Huawei Drums ME909 User Manual

HUAWEI ME909 Series Mini PCIe Module

Hardware Guide

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Date

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2013-06-09

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HUAWEI ME909 Series Mini PCIe Module

Hardware Guide

About This Document

Revision History

Document Date

Version

Chapter Descriptions

0.1

2013-06-09

Creation

This is a draft version, and some chapters

are still with "TBD".

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HUAWEI ME909 Series Mini PCIe Module

Hardware Guide

Contents

1 Introduction....................................................................................................................................7

2 Overall Description ......................................................................................................................8

2.1 About This Chapter........................................................................................................................... 8

2.2 Function Overview............................................................................................................................ 8

2.3 Circuit Block Diagram....................................................................................................................... 9

3 Description of the Application Interfaces..............................................................................10

3.1 About This Chapter......................................................................................................................... 10

3.2 Mini PCIe Interface......................................................................................................................... 10

3.3 Power Sources and Ground s ......................................................................................................... 14

3.4 Power Supply Time Sequence....................................................................................................... 15

3.5 WAKE# Signal................................................................................................................................ 16

3.6 RESIN_N Signal............................................................................................................................. 16

3.7 W_DISABLE# Signal...................................................................................................................... 18

3.8 LED_WWAN# Signal...................................................................................................................... 18

3.9 USB Interface................................................................................................................................. 18

3.10 USIM Card Interface .................................................................................................................... 19

3.10.1 Overview.............................................................................................................................. 19

3.10.2 Circuit Recommended for the USIM Card Interface............................................................ 20

3.11 Audio Interface.............................................................................................................................. 21

3.12 RF Antenna Connector................................................................................................................. 22

3.13 Reserved Pins.............................................................................................................................. 23

3.14 NC Pins ........................................................................................................................................ 23

4 RF Specifications.........................................................................................................................25

4.1 About This Chapter......................................................................................................................... 25

4.2 Operating Frequencies................................................................................................................... 25

4.3 Conducted RF Measurement......................................................................................................... 26

4.3.1 Test Environment................................................................................................................... 26

4.3.2 Test Standards....................................................................................................................... 26

4.4 Conducted Rx Sensitivity and Tx Power........................................................................................ 26

4.4.1 Conducted Receive Sensitivity.............................................................................................. 26

4.4.2 Conducted Transmit Power ................................................................................................... 28

4.5 Antenna Design Requirements ...................................................................................................... 29

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Contents

4.5.1 Antenna Design Indicators..................................................................................................... 29

4.5.2 Interference ........................................................................................................................... 31

4.5.3 GSM/WCDMA/GPS Antenna Requirements......................................................................... 31

4.5.4 Radio Test Environment ........................................................................................................ 32

5 Electrical and Reliability Features...........................................................................................34

5.1 About This Chapter......................................................................................................................... 34

5.2 Absolute Ratings ............................................................................................................................ 34

5.3 Operating and Storage Temperatures and Humidity...................................................................... 35

5.4 Electrical Features of USIM ........................................................................................................... 35

5.5 Electrical Features of Application Interfaces .................................................................................. 35

5.6 Power Supply Features.................................................................................................................. 36

5.6.1 Input Power Supply ............................................................................................................... 36

5.6.2 Power Consumption .............................................................................................................. 37

5.7 Reliability Features......................................................................................................................... 42

5.8 EMC and ESD Features................................................................................................................. 43

6 Mechanical Specifications.........................................................................................................45

6.1 About This Chapter......................................................................................................................... 45

6.2 Dimensions and Interfaces............................................................................................................. 45

6.3 Dimensions of the Mini PCI Express Connector............................................................................ 46

6.4 Specification Selection for Fasteners............................................................................................. 47

6.4.1 Installing the Mini PCIe Adapter on the Main Board.............................................................. 47

6.4.2 Removing the Mini PCIe Adapter from the Main Board ........................................................ 49

7 Certifications................................................................................................................................51

7.1 About This Chapter......................................................................................................................... 51

7.2 Certifications................................................................................................................................... 51

8 Safety Information......................................................................................................................52

8.1 Interference .................................................................................................................................... 52

8.2 Medical Device............................................................................................................................... 52

8.3 Area with Inflammables and Explosives......................................................................................... 52

8.4 Traffic Security................................................................................................................................ 53

8.5 Airline Security................................................................................................................................ 53

8.6 Safety of Children........................................................................................................................... 53

8.7 Environment Protection.................................................................................................................. 53

8.8 WEEE Approval.............................................................................................................................. 53

8.9 RoHS Approval............................................................................................................................... 53

8.10 Laws and Regulations Observance ............................................................................................. 54

8.11 Care and Maintenance ................................................................................................................. 54

8.12 Emergency Call............................................................................................................................ 54

8.13 Regulatory Information................................................................................................................. 54

8.13.1 CE Approval (European Union) ........................................................................................... 54

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Contents

8.13.2 FCC Statement.................................................................................................................... 55

9 Appendix A Circuit of Typical Interface................................................................................56

10 Appendix B Acronyms and Abbreviations..........................................................................57

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HUAWEI ME909 Series Mini PCIe Module

Hardware Guide

Introduction

This document describes the hardware application interfaces and air interfaces

provided by HUAWEI ME909 Series Mini PCIe Module, including ME909u-521,

ME909u-121 and ME909u-721 (hereinafter referred to as the ME909 module).

This document helps hardware engineer to understand the interface specifications,

electrical features and related product information of the ME909 module.

Table 1-1 ME909 series product name

Product name

ME909u-521

ME909u-121

ME909u-721

Description

State

LTE Module for Europe.

LTE Module for North America.

LTE Module for Japan.

Under development

Planning

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HUAWEI ME909 Series Mini PCIe Module

Hardware Guide

Overall Description

2.1 About This Chapter

This chapter gives a general description of the ME909 module and provides:



Function Overview



Circuit Block Diagram

2.2 Function Overview

Table 2-1 Features

Feature

Description



Physical

Dimensions

Dimensions (L × W × H): 51 mm × 30.4 mm × 3.35 mm

Weight: about 12 g

Operating

–20°C to +60°C

Temperature

Storage

–40°C to +85°C

Temperature

Power

DC 3.0 V–3.6 V (typical value is 3.3 V)

Voltage

Application

Interface

One standard USIM (Universal Subscriber Identity Module) card

(Class B and Class C)

(52-pin Mini

PCIe interface

Audio interface: PCM interface

USB 2.0 (High Speed)

RESIN_N: Reset module

WAKE#: Wake up signal

W_DISABLE# Signal (the software version is planning.)

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Overall Description

Feature

Description

LED_WWAN#: Active-low LED signal indicating the state of the

module (the software is under development)

Antenna

connector

WWAN MAIN antenna connector x1

WWAN AUX antenna connector x1

GPS antenna connector x1

2.3 Circuit Block Diagram

Figure 2-1 shows the circuit block diagram of the ME909 Mini PCIe Adapter. The

major functional unit of the Mini PCIe Adapter contains the following parts:



DCDC Circuit



LGA Module



Control signals



Antenna Connectors

Figure 2-1 Circuit block diagram of the ME909 module

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HUAWEI ME909 Series Mini PCIe Module

Hardware Guide

Description of the Application Interfaces

3.1 About This Chapter

This chapter mainly describes the external application interfaces of the ME909

module, including:



Mini PCIe Interface



Power Sources and Grounds

Power Supply Time Sequence

WAKE# Signal

RESIN_N Signal

W_DISABLE# Signal

LED_WWAN# Signal

USB Interface

USIM Card Interface

Audio Interface

RF Antenna Connector

Reserved Pins

NC Pins

3.2 Mini PCIe Interface

The ME909 module uses a Mini-PCIe interface as its external interface. For details

about the module and dimensions, see “6.2 Dimensions and Interfaces”.

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Hardware Guide

Description of the Application Interfaces

Figure 3-1 shows the sequence of pins on the interface of the Mini PCIe Adapter.

Figure 3-1 Sequence of Mini-PCIe interface

T a ble 3-1 shows the pin definitions of the Mini PCIe Interface.

Table 3-1 Pin definitions of the Mini PCIe interface

No.

Pin Name

I/O

Description

DC Characteristics (V)

Mini PCI

Express

HUAWEI Pin

Description

Min.

Typ.

Max.

Standard

Description

WAKE#

3.3Vaux

WAKE#

Open collector

–0.3

active low signal.

This signal is used

to wake up the host.

VCC_3V3

3.3 V DC supply

rails from the PC

side.

3.0

3.3

3.6

COEX1

GND

Not connected

Ground

GND

COEX2

1.5 V

Not connected

CLKREQ#

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Hardware Guide

Description of the Application Interfaces

No.

Pin Name

I/O

Description

DC Characteristics (V)

Mini PCI

Express

HUAWEI Pin

Description

Min.

Typ.

Max.

Standard

Description

UIM_PWR

Power source for

the external USIM

card

1.8/2.85

GND

Ground

UIM_DATA

I/O

External USIM data

signal

1.8/2.85

REFCLK-

UIM_CLK

Not connected

UIM_CLK

External USIM clock

signal

1.8/2.85

REFCLK+

Not connected

UIM_RESET

External USIM reset

signal

1.8/2.85

GND

Ground

UIM_Vpp

Reserved

GND

Not connected

Reserved

Ground

Reserved

GND

Reserved

W_DISABLE#

Reserved

W_DISABLE#

Reserved

The W_DISABLE#

signal is an active

low signal that when

asserted (driven

low) by the system

shall disable radio

operation.

The software

version is planning.

GND

Ground

PERST#

RESIN_N

Reset module

Active-low

PERn0

Not connected

3.3Vaux

VCC_3V3

3.3 V DC supply

rails from the PC

side.

3.0

3.3

3.6

PERp0

Not connected

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Hardware Guide

Description of the Application Interfaces

No.

Pin Name

I/O

Description

DC Characteristics (V)

Mini PCI

Express

HUAWEI Pin

Description

Min.

Typ.

Max.

Standard

Description

GND

Ground

GND

Ground

1.5 V

Not connected

Ground

GND

SMB_CLK

PETn0

SMB_DATA

PETp0

GND

Not connected

Ground

GND

USB_DM

GND

USB_DP

VCC_3V3

GND

Ground

USB_D-

GND

I/O

USB signal D-

Ground

USB_D+

3.3Vaux

I/O

USB signal D+

3.3 V DC supply

rails from the PC

side.

3.0

3.3

3.6

GND

Ground

3.3Vaux

VCC_3V3

3.3 V DC supply

rails from the PC

side

3.0

3.3

3.6

LED_WWAN#

Active-low LED

signal indicating the

state of the card.

The software

feature is under

development and

don't support this

function now.

Drive strength: 10

GND

Ground

LED_WLAN#

Reserved

Not connected

PCM_CLK

PCM interface clock –0.3

1.8

2.1

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Hardware Guide

Description of the Application Interfaces

No.

Pin Name

I/O

Description

DC Characteristics (V)

Mini PCI

Express

HUAWEI Pin

Description

Min.

Typ.

Max.

Standard

Description

LED_WPAN#

Reserved

1.5 V

Not connected

PCM I/F data out

Not connected

PCM I/F data in

Ground

PCM_DOUT

–0.3

1.8

2.1

Reserved

GND

PCM_DIN

GND

–0.3

1.8

2.1

Reserved

3.3Vaux

PCM_SYNC

VCC_3V3

PCM interface sync –0.3

1.8

3.3

2.1

3.6

3.3 V DC supply rail 3.0

from the PC side.



P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital

signal output. AI indicates pins for analog signal input.

The Reserved pins are internally connected to the module. Therefore, these pins should not

be used, otherwise they may cause problems. Please contact with us for more details about

this information.



The NC (Not Connected) pins are floating and there are no signal connected to these pins.

Therefore, these pins should not be used.

3.3 Power Sources and Grounds

For the Mini PCIe Adapter, +3.3 Vaux is the only voltage supply that is available. The

input voltage is 3.3 V±9%, as specified by PCI Express Mini CEM Specifications 1.2.

Table 3-2 Power and ground specifications

Pin No.

Pin Name

Minimum Typical

Maximum

2, 24, 39, 41 and 52

VCC_3V3

3.0 V

3.3 V

3.6 V

4, 9, 15, 18, 21, 26, 27,

29, 34, 35, 37, 40, 43,

and 50

GND

To minimize the RF radiation through the power lines, it is suggested to add ceramic capacitors

of 10 pF and 100 nF in the power lines beside the Mini PCIe connector on the host side.

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Hardware Guide

Description of the Application Interfaces

3.4 Power Supply Time Sequence

Power on sequence

Do not toggle RESIN_N pin during the power on sequence. Pulling RESIN_N pin low

will extend time for module startup.

Figure 3-2 Power on timing sequence

Parameter

Remarks

Time (Nominal value)

Unit

T_PD+

Power Valid to USB

D+ high

Power off Sequence

Cutting off 3.3 V will power off the module.

Figure 3-3 Power off timing sequence

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Description of the Application Interfaces

3.5 WAKE# Signal

WAKE# pin (the signal that the module uses to wake up the PC) supports software

control.

This signal is used for module to wake up the host. It is designed as an OC gate, so it

should be pulled up by the host and it is active-low.

When the module wakes up the host, the BB Chip hold 1s high-level-voltage pulse

and then module output low-level-voltage to wake the host.

Figure 3-4 Connections of the WAKE# pin

3.6 RESIN_N Signal

The RESIN_N pin is used to reset the module's system. When the module software

stops responding, the RESIN_N pin can be pulled down to reset the module

hardware.

The RESIN_N signal is internally pulled up to 1.8 V, which is automatically on when

3.3 V is applied and it is active-low.

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Description of the Application Interfaces

Figure 3-5 Connections of the RESIN_N pin

As the RESIN_N signal are relatively sensitive, it is recommended that you install a 10

nF to 0.1 µF capacitor near the RESIN_N pin of the interface for filtering. In addition,

when you design a circuit on the PCB of the interface board, it is recommended that

the circuit length should not exceed 20 mm and that the circuit should be kept at a

distance of 2.54 mm (100 mil) at least from the PCB edge. Furthermore, you need to

wrap the area adjacent to the signal wire with a ground wire. Otherwise, the module

may be reset due to interference.

The ME909 module supports hardware reset function. If the software of the ME909

module stops responding, you can reset the hardware through the RESIN_N signal as

shown in F ‎ igure 3-6 . When a low-level pulse is supplied through the RESIN_N pin, the

hardware will be reset. After the hardware is reset, the software starts powering on the

module and reports relevant information according to the actual settings. For example,

the AT command automatically reports ^SYSSTART.

Figure 3-6 Reset pulse timing



The RESIN_N pin must not be pulled down for more than 1s.



The RESIN_N pin is optional, which can be not connected.



The maximum Forward Voltage Drop of the diode used in the module is 0.6 V.

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Description of the Application Interfaces

3.7 W_DISABLE# Signal

The W_DISABLE# signal is provided to allow users to disable wireless

communications of the module.

The software version is planning.

3.8 LED_WWAN# Signal

ME909 provides a LED_WWAN# signal to indicate the RF status.

The ME909 module does not support this function because the software feature is

under development. The planning drive strength is10 mA.

External Circuits

‎Figure 3-7 shows the recommended circuits of the LED_WWAN# pin. According to

LED feature, you can adjust the LED brightness by adjusting the resistance of resistor

Figure 3-7 Driving circuit

3.9 USB Interface

The ME909 module is compliant with USB 2.0 protocol. The USB interface is powered

directly from the VBAT supply. The USB input/output lines are compatible with the

USB 2.0 signal specifications. ‎Figure 3-8 shows the circuit of the USB interface.

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Description of the Application Interfaces

Table 3-3 Definition of the USB interface

Pin No. Pin Name

I/O Description

DC Characteristics (V)

Min. Typ.

Max.

USB_DM

USB_DP

I/O USB signal D-

I/O USB signal D+

According to USB protocol, for bus timing or electrical characteristics of ME909 USB

signal, please refer to the chapter 7.3.2 of Universal Serial Bus Specification 2.0.

Figure 3-8 Recommended circuit of USB interface

3.10 USIM Card Interface

3.10.1 Overview

The ME909 module provides a USIM card interface complying with the ISO 7816-3

standard and supports both Class B and Class C USIM cards.

Table 3-4 USIM card interface signals

Pin Pin Name

No.

I/O Description

DC Characteristics (V)

Min.

Typ.

Max.

External USIM

reset signal.

UIM_RESET

UIM_CLK

1.8/2.85

External USIM

clock signal

1.8/2.85

External USIM

I/O

UIM_DATA

data signal

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Hardware Guide

Description of the Application Interfaces

Pin Pin Name

No.

I/O Description

DC Characteristics (V)

Min.

Typ.

Max.

Power source for

the external

UIM_PWR

1.8/2.85

USIM card

3.10.2 Circuit Recommended for the USIM Card Interface

As the Mini PCIe Adapter is not equipped with an USIM socket, you need to place an

USIM socket on the user interface board.

‎Figure 3-9 shows the circuit of the USIM card interface.

Figure 3-9 Circuit of the USIM card interface

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Description of the Application Interfaces



To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic

compatibility (EMC) authentication, the USIM socket should be placed near the

PCIe interface (it is recommended that the PCB circuit connects the PCIe interface

and the USIM socket does not exceed 100 mm), because a long circuit may lead to

wave distortion, thus affecting signal quality.



It is recommended that you wrap the area adjacent to the UIM_CLK and

UIM_DATA signal wires with ground. The Ground pin of the USIM socket and the

Ground pin of the USIM card must be well connected to the power Ground pin

supplying power to the PCIe Adapter.

A 100 nF capacitor and1 μF capacitor are placed between the UIM_PWR and GND

pins in a parallel manner (If UIM_PWR circuit is too long, that the larger

capacitance such as 4.7 μF can be employed if necessary). Three 33 pF

capacitors are placed between the UIM_DATA and Ground pins, the UIM_RESET

and Ground pins, and the UIM_CLK and Ground pins in parallel to filter

interference from RF signals.



It is recommended to take electrostatic discharge (ESD) protection measures near

the USIM card socket. The TVS diode with Vrwm of 5 V and junction capacitance

less than 10 pF must be placed as close as possible to the USIM socket, and the

Ground pin of the ESD protection component is well connected to the power

Ground pin that supplies power to the PCIe Adapter.

3.11 Audio Interface

The ME909 module provides one PCM digital audio interface. T ‎ able 3-5 lists the

signals on the digital audio interface.

The software feature of PCM is planning.

Table 3-5 Signals on the digital audio interface

No.

Pin Name

I/O

Description

DC Characteristics (V)

Min.

–0.3

Typ.

1.8

Max.

2.1

PCM_CLK

PCM_DIN

PCM clock

PCM data input

PCM interface sync

PCM data output

1.8

2.1

PCM_SYNC

PCM_DOUT

1.8

2.1

1.8

2.1

The ME909 module interface enables communication with an external codec to

support linear format.

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HUAWEI ME909 Series Mini PCIe Module

Hardware Guide

Description of the Application Interfaces

Figure 3-10 Circuit diagram of the interface of the PCM (ME909 module is used as PCM

master)



PCM_SYNC: Output when PCM is in master mode;



PCM_CLK: Output when PCM is in master mode;



The PCM function of ME909 only supports master mode;



It is recommended that a TVS be used on the related interface, to prevent electrostatic

discharge and protect integrated circuit (IC) components.

3.12 RF Antenna Connector

The ME909 module provides three antenna connectors (MAIN, GPS and AUX) for

connecting the external antennas.

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Hardware Guide

Description of the Application Interfaces

Figure 3-11 RF antenna connectors

AUX

GPS

MAIN

The antenna connectors must be used with coaxial cables with characteristic

impedance of 50‎Ω.

3.13 Reserved Pins

The ME909 module provides 2 reserved pins. All of reserved pins cannot be used by

the customer.

Table 3-6 Reserved pins

Pin No.

Pin Name

I/O

Description

17, 19

Reserved

Reserved, please keep open.

3.14 NC Pins

The ME909 module has 17 NC pins. All of NC pins should not be connected. Please

keep these pins open.

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Description of the Application Interfaces

Table 3-7 NC pins

Pin No.

Pin Name

I/O

Description

3, 5–7, 11, 13, 16, 23, 25, 28,

30–33, 44, 46, 48

Not connected, please

keep open.

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HUAWEI ME909 Series Mini PCIe Module

Hardware Guide

RF Specifications

4.1 About This Chapter

This chapter describes the RF specifications of the ME909 module, including:



Operating Frequencies



Conducted RF Measurement



Conducted Rx Sensitivity and Tx Power



Antenna Design Requirements

4.2 Operating Frequencies

‎T a ble 4-1 shows the RF bands supported by the ME909u-521 module.

Table 4-1 RF bands of ME909u-521

Operating Band

UMTS Band I

UMTS Band II

UMTS Band V

UMTS Band VIII

GSM 850

1920 MHz–1980 MHz

1850 MHz–1910 MHz

824 MHz–849 MHz

880 MHz–915 MHz

824 MHz–849 MHz

880 MHz–915 MHz

1710 MHz–1785 MHz

1850 MHz–1910 MHz

1920 MHz–1980 MHz

1850 MHz–1910 MHz

1710 MHz–1785 MHz

2110 MHz–2170 MHz

1930 MHz–1990 MHz

869 MHz–894 MHz

925 MHz–960 MHz

869 MHz–894 MHz

925 MHz–960 MHz

1805 MHz–1880 MHz

1930 MHz–1990 MHz

2110 MHz–2170 MHz

1930 MHz–1990 MHz

1805 MHz–1880 MHz

GSM 900

GSM 1800(DCS)

GSM 1900(PCS)

LTE Band I

LTE Band II

LTE Band III

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RF Specifications

Operating Band

LTE Band V

LTE Band VIII

LTE Band VII

LTE Band XX

GPS L1

824 MHz–849 MHz

869 MHz–894 MHz

880 MHz–915 MHz

925 MHz–960 MHz

2500 MHz–2570 MHz

2620 MHz–2690 MHz

791 MHz–821 MHz

832 MHz–862 MHz

1574.42 MHz–1576.42 MHz

1597.55 MHz–1605.89 MHz

GLONASS

4.3 Conducted RF Measurement

4.3.1 Test Environment

Test instrument

Power supply

R&S CMU200, R&S CMW500 ,Agilent E5515C

Keithley 2303, Agilent 66319

RF cable for testing L08-C014-350 of DRAKA COMTEQ or Rosenberger

Cable length: 29 cm



The compensation for different frequency bands relates to the cable and the test

environment.



The instrument compensation needs to be set according to the actual cable conditions.

4.3.2 Test Standards

Huawei modules meet 3GPP TS 51.010-1, 3GPP TS 34.121-1 and 3GPP TS

36.521-1 test standards. Each module passes strict tests at the factory and thus the

quality of the modules is guaranteed.

4.4 Conducted Rx Sensitivity and Tx Power

4.4.1 Conducted Receive Sensitivity

The conducted receive sensitivity is a key parameter that indicates the receiver

performance of ME909u-521 module. The conducted receive sensitivity refers to the

weakest signal that the module at the antenna port can receive. The BER must meet

the 3GPP protocol requirements in the case of the minimum signal.

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The 3GPP Protocol Claim column in ‎T a ble 4-2 lists the required minimum values,

and the Test Value column lists the tested values of the ME909u-521 module.

Table 4-2 ME909u-521 module conducted Rx sensitivity (Unit: dBm)

Band

Typical

TBD

Note

GSM 850

GSM 900

DCS1800

PCS 1900

TBD

WCDMA B1 Main Rx TBD

WCDMA B2 Main Rx TBD

WCDMA B5 Main Rx TBD

WCDMA B8 Main Rx TBD

LTE B1 RX

LTE B2 RX

LTE B3 RX

LTE B5 RX

LTE B7 RX

LTE B8 RX

LTE B20 RX

TBD

Table 4-3 ME909u-521 module GPS main characteristics

Item

Type Value

TBD

Receive Sensitivity (Cold start)

Receive Sensitivity (Hot start)

TBD

Receive Sensitivity (Tracking

mode)

TBD

TTFF@-130dBm (Cold start)

TTFF@-130dBm (Hot start)

TBD

The test values are the average of some test samples.

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4.4.2 Conducted Transmit Power

The conducted transmit power is another indicator that measures the performance of

ME909u-521 module. The conducted transmit power refers to the maximum power

that the module tested at the antenna connector can transmit. According to the 3GPP

protocol, the required transmit power varies with the power class.

‎T a ble 4-4 lists the required ranges of the conducted transmit power of the

ME909u-521 module. The tested values listed in the Test Value column must range

from the minimum power to the maximum power.

Table 4-4 ME909u-521 module conducted Tx power (unit: dBm)

Band

Typical

TBD

Note

GSM 850

GSM 900

DCS1800

PCS 1900

WCDMA B1

WCDMA B2

WCDMA B5

WCDMA B8

LTE B1 RX

LTE B2 RX

LTE B3 RX

LTE B5 RX

LTE B7 RX

LTE B8 RX

LTE B20 RX

Maximum Power Reduction (MPR) of LTE is according to 3GPP TS 36.521-1 as below.

Modulation

QPSK

RB Allocation

≥ 1 RB, ≤ Partial RB

> Partial RB

MPR(dB)

QPSK

≤ 1

≤ 2

16QAM

≥ 1 RB, ≤ Partial RB

> Partial RB

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4.5 Antenna Design Requirements

4.5.1 Antenna Design Indicators

Antenna Efficiency

Antenna efficiency is the ratio of the input power to the radiated or received power of

an antenna. The radiated power of an antenna is always lower than the input power

due to the following antenna losses: return loss, material loss, and coupling loss. The

efficiency of an antenna relates to its electrical dimensions. To be specific, the

antenna efficiency increases with the electrical dimensions. In addition, the

transmission cable from the antenna connector of PCIe Adapter to the antenna is also

part of the antenna. The cable loss increases with the cable length and the frequency.

It is recommended that the cable loss is as low as possible, for example,

MXHP32HP1000 made by Murata or equivalent.

The following antenna efficiency (free space) is recommended for ME909 module to

ensure high radio performance of the module:



Efficiency of the primary antenna: ≥ 40% (below 960 MHz); ≥ 50% (over 1710

MHz)



Efficiency of the diversity antenna: ≥ half of the efficiency of the primary

antenna in receiving band



Efficiency of the GPS antenna: ≥ 50%

In addition, the efficiency should be tested with the transmission cable.

S11 or VSWR

S11 indicates the degree to which the input impedance of an antenna matches the

reference impedance (50 Ω). S11 shows the resonance feature and impedance

bandwidth of an antenna. Voltage standing wave ratio (VSWR) is another expression

of S11. S11 relates to the antenna efficiency. S11 can be measured with a vector

analyzer.

The following S11 value is recommended for the antenna of ME909 module:



S11 of the primary antenna: ≤ –6 dB



S11 of the diversity antenna: ≤ –6 dB



S11 of the GPS antenna: ≤ –10 dB

In addition, S11 is less important than the efficiency, and S11 has weak correlation to

wireless performance.

Isolation

For a wireless device with multiple antennas, the power of different antennas is

coupled with each other. Antenna isolation is used to measure the power coupling.

The power radiated by an antenna might be received by an adjacent antenna, which

decreases the antenna radiation efficiency and affects the running of other devices. To

avoid this problem, evaluate the antenna isolation as sufficiently as possible at the

early stage of antenna design.

Antenna isolation depends on the following factors:

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

Distance between antennas



Antenna type



Antenna direction

The primary antenna must be placed as near as possible to the ME909 module to

minimize the cable length. The diversity antenna needs to be installed

perpendicularly to the primary antenna. The diversity antenna can be placed farther

away from the ME909 module. Antenna isolation can be measured with a two-port

vector network analyzer.

The following antenna isolation is recommended for the antennas on laptops:



Isolation between the primary and diversity antennas: ≤ –12 dB



Isolation between the primary(diversity) antenna and the GPS antenna: ≤

–15 dB



Isolation between the primary antenna and the Wi-Fi antenna: ≤ –15 dB

Polarization

The polarization of an antenna is the orientation of the electric field vector that rotates

with time in the direction of maximum radiation.

The linear polarization is recommended for the antenna of ME909 module.

Radiation Pattern

The radiation pattern of an antenna reflects the radiation features of the antenna in the

remote field region. The radiation pattern of an antenna commonly describes the

power or field strength of the radiated electromagnetic waves in various directions

from‎the‎antenna.‎The‎power‎or‎field‎strength‎varies‎with‎the‎angular‎coordinates‎(θ‎

and‎φ),‎but‎is‎independent‎of‎the‎radial coordinates.

The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal

plane, and the incident waves of base stations are often in the horizontal plane. For

this reason, the receiving performance is optimal.

The following radiation patterns are recommended for the antenna of ME909 module.

Primary/Diversity/GPS antenna: omnidirectional

In addition, the diversity‎antenna’s pattern should be complementary with the

primary’s.

Envelope Correlation Coefficient

The envelope correlation coefficient indicates the correlation between different

antennas in a multi-antenna system (primary antenna, diversity antenna, and MIMO

antenna). The correlation coefficient shows the similarity of radiation patterns, that is,

amplitude and phase, of the antennas. The ideal correlation coefficient of a diversity

antenna system or a MIMO antenna system is 0. A small value of the envelope

correlation coefficient between the primary antenna and the diversity antenna

indicates a high diversity gain. The envelope correlation coefficient depends on the

following factors:



Distance between antennas



Antenna type

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

Antenna direction

The antenna correlation coefficient differs from the antenna isolation. Sufficient

antenna isolation does not represent a satisfactory correlation coefficient. For this

reason, the two indicators need to be evaluated separately.

For the antennas on laptops, the recommended envelope correlation coefficient

between the primary antenna and the diversity antenna is smaller than 0.5.

Gain and Directivity

The radiation pattern of an antenna represents the field strength of the radiated

electromagnetic waves in all directions, but not the power density that the antenna

radiates in the specific direction. The directivity of an antenna, however, measures the

power density that the antenna radiates.

Gain, as another important parameter of antennas, correlates closely to the directivity.

The gain of an antenna takes both the directivity and the efficiency of the antenna into

account. The appropriate antenna gain prolongs the service life of relevant batteries.

The following antenna gain is recommended for ME909 module. Gain of the

primary/diversity antenna ≤ 2.5 dBi



The antenna consists of the antenna body and the relevant RF transmission cable. Take the

RF transmission cable into account when measuring any of the preceding antenna

indicators.



Huawei cooperates with various famous antenna suppliers who are able to make

suggestions on antenna design, for example, Amphenol, Skycross, etc.

4.5.2 Interference

Besides the antenna performance, the interference on the user board also affects the

radio performance (especially the TIS) of the module. To guarantee high performance

of the module, the interference sources on the user board must be properly controlled.

On the user board, there are various interference sources, such as the LCD, CPU,

audio circuits, and power supply. All the interference sources emit interference signals

that affect the normal operation of the module. For example, the module sensitivity

can be decreased due to interference signals. Therefore, during the design, you need

to consider how to reduce the effects of interference sources on the module. You can

take the following measures: Use an LCD with optimized performance; shield the LCD

interference signals; shield the signal cable of the board; or design filter circuits.

Huawei is able to make technical suggestions on radio performance improvement of

the module.

4.5.3 GSM/WCDMA/GPS Antenna Requirements

The antenna for ME909 module must fulfill the following requirements:

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Antenna Requirements

Frequency range

Depending on frequency band(s) provided by the network

operator, the customer must use the most suitable

antenna for that/those band(s)

Bandwidth of main

antenna

70 MHz in GSM850

80 MHz in GSM900

170 MHz in DCS

140 MHz in PCS

250 MHz in WCDMA /LTE Band 1

140 MHz in WCDMA/LTE Band 2

70 MHz in WCDMA/LTE Band 5

80 MHz in WCDMA/LTE Band 8

170 MHz in LTE Band 3

190 MHz in LTE Band 7

71 MHz in LTE Band 20

Bandwidth of diversity

antenna

25 MHz in GSM850

35 MHz in GSM900

75 MHz in DCS

60 MHz in PCS

60 MHz in WCDMA/LTE Band 1

60 MHz in WCDMA/LTE Band 2

25 MHz in WCDMA/LTE Band 5

35 MHz in WCDMA/LTE Band 8

75 MHz in LTE Band 3

70 MHz in LTE Band 7

30 MHz in LTE Band 20

35 MHz in GNSS

Gain

≤ 2.5 dBi

Impedance

50 Ω‎

VSWR absolute max

VSWR recommended

≤ 3:1(≤2:1 for GPS antenna)

≤ 2:1(≤1.5:1 for GPS antenna)

4.5.4 Radio Test Environment

The antenna efficiency, antenna gain, radiation pattern, total radiated power (TRP),

and TIS can be tested in a microwave testing chamber.

Huawei has a complete set of OTA test environments (SATIMO microwave testing

chambers and ETS microwave testing chambers). The testing chambers are certified

by professional organizations and are applicable to testing at frequencies ranging

from 380 MHz to 6 GHz. The test items are described as follows:

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Passive Tests



Antenna efficiency

Gain

Pattern shape

Envelope correlation coefficient

Active Tests



TRP: GSM, WCDMA, CDMA, TD-SCDMA, and LTE systems

TIS: GSM, WCDMA, CDMA, TD-SCDMA, and LTE systems

‎Figure 4-1 shows the SATIMO microwave testing chamber.

Figure 4-1 SATIMO microwave testing chamber

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5.1 About This Chapter

This chapter describes the electrical and reliability features of the interfaces in the

ME909 module, including:



Absolute Ratings



Operating and Storage T e mperatures and Humidity



Electrical Features of USIM



Power Supply Features



Reliability Features



EMC and ESD Features

5.2 Absolute Ratings

‎T a ble 5-1 lists the absolute ratings for the ME909 module. Using the module beyond

these conditions may result in permanent damage to the module.

Table 5-1 Absolute ratings for the ME909 module

Symbol

VCC_3V3

Specification

Min.

–0.3

Max.

4.0

Unit

External power voltage

Digital input voltage

2.16

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5.3 Operating and Storage Temperatures and Humidity

‎T a ble 5-2 lists the operating and storage temperatures and humidity for the ME909

module.

Table 5-2 Operating and storage temperatures and humidity for the ME909 module

Specification

Min.

–20

Max.

+60

Unit

°C

Normal working temperatures^[1]

Ambient temperature for storage

–40

+85

°C

[1]: When the ME909 module works at this temperature, all its RF indexes comply with the

3GPP TS 45.005 and 3GPP TS 34.121-1 specifications.

5.4 Electrical Features of USIM

Table 5-3 Electrical features of Digital Pins in the I/O supply domain of the USIM

Interface

Parameter Description

Minimum Value Maximum Value

Unit

V_IH

Logic high-level 0.65 x V_{DD_PX}

V_{DD_PX}+ 0.3

input voltage

V_IL

Logic low-level

input voltage

–0.3

0.35 x V_{DD_PX}

V_OH

V_OL

Logic high-level V_{DD_PX}–0.45

output voltage

V_{DD_PX}

Logic low-level

output voltage

0.45

5.5 Electrical Features of Application Interfaces

‎T a ble 5-4 lists electrical features (typical values).

Table 5-4 Electrical features of application interfaces

Parameter Description

Minimum Value Maximum Value

Unit

V_IH

Logic high-level 0.65 x V_{DD_PX}

input voltage

V_{DD_PX}+ 0.3

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Parameter Description

Minimum Value Maximum Value

–0.3 0.35 x V_{DD_PX}

Unit

V_IL

Logic low-level

input voltage

V_OH

V_OL

Logic high-level V_{DD_PX}–0.45

output voltage

V_{DD_PX}

Logic low-level

output voltage

0.45

5.6 Power Supply Features

5.6.1 Input Power Supply

‎T a ble 5-5 lists the requirements for input power of the ME909 module.

Table 5-5 Requirements for input power for the ME909 module

Parameter Min.

Typ.

Max.

Ripple

Unit

VCC_3V3 3.0

3.3

3.6

0.05

Figure 5-1 Power Supply During Burst Emission

The VCC_3V3 minimum value must be guaranteed during the burst (with 2.7 A Peak in GSM 2

slot mode). So A low-dropout (LDO) regulator or switch power with current output of more than

3.5 A is strongly recommended for external power supply.

Table 5-6 Requirements for input current of the ME909 module

Power

Module

Peak (GSM 2

slot)

Normal

(WCDMA)

Normal (LTE

23dbm)

VCC_3V3

ME909

2750 mA

1100mA

1200 mA

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5.6.2 Power Consumption

The power consumptions of ME909 module in different scenarios are respectively

listed in ‎T a ble 5-7 , ‎T a ble 5-8 , ‎T a ble 5-9 and ‎T a ble 5-10 .

The power consumption listed in this section is tested when the power supply of the

ME909 module is 3.3 V. Typical values are measured at room temperature, and

minimum and maximum values are measured over the entire operating temperature

range.

Table 5-7 Averaged standby DC power consumption

Description

Bands

Test Value Units Notes/Configuration

LTE

bands

LTE

TBD

DRX cycle=8 (2.56 s)

(Standby)

Module is registered on

and not connected to the

4G network.

USB is in suspend mode.

HSPA+/WCDMA

(Standby)

UMTS

bands

DRX cycle=8 (2.56 s)

Module is registered on

and not connected to the

3G network.

USB is in suspend mode.

GSM/

GPRS/EDGE

GSM

bands

MFRMS=5 (1.175 s)

Module is registered on

and not connected to the

2G network.

(Standby)

USB is in suspend mode.

LTE

bands

Module is powered up and

idle

(Idle)

DRX cycle=8 (2.56 s)

Module is registered on

the 4G network, and PDP

is activated,

No data transmission.

USB is not in suspend

mode.

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Description

Bands

Test Value Units Notes/Configuration

HSPA+/WCDMA

(Idle)

UMTS

bands

TBD

Module is powered up and

idle

DRX cycle=8 (2.56 s)

Module is registered on

the 3G network, and PDP

is activated,

No data transmission.

USB is not in suspend

mode.

GSM/

GPRS/EDGE

GSM

bands

TBD

Module power up and idle

MFRMS=5 (1.175 s)

(Idle)

Module is registered on

the 2G network, and PDP

is activated,

No data transmission.

USB is not in suspend

mode.

Radio Off

Any band TBD

Flight mode

USB is in suspend mode.

Table 5-8 DC power consumption of ME909u-521(WCDMA/HSDPA/LTE)

Description

Band

Test Value Units

Power (dBm)

WCDMA

Band I (IMT2100) TBD

1 dBm Tx Power

10 dBm Tx Power

23.5 dBm Tx Power

1 dBm Tx Power

10 dBm Tx Power

23.5 dBm Tx Power

1 dBm Tx Power

TBD

Band II

TBD

(PCS 1900)

Band V

(850 MHz)

TBD

10 dBm Tx Power

23.5 dBm Tx Power

1 dBm Tx Power

10 dBm Tx Power

23.5 dBm Tx Power

1 dBm Tx Power

Band VIII

(900 MHz)

HSDPA

Band I

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Description

Band

Test Value Units

Power (dBm)

(IMT2100)

TBD

10 dBm Tx Power

23.5 dBm Tx Power

1 dBm Tx Power

10 dBm Tx Power

23.5 dBm Tx Power

1 dBm Tx Power

10 dBm Tx Power

23.5 dBm Tx Power

1 dBm Tx Power

10 dBm Tx Power

23.5 dBm Tx Power

Band II

(PCS 1900)

Band V

(850 MHz)

Band VIII

(900 MHz)

LTE

LTE Band I

TBD

1 dBm Tx Power

10 dBm Tx Power

23dBm Tx Power

1 dBm Tx Power

10 dBm Tx Power

23 dBm Tx Power

1 dBm Tx Power

10 dBm Tx Power

23 dBm Tx Power

1 dBm Tx Power

10 dBm Tx Power

23 dBm Tx Power

1 dBm Tx Power

10 dBm Tx Power

23 dBm Tx Power

1 dBm Tx Power

10 dBm Tx Power

LTE Band II

LTE Band III

LTE Band V

LTE Band VIII

LTE Band VII

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Description

Band

Test Value Units

Power (dBm)

TBD

23 dBm Tx Power

LTE Band XX

1 dBm Tx Power

10 dBm Tx Power

23 dBm Tx Power

Table 5-9 DC power consumption of ME909u-521 (GPRS/EDGE)

Description

Test Value

TBD

Units

PCL

Configuration

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

1 Up/1 Down

2 Up/1 Down

GPRS850

GPRS900

GPRS1800

GPRS1900

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Description

Test Value

TBD

Units

PCL

Configuration

4 Up/1 Down

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

1 Up/1 Down

2 Up/1 Down

4 Up/1 Down

EDGE850

EDGE900

EDGE1800

EDGE1900

Table 5-10 DC power consumption (GPS)

Description

Max Test Value

TBD

Units

Configuration

GPS location request

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

The above values are the average of some test samples.



LTE test condition: 10 MHz bandwidth, QPSK, 1RB when testing max Tx power and full RB

when testing 1 dBm or 10 dBm.

5.7 Reliability Features

‎T a ble 5-11 lists the test conditions and results of the reliability of the ME909 module .

Table 5-11 Test conditions and results of the reliability of the ME909 module

Item

Test Condition

Standard

Low-temperature

storage

Temperature: –40ºC±2ºC

IEC60068

Test duration: 24 h

High-temperature

storage

Temperature: 85ºC±2ºC

Test duration: 24 h

IEC60068

Low-temperature

working

Temperature: –20ºC±2ºC

Test duration: 24 h

High-temperature

working

Temperature: 60ºC ±2ºC

Test duration: 24 h

Damp heat cycling

Temperature shock

Salty fog test

High temperature: 55ºC ±2ºC

Low temperature: 25ºC ±2ºC

Humidity: 95%

Repetition times: 4

Test duration: 12 h+12 h

Low temperature: –40ºC ±2ºC

High temperature: 85ºC ±2ºC

Temperature change interval: < 30s

Test duration: 15 min

IEC60068

Repetition times: 100

Temperature: 35°C

Density of the NaCl solution: 5%±1%

Spraying interval: 8 h

Duration of exposing the module to

the temperature of 35°C: 16 h

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Item

Test Condition

Frequency range: 5 Hz to 200 Hz

Standard

Sine vibration

IEC60068

Acceleration: 10 m/s²

Frequency scan rate: 1 oct/min

Test period: 3 axial directions. Five

circles for each axial direction.

Shock test

Clash test

Drop test

Half-sine wave shock

Peak acceleration: 300 m/s²

Shock duration: 11 ms

Test period: 6 axial directions. One

shock for each axial direction.

Half-sine wave

Peak acceleration: 180 m/s²

Pulse duration: 6 ms

Repetition time: 6 directions. 1000

times for each direction.

First case: 0.3 m in height. Drop the

ME909 module on the marble terrace

with one surface facing downwards

twice. Six surfaces should be tested.

Second case: 0.8 m in height. Drop

the ME909 module on the marble

terrace with one surface facing

downwards twice. Six surfaces

should be tested.

5.8 EMC and ESD Features

EMC tests have to be performed on the application as soon as possible to detect any

potential problems.

Special attention should be paid to the following:



Possible harmful emissions radiated by the application to the RF receiver in the

receiver band.



ESD protection is mandatory on all signals which are externally accessible



Typically, ESD protection is mandatory for the following:

−

UIM

USB



Length of the USIM interface lines (preferably <10 cm).

EMC protection on audio input/output (filters against 900 MHz emissions).

Ground plane: recommends a common ground plane for analog/digital/RF

grounds.

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Hardware Guide

Electrical and Reliability Features



A metallic or plastic case with conductive paint is recommended, except for the

area around the antenna.

The HUAWEI ME909 module does not include any protection against over voltage.

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Mechanical Specifications

6.1 About This Chapter

This chapter mainly describes mechanical specifications of ME909 module, including:



Dimensions and Interfaces



Dimensions of the Mini PCI Express Connector



Specification Selection for Fasteners

6.2 Dimensions and Interfaces

The dimensions of the ME909 module are 51 mm (length) × 30.4 mm (width) ×3.35

mm (height). ‎Figure 6-1 shows the dimensions of ME909 module in detail.

‎Figure 6-1 shows the appearance of the interfaces on the ME909 module.

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Figure 6-1 Dimensions of the ME909 module

6.3 Dimensions of the Mini PCI Express Connector

The Mini PCIe Adapter adopts a standard Mini PCI Express connector that has 52

pins and complies with the PCI Express Mini Card Electromechanical Specification

Revision 1.2.

‎Figure 6-2 shows a 52-pin Mini PCI Express connector (take the Molex 67910002 as

an example).

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Figure 6-2 Dimensions of the Mini PCI Express connector

6.4 Specification Selection for Fasteners

6.4.1 Installing the Mini PCIe Adapter on the Main Board

To install the Mini PCIe Adapter on the main board, do the following:

Step 1 Insert the Mini PCIe Adapter into the Mini PCI Express connector on the main board.

Step 2 Press downwards to fix the Mini PCIe Adapter in the module slot.

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Step 3 Use a screwdriver to fix the Mini PCIe Adapter on the main board with two screws

provided in the Mini PCIe Adapter packing box.

Step 4 Insert the connector of the main antenna into the MAIN antenna interface (M) of the

Mini PCIe Adapter according to the indication on the label of the Mini PCIe Adapter.

Insert the connector of the auxiliary antenna into the AUX antenna interface (A) of the

Mini PCIe Adapter and the GPS antenna into the GPS antenna interface (G) of the

Mini PCIe Adapter in the same way.

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

Insert the antenna connectors vertically into the antenna interfaces of the Mini PCIe

Adapter.



Do not press or squeeze the antenna cable or damage the connectors. Otherwise, the

wireless performance of the Mini PCIe Adapter may be reduced or the Mini PCIe Adapter

cannot work normally.

Ensure that the antenna cables are routed through the channel in the frame of the PC and

do not lay the cables across the raised edges of the frame.

6.4.2 Removing the Mini PCIe Adapter from the Main Board

Step 1 Disconnect the antenna cables from the Mini PCIe Adapter. You can lift the

connectors using a small screwdriver.

Step 2 Remove the two screws with the screwdriver.

Step 3 Slide backwards the two clips to release the Mini PCIe Adapter from the slot. Then, lift

up the Mini PCIe Adapter.

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Certifications

7.1 About This Chapter

This chapter gives a general description of certifications of ME909 module.

7.2 Certifications

The certification of ME909 module is testing now. ‎T a ble 7-1 shows certifications the

ME909u-521 module will be implemented. For more demands, please contact us for more

details about this information.

Table 7-1 ME909u-521 Product Certifications

Certification

Model name

ME909u-521



RoHS

GCF

WEEE

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Safety Information

Read the safety information carefully to ensure the correct and safe use of your

wireless device. Applicable safety information must be observed.

8.1 Interference

Power off your wireless device if using the device is prohibited. Do not use the

wireless device when it causes danger or interference with electric devices.

8.2 Medical Device



Power off your wireless device and follow the rules and regulations set forth by

the hospitals and health care facilities.

Some wireless devices may affect the performance of the hearing aids. For any

such problems, consult your service provider.

Pacemaker manufacturers recommend that a minimum distance of 15 cm be

maintained between the wireless device and a pacemaker to prevent potential

interference with the pacemaker. If you are using an electronic medical device,

consult the doctor or device manufacturer to confirm whether the radio wave

affects the operation of this device.

8.3 Area with Inflammables and Explosives

To prevent explosions and fires in areas that are stored with inflammable and

explosive devices, power off your wireless device and observe the rules. Areas stored

with inflammables and explosives include but are not limited to the following:



Gas station



Fuel depot (such as the bunk below the deck of a ship)



Container/Vehicle for storing or transporting fuels or chemical products



Area where the air contains chemical substances and particles (such as granule,

dust, or metal powder)



Area indicated with the "Explosives" sign

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Safety Information



Area indicated with the "Power off bi-direction wireless equipment" sign

Area where you are generally suggested to stop the engine of a vehicle



8.4 Traffic Security



Observe local laws and regulations while using the wireless device. To prevent

accidents, do not use your wireless device while driving.



RF signals may affect electronic systems of motor vehicles. For more information,

consult the vehicle manufacturer.

In a motor vehicle, do not place the wireless device over the air bag or in the air

bag deployment area. Otherwise, the wireless device may hurt you owing to the

strong force when the air bag inflates.

8.5 Airline Security

Observe the rules and regulations of airline companies. When boarding or

approaching a plane, power off your wireless device. Otherwise, the radio signal of

the wireless device may interfere with the plane control signals.

8.6 Safety of Children

Do not allow children to use the wireless device without guidance. Small and sharp

components of the wireless device may cause danger to children or cause suffocation

if children swallow the components.

8.7 Environment Protection

Observe the local regulations regarding the disposal of your packaging materials,

used wireless device and accessories, and promote their recycling.

8.8 WEEE Approval

The wireless device is in compliance with the essential requirements and other

relevant provisions of the Waste Electrical and Electronic Equipment Directive

2012/19/EU (WEEE Directive).

8.9 RoHS Approval

The wireless device is in compliance with the restriction of the use of certain

hazardous substances in electrical and electronic equipment Directive 2011/65/EU

(RoHS Directive).

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8.10 Laws and Regulations Observance

Observe laws and regulations when using your wireless device. Respect the privacy

and legal rights of the others.

8.11 Care and Maintenance

It is normal that your wireless device gets hot when you use or charge it. Before you

clean or maintain the wireless device, stop all applications and power off the wireless

device.



Use your wireless device and accessories with care and in clean environment.

Keep the wireless device from a fire or a lit cigarette.



Protect your wireless device and accessories from water and vapour and keep

them dry.



Do not drop, throw or bend your wireless device.



Clean your wireless device with a piece of damp and soft antistatic cloth. Do not

use any chemical agents (such as alcohol and benzene), chemical detergent, or

powder to clean it.



Do not leave your wireless device and accessories in a place with a considerably

low or high temperature.



Use only accessories of the wireless device approved by the manufacture.

Contact the authorized service center for any abnormity of the wireless device or

accessories.



Do not dismantle the wireless device or accessories. Otherwise, the wireless

device and accessories are not covered by the warranty.



The device should be installed and operated with a minimum distance of 20 cm

between the radiator and your body.

8.12 Emergency Call

This wireless device functions through receiving and transmitting radio signals.

Therefore, the connection cannot be guaranteed in all conditions. In an emergency,

you should not rely solely on the wireless device for essential communications.

8.13 Regulatory Information

The following approvals and notices apply in specific regions as noted.

8.13.1 CE Approval (European Union)

The wireless device is approved to be used in the member states of the EU. The

wireless device is in compliance with the essential requirements and other relevant

provisions of the Radio and Telecommunications Terminal Equipment Directive

1999/5/EC (R&TTE Directive).

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Safety Information

8.13.2 FCC Statement

Federal Communications Commission Notice (United States): Before a wireless

device model is available for sale to the public, it must be tested and certified to the

FCC that it does not exceed the limit established by the government-adopted

requirement for safe exposure.

This device complies with Part 15 of the FCC Rules. Operation is subject to the

following two conditions: (1) this device may not cause harmful interference, and (2)

this device must accept any interference received, including interference that may

cause undesired operation.

Warning: Changes or modifications made to this equipment not expressly approved

by HUAWEI may void the FCC authorization to operate this equipment.

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Appendix A Circuit of Typical Interface

TBD

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Appendix B Acronyms and

Abbreviations

Appendix B Acronyms and

Abbreviations

Acronym or Abbreviation

Expansion

3GPP

8PSK

AUX

BER

BIOS

BLER

CCC

Third Generation Partnership Project

8 Phase Shift Keying

Auxiliary

Bit Error Rate

Basic Input Output System

Block Error Rate

China Compulsory Certification

European Conformity

Coding Scheme

CSD

Circuit Switched Data

Direct Current

DCE

EMC

ESD

Data Communication Equipment

Electromagnetic Compatibility

Electrostatic Discharge

European Union

FCC

GPIO

GPRS

GSM

HSDPA

Federal Communications Commission

General-purpose I/O

General Packet Radio Service

Global System for Mobile Communication

High-Speed Downlink Packet Access

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Appendix B Acronyms and

Abbreviations

Acronym or Abbreviation

Expansion

HSPA+

HSUPA

ISO

Enhanced High Speed Packet Access

High Speed Up-link Packet Access

International Standards Organization

Liquid Crystal Polyester

Low-Dropout

LCP

LDO

LED

Light-Emitting Diode

LGA

LTE

Land Grid Array

Long Term Evolution

MCP

PCB

Multi-chip Package

Printed Circuit Board

Radio Frequency

Restriction of the Use of Certain Hazardous

Substances

RoHS

TBD

To Be Determined

TTFF

TVS

Time to First Fix

Transient Voltage Suppressor

Universal Mobile Telecommunications System

Universal Serial Bus

UMTS

USB

USIM

VSWR

WCDMA

WEEE

Universal Subscriber Identity Module

Voltage Standing Wave Ratio

Wideband Code Division Multiple Access

Waste Electrical and Electronic Equipment

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