LGA771 Socket
Mechanical Design Guide
November, 2006
Reference Number: 313871-002
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Contents
Introduction.................................................................................................................7
Document Goals and Scope ..................................................................................7
1.1.1 LGA771 Socket Overview ..........................................................................7
1.1.2 Document Goals.......................................................................................7
1.1.3 Important Remarks ..................................................................................7
Terminology .......................................................................................................8
Reference Documents..........................................................................................8
Assembled Component and Package Description...............................................................9
Mechanical Requirements ............................................................................................ 11
Socket Components........................................................................................... 11
3.2.1 Socket Body .......................................................................................... 11
3.2.2 Socket Actuation Mechanism.................................................................... 13
3.2.3 Pick and Place Cover............................................................................... 14
3.2.4 Socket Insertion / Actuation Forces........................................................... 14
Electrical Requirements............................................................................................... 19
Environmental Requirements ....................................................................................... 21
Durability......................................................................................................... 23
Mechanical Drawings................................................................................................... 25
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Figures
1
Definition of R...................................................................................................17
LGA Socket Assembly Drawing (Sheet 1 of 4)........................................................26
LGA Socket Assembly Drawing (Sheet 2 of 4)........................................................27
LGA Socket Assembly Drawing (Sheet 3 of 4)........................................................28
LGA Socket Assembly Drawing (Sheet 4 of 4)........................................................29
A-10 LGA771 Socket Motherboard Footprint (Sheet 6 of 7) .............................................35
A-11 LGA 771 Socket Motherboard Footprint (Sheet 7 of 7) ............................................36
A-12 LGA 771 Socket Footprint (Sheet 1 of 2) ..............................................................37
A-13 LGA 771 Socket Footprint (Sheet 2 of 2) ..............................................................38
Tables
Socket Loading Specifications..............................................................................16
4
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Revision History
Revision
Description
Initial release of the document.
Date
June 2006
001
•
•
•
•
•
Updated Dual-Core 5000 & 5100 Series stackup heights
Added Quad-Core 5300 Series stackup height
Added Figure 3-1
002
November 2006
Removed Appendix B - Vendor Information
§
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Introduction
1 Introduction
1.1
Document Goals and Scope
1.1.1
LGA771 Socket Overview
This document describes a surface mount, LGA (Land Grid Array) socket intended for
®
®
the Dual-Core Intel Xeon Processor 5000 Sequence Family for Servers and
Workstations. The socket provides I/O, power and ground contacts. The socket
contains 771 contacts arrayed about a cavity in the center of the socket with solder
balls for surface mounting with the motherboard. The LF-LGA771 Socket contains lead-
free solder balls while the LGA771 Socket contains eutectic solder balls. This Design
Guide will refer to the socket as LGA771 for simplicity, but its contents are applicable to
both lead-free and eutectic solder materials unless otherwise specified. The socket
contacts have 1.09 mm X 1.17 mm pitch (X by Y) in a 33x30 grid array with 15x14 grid
depopulation in the center of the array and selective depopulation for keying features.
A matching LGA package will be mated with the socket.
For board layout, the land pattern for the LGA771 socket is 43 mils X 46 mils (X by Y),
and the pad size is 18 mils. The component dimensions are defined in metric so there is
a slight round-off error when converting to mils, but it is a negligible amount, relatively
speaking, when compared to the size of the ball and pad. There have been no reported
manufacturing issues.
1.1.2
1.1.3
Document Goals
The goals of this document are:
• To provide LGA771 socket information necessary for motherboard design to ensure
the specified performance of the platform.
• To define the boundary conditions and design constraints within which the socket
design must fit and perform.
Important Remarks
All LGA771 socket characteristics mentioned in this document may change.
LGA771 socket validation reports are available from socket vendors.
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Introduction
1.2
Terminology
Term
Description
LGA771 Socket
Processor in the 771-land package mates with the system board through a surface
mount, 771-pin, LGA (land grid array) socket.
LGA771-Land
LGA771 Package
Processors in the 771-Land package are available in a Flip-Chip Land Grid Array
package technology, consisting of a processor core mounted on a substrate with an
integrated heat spreader (IHS). This packaging technology employs a 1.09 mm x
1.17 mm pitch for the substrate lands. Refer to the processor datasheet for
additional information.
IHS (Integrated Heat
Spreader)
A component of the processor package used to enhance the thermal performance of
the package. Component thermal solutions interface with the processor at the IHS
surface.
Lead-free / Pb-free
RoHS compliant
Lead has not been intentionally added, but lead may still exist as an impurity below
1000 ppm.
Lead and other materials banned in RoHS Directive are either (1) below all applicable
substance thresholds as proposed by the EU or (2) an approved/pending exemption
applies. (Note: RoHS implementing details are not fully defined and may change).
1.3
Reference Documents
Document
Intel Order Number
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
313079
313355
313062
313357
315569
315794
Dual-Core Intel® Xeon® Processor 5100 Series Datasheet
Dual-Core Intel® Xeon® Processor 5000 Series Thermal/Mechanical Design Guide
Dual-Core Intel® Xeon® Processor 5100 Series Thermal/Mechanical Design Guide
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
Quad-Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guide
Note: Contact your Intel representative for the latest revisions of these documents.
§
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Assembled Component and Package Description
2 Assembled Component and
Package Description
The LGA771 Socket dimensions and characteristics must be compatible with that of the
processor package and related assembly components. Processors using Flip-Chip Land
Grid Array package technology are targeted to be used with the LGA771 socket.
The assembled component may consist of a cooling solution (heatsink, fan, clips, and
retention mechanism), and processor package. The processor Thermal/Mechanical
Design Guidelines (TMDG) provides information for designing components compliant
with the Intel reference design.
Relevant processor 771-Land LGA package and pin-out information is given in the
processor datasheet.
§
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Assembled Component and Package Description
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Mechanical Requirements
3 Mechanical Requirements
3.1
Attachment
The socket will be tested against the mechanical shock and vibration requirements
processor datasheet. The socket will only be attached by the 771 contact solder balls to
the motherboard. There are no additional external methods (i.e. screw, extra solder,
adhesive, etc.) to attach the socket.
Note:
Heatsink Static Compressive Loading
Heatsink static compressive loading is traditionally used for:
• Mechanical performance in mechanical shock and vibration.
• Thermal interface material (TIM) performance
— Required preload depends on selected TIM
In addition to mechanical performance in shock and vibration and TIM performance,
LGA771 socket requires a minimum heatsink static compressive load to protect against
fatigue failure of socket solder joints.
Solder ball tensile stress is created by inserting a processor into the socket and
actuating the LGA771 socket load plate. In addition, solder joint shear stress is caused
by coefficient of thermal expansion (CTE) mismatch induced shear loading. The solder
joint compressive axial force induced by the heatsink static compressive load helps to
reduce the combined joint tensile and shear stress.
Overall, the heatsink required static compressive load is the minimum static
compressive load needed to meet all of the above requirements: Mechanical shock and
vibration, TIM performance, and LGA771 socket protection against fatigue failure.
the LGA771 socket to ensure socket solder joint protection against fatigue in
temperature cycling.
3.2
Socket Components
The socket is made of four main components: socket body, load plate, load lever, and
The socket will be delivered as a single integral assembly.
3.2.1
Socket Body
3.2.1.1
Housing
The housing material will be a thermoplastic or equivalent, UL 94 V-0 flame rating,
temperature rating and design capable of maintaining structural integrity following a
temperature of 260°C for 40 seconds which is typical of a reflow/rework profile for
solder material used on the socket. The material must have a thermal coefficient of
expansion in the XY plane capable of passing reliability tests rated for an expected high
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Mechanical Requirements
operating temperature, while mounted on an FR4-type motherboard material. The
creep properties of the material must be such that the mechanical integrity of the
The color of the socket housing will be dark as compared to the solder balls to provide
the contrast needed for surface-mount (SMT) equipment pick and place vision systems.
Components of the socket may be different colors as long as they meet the above
requirement.
3.2.1.2
Package Installation / Removal Access
Access will be provided to facilitate the manual insertion and removal of the package.
To assist in package alignment and proper orientation during package installation into
the socket:
• The package substrate has keying notches along two opposing edges of the
package and offset from the package centerline (refer to the processor datasheet
for further details).
• The socket utilizes one feature designed to mate with the keying notch along the
3.2.1.3
Socket Standoffs
Standoffs will be provided on the bottom of the socket base in order to ensure the
minimum socket height after solder reflow. The standoff locations and surface area
plane and the standoff prior to reflow is required to prevent solder ball to motherboard
land open joints.
3.2.1.4
Markings
All markings withstand a temperature of 260°C for 40 seconds, which is typical of a
reflow/rework profile for solder material used on the socket, as well as any
3.2.1.4.1
Name
LGA771 (Font type is Helvetica Bold – minimum 6 point (or 2.125 mm)).
This mark shall be stamped or Laser Marked into the sidewall of the stiffener plate on
the actuation lever side when eutectic solder is used.
LF-LGA771 (Font type is Helvetica Bold – minimum 6 point (or 2.125 mm)).
This mark shall be stamped or Laser Marked into the sidewall of the stiffener plate on
the actuation lever side when lead-free solder is used.
Manufacturer’s insignia (Font size is at supplier’s discretion).
This mark will be molded or Laser Marked into the socket housing.
Both socket name and manufacturer’s insignia will be visible when first seated on the
motherboard.
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Mechanical Requirements
3.2.1.4.2
3.2.1.5
Lot Traceability
Each socket will be marked with a lot identification code to allow traceability of all
components, date of manufacture (year and week), and assembly location. The mark
must be placed on a surface that is visible when mounted on the motherboard.
Contacts
The socket has a total of 771 contacts, with 1.09 mm X 1.17 mm pitch (X by Y) in a
33x30 grid array with 15x14 grid depopulation in the center of the array and selective
depopulation for alignment features. For board layout, a 43 mils x 46 mils pitch
(X by Y) can be utilized.
Base material for the contacts is high strength copper alloy.
For the area on socket contacts where processor lands will mate, there is a 0.381 µm
[15 µinches] minimum gold plating over 1.27 µm [50 µinches] minimum nickel
underplate.
No contamination by solder in the contact area is allowed during solder reflow.
3.2.1.6
Solder Balls
A total of 771 solder balls corresponding to the contacts are on the bottom of the
socket for surface mounting with the motherboard.
Two versions of the socket, leaded and lead-free, will be available with the following
materials for the solder balls:
• Eutectic Solder
— Sn63 Pb37 (± 0.5% Sn).
— Socket marking will be LGA771 for sockets comprised of eutectic solder.
• Lead-free Solder
— Composition must be lead free and have a melting point temperature in the
range of 217-220°C (for example: Sn Ag 3.0 Cu 0.5).
— Socket marking will be LF-LGA771 for sockets comprised of lead-free solder.
The co-planarity (profile) requirement for all solder balls on the underside of the socket
The solder ball pattern has a true position requirement with respect to applicable
3.2.2
Socket Actuation Mechanism
The socket actuation mechanism is made of the load plate and the load lever. These
components are made of stainless steel SUS 301. Both components need to be fully
actuated to ensure electrical contact. When correctly actuated, the top surface of the
processor IHS is above the load plate allowing proper installation of a heatsink. The
post-actuated seating plane of the package is flush with the seating plane of the
socket. Movement will be along the Z direction, perpendicular to the motherboard.
When combined with the socket body and load lever, the load plate distributes the force
necessary to achieve the required socket contact resistance values. The load from the
load plate is distributed across two sides of the package onto a step on each side of the
IHS. It is then distributed by the package across all of the contacts.
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Mechanical Requirements
The stiffener plate is made of stainless steel SUS 301. The stiffener plate provides the
interface to the load lever and the load plate and creates the primary stiffening element
to react to the load generated by the load plate.
3.2.3
Pick and Place Cover
The pick and place cover is a dual purpose removable component common to the
LGA771 socket. The cover’s primary purpose is to provide a planar surface at least
20 mm in diameter and compatible with SMT placement systems. As such, the cover
retention must be sufficient to support the socket weight during lifting, translation, and
placement. The cover material should be chosen such that it is able to withstand 260°C
for 40 seconds.
The secondary function of the Pick and Place Cover is to provide a physical barrier
against contamination and undesirable physical contact of the socket contact array
during post-SMT handling environments in board assembly environments, during
shipping, and in system assembly environments. As such, cover retention is sufficient
for the cover to remain in place through these environments. The cover should be able
to be installed and removed without the use of tools.
There should be no surfaces or features above the pick surface. The Pick and Place cap
should attach to the exterior of the Load Plate to maximize its distance from the socket
contacts and be compatible with volumetric keep-ins as defined in the processor
Thermal/Mechanical Design Guidelines. The cover should not have features that
protrude below the Load Plate inner profile and into the socket cavity. Also, there
should be no features that protrude above the pick and place surface. Further, any vent
holes added to the Pick and Place Cover to aid in air circulation during reflow should be
positioned as to not allow fluid contaminants a direct path to the contacts (i.e. no
socket contacts should be visible with the cover installed). Finally, a Pin 1 indicator,
typically a triangular cutout, on the Pick and Place Cover is highly desirable.
3.2.4
Socket Insertion / Actuation Forces
Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/
Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table
R2-7 (Maximum Grip Forces).
The socket must be designed so that it requires no force to insert the package into the
socket.
The load lever actuation force must not exceed 3.9 kgf [8.6 lbf] in the vertical direction
and 1 kgf [2.3 lbf] in the lateral direction.
The pick and place cover insertion and removal force must not exceed 1 kgf [2.3 lbf].
3.3
Socket Size
This information should be used in conjunction with the reference motherboard keep-
out drawings provided in the processor Thermal/Mechanical Design Guidelines to
ensure compatibility with the reference thermal mechanical components.
3.4
Socket Weight
The LGA771 socket will weigh around 35 g, which includes the mechanical components.
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Mechanical Requirements
3.5
Package/Socket Stackup Height
®
®
Table 3-1.
Intel Xeon 5000 Sequence Package and Socket Stackup Height
1
Integrated Stackup Height (mm)
From Top of Board to Top of IHS
Processor
Dual-Core Intel® Xeon® Processor 5000 Series
Dual-Core Intel® Xeon® Processor 5100 Series
Quad-Core Intel® Xeon® Processor 5300 Series
7.628 - 8.120
7.693 - 8.155
7.604 - 8.124
Notes:
1.
Preliminary Guidance. This data is provided for information only, and should be derived from: (a) the height
of the socket seating plane above the motherboard after reflow, given in the LGA771 Socket Mechanical
Design Guide with its tolerances; (b) the height of the package, from the package seating plane to the top
of the IHS, and accounting for its nominal variation and tolerances that are given in the corresponding
processor datasheet.
1
Figure 3-1. Cross-sectional view of Package / Socket stackup height
Notes:
1.
Not to scale. Shown for illustrative purposes only.
3.6
Socket Loading Specifications
mechanical load limits should not be exceeded during heatsink assembly, mechanical
stress testing or standard drop and shipping conditions. The heatsink attach solutions
must not include continuous stress onto the socket with the exception of a uniform load
to maintain the heatsink-to-processor thermal interface. Also, any mechanical system
or component testing should not exceed these limits. The socket body should not be
used as a mechanical reference or load-bearing surface for thermal or mechanical
solutions.
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Mechanical Requirements
Table 3-2.
Socket Loading Specifications
Board
Thickness
10
Parameter
R
Min
Max
Unit
Notes
Static
Compressive Load
Apply for all
board
thickness
from
1.57 mm
25 mm
< R <
45 mm
80
18
133
30
N
lbf
1,2,3,8,
9,10,
11,12
( 0.062” )
to 2.54 mm
( 0.100” )
R >45 mm 80
18
311
70
N
lbf
Dynamic
Compressive Load
NA
NA
NA
311 N (max static compressive
load) + 222 N dynamic loading
N
1,3,4,
5,6
70 lbf (max static compressive
load) + 50 lbf dynamic loading
lbf
Transient Bend
Limits
1.57 mm
0.062”
NA
NA
750
700
650
1,3,7
με
2.16 mm
0.085”
2.54 mm
0.100”
Notes:
1.
These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top
surface.
2.
This is the minimum and maximum static force that can be applied by the heatsink and retention solution
to maintain the heatsink and processor interface.
3.
4.
5.
Loading limits are for the LGA771 socket.
Dynamic compressive load applies to all board thickness.
Dynamic loading is defined as an 11 ms duration average load superimposed on the static load
requirement.
6.
Test condition used a heatsink mass of 1 lbm with 50 g acceleration measured at heatsink mass. The
dynamic portion of this specification in the product application can have flexibility in specific values, but the
ultimate product of mass times acceleration should not exceed this dynamic load.
Transient bend is defined as the transient board deflection during manufacturing such as board assembly
and system integration. It is a relatively slow bending event compared to shock and vibration tests.
Refer to the processor Thermal Mechanical Design Guide for information on heatsink clip load metrology.
R is defined as the radial distance from the center of the LGA771 socket ball array to the center of the
7.
8.
9.
10. Applies to populated sockets in fully populated and partially populated socket configurations.
11. Through life or product. Condition must be satisfied at the beginning of life and at the end of life.
12. Rigid backing is not allowed. The board should flex in the enabled configuration.
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Mechanical Requirements
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Electrical Requirements
4 Electrical Requirements
Socket electrical requirements are measured from the socket-seating plane of the
processor to the component side of the PCB to which it is attached. All specifications
are maximum values (unless otherwise stated) for a single socket contact, but includes
effects of adjacent contacts where indicated.
Table 4-1.
LGA771 Socket Electrical Requirements
No
*1
Criteria
Size
Notes
Mated loop
inductance, Loop
1.17 mm:
<3.9 nH
The inductance calculated for two contacts, considering one
forward conductor and one return conductor. These values
must be satisfied at the worst-case height of the socket.
2
3
4
Mated partial mutual
inductance, L
NA
The inductance on a conductor due to any single neighboring
conductor.
Maximum mutual
capacitance, C
<1 pF
≤ 15.2 mΩ
The capacitance between two pins/connectors.
Socket Average
Contact Resistance
(EOL)
This value has to be satisfied at all times.
The specification listed is at room temperature.
The socket average resistance target is derived from average
of every chain contact resistance, with a chain contact
resistance defined as the resistance of each chain minus
resistance of shorting bars divided by number of lands in the
daisy chain.
Socket Contact Resistance: The resistance of the socket
contact, including the interface resistance to the package land.
5
Max Chain Contact
Resistance (EOL)
≤ 28 mΩ
This value has to be satisfied at all times.
The specification listed is at room temperature.
The socket average resistance target is derived from average
of every chain contact resistance, with a chain contact
resistance defined as the resistance of each chain minus
resistance of shorting bars divided by number of lands in the
daisy chain.
Socket Contact Resistance: The resistance of the socket
contact, including the interface resistance to the package land.
6
Bulk Resistance
Increase
≤ 3 mΩ
The bulk resistance increase per contact from 24°C to 100°C
7
8
Dielectric Withstand
Voltage
360 Volts
RMS
Insulation Resistance 800 MΩ
§
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Electrical Requirements
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Environmental Requirements
5 Environmental Requirements
Design, including materials, shall be consistent with the manufacture of units that meet
the following environmental reference points.
The reliability targets in this section are based on the expected field use environment
for a server product. The test sequence for new sockets will be developed using the
knowledge-based reliability evaluation methodology, which is acceleration factor
Figure 5-1. Flow Chart of Knowledge-Based Reliability Evaluation Methodology
Establish the market/
expected use environment
for the technology
Develop Speculative stress
conditions based on
historical data, content
experts, and literature
search.
Freeze stressing
requirements and perform
additional data turns.
Perform stressing to
validate accelerated
stressing assumptions and
determine acceleration
factors.
A detailed description of this methodology can be found at:
speculative use condition assumptions, and are provided as examples only.
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Environmental Requirements
Table 5-1.
Use Conditions Environment
Example
7 Year stress
equivalent
Example
10 Year stress
equivalent
Speculative Stress
Example
Use condition
Use Environment
Condition
Slow small internal
gradient changes due to
external ambient
(temperature cycle or
externally heated)
Temperature Cycle
ΔT = 35 - 44°C
(solder joint)
550-930 cycles
Temp Cycle Q
(-25°C to 100°C)
780-1345 cycles
Temp Cycle Q
(-25°C to 100°C)
Fast, large gradient on/off
to max operating temp.
(power cycle or internally
heated including power
save features)
High ambient moisture
during low-power state
(operating voltage)
THB/HAST
Bake
T = 25 –30°C
85%RH
(ambient)
110-220 hrs at 110
°C 85%RH
145-240 hrs at 110°C
85%RH
High Operating
T = 95 - 105°C
(contact)
700 – 2500 hrs at
125°C
800 – 3300 hrs at
125°C
temperature and short
duration high temperature
exposures
Mechanical Shock
System-level
Total of 12 drops per
system:
n/a
Unpackaged
2 drops per axis
± direction
Trapezoidal
25 g
velocity change is based on packaged weight
Non-palletized
Product Velocity
Change* (in/sec)
Product Weight (lbs)
Shipping and Handling
< 20 lbs
250
225
205
175
145
125
20 to > 40
40 to > 80
80 to < 100
100 to < 120
120
* Change in velocity is based upon a 0.5
coefficient of restitution.
Random Vibration
System-level
Total per system:
n/a
Unpackaged
10 minutes per axis
3 axes
5 Hz to 500 Hz
Shipping and Handling
2.20 g RMS random
2
2
5 Hz @ .001 g /Hz to 20 Hz @ 0.01 g /Hz (slope
up)
2
20 Hz to 500 Hz @ 0.01 g /Hz (flat)
Random control limit tolerance is ± 3 dB
Note: These reliability requirements are given as examples only based on speculative use condition assumptions.
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Environmental Requirements
5.1
5.2
Solvent Resistance
Requirement: No damage to ink markings if applicable. EIA 364-11A.
Durability
Use per EIA-364, test procedure 09. Measure contact resistance when mated in 1st and
30th cycles. The package should be removed at the end of each de-actuation cycle and
reinserted into the socket. The socket’s pick-and-place cover must be able to be
inserted and removed from the socket at least 30 times.
§
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Environmental Requirements
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Mechanical Drawings
A Mechanical Drawings
The following table lists the mechanical drawings included in this section. These
drawings refer to the LGA771 socket.
Note:
Intel reserves the right to make changes and modifications to the design as necessary.
Drawing Description
LGA771 Socket Assembly Drawing
Page Number
27-30
31-37
38-39
LGA771 Socket Motherboard Footprint -1
LGA771 Socket Footprint
See figures beginning on following page.
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