This product complies with the RoHS Directive (EU 2002/95/EC).
ESD Diodes
MAZWxxxHG Series
Silicon planar type
For surge absorption circuit
■ Features
■ Package
•
•
Two elements anode-common type
Code
SSSMini3-F2
•
Pin Name
1: Cathode 1
2: Cathode 2
3: Anode 1, 2
■ Absolute Maximum Ratings Ta = 25°C
Parameter
Total power dissipation *
Junction temperature
Storage temperature
Symbol
Ptot
Rating
150
Unit
mW
°C
■ Internal Connection
3
Tj
150
Tstg
−55 to +150
°C
Note) : Ptot = 150 mW achieved with a printed circuit board.
*
1
2
■ Common Electrical Characteristics Ta = 25°C 3°C
Parameter
Zener voltage *
Symbol
VZ
Conditions
Min
Typ
Max
Unit
V
IZ
Specified value
Specified value
Specified value
Specified value
Refer to the list of the
electrical characteristics
within part numbers
Zener rise operating resistance
Zener operating resistance
Reverse current
RZK
RZ
IZ
Ω
IZ
Ω
IR
VR
µA
Note) 1. Measuring methods are based JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. Electrostatic breakdown voltage is 10 kV
Test method: IEC1000-4-2 (C = 150 pF, R = 330 Ω, Contact discharge: 10 times)
3. : The temperature must be controlled 25°C for VZ mesurement.
*
VZ value measured at other temperature must be adjusted to VZ (25°C)
VZ guaranted 20 ms after current flow.
Publication date: September 2007
SKE00035AED
1
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This product complies with the RoHS Directive (EU 2002/95/EC).
MAZWxxxHG Series
SSSMini3-F2
Unit: mm
1.20 0.05
0.30 +−00..0025
3
2
1
0.13 +−00..0025
0.20 +−00..0025
(0.4)
(0.4)
0.80 0.05
SKE00035AED
3
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Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
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