INTEGRATED CIRCUITS
DATA SHEET
TDA1519
2 x 6 W stereo car radio power
amplifier
May 1992
Product specification
File under Integrated Circuits, IC01
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Philips Semiconductors
Product specification
2 x 6 W stereo car radio power amplifier
TDA1519
Fig.1 Block diagram.
May 1992
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Philips Semiconductors
Product specification
2 x 6 W stereo car radio power amplifier
TDA1519
PINNING
1
2
3
4
5
6
7
8
9
INV1
non-inverting input 1
ground (signal)
GND1
SVRR
OUT1
GND2
OUT2
supply voltage ripple rejection
output 1
ground (substrate)
output 2
V
supply voltage
P
M/SS
mute/stand-by switch
non-inverting input 2
−INV2
FUNCTIONAL DESCRIPTION
The TDA1519 contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 40 dB.
A special feature of this device is the mute/stand-by switch which has the following features:
• low stand-by current (< 100 µA)
• low mute/stand-by switching current (low cost supply switch)
• mute condition.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER
Supply voltage
CONDITIONS
SYMBOL
MIN.
MAX.
UNIT
operating
V
−
−
18
30
V
V
P
P
non-operating
load dump protected
V
during 50 ms;
t ≥ 2,5 ms
V
V
V
−
−
−
−
−
−
−
−
45
18
6
V
r
P
AC and DC short-circuit-safe voltage
Reverse polarity
V
PSC
PR
V
Energy handling capability at outputs
Non-repetitive peak output current
Repetitive peak output current
Total power dissipation
V = 0 V
200
4
mJ
A
P
I
OSM
ORM
I
2,5
15
A
see Fig.2
P
T
W
°C
°C
tot
Crystal temperature
150
+ 150
c
Storage temperature range
T
−55
stg
May 1992
4
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Philips Semiconductors
Product specification
2 x 6 W stereo car radio power amplifier
TDA1519
Fig.2 Power derating curve.
DC CHARACTERISTICS (note 1)
V = 14,4 V; T = 25 °C; unless otherwise specified
P
amb
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply
Supply voltage range
Quiescent current
DC output voltage
note 2
V
6,0
14,4
18,0
V
P
I
−
−
40
80
mA
V
P
note 3
V
6,95
−
O
Mute/stand-by switch
Switch-on voltage level
Mute condition
see Fig.3
V
V
8,5
3,3
−
−
−
V
V
ON
6,4
mute
Output signal in mute position
V = 1 V (max.);
I
f = 20 Hz to
15 kHz
V
V
I
−
0
−
20
2
mV
V
O
Stand-by condition
−
sb
DC current in stand-by condition
Switch-on current
−
−
−
100
40
µA
µA
sb
I
12
sw
May 1992
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Philips Semiconductors
Product specification
2 x 6 W stereo car radio power amplifier
TDA1519
AC CHARACTERISTICS (note 1)
V = 14,4 V; R = 4 Ω; f = 1 kHz; T
= 25 °C; unless otherwise specified
P
L
amb
PARAMETER
CONDITIONS
note 4;
SYMBOL
MIN.
TYP.
MAX.
UNIT
Output power
THD = 0,5%
THD = 10%
P
4
5
−
−
−
W
W
%
o
o
P
5,5
6,0
0,1
Total harmonic distortion
Low frequency roll-off
P = 1 W
THD
−
o
note 5;
−3 dB
−1 dB
f
−
45
−
−
Hz
L
High frequency roll-off
f
20
39
−
kHz
dB
H
Closed loop voltage gain
G
40
41
v
Supply voltage ripple rejection
note 6
ON
f = 100 Hz
SVRR
40
48
48
80
50
−
−
dB
dB
dB
dB
kΩ
ON
f = 10 Hz to 10 kHz SVRR
−
−
mute
SVRR
SVRR
−
−
stand-by
−
−
Input impedance
Noise output voltage
ON
|Z |
60
75
i
note 7;
R = 0 Ω
V
V
V
α
−
150
250
120
−
−
µV
µV
µV
dB
dB
S
no(rms)
no(rms)
no(rms)
ON
R = 10 kΩ
−
500
−
S
mute
note 8
−
Channel separation
Channel balance
R = 10 kΩ
40
−
−
S
|∆G |
0,1
1
v
Notes to the characteristics
1. All characteristics are measured using the circuit shown in Fig.4.
2. The circuit is DC adjusted at V = 6 V to 18 V and AC operating at V = 8,5 V to 18 V.
P
P
3. At 18 V < V < 30 V the DC output voltage ≤ V /2.
P
P
4. Output power is measured directly at the output pins of the IC.
5. Frequency response externally fixed.
6. Ripple rejection measured at the output with a source impedance of 0 Ω (maximum ripple amplitude of 2 V) and a
frequency between 100 Hz and 10 kHz.
7. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.
8. Noise output voltage independent of R (V = 0 V).
S
I
May 1992
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Philips Semiconductors
Product specification
2 x 6 W stereo car radio power amplifier
TDA1519
Fig.3 Stand-by, mute and ON conditions.
May 1992
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Philips Semiconductors
Product specification
2 x 6 W stereo car radio power amplifier
TDA1519
APPLICATION INFORMATION
Fig.4 Application circuit diagram.
May 1992
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Philips Semiconductors
Product specification
2 x 6 W stereo car radio power amplifier
TDA1519
PACKAGE OUTLINE
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
D
D
1
q
A
2
P
P
1
A
3
q
2
q
1
A
A
4
E
pin 1 index
c
L
1
9
b
Q
e
Z
b
w
M
2
b
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
Z
max.
A
max.
2
(1)
(1)
E
UNIT
A
A
b
b
b
c
D
D
e
L
P
P
Q
q
q
q
2
w
A
3
4
1
2
1
1
1
18.5
17.8
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20
3.9 2.75 3.4 1.75 15.1
3.4 2.50 3.2 1.55 14.9
4.4
4.2
5.9
5.7
2.54
mm
3.7
0.25 1.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-25
SOT110-1
May 1992
9
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Philips Semiconductors
Product specification
2 x 6 W stereo car radio power amplifier
TDA1519
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
SOLDERING
Introduction
specified maximum storage temperature (T
). If the
stg max
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
May 1992
10
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