Intel Power Supply ATX12V User Manual

ATX12V  
Power Supply Design Guide  
Version 2.0  
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ATX12V Power Supply Design Guide  
Version 2.0  
Contents  
3
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ATX12V Power Supply Design Guide  
Version 2.0  
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ATX12V Power Supply Design Guide  
Version 2.0  
Figures  
Tables  
5
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ATX12V Power Supply Design Guide  
Version 2.0  
1. Introduction  
1.1. Scope  
This document provides design suggestions and reference specifications for a family of  
power supplies that comply with the ATX Specification, Version 2.03for motherboards  
and chassis. It includes supplementary information not expressly detailed in the ATX  
Specification, such as information about the physical form factor of the power supply,  
cooling requirements, connector configuration, and pertinent electrical and signal timing  
specifications.  
This document is provided as a convenience only and is not intended to replace the user’s  
independent design and validation activity. It should not be inferred that all ATX12V  
power supplies must conform exactly to the content of this document. The design specifics  
described herein are not intended to support all possible system configurations. System  
power supply needs vary widely depending on factors such as the application (that is, for  
desktop, workstation, or server), intended ambient environment (temperature, line voltage),  
or motherboard power requirements.  
1.2. Key Changes for ATX12V Version 2.0 as Compared with  
ATX Power Supply  
This section briefly summarizes the major changes made to this document that now defines  
ATX12V power supply. With the move to 12V voltage regulators for the processor, ATX  
guidelines for 5V as main power are no longer provided.  
1.2.1. Increased +12 VDC output capability  
System components that use 12V are continuing to increase in power. In cases where  
expected current requirements is greater than 18A a second 12 V rail should be made  
available. ATX12V power supplies should be designed to accommodate these increased  
+12 VDC currents.  
1.2.2. Minimum Efficiency  
Minimum measured efficiency is required to be 70% at full and typical (~50%) load and  
60% at light (~20%) load. New recommended guidance has been added to provide direction  
for future requirements.  
2.03 is the current version of the ATX Specification as of this writing. Future references to the ATX  
Specification in this document imply version 2.03 or later, as applicable.  
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ATX12V Power Supply Design Guide  
Version 2.0  
1.2.3. Main Power Connector:  
The 2 x 10 main power connector has been replaced by a 2 x 12 connector. This was made to  
support 75 watt PCI Express*requirements. Pinout assignments are based on the SSI  
recommendation.  
With the added 12V, 5V, and 3.3V pins the need for an Aux Power connector is no longer  
needed and the guidance for this connector has been removed.  
1.2.4. Separate current limit for 12V2 on the 2x2 connector:  
The 12V rail on the 2 x 2 power connector should be a separate current limited output to meet  
the requirements of UL and EN 60950.  
1.3 Terminology  
The following terms are used in this document:  
Term  
Description  
The status given to items within this design guide, which are required to meet  
design guide and a large majority of system applications.  
Required  
The status given to items within this design guide, which are not required to  
meet design guide, however, are required by many system applications.  
Recommended  
Optional  
The status given to items within this design guide, which are not required to  
meet design guide, however, some system applications may optionally use these  
features.  
Declared sound power, LwAd. The declared sound power level shall be  
measured according to ISO* 7779 for the power supply and reported according  
to ISO 9296.  
BA  
Cubic Feet per Minute (airflow).  
CFM  
A waveform changes from one level to another in a steady fashion, without  
intermediate retracement or oscillation.  
Monotonically  
The periodic or random signals over frequency band of 0 Hz to 20 MHz.  
Noise  
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ATX12V Power Supply Design Guide  
Version 2.0  
2. Applicable Documents  
The following documents support this design guide as additional reference material.  
Document Title  
Description  
FCC Rules Part 15, Class B  
ICES-003: 1997, Class B  
Title 47, Code of Federal Regulations, Part 15  
Interference-Causing Equipment Standard – Digital Apparatus  
EN 55022: 1998 +  
Amendment A1:2000 Class B  
Information Technology Equipment – Radio disturbance characteristics – Limits  
and methods of measurement  
Information Technology Equipment – Radio disturbance characteristics – Limits  
and methods of measurement  
CISPR 22: 1997, Class B  
AS/NZS 3548:1995, Class B  
EN 55024:1998  
Information Technology Equipment – Radio disturbance characteristics – Limits  
and methods of measurement  
Information Technology Equipment – Immunity Characteristics – Limits and  
methods of measurement  
IEC 60950, 3rd ed., 1999  
EN 60950: 2000  
UL 60950, 3rd ed., 2000  
Safety of Information Technology Equipment  
Safety of Information Technology Equipment  
Safety of Information Technology Equipment  
Safety of Information Technology Equipment  
CSA 22.2 No. 60950-00  
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ATX12V Power Supply Design Guide  
Version 2.0  
3. Electrical  
The electrical requirements that follow are to be met over the environmental ranges  
3.1. AC Input  
Table 1 lists AC input voltage and frequency requirements for continuous operation. The  
power supply shall be capable of supplying full-rated output power over two input voltage  
ranges rated 100-127 VAC and 200-240 VAC RMS nominal. The correct input range for  
use in a given environment may be either switch-selectable or auto-ranging. The power  
supply shall automatically recover from AC power loss. The power supply must be able to  
start up under peak loading at 90 VAC.  
Table 1. AC Input Line Requirements  
Parameter  
Minimum  
90  
Nominal+  
115  
Maximum  
135  
Unit  
Vin (115 VAC)  
Vin (230 VAC)  
Vin Frequency  
VAC rms  
VAC rms  
Hz  
180  
230  
265  
47  
--  
63  
+Note: Nominal voltages for test purposes are considered to be within 1.0 V of nominal.  
3.1.1. Input Over-current Protection  
The power supply shall incorporate primary fusing for input over-current protection to  
prevent damage to the power supply and meet product safety requirements. Fuses should  
be slow-blowtype or equivalent to prevent nuisance trips.  
3.1.2. Inrush Current Limiting  
Maximum inrush current from power-on (with power on at any point on the AC sine) and  
including, but not limited to, three line cycles, shall be limited to a level below the surge  
rating of the input line cord, AC switch if present, bridge rectifier, fuse, and EMI filter  
components. Repetitive ON/OFF cycling of the AC input voltage should not damage the  
power supply or cause the input fuse to blow.  
. For Denmark and Switzerland international safety requirements, if the internal over-current protective  
devices exceed 8A for Denmark and 10A for Switzerland, then the power supply must pass international  
safety testing to EN 60950 using a maximum 16A over-current protected branch circuit, and this 16A (time  
delay fuse) branch circuit protector must not open during power supply abnormal operation (output short  
circuit and component fault) testing.  
9
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ATX12V Power Supply Design Guide  
Version 2.0  
3.1.3. Input Under-voltage  
The power supply shall contain protection circuitry such that the application of an input  
power supply.  
3.1.4. Regulatory  
The power supply is required to be tested and comply with the most current version  
of the following regulatory specification requirements and/or standards  
PRODUCT SAFETY  
UL* 60950, 3rd Edition CAN/CSA-C22.2-60950-00,  
EN*60 950, 3rd Edition  
IEC*60 950, 3rd Edition (CB Report to include all national deviations)  
EU* Low Voltage Directive (73/23/EEC) (CE Compliance)  
GB4943-90 CCIB* (China)  
ELECTROMAGNETIC CAMPATIBILITY  
FCC*, Class B, Part 15 (Radiated & Conducted Emissions)  
CISPR* 22 / EN55022, 3rd Edition (Radiated & Conducted Emissions)  
EN55024 (ITE Specific Immunity)  
EN 61000-4-2 Electrostatic Discharge  
EN 61000-4-3Radiated RFI Immunity  
EN 61000-4-4Electrical Fast Transients.  
EN 61000-4-5 Electrical Surge  
EN 61000-4-6 RF Conducted  
EN 61000-4-8 Power Frequency Magnetic Fields  
EN 61000-4-11 Voltage Dips, Short Interrupts and Fluctuations  
EN61000-3-2 (Harmonics)  
EN61000-3-3 (Voltage Flicker)  
EU EMC Directive ((8/9/336/EEC) (CE Compliance)  
Other Certifications and/or Declarations  
GB925 (China/CCC*), CNS13438 (Taiwan/BSMI*),  
AS/NZ3548 (Australia/C-tick* based on CISPR22)  
10  
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ATX12V Power Supply Design Guide  
Version 2.0  
3.1.5. Catastrophic Failure Protection  
Should a component failure occur, the power supply should not exhibit any of the  
following:  
Flame  
Excessive smoke  
Charred PCB  
Fused PCB conductor  
Startling noise  
Emission of molten material  
3.2. DC Output  
3.2.1. DC Voltage Regulation  
The DC output voltages shall remain within the regulation ranges shown in Table 2 when  
measured at the load end of the output connectors under all line, load, and environmental  
conditions. The voltage regulation limits shall be maintained under continuous operation  
for any steady state temperature and operating conditions specified in Section 5.  
Table 2. DC Output Voltage Regulation  
Output  
Range  
Min.  
Nom.  
Max.  
Unit  
+12V1DC  
+12V2DC (1)  
+5VDC  
5%  
5%  
+11.40  
+11.40  
+4.75  
+3.14  
-10.80  
+4.75  
+12.00  
+12.00  
+5.00  
+3.30  
-12.00  
+5.00  
+12.60  
+12.60  
+5.25  
+3.47  
-13.20  
+5.25  
Volts  
Volts  
Volts  
Volts  
Volts  
Volts  
5%  
+3.3VDC (2)  
5%  
-12VDC  
10%  
5%  
+5VSB  
(1) At +12 VDC peak loading, regulation at the +12 VDC output can go to 10%.  
(2) Voltage tolerance is required at main connector and S-ATA connector (if used).  
11  
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ATX12V Power Supply Design Guide  
Version 2.0  
3.2.2. Remote Sensing  
The +3.3 VDC output should have provisions for remote sensing to compensate for  
excessive cable drops. The default sense should be connected to pin 11 of the main power  
connector. The power supply should draw no more than 10 mA through the remote sense  
line to keep DC offset voltages to a minimum.  
3.2.3. Typical Power Distribution  
DC output power requirements and distributions will vary based on specific system options  
and implementation. Significant dependencies include the quantity and types of processors,  
memory, add-in card slots, and peripheral bays, as well as support for advanced graphics or  
other features. It is ultimately the responsibility of the designer to derive a power budget  
for a given target product and market.  
and a graphical recommendation for cross loading. It should not be inferred that all power  
supplies must conform to these tables, nor that a power supply designed to meet the  
information in the tables will work in all system configurations.  
12  
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ATX12V Power Supply Design Guide  
Version 2.0  
3.2.3.1. ATX12V Configurations  
Table 3. Typical Power Distribution for a 250 W ATX12V Configuration  
Min.  
Max.  
Peak  
Current  
(amps)  
Current  
(amps)  
Current  
(amps)  
Output  
1
1
8
14  
18  
17  
0.3  
2
10  
+12 V1DC  
+12 V2DC  
+5 VDC  
0.3  
0.5  
0
+3.3 VDC  
-12 VDC  
+5 VSB  
0
2.5  
Note: Total combined output of 3.3 V and 5 V is  
Peak currents may last up to 17 seconds with not more than one occurrence per minute  
12V1DC and 12V2DC should have separate current limit circuits to meet 240VA safety requirements.  
250W Cross Regulation  
(5V rail + 3.3V rail vs. 12V)  
120  
100  
80  
Combined Power  
(5Vrail + 3.3V rail)  
60  
C
40  
20  
0
0
50  
100  
150  
200  
250  
12V power (watts)  
Figure 1. Cross Loading Graph for 250W Configuration  
13  
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ATX12V Power Supply Design Guide  
Version 2.0  
Table 4. Typical Power Distribution for a 300 W ATX12V Configuration  
Min.  
Max.  
Peak  
Current  
(amps)  
Current  
(amps)  
Current  
(amps)  
Output  
+12 V1DC  
+12 V2DC  
+5 VDC  
1.0  
1.0  
0.3  
0.5  
0.0  
0.0  
8.0  
14.0  
20.0  
20.0  
0.3  
10.0  
+3.3 VDC  
-12 VDC  
+5 VSB  
2.0  
2.5  
Note: Total combined output of 3.3 V and 5 V is  
Peak currents may last up to 17 seconds with not more than one occurrence per minute  
12V1DC and 12V2DC should have separate current limit circuits to meet 240VA safety requirements.  
300W Cross Regulation  
(5V rail + 3.3V rail vs. 12V1 +12V2)  
120  
100  
80  
Combined Power  
(5V rail + 3.3V rail)  
60  
40  
20  
0
0
20 40 60 80 100 120 140 160 180 200 220 240 260 280  
12V power (watts)  
Figure 2. Cross Loading Graph for 300W Configuration  
14  
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ATX12V Power Supply Design Guide  
Version 2.0  
Table 5. Typical Power Distribution for a 350 W ATX12V Configuration  
Min.  
Max.  
Peak  
Current  
(amps)  
Current  
(amps)  
Current  
(amps)  
Output  
1
10  
15  
12  
+12 V1DC  
+12 V2DC  
+5 VDC  
1
0.3  
0.5  
0.0  
0.0  
21  
22  
+3.3 VDC  
-12 VDC  
+5 VSB  
0.3  
2.0  
2.5  
Note: Total combined output of 3.3 V and 5 V is  
Peak currents may last up to 17 seconds with not more than one occurrence per minute  
12V1DC and 12V2DC should have separate current limit circuits to meet 240VA safety requirements.  
350W Cross Regulation  
(5V rail + 3.3V rail vs. 12V1 +12V2)  
140  
120  
100  
Combined Power  
(5V rail + 3.3V rail)  
80  
60  
40  
20  
0
0
50  
100  
150  
200  
250  
300  
350  
12V power (watts)  
Figure 3. Cross Loading Graph for 350W Configuration  
15  
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ATX12V Power Supply Design Guide  
Version 2.0  
Table 6. Typical Power Distribution for a 400 W ATX12V Configuration  
Min.  
Max.  
Peak  
Current  
(amps)  
Current  
(amps)  
Current  
(amps)  
Output  
+12 V1DC  
+12 V2DC  
+5 VDC  
1
1
14  
15  
28  
30  
0.3  
2
16  
0.3  
0.5  
0
+3.3 VDC  
-12 VDC  
+5 VSB  
0
2.5  
Note: Total combined output of 3.3 V and 5 V is  
Peak currents may last up to 17 seconds with not more than one occurrence per minute  
12V1DC and 12V2DC should have separate current limit circuits to meet 240VA safety requirements.  
400W Cross Regulation  
(5V rail + 3.3V rail vs. 12V1 +12V2)  
140  
120  
100  
Combined Power  
(5V rail + 3.3V rail)  
80  
60  
40  
20  
0
0
50  
100  
150  
200  
250  
300  
350  
400  
12V power (watts)  
Figure 4. Cross Loading Graph for 400W Configuration  
16  
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ATX12V Power Supply Design Guide  
Version 2.0  
3.2.4. Power Limit / Hazardous Energy Levels  
Under normal or overload conditions, no output shall continuously provide 240 VA under  
any conditions of load including output short circuit, per the requirement of UL 1950/CSA  
950 / EN 60950/IEC 950.  
3.2.5. Efficiency  
3.2.5.1. General  
The power supply required minimum is 70% efficient under Fullload, 70% under  
typicalload, and 60% in a lightload or idle condition. The efficiency of the power  
supply should be tested at nominal input voltage of 115VAC input and/or 230VAC input,  
operating conditions defined in Section 5. The loading condition for testing efficiency  
shown in Table 8 represents a fully loaded system, a ~50% (typical) loaded system, and a  
~20% (light) loaded system.  
Table 7. Minimum Efficiency Vs Load  
Loading  
Full load  
70%  
Typical load  
70%  
Light load  
60%  
Required Minimum Efficiency  
Recommended Minimum Efficiency  
75%  
80%  
68%  
17  
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ATX12V Power Supply Design Guide  
Version 2.0  
Table 8. Loading Table for Efficiency Measurements  
250W (loading shown in Amps)  
Loading +12V1 +12V2  
+5V  
6.8  
3
+3.3V  
6.5  
4
-12V  
0.3  
+5Vsb  
1.0  
Full  
Typical  
Light  
4
3
2
11.5  
5
0.1  
1.0  
2.4  
0.3  
0.5  
0.0  
1.0  
300W (loading shown in Amps)  
Loading +12V1 +12V2  
+5V  
8
+3.3V  
7.5  
4
-12V  
0.2  
+5Vsb  
1.0  
Full  
Typical  
Light  
7
4
2
12  
8
3
0.1  
1.0  
2
0.5  
1.5  
0.0  
1.0  
350W (loading shown in Amps)  
Loading +12V1 +12V2  
+5V  
9
+3.3V  
10  
-12V  
0.3  
+5Vsb  
1.0  
Full  
Typical  
Light  
10  
5
13  
9
3
5
0.1  
1.0  
3
3
1.0  
2.0  
0.0  
1.0  
400W (loading shown in Amps)  
Loading +12V1 +12V2  
+5V  
9
+3.3V  
-12V  
0.3  
+5Vsb  
1.0  
Full  
Typical  
Light  
12  
5
14  
9
11  
5
3
0.1  
1.0  
3
3
1
3
0.0  
1.0  
18  
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ATX12V Power Supply Design Guide  
Version 2.0  
3.2.5.2. Energy Star*  
The Energy Starefficiency requirements of the power supply depend on the intended  
system configuration. In the low-power / sleep state (S1 or S3) the system should consume  
power in accordance with the values listed inTable 9.  
Table 9. Energy Star Input Power Consumption  
Maximum Continuous Power Rating RMS Watts from the AC line in sleep/low-power  
of Power Supply  
mode  
< 200 W  
< 15 W  
> 200 W < 300 W  
> 300 W < 350 W  
> 350 W < 400 W  
> 400 W  
< 20 W  
< 25 W  
< 30 W  
10% of the maximum continuous output rating  
Note: To help meet the Energy Starsystem requirements, it is recommended that the  
power supply have > 50% efficiency in standby mode.  
3.2.5.3. Other Low Power System Requirements  
For power supplies designed for low standby power, the following provides some general  
guidance. Requirements will vary with geographic region and target end user market.  
To help meet the Blue Angel*, RAL-UZ 78, US Presidential executive order 13221, future  
EPA requirements, and other low Power system requirements the +5 VSB standby supply  
should be as efficient as possible. Standby efficiency is measured with the main outputs off  
(PS_ON# high state). Standby efficiency should be greater than 50% with a minimum  
loading of 100mA.  
3.2.6. Output Ripple/Noise  
Ripple and noise are defined as periodic or random signals over a frequency band of 10 Hz  
to 20 MHz. Measurements shall be made with an oscilloscope with 20 MHz bandwidth.  
Outputs should be bypassed at the connector with a 0.1 µF ceramic disk capacitor and a  
10 µF electrolytic capacitor to simulate system loading. See Figure 5.  
19  
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ATX12V Power Supply Design Guide  
Version 2.0  
Table 10. DC Output Noise/Ripple  
Max. Ripple & Noise  
Output  
+12 V1DC  
+12 V2DC  
+5 VDC  
(mVpp)  
120  
200  
50  
+3.3 VDC  
-12 VDC  
+5 VSB  
50  
120  
50  
V out  
Power Supply  
AC Hot  
Load must be  
isolated from the  
ground of the  
power supply.  
Load  
AC Neutral  
0.1uf  
10uf  
V return  
AC Ground  
General Notes:  
1. Load the output with its minimum load  
current.  
2. Connect the probes as shown.  
3. Repeat the measurement with maximum  
load on the output.  
Scope  
Filter Note:  
Scope Note:  
0.1uf - Kemet, C1206C104K5RAC or equivalent  
10uf - United Chemi-con, 293D106X0025D2T or  
equivalent  
Use Tektronix TDS460 Oscilloscope or  
equivalent and a P6046 probe or equivalent.  
Figure 5. Differential Noise Test Setup  
20  
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ATX12V Power Supply Design Guide  
Version 2.0  
3.2.7. Output Transient Response  
Table 11 summarizes the expected output transient step sizes for each output. The transient  
load slew rate is = 1.0 A/µs.  
Table 11. DC Output Transient Step Sizes  
Max. step size  
Max. step size  
(amps)  
Output  
+12 V1DC  
+12 V2DC  
+5 VDC  
40%  
60%  
30%  
30%  
+3.3 VDC  
-12 VDC  
+5 VSB  
0.1 A  
0.1 A  
(1) For example, for a rated +5 VDC output of 18 A, the transient step would be 30% × 18 A = 5.4 A  
Output voltages should remain within the regulation limits of Section 3.2.1, and the power  
state load, including any or all of the following conditions:  
Simultaneous load steps on the +12 VDC, +5 VDC, and +3.3 VDC outputs  
(all steps occurring in the same direction)  
Load-changing repetition rate of 50 Hz to 10 kHz  
AC input range per Section 3.1  
Capacitive loading per Table 12.  
3.2.8. Capacitive Load  
The power supply should be able to power up and operate normally with the following  
capacitances simultaneously present on the DC outputs. This capacitive loading should be  
used to check stability and should not be included for noise testing.  
Table 12. Output Capacitive Loads  
Output  
ATX12V  
Capacitive load (PF)  
+12 V1DC  
+12 V2DC  
+5 VDC  
5,000  
3,000  
6,000  
6,000  
350  
+3.3 VDC  
-12 VDC  
+5 VSB  
350  
21  
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ATX12V Power Supply Design Guide  
Version 2.0  
3.2.9. Closed-loop Stability  
The power supply shall be unconditionally stable under all line/load/transient load  
phase margin and 10 dB gain margin is recommended at both the maximum and minimum  
loads.  
3.2.10. +5 VDC / +3.3 VDC Power Sequencing  
The +12 VDC and +5 VDC output levels must be equal to or greater than the +3.3 VDC  
output at all times during power-up and normal operation. The time between the +12 VDC  
or +5 VDC output reaching its minimum in-regulation level and +3.3 VDC reaching its  
minimum in-regulation level must be 20 ms.  
3.2.11. Voltage Hold-up Time  
The power supply should maintain output regulation per Section 3.2.1 despite a loss of  
input power at the low-end nominal range115 VAC / 57 Hz or 230 VAC / 47 Hzat  
maximum continuous output load as applicable for a minimum of 17 ms.  
3.3. Timing / Housekeeping / Control  
T1  
T5  
~
VAC  
PS_ON#  
~
~
+12VDC  
+5VDC  
+3.3VDC  
95%  
10%  
O/P's  
}
T2  
T3  
~
PWR_OK  
T6  
T4  
timing_3_5_12b  
PWR_OK Sense Level = 95% of nominal  
Figure 6. Power Supply Timing  
Notes: T1 is defined in Section 3.3.4. T2 is defined in Section 3.3.5. T3, T4, T5, and T6 are defined in Table 13  
22  
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ATX12V Power Supply Design Guide  
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3.3.1. PWR_OK  
PWR_OK is a power goodsignal. It should be asserted high by the power supply to  
indicate that the +12 VDC, +5VDC, and +3.3VDC outputs are above the under-voltage  
to guarantee continuous power operation within specification for at least the duration  
specified in Section 3.2.11, Voltage Hold-up Time.Conversely, PWR_OK should be de-  
asserted to a low state when any of the +12 VDC, +5 VDC, or +3.3 VDC output voltages  
falls below its under-voltage threshold, or when mains power has been removed for a time  
sufficiently long such that power supply operation cannot be guaranteed beyond the power-  
down warning time. The electrical and timing characteristics of the PWR_OK signal are  
Table 13. PWR_OK Signal Characteristics  
Signal Type  
+5 V TTL compatible  
Logic level low  
< 0.4 V while sinking 4 mA  
Between 2.4 V and 5 V output while sourcing 200 µA  
1 kfrom output to common  
100 ms < T3 < 500 ms  
Logic level high  
High-state output impedance  
PWR_OK delay  
PWR_OK risetime  
T4 10 ms  
AC loss to PWR_OK hold-up time T5 16 ms  
Power-down warning T6 1 ms  
3.3.2. PS_ON#  
PS_ON# is an active-low, TTL-compatible signal that allows a motherboard to remotely  
control the power supply in conjunction with features such as soft on/off, Wake on LAN*,  
or wake-on-modem. When PS_ON# is pulled to TTL low, the power supply should turn on  
the five main DC output rails: +12VDC, +5VDC, +3.3VDC, -5VDC, and -12VDC. When  
PS_ON# is pulled to TTL high or open-circuited, the DC output rails should not deliver  
current and should be held at zero potential with respect to ground. PS_ON# has no effect  
on the +5VSB output, which is always enabled whenever the AC power is present. Table  
14 lists PS_ON# signal characteristics.  
The power supply shall provide an internal pull-up to TTL high. The power supply shall  
also provide de-bounce circuitry on PS_ON# to prevent it from oscillating on/off at startup  
when activated by a mechanical switch. The DC output enable circuitry must be SELV-  
compliant.  
The power supply shall not latch into a shutdown state when PS_ON# is driven active by  
pulses between 10ms to 100ms during the decay of the power rails.  
23  
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ATX12V Power Supply Design Guide  
Version 2.0  
Table 14. PS_ON# Signal Characteristics  
Min.  
Max.  
VIL, Input Low Voltage  
0.0 V  
0.8 V  
IIL, Input Low Current (Vin = 0.4 V)  
VIH, Input High Voltage (Iin = -200 µA)  
VIH open circuit, Iin = 0  
-1.6 mA  
2.0 V  
5.25 V  
Hysteresis 0.3 V  
Disable  
2.0 V  
PS is  
0.8 V  
PS is  
disabled  
enabled  
Enable  
5.25 = Maximum Open-  
Circuit Voltage  
0.8  
2.0  
PS_ON# Voltage  
Figure 7. PS_ON# Signal Characteristics  
3.3.3. +5 VSB  
+5 VSB is a standby supply output that is active whenever the AC power is present. It  
provides a power source for circuits that must remain operational when the five main DC  
output rails are in a disabled state. Example uses include soft power control, Wake on  
LAN, wake-on-modem, intrusion detection, or suspend state activities.  
The +5 VSB output should be capable of delivering a minimum of 2.0 A at +5 V 5% to  
external circuits. The power supply must be able to provide the required power during a  
"wake up" event. If an external USB device generates the event, there may be peak  
currents as high as 2.5A lasting no more than 500mS.  
Overcurrent protection is required on the +5 VSB output regardless of the output current  
rating. This ensures the power supply will not be damaged if external circuits draw more  
current than the supply can provide.  
24  
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ATX12V Power Supply Design Guide  
Version 2.0  
3.3.4. Power-on Time  
The power-on time is defined as the time from when PS_ON# is pulled low to when the  
+12 VDC, +5 VDC, and +3.3 VDC outputs are within the regulation ranges specified in  
+5 VSB shall have a power-on time of two seconds maximum after application of valid AC  
voltages.  
3.3.5. Risetime  
The output voltages shall rise from 10% of nominal to within the regulation ranges  
There must be a smooth and continuous ramp of each DC output voltage from 10% to 90%  
The smooth turn-on requires that, during the 10% to 90% portion of the rise time, the slope  
of the turn-on waveform must be positive and have a value of between 0 V/ms and  
[Vout,nominal / 0.1] V/ms. Also, for any 5 ms segment of the 10% to 90% risetime  
waveform, a straight line drawn between the end points of the waveform segment must  
have a slope [Vout,nominal / 20] V/ms.  
3.3.6. Overshoot at Turn-on / Turn-off  
The output voltage overshoot upon the application or removal of the input voltage, or the  
less than 10% above the nominal voltage. No voltage of opposite polarity shall be present  
on any output during turn-on or turn-off.  
3.3.7. Reset after Shutdown  
If the power supply latches into a shutdown state because of a fault condition on its outputs,  
the power supply shall return to normal operation only after the fault has been removed and  
the PS_ON# (or AC input) has been cycled OFF/ON with a minimum OFF time of  
1 second.  
3.3.8. +5 VSB at AC Power-down  
After AC power is removed, the +5 VSB standby voltage output should remain at its steady  
begins to decrease in voltage. The decrease shall be monotonic in nature, dropping to  
0.0 V. There shall be no other perturbations of this voltage at or following removal of AC  
power.  
25  
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ATX12V Power Supply Design Guide  
Version 2.0  
3.4. Output Protection  
3.4.1. Over-voltage Protection  
The over-voltage sense circuitry and reference shall reside in packages that are separate and  
distinct from the regulator control circuitry and reference. No single point fault shall be  
able to cause a sustained over-voltage condition on any or all outputs. The supply shall  
provide latch-mode over-voltage protection as defined in Table 15.  
Table 15. Overvoltage Protection  
Output  
Min.  
Nom.  
Max.  
Unit  
+12 V1DC & +12V2DC  
13.4  
15.0  
15.6  
Volts  
+5 VDC  
5.74  
3.76  
6.3  
4.2  
7.0  
4.3  
Volts  
Volts  
+3.3 VDC  
3.4.2. Short-circuit Protection  
An output short circuit is defined as any output impedance of less than 0.1 ohms. The  
power supply shall shut down and latch off for shorting the +3.3 VDC, +5 VDC, or  
+12 VDC rails to return or any other rail. The +12 V1DC and +12V2DC should have  
separate short circuit and overload protection. Shorts between main output rails and +5  
VSB shall not cause any damage to the power supply. The power supply shall either shut  
down and latch off or fold back for shorting the negative rails. +5 VSB must be capable of  
being shorted indefinitely, but when the short is removed, the power supply shall recover  
automatically or by cycling PS_ON#. The power supply shall be capable of withstanding a  
continuous short-circuit to the output without damage or overstress to the unit (for  
example, to components, PCB traces, connectors) under the input conditions specified in  
Section 3.1. The maximum short-circuit energy in any output shall not exceed 240 VA, per  
IEC 60950 requirements.  
3.4.3. No-load Operation  
No damage or hazardous condition should occur with all the DC output connectors  
disconnected from the load. The power supply may latch into the shutdown state.  
3.4.4. Over-current Protection  
Overload currents applied to each tested output rail will cause the output to trip before  
reaching or exceeding 240 VA. For testing purposes, the overload currents should be  
ramped at a minimum rate of 10 A/s starting from full load.  
26  
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ATX12V Power Supply Design Guide  
Version 2.0  
3.4.5. Over-temperature Protection  
The power supply may include an over-temperature protection sensor, which can trip and  
shut down the power supply at a preset temperature point. Such an overheated condition is  
typically the result of internal current overloading or a cooling fan failure. If the protection  
circuit is nonlatching, then it should have hysteresis built in to avoid intermittent tripping.  
3.4.6. Output Bypass  
The output return may be connected to the power supply chassis. The return will be  
connected to the system chassis by the system components.  
27  
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ATX12V Power Supply Design Guide  
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4. Mechanical  
4.1. Labeling / Marking  
The following is a non-inclusive list of suggested markings for each power supply unit.  
Product regulation stipulations for sale into various geographies may impose additional  
labeling requirements.  
Manufacturer information: manufacturers name, part number, and lot date code, etc.,  
in human-readable text and/or bar code formats  
Nominal AC input operating voltages (100-127 VAC and 200-240 VAC) and current  
rating certified by all applicable safety agencies (Section 8)  
DC output voltages and current ratings  
Access warning text (Do not remove this cover. Trained service personnel only. No  
user serviceable components inside.) in English, German, Spanish, French, Chinese,  
and Japanese with universal warning markings  
4.2. Physical Dimensions  
The supply shall be enclosed and meet the physical outline shown in either Figure 8 or 9, as  
applicable.  
28  
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ATX12V Power Supply Design Guide  
Version 2.0  
.
53 REF  
Air inlet grill, 55% open area.  
Second optional  
fan may go in  
this location  
WIRE HARNESS  
16 REF  
150 REF  
20.0  
(2X)  
4.0X6  
(2X)  
Optional air  
inlet area.  
Optional air  
inlet area.  
146.0  
140 REF  
Preferred locations of  
manufacturer label  
86 REF  
138.0  
No. 6-32 UNC-2B THREADED HOLE (4X)  
See Note 4.  
Notes; unless otherwise  
specified:  
1. Dimensions are in mm.  
2.  
Drawing is not to scale.  
64.0  
74.0  
3. Tolerances:  
X +/- 1  
X.X +/- 0.5  
4. If a wire grill is required  
for acoustics or thermals,  
the grill and screws must  
be flush mounted.  
114.0  
6.0  
16.0  
psu_grills  
6.0 (2X)  
Figure 8. Power Supply Dimensions for Chassis That Does Not Require Top Venting  
29  
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ATX12V Power Supply Design Guide  
Version 2.0  
.
Second optional  
53 REF  
Optional Venting Area  
fan may be located  
in optional venting  
area or on topside.  
WIRE HARNESS  
11.0 x 5.0 cutouts (4X);  
min 6.0 clearance under  
16 REF  
cutout from inside top cover.  
150 REF  
20.0  
(2X)  
4.0X6  
94.0  
See Note 5.  
5.0  
Area on top surface  
inside dotted lines should  
have 60% minimum open  
area for proper venting.  
Eight rectangular holes  
are for air duct mounting  
to direct airflow across  
processor heatsink.  
146.0  
Preferred location of  
manufacturer label  
80.0  
140 REF  
5.0  
45.0  
114.0  
138.0  
8.0  
86 REF  
No. 6-32 UNC-2B THREADED HOLE (4X)  
9.0 x 3.2 cutouts (4X);  
min 5.0 clearance under  
cutout from inside top cover.  
Notes; unless otherwise specified:  
1. Dimensions are in mm.  
See Note 4.  
2.  
Drawing is not to scale.  
3. Tolerances:  
X +/- 1  
X.X +/- 0.5  
4. If a wire grill is required  
for acoustics or thermals,  
the grill and screws must  
be flush mounted.  
64.0  
74.0  
5. Bottom side (not pictured)  
may be user-accessible in  
final system installation.  
Cover openings as  
114.0  
6.0  
16.0  
necessary to prevent  
access to non-SELV  
circuitry and to meet product  
safety requirements.  
6.0 (2X)  
psu_duct_mount  
Figure 9. Power Supply Dimensions for Chassis That Require Top Venting  
30  
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ATX12V Power Supply Design Guide  
Version 2.0  
4.3. Airflow / Fan  
The ATX Specification allows for numerous (and often confusing) possibilities for power  
supply fan location, direction, speed, and venting. The designers choice of a power supply  
cooling solution depends in part on the targeted end-use system application(s). At a  
minimum, the power supply design must ensure its own reliable and safe operation.  
Fan location/direction. In general, exhausting air from the system chassis enclosure via a  
power supply fan at the rear panel is the preferred, most common, and most widely  
applicable system-level airflow solution. Other solutions are permitted, including fans on  
the topside of figure 5 and the Wire harness side of figure 4 or 5. Some system/chassis  
designers may choose to use other solutions to meet specific system cooling requirements.  
Fan size/speed. An 80 mm or larger axial fan is typically needed to provide enough cooling  
airflow through an average ATX system. Exact CFM requirements vary by application and  
end-use environment, but 25-35 CFM is typical for the fan itself.  
For consumer or other noise-sensitive applications, it is recommended that a thermally  
sensitive fan speed control circuit be used to balance system-level thermal and acoustic  
performance. The circuit typically senses the temperature of an internal heatsink and/or  
incoming ambient air and adjusts the fan speed as necessary to keep power supply and  
system component temperatures within specification. Both the power supply and system  
designers should be aware of the dependencies of the power supply and system  
temperatures on the control circuit response curve and fan size and should specify them  
very carefully.  
The power supply fan should be turned off when PS_ON# is de-asserted (high). In this  
state, any remaining active power supply circuitry must rely only on passive convection for  
cooling.  
Venting. In general, more venting in a power supply case yields reduced airflow  
impedance and improved cooling performance. Intake and exhaust vents should be as  
large, open, and unobstructed as possible so as not to impede airflow or generate excessive  
acoustic noise. In particular, avoid placing objects within 0.5 inches of the intake or  
exhaust of the fan itself. A flush-mount wire fan grill can be used instead of a stamped  
metal vent for improved airflow and reduced acoustic noise.  
There are three caveats to the venting guidelines above:  
Openings must be sufficiently designed to meet the safety requirements described in  
Larger openings yield decreased EMI-shielding performance (see Section 6).  
Venting in inappropriate locations can detrimentally allow airflow to bypass those  
areas where it is needed.  
31  
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ATX12V Power Supply Design Guide  
Version 2.0  
The ATX Specification offers two options for venting between the power supply and the  
system interior:  
power supply itself, with little regard for directly cooling any system components. This  
venting method is nearly always used in conjunction with a fan that exhausts out the  
rear of the power supply.  
The venting shown in Figure 9 allows designers to more directly couple the power  
supply airflow to system components such as the processor or motherboard core,  
potentially cooling all critical components with a single fan. Both the power supply fan  
location and direction may vary in this case. The trade-off is usually one of reduced  
system cost versus narrower design applicability.  
4.4. AC Connector  
The AC input receptacle should be an IEC 320 type or equivalent. In lieu of a dedicated  
switch, the IEC 320 receptacle may be considered the mains disconnect.  
4.5. DC Connectors  
Figure 10 shows pinouts and profiles for typical ATX power supply DC harness  
connectors.  
Listed or recognized component appliance wiring material (AVLV2), CN, rated min 85 °C,  
300 VDC shall be used for all output wiring.  
There are no specific requirements for output wire harness lengths, as these are largely a  
function of the intended end-use chassis, motherboard, and peripherals. Ideally, wires  
should be short to minimize electrical/airflow impedance and simplify manufacturing, yet  
they should be long enough to make all necessary connections without any wire tension  
(which can cause disconnections during shipping and handling). Recommended minimum  
harness lengths for general-use power supplies are 280 mm for the +12 V power connector  
and 250 mm for all other wire harnesses. Measurements are made from the exit port of the  
power supply case to the wire side of the first connector on the harness.  
NOTE  
Details of the 2x3 Optional Power Connectormentioned in the ATX 2.03 Specification  
are omitted from this design guide until such time as the signals on that connector are more  
rigidly defined.  
32  
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ATX12V Power Supply Design Guide  
Version 2.0  
1
13  
+3.3V  
+3.3V  
+3.3V  
12V  
-
COM  
COM  
+5V  
PS_ON#  
COM  
COM  
COM  
COM  
+5V  
COM  
PWR_ON  
NC  
+5V  
+5VSB  
+12V1  
+5V  
+12V1  
+5V  
COM  
3.3V
Main Power Connector  
Figure 10. ATX12V Power Supply Connectors  
(Pin-side view, not to scale)  
33  
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ATX12V Power Supply Design Guide  
Version 2.0  
4.5.1. ATX Main Power Connector  
Connector: MOLEX* housing: 24 Pin Molex Mini-Fit Jr. PN# 39-01-2240 or  
equivalent  
(Mating motherboard connector is Molex 44206-0007 or equivalent)  
18 AWG is suggested for all wires except for the +3.3 V sense return wire, pin 11 (22 AWG).  
For 300 W configurations, 16 AWG is recommended for all +12 VDC, +5 VDC, +3.3 VDC, and  
COM.  
Pin  
Signal  
Color  
Pin  
Signal  
Color  
1
+3.3VDC  
Orange  
13  
+3.3VDC  
Orange  
[13]  
[+3.3 V default [Brown]  
sense]  
2
+3.3VDC  
COM  
Orange  
Black  
Red  
14  
15  
16  
17  
18  
19  
20  
21  
22  
-12VDC  
COM  
Blue  
3
Black  
Green  
Black  
Black  
Black  
N/C  
4
+5VDC  
COM  
PS_ON#  
COM  
5
Black  
Red  
6
+5VDC  
COM  
COM  
7
Black  
Gray  
COM  
8
PWR_OK  
+5VSB  
+12 V1DC  
Reserved  
+5VDC  
+5VDC  
9
Purple  
Yellow  
Red  
10  
Red  
11  
12  
+12 V1DC  
+3.3 VDC  
Yellow  
23  
24  
+5 VDC  
COM  
Red  
Orange  
Black  
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ATX12V Power Supply Design Guide  
Version 2.0  
4.5.2. +12 V Power Connector  
Connector: MOLEX 39-01-2040 or equivalent  
(Mating motherboard connector is Molex 39-29-9042 or equivalent)  
Pin  
1
Signal  
COM  
COM  
18 AWG Wire  
Black  
Pin  
3
Signal  
18 AWG Wire  
+12V2DC  
+12V2DC  
Yellow /Black Stripe  
Yellow/ Black Stripe  
2
Black  
4
4.5.3. Peripheral Connector(s)  
Connector: AMP 1-480424-0 or MOLEX  
8981-04P or equivalent.  
Contacts: AMP 61314-1 or equivalent.  
Pin  
1
Signal  
+12V1DC  
COM  
18 AWG Wire  
Yellow  
Black  
2
3
COM  
Black  
4
+5VDC  
Red  
35  
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ATX12V Power Supply Design Guide  
Version 2.0  
4.5.4. Serial ATA Power Connector  
This is a required connector for systems with Serial ATA devices.  
The detailed requirements for the Serial ATA Power Connector can be found in the Serial  
ATA: High Speed Serialized AT Attachmentspecification, Section 6.3 Cables and  
connector specification. http://www.serialata.org/  
Wire Signal  
18 AWG Wire  
Orange  
Black  
5
4
3
2
+3.3 VDC  
COM  
+5 VDC  
COM  
Red  
Black  
1
+12 V1DC  
Yellow  
Wire #s  
5
4
3
2
1
Figure 11. Serial ATA Connector  
4.5.5. Floppy Drive Connector  
Connector: AMP 171822-4 or equivalent  
Pin  
1
Signal  
+5VDC  
COM  
20 AWG Wire  
Red  
2
Black  
3
COM  
Black  
4
+12V1DC  
Yellow  
36  
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ATX12V Power Supply Design Guide  
Version 2.0  
5. Environmental  
The following subsections define recommended environmental specifications and test  
parameters, based on the typical conditions to which an ATX12V power supply may be  
subjected during operation or shipment.  
5.1. Temperature  
Operating ambient  
+10 °C to +50 °C  
(At full load, with a maximum temperature rate of change of  
5 °C/10 minutes, but no more than 10 °C/hr.)  
Non-operating ambient  
-40 °C to +70 °C  
(Maximum temperature rate of change of 20 °C/hr.)  
5.2. Thermal Shock (Shipping)  
Non-operating  
-40 °C to +70 °C  
15 °C/min dT/dt 30 °C/min  
Tested for 50 cycles; Duration of exposure to temperature  
extremes for each half cycle shall be 30 minutes.  
5.3. Humidity  
Operating  
To 85% relative humidity (non-condensing)  
To 95% relative humidity (non-condensing)  
Non-operating  
Note: 95% RH is achieved with a dry bulb temperature of  
55 °C and a wet bulb temperature of 54 °C.  
5.4. Altitude  
Operating  
To 10,000 ft  
To 50,000 ft  
Non-operating  
37  
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ATX12V Power Supply Design Guide  
Version 2.0 Final Review Copy  
5.5. Mechanical Shock  
Non-operating  
50 g, trapezoidal input; velocity change 170 in/s  
Three drops on each of six faces are applied to each sample.  
5.6. Random Vibration  
Non-operating  
0.01 g²/Hz at 5 Hz, sloping to 0.02 g²/Hz at 20 Hz, and  
maintaining 0.02 g²/Hz from 20 Hz to 500 Hz. The area under  
the PSD curve is 3.13 gRMS. The duration shall be 10 minutes  
per axis for all three axes on all samples.  
5.7. Acoustics  
For power supplies designed for low noise, the following provides some general guidance.  
Guidelines Sound Power: The power supply assembly shall not produce a declared sound  
power level greater than 4.0 BA. Sound power determination is to be performed at 43C,  
50% of maximum rated load, at sea level. This test point is chosen to represent the  
environment seen inside a typical system at the idle acoustic test condition, with the 43C  
being derived from the standard ambient assumption of 23C, with 20C added for the  
temperature rise within the system (what is typically seen by the inlet fan). The declared  
sound power level shall be measured according to ISO 7779 and reported according to ISO  
9296.  
Pure Tones: The power supply assembly shall not produce any prominent discrete tone  
determined according to ISO 7779, Annex D.  
38  
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ATX12V Power Supply Design Guide  
Version 2.0 Final Review Copy  
6. Electromagnetic Compatibility  
The following subsections outline sample product regulations requirements for a typical  
power supply. Actual requirements will depend on the design, product end use, target  
geography, and other variables. Consult your companys Product Safety and Regulations  
department for more details.  
6.1. Emissions  
The power supply shall comply with FCC Part 15, EN55022: 1998 and CISPR 22: 1997,  
meeting Class B for both conducted and radiated emissions with a 4 dB margin. Tests shall  
be conducted using a shielded DC output cable to a shielded load. The load shall be  
adjusted as follows for three tests: No load on each output; 50% load on each output;  
100% load on each output. Tests will be performed at 100 VAC 50Hz, 120 VAC 60 Hz,  
and 230 VAC 50 Hz power.  
6.2. Immunity  
The power supply shall comply with EN 55024:1998.  
39  
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ATX12V Power Supply Design Guide  
Version 2.0 Final Review Copy  
6.3. Input Line Current Harmonic Content and Line Flicker  
For sales in EU (European Union) or Japan the power supply shall meet the requirements of  
EN61000-3-2 Class D and the Guidelines for the Suppression of Harmonics in Appliances  
and General Use Equipment Class D for harmonic line current content at full rated power.  
See Table 16 for the harmonic limits.  
Table 16. Harmonic Limits, Class D Equipment  
Per: EN 61000-3-2  
Per: JEIDA MITI  
Harmonic Order  
n
Maximum permissible Harmonic  
current at 230 VAC / 50 Hz in Amps  
Maximum permissible Harmonic  
current at 100VAC / 50 Hz in Amps  
Odd harmonics  
3
2.3  
1.14  
5.29  
2.622  
5
7
0.77  
1.771  
9
11  
0.4  
0.92  
0.33  
0.759  
13  
0.21  
0.483  
15n 39  
0.15 x (15/n)  
0.345 x (15/n)  
6.4. Magnetic Leakage Fields  
A PFC choke magnetic leakage field should not cause any interference with a high-  
resolution computer monitor placed next to or on top of the end-use chassis.  
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7. Reliability  
7.1. Component De-rating  
The de-rating process promotes quality and high reliability. All electronic components should be  
designed with conservative device de-ratings for use in commercial and industrial environments.  
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8. Safety  
The following subsections outline sample product regulations requirements for a typical  
power supply. Actual requirements will depend on the design, product end use, target  
geography, and other variables. Consult your companys Product Safety and Regulations  
department for more details.  
8.1. North America  
The power supply must be certified by an NRTL (Nationally Recognized Testing  
Laboratory) for use in the USA and Canada under the following conditions:  
The supply must be recognized for use in Information Technology Equipment including  
Electrical Business Equipment per UL 60950, 3rd edition, 2000. The certification must  
include external enclosure testing for the AC receptacle side of the power supply. (see  
The supply must have a full complement of tests conducted as part of the certification,  
such as input current, leakage current, hi-pot, temperature, energy discharge test,  
transformer output characterization test (open-circuit voltage, short-circuit current, and  
maximum VA output), and abnormal testing (to include stalled-fan tests and voltage-  
selectswitch mismatch).  
The enclosure must meet fire enclosure mechanical test requirements per clauses 2.9.1  
and 4.2 of the above-mentioned standard.  
Production hi-pot testing must be included as a part of the certification and indicated as  
such in the certification report.  
There must not be unusual or difficult conditions of acceptability such as mandatory  
additional cooling or power de-rating. The insulation system shall not have temperatures  
exceeding their rating when tested in the end product.  
The certification mark shall be marked on each power supply.  
The power supply must be evaluated for operator-accessible secondary outputs (reinforced  
insulation) that meet the requirements for SELV and do not exceed 240 VA under any  
condition of loading.  
The proper polarity between the AC input receptacle and any printed wiring boards  
connections must be maintained (that is, brown=line, blue=neutral, green or  
green/yellow=earth/chassis).  
Failure of any single component in the fan-speed control circuit shall not cause the internal  
component temperatures to exceed the abnormal fault condition temperatures per IEC  
60950 3rd ed., 1999.  
42  
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8.2. International  
The vendor must provide a complete CB certificate and test report to IEC 60950: 3rd ed.,  
1999. The CB report must include ALL CB member country national deviations. CB  
report must include evaluation to EN 60950: 2000. All evaluations and certifications must  
be for reinforced insulation between primary and secondary circuits.  
8.3. Proscribed Materials  
Cadmium should not be used in painting or plating.  
No quaternary salt electrolytic capacitors shall be used.  
Mercury shall not be used.  
The use of CFCs or HFCs shall not be used in the design or manufacturing process.  
43  
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