Cypress Clock CY7B9910 User Manual

CY7B9910  
CY7B9920  
Low Skew Clock Buffer  
The completely integrated PLL enables “zero delay” capability.  
External divide capability, combined with the internal PLL, allows  
distribution of a low frequency clock that is multiplied by virtually  
any factor at the clock destination. This facility minimizes clock  
distribution difficulty while allowing maximum system clock  
speed and flexibility.  
Features  
All outputs skew <100 ps typical (250 max.)  
15 to 80 MHz output operation  
Zero input to output delay  
50% duty cycle outputs  
Block Diagram Description  
Outputs drive 50Ω terminated lines  
Low operating current  
Phase Frequency Detector and Filter  
The Phase Frequency Detector and Filter blocks accept inputs  
from the reference frequency (REF) input and the feedback (FB)  
input and generate correction information to control the  
frequency of the Voltage Controlled Oscillator (VCO). These  
blocks, along with the VCO, form a Phase Locked Loop (PLL)  
that tracks the incoming REF signal.  
24-pin SOIC package  
Jitter:<200 ps peak to peak, <25 ps RMS  
Functional Description  
The CY7B9910 and CY7B9920 Low Skew Clock Buffers offer  
low skew system clock distribution. These multiple output clock  
drivers optimize the timing of high performance computer  
systems. Each of the eight individual drivers can drive terminated  
transmission lines with impedances as low as 50Ω. They deliver  
minimal and specified output skews and full swing logic levels  
(CY7B9910 TTL or CY7B9920 CMOS).  
VCO  
The VCO accepts analog control inputs from the PLL filter block  
and generates a frequency. The operational range of the VCO is  
determined by the FS control pin.  
Logic Block Diagram  
TEST  
VOLTAGE  
PHASE  
FB  
FREQ  
DET  
FILTER  
CONTROLLED  
OSCILLATOR  
REF  
FS  
Q0  
Q1  
Q2  
Q3  
Q4  
Q5  
Q6  
Q7  
Cypress Semiconductor Corporation  
Document Number: 38-07135 Rev. *B  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised August 07, 2007  
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CY7B9910  
CY7B9920  
Static Discharge Voltage............................................>2001V  
(MIL-STD-883, Method 3015)  
Maximum Ratings  
Operating outside these boundaries may affect the performance  
and life of the device. These user guidelines are not tested.  
Latch Up Current .....................................................>200 mA  
Operating Range  
Storage Temperature .................................65°C to +150°C  
Ambient Temperature with  
Power Applied ............................................55°C to +125°C  
Supply Voltage to Ground Potential................–0.5V to +7.0V  
DC Input Voltage ............................................–0.5V to +7.0V  
Output Current into Outputs (LOW)............................. 64 mA  
Ambient  
Range  
Commercial  
Industrial  
Temperature  
0°C to +70°C  
–40°C to +85°C  
V
CC  
5V ± 10%  
5V ± 10%  
Document Number: 38-07135 Rev. *B  
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CY7B9910  
CY7B9920  
Electrical Characteristics Over the Operating Range  
CY7B9910  
CY7B9920  
Min Max  
Parameter  
Description  
Test Conditions  
= Min, I = –16 mA  
Min  
Max  
Unit  
V
Output HIGH Voltage  
V
V
V
V
2.4  
V
OH  
CC  
CC  
CC  
CC  
OH  
= Min, I =–40 mA  
V
–0.75  
OH  
CC  
V
Output LOW Voltage  
= Min, I = 46 mA  
0.45  
V
OL  
OL  
= Min, I = 46 mA  
0.45  
OL  
V
V
V
V
V
I
Input HIGH Voltage  
(REF and FB inputs only)  
2.0  
V
V
1.35  
V
CC  
V
V
IH  
CC  
CC  
Input LOW Voltage  
(REF and FB inputs only)  
–0.5  
0.8  
–0.5  
1.35  
IL  
Three Level Input HIGH  
Min V Max  
V
– 1V  
V
V
– 1V  
V
V
IHH  
IMM  
ILL  
CC  
CC  
CC  
CC  
CC  
Voltage (Test, FS)  
Three Level Input MID  
Min V Max  
V
/2 –  
V
/2 +  
V
/2 –  
V /2 +  
CC  
500 mV  
V
CC  
CC  
CC  
500 mV  
CC  
Voltage (Test, FS)  
500 mV  
500 mV  
Three Level Input LOW  
Min V Max  
0.0  
1.0  
0.0  
1.0  
V
CC  
Voltage (Test, FS)  
Input HIGH Leakage Current  
(REF and FB inputs only)  
V
V
V
V
V
V
= Max, V = Max  
10  
10  
μA  
μA  
μA  
μA  
μA  
mA  
mA  
IH  
CC  
IN  
I
I
I
I
I
I
Input LOW Leakage Current  
(REF and FB inputs only)  
= Max, V = 0.4V  
–500  
–50  
–500  
–50  
IL  
CC  
IN  
Input HIGH Current  
(Test, FS)  
= V  
CC  
200  
50  
200  
50  
IHH  
IMM  
ILL  
IN  
Input MID Current  
(Test, FS)  
= V /2  
IN  
CC  
Input LOW Current  
(Test, FS)  
= GND  
–200  
–250  
–200  
N/A  
IN  
Output Short Circuit  
= Max, V  
OUT  
OS  
CC  
Current  
= GND (25°C only)  
Operating Current Used by  
Internal Circuitry  
V
= V  
= Max All Com’l  
85  
90  
85  
90  
CCQ  
CCN  
CCQ  
Input  
Selects Open  
Mil/Ind  
I
Output Buffer Current per  
Output Pair  
V
= V = Max  
CCQ  
= 0 mA  
14  
19  
mA  
CCN  
CCN  
I
OUT  
Input Selects Open, f  
MAX  
[5]  
PD  
Power Dissipation per  
Output Pair  
V
= V  
= 0 mA  
= Max  
78  
104  
mW  
CCN  
CCQ  
I
OUT  
Input Selects Open, f  
MAX  
Notes  
4. These inputs are normally wired to VCC, GND, or left unconnected (actual threshold voltages vary as a percentage of VCC). Internal termination resistors hold  
unconnected inputs at VCC/2. If these inputs are switched, the function and timing of the outputs may glitch and the PLL may require an additional tLOCK time  
before all data sheet limits are achieved.  
5. Tested one output at a time, output shorted for less than one second, less than 10% duty cycle. Room temperature only. CY7B9920 outputs are not short circuit  
protected.  
6. Total output current per output pair is approximated by the following expression that includes device current plus load current:  
CY7B9910:  
ICCN = [(4 + 0.11F) + [((835 – 3F)/Z) + (.0022FC)]N] x 1.1  
CY7B9920:  
ICCN = [(3.5+.17F) + [((1160 – 2.8F)/Z) + (.0025FC)]N] x 1.1  
Where  
F = frequency in MHz  
C = capacitive load in pF  
Z = line impedance in ohms  
N = number of loaded outputs; 0, 1, or 2  
FC = F < C.  
7. Total power dissipation per output pair is approximated by the following expression that includes device power dissipation plus power dissipation due to the load circuit:  
CY7B9910:  
PD = [(22 + 0.61F) + [((1550 – 2.7F)/Z) + (.0125FC)]N] x 1.1  
CY7B9920:  
PD = [(19.25+ 0.94F) + [((700 + 6F)/Z) + (.017FC)]N] x 1.1.See note 3 for variable definition.  
Document Number: 38-07135 Rev. *B  
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CY7B9910  
CY7B9920  
Capacitance  
Tested initially and after any design or process changes that may affect these parameters.  
Parameter  
Description  
Test Conditions  
Max  
Unit  
C
Input Capacitance  
T = 25°C, f = 1 MHz, V = 5.0V  
10  
pF  
IN  
A
CC  
AC Test Loads and Waveforms  
5V  
3.0V  
2.0V  
=1.5V  
0.8V  
0.0V  
2.0V  
=1.5V  
0.8V  
R1=130  
R2=91  
R1  
R2  
V
th  
V
th  
C = 50 pF (C = 30pF for –5 and – 2 devices)  
L
L
C
L
(Includes fixture and probe capacitance)  
1ns  
1ns  
7B9910–3  
7B9910–4  
TTL AC Test Load (CY7B9910)  
TTL Input Test Waveform (Cy7B9910)  
V
CC  
V
CC  
R1=100  
R2=100  
80%  
CC  
20%  
0.0V  
80%  
R1  
R2  
C = 50 pF (C =30 pF for –5 and – 2devices)  
V
th  
= V /2  
V
th  
= V /2  
L
L
CC  
(Includes fixture and probe capacitance)  
20%  
C
L
3ns  
3ns  
7B9910–5  
7B9910–6  
CMOS Input Test Waveform (CY7B9920)  
CMOS AC Test Load (CY7B9920)  
Switching Characteristics  
Over the Operating Range  
[8]  
[8]  
CY7B9910–2  
Min Typ  
CY7B9920–2  
Min Typ  
Parameter  
Description  
FS = LOW  
Max  
Max  
Unit  
[1, 2]  
f
Operating Clock  
15  
30  
50  
80  
15  
30  
50  
80  
MHz  
NOM  
Frequency in MHz  
FS = MID  
25  
25  
[12]  
FS = HIGH  
40  
40  
t
t
t
t
t
t
t
t
t
t
REF Pulse Width HIGH  
REF Pulse Width LOW  
5.0  
5.0  
5.0  
5.0  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ms  
ps  
ps  
RPWH  
RPWL  
SKEW  
DEV  
[13, 14]  
Zero Output Skew (All Outputs)  
0.1  
0.25  
0.75  
+0.25  
+0.65  
1.2  
0.1  
0.25  
0.75  
+0.25  
+0.65  
2.5  
[14, 15]  
Device-to-Device Skew  
Propagation Delay, REF Rise to FB Rise  
–0.25  
–0.65  
0.15  
0.0  
0.0  
1.0  
1.0  
–0.25  
–0.65  
0.5  
0.0  
0.0  
2.0  
2.0  
PD  
[16]  
Output Duty Cycle Variation  
ODCV  
ORISE  
OFALL  
LOCK  
JR  
[17, 18]  
Output Rise Time  
[17, 18]  
Output Fall Time  
0.15  
1.2  
0.5  
2.5  
[19]  
PLL Lock Time  
0.5  
0.5  
Cycle-to-Cycle Output Jitter Peak to Peak  
RMS  
200  
25  
200  
25  
Document Number: 38-07135 Rev. *B  
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CY7B9910  
CY7B9920  
CY7B9910–5  
Typ  
CY7B9920–5  
Typ  
Parameter  
Description  
FS = LOW  
Min  
15  
Max  
Min  
15  
Max  
Unit  
f
Operating Clock  
30  
30  
MHz  
NOM  
Frequency in MHz  
FS = MID  
25  
50  
80  
25  
50  
80  
FS = HIGH  
40  
40  
t
t
t
t
t
t
t
t
t
t
REF Pulse Width HIGH  
REF Pulse Width LOW  
5.0  
5.0  
5.0  
5.0  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ms  
ps  
ps  
RPWH  
RPWL  
SKEW  
DEV  
Zero Output Skew (All Outputs)  
0.25  
0.5  
1.0  
+0.5  
+1.0  
1.5  
1.5  
0.5  
200  
25  
0.25  
0.5  
1.0  
+0.5  
+1.0  
3.0  
3.0  
0.5  
200  
25  
[8, 15]  
Device-to-Device Skew  
Propagation Delay, REF Rise to FB Rise  
–0.5  
–1.0  
0.15  
0.15  
0.0  
0.0  
1.0  
1.0  
–0.5  
–1.0  
0.5  
0.0  
0.0  
2.0  
2.0  
PD  
Output Duty Cycle Variation  
ODCV  
ORISE  
OFALL  
LOCK  
JR  
Output Rise Time  
Output Fall Time  
0.5  
PLL Lock Time  
[8]  
Cycle-to-Cycle Output Jitter Peak to Peak  
[8]  
RMS  
Notes  
8. Guaranteed by statistical correlation. Tested initially and after any design or process changes that may affect these parameters.  
9. CMOS output buffer current and power dissipation specified at 50 MHz reference frequency.  
10. Applies to REF and FB inputs only.  
11. Test measurement levels for the CY7B9910 are TTL levels (1.5V to 1.5V). Test measurement levels for the CY7B9920 are CMOS levels (VCC/2 to VCC/2). Test  
conditions assume signal transition times of 2ns or less and output loading as shown in the AC Test Loads and Waveforms unless otherwise specified.  
12. Except as noted, all CY7B9920–2 and –5 timing parameters are specified to 80 MHz with a 30 pF load.  
13. tSKEW is defined as the time between the earliest and the latest output transition among all outputs when all are loaded with 50 pF and terminated with 50Ω to  
2.06V (CY7B9910) or VCC/2 (CY7B9920).  
14. tSKEW is defined as the skew between outputs.  
15. tDEV is the output-to-output skew between any two outputs on separate devices operating under the same conditions (VCC, ambient temperature, air flow, and  
so on).  
16. tODCV is the deviation of the output from a 50% duty cycle.  
17. Specified with outputs loaded with 30 pF for the CY7B99X0–2 and –5 devices and 50 pF for the CY7B99X0–7 devices. Devices are terminated through 50Ω to  
2.06V (CY7B9910) or VCC/2 (CY7B9920).  
18. tORISE and tOFALL measured between 0.8V and 2.0V for the CY7B9910 or 0.8VCC and 0.2VCC for the CY7B9920.  
19. tLOCK is the time that is required before synchronization is achieved. This specification is valid only after VCC is stable and within normal operating limits. This  
parameter is measured from the application of a new signal or frequency at REF or FB until tPD is within specified limits.  
Document Number: 38-07135 Rev. *B  
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CY7B9910  
CY7B9920  
Switching Characteristics  
Over the Operating Range (continued)  
CY7B9910–7  
Typ  
CY7B9920–7  
Typ  
Parameter  
Description  
FS = LOW  
Min  
Max  
Min  
Max  
Unit  
f
Operating Clock  
15  
30  
15  
30  
MHz  
NOM  
Frequency in MHz  
FS = MID  
25  
40  
50  
80  
25  
40  
50  
[12]  
FS = HIGH  
80  
t
t
t
t
t
t
t
t
t
t
t
REF Pulse Width HIGH  
REF Pulse Width LOW  
5.0  
5.0  
5.0  
5.0  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ms  
ps  
ps  
RPWH  
RPWL  
SKEW  
DEV  
Zero Output Skew (All Outputs)  
0.3  
0.75  
1.5  
0.3  
0.75  
1.5  
Device-to-Device Skew  
Propagation Delay, REF Rise to FB Rise  
–0.7  
–1.2  
0.15  
0.15  
0.0  
0.0  
1.5  
1.5  
+0.7  
+1.2  
2.5  
–0.7  
–1.2  
0.5  
0.0  
0.0  
3.0  
3.0  
+0.7  
+1.2  
5.0  
PD  
Output Duty Cycle Variation  
ODCV  
ORISE  
OFALL  
LOCK  
JR  
Output Rise Time  
Output Fall Time  
2.5  
0.5  
5.0  
PLL Lock Time  
0.5  
0.5  
[8]  
Cycle-to-Cycle Output Peak to Peak  
Jitter  
200  
25  
200  
25  
[8]  
RMS  
JR  
Document Number: 38-07135 Rev. *B  
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CY7B9910  
CY7B9920  
AC Timing Diagrams  
Figure 1. AC Timing Diagrams  
t
t
RPWL  
REF  
t
RPWH  
REF  
t
PD  
t
ODCV  
t
ODCV  
FB  
Q
t
JR  
t
SKEW  
t
SKEW  
OTHERQ  
Figure 2. Zero Skew and Zero Delay Clock Driver  
REF  
LOAD  
Z
Z
0
FB  
SYSTEM  
CLOCK  
REF  
FS  
LOAD  
LOAD  
Q0  
Q1  
0
Q2  
Q3  
Q4  
Q5  
Z
0
Q6  
Q7  
LOAD  
TEST  
Z
0
Document Number: 38-07135 Rev. *B  
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CY7B9910  
CY7B9920  
Operational Mode Descriptions  
Figure 2 shows the device configured as a zero skew clock  
buffer. In this mode the 7B9910/9920 is used as the basis for a  
low skew clock distribution tree. The outputs are aligned and may  
each drive a terminated transmission line to an independent  
load. The FB input is tied to any output and the operating  
frequency range is selected with the FS pin. The low skew speci-  
fication, coupled with the ability to drive terminated transmission  
lines (with impedances as low as 50 ohms), enables efficient  
printed circuit board design.  
Figure 1 shows the CY7B9910/9920 connected in series to  
construct a zero skew clock distribution tree between boards.  
Cascaded clock buffers accumulates low frequency jitter  
because of the non-ideal filtering characteristics of the PLL filter.  
Do not connect more than two clock buffers in series.  
Figure 3. Board-to-Board Clock Distribution  
LOAD  
LOAD  
REF  
Z
0
FB  
SYSTEM  
CLOCK  
REF  
FS  
Z
0
Q0  
Q1  
Q2  
Q3  
LOAD  
Q4  
Q5  
Z
0
Q6  
Q7  
FB  
REF  
FS  
TEST  
LOAD  
Q0  
Q1  
Z
0
Q2  
Q3  
Q4  
Q5  
LOAD  
Q6  
Q7  
TEST  
Document Number: 38-07135 Rev. *B  
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CY7B9910  
CY7B9920  
Ordering Information  
Accuracy  
Operating  
Range  
Ordering Code  
Package Type  
24-Pb Small Outline IC  
(ps)  
250  
CY7B9910–2SC  
CY7B9910–2SCT  
Commercial  
24-Pb Small Outline IC - Tape and Reel  
24-Pb Small Outline IC  
Commercial  
Commercial  
Commercial  
Commercial  
Industrial  
[20]  
CY7B9920–2SC  
CY7B9910–5SC  
CY7B9910–5SCT  
CY7B9910–5SI  
CY7B9910–5SIT  
CY7B9920–5SC  
CY7B9920–5SCT  
CY7B9920–5SI  
CY7B9910–7SC  
500  
24-Pb Small Outline IC  
24-Pb Small Outline IC - Tape and Reel  
24-Pb Small Outline IC  
24-Pb Small Outline IC - Tape and Reel  
24-Pb Small Outline IC  
Industrial  
Commercial  
Commercial  
Industrial  
24-Pb Small Outline IC - Tape and Reel  
24-Pb Small Outline IC  
750  
24-Pb Small Outline IC  
Commercial  
Industrial  
[20]  
CY7B9910–7SI  
24-Pb Small Outline IC  
[20]  
CY7B9920–7SC  
24-Pb Small Outline IC  
Commercial  
Industrial  
[20]  
CY7B9920–7SI  
24-Pb Small Outline IC  
Pb-Free  
250  
CY7B9910–2SXC  
CY7B9910–2SXCT  
CY7B9910–5SXC  
CY7B9910–5SXCT  
CY7B9910–5SXI  
CY7B9910–5SXIT  
CY7B9910–7SXC  
CY7B9910–7SXCT  
24-Pb Small Outline IC  
Commercial  
Commercial  
Commercial  
Commercial  
Industrial  
24-Pb Small Outline IC - Tape and Reel  
24-Pb Small Outline IC  
500  
24-Pb Small Outline IC - Tape and Reel  
24-Pb Small Outline IC  
24-Pb Small Outline IC - Tape and Reel  
24-Pb Small Outline IC  
Industrial  
750  
Commercial  
Commercial  
24-Pb Small Outline IC - Tape and Reel  
Package Diagram  
Figure 4. 24-Pin (300 Mil) Molded SOIC S13  
51-85025-*C  
Note  
20. Not recommended for new design.  
Document Number: 38-07135 Rev. *B  
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CY7B9910  
CY7B9920  
Document History  
Document Title: CY7B9910/CY7B9920 Low Skew Clock Buffer  
Document Number: 38-07135  
Orig. of  
Change  
REV.  
ECN NO. Issue Date  
Description of Change  
**  
110244  
10/28/01  
SZV  
Change from Specification number: 38-00437 to 38-07135  
*A  
1199925  
See ECN DPF/AESA Added Pb-free parts in Ordering Information  
Added Note 20: Not recommended for the new design  
*B  
1353343  
See ECN AESA  
Change status to final  
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OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not  
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where  
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer  
assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
Use may be limited by and subject to the applicable Cypress software license agreement.  
Document Number: 38-07135 Rev. *B  
Revised August 07, 2007  
Page 11 of 11  
PSoC Designer™, Programmable System-on-Chip™, and PSoC Express™ are trademarks and PSoC® is a registered trademark of Cypress Semiconductor Corp. All other trademarks or registered  
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trademarks referenced herein are property of the respective corporations. Purchase of I C components from Cypress or one of its sublicensed Associated Companies conveys a license under the  
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Philips I C Patent Rights to use these components in an I C system, provided that the system conforms to the I C Standard Specification as defined by Philips. All products and company names  
mentioned in this document may be the trademarks of their respective holders.  
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