Intel Crib Toy D2700 User Manual

Embedded Intel® AtomTM Processor  
D2700 with Intel® NM10 Express  
Chipset  
Development Kit User’s Manual  
February 2012  
Order Number: 326544  
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Component Information  
The Intel® AtomTM Processor D2700 and NM10 Express Chipset used on the Intel®  
Embedded Board D2700 include the following component stepping, identifiable by  
associated S-Spec numbers:  
Device  
D2700  
NM10  
Stepping  
S-Spec Number  
SR0D9  
B2  
B0  
SLGXX  
Ordering Information  
The name of this Development Kit is the Intel® Atom™ Processor D2700 with Intel® NM10  
Express Chipset Development Kit. This document is the user guide for this Kit.  
For ordering purposes, the part number of the Kit is EMBCDTNMCCDVK, and the kit‘s product code is  
MM# 920352.  
The product brief and other collaterals for the platform based on the Intel® AtomTM Processor D2700  
and NM10 Express Chipset can be downloaded at:  
This kit comprises a chassis, peripherals, cables, and an Intel® mini-ITX sized Embedded Board  
D2700 which includes the two Intel devices which comprise the platform - the Intel® Atom™  
processor D2700 and Intel® NM10 Express chipset. In addition, this kit also includes an SSD (Solid  
State Disk) for the Operating System Image, and a USB Stick for additional components, and tools.  
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Embedded Intel® AtomTM Processor D2700 with Intel® NM10 Express Chipset Development Kit User‘s Manual  
Preface  
This User‘s Manual specifies the typical hardware set-up procedures, features, and use  
of the evaluation board and other components included in the Intel® Atom™ Processor  
D2700 with Intel® NM10 Express Chipset Development Kit. The Intel® Embedded  
Board D2700 is mounted inside the Development Kit and functions as the mainboard  
for the entire mini-ITX chassis.  
Intended Audience  
This manual is written for OEMs, system evaluators, and embedded system developers.  
The manual is intended to provide detailed, technical information about the  
development kit and its components. It is specifically not intended for general  
audiences and assumes basic familiarity with the fundamental concepts involved with  
installing and configuring hardware for a personal computer system.  
What This Document Contains  
Chapter  
Description  
Development kit contents  
1
2
3
4
5
6
7
8
Evaluation board hardware and contents  
A map of the resources of the Intel Embedded Board  
The features supported by the BIOS  
A description of the BIOS error messages, beep codes, and POST codes  
Assembling/Disassembling the development kit  
Operating System references  
Battery disposal information  
Typographical Conventions  
This section contains information about the conventions used in this specification. Not  
all of these symbols and abbreviations appear in all specifications of this type.  
Notes, Cautions, and Warnings  
NOTE  
Notes call attention to important information.  
CAUTION  
Cautions are included to help you avoid damaging hardware or losing data.  
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Intel® AtomTM D2700 Processor with NM10 Express Chipset Development Kit User’s Manual  
Other Common Notations  
#
Used after a signal name to identify an active-low signal (such as USBP0#)  
Gigabyte (1,073,741,824 bytes)  
Gigabytes per second  
GB  
GB/s  
Gb/s  
KB  
Gigabits per second  
Kilobyte (1024 bytes)  
Kb  
Kilobit (1024 bits)  
kb/s  
MB  
1000 bits per second  
Megabyte (1,048,576 bytes)  
MB/s  
Mb  
Megabytes per second  
Megabit (1,048,576 bits)  
Mb/s  
TDP  
xxh  
x.x V  
*
Megabits per second  
Thermal Design Power  
An address or data value ending with a lowercase h indicates a hexadecimal value.  
Volts. Voltages are DC unless otherwise specified.  
This symbol is used to indicate third-party brands and names that are the property of their  
respective owners.  
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Embedded Intel® AtomTM Processor D2700 with Intel® NM10 Express Chipset Development Kit User‘s Manual  
Contents  
2.5.1 Intel® Embedded Board D2700 Graphics Subsystem.................. 21  
2.7 Intel® NM10 Express Chipset.............................................................. 25  
2.10.1 Intel® 82574L Gigabit Ethernet Controllers ............................... 30  
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Figures  
Tables  
Table 4. Supported Memory Configurations1 ................................................... 23  
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Table 24. Front Panel USB Header with Intel® Z-U130 USB Solid-State Drive or  
Table 34. Intel® Embedded Board D2700 Environmental Specifications .............. 67  
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Embedded Intel® AtomProcessor D2700 with Intel® NM10 Express Chipset Development Kit User‘s Manual  
1 Development Kit Contents  
1.1 Included Hardware and Documentation  
Each development kit ships as a complete system in a mini-ITX chassis  
(Size: 192x210x62mm)  
Intel® Embedded Board D2700 with Intel® Atom™ Processor D2700 with Intel® NM10  
Express Chipset installed in chassis  
2 GB DDR3 1066 MT/s non-ECC memory SO-DIMM  
SSD (Solid State Disk), with a Yocto Project* based Linux Operating System pre-  
installed, with power and SATA extension cable  
Power supply-60W Desktop type AC/DC switching mode power supply  
picoPSU-120, 120W output, 12V input DC-DC power supply adapter  
USB Stick with documentation and software  
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Embedded Intel® AtomProcessor D2700 with Intel® NM10 Express Chipset Development Kit User‘s Manual  
1.2 Development Kit Images  
1.2.1  
1.2.2  
Front  
Inside  
1.2.3  
Back  
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2 Intel® Embedded Board D2700  
Overview  
2.1 Overview  
2.1.1  
Feature Summary  
Table 1 summarizes the features of Intel® Embedded Board D2700.  
Table 1. Feature Summary  
Form Factor of  
D2700 Embedded  
Board  
Mini-ITX (6.7 inches by 6.7 inches [170 millimeters by 170 millimeters])  
compatible with microATX  
Processor  
Passively-cooled, soldered-down Dual-Core Intel® Atom™ processor D2700 with  
integrated graphics and integrated memory controller  
Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Module  
Memory  
(SO-DIMM) sockets  
Support for DDR3 1066 MHz, DDR3 1333 MHz, and DDR3 1600 MHz  
SO-DIMMs  
Note: DDR3 1333 MHz and DDR3 1600 MHz memory will run at 1066 MHz  
Support for up to 4 GB of system memory on a single SO-DIMM (or two 2 GB  
SO-DIMMs)  
Chipset  
Audio  
Intel® NM10 Express Chipset  
Multi-streaming 5.1 (6-channel) audio subsystem support based on the Realtek*  
ALC662 high definition audio codec  
Graphics  
Onboard Intel® graphics subsystem with support for:  
Analog displays (VGA)  
Digital displays (DVI-I)  
Flat Panel displays (LVDS interface)  
Legacy I/O Control  
Winbond* W83627DHG-P based Legacy I/O controller for hardware  
management, serial, parallel, and PS/2* ports  
Seven USB 2.0 ports:  
Four back panel ports  
Peripheral  
Interfaces  
Two ports are implemented with a dual port internal header for front panel  
cabling  
One port is implemented with an internal header (brown-colored) that  
supports an Intel® Z-U130 USB Solid-State Drive or compatible device  
Two Serial ATA (SATA) 3.0 Gb/s connectors (supporting IDE and AHCI mode)  
One parallel port header  
Two serial port connectors on the back panel  
Two serial port headers  
One PS/2-style keyboard port  
One PS/2-style mouse port  
LAN Support  
Two Intel® 82574L Gigabit (10/100/1000 Mb/s) Ethernet LAN Controllers  
including two RJ45 back panel connectors for dual LAN subsystems.  
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Table 1. Feature Summary (continued)  
Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device  
BIOS  
Support for Advanced Configuration and Power Interface (ACPI), Plug and  
Play, and System Management BIOS (SMBIOS)  
Suspend to RAM support  
Instantly Available  
PC Technology  
Wake on PCI, PCI Express*, PS/2, serial, front panel, USB ports, and LAN  
One Conventional PCI bus connector (with riser card support for up to two PCI  
Expansion  
Capabilities  
cards)  
One PCI Express Full-/Half-Mini Card slot  
Hardware monitoring through the Winbond I/O controller  
Voltage sense to detect out of range power supply voltages  
Thermal sense to detect out of range thermal values  
One fan header  
Hardware Monitor  
Subsystem  
One fan sense input used to monitor fan activity  
Fan speed control  
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2.1.2  
Board Layout  
Figure 1 shows the location of the major components.  
Figure 1. Major Board Components (Top)  
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Table 2 lists the components identified in Figure 1.  
Table 2. Board Components Shown in Figure 1  
Item/callout  
Description  
Back panel connectors  
Standby power LED  
A
B
C
D
E
F
Processor core power connector (2 x 12)  
Serial port header  
Intel Atom processor  
SO-DIMM channel A DIMM 0 socket  
SO-DIMM channel A DIMM 1 socket (Populate DIMM 1 when  
using a single SO-DIMM)  
G
Trusted Platform Module (TPM) header  
Backlight inverter voltage selection jumper  
Flat panel voltage selection jumper  
FPD brightness connector  
LVDS data connector  
H
I
J
K
L
Intel NM10 Express Chipset  
System fan header  
M
N
O
P
SATA connectors  
Front panel header  
Q
R
S/PDIF header  
Battery  
Front panel USB 2.0 header  
Front Panel Wireless Activity LED header  
Serial port header  
S
T
U
V
BIOS setup configuration jumper block  
PCI Express Full-/Half-Mini Card slot  
Conventional PCI bus add-in card connector  
Piezoelectric speaker  
W
X
Y
Parallel port header  
Z
Front panel audio header  
AA  
BB  
Front panel USB header with Intel Z-U130 USB Solid-State  
Drive or compatible device support (brown-colored)  
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Embedded Intel® AtomProcessor D2700 with Intel® NM10 Express Chipset Development Kit User‘s Manual  
2.1.3  
Block Diagram  
Figure 2 is a block diagram of the major functional areas of the Intel® Embedded Board  
D2700.  
Figure 2. Block Diagram of Development Kit  
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Embedded Intel® AtomProcessor D2700 with Intel® NM10 Express Chipset Development Kit User‘s Manual  
2.2 Online Support  
For information about…  
Visit this web site:  
®
Intel AtomTM Processor D2700 and  
NM10 Express Chipset Platform  
Overview  
Chipset information  
(Search for NM10 Express Chipset)  
BIOS and driver updates  
Tested memory  
Solid State Drives (SSD)  
(Click on SOLID STATE DRIVES link on the right)  
Integration information  
Roadmap information, tools,  
software, technical documents  
Intel Embedded Design Center:  
2.3 Supported Operating Systems  
The following independent operating systems are supported for this platform:  
Operating System - Driver Support  
Microsoft Windows* 7 - Intel provides drivers  
Microsoft Windows* Embedded Standard 7- Intel provides drivers  
Microsoft Windows* XP - Intel provides drivers  
Microsoft Windows* Embedded CE 7 - Intel provides drivers  
MeeGo* 1.2 - Intel provides drivers  
Yocto Project* - Intel provides drivers  
Wind River* VxWorks* Wind River provides drivers  
Intel strives to provide customers with a complete development environment supporting  
customer applications and operating systems. Any software provided in development kits is  
subject to change without notice.  
For the latest information on operating system and BIOS support refer to the Intel Embedded  
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2.4 BIOS vendors  
The BIOS vendors are:  
BIOS vendors  
American Megatrends*  
Insyde Software*  
Phoenix Technologies  
Byosoft*  
2.5 Processor  
The board has a passively-cooled, soldered-down Dual-Core Intel® AtomTM processor  
D2700 with integrated graphics and integrated memory controller.  
NOTE  
The board is designed to be passively cooled in a properly ventilated chassis. Chassis  
venting locations are recommended above the processor area for maximum heat  
dissipation effectiveness.  
For information about  
Refer to  
Power supply connectors  
Section 3.2.2.3  
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2.5.1  
Intel® Embedded Board D2700 Graphics  
Subsystem  
2.5.1.1  
Intel® Graphics Media Accelerator 3600 Graphics  
Controller (Intel® GMA)  
The Intel® AtomTM Processor D2700 contains an integrated graphics core, the Intel®  
GMA 3600 graphics controller, which features the following functionalities:  
High quality texture engine  
DirectX* 9.0c and OpenGL* 3.0 compliant  
Hardware Pixel Shader 4.1  
Vertex Shader Model 4.1  
640 MHz graphics core frequency  
200 MHz render clock frequency  
Seven display planes, Display Plane A, B, Display Sprite C (can be connected to  
either pipe), Display OV (can be connected to either pipe), Cursor A, Cursor B,  
and VGA  
Two display pipes, Pipe A and B support the dual independent displays  
Max Pixel Clock: SC LVDS: 112 MHz, 18bpp and 24bpp; DDI: 2x 4, 1.62GHz,  
2.7GHz; VGA: up to 350MHz  
Display Ports: DVI-I, LVDS (single channel), VGA (CRT/DAC)  
Embedded panel: LVDS  
External panel: DVI-I (HDMI w/adapter), LVDS, VGA (CRT/DAC)  
Supports HDCP 1.3 & PAVP1.1c for Bluray playback (HDCP is needed for High  
Definition playback)  
PAVP: Collection of HW-based security mechanisms designed to  
provide a secure path for content from a media player application to  
the graphics hardware  
HDCP: Specification developed by Intel Corporation to protect digital  
entertainment content across the DVI interface  
Subsequently ported to HDMI and Display Port  
Supports HDMI 1.3a through SW lip-sync  
Supports DX*9  
Supports NV12 data format  
3x3 Panel Fitter shared by two pipes  
Supports Intel® HD Audio Codec  
Supports Intel® Display Power Saving Technology (Intel® DPST) 4.0  
No Frame Buffer Compensation (FBC)  
No TVOut  
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Table 3 summarizes the resolution support of the graphics interfaces.  
Table 3. Summary of the Resolution of the Graphics interfaces  
Interface  
Max  
Remark  
Resolution  
LVDS (Single Ch)  
VGA (CRT/DAC)  
DVI/HDMI  
1440 x 900  
1920 x 1200  
1920 x 1200  
60 Hz; 18 & 24 bpps  
60 Hz at 355 MHz Max  
60 Hz; up to 165MHz  
2.5.1.2  
Video  
The Intel® AtomTM Processor D2700 supports the following video output functionalities  
over its display interfaces:  
The Intel® Atom™ Processor D2000 series supports full MPEG2 (VLD/ iDCT/MC), WMV,  
Fast video Composing, HW decode/ acceleration for MPEG4 Part 10 (AVC/H.264) & VC-  
1; 720p60, 1080i60, 1080p@24 up to 20 Mps  
MPEG4 part2 does not utilize Next Generation Intel® Atom™ Processor based Platform  
H/W  
No hardware assist for Flash Decode from Adobe 11.0 and onwards  
D2700 processor supports Blu-Ray* 2.0 playback (Windows* only) - 1 x HD and 1 x SD  
streaming  
Video image Enhancement: Hue, Saturation, Brightness, Contrast (HSBC) adjust, Bob  
De-Interlacing  
2.6 System Memory  
The board has two 204-pin DDR3 SO-DIMM sockets and supports the following  
memory features:  
DDR3 SDRAM SO-DIMMs with gold-plated contacts  
Unbuffered, non-ECC, Raw Card B (1Rx8) and Raw Card-F (2Rx8) SO-DIMMs only  
4 GB maximum total system memory  
Minimum total system memory: 256 MB  
Non-ECC DIMMs  
Serial Presence Detect  
DDR3 800 MHz and DDR3 1066 MHz SO-DIMMs (Higher speed SO-DIMMs  
supported at 1066 MHz if supported by the memory module.)  
When only using one SO-DIMM, DIMM 1 must be used  
NOTE  
Due to passively-cooled thermal constraints, system memory must have an operating  
temperature rating of 85 oC.  
The board is designed to be passively cooled in a properly ventilated chassis. Chassis  
venting locations are recommended above the system memory area for maximum heat  
dissipation effectiveness.  
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NOTE  
To be fully compliant with all applicable DDR3 SDRAM memory specifications, the  
board should be populated with SO-DIMMs that support the Serial Presence Detect  
(SPD) data structure. This allows the BIOS to read the SPD data and program the  
chipset to accurately configure memory settings for optimum performance. If non-SPD  
memory is installed, the BIOS will attempt to correctly configure the memory settings,  
but performance and reliability may be impacted or the SO-DIMMs may not function  
under the determined frequency.  
Table 4 lists the supported SO-DIMM configurations.  
Table 4. Supported Memory Configurations1  
Raw Card  
Version  
SO-DIMM  
Capacity  
DRAM Device  
Technology  
DRAM  
Organization  
# of DRAM  
Devices  
1 GB  
2 GB  
2 GB  
4 GB2  
1 Gb  
2 Gb  
1 Gb  
2 Gb  
128 M x 8  
256 M x 8  
128 M x 8  
256 M x 8  
8
B
8
16  
16  
F
Notes:  
1. System memory configurations are based on availability and are subject to change.  
2. Support for one 4 GB SO-DIMM installed in slot 1. Slot 0 must be left empty.  
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Figure 3 illustrates the memory channel and SO-DIMM configuration.  
Figure 3. Memory Channel and SO-DIMM Configuration  
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2.7 Intel® NM10 Express Chipset  
The Intel® NM10 Express Chipset with Direct Media Interface (DMI) interconnect  
provides interfaces to the processor and the USB, SATA, LPC, LAN, PCI, and PCI  
Express interfaces. The Intel® NM10 Express Chipset is a centralized controller for the  
board‘s I/O paths.  
NOTE  
The board is designed to be passively cooled in a properly ventilated chassis. Chassis  
venting locations are recommended above the processor heatsink area for maximum  
heat dissipation effectiveness.  
For information about  
Refer to  
®
In Find Content field, enter NM10‖  
Section 2.1.3  
Intel NM10 Express chipset  
Resources used by the chipset  
2.7.1  
Video Memory Allocation  
Video memory is allocated from the total available system memory for the efficient  
balancing of 2-D/3-D graphics performance and overall system performance.  
Dynamic allocation of system memory to video memory is as follows:  
256 MB total RAM results in 32 MB video RAM  
512 MB total RAM results in 64 MB video RAM  
1 GB total RAM results in 128 MB video RAM  
2 GB total RAM results in 224 MB video RAM  
2.7.2  
Analog Display (VGA)  
The VGA port supports analog displays. The maximum supported resolution is 1920 x  
1200 (WUXGA) at a 60 Hz refresh rate. The VGA port is enabled for POST whenever a  
monitor is attached.  
2.7.3  
Digital Visual Interface (DVI-I)  
The DVI-I port supports both digital and analog DVI displays. The maximum  
supported resolution is 1920 x 1200 (WUXGA). The DVI port is compliant with the  
DVI 1.0 specification. DVI analog output can also be converted to VGA using a DVI-  
VGA converter.  
2.7.4  
Flat Panel Interface (LVDS)  
The flat panel interface (LVDS) supports the following:  
Panel support up to 1440 x 900  
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25 MHz to 112 MHz singlechannel; @18 or 24 bpp  
TFT panel type  
Panel fitting, panning, and center mode  
CPIS 1.5 compliant  
Spread spectrum clocking  
Panel power sequencing  
Integrated PWM interface for LCD backlight inverter control  
Flat panel brightness control via front panel button input as well as Windows* 7  
Screen brightnessadjustment slider  
NOTE  
Support for flat panel display configuration complies with the following:  
1. Internal flat panel display settings are not exposed through Intel® Integrator  
Toolkit or Intel® Integrator Assistant GUIs.  
2. Internal flat panel display settings will not be overwritten by loading BIOS setup  
defaults.  
3. Internal flat panel display settings will be preserved across BIOS updates.  
2.7.5  
Configuration Modes  
For monitors attached to the VGA port, video modes supported by this board are based  
on the Extended Display Identification Data (EDID) protocol.  
Video mode configuration for LVDS displays is supported as follows:  
Automatic panel identification via Extended Display Identification Data (EDID) for  
panels with onboard EDID support  
Panel selection from common predefined panel types (without onboard EDID)  
Custom EDID payload installation for ultimate parameter flexibility, allowing  
custom definition of EDID data on panels without onboard EDID  
In addition, BIOS setup provides the following configuration parameters for internal  
flat panel displays:  
Screen Brightness: allows the end user to set the screen brightness for the display  
effective through the Power-On Self Test stage (such as while showing the splash  
screen image and BIOS setup). Windows 7 ignores this setting in favor of the  
native screen brightness‖ control provided by the operating system.  
Brightness Steps: allows the system integrator to configure the brightness steps for  
the operating system‘s screen brightness‖ control (such as the Screen brightness‖  
adjustment slider under the Windows 7 Power Options‖ control panel).  
Flat Panel Configuration Changes Lock: allows the system integrator to lock‖  
critical settings of the LVDS configuration to avoid end users potentially rendering  
the display unusable.  
Color Depth: allows the system integrator to select whether the panel is 24 bpp or  
18 bpp.  
Inverter Frequency and Polarity: allows the system integrator to set the operating  
frequency and polarity of the panel inverter board.  
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Maximum and Minimum Inverter Current Limit (%): allows the system integrator to  
set maximum PWM%, as appropriate, according to the power requirements of the  
internal flat panel display and the selected inverter board.  
Panel Power Sequencing: allows the system integrator to adjust panel sequencing  
parameters, if necessary.  
NOTE  
Support for flat panel display configuration complies with the following:  
1. Internal flat panel display settings are not exposed through Intel® Integrator  
Toolkit or Intel® Integrator Assistant GUIs.  
2. Internal flat panel display settings will not be overwritten by loading BIOS setup  
defaults.  
3. Internal flat panel display settings will be preserved across BIOS updates.  
2.7.6  
USB  
The board provides up to seven USB 2.0 ports, supports UHCI and EHCI, and uses  
UHCI- and EHCI-compatible drivers:  
Four back panel ports  
Two ports are implemented with a dual port internal header for front panel cabling  
One port is implemented with an internal header (brown-colored) that supports an  
Intel® Z-U130 USB Solid-State Drive or compatible device  
NOTE  
Computer systems that have an unshielded cable attached to a USB port may not meet  
FCC Class B requirements, even if no device is attached to the cable. Use shielded  
cable that meets the requirements for full-speed devices.  
For information about  
Refer to  
The location of the USB connectors on the back panel  
The location of the front panel USB headers  
2.7.7  
SATA Support  
The board provides two SATA interface connectors that support one device per  
connector.  
The board‘s SATA controller offers independent SATA ports with a theoretical  
maximum transfer rate of 3.0 Gb/s on each port. One device can be installed on each  
port for a maximum of two SATA devices. A point-to-point interface is used for host to  
device connections, unlike PATA which supports a master/slave configuration and two  
devices on each channel.  
For compatibility, the underlying SATA functionality is transparent to the operating  
system. The SATA controller supports IDE and AHCI configuration and can operate in  
both legacy and native modes. In legacy mode, standard ATA I/O and IRQ resources  
are assigned (IRQ 14 and 15). In native mode, standard Conventional PCI bus  
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resource steering is used. Native mode is the preferred mode for configurations using  
the Windows Vista* operating system.  
For information about  
Obtaining AHCI driver  
Refer to  
Section 2.2  
The location of the SATA connectors  
2.8 Real-Time Clock Subsystem  
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the  
computer is not plugged into a wall socket, the battery has an estimated life of three  
years. When the computer is plugged in, the standby current from the power supply  
extends the life of the battery. The clock is accurate to 13 minutes/year at 25 ºC  
with 3.3 VSB applied.  
NOTE  
If the battery and AC power fail, custom defaults, if previously saved, will be loaded  
into CMOS RAM at power-on.  
When the voltage drops below a certain level, the BIOS Setup program settings stored  
in CMOS RAM (for example, the date and time) might not be accurate. Replace the  
battery with an equivalent one. Figure 1 shows the location of the battery.  
2.9 Legacy I/O Controller  
The Legacy I/O Controller provides the following features:  
Two serial port headers  
Two serial port connectors on the back panel  
One parallel port header with Enhanced Parallel Port (EPP) support  
Serial IRQ interface compatible with serialized IRQ support for Conventional PCI  
bus systems  
PS/2-style keyboard and mouse ports  
Intelligent power management, including a programmable wake-up event interface  
Conventional PCI bus power management support  
The BIOS Setup program provides configuration options for the Legacy I/O controller.  
For information about  
Refer to  
The location of the headers  
The serial port headers signal mapping  
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2.9.1  
Serial Ports  
The four serial ports (two back panel connectors and two internal headers) support  
data transfers at speeds up to 115.2 kb/s with BIOS support.  
For information about  
Refer to  
The location of the serial port connectors  
2.9.2  
Parallel Port  
Use the BIOS Setup program to set the parallel port mode for the 25-pin D-Sub  
parallel port header.  
For information about  
Refer to  
The location of the parallel port connector  
2.9.3  
Keyboard and Mouse Interfaces  
PS/2 keyboard and mouse connectors are located on the back panel.  
NOTE  
The keyboard is supported in the top PS/2 connector and the mouse is supported in  
the bottom PS/2 connector. Power to the computer should be turned off before a  
keyboard or mouse is connected or disconnected.  
For information about  
Refer to  
The location of the keyboard and mouse connectors  
29  
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2.10 LAN Subsystem  
The LAN subsystem consists of the following:  
Intel® NM10 Express Chipset  
Two Intel® 82574L Gigabit Ethernet Controllers (10/100/1000 Mb/s)  
RJ-45 LAN connector with integrated status LEDs  
Additional features of the LAN subsystem include:  
CSMA/CD protocol engine  
LAN connect interface that supports the Ethernet controller  
Conventional PCI bus power management  
Supports ACPI technology  
Supports LAN wake capabilities  
2.10.1 Intel® 82574L Gigabit Ethernet Controllers  
The Intel® 82574L Gigabit Ethernet Controllers support the following features:  
PCI Express link  
10/100/1000 IEEE 802.3 compliant  
Compliant to IEEE 802.3x flow control support  
802.1p and 802.1q  
TCP, IP, and UDP checksum offload (for IPv4 and IPv6)  
Transmit TCP segmentation  
Full device driver compatibility  
PCI Express power management support  
2.10.2 LAN Subsystem Software and Drivers  
LAN software and drivers are available from Intel‘s web site.  
For information about  
Refer to  
Obtaining LAN software and drivers  
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2.10.3 RJ-45 LAN Connector with Integrated LEDs  
Two LEDs are built into the RJ-45 LAN connectors (shown in Figure 4).  
Figure 4. LAN Connector LED Locations  
Table 5 describes the LED states when the board is powered up and the Ethernet LAN  
subsystem is operating.  
Table 5. LAN Connector LED States  
LED  
LED Color  
LED State  
Off  
Condition  
LAN link is not established.  
Link/Activity (A, C)  
Green  
On  
LAN link is established.  
Blinking  
Off  
LAN activity is occurring.  
10 Mb/s data rate is selected or negotiated.  
100 Mb/s data rate is selected or negotiated.  
1000 Mb/s data rate is selected or negotiated.  
Link Speed (B, D)  
Green/Yellow  
Green  
Yellow  
31  
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2.11 Audio Subsystem  
The board supports the Intel® High Definition Audio (Intel® HD Audio) subsystem. The  
audio subsystem consists of the following:  
Intel® NM10 Express Chipset  
Realtek* ALC662 audio codec  
The audio subsystem has the following features:  
Advanced jack sense for the back panel audio jacks that enables the audio codec to  
recognize the device that is connected to an audio port. The back panel audio jacks  
are capable of re-tasking according to the user‘s definition, or can be automatically  
switched depending on the recognized device type.  
Front panel Intel® HD Audio and AC ‘97 audio support.  
3-port analog audio out stack.  
Windows Vista Basic certification.  
A signal-to-noise (S/N) ratio of 95 dB.  
Table 6 lists the supported functions of the front panel and back panel audio jacks.  
Table 6. Audio Jack Support  
Micro-  
phone  
Line Out  
Line In  
Audio Jack  
Headphones  
(Front Spks)  
(Stereo 2)  
Mic-In  
Front panel Green  
Front panel Pink  
Back panel Blue  
Back panel Green  
Back panel Pink  
Default  
Default  
Default  
(ctrl panel)  
Default  
Default  
32  
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2.11.1 Audio Subsystem Software  
Audio software and drivers are available from Intel‘s web site.  
For information about  
Refer to  
Obtaining audio software and drivers  
Section 2.2  
2.11.2 Audio Connectors and Headers  
The board contains audio connectors and headers on both the back panel and the  
component side of the board. The component-side audio headers include front panel  
audio (a 2 x 5-pin header that provides mic in and line out signals for front panel audio  
connectors).  
Item Description  
A
B
C
Line in  
Line out  
Mic in  
Figure 5. Back Panel Audio Connectors  
NOTE  
The back panel audio line out connector is designed to power headphones or amplified  
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are  
connected to this output.  
For information about  
Refer to  
Figure 11  
The locations of the front panel audio header and S/PDIF audio header  
The signal names of the front panel audio header and S/PDIF header  
The back panel audio connectors  
Section 3.2.2.1  
33  
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2.12 Hardware Management Subsystem  
The hardware management features enable the board to be compatible with the Wired  
for Management (WfM) specification. The board has several hardware management  
features, including the following:  
Thermal monitoring  
Voltage monitoring  
2.12.1 Hardware Monitoring  
The hardware monitoring and fan control subsystem is based on the Winbond  
W83627DHG-P device, which supports the following:  
System ambient temperature monitoring  
System fan speed monitoring  
Power monitoring of +12 V, +5 V, +5 Vstdby, +3.3 V, and +VCCP  
SMBus interface  
34  
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2.12.2 Thermal Monitoring  
Figure 6 shows the locations of the thermal sensors and fan header.  
Item Description  
A
B
C
Remote thermal sensor  
DTS, located on the processor die  
System fan header  
Figure 6. Thermal Sensors and Fan Header  
35  
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2.13 Power Management  
Power management is implemented at several levels, including:  
Software support through Advanced Configuration and Power Interface (ACPI)  
Hardware support:  
Power connector  
Fan header  
LAN wake capabilities  
Instantly Available PC technology  
Wake from USB  
Wake from PS/2 devices  
Wake from serial port  
Power Management Event signal (PME#) wake-up support  
WAKE# signal wake-up support  
2.13.1 ACPI  
ACPI gives the operating system direct control over the power management and Plug  
and Play functions of a computer. The use of ACPI with the board requires an  
operating system that provides full ACPI support. ACPI features include:  
Plug and Play (including bus and device enumeration)  
Power management control of individual devices, add-in boards (some add-in  
boards may require an ACPI-aware driver), video displays, and hard disk drives  
Methods for achieving less than 15-watt system operation in the power-on/standby  
sleeping state  
A Soft-off feature that enables the operating system to power-off the computer  
Support for multiple wake-up events (see Table 9)  
Support for a front panel power and sleep mode switch  
Table 7 lists the system states based on how long the power switch is pressed,  
depending on how ACPI is configured with an ACPI-aware operating system.  
Table 7. Effects of Pressing the Power Switch  
If the system is in this  
…and the power switch  
state…  
is pressed for  
…the system enters this state  
Off  
Less than four seconds  
Less than four seconds  
More than four seconds  
Less than four seconds  
More than four seconds  
Power-on  
(ACPI G0 working state)  
(ACPI G2/G5 Soft off)  
On  
Power-off  
(ACPI G2/G5 Soft off)  
(ACPI G0 working state)  
On  
Fail safe power-off  
(ACPI G2/G5 Soft off)  
(ACPI G0 working state)  
Sleep  
Wake-up  
(ACPI G0 working state)  
(ACPI G1 sleeping state)  
Sleep  
Power-off  
(ACPI G1 sleeping state)  
(ACPI G2/G5 Soft off)  
36  
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2.13.1.1 System States and Power States  
Under ACPI, the operating system directs all system and device power state  
transitions. The operating system puts devices in and out of low-power states based on  
user preferences and knowledge of how devices are being used by applications.  
Devices that are not being used can be turned off. The operating system uses  
information from applications and user settings to put the system as a whole into a  
low-power state.  
Table 8 lists the power states supported by the board along with the associated system  
power targets. Refer to the ACPI specification for a complete description of the various  
system and power states.  
Table 8. Power States and Targeted System Power  
Global  
States  
Processor  
Sleeping States States  
Targeted System  
Power (Note 1)  
Device States  
G0 working  
S0 working  
C0 working  
D0 working  
Full power > 30 W  
state  
state.  
(Note 2)  
G1 sleeping  
state  
S3 Suspend to  
RAM. Context  
saved to RAM.  
No power  
D3 no power  
except for  
wake-up logic.  
Power < 5 W  
(Note 2)  
G1 sleeping  
state  
S4 Suspend to  
disk. Context  
saved to disk.  
No power  
No power  
D3 no power  
except for  
wake-up logic.  
Power < 5 W  
(Note 2)  
G2/S5  
S5 Soft off.  
Context not saved.  
Cold boot is  
D3 no power  
except for  
wake-up logic.  
Power < 5 W  
required.  
G3 –  
No power to the  
system.  
No power  
D3 no power for No power to the system.  
mechanical off.  
AC power is  
disconnected  
from the  
wake-up logic,  
except when  
provided by  
Service can be performed  
safely.  
battery or  
computer.  
external source.  
Notes:  
1. Total system power is dependent on the system configuration, including add-in boards and peripherals  
powered by the system‘s power supply.  
2. Dependent on the standby power consumption of wake-up devices used in the system.  
37  
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2.13.1.2 Wake-up Devices and Events  
Table 9 lists the devices or specific events that can wake the computer from specific  
states.  
Table 9. Wake-up Devices and Events  
Devices/events that wake up the system…  
…from this sleep state  
Note 1)  
(
Power switch  
RTC alarm  
LAN  
S3, S4, S5  
S3, S4, S5  
S3, S4, S5  
(Note 1)  
(Note 1)  
(Note 2)  
USB  
S3  
(Note 1)  
(Note 1)  
WAKE#  
S3, S4, S5  
S3, S4, S5  
S3  
PME# signal  
Serial port  
PS/2 devices  
(Notes 1 and 3)  
S3, S4, S5  
Notes:  
1. S4 implies operating system support only.  
2. USB ports must be turned off during S4/S5 states.  
3. PS/2 wake from S5 should have a selection in the BIOS to enable wake from a combination key  
(Alt + Print Screen) or the keyboard power button.  
NOTE  
The use of these wake-up events from an ACPI state requires an operating system that  
provides full ACPI support. In addition, software, drivers, and peripherals must fully  
support ACPI wake events.  
38  
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2.13.2 Hardware Support  
The board provides several power management hardware features, including:  
Power connector  
Fan header  
LAN wake capabilities  
Instantly Available PC technology  
Wake from USB  
Wake from PS/2 devices  
Power Management Event signal (PME#) wake-up support  
WAKE# signal wake-up support  
+5V Standby Power Indicator LED  
LAN wake capabilities and Instantly Available PC technology require power from the  
+5 V standby line.  
NOTE  
The use of Wake from USB technologies from an ACPI state requires an operating  
system that provides full ACPI support.  
2.13.2.1 Fan Header  
The function/operation of the fan header is as follows:  
The fan is on when the board is in the S0 state.  
The fan is off when the board is off or in the S3, S4, or S5 state.  
The system fan header supports closed-loop fan control that can adjust the fan  
speed and is wired to a fan tachometer input.  
The fan header supports +12 V, 3-wire fans at 1 A maximum.  
For information about  
Refer to  
The locations of the fan header and thermal sensors  
The signal names of the system fan header  
2.13.2.2 LAN Wake Capabilities  
LAN wake capabilities enable remote wake-up of the computer through a network. The  
LAN subsystem network adapter monitors network traffic at the Media Independent  
Interface. The board supports LAN wake capabilities with ACPI in the following ways:  
By Ping  
By Magic Packet  
Upon detecting the configured wake packet type, the LAN subsystem asserts a wake-  
up signal that powers up the computer.  
39  
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2.13.2.3 Instantly Available PC Technology  
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-  
RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the  
hard drive(s) and fan will power off, the front panel LED will blink). When signaled by  
a wake-up device or event, the system quickly returns to its last known state. Table 9  
lists the devices and events that can wake the computer from the S3 state.  
The board supports the PCI Bus Power Management Interface Specification. Add-in  
boards that also support this specification can participate in power management and  
can be used to wake the computer.  
2.13.2.4 Wake from USB  
USB bus activity wakes the computer from an ACPI S3 state.  
NOTE  
Wake from USB requires the use of a USB peripheral that supports Wake from USB and  
support in the operating system.  
2.13.2.5 PME# Signal Wake-up Support  
When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI  
S3, S4, or S5 state (with Wake on PME enabled in the BIOS).  
2.13.2.6 Wake from PS/2 Devices  
PS/2 keyboard activity wakes the computer from an ACPI S3, S4, or S5 state.  
However, when the computer is in an ACPI S4 or S5 state, the only PS/2 activity that  
will wake the computer is the Alt + Print Screen or the Power Key available only on  
some keyboards.  
2.13.2.7 WAKE# Signal Wake-up Support  
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from  
an ACPI S3, S4, or S5 state.  
2.13.2.8 Wake from Serial Port  
Serial port activity wakes the computer from an ACPI S3 state.  
40  
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2.13.2.9 +5 V Standby Power Indicator LED  
The +5 V standby power indicator LED shows that power is still present even when the  
computer appears to be off. Figure 7 shows the location of the standby power  
indicator LED.  
CAUTION  
If AC power has been switched off and the standby power indicator is still lit,  
disconnect the power cord before installing or removing any devices connected to the  
board. Failure to do so could damage the board and any attached devices.  
Figure 7. Location of the Standby Power Indicator LED  
41  
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2.14 Debug Interfaces  
The following debug support is provided on the Intel® Embedded Board D2700:  
XDP (Extended Debug Port) connector supporting 3.3V JTAG is provided at location J22  
(on the reverse side of the board) for processor run control debug support.  
Two back panel serial ports and additional onboard headers provide UART connectivity  
(see Section 3.2)  
42  
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3 Technical Reference  
3.1 Memory Map  
3.1.1  
Addressable Memory  
The board utilizes 4 GB of addressable system memory. Typically the address space  
that is allocated for Conventional PCI bus add-in cards, PCI Express configuration  
space, BIOS (SPI Flash), and chipset overhead resides above the top of DRAM (total  
system memory). On a system that has 4 GB of system memory installed, it is not  
possible to use all of the installed memory due to system address space being  
allocated for other system critical functions. These functions include the following:  
BIOS/ SPI Flash (2 MB)  
Local APIC (19 MB)  
Direct Media Interface (40 MB)  
Internal graphics address registers  
Memory-mapped I/O that is dynamically allocated for Conventional PCI add-in  
cards  
43  
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The amount of installed memory that can be used will vary based on add-in cards and  
BIOS settings. Figure 8 shows a schematic of the system memory map. All installed  
system memory can be used when there is no overlap of system addresses.  
Figure 8. Detailed System Memory Address Map  
44  
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Table 10 lists the system memory map.  
Table 10. System Memory Map  
Address Range  
(decimal)  
Address Range  
(hex)  
Size  
Description  
Extended memory  
Runtime BIOS  
Reserved  
1024 K - 4194304 K  
960 K - 1024 K  
896 K - 960 K  
100000 - FFFFFFFF  
F0000 - FFFFF  
E0000 - EFFFF  
C8000 - DFFFF  
4095 MB  
64 KB  
64 KB  
96 KB  
800 K - 896 K  
Potential available high DOS  
memory (open to the PCI bus).  
Dependent on video adapter used.  
640 K - 800 K  
639 K - 640 K  
A0000 - C7FFF  
9FC00 - 9FFFF  
160 KB  
1 KB  
Video memory and BIOS  
Extended BIOS data (movable by  
memory manager software)  
512 K - 639 K  
0 K - 512 K  
80000 - 9FBFF  
00000 - 7FFFF  
127 KB  
512 KB  
Extended conventional memory  
Conventional memory  
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3.2 Connectors and Headers  
CAUTION  
Only the following connectors/headers have overcurrent protection: Back panel and  
front panel USB, VGA, serial, and PS/2.  
The other internal connectors/headers are not overcurrent protected and should  
connect only to devices inside the computer’s chassis, such as fans and internal  
peripherals. Do not use these connectors/headers to power devices external to the  
computer’s chassis. A fault in the load presented by the external devices could cause  
damage to the computer, the power cable, and the external devices themselves.  
NOTE  
Computer systems that have an unshielded cable attached to a USB port may not meet  
FCC Class B requirements, even if no device is attached to the cable. Use shielded  
cable that meets the requirements for full-speed devices.  
This section describes the board‘s connectors and headers. The connectors and  
headers can be divided into these groups:  
Back panel I/O connectors (see page 47)  
Component-side connectors and headers (see page 49)  
46  
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3.2.1  
Back Panel  
3.2.1.1  
Back Panel Connectors  
Figure 9 shows the location of the back panel connectors.  
Item Description  
A
B
C
D
E
F
PS/2 mouse port  
PS/2 keyboard port  
Serial port connector  
Serial port connector  
VGA connector  
DVI-I connector  
LAN port  
G
H
I
USB 2.0 ports  
LAN port  
J
USB 2.0 ports  
Line in  
K
L
Line out  
M
Mic in  
Figure 9. Back Panel Connectors  
NOTE  
The back panel audio line out connector is designed to power headphones or amplified  
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are  
connected to this output.  
47  
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3.2.1.2  
I/O Shield  
The I/O shield provided with the board allows access to all back panel connectors and  
is compatible with standard mini-ITX and microATX chassis. As an added benefit for  
system configurations with wireless PCI Express Mini Card solutions, the I/O shield also  
provides pre-cut holes for user installation of up to three external wireless antenna.  
Figure 10 shows an I/O shield reference diagram. Dimensions are listed in inches  
[millimeters].  
Figure 10. I/O Shield Reference Diagram  
48  
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3.2.2  
Component-side Connectors and Headers  
Figure 11 shows the locations of the component-side connectors and headers.  
Figure 11. Component-side Connectors and Headers  
49  
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Table 11 lists the component-side connectors and headers identified in Figure 11.  
Table 11. Component-side Connectors and Headers Shown in Figure 11  
Item/callout  
Description  
Processor core power connector (2 x 12)  
Serial port header  
A
B
C
D
E
F
TPM header  
Backlight inverter voltage selection jumper  
Flat panel voltage selection jumper  
FPD brightness connector  
LVDS data connector  
G
H
I
System fan header  
SATA connector  
SATA connector  
J
Front panel header  
K
L
S/PDIF header  
M
N
O
P
Front panel USB 2.0 header  
Front Panel Wireless Activity LED header  
Serial port header  
PCI Express Full-/Half-Mini Card slot  
Conventional PCI bus add-in card connector  
Parallel port header  
Q
R
S
T
Front panel audio header  
®
Front panel USB header with Intel Z-U130 USB Solid-State Drive or compatible  
device support (brown-colored)  
50  
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3.2.2.1  
Signal Tables for the Connectors and Headers  
Table 12. TPM Header  
Pin  
1
Signal Name  
CK_33M_TPM_DIP  
LFRAME#  
PLTRST#  
LAD3  
Pin  
2
Signal Name  
Ground  
3
4
Key (no pin)  
No connection  
LAD2  
5
6
7
8
9
+3.3 V  
10  
12  
14  
16  
18  
20  
LAD1  
11  
13  
15  
17  
19  
LAD0  
Ground  
No connection  
+3.3 VSB  
Ground  
No connection  
TPM_SERRQ  
TPM_CLKRUN#  
No connection  
LPCPD#  
Table 13. Serial Port Headers  
Pin  
Signal Name  
Pin  
Signal Name  
1
3
5
7
9
DCD (Data Carrier Detect)  
TXD# (Transmit Data)  
Ground  
2
RXD# (Receive Data)  
DTR (Data Terminal Ready)  
DSR (Data Set Ready)  
CTS (Clear To Send)  
Key (no pin)  
4
6
RTS (Request To Send)  
RI (Ring Indicator)  
8
10  
51  
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Table 14. LVDS Data Connector  
Pin  
1
Signal Name  
EVEN_Lane3_P  
EVEN_Lane3_N  
EVEN_Lane2_P  
EVEN_Lane2_N  
EVEN_Lane1_P  
EVEN_Lane1_N  
EVEN_Lane0_P  
EVEN_Lane0_N  
ODD_Lane3_P  
Pin  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
Signal Name  
N/C  
2
EDID_3.3V  
3
LCD_GND  
4
LCD_GND  
5
LCD_GND  
6
EVEN_CLK_P  
EVEN_CLK_N  
BKLT_GND  
7
8
9
BKLT_GND  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
ODD_Lane3_N  
BKLT_GND  
ODD_Lane2_P  
EDID_CLK  
ODD_Lane2_N  
BKLT_ENABLE  
BKLT_PWM_DIM  
ODD_CLK_P  
ODD_CLK_N  
BKLT_PWR (5V/12V/19V)  
BKLT_PWR (5V/12V/19V)  
BKLT_PWR (5V/12V/19V)  
N/C  
ODD_Lane1_P  
ODD_Lane1_N  
ODD_Lane0_P  
ODD_Lane0_N  
EDID_GND  
LCD_VCC (3.3V/5V/12V)  
LCD_VCC (3.3V/5V/12V)  
LCD_VCC (3.3V/5V/12V)  
EDID_DATA  
52  
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Table 15. Backlight Inverter Voltage Selection Jumper  
Voltage  
Jumper Setting  
Configuration  
3.3 V  
2 and 4  
Jumper position for 3.3 V (default)  
5 V  
6 and 4  
3 and 4  
Jumper position for 5 V  
Jumper position for 12 V  
12 V  
Table 16. FPD Brightness Connector  
Pin  
1
Signal Name  
Description  
BKLT_EN  
Backlight enable  
2
BKLT_PWM  
Backlight control  
3
BKLT_PWR (5 V/12 V)  
BKLT_PWR (5 V/12 V)  
BKLT_GND/Brightness_GND  
BKLT_GND/Brightness_GND  
Brightness_Up  
Backlight inverter power  
Backlight inverter power  
Ground (shared)  
4
5
6
Ground (shared)  
7
Panel brightness increase  
Panel brightness decrease  
8
Brightness_Down  
Table 17. Flat Panel Voltage Selection Jumper  
Voltage  
Jumper Setting  
Configuration  
5 V  
1 and 2  
Jumper position for 5 V (default)  
12 V  
3 and 2  
Jumper position for 12 V  
53  
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Table 18. System Fan Header  
Pin  
1
Signal Name  
Ground  
2
+12 V (PWM controlled pulses)  
Tach  
3
Table 19. SATA Connectors  
Pin  
1
Signal Name  
Ground  
TXP  
2
3
TXN  
4
Ground  
RXN  
5
6
RXP  
7
Ground  
Table 20. Front Panel Wireless Activity LED Header  
Pin  
1
Signal Name  
Ground  
2
MINICARD_WLAN#  
Table 21. Front Panel Audio Header for Intel® HD Audio  
Pin  
1
Signal Name  
Pin  
2
Signal Name  
[Port 1] Left channel  
[Port 1] Right channel  
[Port 2] Right channel  
SENSE_SEND (Jack detection)  
[Port 2] Left channel  
Ground  
3
4
PRESENCE# (Dongle present)  
[Port 1] SENSE_RETURN  
Key (no pin)  
5
6
7
8
9
10  
[Port 2] SENSE_RETURN  
Table 22. Front Panel Audio Header for AC ’97 Audio  
Pin  
1
Signal Name  
MIC  
Pin  
2
Signal Name  
AUD_GND  
3
MIC_BIAS  
FP_OUT_R  
AUD_5V  
4
AUD_GND  
5
6
FP_RETURN_R  
KEY (no pin)  
FP_RETURN_L  
7
8
9
FP_OUT_L  
10  
54  
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Table 23. Front Panel USB 2.0 Headers  
Pin  
1
Signal Name  
+5 VDC  
D-  
Pin  
2
Signal Name  
+5 VDC  
D-  
3
4
5
D+  
6
D+  
7
Ground  
8
Ground  
No Connect  
9
KEY (no pin)  
10  
Table 24. Front Panel USB Header with Intel® Z-U130 USB Solid-State Drive or  
Compatible Device Support  
Pin  
1
Signal Name  
+5 VDC  
D-  
Pin  
2
Signal Name  
NC  
3
4
NC  
5
D+  
6
NC  
7
Ground  
8
NC  
9
KEY (no pin)  
10  
LED#  
Table 25. Internal S/PDIF Header  
Pin  
1
Signal Name  
GND  
Description  
Ground  
2
SPDIF_OUT  
Key (no pin)  
+5V_DC  
S/PDIF signal from the codec  
Key (no pin)  
3
4
5 V power (for optical/TOSLINK module)  
55  
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Table 26. Parallel Port Header  
Pin  
1
Standard Signal Name  
STROBE#  
AUTOFD#  
PD0  
ECP Signal Name  
STROBE#  
AUTOFD#, HOSACK  
PD0  
EPP Signal Name  
WRITE#  
DATASTB#  
PD0  
2
3
4
FAULT#  
PD1  
FAULT#, PERIPHREQST#  
PD1  
FAULT#  
PD1  
5
6
INT#  
INT#, REVERSERQST#  
PD2  
RESET#  
PD2  
7
PD2  
8
SLCTIN#  
PD3  
SLCTIN#  
ADDRSTB#  
PD3  
9
PD3  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
GROUND  
PD4  
GROUND  
GROUND  
PD4  
PD4  
GROUND  
PD5  
GROUND  
GROUND  
PD5  
PD5  
GROUND  
PD6  
GROUND  
GROUND  
PD6  
PD6  
GROUND  
PD7  
GROUND  
GROUND  
PD7  
PD7  
GROUND  
ACK#  
GROUND  
GROUND  
INTR  
ACK#  
GROUND  
BUSY  
GROUND  
GROUND  
WAIT#  
GROUND  
PE  
BUSY#, PERIPHACK  
GROUND  
GROUND  
PERROR  
GROUND  
SELECT  
KEY (no pin)  
PE, ACKREVERSE#  
GROUND  
GROUND  
SELECT  
KEY (no pin)  
SELECT  
KEY (no pin)  
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3.2.2.2  
Add-in Card Connectors  
The board has the following add-in card connectors:  
PCI Express Full-/Half-Mini Card slot  
Conventional PCI bus connector (with riser card support for up to two PCI cards)  
Note the following considerations for the Conventional PCI bus connector:  
The Conventional PCI bus connector is bus master capable.  
SMBus signals are routed to the Conventional PCI bus connector. This enables  
Conventional PCI bus add-in boards with SMBus support to access sensor data on  
the board. The specific SMBus signals are as follows:  
The SMBus clock line is connected to pin A40.  
The SMBus data line is connected to pin A41.  
The Conventional PCI bus connector also supports single-slot and dual-slot riser cards  
for use of up to two bus master PCI expansion cards. In order to support two PCI bus  
master expansion cards, the riser card must support the following PCI signal routing:  
Pin A11: additional 33 MHz PCI clock  
Pin B10: additional PCI Request signal (i.e., PREQ#2)  
Pin B14: additional PCI Grant signal (i.e., GNT#2)  
NOTE  
BIOS IRQ programming for the second PCI slot on PCI riser card:  
ID_SEL: AD20 (Device 4)  
Second PCI slot INT Mapping:  
INT A# (A6) INT D# of mother board PCI slot.  
INT B# (B7) INT A# of mother board PCI slot.  
INT C# (A7) INT B# of mother board PCI slot.  
INT D# (B8) INT C# of mother board PCI slot.  
NOTE  
The Conventional PCI slot on this board does not support the PCI PHOLD1 function. Due  
to this limitation (errata), certain PCI cards may experience performance or detection  
issues when DMA transfer is used as part of the PCI card operation.  
1
PHOLD is the signal required to hold the bus during DMA transfers.  
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3.2.2.3  
Power Supply Connector  
The board has a 2 x 12 power connector (see Table 27). This board requires a TFX12V  
or SFX12V power supply.  
Table 27. Power Connector  
Pin  
1
Signal Name  
+3.3 V  
Pin  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
Signal Name  
+3.3 V  
2
+3.3 V  
-12 V  
3
Ground  
Ground  
4
+5 V  
PS-ON# (power supply remote on/off)  
5
Ground  
Ground  
Ground  
Ground  
No connect  
+5 V  
6
+5 V  
7
Ground  
8
PWRGD (Power Good)  
+5 V (Standby)  
+12 V  
9
10  
11  
12  
+5 V  
+12 V  
+5 V  
No connect  
Ground  
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3.2.2.4  
Front Panel Header  
This section describes the functions of the front panel header. Table 28 lists the signal  
names of the front panel header. Figure 12 is a connection diagram for the front panel  
header.  
Table 28. Front Panel Header  
In/  
Out  
In/  
Out  
Pin Signal  
Description  
Pin  
Signal  
Description  
Hard Drive Activity LED  
Power LED  
1
3
HD_PWR  
Out  
Hard disk LED  
pull-up to +5 V  
2
4
HDR_BLNK_GRN Out  
Front panel green  
LED  
HDA#  
Out  
Hard disk active  
LED  
HDR_BLNK_YEL Out  
Front panel yellow  
LED  
Reset Switch  
On/Off Switch  
5
7
Ground  
Ground  
6
8
FPBUT_IN  
Ground  
In  
Power switch  
Ground  
FP_RESET#  
+5 V  
In  
Reset switch  
Power  
Not Connected  
9
Power  
10  
N/C  
Not connected  
Figure 12. Connection Diagram for Front Panel Header  
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3.2.2.4.1  
Hard Drive Activity LED Header  
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is  
being read from or written to a hard drive.  
3.2.2.4.2  
Reset Switch Header  
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type  
switch that is normally open. When the switch is closed, the board resets and runs the  
POST.  
3.2.2.4.3  
Power/Sleep LED Header  
Pins 2 and 4 can be connected to a single- or dual-color LED. Table 29 shows the  
default states for a single-color LED.  
Table 29. States for a One-Color Power LED  
LED State  
Off  
Description  
Power off/hibernate (S5/S4)  
Sleeping (S3)  
Blinking  
Steady Green  
Running/Away (S0)  
NOTE  
The LED states listed in Table 29 are default settings that can be modified through  
BIOS setup. Systems built with a dual-color front panel power LED can also use  
alternate color state options.  
3.2.2.4.4  
Power Switch Header  
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The  
switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power  
supply circuitry to switch on or off. (The time requirement is due to internal debounce  
circuitry on the board.) At least two seconds must pass before the power supply  
circuitry will recognize another on/off signal.  
60  
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3.2.2.5  
Front Panel USB 2.0 Headers  
Figure 13 and Figure 14 are connection diagrams for the front panel USB 2.0 headers.  
NOTE  
The +5 VDC power on the USB 2.0 headers is fused.  
Use only a front panel USB connector that conforms to the USB 2.0 specification for  
high-speed USB devices.  
Figure 13. Connection Diagram for Front Panel USB 2.0 Header  
Figure 14. Connection Diagram for Front Panel USB 2.0 Header  
with Intel® Z-USB Solid-State Drive or Compatible Device Support  
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3.3 BIOS Configuration Jumper Block  
CAUTION  
Do not move the jumper with the power on. Always turn off the power and unplug the  
power cord from the computer before changing a jumper setting. Otherwise, the board  
could be damaged.  
Figure 15 shows the location of the jumper block. The jumper determines the BIOS  
Setup program‘s mode. Table 30 lists the jumper settings for the three modes: normal,  
configure, and recovery.  
Figure 15. Location of the BIOS Configuration Jumper Block  
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Table 30. BIOS Configuration Jumper Settings  
Jumper  
Function/Mode  
Setting  
Configuration  
Normal  
1-2  
The BIOS uses current configuration information and passwords  
for booting.  
Configure  
Recovery  
2-3  
After the POST runs, Setup runs automatically. The maintenance  
menu is displayed.  
None  
The BIOS attempts to recover the BIOS configuration. See  
Section 4.6.1 for more information on BIOS recovery.  
63  
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3.4 Mechanical Considerations  
3.4.1  
Form Factor  
The board is designed to fit into a mini-ITX or microATX form-factor chassis. Figure 16  
illustrates the mechanical form factor for the board. Dimensions are given in inches  
[millimeters]. The outer dimensions are 6.7 inches by 6.7 inches [170 millimeters by  
170 millimeters]. Location of the I/O connectors and mounting holes are in compliance  
with the microATX specification.  
Figure 16. Board Dimensions  
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3.5 Electrical Considerations  
3.5.1  
Fan Header Current Capability  
Table 31 lists the current capability of the fan header.  
Table 31. Fan Header Current Capability  
Fan Header  
Maximum Available Current  
System fan  
1.5 A  
3.5.2  
Add-in Board Considerations  
The board is designed to provide 2 A (average) of +5 V current for the Conventional  
PCI slot. The total +5 V current draw for the Conventional PCI expansion slot (total  
load) must not exceed 2 A.  
65  
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3.6 Power Consumption  
Power measurements were performed to determine bare minimum and likely  
maximum power requirements from the board, as well as attached devices, in order to  
facilitate power supply rating estimates for specific system configurations.  
3.6.1  
Minimum Load Configuration  
Minimum load refers to the power demand placed on the power supply when using a  
bare system configuration with minimal power requirement conditions. Minimum load  
configuration test results are shown in Table 32. The test configuration was defined as  
follows:  
2 GB DDR3/1066 MHz SO-DIMM  
USB keyboard and mouse  
LAN linked at 1000 Mb/s  
DOS booted via network (PXE); system at idle  
All on board peripherals enabled (serial, parallel, audio, …)  
Table 32. Minimum Load Configuration Current and Power Results  
3.3 V  
5 V  
12 V  
-12 V  
5 VSB  
0.10 A  
Output Voltage  
Minimum Load  
0.89 A  
1.06 A  
0.14 A  
0.08 A  
3.6.2  
Maximum Load Configuration  
Maximum load refers to the incremental power demands placed on the power supply,  
augmenting the minimum load configuration into a fully-featured system that stresses  
power consumption from all subsystems. Maximum load configuration test results are  
shown in Table 33. The test configuration was defined as follows:  
4 GB DDR3/1066MHz SO-DIMM  
14.1-inch LCD via LVDS  
SATA DVD-R/W  
Load: DVD playback  
3.5-inch SATA hard disk drive, running Microsoft Windows Vista Home Basic  
Load: continuous read/write benchmark  
Intel® Z-U130 USB Solid-State Drive or compatible device on the USB flash drive  
header  
Load: continuous read/write benchmark  
Wireless card on PCI Express Full-/Half-Mini Card slot, connected via 802.11n  
protocol  
Load: continuous read/write benchmark on remote share  
Riser card on conventional PCI slot, populated with PCI LAN card, running file  
transfer through local network to SATA hard drive  
USB keyboard and mouse  
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Back and front panel host-powered USB devices (other than keyboard and mouse)  
Load: continuous read/write activity on external drive/peripheral  
LAN linked at 1000 Mb/s  
Load: continuous read/write benchmark on remote share  
All on board peripherals enabled (serial, parallel, audio, …)  
Table 33. Maximum Load Configuration Current and Power Results  
3.3 V  
5 V  
12 V  
-12 V  
5 VSB  
0.72 A  
Output Voltage  
Maximum Load  
4.78 A  
6.32 A  
2.01 A  
0.05 A  
3.7 Reliability  
The Mean Time Between Failures (MTBF) prediction is calculated using component and  
sub-assembly random failure rates. The calculation is based on the Telcordia SR-332,  
Method I Case 1 50% electrical stress, 55 ºC ambient. The MTBF prediction is used to  
estimate repair rates and spare parts requirements.  
The MTBF data was calculated from predicted data at 55 ºC. The Intel® Embedded  
Board D2700 has an MTBF of at least 314,073 hours.  
3.8 Environmental  
Table 34 lists the environmental specifications for the board.  
Table 34. Intel® Embedded Board D2700 Environmental Specifications  
Parameter  
Specification  
Temperature  
-20 C to +70 C  
0 C to +50 C  
Non-Operating  
Operating  
Shock  
Unpackaged  
50 g trapezoidal waveform  
Velocity change of 170 inches/second²  
Half sine 2 millisecond  
Packaged  
Product weight (pounds)  
Free fall (inches)  
Velocity change (inches/s²)  
<20  
36  
30  
24  
18  
167  
152  
136  
118  
21-40  
41-80  
81-100  
Vibration  
Unpackaged  
5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz  
20 Hz to 500 Hz: 0.02 g² Hz (flat)  
Packaged  
10 Hz to 40 Hz: 0.015 g² Hz (flat)  
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz  
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4 Overview of BIOS Features  
4.1 Introduction  
The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash  
Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash  
contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN  
EEPROM information, and Plug and Play support.  
The BIOS displays a message during POST identifying the type of BIOS and a revision  
code. The initial production BIOSs are identified as CCCDT10N.86A.  
The BIOS Setup program can be used to view and change the BIOS settings for the  
computer. The BIOS Setup program is accessed by pressing the <F2> key after the  
Power-On Self-Test (POST) memory test begins and before the operating system boot  
begins. The menu bar is shown below.  
Maintenance  
Main  
Advanced  
Security  
Power  
Boot  
Exit  
NOTE  
The maintenance menu is displayed only when the board is in configure mode.  
Section 3.3 shows how to put the board in configure mode.  
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Table 35 lists the BIOS Setup program menu features.  
Table 35. BIOS Setup Program Menu Bar  
Maintenance Main  
Advanced Security  
Power  
Boot  
Exit  
Clears  
Displays  
processor  
Configures  
advanced  
Sets  
Configures  
power  
Selects boot Saves or  
passwords and  
displays  
passwords  
options  
discards  
changes to  
Setup  
and memory features  
configuration available  
and security management  
processor  
information  
features  
features and  
power states  
options  
through the  
chipset  
program  
options  
Table 36 lists the function keys available for menu screens.  
Table 36. BIOS Setup Program Function Keys  
BIOS Setup Program  
Function Key  
<> or <>  
<> or <>  
<Enter>  
Description  
Selects a different menu screen (Moves the cursor left or right)  
Selects an item (Moves the cursor up or down)  
Executes command or selects the submenu  
<F9>  
Load the default configuration values for the current menu  
Save the current values and exits the BIOS Setup program  
Exits the menu  
<F10>  
<Esc>  
4.2 BIOS Flash Memory Organization  
The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 16 Mb (2048 KB)  
flash memory device.  
4.3 Resource Configuration  
4.3.1  
PCI* Autoconfiguration  
The BIOS can automatically configure PCI devices. PCI devices may be onboard or  
add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having  
to configure the system. When a user turns on the system after adding a PCI card, the  
BIOS automatically configures interrupts, the I/O space, and other system resources.  
Any interrupts set to Available in Setup are considered to be available for use by the  
add-in card.  
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4.4 System Management BIOS (SMBIOS)  
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing  
computers in a managed network.  
The main component of SMBIOS is the Management Information Format (MIF)  
database, which contains information about the computing system and its  
components. Using SMBIOS, a system administrator can obtain the system types,  
capabilities, operational status, and installation dates for system components. The MIF  
database defines the data and provides the method for accessing this information. The  
BIOS enables applications such as third-party management software to use SMBIOS.  
The BIOS stores and reports the following SMBIOS information:  
BIOS data, such as the BIOS revision level  
Fixed-system data, such as peripherals, serial numbers, and asset tags  
Resource data, such as memory size, cache size, and processor speed  
Dynamic data, such as event detection and error logging  
Non-Plug and Play operating systems require an additional interface for obtaining the  
SMBIOS information. The BIOS supports an SMBIOS table interface for such operating  
systems. Using this support, an SMBIOS service-level application running on a  
non-Plug and Play operating system can obtain the SMBIOS information. Additional  
board information can be found in the BIOS under the Additional Information header  
under the Main BIOS page.  
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4.5 Legacy USB Support  
Legacy USB support enables USB devices to be used even when the operating system‘s  
USB drivers are not yet available. Legacy USB support is used to access the BIOS  
Setup program, and to install an operating system that supports USB. By default,  
Legacy USB support is set to Enabled.  
Legacy USB support operates as follows:  
1. When you apply power to the computer, legacy support is disabled.  
2. POST begins.  
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to  
enter and configure the BIOS Setup program and the maintenance menu.  
4. POST completes.  
5. The operating system loads. While the operating system is loading, USB keyboards  
and mice are recognized and may be used to configure the operating system.  
(Keyboards and mice are not recognized during this period if Legacy USB support  
was set to Disabled in the BIOS Setup program.)  
6. After the operating system loads the USB drivers, all legacy and non-legacy USB  
devices are recognized by the operating system, and Legacy USB support from the  
BIOS is no longer used.  
7. Additional USB legacy feature options can be accessed by using Intel Integrator  
Toolkit.  
To install an operating system that supports USB, verify that Legacy USB support in  
the BIOS Setup program is set to Enabled and follow the operating system‘s  
installation instructions.  
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4.6 BIOS Updates  
The BIOS can be updated using either of the following utilities, which are available on  
the Intel web site:  
Intel® Express BIOS Update utility, which enables automated updating while in the  
Windows environment. Using this utility, the BIOS can be updated from a file on a  
hard disk, a USB drive (a flash drive or a USB drive), or an optical drive.  
Intel® Flash Memory Update Utility, which requires booting from DOS. Using this  
utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash  
drive or a USB drive), or an optical drive.  
Intel® F7 switch allows a user to select where the BIOS .bio file is located and  
perform the update from that location/device. Similar to performing a BIOS  
Recovery without removing the BIOS configuration jumper.  
Both utilities verify that the updated BIOS matches the target system to prevent  
accidentally installing an incompatible BIOS.  
NOTE  
Review the instructions distributed with the upgrade utility before attempting a BIOS  
update.  
For information about  
Refer to  
BIOS update utilities  
4.6.1  
BIOS Recovery  
It is unlikely that anything will interrupt a BIOS update. However, if an interruption  
occurs, the BIOS could be damaged. Table 37 lists the drives and media types that can  
and cannot be used for BIOS recovery. The BIOS recovery media does not need to be  
made bootable.  
Table 37. Acceptable Drives/Media Types for BIOS Recovery  
Media Type(Note)  
Can be used for BIOS recovery?  
Optical drive connected to the SATA interface  
USB removable drive (a USB Flash Drive, for example)  
USB diskette drive (with a 1.44 MB diskette)  
USB hard disk drive  
Yes  
Yes  
No  
Yes  
NOTE: Supported file systems for BIOS recovery:  
NTFS (sparse, compressed, or encrypted files are not supported)  
FAT32  
FAT16  
FAT12  
ISO 9660  
For information about  
BIOS update instructions  
Refer to  
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4.6.2  
Custom Splash Screen  
During POST, an Intel® splash screen is displayed by default. This splash screen can be  
augmented with a custom splash screen. The Intel® Integrator Toolkit can be used to  
create a custom splash screen.  
NOTE  
If you add a custom splash screen, it will share space with the Intel branded logo.  
Refer to  
For information about  
®
Intel Integrator Toolkit  
4.7 Boot Options  
In the BIOS Setup program, the user can choose to boot from a hard drive, optical  
drive, removable drive, or the network. The default setting is for the optical drive to be  
the first boot device, the hard drive second, removable drive third, and the network  
fourth.  
4.7.1  
Optical Drive Boot  
Booting from the optical drive is supported in compliance to the El Torito bootable  
CD-ROM format specification. Under the Boot menu in the BIOS Setup program, the  
optical drive is listed as a boot device. Boot devices are defined in priority order.  
Accordingly, if there is not a bootable CD in the optical drive, the system will attempt  
to boot from the next defined drive.  
4.7.2  
Network Boot  
The network can be selected as a boot device. This selection allows booting from the  
onboard LAN or a network add-in card with a remote boot ROM installed.  
Pressing the <F12> key during POST automatically forces booting from the LAN. To  
use this key during POST, the User Access Level in the BIOS Setup program's Security  
menu must be set to Full.  
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4.7.3  
Booting Without Attached Devices  
For use in embedded applications, the BIOS has been designed so that after passing  
the POST, the operating system loader is invoked even if the following devices are not  
present:  
Video adapter  
Keyboard  
Mouse  
4.7.4  
Changing the Default Boot Device During POST  
Pressing the <F10> key during POST causes a boot device menu to be displayed. This  
menu displays the list of available boot devices (as set in the BIOS setup program‘s  
Boot Device Priority submenu). Table 38 lists the boot device menu options.  
Table 38. Boot Device Menu Options  
Boot Device Menu Function Keys  
Description  
<> or <>  
Selects a default boot device  
<Enter>  
Exits the menu, saves changes, and boots from the selected  
device  
<Esc>  
Exits the menu without saving changes  
4.8 Adjusting Boot Speed  
These factors affect system boot speed:  
Selecting and configuring peripherals properly  
Optimized BIOS boot parameters  
Enabling the new Fast Boot feature  
4.8.1  
Peripheral Selection and Configuration  
The following techniques help improve system boot speed:  
Choose a hard drive with parameters such as power-up to data ready‖ in less than  
eight seconds that minimizes hard drive startup delays.  
Select a CD-ROM drive with a fast initialization rate. This rate can influence POST  
execution time.  
Eliminate unnecessary add-in adapter features, such as logo displays, screen  
repaints, or mode changes in POST. These features may add time to the boot  
process.  
Try different monitors. Some monitors initialize and communicate with the BIOS  
more quickly, which enables the system to boot more quickly.  
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4.8.2  
BIOS Boot Optimizations  
Use of the following BIOS Setup program settings reduces the POST execution time.  
In the Boot Menu, set the hard disk drive as the first boot device. As a result, the  
POST does not first seek a diskette drive, which saves about one second from the  
POST execution time.  
In the Peripheral Configuration submenu, disable the LAN device if it will not be  
used. This can reduce up to four seconds of option ROM boot time.  
NOTE  
It is possible to optimize the boot process to the point where the system boots so  
quickly that the Intel logo screen (or a custom logo splash screen) will not be seen.  
Monitors and hard disk drives with minimum initialization times can also contribute to a  
boot time that might be so fast that necessary logo screens and POST messages  
cannot be seen.  
This boot time may be so fast that some drives might be not be initialized at all. If this  
condition should occur, it is possible to introduce a programmable delay ranging from  
zero to 30 seconds by 5 second increments (using the Hard Disk Pre-Delay feature of  
the Advanced Menu in the Drive Configuration Submenu of the BIOS Setup program).  
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4.9 BIOS Security Features  
The BIOS includes security features that restrict access to the BIOS Setup program  
and who can boot the computer. A supervisor password and a user password can be  
set for the BIOS Setup program and for booting the computer, with the following  
restrictions:  
The supervisor password gives unrestricted access to view and change all the Setup  
options in the BIOS Setup program. This is the supervisor mode.  
The user password gives restricted access to view and change Setup options in the  
BIOS Setup program. This is the user mode.  
If only the supervisor password is set, pressing the <Enter> key at the password  
prompt of the BIOS Setup program allows the user restricted access to Setup.  
If both the supervisor and user passwords are set, users can enter either the  
supervisor password or the user password to access Setup. Users have access to  
Setup respective to which password is entered.  
Setting the user password restricts who can boot the computer. The password  
prompt will be displayed before the computer is booted. If only the supervisor  
password is set, the computer boots without asking for a password. If both  
passwords are set, the user can enter either password to boot the computer.  
For enhanced security, use different passwords for the supervisor and user  
passwords.  
Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to  
16 characters in length.  
Table 39 shows the effects of setting the supervisor password and user password. This  
table is for reference only and does not display on the screen.  
Table 39. Supervisor and User Password Functions  
Password  
to Enter  
Setup  
Password  
During  
Boot  
Password  
Set  
Supervisor  
Mode  
User Mode  
Setup Options  
Neither  
Can change all  
options  
Can change all None  
options  
None  
None  
(Note)  
(Note)  
Supervisor  
only  
Can change all  
options  
Can change a  
limited  
Supervisor Password  
Supervisor  
None  
number of  
options  
User only  
N/A  
Can change all Enter Password  
User  
User  
options  
Clear User Password  
Supervisor  
and user set  
Can change all  
options  
Can change a  
limited  
Supervisor Password  
Enter Password  
Supervisor or  
user  
Supervisor or  
user  
number of  
options  
Note:  
If no password is set, any user can change all Setup options.  
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5 Board Status and Error Messages  
5.1 BIOS Beep Codes  
The BIOS uses audible beep codes to signal status messages and error messages  
indicating recoverable errors that occur during the POST. The beep codes are listed in  
Table 40. These beep codes can be heard through a speaker attached to the board‘s  
line out audio jack (see Figure 5, B on page 33).  
Table 40. BIOS Beep Codes  
Type  
Pattern  
Frequency  
BIOS update in progress None  
(Note)  
Video error  
On-off (1.0 second each) two times, then  
2.5-second pause (off), entire pattern repeats  
(beeps and pause) once and the BIOS will  
continue to boot.  
932 Hz  
When no VGA option ROM is  
found.  
Memory error  
On-off (1.0 second each) three times, then  
2.5-second pause (off), entire pattern repeats  
(beeps and pause) until the system is powered  
off.  
932 Hz  
Thermal trip warning  
Alternate high and low beeps (1.0 second each)  
for eight beeps, followed by system shut down.  
High beep 2000 Hz  
Low beep 1500 Hz  
Note: Disabled per default BIOS setup option.  
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5.2 Front-panel Power LED Blink Codes  
Whenever a recoverable error occurs during POST, the BIOS causes the board‘s front  
panel power LED to blink an error message describing the problem (see Table 41).  
Table 41. Front-panel Power LED Blink Codes  
Type  
Pattern  
Note  
BIOS update in progress Off when the update begins, then on for  
0.5 seconds, then off for 0.5 seconds. The  
pattern repeats until the BIOS update is  
complete.  
(Note)  
Video error  
On-off (1.0 second each) two times, then  
2.5-second pause (off), entire pattern repeats  
(blink and pause) until the system is powered  
off.  
When no VGA option ROM is  
found.  
Memory error  
On-off (1.0 second each) three times, then  
2.5-second pause (off), entire pattern repeats  
(blinks and pause) until the system is powered  
off.  
Thermal trip warning  
Each beep will be accompanied by the following  
blink pattern: .25 seconds on, .25 seconds off,  
.25 seconds on, .25 seconds off. This will result  
in a total of 16 blinks.  
Note: Disabled per default BIOS setup option.  
5.3 BIOS Error Messages  
Whenever a recoverable error occurs during POST, the BIOS displays an error message  
describing the problem. Table 42 lists the error messages and provides a brief  
description of each.  
Table 42. BIOS Error Messages  
Error Message  
CMOS Battery Low  
CMOS Checksum Bad  
Explanation  
The battery may be losing power. Replace the battery soon.  
The CMOS checksum is incorrect. CMOS memory may have been  
corrupted. Run Setup to reset values.  
Memory Size Decreased  
No Boot Device Available  
Memory size has decreased since the last boot. If no memory  
was removed, then memory may be bad.  
System did not find a device to boot.  
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5.4 Port 80h POST Codes  
During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O  
port 80h. If the POST fails, execution stops and the last POST code generated is left at  
port 80h. This code is useful for determining the point at which an error occurred.  
Displaying the POST codes requires a PCI bus add-in card, often called a POST card.  
The POST card can decode the port and display the contents on a medium such as a  
seven-segment display.  
NOTE  
The POST card must be installed in the PCI bus connector.  
The following tables provide information about the POST codes generated by the BIOS:  
Table 43 lists the Port 80h POST code ranges  
Table 44 lists the Port 80h POST codes themselves  
Table 45 lists the Port 80h POST sequence  
NOTE  
In the tables listed above, all POST codes and range values are listed in hexadecimal.  
Table 43. Port 80h POST Code Ranges  
Range  
Subsystem  
0x00 0x05  
0x10, 0x20, 0x30  
0x11 0x1F  
0x21 0x29  
0x2A 0x2F  
0x31 0x35  
0x36 0x3F  
0x41 0x4F  
0x50 0x5F  
0x60 0x6F  
0x70 0x7F  
0x80 0x8F  
0x90 0x9F  
0xA0 0xAF  
0xB0 0xBF  
Entering SX states S0 to S5.  
Resuming from SX states (0x10 0x20 S2, 0x30 S3, etc.)  
PEI phase pre MRC execution  
MRC memory detection  
PEI phase post MRC execution  
Recovery  
Platform DXE driver  
CPU Initialization (PEI, DXE, SMM)  
I/O Buses: PCI, USB, ATA etc. 0x5F is an unrecoverable error. Start with PCI.  
BDS  
Output devices: All output consoles.  
For future use  
Input devices: Keyboard/Mouse.  
For future use  
Boot Devices: Includes fixed media and removable media. Not that critical since  
consoles should be up at this point.  
0xC0 0xCF  
0xD0 0xDF  
For future use  
For future use  
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Table 44. Port 80h POST Codes  
Port 80 Code  
Progress Code Enumeration  
ACPI S States  
0x00,0x01,0x02,0x03,0x04,0x05  
0x10,0x20,0x30  
Entering S0, S2, S3, S4, or S5 state  
Resuming from S2, S3, S4, or S5 state  
PEI before MRC  
PEI Platform driver  
0x11  
0x12  
0x13  
0x14  
0x15  
Set boot mode, GPIO init  
Early chipset register programming  
Basic chipset initialization  
LAN init  
Exit early platform init driver  
PEI SMBUS  
0x16  
0x17  
0x18  
SMBUS driver init  
Entry to SMBUS execute read/write  
Exit SMBUS execute read/write  
Memory  
0x21  
0x24  
0x25  
0x27  
0x28  
MRC entry point  
Detecting presence of memory DIMMs  
Override Detected DIMM settings  
Configuring memory.  
Testing memory  
PEIMs/Recovery  
0x31  
0x33  
0x34  
Crisis Recovery has initiated  
Loading recovery capsule  
Start recovery capsule / valid capsule is found  
CPU Initialization  
CPU PEI Phase  
0x41  
0x42  
0x43  
Begin CPU PEI Init  
XMM instruction enabling  
End CPU PEI Init  
CPU PEI SMM Phase  
0x44  
0x45  
0x46  
Begin CPU SMM Init smm relocate bases  
Smm relocate bases for APs  
End CPU SMM Init  
continued  
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Table 44. Port 80h POST Codes (continued)  
Port 80 Code  
Progress Code Enumeration  
CPU DXE Phase  
0x47  
0x48  
0x49  
0x4A  
0x4B  
0x4C  
CPU DXE Phase begin  
Refresh memory space attributes according to MTRRs  
Load the microcode if needed  
Initialize strings to HII database  
Initialize MP support  
CPU DXE Phase End  
CPU DXE SMM Phase  
CPU DXE SMM Phase begin  
Relocate SM bases for all APs  
CPU DXE SMM Phase end  
I/O BUSES  
0x4D  
0x4E  
0x4F  
0x50  
0x51  
0x52  
Enumerating PCI buses  
Allocating resources to PCI bus  
Hot Plug PCI controller initialization  
USB  
0x58  
0x59  
Resetting USB bus  
Reserved for USB  
ATA/ATAPI/SATA  
Resetting PATA/SATA bus and all devices  
Reserved for ATA  
0x5A  
0x5B  
BDS  
0x60  
0x61  
0x62  
0x63  
0x64  
0x65  
0x66  
0x67  
0x68  
0x69  
0x6A  
0x6B  
0x6C  
0x6D  
0x6E  
0x6F  
BDS driver entry point initialize  
BDS service routine entry point (can be called multiple times)  
BDS Step2  
BDS Step3  
BDS Step4  
BDS Step5  
BDS Step6  
BDS Step7  
BDS Step8  
BDS Step9  
BDS Step10  
BDS Step11  
BDS Step12  
BDS Step13  
BDS Step14  
BDS return to DXE core (should not get here)  
continued  
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Table 44. Port 80h POST Codes (continued)  
Port 80 Code  
Progress Code Enumeration  
Keyboard (PS/2 or USB)  
0x90  
0x91  
0x92  
0x93  
0x94  
0x95  
Resetting keyboard  
Disabling the keyboard  
Detecting the presence of the keyboard  
Enabling the keyboard  
Clearing keyboard input buffer  
Instructing keyboard controller to run Self Test (PS/2 only)  
Mouse (PS/2 or USB)  
Resetting mouse  
0x98  
0x99  
0x9A  
0x9B  
Detecting mouse  
Detecting presence of mouse  
Enabling mouse  
Fixed Media  
0xB0  
0xB1  
Resetting fixed media  
Disabling fixed media  
0xB2  
0xB3  
Detecting presence of a fixed media (IDE hard drive detection etc.)  
Enabling/configuring a fixed media  
Removable Media  
0xB8  
0xB9  
0xBA  
Resetting removable media  
Disabling removable media  
Detecting presence of a removable media (IDE, CDROM detection  
etc.)  
0xBC  
0xE4  
Enabling/configuring a removable media  
DXE Core  
Entered DXE phase  
BDS  
0xE7  
0xE8  
0xE9  
0xEB  
Waiting for user input  
Checking password  
Entering BIOS setup  
Calling Legacy Option ROMs  
Runtime Phase/EFI OS Boot  
EFI boot service ExitBootServices ( ) has been called  
EFI runtime service SetVirtualAddressMap ( ) has been called  
0xF8  
0xF9  
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Table 45. Typical Port 80h POST Sequence  
POST Code  
Description  
24  
27  
28  
33  
E4  
50  
51  
92  
90  
94  
95  
EB  
58  
5A  
92  
90  
94  
5A  
28  
90  
94  
E7  
00  
A3  
Detecting presence of memory DIMMs  
Configuring memory  
Testing memory  
Loading recovery capsule  
Entered DXE phase  
Enumerating PCI buses  
Allocating resourced to PCI bus  
Detecting the presence of the keyboard  
Resetting keyboard  
Clearing keyboard input buffer  
Keyboard Self Test  
Calling Video BIOS  
Resetting USB bus  
Resetting PATA/SATA bus and all devices  
Detecting the presence of the keyboard  
Resetting keyboard  
Clearing keyboard input buffer  
Resetting PATA/SATA bus and all devices  
Testing memory  
Resetting keyboard  
Clearing keyboard input buffer  
Waiting for user input  
Ready to boot  
Legacy USB driver disconnect  
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6 Assembly/Disassembly Guide  
6.1 Introduction  
Please take a moment to read this manual before you start assembling or  
disassembling the enclosure. Often times, rushing into unit installation can result in  
damage to your enclosure, motherboard, and power supply.  
CAUTION  
The procedures in this chapter assume familiarity with the general terminology associated with  
personal computers and mobile electronics, and with the safety practices and regulatory compliance  
required for using and modifying electronic equipment.  
Disconnect the unit from its power source and from any telecommunications links, networks, or  
modems before performing any of the procedures described in this chapter. Failure to disconnect  
power, telecommunications links, networks, or modems before you open the unit or perform any  
procedures can result in personal injury or equipment damage. Some circuitry on the board can  
continue to operate even though the front panel power button is off.  
Follow these guidelines before you begin installing the Embedded Board:  
Always follow the steps in each procedure in the correct order.  
Set up a log to record information about your unit, such as model, serial  
numbers, installed options, and configuration information.  
Electrostatic discharge (ESD) can damage components. Perform the procedures  
described in this chapter only at an ESD workstation using an antistatic wrist  
strap and a conductive foam pad. If such a station is not available, you can  
provide some ESD protection by wearing an antistatic wrist strap and attaching  
it to a metal part of the unit‘s chassis.  
To avoid injury, be careful of:  
.
.
.
.
.
Sharp pins on connectors or headers  
Sharp pins on printed circuit assemblies  
Rough edges and sharp corners on the inside of the chassis  
Hot components (such as voltage regulators and heat sinks)  
Damage to wires that could cause a short circuit  
6.2 Required tools  
Phillips screwdriver  
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6.3 Board Installation Steps  
1. To remove the top lid, remove the screw (encircled in red) from the back, in the  
right corner, see Figure 17. Push back the top lid ½ inches and after this, gently pull  
it up.  
Figure 17 -- Removing the top lid  
1 - WiFi antenna hole, 2 - DC Power jack hole  
2. Install I/O motherboard shield on the back of the enclosure.  
3. Install the motherboard on the base plate using four screws pictured below.  
Figure 18Install Motherboard  
4. Connect the ON/OFF and Power LED cables (J3 in Figure 19) to the motherboard  
using the cable harness provided with the enclosure, see Figure 19. Also, you can  
connect the USB header (J2 in Figure 19), if needed. Connect the ON/OFF and Power  
LED cables (J3 in Figure 19) to the motherboard using the cable harness provided  
with the enclosure. Also, you can connect the USB header, if needed.  
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Figure 19 -- J2 (USB Header) and J3 (2x3) pin header, view from the back of  
Enclosure  
6.4 Installing USB devices under the front plate  
The face plate is designed to conceal USB flash drives, Bluetooth, USB WIFI modules or  
other USB devices. To add a USB device under the front plate, remove it by carefully  
pressing outwards and gently pushing, one by one, the plastic lids from the sides (see  
Figure 20 -- Removing the front plate by pressing the left and right plastic lids  
Near the front USB connector there are 2 jumpers (pictured in Figure 21) which are used  
to customize how the board will start.  
JP1: Disable On/Off power button (removing this jumper disables the power button).  
JP2: Enable auto start (set power button on ON‖ state always).  
Figure 21 -- JP1, JP2 pin header and 2 x USB slots  
Front view of the enclosure, with the front plate removed.  
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After installing the desired USB devices, snap back the front plate.  
6.5 Installing SSD and Fans  
Install the SSD using the provided screws. The SSD (and optional coolers) will be  
fastened onto the SSD Mounting Bracket see Figure 22. On the bracket you can install  
one 2.5‖ hard drive or two fans (40x40x10mm) pictured below.  
Figure 22: Mount Bracket for HDD, SSD, or Fan  
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7 Operating System Reference  
7.1 Installing Windows* 7  
This section provides step-by-step instructions for installing Windows* 7 on platforms  
based on the Intel® Atom™ Processor N2000 or D2000 Series and Intel® NM10  
Express Chipset.  
The instructions in this section have been validated with the Intel® Atom™ Processor  
D2700 with Intel® NM10 Express Chipset and Intel® Atom™ Processor N2800 with  
Intel® NM10 Express Chipset Development Kits. However, the information in this  
section is applicable to any Intel platform based on the Intel® Atom™ Processor  
N2000 or D2000 Series and Intel® NM10 Express Chipset.  
For customers evaluating or using the Development Kit(s) as a basis for their  
embedded design and Windows 7 as their operating system, this is the primary  
guidance Intel provides for installing the drivers and operating system to deliver  
optimized performance.  
Windows 7 is the 2009 release of Microsoft Windows which is a series of operating  
systems produced by Microsoft for use on all different types of personal computers,  
including home and business desktops, laptops, netbooks, tablet PCs, and media  
center PCs.  
Windows 7 is an officially supported OS for this platform. Starter, Home Basic and  
Home Premium are the supported versions of this OS for this platform.  
Note: Six additional plan of record operating systems exist for this platform as well:  
Windows XP, Windows XP Embedded (XPe), Yocto Project, MeeGo 1.2, VxWorks,  
Windows Embedded Compact 7, and Windows Embedded Standard 7 (WES7).  
Hardware and software required for installation of Windows 7 and the drivers made by  
Intel on this platform include:  
A system designed to Intel‘s platform design guide recommendations  
40 GB or larger blank hard disk drive (HDD) or SSD  
USB DVD-ROM drive (or USB flash drive depending on how Microsoft Windows  
7 is downloaded and installed)  
7.1.1  
Downloading and installing Windows 7 onto the  
Target SSD/HDD  
Windows 7 is a closed source platform that includes the kernel, core OS, UI libraries  
and tools, reference user experiences for multiple devices and applications, a standard  
set of APIs across all target device types, and the flexibility to support add-ons and  
applications. Since Windows 7 is the exclusive property of Microsoft, Intel is legally not  
allowed to distribute a BSP or full OS image with Intel drivers already pre-installed in  
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it. The purpose of this section is thus to provide the instructions necessary for  
downloading and creating the Microsoft Windows 7 OS and then installing the drivers  
created by Intel for this platform under Windows 7.  
Before proceeding with the rest of this section which covers how to install Intel-created  
graphics, chipset and processor drivers into the target Windows 7 based platform,  
customers must first obtain a blank SATA based HDD or SSD (recommended size = 40  
GB or more) and choose one of the acceptable methods in Table 46 to install Windows  
7 from scratch.  
Table 46. Windows 7 Installation Options  
If you want to do this  
Go here for more information  
Format the HDD/SSD and  
install Windows 7.  
http://windows.microsoft.com/en-us/windows7/Installing-and-reinstalling-  
Windows-7  
See "Using the Custom installation option and formatting the hard disk" in  
this topic  
Install Windows 7 on a  
HDD/SSD that did not  
previously have an operating  
system.  
See "Using the Custom installation option if no operating system is  
installed" in this topic.  
Install Windows 7 on a  
HDD/SSD based platform  
without using a DVD drive.  
For information about downloading Windows 7, and then creating a USB  
flash drive to install Windows 7, go to: http://windows.microsoft.com/en-  
NOTE: Instructions are courtesy of Microsoft.  
Once the SSD/HDD contains a fresh version of Windows 7, it is recommended that the  
latest service pack be downloaded and installed.  
Note: This may not be necessary if the latest service pack is integrated into the  
original OS installation.  
A service pack (SP) is a Windows update, often integrating previously released  
updates, that helps make Windows more reliable. Service packs, which are provided  
free of charge by Microsoft, can include security and performance improvements and  
support for new types of hardware. Installing the latest service pack helps keep  
Windows 7 up to date.  
The easiest way to get any necessary service packs is to use the target platform‘s  
Windows 7 and turn on Windows Update for Windows 7. Step by step instructions on  
how to do this are posted here from Microsoft: http://windows.microsoft.com/en-  
As of December 2011, the most recent service pack available for manual download is  
R2 SP1 (Service Pack 1). Download R2 SP1 from the Download Center here:  
Turning on Automatic Updating is optional. If you are creating a golden image for  
prototyping or production purposes, having explicit control over operating system  
updates is recommended.  
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7.1.2  
Downloading and installing processor, graphics,  
chipset and other optional drivers  
Though the standard OS may contain several drivers compatible with the platform it is  
recommended that you install the latest platform drivers found here:  
These drivers, in pre-release and release forms, are also available in the same package  
format from https://platformsw.intel.com. Please see your Intel field representative for  
access.  
Driver files are generally available as an executable file. If you have downloaded the  
package file to your platform, and it is in ZIP format, extract the contents of the file  
using a file decompression program such as WinZip* or 7-Zip*.  
7.2 Installing Windows* Embedded Standard 7  
This section provides step-by-step instructions for installing Windows* Embedded  
Standard 7 on platforms based on the Intel® Atom™ Processor N2000 or D2000 Series  
and Intel® NM10 Express Chipset.  
The instructions in this section have been validated with the Intel® Atom™ Processor  
D2700 with Intel® NM10 Express Chipset and Intel® Atom™ Processor N2800 with  
Intel® NM10 Express Chipset Development Kits. However, the information in this  
section is applicable to any Intel platform based on the Intel® Atom™ Processor  
N2000 or D2000 Series and Intel® NM10 Express Chipset.  
For customers evaluating or using the Development Kit(s) as a basis for their  
embedded design, and Windows Embedded Standard 7 as their operating system, this  
is the primary guidance Intel provides for installing the drivers and operating system  
to deliver optimized performance.  
Windows Embedded Standard 7, abbreviated WES7, is a Windows 7 compatible  
operating system from Microsoft designed specifically for use in embedded systems.  
With WES7 software developers and system engineers have the ability to customize  
the operating system by selecting components they most need to run their advanced  
commercial and consumer devices and existing Windows applications and drivers.  
Developers can use Windows Embedded Standard 7 and the component selection  
menu built into it to create a custom, segment specific and highly space conscious OS  
build for a variety of connected, and service-oriented advanced commercial or  
consumer devices. Examples include operating system customizations for set-top  
boxes, full featured point of service appliances, gaming devices, industrial controls,  
multimedia internet devices, kiosks, digital signage, monitoring devices, and thin  
clients.  
According to Microsoft, Windows Embedded Standard 7, is based on Windows 7 which  
was previously codenamed Windows Embedded ‗Quebec‘. Windows Embedded  
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Standard 7 includes Windows Vista and Windows 7 features such as Aero, SuperFetch,  
ReadyBoost, BitLocker Drive Encryption, Windows Firewall, Windows Defender, Address  
space layout randomization, Windows Presentation Foundation, Silverlight 2, Windows  
Media Center among several other packages. Windows Embedded Standard 7 is x86  
compatible and applications that run under Windows 7 should perform equivalently  
under WES7.  
Hardware and software required for installation of Windows 7 and the drivers made by  
Intel on this platform include:  
• A system designed to Intel‘s platform design guide recommendations  
40 GB or larger blank hard disk drive (HDD) or SSD  
USB DVD-ROM drive (or USB flash drive depending on how Microsoft Windows 7 is  
downloaded and installed)  
Windows Embedded Standard 7 DVD Image  
7.2.1  
Downloading, burning, and installing the WES7  
DVD image  
A DVD image for Windows Embedded Standard 7 SP1 with registration instructions for  
trial and full licenses can be found at:  
Download the image per the instructions provided by Microsoft on the page and burn  
to a writeable DVD disc.  
7.2.2  
Install WES7  
1. Ensure that the hard disk or SSD to be used is not bootable to any operating  
system, and that the USB DVD-ROM drive is connected to platform.  
2. Boot the system with the WES7 DVD you have created. Choose Build an Image as  
shown in Figure 23.  
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Figure 23: Build an image  
3. Read and accept the license as shown in Figure 24. Click Next  
Figure 24: Accept the license terms  
4. WES7 allows you to choose from several pre-configured templates when creating  
your image. Each selection has a different set of driver support and potentially  
different look and feel for the user interface. The default is Application Compatibility,  
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which installs many of the basic Windows applications (Media Player, Internet explorer,  
etc.) and drivers necessary for broad application support with the default windows  
desktop look and feel. Intel recommends that you click View Template on each as  
Figure 25: View template  
5. The template view will show you a list of the applications, drivers, and feature  
packages selected by each template. An example of the Application Compatibility  
template view is in Figure 26. When you are satisfied with your choice of template,  
click Close. Intel recommends that you thoroughly review each of the templates before  
clicking Next.  
Figure 26: Template details  
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You may also choose Do not use a template to create your own customized image with  
only the drivers and features that you need for your specific product implementation.  
In that case, select the desired features that you need, and click Next.  
6. Select your preferred language and keyboard region as shown in Figure 27.  
Figure 27: Choose a language and other preferences  
7. Select a disk install location as shown in Figure 28. You may want to delete any  
existing partitions that appear in the list. If not, you can use an unallocated section or  
create one using the options. Note that you will likely need at least 8GB of free space  
for an install depending on which image options and features you chose in step 5.  
When you are finished, click Next.  
Figure 28: Where do you want to install Windows?  
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8. The installation will run for several minutes. During this time, the system may  
restart a number of times.  
Figure 29: Installing Windows  
9. When the install process completes, you will be presented with a login screen,  
where you can establish a user account and name for your system.  
Figure 30: Set up Windows - Login  
7.2.3  
Downloading and installing processor, graphics,  
chipset and other optional drivers  
Though the standard OS may contain several drivers compatible with the platform it is  
recommended that you install the latest platform drivers found here:  
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These drivers, in pre-release and release forms are also available in the same package  
format from https://platformsw.intel.com. Please see your Intel field representative for  
access.  
Driver files are generally available as an executable file. If you have downloaded the  
package file to your platform and it is in ZIP format, extract the contents of the file  
using a file decompression program such as WinZip* or 7-Zip*.  
7.3 Installing Windows Embedded Compact 7*  
For customers requiring WEC7 BSPs for their boards, please contact the respective  
7.4 Installing Windows XP*  
This section provides step-by-step instructions for downloading the drivers for  
platforms featuring the Intel® NM10 chipset and the Embedded Graphics Driver for the  
Intel® Atom™ Processor N2600/D2700/N2800, to properly install and configure the  
Microsoft Windows XP* with Service Pack 3 image.  
These instructions have been used with the Intel Customer Reference Board (CRB) and  
are applicable to any Intel platform based on the Intel Atom Processor  
N2600/D2700/N2800 paired with Intel NM10 Express Chipset.  
For customers evaluating or using the Development Kit as a basis for their embedded  
design, and Windows* XP as their operating system, this document is the primary  
guidance Intel provides for setting up the drivers and operating system.  
7.4.1  
Overview  
Windows XP with Service Pack 3 does not provide drivers for all the SATA controllers,  
requiring an extra step during the install procedure. There are two different methods of  
performing the installation to accommodate for the missing SATA drivers.  
The first method requires a USB floppy drive with the SATA drivers loaded on the  
floppy disk. This approach is typically referred to as an F6 Install since the user is  
required to press F6 early in the install to indicate the SATA drivers will be read from a  
floppy disk.  
The second method requires a tool to produce a new Windows XP image typically  
referred to as slipstreamed image. The slipstreamed image eliminates the need for the  
floppy drive and floppy disk, but requires a software tool to create the image. The  
preferred approach is the slipstream method due to the limited availability of validated  
floppy drives. Both install methods require you download the SATA drivers from Intel  
separately from the Windows image. If you skip this step, you will get a blue screen  
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early in the installation sequence. Additional information about this issue can be found  
on the Microsoft website.  
Note: Not all USB floppy disk drives are created equal. If you go this route, please  
read the above support documents from Microsoft to get a list of supported floppy  
drives.  
7.4.2  
F6 install with floppy  
1. Download either the STOR_10.1.0.1008_f6flpy-x86.zip or  
STOR_10.1.0.1008_f6flpy-x64.zip SATA Driver files from here  
2. Put the SATA drivers on a floppy disk.  
a) iaahci.cat  
b) iaAHCI.inf  
c) iastor.cat  
d) iaStor.inf  
e) iaStor.sys  
f) license.txt  
g) TXTSETUP.OEM  
h) F6Readme.txt  
3. Attach the USB Floppy drive to the CRB.  
4. Connect a SATA or USB CD or DVD drive with the Microsoft Windows XP with  
Service Pack 3 image.  
5. Boot the CRB to initiate the Windows XP Setup process.  
6. When the Windows XP Setup screen appears, you will soon see a message in  
the grey bar at the bottom of the screen. This message will say, Press F6 if  
you need to install a third party SCSI or RAID driver….‖  
a) Press F6.  
b) The installer will continue on for a minute or so before the F6 install  
screen will appear.  
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c) Press S to Specify Additional Device. The SCSI adapter screen will  
appear.  
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d) Press Enter to Select the Intel® NM10 Express Chipset. The screen  
titled Setup will load support for Intel® NM10 Express Chipset‖ will  
appear.  
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e) Press Enter to continue. The partitions screen will appear.  
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f) Select the C: partition and press Enter. Setup will continue as normal.  
7.4.3  
Slipstream install  
There are several tools available that can create a slipstream image. This document  
uses the nLite* 1.4.9.1 tool.  
1. Download and install nLite from: http://www.nliteos.com/index.html.  
2. Download either the STOR_10.1.0.1008_f6flpy-x86.zip or  
STOR_10.1.0.1008_f6flpy-x64.zip SATA Driver files from here.  
3. Extract the Intel® Rapid Storage Technology F6 Driver files.  
4. Download the Windows XP installation ISO or insert the Windows XP installation  
Disk into the disk drive.  
5. Start the nLite tool.  
a. Select your language and click Next  
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b. Click on Browse and point to the folder with the Windows XP installation files  
(from step 4). You will see the information fields populate. Click Next.  
c. Click Next on the Presets page.  
d. Select Drivers and Bootable ISO on the Task Selection page. Click Next.  
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e. Click Insert  
Single Driver  
i. Browse to the Intel Rapid Storage Technology F6 Driver files.  
ii. Select the iaAHCI.inf file.  
f. Select the Textmode driver radio button.  
g. Select the Intel® NM10 Express Chipset in the Textmode integration options  
pane.  
h. Click OK.  
i.  
On the Drivers page, click Next.  
Click Yes to start the process.  
j.  
k. On the Processing… page, click Next.  
l. On the Bootable ISO page, .abel your new Windows XP installation with  
something meaningful such as: WindowsXPSP3NM10SATA.  
m. Click Make ISO.  
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n. Name your ISO with a meaningful name, such as:  
WindowsXPSP3WithNM10Sata.iso  
o. Click Next.  
p. Click Finish.  
6. Burn the newly generated ISO file to a CD using your favorite tool.  
7. Attach a SATA CD ROM or USB CD ROM to Intel‘s CRB.  
8. Install Windows XP by selecting the appropriate options in the setup screens.  
7.4.4  
Install Device Drivers  
The Rapid Storage Technology Drivers, Audio Drivers, LAN Drivers, and Chipset Drivers  
can be found here:  
7.4.5  
Install and configure EMGD  
The Intel® Embedded Media and Graphics Driver (Intel® EMGD) comprises a suite of  
multi-platform graphics drivers designed to meet the requirements of embedded  
applications, featuring Intel® Dynamic Display Configuration Technology (DDCT).  
The Intel® Embedded Media and Graphics Drivers support the following types of  
display devices:  
Analog CRT  
LVDS flat panels  
HDMI / DVI  
DisplayPort / Embedded DisplayPort  
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Intel® EMGD is designed to work with fixed-function systems, such as Point-of-Sale  
(POS) devices, ATMs, gaming devices, In-vehicle Information/Entertainment systems,  
etc. It can be configured to work with various hardware and software systems.  
For more information, please refer to the EMGD User‘s Guide bundled with the EMGD  
Graphics Driver.  
7.5 Using MeeGo*  
This section provides step-by-step instructions for downloading, installing, and  
configuring MeeGo for the Intel® Atom™ Processor N2600/D2700/N2800.  
These step-by-step instructions have been used with the Intel Customer Reference  
Board (CRB) and are applicable to any Intel platform based on the Intel Atom  
Processor N2600/D2700/N2800 paired with Intel NM10 Express Chipset.  
For customers evaluating or using the Development Kit as a basis for their embedded  
design, and MeeGo* as their operating system, this is the primary guidance Intel  
provides for setting up the drivers and operating system.  
7.5.1  
Booting MeeGo*  
The MeeGo* project provides a Linux-based, open source software platform for the  
next generation of computing devices. The MeeGo software platform is designed to  
give developers the broadest range of device segments to target for their applications,  
including netbooks, handheld computing and communications devices, in-vehicle  
infotainment devices, smart TVs, tablets and more all using a uniform set of APIs  
based on Qt. For consumers, MeeGo will offer innovative application experiences that  
they can take from device to device. For more information, visit the MeeGo website at  
7.5.2  
Live Image on USB stick  
1. Insert and Format the USB stick.  
a.  
b.  
c.  
On Windows 7, right click on Computer.  
Click on Manage.  
On the Computer Management page, Select Storage>Disk Management  
on the Left hand side  
d.  
Remove any partitions or volumes. This is particularly important when  
you have used the USB stick for other Linux distributions or previous  
versions of MeeGo.  
2. Download the Beta MeeGo image.  
b. Choose the meego-netbook-ia32-*.img file  
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3. Download and install Win32 Disk Imager from:  
4. Use Win32DiskImager to put the image on your USB Stick  
5. Write the image to the USB stick by selecting Write.  
6. Insert the USB stick into the CRB.  
7. When you boot the BIOS be sure to select the USB stick as the primary boot drive.  
8. When the selection options appear, select the first option to Boot MeeGo.  
7.5.3  
Install with USB stick  
1. Insert and format the USB stick.  
a. On Windows 7, right click on Computer.  
b. Click on Manage.  
c. On the Computer Management page, Select Storage>Disk Management on the  
left hand side  
d. Remove any partitions or volumes. This is particularly important when you  
have used the USB stick for other Linux distributions or previous versions of MeeGo.  
2. Download the Beta MeeGo image.  
b. Choose the meego-netbook-ia32-*.img file  
3. Download and install Win32 Disk Imager from:  
4. Use Win32DiskImager to put the image on your USB Stick  
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5. Write the image to the USB stick by selecting Write.  
6. Insert the USB stick into the CRB.  
7. When you boot the BIOS be sure to select the USB stick as the primary boot drive.  
8. When the selection options appear, select the second option to Installation Only  
option.  
9. Follow the prompts to install.  
Note: MeeGo Bug number 23757 has been created recently due to a mismatch size of  
the GUI installer when BOTH the VGA and LVDS screens are attached. If you do not  
see the arrows or next buttons on the screen, you may press enter as the next buttons  
will be enabled by default. Or you can attach just one monitor for the installation  
procedure, and the GUI installer should size correctly.  
7.5.4  
Graphics Driver  
The MeeGo Graphics driver is integrated into the MeeGo Alpha image. Since the  
graphics capabilities are integrated in the image, no additional installations are  
required, and no additional configuring is required to benefit from the Linux based  
hardware accelerated graphics drivers. The source file for the stand alone files for the  
graphics drivers in MeeGo are at:  
7.5.5  
Flash  
Hardware accelerated flash for MeeGo can be downloaded from the following site:  
7.6 Using Yocto Project*  
This section provides step-by-step instructions for downloading the drivers for  
platforms featuring the Intel® NM10 chipset and the Embedded Graphics Driver for the  
Intel® Atom™ Processor N2600/D2700/N2800, to properly install and configure Yocto  
Project*.  
The step-by-step instructions in this section have been used with the Intel Customer  
Reference Board (CRB). The information in this quick start guide is applicable to any  
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Intel platform based on the Intel Atom Processor N2600/D2700/N2800 paired with  
Intel NM10 Express Chipset.  
For customers evaluating or using the Development Kit as a basis for their embedded  
design, and Yocto Project* to develop a custom Linux* operating system, as their  
operating system, this is the primary guidance Intel provides for setting up the drivers  
and operating system.  
7.6.1  
Booting Yocto Project*  
The Yocto Project* is an open source collaboration project that provides templates,  
tools and methods to help you create custom Linux-based systems for embedded  
products regardless of the hardware architecture. The Yocto Project* BSP used in this  
quick start guide is a custom Linux-based BSP that was generated using the Yocto  
Project tools and methods. See http://www.yoctoproject.org/ for more information.  
7.6.2  
Live Image on USB stick  
1. Insert and Format the USB stick.  
a. On Windows 7, right click on Computer.  
b. Click on Manage.  
c. On the Computer Management page, Select Storage>Disk Management on the  
Left hand side  
d. Remove any partitions or volumes on the USB Stick. This is particularly  
important when you have used the USB stick for other Linux distributions or  
previous versions of Yocto Project.  
2. Download the Yocto Project image.  
3. The image (and other supporting files) will be contained within a TAR.BZ2 (also  
known as a tarball) archive. Use the latest version of WinZip or 7-Zip to extract the  
image.  
a. The image filename should be similar to the following:  
core-image-sato-cedartrail.hdd.img  
b. If necessary change the file extension to .IMG.  
4. Download and install Win32 Disk Imager from:  
5. Use Win32DiskImager to put the image on your USB Stick  
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6. Write the image to the USB stick by selecting Write.  
7. Insert the USB stick into the CRB.  
8. When you boot the BIOS be sure to select the USB stick as the primary boot drive.  
9. When the Boot: prompt appears, you can type boot at the prompt. If you do not  
type anything the default behavior will be to boot off of the USB stick.  
7.6.3  
Install with USB stick  
1. Insert and Format the USB stick.  
a. On Windows 7, right click on Computer.  
b. Click on Manage.  
c. On the Computer Management page, Select Storage>Disk Management on the  
Left hand side  
d. Remove any partitions or volumes on the USB Stick. This is particularly  
important when you have used the USB stick for other Linux distributions or  
previous versions of Yocto Project.  
2. Download the Yocto Project image.  
3. The image (and other supporting files) will be contained within a TAR.BZ2 (also  
known as a tarball) archive. Use the latest version of WinZip or 7-Zip to extract the  
image.  
a. The image filename should be similar to the following:  
core-image-sato-cedartrail.hdd.img  
b. If necessary change the file extension to .IMG.  
4. Download and install Win32 Disk Imager from:  
5. Use Win32DiskImager to put the image on your USB Stick  
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6. Write the image to the USB stick by selecting Write.  
7. Insert the USB stick into the CRB.  
8. When you boot the BIOS be sure to select the USB stick as the primary boot drive.  
9. When the Boot: prompt appears, you must type install to install to the attached  
SATA drive.  
a. Note this prompt only remains on the screen for a few seconds, so you need to  
be prepared for it.  
10.  
You will be asked to confirm the drive you intend to install Yocto Project on.  
Type ‗Y‘ at the prompt to complete the installation to the drive.  
Note: The Yocto Project install will assume the entre drive will be used for Yocto  
Project. Dual boot options, discovery of existing partitions and OSs are not enabled.  
7.6.4  
Install with CD or DVD  
Currently installing via CD or DVD is not enabled.  
7.6.5  
Graphics Driver  
The preliminary Yocto Project* BSP graphics driver will be based on the standard Linux  
VESA driver. This VESA driver will not be able to take advantage of Intel‘s graphics  
engine. Closed source hardware accelerated graphics drivers will be incorporated into  
future releases of the Yocto Project* BSP.  
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8 Battery Disposal  
CAUTION  
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be  
recycled where possible. Disposal of used batteries must be in accordance with local  
environmental regulations.  
PRÉCAUTION  
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les  
piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des  
piles usagées doit respecter les réglementations locales en vigueur en matière de  
protection de l'environnement.  
FORHOLDSREGEL  
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør  
om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse  
med gældende miljølovgivning.  
OBS!  
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier  
bør kastes i henhold til gjeldende miljølovgivning.  
VIKTIGT!  
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras  
enligt de lokala miljövårdsbestämmelserna.  
VARO  
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on  
maghdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten  
mukaisesti.  
VORSICHT  
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie  
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen  
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des  
Herstellers entsprechend.  
AVVERTIMENTO  
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.  
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per  
disfarsi delle pile usate, seguire le istruzioni del produttore.  
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PRECAUCIÓN  
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice  
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del  
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del  
fabricante.  
WAARSCHUWING  
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type  
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het  
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.  
ATENÇÃO  
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.  
As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias  
usadas deve ser feita de acordo com as regulamentações ambientais da região.  
AŚCIAROŽZNAŚĆ  
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.  
Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых  
акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.  
UPOZORNÌNÍ  
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné,  
baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními  
předpisy o životním prostředí.  
Προσοχή  
Υπάπσει κίνδςνορ για έκπηξη ζε πεπίπηυζη πος η μπαηαπία ανηικαηαζηαθεί από μία  
λανθαζμένος ηύπος. Οι μπαηαπίερ θα ππέπει να ανακςκλώνονηαι όηαν κάηι ηέηοιο είναι  
δςναηό. Η απόππιτη ηυν σπηζιμοποιημένυν μπαηαπιών ππέπει να γίνεηαι ζύμθυνα με  
ηοςρ καηά ηόπο πεπιβαλλονηικούρ κανονιζμούρ.  
VIGYÁZAT  
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket  
lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi  
előírásoknak megfelelően kell kiselejtezni.  
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AWAS  
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri  
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi  
peraturan alam sekitar tempatan.  
OSTRZEŻENIE  
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu  
baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi  
przepisami ochrony środowiska.  
PRECAUŢIE  
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.  
Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să  
respecte reglementările locale privind protecţia mediului.  
ВНИМАНИЕ  
При использовании батареи несоответствующего типа существует риск ее взрыва.  
Батареи должны быть утилизированы по возможности. Утилизация батарей должна  
проводится по правилам, соответствующим местным требованиям.  
UPOZORNENIE  
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.  
Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí  
vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.  
POZOR  
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.  
Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi  
okoljevarstvenimi predpisi.  
UYARI  
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri  
dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.  
OСТОРОГА  
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.  
Якщо можливо, використані батареї слід утилізувати. Утилізація використаних  
батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.  
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