Panasonic Network Card MANV250GE User Manual

Zener Diodes  
MANV250GE  
Silicon planar type  
For surge protect  
Features  
Package  
Large surge reduction power  
Code  
SMini2-F3  
Pin Name  
1: Anode  
Absolute Maximum Ratings Ta = 25°C  
Parameter  
Symbol  
Rating  
Unit  
W
2: Cathode  
1
*
Peak pulse power  
PPP  
IPP  
450  
1
Peak pulse current *  
9
18  
A
Marking Symbol: RD  
Maximum peak reverse voltage  
VRM  
PT  
V
2
Total power dissipation *  
150  
mW  
°C  
°C  
kV  
Junction temperature  
Storage temperature  
Tj  
150  
T
stg  
–55 to +150  
±30  
3
Electrostatic discharge *  
ESD  
Note) 1: Test method: IEC61000-4-5 (tp = 8/20 ms, Unrepeated)  
*
*2: PT = 150 mW achieved with a printed circuit board.  
3: Test method: IEC61000-4-2 (C = 150 pF, R = 330 W, Contact discharge: 10 times)  
*
Electrical Characteristics Ta = 25°C±3°C  
Parameter  
Symbol  
VBR  
IR  
Conditions  
Min  
Typ  
Max  
30.0  
10.0  
50.0  
Unit  
V
1
Breakdown voltage *  
IR = 1 mA  
VR = 18 V  
20.0  
25.0  
Reverse current  
mA  
V
2
Clamping voltage *  
VC  
IPP = 9.0A, tp = 8/20 ms  
Terminal capacitance  
Ct  
IR = 0 V, f = 1 MHz  
76  
pF  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.  
2. 1: V guaranted 20 ms after current ow.  
*
Z
2: Pulse Waveform  
*
100  
90  
Front time:  
T1 = 1.25 × T = 8 µs 20%  
Time to half value:  
T2 = 20 µs 20%  
T2  
50  
10  
T
T1  
t
Publication date: October 2005  
SKE00038AED  
1
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MANV250GE  
SMini2-F3  
Unit: mm  
1.25 0.10  
0.50 0.05  
0.13 +00..0025  
2
0 to 0.05  
1
0.35 0.05  
5°  
SKE00038AED  
3
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Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other  
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other  
company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita  
Electric Industrial Co., Ltd.  
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