DATA SHEET
MOS INTEGRATED CIRCUIT
µPD30500, 30500A, 30500B
VR5000TM, VR5000ATM, VR5000BTM
64-BIT MICROPROCESSOR
DESCRIPTION
Note
Note
The µPD30500 (VR5000), µPD30500A
(VR5000A), and µPD30500B
(VR5000B) are a high-performance,
64-bit RISC (Reduced Instruction Set Computer) type microprocessors employing the RISC architecture developed
TM
by MIPS
Technologies Inc.
TM
The instructions of the VR5000, VR5000A, and VR5000B are compatible with those of the VR3000
series and
TM
TM
VR4000 series and higher, and completely compatible with those of the VR10000 . Therefore, present applications
can be used as they are.
Note Under development
Detailed functions are descrided in the following manual. Be sure to read the manual when
designing your system.
• VR5000 User’s Manual (U11761E)
FEATURES
•
•
Employs 64-bit MIPS-based RISC architecture
High-speed processing
•
•
2-way super scalar 5-stage pipeline
5.5 SPECint95, 5.5 SPECfp95, 278 MIPS (µPD30500)
6.6 SPECint95, 6.6 SPECfp95, 353 MIPS (µPD30500A)
8 SPECint95, 8 SPECfp95, 423 MIPS (µPD30500B)
•
•
•
High-speed translation buffer mechanism (TLB) (48 entries)
Address space Physical: 36 bits, Virtual: 40 bits
Floating-point unit (FPU)
•
Sum-of-products operation instruction supported
•
•
•
Primary cache memory (instruction/data: 32K bytes each)
Secondary cache controller
Maximum operating frequency Internal : 200MHz (µPD30500), 250 MHz (µPD30500A), 300 MHz (µPD30500B)
External: 100 MHz
•
External/internal multiple selectable from two to eight
•
•
Instruction set compatible with VR3000 and VR4000 series and higher (conforms to MIPS I, II, III, and IV)
Supply voltage: 3.3 V ±5% (µPD30500)
Core: 2.5 V ±5%, I/O: 3.3 V ±5% (µPD30500A)
Core: 1.8 V ±0.1 V, I/O: 3.3 V ±5% (µPD30500B)
Unless otherwise specified, the VR5000 (µPD30500) is treated as the representative model throughout this
document.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability
and additional information.
The mark shows major revised points.
Document No. U12031EJ3V0DS00 (3rd edition)
Date Published August 1999 N CP(K)
Printed in Japan
1997,1999
©
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1997
MIPS Technologies Inc.
©
µPD30500, 30500A, 30500B
PIN CONFIGURATION
•
223-pin ceramic PGA (48 × 48 mm)
µPD30500RJ-150
µPD30500RJ-180
µPD30500RJ-200
Bottom View
Top View
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
V U T R P N M L K J H G F E D C B A
A B C D E F G H J K L M N P R T U V
Index mark
Data Sheet U12031EJ3V0DS00
3
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µPD30500, 30500A, 30500B
No.
A2
Name
No.
C5
Name
SysADC6
SysAD16
SysAD50
SysAD22
SysAD24
SysAD28
SysAD62
SysAD44
SysAD10
SysAD38
SysAD4
SysAD34
SysAD2
GND
No.
E18
F1
Name
No.
K17
K18
L1
Name
GNDP
No.
R6
Name
SysAD51
SysAD55
SysAD27
SysAD31
SysAD43
SysAD39
SysAD35
SysAD1
ScWord1
ScLine0
ScLine3
ScLine6
GND
No.
U9
Name
SysAD63
SysAD13
SysAD11
SysAD9
SysAD37
SysAD3
ScWord0
VDD
VDD
VDD
A3
GND
C6
VDD
GND
R7
U10
U11
U12
U13
U14
U15
U16
U17
U18
V1
A4
VDD
C7
F2
Reserved
ScValid
Int1
GND
R8
A5
GND
C8
F3
L2
SysCmd8
SysCmd7
SysCmd5
ScLine12
ScLine14
ScLine15
VDD
R9
A6
GND
C9
F4
L3
R10
R11
R12
R13
R14
R15
R16
R17
R18
T1
A7
VDD
C10
C11
C12
C13
C14
C15
C16
C17
C18
D1
F15
F16
F17
F18
G1
ScDCE0
ScCWE0
ScTDE
GND
L4
A8
GND
L15
L16
L17
L18
M1
A9
VDD
A10
A11
A12
A13
A14
A15
A16
A17
A18
B1
GND
GND
VDD
GND
GND
GND
G2
Reserved
Reserved
Reserved
ScCLR
ScTCE
Modeln
VDD
VDD
GND
VDD
G3
M2
SysCmd6
SysCmd4
SysCmd1
ScLine8
ScLine10
ScLine13
GND
V2
GND
GND
G4
M3
V3
VDD
GND
G15
G16
G17
G18
H1
M4
GND
V4
GND
VDD
GND
M15
M16
M17
M18
N1
T2
SysAD15
SysAD47
SysAD17
SysAD19
SysAD23
SysAD57
SysAD29
VDD
V5
GND
GND
D2
Int3
T3
V6
VDD
GND
D3
Int5
T4
V7
GND
GND
D4
Release
VDD
VDD
T5
V8
VDD
B2
GND
D5
H2
Reserved
Reserved
Reserved
VDDOk
GND
T6
V9
GND
B3
VDD
D6
SysADC2
SysAD48
SysAD52
SysAD56
SysAD60
SysAD14
SysAD42
SysAD8
SysAD36
H3
N2
SysCmd3
SysCmd2
SysADC7
ScLine5
ScLine7
ScLine11
VDD
T7
V10
V11
V12
V13
V14
V15
V16
V17
V18
VDD
B4
SysADC4
SysADC0
SysAD18
SysAD20
SysAD54
SysAD26
SysAD58
SysAD30
SysAD46
SysAD12
SysAD40
SysAD6
GND
D7
H4
N3
T8
GND
B5
D8
H15
H16
H17
H18
J1
N4
T9
VDD
B6
D9
ModeClock N15
T10
T11
T12
T13
T14
T15
SysAD45
SysAD41
SysAD7
SysAD5
SysAD33
Reset
GND
B7
D10
D11
D12
D13
D14
D15
D16
D17
D18
E1
SysClock
GND
N16
N17
N18
P1
VDD
B8
GND
B9
GND
GND
B10
B11
B12
B13
B14
B15
B16
B17
B18
C1
J2
WrRdy
Validln
ExtRqst
Reserved
Reserved
Reserved
VDD
VDD
VDD
J3
P2
SysCmd0
GND
ColdReset J4
P3
SysCmdP T16
ScLine1
VDD
SysAD0
ScTOE
VDD
J15
P4
SysADC1
ScLine2
ScLine4
ScLine9
GND
T17
T18
U1
U2
U3
U4
U5
U6
J16
J17
J18
K1
P15
P16
P17
P18
R1
VDD
VDD
GND
VDD
VDD
E2
Int0
VDD
GND
VDD
E3
Int2
K2
ScMatch
RdRdy
ScDOE
Reserved
VDDP
VDD
SysAD21
SysAD53
SysAD25
SysAD59
SysAD61
VDD
E4
Int4
K3
R2
SysADC5
SysADC3
C2
VDD
E15
E16
E17
SysAD32
ScDCE1
ScCWE1
K4
R3
C3
ValidOut
NMI
K15
K16
R4
BigEndian U7
SysAD49 U8
C4
R5
Data Sheet U12031EJ3V0DS00
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4
µPD30500, 30500A, 30500B
•
272-pin plastic BGA (29 × 29 mm)
µPD30500S2-150
µPD30500S2-180
µPD30500S2-200
µPD30500AS2-200Note
µPD30500AS2-250Note
µPD30500BS2-250Note
µPD30500BS2-300Note
Bottom View
Top View
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
AA Y W V U T R P N M L K J H G F E D C B A
A B C D E F G H J K L M N P R T U V W Y AA
Note Under development
Data Sheet U12031EJ3V0DS00
5
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µPD30500, 30500A, 30500B
(1) µPD30500
No.
A1
Name
GND
No.
C5
Name
No.
F1
Name
SysAD8
SysAD38
SysAD6
GND
No.
Name
No.
Name
No.
Y1
Name
L20
L21
M1
SysAD63
GND
ScDCE1
ScDCE0
ScCWE0
ScTCE
Modeln
Reserved
GNDP
Reserved
ScLine13
ScLine11
ScLine8
ScLine5
ScLine4
ScLine0
Reset
VDD
U18
U19
U20
U21
V1
VDD
VDD
F2
A2
VDD
C6
SysAD17
SysAD49
GND
Y2
VDD
F3
SysAD26
SysAD56
SysAD24
VDD
A3
GND
C7
Y3
VDD
F4
M2
A4
SysAD32
GND
C8
Y4
Release
Int3
F18
F19
F20
F21
G1
GND
M3
A5
C9
VDD
Y5
SysAD1
SysAD33
SysAD3
GND
M4
A6
ScCWE1
GND
C10
C11
C12
C13
C14
C15
C16
C17
C18
C19
C20
C21
D1
V2
VDD
Y6
Int2
M18
M19
M20
M21
N1
VDD
A7
V3
VDD
Y7
ScValid
Reserved
Reserved
Reserved
ExtRqst
RdRdy
SysCmd8
SysCmd5
SysCmd3
SysCmd0
SysCmdP
SysADC1
SysAD15
VDD
SysAD29
SysAD61
SysAD31
GND
A8
VDDOk
GND
V4
GND
Y8
A9
V5
NMI
Y9
G2
SysAD10
SysAD40
VDD
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
B1
SysClock
GND
V6
GND
Y10
Y11
Y12
Y13
Y14
Y15
Y16
Y17
Y18
Y19
Y20
Y21
AA1
AA2
AA3
AA4
AA5
AA6
AA7
AA8
AA9
G3
V7
VDD
G4
N2
SysAD54
SysAD22
GND
ScLine15
GND
V8
VDD
G18
G19
G20
G21
H1
VDD
N3
V9
GND
SysAD35
SysAD5
GND
N4
ScLine12
GND
V10
V11
V12
V13
V14
V15
V16
V17
V18
V19
V20
V21
W1
VDD
N18
N19
N20
N21
P1
GND
VDD
SysAD27
SysAD59
GND
ScLine7
GND
VDD
SysAD42
SysAD44
SysAD12
VDD
GND
GND
H2
ScLine2
GND
VDD
VDD
H3
SysAD50
SysAD52
SysAD20
VDD
D2
VDD
VDD
H4
P2
VDD
D3
VDD
GND
H18
H19
H20
H21
J1
VDD
P3
GND
D4
GND
VDD
VDD
SysAD7
SysAD39
SysAD37
GND
P4
VDD
D5
VDD
GND
GND
P18
P19
P20
P21
R1
VDD
B2
VDD
D6
GND
VDD
VDD
SysAD25
SysAD57
SysAD55
GND
B3
VDD
D7
VDD
VDD
GND
B4
SysAD2
SysAD0
ScTOE
ScCLR
ScTDE
D8
VDD
VDD
ValidOut
GND
J2
SysAD46
SysAD14
GND
B5
D9
GND
GND
J3
B6
D10
D11
D12
VDD
W2
VDD
Int0
J4
R2
SysAD18
SysAD48
VDD
B7
VDDP
W3
VDD
GND
J18
J19
J20
J21
K1
GND
R3
B8
VDD
W4
VDD
Reserved
GND
SysAD9
SysAD41
GND
R4
B9
ModeClock D13
GND
W5
Int5
R18
R19
R20
R21
T1
VDD
B10
B11
B12
B13
B14
B15
B16
B17
B18
B19
B20
B21
C1
Reserved
Reserved
NC
D14
D15
D16
D17
D18
D19
D20
D21
E1
VDD
W6
Int4
AA10 WrRdy
AA11 GND
SysAD53
SysAD23
GND
VDD
W7
Int1
SysAD60
SysAD30
SysAD62
VDD
GND
W8
Reserved
Reserved
Reserved
Validln
ScDOE
SysCmd7
SysCmd4
SysCmd1
SysADC7
SysADC5
SysAD47
BigEndian
VDD
AA12 ScMatch
AA13 GND
K2
ScLine14
ScLine10
ScLine9
ScLine6
ScLine3
ScLine1
VDD
VDD
W9
K3
SysAD16
SysADC0
SysADC2
GND
GND
W10
W11
W12
W13
W14
W15
W16
W17
W18
W19
W20
W21
AA14 SysCmd6
AA15 GND
K4
T2
VDD
K18
K19
K20
K21
L1
VDD
T3
VDD
AA16 SysCmd2
AA17 GND
SysAD11
SysAD43
SysAD13
GND
T4
VDD
T18
T19
T20
T21
U1
GND
GND
AA18 SysADC3
AA19 GND
SysAD19
SysAD51
SysAD21
GND
E2
SysAD36
SysAD4
VDD
VDD
E3
AA20 VDD
L2
SysAD58
SysAD28
VDD
VDD
E4
AA21 GND
L3
GND
E18
E19
VDD
L4
U2
SysADC4
SysADC6
VDD
C2
VDD
ScWord1
ScWord0
GND
L18
L19
VDD
U3
C3
ColdReset E20
SysAD34 E21
SysAD45
U4
C4
GND
Data Sheet U12031EJ3V0DS00
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6
µPD30500, 30500A, 30500B
(2) µPD30500A, 30500B
No.
A1
Name
GND
No.
C5
Name
No.
F1
Name
No.
Name
No.
Name
No.
Y1
Name
VDDIO
ScDCE1
ScDCE0
ScCWE0
ScTCE
Modeln
NC
SysAD8
SysAD38
SysAD6
GND
L20
L21
M1
SysAD63
GND
U18
U19
U20
U21
V1
VDD
A2
VDDIO
Y2
VDDIO
C6
F2
SysAD17
SysAD49
GND
A3
GND
Y3
VDDIO
C7
F3
SysAD26
SysAD56
SysAD24
VDDIO
A4
SysAD32
GND
Y4
Release
Int3
C8
F4
M2
A5
Y5
C9
F18
F19
F20
F21
G1
GND
M3
VDD
A6
ScCWE1
GND
Y6
Int2
C10
C11
C12
C13
C14
C15
C16
C17
C18
C19
C20
C21
D1
SysAD1
SysAD33
SysAD3
GND
M4
V2
VDD
A7
Y7
ScValid
GND
GNDP
GND
M18
M19
M20
M21
N1
VDDIO
V3
VDD
A8
VDDOk
GND
Y8
SysAD29
SysAD61
SysAD31
GND
V4
GND
A9
Y9
GND
ScLine13
ScLine11
ScLine8
ScLine5
ScLine4
ScLine0
Reset
VDDIO
GND
V5
NMI
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
B1
SysClock
GND
Y10
Y11
Y12
Y13
Y14
Y15
Y16
Y17
Y18
Y19
Y20
Y21
AA1
AA2
AA3
AA4
AA5
AA6
AA7
AA8
AA9
GND
G2
SysAD10
SysAD40
VDDIO
V6
GND
ExtRqst
RdRdy
SysCmd8
SysCmd5
SysCmd3
SysCmd0
SysCmdP
SysADC1
SysAD15
VDDIO
G3
V7
VDD
ScLine15
GND
G4
N2
SysAD54
SysAD22
GND
V8
VDDIO
GND
G18
G19
G20
G21
H1
VDDIO
N3
V9
ScLine12
GND
SysAD35
SysAD5
GND
N4
V10
V11
V12
V13
V14
V15
V16
V17
V18
V19
V20
V21
W1
VDD
N18
N19
N20
N21
P1
GND
VDDIO
VDD
ScLine7
GND
SysAD27
SysAD59
GND
SysAD42
SysAD44
SysAD12
VDD
GND
ScLine2
GND
VDD
H2
VDDIO
VDD
D2
VDD
H3
SysAD50
SysAD52
SysAD20
VDD
VDDIO
D3
VDD
H4
P2
GND
GND
VDDIO
D4
GND
H18
H19
H20
H21
J1
VDD
P3
VDDIO
GND
VDDIO
GND
D5
VDD
SysAD7
SysAD39
SysAD37
GND
P4
B2
VDDIO
VDDIO
D6
GND
P18
P19
P20
P21
R1
VDD
VDD
B3
VDDIO
GND
D7
VDDIO
VDD
SysAD25
SysAD57
SysAD55
GND
VDD
B4
SysAD2
SysAD0
ScTOE
ScCLR
ScTDE
ModeClock
GND
ValidOut
GND
D8
VDD
B5
D9
GND
J2
SysAD46
SysAD14
GND
GND
B6
Int0
D10
D11
D12
D13
D14
D15
D16
D17
D18
D19
D20
D21
E1
VDDIO
VDDP
J3
W2
VDDIO
VDDIO
VDDIO
Int5
B7
GND
J4
R2
SysAD18
SysAD48
VDDIO
W3
B8
GND
VDD
J18
J19
J20
J21
K1
GND
R3
W4
B9
GND
GND
SysAD9
SysAD41
GND
R4
W5
B10
B11
B12
B13
B14
B15
B16
B17
B18
B19
B20
B21
C1
AA10 WrRdy
AA11 GND
VDDIO
VDD
R18
R19
R20
R21
T1
VDDIO
W6
Int4
GND
SysAD53
SysAD23
GND
W7
Int1
GND
AA12 ScMatch
AA13 GND
GND
SysAD60
SysAD30
SysAD62
VDDIO
W8
GND
ScLine14
ScLine10
ScLine9
ScLine6
ScLine3
ScLine1
VDDIO
VDDIO
GND
K2
W9
GND
AA14 SysCmd6
AA15 GND
K3
SysAD16
SysADC0
SysADC2
GND
W10
W11
W12
W13
W14
W15
W16
W17
W18
W19
W20
W21
VDD
VDD
K4
T2
Validln
ScDOE
SysCmd7
SysCmd4
SysCmd1
SysADC7
SysADC5
SysAD47
BigEndian
VDDIO
GND
AA16 SysCmd2
AA17 GND
VDD
K18
K19
K20
K21
L1
VDDIO
T3
VDD
SysAD11
SysAD43
SysAD13
GND
T4
AA18 SysADC3
AA19 GND
GND
T18
T19
T20
T21
U1
GND
E2
SysAD36
SysAD4
VDD
SysAD19
SysAD51
SysAD21
GND
VDDIO
AA20 VDDIO
AA21 GND
E3
VDDIO
E4
L2
SysAD58
SysAD28
VDD
GND
E18
E19
E20
E21
VDD
L3
C2
VDDIO
ScWord1
ScWord0
GND
L4
U2
SysADC4
SysADC6
VDD
C3
ColdReset
SysAD34
L18
L19
VDD
U3
C4
SysAD45
U4
Data Sheet U12031EJ3V0DS00
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7
µPD30500, 30500A, 30500B
PIN NAMES
BigEndian
ColdReset
ExtRqst
GND
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
Endian Mode Select
Cold Reset
External Request
Ground
GNDP
Quiet GND for PLL
Int (0:5)
ModeClock
Modeln
Interrupt Request
Boot Mode Clock
Boot Mode Data In
NC
No Connection
NMI
Non-maskable Interrupt Request
Read Ready
RdRdy
Release
Reset
Release Interface
Reset
ScCLR
Secondary Cache Block Clear
Secondary Cache Write Enable
Data RAM Chip Enable
Data RAM Output Enable
Secondary Cache Line Index
Secondary Cache Tag Match
Secondary Cache Tag RAM Chip Enable
Secondary Cache Tag RAM Data Enable
Secondary Cache Tag RAM Output Enable
Secondary Cache Valid
Secondary Cache Word Index
System Address/Data Bus
System Address/Data Check Bus
System Clock
ScCWE (0:1)
ScDCE (0:1)
ScDOE
ScLine (0:15)
ScMatch
ScTCE
ScTDE
ScTOE
ScValid
ScWord (0:1)
SysAD (0:63)
SysADC (0:7)
SysClock
SysCmd (0:8)
SysCmdP
Validln
System Command/Data Identifier
System Command/Data Identifier Bus Parity
Valid Input
ValidOut
VDD
Valid Output
Power Supply (µPD30500)
Power Supply for Processor Core (µPD30500A, 30500B)
Power Supply for Processor I/O (µPD30500A, 30500B only)
VDD is OK
VDD
VDDIO
VDDOk
VDDP
Quiet VDD for PLL
Write Ready
WrRdy
Data Sheet U12031EJ3V0DS00
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µPD30500, 30500A, 30500B
INTERNAL BLOCK DIAGRAM
Data, address Control
System interface
SysClock
Clock
generator
Instruction cache
Data cache
CP0
TLB
Execution unit
Instruction address
Pipeline control
Floating-point unit
Data Sheet U12031EJ3V0DS00
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9
µPD30500, 30500A, 30500B
PIN FUNCTIONS
Pin Name
I/O
I/O
Function
SysAD (0:63)
System address/data bus.
64-bit bus for communication between processor, secondary cache and external agent.
SysADC (0:7)
SysCmd (0:8)
I/O
I/O
System address/data check bus.
8-bit bus including check bits for the SysAD bus.
System command/data ID bus.
9-bit bus for communication of commands and data identifiers between processor
and external agent.
SysCmdP
I/O
System command/data ID bus parity.
1-bit even number parity bit for the SysCmd bus.
ValidIn
Input
Valid in.
Signal indicating that external agent has transmitted valid address or data onto
SysAD bus and valid command or data identifier onto SysCmd bus.
ValidOut
Output Valid out.
Signal indicating that processor has transmitted valid address or data onto SysAD
bus and valid command or data identifier onto SysCmd bus.
ExtRqst
Input
External request.
Signal used by external agent to request for its use by system interface.
Release
WrRdy
Output Interface release.
Signal indicating that the processor has released the system interface to the slave state.
Output Write ready.
Signal indicating that the external agent can accept a processor write request.
RdRdy
Input
Read ready.
Signal indicating that external agent can accept a processor read request.
ScCLR
Output Secondary cache block clear.
Clears all the valid bits of the tag RAM.
ScCWE (0:1)
ScDCE (0:1)
ScDOE
Output Secondary cache write enable.
Write enable signal for the secondary cache RAM.
Output Data RAM chip select.
Chip select signal for secondary cache RAM.
Input
Data RAM output enable.
Data output enable signal from the external agent.
ScLine (0:15)
ScMatch
ScTCE
Output Secondary cache line index.
Cache line index output of the secondary cache.
Input
Secondary cache tag match.
Tag match signal from secondary cache tag RAM.
Output Secondary cache tag RAM chip select.
Chip select signal of the secondary cache tag RAM.
ScTDE
Output Secondary cache tag RAM data enable.
Data enable signal from the secondary cache tag RAM.
ScTOE
Output Secondary cache tag RAM output enable.
Output enable signal from the secondary cache tag RAM.
ScWord (0:1)
ScValid
I/O
Secondary cache word index.
Signal indicating that the double word of the secondary cache index is correct.
I/O
Secondary cache valid.
Signal indicating that the data of the secondary cache is valid.
Data Sheet U12031EJ3V0DS00
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µPD30500, 30500A, 30500B
Pin Name
Int (0:5)
I/O
Function
Input
Interrupt.
General-purpose processor interrupt requests whose input statuses can be confirmed by
bits 15 through 10 of cause register.
NMI
Input
Input
Non-maskable interrupt.
Interrupt request that cannot be masked.
ColdReset
Cold reset.
Signal initializing the internal status of the processor. Inactivate this signal in synchroniza-
tion with SysClock.
Reset
Input
Reset.
Signal generating a reset exception, without initializing the internal status of the processor.
Inactivate this signal in synchronization with SysClock.
SysClock
BigEndian
Input
Input
System clock.
Clock input signal to processor.
Endian mode setting.
This signal sets the endian mode of the system interface.
When setting the endian mode with this signal, specify little endian with the data from the
ModeIn pin that is input at reset.
To set the endian mode with the data from the ModeIn pin, fix this signal to 0.
BigEndian
Bit 8 of boot mode
Mode
1
1
0
0
1
0
1
0
—
Big endian
Big endian
Little endian
ModeClock
Modeln
Output Boot mode clock.
Successive boot mode data clock output resulting from dividing SysClock by 256.
Input
Input
Boot mode data input.
Input of initialization bit stream.
Note
VDDOk
VDD and VDDIO
are valid.
Signal indicating that the voltage supplied to the VR5000 is 3.135 V or higher for 100 ms,
and that that status is stabilized. When VDDOk is asserted active, the VR5000 starts an
initialization sequence.
VDDP
GNDP
VDD
–
–
–
PLL VDD.
Power supply for internal PLL.
PLL GND.
Ground for internal PLL.
• VR5000
Positive power supply pin (3.3 V)
• VR5000A
Power supply pin for core (2.5 V)
• VR5000B
Power supply pin for core (1.8 V)
Note
VDDIO
–
–
Power supply pin for I/O (3.3 V)
Ground pin.
GND
Note VDDIO is only for VR5000A and VR5000B.
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11
µPD30500, 30500A, 30500B
ELECTRICAL SPECIFICATIONS
(1) µPD30500
Absolute Maximum Ratings
Parameter
Supply voltage
Symbol
VDD
Condition
Rating
–0.5 to +4.0
–0.5 to VDD + 0.3
–1.5 to VDD + 0.3
0 to +70
Unit
V
Note
Input voltage
VI
V
Pulse of less than 10 ns
PGA package
V
Operating case temperature
Storage temperature
TC
°C
°C
°C
°C
BGA package
0 to +85
Tstg
PGA package
–65 to +150
–40 to +125
BGA package
Note The upper limit of the input voltage (VDD + 0.3) is +4.0 V.
Cautions 1. Do not short circuit two or more outputs at the same time.
2. The quality of the product may be degraded if the absolute maximum rating of even one of
the above parameters is exceeded, even momentarily. Absolute maximum ratings, therefore,
specify the values which if exceeded may physically damage the product. Use the product
never exceeding these ratings.
The specifications and conditions shown in the following DC Characteristics and AC
Characteristics are the range within which the product can normally operate and the quality
can be guaranteed.
DC Characteristics (TC = 0 to +70 °C (PGA Package), TC = 0 to +85 °C (BGA Package), VDD = 3.3 V ±5 %)
Parameter
Symbol
VOH
Condition
VDD = MIN., IOH = –4 mA
VDD = MIN., IOL = 4 mA
MIN.
2.4
MAX.
Unit
V
High-level output voltage
Low-level output voltage
VOL
0.4
VDD + 0.3
+0.8
V
Note 1
High-level input voltage
VIH
2.0
–0.5
V
Note 1
Low-level input voltage
VIL
V
Pulse of less than 10 ns
Pulse of less than 10 ns
–1.5
+0.8
V
Note 2
Note 2
High-level input voltage
VIHC
VILC
0.8 × VDD
–0.5
VDD + 0.3
0.2 × VDD
0.2 × VDD
2.16
V
Low-level input voltage
Supply current
V
–1.5
V
IDD
Normal
150 MHz
180 MHz
200 MHz
A
operation
2.54
A
2.8
A
Standby
0.25
A
Input leakage current
ILI
–5
–5
+5
µA
µA
Input/output leakage current
ILIO
+5
Notes 1. Not applied to the SysClock pin.
2. Applied to the SysClock pin only.
Remark The operating supply current is almost proportional to the operating clock frequency.
Data Sheet U12031EJ3V0DS00
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µPD30500, 30500A, 30500B
Capacitance
Parameter
Symbol
CIn
Condition
MIN.
MAX.
Unit
pF
Input capacitance
Output capacitance
5
7
Cout
pF
AC Characteristics (TC = 0 to +70 °C (PGA Package), TC = 0 to +85 °C (BGA Package), VDD = 3.3 V ±5 %)
Clock parameter
Parameter
Symbol
tCH
Condition
MIN.
3.0
3.0
20
MAX.
Unit
ns
System clock high-level width
System clock low-level width
tCL
ns
Note 1, 2
System clock frequency
150 MHz
180 MHz
200 MHz
150 MHz
180 MHz
200 MHz
75
90
MHz
MHz
MHz
ns
20
20
100
50
System clock cycle
System clock jitter
tCP
13.3
11.1
10
50
ns
50
ns
tji
System clock frequency > 66 MHz
±125
±250
2.0
2.0
ps
System clock frequency ≤ 66 MHz
ps
System clock rise time
System clock fall time
Mode clock cycle
tCR
ns
tCF
ns
tMOC
256 × tCP
ns
Notes 1. The operation of the VR5000 is guaranteed only when the PLL is operating
2. The operation is guaranteed if the internal operating frequency 100 MHz or higher.
Data Sheet U12031EJ3V0DS00
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µPD30500, 30500A, 30500B
System Interface Parameter
Parameter
Symbol
Condition
Modebit (14 : 13) = 10
Modebit (14 : 13) = 11
Modebit (14 : 13) = 00
Modebit (14 : 13) = 01
MIN.
1.0
MAX.
Unit
ns
ns
ns
ns
ns
ns
ns
Data output hold time
tDM
1.1
1.3
1.3
Data output delay time
Data input setup time
Data input hold time
tDO
tDS
tDH
5.0
1.6
0.5
Boot Mode Interface Parameter
Parameter
More data setup time
Mode data hold time
Symbol
Condition
MIN.
MAX.
Unit
ns
tMDS
tMDH
tCP × 0.35
tCP × 0.35
ns
Load Coefficient
Parameter
Symbol
CLD
Condition
MIN.
MAX.
1.5
Unit
Load coefficient
ns/25 pF
Data Sheet U12031EJ3V0DS00
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µPD30500, 30500A, 30500B
(2) µPD30500A (Preliminary)
Absolute Maximum Ratings
Parameter
Symbol
VDDIO
VDD
Condition
Rating
–0.5 to +4.0
Unit
V
Supply voltage
–0.3 to +3.3
V
Note
Input voltage
VI
–0.5 to VDDIO + 0.3
–1.5 to VDDIO + 0.3
0 to +85
V
Pulse of less than 10 ns
V
Operating case temperature
Storage temperature
TC
°C
°C
Tstg
–40 to +125
Note The upper limit of the input voltage (VDDIO + 0.3) is +4.0 V.
Cautions 1. Do not short circuit two or more outputs at the same time.
2. The quality of the product may be degraded if the absolute maximum rating of even one of
the above parameters is exceeded, even momentarily. Absolute maximum ratings, therefore,
specify the values which if exceeded may physically damage the product. Use the product
never exceeding these ratings.
The specifications and conditions shown in the following DC Characteristics and AC
Characteristics are the range within which the product can normally operate and the quality
can be guaranteed.
DC Characteristics (TC = 0 to +85 °C, VDDIO = 3.3 V ±5 %, VDD = 2.5 V ±5 %)
Parameter
Symbol
VOH
Condition
VDDIO = MIN., IOH = –4 mA
VDDIO = MIN., IOL = 4 mA
MIN.
2.4
MAX.
Unit
V
High-level output voltage
Low-level output voltage
VOL
0.4
VDDIO + 0.3
+0.8
V
Note 1
High-level input voltage
VIH
2.0
V
Note 1
Low-level input voltage
VIL
–0.5
–1.5
V
Pulse of less than 10 ns
Pulse of less than 10 ns
+0.8
V
Note 2
Note 2
High-level input voltage
VIHC
VILC
0.8 × VDDIO VDDIO + 0.3
V
Low-level input voltage
Input leakage current
–0.5
–1.5
–5
0.2 × VDDIO
0.2 × VDDIO
+5
V
V
ILI
µA
µA
Input/output leakage current
ILIO
–5
+5
Notes 1. Not applied to the SysClock pin.
2. Applied to the SysClock pin only.
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µPD30500, 30500A, 30500B
Capacitance
Parameter
Symbol
CIn
Condition
MIN.
MAX.
Unit
pF
Input capacitance
Output capacitance
5
7
Cout
pF
AC Characteristics (TC = 0 to +85 °C, VDDIO = 3.3 V ±5 %, VDD = 2.5 V ±5 %)
Clock parameter
Parameter
Symbol
tCH
Condition
MIN.
3.0
3.0
20
MAX.
Unit
ns
System clock high-level width
System clock low-level width
tCL
ns
Note 1, 2
System clock frequency
100
50
MHz
ns
System clock cycle
System clock jitter
tCP
tji
10
System clock frequency > 66 MHz
±125
±250
2.0
ps
System clock frequency ≤ 66 MHz
ps
System clock rise time
System clock fall time
Mode clock cycle
tCR
ns
tCF
2.0
ns
tMOC
256 × tCP
ns
Notes 1. The operation of the VR5000A is guaranteed only when the PLL is operating
2. The operation is guaranteed if the internal operating frequency 100 MHz or higher.
Data Sheet U12031EJ3V0DS00
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µPD30500, 30500A, 30500B
System Interface Parameter
Parameter
Symbol
Condition
Modebit (14 : 13) = 10
Modebit (14 : 13) = 11
Modebit (14 : 13) = 00
Modebit (14 : 13) = 01
MIN.
1.3
MAX.
Unit
ns
ns
ns
ns
ns
ns
ns
Data output hold time
tDM
1.4
1.5
1.5
Data output delay time
Data input setup time
Data input hold time
tDO
tDS
tDH
5.0
1.6
0.5
Boot Mode Interface Parameter
Parameter
More data setup time
Mode data hold time
Symbol
Condition
MIN.
MAX.
Unit
ns
tMDS
tMDH
tCP × 0.35
tCP × 0.35
ns
Load Coefficient
Parameter
Symbol
CLD
Condition
MIN.
MAX.
1.5
Unit
Load coefficient
ns/25 pF
Power Application Sequence
Two kinds of power sources are provided with the VR5000A. The sequence of the power application order is not
fixed. However, make sure that either of the power supplies does not remain turned on for 1 second or more while
the other remains off.
Parameter
Symbol
Condition
MIN.
0
MAX.
1
Unit
sec
Power application delay
tDP
Data Sheet U12031EJ3V0DS00
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µPD30500, 30500A, 30500B
(3) µPD30500B (Preliminary)
Absolute Maximum Ratings
Parameter
Symbol
VDDIO
VDD
Condition
Rating
–0.5 to +4.0
Unit
V
Supply voltage
–0.3 to +2.5
V
Note
Input voltage
VI
–0.5 to VDDIO + 0.3
–1.5 to VDDIO + 0.3
0 to +85
V
Pulse of less than 10 ns
V
Operating case temperature
Storage temperature
TC
°C
°C
Tstg
–40 to +125
Note The upper limit of the input voltage (VDDIO + 0.3) is +4.0 V.
Cautions 1. Do not short circuit two or more outputs at the same time.
2. The quality of the product may be degraded if the absolute maximum rating of even one of
the above parameters is exceeded, even momentarily. Absolute maximum ratings, therefore,
specify the values which if exceeded may physically damage the product. Use the product
never exceeding these ratings.
The specifications and conditions shown in the following DC Characteristics and AC
Characteristics are the range within which the product can normally operate and the quality
can be guaranteed.
DC Characteristics (TC = 0 to +85 °C, VDDIO = 3.3 V ±5 %, VDD = 1.8 V ±0.1 V)
Parameter
Symbol
VOH
Condition
VDDIO = MIN., IOH = –4 mA
VDDIO = MIN., IOL = 4 mA
MIN.
2.4
MAX.
Unit
V
High-level output voltage
Low-level output voltage
VOL
0.4
VDDIO + 0.3
+0.8
V
Note 1
High-level input voltage
VIH
2.0
V
Note 1
Low-level input voltage
VIL
–0.5
–1.5
V
Pulse of less than 10 ns
Pulse of less than 10 ns
+0.8
V
Note 2
Note 2
High-level input voltage
VIHC
VILC
0.8 × VDDIO VDDIO + 0.3
V
Low-level input voltage
Input leakage current
–0.5
–1.5
–5
0.2 × VDDIO
0.2 × VDDIO
+5
V
V
ILI
µA
µA
Input/output leakage current
ILIO
–5
+5
Notes 1. Not applied to the SysClock pin.
2. Applied to the SysClock pin only.
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µPD30500, 30500A, 30500B
Capacitance
Parameter
Symbol
CIn
Condition
MIN.
MAX.
Unit
pF
Input capacitance
Output capacitance
5
7
Cout
pF
AC Characteristics (TC = 0 to +85 °C, VDDIO = 3.3 V ±5 %, VDD = 1.8 V ±0.1 V)
Clock parameter
Parameter
Symbol
tCH
Condition
MIN.
3.0
3.0
20
MAX.
Unit
ns
System clock high-level width
System clock low-level width
tCL
ns
Note 1, 2
System clock frequency
100
50
MHz
ns
System clock cycle
System clock jitter
tCP
tji
10
System clock frequency > 66 MHz
±125
±250
2.0
ps
System clock frequency ≤ 66 MHz
ps
System clock rise time
System clock fall time
Mode clock cycle
tCR
ns
tCF
2.0
ns
tMOC
256 × tCP
ns
Notes 1. The operation of the VR5000B is guaranteed only when the PLL is operating
2. The operation is guaranteed if the internal operating frequency 100 MHz or higher.
Data Sheet U12031EJ3V0DS00
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µPD30500, 30500A, 30500B
System Interface Parameter
Parameter
Symbol
Condition
Modebit (14 : 13) = 10
Modebit (14 : 13) = 11
Modebit (14 : 13) = 00
Modebit (14 : 13) = 01
MIN.
1.3
MAX.
Unit
ns
ns
ns
ns
ns
ns
ns
Data output hold time
tDM
1.4
1.5
1.5
Data output delay time
Data input setup time
Data input hold time
tDO
tDS
tDH
5.0
1.6
0.5
Boot Mode Interface Parameter
Parameter
More data setup time
Mode data hold time
Symbol
Condition
MIN.
MAX.
Unit
ns
tMDS
tMDH
tCP × 0.35
tCP × 0.35
ns
Load Coefficient
Parameter
Symbol
CLD
Condition
MIN.
MAX.
1.5
Unit
Load coefficient
ns/25 pF
Power Application Sequence
Two kinds of power sources are provided with the VR5000B. The sequence of the power application order is not
fixed. However, make sure that either of the power supplies does not remain turned on for 1 second or more while
the other remains off.
Parameter
Symbol
Condition
MIN.
0
MAX.
1
Unit
sec
Power application delay
tDP
Data Sheet U12031EJ3V0DS00
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µPD30500, 30500A, 30500B
Test Condition
SysClock
50 %
tDO
tDM
All output pins
50 %
Test Load
All output pins
DUT
C
L
= 50 pF
Timing Chart
Clock timing
tCP
tCH
80 %
SysClock
50 %
20 %
tCL
tCR
tCF
Mode clock timing
tMOC
ModeClock
50 %
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µPD30500, 30500A, 30500B
Clock jitter
tji
tji
SysClock
50 %
System interface edge timing
SysClock
tDO
tDH
tDM
tDS
SysAD (0 : 63), SysADC (0 : 7),
SysCmd (0 : 8), SysCmdP,
Output
Output
Input
ScLine (0 : 15), ScWord (0 : 1), ScTCE, ScValid
tDO
tDM
ValidOut, Release, ScCLR,
ScCWE (0 : 1), ScDCE (0 : 1),
ScTDE, ScTOE
Output
Output
tDS
tDH
ValidIn, ExtRqst, RdRdy,
WrRdy, ScDOE, ScMatch,
Int (0 : 5), NMI
Input
Boot mode interface edge timing
ModeClock
tMDS
tMDH
Input
ModeIn
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22
µPD30500, 30500A, 30500B
Clocking relations
Cycle
1
2
3
4
SysClock
(input)
PClock
(output)
tDO
tDM
SysAD Driven
(output)
Data
Data
Data
Data
SysAD Received
(input)
Data
Data
Data
Data
tDS
tDH
Power application sequence (VR5000A, VR5000B only)
tDP
tDP
VDD 0.5VDD
VDDIO
0.5VDDIO
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23
µPD30500, 30500A, 30500B
Reset Timing
Power-on reset timing
Note 1
VDD
VDDI/ONote 2
SysClock
VDDOk
3.135 V
≥ 64 K SysClock
≥ 100 ms
256 SysClock
ModeClock
ModeIn
Undefined
tMDS
tMDH
bit0
bit1
bit255
tDS
ColdReset
Reset
≥ 64 SysClock
tDS
Notes 1. 3.135 V (VR5000), 2.375 V (VR5000A), 1.7 V (VR5000B)
2. VR5000A, VR5000B only
Cold reset timing
H
H
VDD
VDDIONote
SysClock
VDDOk
≥ 64 K SysClock
≥ 64 SysClock
256 SysClock
ModeClock
ModeIn
Undefined
tMDS
tMDH
bit0
bit1
bit255
tDS
≥ 64 SysClock
ColdReset
Reset
tDS
Note VR5000A, VR5000B only
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24
µPD30500, 30500A, 30500B
Warm reset timing
H
H
VDD
VDDIONote
SysClock
VDDOk
≥ 64 SysClock
H
H
ColdReset
Reset
tDS
tDS
Note VR5000A, VR5000B only
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25
µPD30500, 30500A, 30500B
PACKAGE DRAWING
223 PIN CERAMIC PGA
A
< Bottom View >
18
17
16
15
14
13
12
11
10
9
D
8
7
6
5
4
3
2
1
T S R Q P N M L K J H G F E D C B A
Index Mark
J
I
F
E
K
M
L
φM
H
G
NOTE
ITEM MILLIMETERS
INCHES
1.860±0.010
1.860±0.010
0.080
Each lead centerline is located within φ0.254(φ0.010 inch) of
A
D
E
F
G
H
I
47.24±0.25
47.24±0.25
2.03
its true position (T.P.) at maximum material condition.
2.54(T.P.)
3.30±0.2
0.50 MIN.
2.82
0.100(T.P.)
0.130±0.008
0.019 MIN.
0.111
J
3.98 MAX.
φ 1.27±0.2
φ0.46±0.05
0.254
0.157 MAX.
0.050±0.008
φ0.018±0.002
0.010
K
L
M
X223RJ-100A-1
Data Sheet U12031EJ3V0DS00
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26
µPD30500, 30500A, 30500B
272 PIN PLASTIC BGA (29x29)
B
A
A
21
20
19
18
17
16
15
14
13
12
11
10
9
D
8
7
6
5
4
3
2
1
AA
YWV U T R P NM L K J H G F E D C B A
Index mark
Z
J
Y
H
G
E
S
detail of A part
A
A
K
S
F
φ
M
L
M
S
B *2
φP
M
S *3
N
NOTES
1. Controlling dimension
ITEM MILLIMETERS
INCHES
millimeter.
+0.008
A
D
29.00±0.20
1.142
−0.009
∗
2. Each ball centerline is located within
its true position (T.P.) at maximum material condition.
3. Each ball centerline is located within 0.10 mm of
its true position (T.P.) at maximum material condition.
φ
0.30 mm of
+0.008
29.00±0.20
1.142
0.071
−0.009
∗
φ
E
F
1.80
1.27 (T.P.)
0.050 (T.P.)
+0.004
0.024
G
0.60±0.10
−0.005
H
J
0.90
0.035
1.50±0.20
0.15
0.059±0.008
0.006
K
+0.006
φ
0.030
L
φ
0.75±0.15
−0.007
M
N
P
Y
Z
0.30
0.012
0.25 MIN.
0.10
0.009 MIN.
0.004
C1.5
0.059
C0.5
0.020
S272S2-C6-2
Data Sheet U12031EJ3V0DS00
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27
µPD30500, 30500A, 30500B
RECOMMENDED SOLDERING CONDITIONS
Soldering this product under the following soldering conditions is recommended.
For the details of the recommended soldering conditions, refer to Information Document Semiconductor Device
Mounting Technology Manual (C10535E).
For the soldering methods and recommended other than those recommended, consult NEC.
(1) Soldering Conditions of Surface Mount Type
µPD30500S2-150
µPD30500S2-180
µPD30500S2-200
µPD30500AS2-200
µPD30500AS2-250
µPD30500BS2-250
µPD30500BS2-300
: 272-pin plastic BGA (29 × 29 mm)
: 272-pin plastic BGA (29 × 29 mm)
: 272-pin plastic BGA (29 × 29 mm)
: 272-pin plastic BGA (29 × 29 mm)
: 272-pin plastic BGA (29 × 29 mm)
: 272-pin plastic BGA (29 × 29 mm)
: 272-pin plastic BGA (29 × 29 mm)
Note 1
Note 1
Note 1
Note 1
Recommended
Soldering Method
Infrared reflow
Soldering Conditions
Conditions Symbol
Package peak temperature: 235 °C, Time: 30 sec max. (210 °C min.),
Number of times: 3 times max., Number of days: 3Note 2 (after that, prebaking is
necessary at 125 °C for 10 hours)
IR35-103-3
VP15-103-3
—
VPS
Package peak temperature: 215 °C, Time: 25 to 40 sec max. (200 °C min.),
Number of times: 3 times max., Number of days: 3Note 2 (after that, prebaking is
necessary at 125 °C for 10 hours)
Partial heating
Pin temperature: 300 °C max., Time: 3 sec max. (per device side)
Notes 1. Under development
2. Number of days in storage after the dry pack has been opened. The storage conditions are at 25 °C, 65% RH
MAX.
Caution Do not use two or more soldering methods in combination (except partial heating).
(2) Soldering Conditions of Insertion Type
µPD30500RJ-150 : 223-pin ceramic PGA (48 × 48 mm)
µPD30500RJ-180 : 223-pin ceramic PGA (48 × 48 mm)
µPD30500RJ-200 : 223-pin ceramic PGA (48 × 48 mm)
Soldering Method
Soldering Conditions
Wave soldering
(Pin only)
Solder bath temperature: 260 °C max., Time: 10 sec max.,
Partial heating
Pin temperature: 300 °C max., Time: 3 sec max. (Per pin)
Caution Wave soldering is only for the lead part in order that jet solder cannot contact with the chip directly.
Data Sheet U12031EJ3V0DS00
28
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µPD30500, 30500A, 30500B
TM
DIFFERENCES BETWEEN THE VR5000 AND VR4310
Item
VR5000
VR4310
167 MHz MAX.
Operating frequency
Internal
External
200 MHz MAX.
100 MHz MAX.
83.3 MHz MAX.
5-stage pipeline
Pipeline
Cache
2-way super scalar 5-stage
pipeline
Primary instruction cache
Primary data cache
32K bytes
32K bytes
16K bytes
8K bytes
None
Secondary cache interface Provided
Data protection
Byte parity
None
System bus
Write data transfer rate
9 types (DDDD/DD×DD×/
DD××DD××/D×D×D×D×/
DD×××DD×××/DD××××DD××××/
D××D××D××D××/
2 types (D/D××)
DD××××××DD××××××/D×××D×××)
Initialization pin at reset
ModeIn (dedicated serial pin)
DivMode (0:2)
Status after last data write Access ends
Last data retained when transfer
rate is set
Integer operation unit
JTAG interface
Corresponding instruction
MIPS I, II, III, IV instruction sets
MIPS I, II, III instruction sets
Provided
None
None
SyncOut-SyncIn bus
Clock interface
Provided
Multiplication ratio of input 2, 3, 4, 5, 6, 7, 8
to internal
1.5, 2, 2.5, 3, 4, 5, 6
Division ratio of internal to 2, 3, 4, 5, 6, 7, 8
bus
1.5, 2, 2.5, 3, 4, 5, 6
TClock
Clock output
None
Low-power mode
PRId register
Pipline does not operate.
Pipeline/system bus operates
at power of 1/4 of normal
operation.
Imp = 0×23
Imp = 0×0B
Data Sheet U12031EJ3V0DS00
29
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µPD30500, 30500A, 30500B
NOTES FOR CMOS DEVICES
1
PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2
HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3
STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
Note that this document is not designated as ‘preliminary’, while some of the related documents are preliminary
versions.
VR3000, VR4000, VR4310, VR5000, VR5000A, VR5000B, VR10000, and VR Series are trademarks of NEC Corp.
MIPS is a trademark of MIPS Technologies Inc.
Data Sheet U12031EJ3V0DS00
30
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µPD30500, 30500A, 30500B
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, please contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
• Device availability
• Ordering information
• Product release schedule
• Availability of related technical literature
• Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
• Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
NEC Electronics Inc. (U.S.)
Santa Clara, California
Tel: 408-588-6000
800-366-9782
NEC Electronics Hong Kong Ltd.
Hong Kong
Tel: 2886-9318
NEC Electronics (Germany) GmbH
Benelux Office
Eindhoven, The Netherlands
Tel: 040-2445845
Fax: 2886-9022/9044
Fax: 408-588-6130
800-729-9288
Fax: 040-2444580
NEC Electronics Hong Kong Ltd.
Seoul Branch
Seoul, Korea
Tel: 02-528-0303
Fax: 02-528-4411
NEC Electronics (France) S.A.
Velizy-Villacoublay, France
Tel: 01-30-67 58 00
NEC Electronics (Germany) GmbH
Duesseldorf, Germany
Tel: 0211-65 03 02
Fax: 01-30-67 58 99
Fax: 0211-65 03 490
NEC Electronics Singapore Pte. Ltd.
United Square, Singapore 1130
Tel: 65-253-8311
NEC Electronics (France) S.A.
Spain Office
Madrid, Spain
NEC Electronics (UK) Ltd.
Milton Keynes, UK
Tel: 01908-691-133
Fax: 65-250-3583
Tel: 91-504-2787
Fax: 01908-670-290
Fax: 91-504-2860
NEC Electronics Taiwan Ltd.
Taipei, Taiwan
Tel: 02-2719-2377
NEC Electronics Italiana s.r.l.
Milano, Italy
NEC Electronics (Germany) GmbH
Scandinavia Office
Tel: 02-66 75 41
Fax: 02-2719-5951
Taeby, Sweden
Fax: 02-66 75 42 99
Tel: 08-63 80 820
NEC do Brasil S.A.
Fax: 08-63 80 388
Electron Devices Division
Rodovia Presidente Dutra, Km 214
07210-902-Guarulhos-SP Brasil
Tel: 55-11-6465-6810
Fax: 55-11-6465-6829
J99.1
Data Sheet U12031EJ3V0DS00
31
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µPD30500, 30500A, 30500B
Exporting this product or equipment that includes this product may require a governmental license from the U.S.A. for some
countries because this product utilizes technologies limited by the export control regulations of the U.S.A.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights
or other intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated “quality assurance program“ for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98.8
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