This product complies with the RoHS Directive (EU 2002/95/EC).
Zener Diodes
MAZDxxx Series
Silicon planar type
For constant voltage, constant current, waveform clipper and
surge absorption circuit
Features
Package
Low noise type
Code
SSSMini2-F2
Pin Name
1:Anode
Absolute Maximum Ratings Ta = 25°C
Parameter
Repetitive peak forward current
Total power dissipation *
Junction temperature
Symbol
IFRM
PT
Rating
200
Unit
mA
mW
°C
2: Cathode
120
Marking Symbol:
Tj
150
Refer to the list of the electrical characteristics
within part numbers
Storage temperature
T
stg
–55 to +150
°C
Note) : P = 100 mW achieved with a printed circuit board.
*
T
Electrical Characteristics Ta = 25°C±3°C
Parameter
Symbol
VF
Conditions
Min
Typ
Max
Unit
V
Forward voltage
IF = 10 mA
0.9
1.0
Zener voltage *
VZ
IZ
Specified value
Specified value
Specified value
V
Refer to the list of the
Zener operating resistance
Reverse current
RZ
IZ
electrical characteristics
within part numbers
W
IR
VR
mA
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. Absolute frequency of input and output is 5 MHz
3. The temperature must be controlled 25°C for VZ mesurement.
VZ value measured at other temperature must be adjusted to VZ (25°C)
4. : V guaranted 20 ms after current flow.
*
Z
Publication date: November 2008
SKE00020BED
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This product complies with the RoHS Directive (EU 2002/95/EC).
MAZDxxx Series
PT T
IZ VZ
IZ VZ
a
103
102
103
102
200
150
100
50
Ta = 25°C
Ta = 25°C
Mounted on a glass epoxy
PC board
10
1
10
1
10−1
10−2
10−3
10−1
10−2
10−3
0
0
4
8
12
0
2
4
6
0
40
80
120
160
( )
V
(
)
V
Zener voltage VZ
Zener voltage VZ
Ambient temperature Ta (°C)
IZ VZ
IZ VZ
103
102
103
102
Ta = 25°C
Ta = 25°C
10
1
10
1
10−1
10−2
10−3
10−1
10−2
10−3
0
10
20
30
0
20
40
60
(
)
(
)
V
Zener voltage VZ
V
Zener voltage VZ
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This product complies with the RoHS Directive (EU 2002/95/EC).
MAZDxxx Series
SSSMini2-F2
Unit: mm
0.60 ±0.05
0.12 +−00..0025
2
1
0.27 +−00..0025
5°
4
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Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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