AMD Computer Hardware 1207 User Manual
Thermal Design Guide for  
Socket F (1207) Processors  
Publication # 32800  
Revision: 3.00  
Issue Date: August 2006  
Advanced Micro Devices  
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32800 Rev. 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
Contents  
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9  
Chapter 1  
1.1  
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11  
Summary of Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11  
Processor Thermal Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13  
Processor Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13  
Socket Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14  
Chapter 2  
2.1  
2.2  
Chapter 3  
Thermal Design of Platforms Using the AMD Processor-In-a-Box (PIB)  
Thermal Solution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15  
3.1  
3.2  
3.3  
Motherboard Component Height Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15  
Thermal Solution Design Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16  
Sample Heat Sinks and Attachment Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16  
3.3.1  
3.3.2  
Backplate Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18  
Retention Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19  
Chapter 4  
Thermal Design of Custom 1U-2P Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21  
Motherboard Component Height Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21  
Thermal Solution Design Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22  
Sample Heat Sinks and Attachment Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22  
4.1  
4.2  
4.3  
4.3.1  
Backplate Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24  
Spring Screws . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24  
Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25  
Fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26  
Thermal Interface Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27  
4.3.2  
4.3.3  
4.3.4  
4.3.5  
Chapter 5  
Thermal Design of Custom 2U-4P Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29  
Motherboard Component Height Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29  
Thermal Solution Design Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30  
Sample Heat Sinks and Attachment Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30  
5.1  
5.2  
5.3  
5.3.1  
Backplate Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32  
Spring Clip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33  
Retention Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33  
5.3.2  
5.3.3  
Contents  
3
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
5.3.4  
5.3.5  
5.3.6  
Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33  
Fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35  
Thermal Interface Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35  
Appendix A Keep-Out Drawings for Platforms Using the PIB Thermal Solution for  
Socket F (1207) Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37  
Appendix B Keep-Out Drawings for Custom 1U-2P Systems Based on the  
Socket F (1207) Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45  
Appendix C Keep-Out Drawings for Custom 2U-4P Systems Based on the  
Socket F (1207) Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53  
Appendix D Flow Simulation Results for Custom 2U-4P Systems Based on  
Socket F (1207) Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61  
4
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32800 Rev. 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
List of Figures  
Figure 1.  
Figure 2.  
The 1207-Pin Socket. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14  
Motherboard Component Height Restrictions for Platforms Using the  
AMD PIB Thermal Solution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15  
Figure 3.  
Exploded View of Thermal Solution AMD PIB Platforms based on  
Socket F (1207) Processors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18  
Figure 4.  
Figure 5.  
Figure 6.  
Figure 7.  
Motherboard Component Height Restrictions for Custom 1U-2P Systems. . . . . . . . . .21  
Exploded View of Thermal Solution for Custom 1U-2P Systems . . . . . . . . . . . . . . . . .24  
High Performance Heat Sink for Custom 1U-2P Systems . . . . . . . . . . . . . . . . . . . . . . .25  
Thermal Performance Chart of Heat Sink When Used with a Dual-Core Processor  
in 90 nm Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26  
Figure 8.  
Figure 9.  
Motherboard Component-Height Restrictions for Custom 2U-4P Systems. . . . . . . . . .29  
Exploded View of Thermal Solution for Custom 2U-4P System Based on Socket F  
(1207) Processors32  
Figure 10. High Performance Heat Sink for Custom 2U-4P Systems . . . . . . . . . . . . . . . . . . . . . . .34  
Figure 11. Thermal Performance Chart of Heat Sink When Used with a Dual-Core Processor  
in 90 nm Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35  
Figure 12. Socket F (1207) PIB Board Component Height Restrictions. . . . . . . . . . . . . . . . . . . . .38  
Figure 13. Socket F (1207) PIB Mounting Holes, Contact Pads, and No-Routing Zone . . . . . . . .39  
Figure 14. Socket F (1207) PIB Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . . . .40  
Figure 15. Socket F (1207) PIB Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . . . .41  
Figure 16. Socket F (1207) PIB Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . . . .42  
Figure 17. Socket F (1207) PIB Board Bottom Side Keep-Out. . . . . . . . . . . . . . . . . . . . . . . . . . . .43  
Figure 18. Socket F (1207) 1U-2P Board Component Height Restrictions. . . . . . . . . . . . . . . . . . .46  
Figure 19. Socket F (1207) 1U-2P Mounting Holes, Contact Pads, and No-Routing Zone . . . . . .47  
Figure 20. Socket F (1207) 1U-2P Socket Outline and Socket Window. . . . . . . . . . . . . . . . . . . . .48  
Figure 21. Socket F (1207) 1U-2P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .49  
Figure 22. Socket F (1207) 1U-2P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .50  
Figure 23. Socket F (1207) 1U-2P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51  
Figure 24. Socket F (1207) 2U-4P Board Component Height Restrictions. . . . . . . . . . . . . . . . . . .54  
Figure 25. Socket F (1207) 2U-4P Mounting Holes, Contact Pads, and No-Routing Zone . . . . . .55  
List of Figures  
5
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
Figure 26. Socket F (1207) 2U-4P Socket Outline and Socket Window. . . . . . . . . . . . . . . . . . . . .56  
Figure 27. Socket F (1207) 2U-4P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .57  
Figure 28. Socket F (1207) 2U-4P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .58  
Figure 29. Socket F (1207) 2U-4P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59  
Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . . . . . .61  
Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System . . . . . . . . . . . . . . . . . . . . .62  
6
List of Figures  
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32800 Rev. 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
List of Tables  
Table 1.  
Table 2.  
Mechanical and Thermal Specifications for Socket F (1207) Processors. . . . . . . . . . . .13  
Thermal Solution Design Requirements for Platforms Using Socket F (1207)  
PIB processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16  
Table 3.  
Components for the Processor Thermal Reference Design for the AMD PIB  
Thermal Solution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17  
Table 4.  
Table 5.  
Thermal Solution Design Requirements for Custom 1U-2P Systems . . . . . . . . . . . . . .22  
Components for the Processor Thermal Reference Design for Custom  
1U-2P Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23  
Table 6.  
Table 7.  
Table 8.  
Fin Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25  
Thermal Solution Design Requirements for Custom 2U-4P Systems . . . . . . . . . . . . . .30  
Components for the Processor Thermal Reference Design for Custom  
2U-4P Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31  
Table 9.  
Chemical Element of SK7 Spring Steel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33  
Table 10. Fin Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34  
List of Tables  
7
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
8
List of Tables  
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32800 Rev. 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
Revision History  
Description  
Date  
Revision  
July 2006  
3.00  
Initial Public release.  
Revision History  
9
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
10  
Revision History  
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32800 Rev. 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
Chapter 1 Introduction  
This document specifies performance requirements for the design of thermal and mechanical  
solutions for socket F (1207) processors, utilizing AMD 64-bit technology. Detailed drawings,  
descriptions, and design targets are provided to help manufacturers, vendors, and engineers meet the  
requirements for the socket F (1207) processors.  
1.1  
Summary of Requirements  
To allow optimal reliability of a processor, the thermal and cooling solution dissipates heat from that  
processor operating at the thermal design power. This document specifies the required values for the  
thermal and mechanical parameters of systems based on socket F (1207) processors.  
Chapter 1  
Introduction  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
12  
Introduction  
Chapter 1  
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32800 Rev. 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
Chapter 2 Processor Thermal Solutions  
This chapter describes the thermal solutions for systems based on socket F (1207) processors.  
2.1  
Processor Specifications  
The objective of thermal solutions is to maintain the processor temperature within specified limits.  
Thermal performance, physical mounting, acoustic noise, mass, reliability, and cost must be  
considered during the design of a thermal solution.  
Table 1 lists the pertinent processor specifications for a thermal solution design for systems based on  
socket F (1207) processors.  
Table 1.  
Symbol  
Mechanical and Thermal Specifications for Socket F (1207) Processors  
Maximum  
Description  
Notes  
Value  
TCase Maximum case  
temperature  
67°C - 72°C Consult the processor data sheet for the  
thermal requirements specific to the  
processor.  
ACPU Processor contact 32.5 mm x Interfaces with heat sink  
area  
32.5 mm  
Form Processor form  
Factor factor  
LGA  
LGA form factor for socket F (1207)  
processors  
Chapter 2  
Processor Thermal Solutions  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
2.2  
Socket Description  
Figure 1 shows a three-dimensional view of the 1207-pin socket used with socket F (1207)  
processors. This socket is based on LGA (land-grid array) technology. The LGA socket has 35 pads x  
35 pads on a 1.1 mm pitch, with a 3.52 mm wide de-populated BGA (ball grid array) zone in the  
center, plus a 0.66 mm offset between the two BGA arrays. A small solder-ball makes the electrical  
and mechanical connection to the motherboard at each socket contact.  
Figure 1. The 1207-Pin Socket  
14  
Processor Thermal Solutions  
Chapter 2  
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32800 Rev. 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
Chapter 3 Thermal Design of Platforms Using  
the AMD Processor-In-a-Box (PIB)  
Thermal Solution  
This chapter describes the motherboard component height restrictions, thermal-solution design  
requirements, sample heat sinks, and attachment methods for platforms using the AMD Processor-In-  
a-Box (PIB) thermal solution for socket F (1207) processors.  
3.1  
Motherboard Component Height Restrictions  
The mounting solution for the heat sink calls for a standard motherboard keep-out region and  
mounting holes for the processor. Figure 2 shows an overview of the motherboard component height  
restrictions for platforms using the PIB thermal solution for socket F (1207) processors.  
Figure 2. Motherboard Component Height Restrictions for Platforms Using the AMD PIB  
Thermal Solution  
Chapter 3  
Thermal Design of Platforms Using the AMD Processor-In-a-  
Box (PIB) Thermal Solution  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
Depending on the system features and layout, more space around the socket may be available for the  
thermal solution than is shown in Figure 2 on page 15. This space permits heat sink designs with  
better thermal performance.  
Appendix A on page 37 shows a complete, detailed set of keep-out drawings for the AMD PIB  
thermal solution for socket F (1207).  
3.2  
Thermal Solution Design Requirements  
Table 2 provides the design-target specifications that must be met for the processor to operate reliably  
in a typical platform using the AMD PIB thermal solution for socket F (1207) processors.  
Table 2.  
Thermal Solution Design Requirements for Platforms Using Socket F (1207) PIB  
processors  
Symbol  
Description  
Maximum  
L
Length of heat sink  
Width of heat sink  
Height of heat sink  
68 mm  
77 mm  
60 mm  
W
H
0.26°C/W1  
θca  
Case-to-ambient thermal  
resistance  
450 g to 700 g2  
75 lbs ±15 lbs  
MHS  
Fclip  
TA  
Mass of heat sink  
Clip force  
Local ambient temperature near  
processor  
38°C  
Notes:  
1. This is the thermal resistance required for dual-core, 90-nm socket F (1207) processors. The thermal resistance  
requirement may vary depending on the product OPN. The user should consult the processor data sheet for the  
thermal requirements specific to the part.  
2. Heat sinks weighing up to 450 g can be attached to the motherboard. Heat sinks weighing over 450 g should be tied  
directly to the chassis for reliable shock and vibration performance.  
3.3  
Sample Heat Sinks and Attachment Methods  
The heat sink, fan, mounting spring clip, and thermal interface material used for the AMD PIB  
thermal solution for socket F (1207) processors are the same as the heat sink, fan, mounting spring  
clip, and thermal interface material used for systems based on the socket 940 processor.  
The backplate and retention frame are different from those used in the socket 940 processor. The  
EMC shield implemented in the socket 940-based systems is not recommended for AMD PIB thermal  
solutions for socket F (1207) processors.  
16  
Thermal Design of Platforms Using the AMD Processor-In-a-  
Box (PIB) Thermal Solution  
Chapter 3  
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32800 Rev. 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
Table 3 lists the parts used in the thermal reference design for the AMD PIB thermal solution for  
socket F (1207) processors.  
Table 3.  
Components for the Processor Thermal Reference Design for the AMD PIB  
Thermal Solution  
Part Description  
Material  
Quantity  
Heat sink  
Heatpipe  
Fan  
Copper with aluminum fins  
Sintered-powder copper  
Plastic  
1
2
1
1
2
1
Spring clip  
Retention frame  
Backplate  
SK7 heat treated spring steel  
Lexan, 20% glass-filled  
Low-carbon steel, anti-corrosive  
finish  
Insulator  
Formex GK-17  
1
Figure 3 on page 18 shows an exploded view of the thermal solution for platforms using an AMD PIB  
based on socket F (1207) processors.  
Chapter 3  
Thermal Design of Platforms Using the AMD Processor-In-a-  
Box (PIB) Thermal Solution  
17  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
Figure 3. Exploded View of Thermal Solution AMD PIB Platforms based on Socket F (1207)  
Processors  
3.3.1  
Backplate Assembly  
The backplate is mounted on the backside of the motherboard and enhances local stiffness to support  
shock and vibration loads acting on the heat sink. The backplate assembly prevents excessive  
motherboard warpage in the area near the processor. Without a backplate, excessive warpage could  
cause serious damage to electrical connections of the processor socket and integrated circuit packages  
surrounding the processor. The backplate also serves as a stiffener plate for the LGA socket.  
The reference backplate is made from a 1/16-inch, hard-milled steel, has an overall thickness of 0.138  
inch (3.5 mm), including stiffening ribs, and has a mounting-hole pitch of 3.5 inches. To  
accommodate the capacitors on the backside of the board, there is a square hole in the center of the  
backplate.  
18  
Thermal Design of Platforms Using the AMD Processor-In-a-  
Box (PIB) Thermal Solution  
Chapter 3  
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32800 Rev. 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
Note: Do not cut entirely through the center rib. Doing so will compromise the stiffness of the  
backplate.  
The plate uses two PennEngineering (PEM) standoffs that serve multiple purposes. The PEM  
standoffs serve as attachment points for the retention frame screws. They also align the backplate  
properly to the motherboard. Features in the retention frame slide over the standoffs and allow the  
installation of the screws with a minimum chance of cross threading. Additionally, four M3.5 PEM  
standoffs in the backplate serve as attachment points for the socket.  
The insulator prevents the backplate from electrically shorting to the motherboard. A pressure-  
sensitive adhesive in the insulator keeps the backplate in place against the motherboard during  
assembly. The insulator also is thick enough to prevent any significant capacitive coupling between  
the motherboard and backplate.  
3.3.2  
Retention Frame  
The plastic retention frame, made of 20% glass-filled Lexan, is a two-piece implementation rather  
than the single-piece frame used for socket 940. This change accommodates the larger foot-print of  
socket F (1207) processors.  
The retention frame serves multiple purposes. The retention frame aligns the heat sink and provides a  
stop for the heat sink in large shock-force events. The retention frame and backplate are attached to  
the motherboard by the motherboard vendor. Two screws securely hold the backplate and retention  
frame together. The two mounting tabs on the retention frame serve as attachment points for the heat  
sink spring clip.  
Chapter 3  
Thermal Design of Platforms Using the AMD Processor-In-a-  
Box (PIB) Thermal Solution  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
20  
Thermal Design of Platforms Using the AMD Processor-In-a-  
Chapter 3  
Box (PIB) Thermal Solution  
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32800 Rev. 3.02 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
Chapter 4 Thermal Design of Custom 1U-2P  
Systems  
This chapter describes the motherboard component-height restrictions, thermal-solution design  
requirements, sample heat sinks, and attachment methods for custom 1U-2P systems based on socket  
F (1207) processors.  
Note: These keep-outs are defined for custom rack mount equipment to optimize thermal and  
acoustic performance in these systems. These keep-outs are not compliant with AMD  
Processor-In-a-Box (PIB) thermal solutions.  
4.1  
Motherboard Component Height Restrictions  
The mounting solution for the heat sink calls for a standard motherboard keep-out region and  
mounting holes for the processor. Figure 4 shows an overview of the motherboard component height  
restrictions for custom 1U-2P systems based on the thermal solution for socket F (1207) processors.  
Figure 4. Motherboard Component Height Restrictions for Custom 1U-2P Systems  
Chapter 4  
Thermal Design of Custom 1U-2P Systems  
21  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
Depending on the system features and layout, more space around the socket may be available for the  
thermal solution than is shown in Figure 4 on page 21. This space permits heat sink designs with  
better thermal performance.  
Appendix B on page 45 shows a complete, detailed set of keep-out drawings for custom 1U-2P  
systems based on socket F (1207) processors.  
4.2  
Thermal Solution Design Requirements  
To maintain the case temperature of the processor below the maximum specification, certain heat sink  
design parameters must be considered. Table 4 provides the design-target specifications that must be  
met for socket F (1207) processors to operate reliably.  
Table 4.  
Thermal Solution Design Requirements for Custom 1U-2P Systems  
Symbol  
Description  
Maximum  
L
Length of heat sink  
Width of heat sink  
Height of heat sink  
87 mm  
74 mm  
28 mm  
W
H
0.26°C/W1, 2, 3  
θca  
Case-to-ambient thermal  
resistance  
MHS  
Fclip  
TA  
Mass of heat sink  
Clip force  
450 g to 700 g  
75 lbs ±15 lbs  
38°C  
Local air temperature entering  
processor heat sink  
Notes:  
1. This is the thermal resistance required for dual core, 90-nm socket F (1207) processors. The thermal resistance  
requirement may vary depending on the product OPN. The user should consult the processor data sheet for the  
thermal requirements specific to the part.  
2. Heat sinks weighing up to 450 g can be attached to the motherboard. Heat sinks weighing over 450 g should be tied  
directly to the chassis for more reliable shock and vibration performance.  
3. This chapter describes a heat sink weighing less than or equal to 450 g.  
4.3  
Sample Heat Sinks and Attachment Methods  
The following sections provide one possible thermal design solution and the specifics on attaching  
that solution to the motherboard.  
Table 5 on page 23 lists the parts used in the thermal reference design solution for 1U-2P systems  
based on socket F (1207) processors.  
22  
Thermal Design of Custom 1U-2P Systems  
Chapter 4  
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32800 Rev. 3.02 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
Table 5.  
Components for the Processor Thermal Reference Design for Custom 1U-2P  
Systems  
Part Description  
Material  
Quantity  
Heat sink  
Fan  
Copper base, aluminum fins  
Plastic  
1
1
2
1
Spring screw  
Backplate  
SK7 heat treated spring steel  
Low carbon steel, anti-corrosive  
finish  
Insulator  
Formex GK-17  
1
Figure 5 on page 24 shows an exploded view of the components used in the thermal reference design  
solution for custom 1U-2P systems based on socket F (1207) processors.  
Chapter 4  
Thermal Design of Custom 1U-2P Systems  
23  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
Figure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems  
The following sections describe the mechanical requirements of the components shown in Figure 5.  
4.3.1  
Backplate Assembly  
For details on the backplate assembly, see section 3.3.1 on page 18.  
Note: The backplate for this custom design has a mounting-hole pitch of 4.1 inches.  
4.3.2  
Spring Screws  
The spring screws are designed to apply 75 lbs of force to the heat sink. This force is necessary to  
help prevent the heat sink from lifting off the package during shock- or vibration-induced events.  
24  
Thermal Design of Custom 1U-2P Systems  
Chapter 4  
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32800 Rev. 3.02 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
Lifting the heat sink away from the processor can result in damage to the processor contact pads, the  
socket contacts, or the socket solder-ball joints. Maintaining the spring force is important for the life  
of the processor and the socket and for repeated installations and upgrades of the processor.  
4.3.3  
Heat Sink  
Figure 6 shows a picture of the reference design heat sink for 1U-2P systems. The footprint of the  
heat sink is 87 mm x 74 mm. The heat sink weighs 420 g and has aluminum fins soldered to a copper  
base. The copper base tapers from a thickness of 6 mm at the center to 1.5 mm at the edges. This  
tapering provides optimum heat-spreading performance from the processor to the heat sink while  
keeping the heat sink weight within specification. The fin geometry is designed to provide optimized  
thermal performance in combination with the fans, as described in Section 4.3.4, on page 26, in a  
typical 1U-2P system.  
Figure 6. High Performance Heat Sink for Custom 1U-2P Systems  
Table 6 shows the parameters of the aluminum fins for the high-performance heat sink shown in  
Figure 6.  
Table 6.  
Fin Parameters  
Height (at  
Length  
Height (at Edges) Thickness Pitch No. of Fins  
Center)  
87 mm  
22 mm  
26.5 mm  
0.4 mm  
1.48  
mm  
50  
Chapter 4  
Thermal Design of Custom 1U-2P Systems  
25  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
Other fan and heat sink combinations may yield adequate thermal performance. The system designer  
must ensure that the thermal solution provides required cooling for the processor for the given system  
layout and flow characteristics.  
Because the processor-mounting surface extends above the surface of the cam box on the socket, the  
heat sink bottom can be flat. The heat sink must have a flat surface of at least 40 mm x 40 mm,  
centered over the processor.  
Figure 7 shows the measured thermal performance vs. flow rate for a slightly shorter version of this  
heat sink (3.5" hole pitch vs. 4.1" hole pitch). This data represents the expected performance of this  
heat sink on a dual-core socket F (1207) processor. Based on flow tests on the AMD reference 1U-2P  
system, the flow through the heat sink is estimated to be approximately 20 cubic feet per minute  
(CFM). Figure 7 shows that this corresponds to case-to-ambient thermal resistance of 0.24°C/W. This  
case-to-ambient thermal resistance has been confirmed through system thermal tests. The  
requirement (see Table 4 on page 22) is 0.26°C/W.  
Figure 7. Thermal Performance Chart of Heat Sink When Used with a Dual-Core Processor  
in 90 nm Process  
4.3.4  
Fans  
AMD has tested the heat sink described in Section 4.3 on page 22 with a row of five 40 mm x 50 mm  
x 56 mm fans (Delta Part number GFB0412EHS) in a typical 1U-2P system. The fan has a 27.3-CFM  
maximum flow rate and a 1.63-inches water maximum pressure head. The heat sinks are ducted so  
the flow from two fans enters each of the processor heat sinks.  
26  
Thermal Design of Custom 1U-2P Systems  
Chapter 4  
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32800 Rev. 3.02 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
4.3.5  
Thermal Interface Material  
The heat sink contacts the top surface of the processor package and utilizes the thermal interface  
material between the processor lid and the heat sink. AMD recommends using a high performance  
grease such as Shin-Etsu 7783D or Dow Corning TC-5022. AMD does not recommend using phase  
change materials between the heat sink and the processor. Phase-change materials develop high  
adhesion forces between the heat sink and processor when the material is in the solid phase. This  
strong adhesive force can cause the processor to stick to the heat sink, making heat sink removal  
difficult and damaging the socket solder balls.  
Chapter 4  
Thermal Design of Custom 1U-2P Systems  
27  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
28  
Thermal Design of Custom 1U-2P Systems  
Chapter 4  
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32800 Rev. 3.02 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
Chapter 5 Thermal Design of Custom 2U-4P  
Systems  
This chapter describes the motherboard component-height restrictions, thermal-solution design  
requirements, sample heat sinks, and attachment methods for custom 2U-4P systems based on socket  
F (1207) processors.  
Note: These keep-outs are defined for custom rack mount equipment to optimize thermal and  
acoustic performance in these systems. These keep-outs are not compliant with AMD  
Processor-In-a-Box (PIB) thermal solutions.  
5.1  
Motherboard Component Height Restrictions  
The mounting solution for the heat sink calls for a standard motherboard keep-out region and  
mounting holes for the processor. Figure 8 shows an overview of the motherboard component height  
restrictions for custom 2U-4P systems based on the thermal solution for socket F (1207) processors.  
Figure 8. Motherboard Component-Height Restrictions for Custom 2U-4P Systems  
Chapter 5  
Thermal Design of Custom 2U-4P Systems  
29  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.00 August 2006  
Depending on the system features and layout, more space around the socket may be available for the  
thermal solution than is shown in Figure 8 on page 29. This space permits heat sink designs with  
better thermal performance.  
Appendix C on page 53 shows a complete, detailed set of keep-out drawings for custom 2U-4P  
systems based on socket F (1207) processors.  
5.2  
Thermal Solution Design Requirements  
Table 7 provides the design-target specifications that must be met for socket F (1207) processors to  
operate reliably in a typical 2U-4P system based on socket F (1207) processors.  
Table 7.  
Thermal Solution Design Requirements for Custom 2U-4P Systems  
Symbol  
Description  
Maximum  
L
W
H
Length of heat sink  
Width of heat sink  
Height of heat sink  
92 mm  
58 mm  
40 mm  
0.26°C/W1, 2, 3  
θca  
Case-to-ambient thermal  
resistance  
MHS  
Fclip  
TA  
Mass of heat sink  
Clip force  
450 g to 700 g  
75 lbs ±15 lbs  
38°C  
Local ambient temperature near  
processor  
Notes:  
1. This is the thermal resistance required for dual-core, 90-nm socket F (1207) processors. The thermal resistance  
requirement may vary depending on the product OPN. The user should consult the processor data sheet for the  
thermal requirements specific to the part.  
2. Heat sinks weighing up to 450 g can be attached to the motherboard. Heat sinks weighing over 450 g should be tied  
directly to the chassis for more reliable shock and vibration performance.  
3. This chapter describes a heat sink weighing less than or equal to 450 g. Design examples of solutions up to 700 g are  
in development.  
5.3  
Sample Heat Sinks and Attachment Methods  
The following sections provide one possible thermal design solution and the specifics on attaching  
that solution to the motherboard.  
Table 8 on page 31 lists the parts used in the thermal reference design for Custom 2U-4P systems  
based on socket F (1207) processors.  
30  
Thermal Design of Custom 2U-4P Systems  
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32800 Rev. 3.02 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
Table 8.  
Components for the Processor Thermal Reference Design for Custom 2U-4P  
Systems  
Part Description  
Material  
Quantity  
Heat sink  
Fan  
Aluminum  
Plastic  
1
1
1
2
1
Spring clip  
Retention frame  
Backplate  
SK7 heat treated spring steel  
Lexan, 20% glass-filled  
Low carbon steel, anti-corrosive  
finish  
Insulator  
Formex GK-17  
1
Figure 9 on page 32 shows an exploded view of the components used in the thermal reference design  
solution for custom 2U-4P systems based on socket F (1207) processors.  
Chapter 5  
Thermal Design of Custom 2U-4P Systems  
31  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.00 August 2006  
Figure 9. Exploded View of Thermal Solution for Custom 2U-4P System Based on Socket F  
(1207) Processors  
The following sections describe the mechanical requirements of the components shown in Figure 9.  
5.3.1  
Backplate Assembly  
For details on the backplate assembly, see section 3.3.1 on page 18.  
Note: The backplate for this custom design has a mounting-hole pitch of 4.1 inches.  
32  
Thermal Design of Custom 2U-4P Systems  
Chapter 5  
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32800 Rev. 3.02 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
5.3.2  
Spring Clip  
The spring clip is designed to apply 75 lbs of force to the center of the heat sink. This force is  
necessary to help prevent the heat sink from lifting off of the package during shock or vibration-  
induced events. Lifting the heat sink away from the processor can result in damage to the processor  
contact pads, the socket contacts, or the socket solder-ball joints. Maintaining the spring force is  
important for the life of the processor and for repeated installations and upgrades of the processor.  
The spring clip material is heat-treatable spring steel, SK7. AMD strongly recommends using SK7 or  
an equivalent material for the spring clip. The clip should be plated after heat treatment for cosmetic  
and anti-corrosive reasons. Table 9 gives the chemical composition of SK7. The heat treatment used  
should bring the ultimate strength of the material to a minimum of 1,300 megapascals (MPa) or 189  
kilopounds per square inch (kpsi), and it should bring the yield strength to 940 MPa (or 136 kpsi).  
Other materials commonly used for heat sink spring clips have been shown to yield under the high  
load of the initial spring-clip deflection and become deformed so that the spring clip can no longer  
apply the same load.  
Table 9.  
Chemical Element of SK7 Spring Steel  
Element  
Percentage of the Element  
C
Si  
Mn  
P
0.60-0.70  
Maximum 0.35  
0.80-0.90  
Maximum 0.030  
Maximum 0.030  
Remaining balance  
S
Fe  
5.3.3  
Retention Frame  
The plastic retention frame, made of 20% glass-filled Lexan, is a two-piece implementation rather  
than the single-piece frame used for socket 940. This change accommodates the larger foot-print of  
socket F (1207) processors.  
The retention frame serves multiple purposes. The retention frame aligns the heat sink and provides a  
stop for the heat sink in large shock-force events. The retention frame and backplate are attached to  
the motherboard by the motherboard vendor. Two screws securely hold the backplate and retention  
frame together. The two mounting tabs on the retention frame serve as attachment points for the heat  
sink spring clip.  
5.3.4  
Heat Sink  
Figure 10 on page 34 shows a picture of the reference design heat sink for 2U-4P systems. The  
footprint of the reference design heat sink is 92 mm x 58 mm. The heat sink weighs 378 g and has an  
aluminum fin stack soldered to the copper base. The copper base tapers from a thickness of 7 mm at  
Chapter 5  
Thermal Design of Custom 2U-4P Systems  
33  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.00 August 2006  
the center to 2.5 mm at the edges. The heat sink also has three heat pipes soldered to the base and  
connected to the top of the fin stack to improve fin efficiency. This design provides optimum heat  
spreading performance from the processor to the heat sink. The fin geometry has been designed to  
provide optimized thermal performance in combination with the fans, as described in Section 5.3.5,  
on page 35, in a typical 2U-4P system.  
Figure 10. High Performance Heat Sink for Custom 2U-4P Systems  
Table 10 shows the parameters of the aluminum fins for the high-performance heat sink shown in  
Figure 10.  
Table 10. Fin Parameters  
Length Height (at Center) Height (at Edges) Thickness Pitch No of Fins  
92 mm  
32.5 mm  
37 mm  
0.2 mm 1.5 mm  
39  
Other fan and heat sink combinations may yield adequate thermal performance. The system designer  
must ensure that the thermal solution provides required cooling for the processor for the given system  
layout and flow characteristics.  
Because the processor-mounting surface extends above the surface of the cam box on the socket, the  
heat sink bottom can be flat. The heat sink must have a flat surface of at least 40 mm x 40 mm,  
centered over the processor.  
Figure 11 shows the measured thermal performance vs. flow rate for this heat sink. This data  
represents the expected performance of this heat sink on a dual-core socket F (1207) processor. Based  
34  
Thermal Design of Custom 2U-4P Systems  
Chapter 5  
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32800 Rev. 3.02 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
on flow simulations of an AMD reference 2U system, the flow-through of the heat sink is  
approximately 18 CFM. Figure 11 shows that this flow rate corresponds to a case-to-ambient thermal  
resistance of 0.22°C/W. This case-to-ambient thermal resistance exceeds requirements (see Table 7  
on page 30).  
Figure 11. Thermal Performance Chart of Heat Sink When Used with a Dual-Core Processor  
in 90 nm Process  
5.3.5  
Fans  
AMD has conducted simulations of the heat sink described in Section 5.3.4 on page 33 with two 60  
mm x 60 mm x 38 mm fans (Delta Part number FFB0812EHE-HS2) in series, that is, back to back.  
The fans have a maximum flow rate of 80.2 CFM and a maximum pressure drop of 0.8 inches of  
water. The heat sinks are ducted so the flow from the two fans enters the processor heat sinks with  
some bypass. The bypass is designed to cool the core VRM.  
5.3.6  
Thermal Interface Material  
The heat sink makes contact with the top surface of the processor package utilizing the thermal  
interface material between the processor lid and the heat sink. AMD recommends using a high  
performance grease such as Shin-Etsu 7783D or Dow Corning TC-5022. AMD does not recommend  
using phase change materials between the heat sink and the processor. Phase-change materials  
develop high adhesion forces between the heat sink and processor when the material is in the solid  
phase. This strong adhesive force may cause the processor to stick to the heat sink, making heat sink  
removal difficult and damaging the socket solder balls.  
Chapter 5  
Thermal Design of Custom 2U-4P Systems  
35  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.00 August 2006  
36  
Thermal Design of Custom 2U-4P Systems  
Chapter 5  
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32800 Rev. 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
Appendix A Keep-Out Drawings for Platforms  
Using the PIB Thermal Solution for  
Socket F (1207) Processors  
Appendix A contains detailed recommended keep-out drawings for processor heat sink and mounting  
hardware for platforms using socket F (1207) Processor-In-a-Box (PIB) processors. Depending on the  
system features and layout, more space around the processor may be available for the thermal  
solution than is shown in these drawings. This space permits the design of heat sinks with better  
thermal performance.  
Appendix A  
Keep-Out Drawings for Platforms Using the PIB Thermal  
Solution for Socket F (1207) Processors  
37  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
Figure 12. Socket F (1207) PIB Board Component Height Restrictions  
38  
Keep-Out Drawings for Platforms Using the PIB Thermal  
Appendix A  
Solution for Socket F (1207) Processors  
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32800 Rev. 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
8 0 0 3 .  
1 4 . 7 6  
6 3 . 6 4  
4 3 5 2 .  
5
x 2  
x 2  
3 5 2 .  
9 6 1 .  
1 8 . 5 9  
5
1 9 . 4 9  
0 0 0 0 .  
7
0 0 0 .  
x 2  
x 2  
3 9 0 .  
7 8 0 7 .  
9 0 . 1 0  
9 9 . 1 9  
6 6 9 0 .  
1 4 4 1 .  
4 5 . 2 4  
9 5 . 3 6  
Figure 13. Socket F (1207) PIB Mounting Holes, Contact Pads, and No-Routing Zone  
Appendix A  
Keep-Out Drawings for Platforms Using the PIB Thermal  
Solution for Socket F (1207) Processors  
39  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
9 1 8 2 .  
2 5 0 . 1  
1 6 . 5 5  
6 . 3 8  
1
1
8 7 4 . 0  
9 . 1 9  
0 0 0 0 .  
4 7 2 0 .  
0 0 0 .  
9 3 . 1 8  
Figure 14. Socket F (1207) PIB Socket Outline and Socket Window  
40  
Keep-Out Drawings for Platforms Using the PIB Thermal  
Appendix A  
Solution for Socket F (1207) Processors  
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32800 Rev. 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
x 2  
x 2  
x 2  
8
4
0 0 3 .  
8 3 2 3 .  
6 5 2 .  
4 1 7 6 .  
9 5 7 1 .  
4 1 6 7 .  
0 0 0 0 . 0 0 0 .  
x 2  
x 2  
x 2  
6
0 8 1 .  
2 6 1 .  
4 4 1 .  
5 9 2 7 .  
1 3 3 2 .  
5 9 3 6 .  
5
1
Figure 15. Socket F (1207) PIB Heat Sink Height Restriction Zone  
Appendix A  
Keep-Out Drawings for Platforms Using the PIB Thermal  
Solution for Socket F (1207) Processors  
41  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
8 8 2 5 .  
2 9 7 3 .  
0 0 0 0 .  
3 1 1 8 .  
0 0 0 .  
4 7 3 3 .  
Figure 16. Socket F (1207) PIB Board No-Through-Hole Keep-Out  
42  
Keep-Out Drawings for Platforms Using the PIB Thermal  
Appendix A  
Solution for Socket F (1207) Processors  
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32800 Rev. 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
8 8 2 5 .  
5 3 2 4 .  
2 9 7 3 .  
3 6 6 4 .  
x 2  
x 2  
5
9 6 1 .  
3 3 1 .  
9 1 4 9 .  
5
9 1 3 3 .  
2 x  
2 3 0 3 .  
3 9 0 .  
9 1 5 .  
0 0 0 0 .  
0 0 0 .  
x 2  
7
0 9 1 0 .  
9 6 0 6 .  
3 1 1 8 .  
5 4 2 4 .  
4 7 3 3 .  
Figure 17. Socket F (1207) PIB Board Bottom Side Keep-Out  
Appendix A  
Keep-Out Drawings for Platforms Using the PIB Thermal  
43  
Solution for Socket F (1207) Processors  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
44  
Keep-Out Drawings for Platforms Using the PIB Thermal  
Appendix A  
Solution for Socket F (1207) Processors  
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32800 Rev. 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
Appendix B Keep-Out Drawings for Custom 1U-  
2P Systems Based on the Socket F  
(1207) Processor  
Appendix B contains detailed recommended keep-out drawings for processor heat sink and mounting  
hardware for a custom 1U-2P system based on the socket F (1207) processors. Depending on the  
system features and layout, more space around the processor may be available for the thermal  
solution than is shown in these drawings. This space permits the design of heat sinks with better  
thermal performance.  
Note: These keep-outs are defined for custom rack mount equipment to optimize thermal and  
acoustic performance in these systems. These keep-outs are not compliant with AMD  
Processor-In-a-Box (PIB) thermal solutions.  
Appendix B  
Keep-Out Drawings for Custom 1U-2P Systems Based on the  
Socket F (1207) Processor  
45  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
Figure 18. Socket F (1207) 1U-2P Board Component Height Restrictions  
46  
Keep-Out Drawings for Custom 1U-2P Systems Based on the  
Socket F (1207) Processor  
Appendix B  
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32800 Rev. 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
8 3 2 4 .  
8 9 . 7 1  
6 3 . 6 4  
x 2  
x 2  
4
3 5 2 .  
6 9 1 .  
5
1 9 . 4 9  
0 0 0 0 .  
0 0 0 .  
x 2  
x 2  
7
6
9 3 0 .  
6 9 0 .  
9 0 . 1 0  
4 5 . 2 4  
2 6 1 6 .  
6 1 . 3 2  
Figure 19. Socket F (1207) 1U-2P Mounting Holes, Contact Pads, and No-Routing Zone  
Appendix B  
Keep-Out Drawings for Custom 1U-2P Systems Based on the  
Socket F (1207) Processor  
47  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
9 1 8 2 .  
1 6 . 5 5  
4 8 7 . 0  
1
9 . 1 9  
0 0 0 0 .  
4 7 2 0 .  
0 0 0 .  
9 3 . 1 8  
Figure 20. Socket F (1207) 1U-2P Socket Outline and Socket Window  
48  
Keep-Out Drawings for Custom 1U-2P Systems Based on the  
Appendix B  
Socket F (1207) Processor  
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32800 Rev. 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
9 2 4 3 .  
4
3 5 . 8 2  
x 2  
3 8 2 .  
8 9 . 7 1  
0 0 0 0 .  
0 0 0 .  
x 2  
6
6 2 1 .  
6 1 . 3 2  
1 6 8 1 .  
1 7 . 4 2  
Figure 21. Socket F (1207) 1U-2P Heat Sink Height Restriction Zone  
Appendix B  
Keep-Out Drawings for Custom 1U-2P Systems Based on the  
Socket F (1207) Processor  
49  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
1 6 3 6 .  
1 4 . 8 0  
0 0 0 0 .  
5 9 1 8 .  
0 0 0 .  
9 5 . 4 0  
Figure 22. Socket F (1207) 1U-2P Board No-Through-Hole Keep-Out  
50  
Keep-Out Drawings for Custom 1U-2P Systems Based on the  
Appendix B  
Socket F (1207) Processor  
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32800 Rev. 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
1 6 3 6 .  
1 4 . 8 0  
6 8 . 7 4  
x 2  
7
9 4 2 .  
8 3 2 4 .  
8 9 . 7 1  
6 8 . 6 1  
x 2  
x 2  
5
4 3 2 .  
9 6 1 5 .  
1 9 . 4 9  
9 . 3 3  
x 2  
3 3 1 5 .  
2 3 0 3 .  
1
x 2  
1
9 5 .  
0 0 0 0 .  
0 0 0 .  
x 2  
x 2  
7
3 9 0 .  
8 6 0 .  
9 0 . 1 0  
4 0 . 2 2  
8
2 6 1 6 .  
6 1 . 3 2  
4 0 . 3 5  
x 2  
0
3 8 1 .  
5 9 1 8 .  
9 5 . 4 0  
Figure 23. Socket F (1207) 1U-2P Backplate Contact Zone  
Appendix B  
Keep-Out Drawings for Custom 1U-2P Systems Based on the  
Socket F (1207) Processor  
51  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
52  
Keep-Out Drawings for Custom 1U-2P Systems Based on the  
Appendix B  
Socket F (1207) Processor  
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32800 Rev. 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
Appendix C Keep-Out Drawings for Custom 2U-  
4P Systems Based on the Socket F  
(1207) Processor  
Appendix C contains detailed recommended keep out drawings for processor heat sink and mounting  
hardware for a 2U-4P system based on the socket F (1207) processor. Depending on the system  
features and layout, more space around the processor may be available for the thermal solution than is  
shown in these drawings. This space permits the design of heat sinks with better thermal  
performance.  
Note: These keep-outs are defined for custom rack mount equipment to optimize thermal and  
acoustic performance in these systems. These keep-outs are not compliant with AMD  
Processor-In-a-Box (PIB) thermal solutions.  
Appendix C  
Keep-Out Drawings for Custom 2U-4P Systems Based on the  
Socket F (1207) Processor  
53  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
Figure 24. Socket F (1207) 2U-4P Board Component Height Restrictions  
54  
Keep-Out Drawings for Custom 2U-4P Systems Based on the  
Socket F (1207) Processor  
Appendix C  
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32800 Rev. 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
4 3 3 4 .  
2 2 . 8 7  
. 9 1 7  
x 2  
x 2  
1
9 7 2 .  
8
4 7 7 5 .  
3 6 6 4 .  
4 3 . 8 2  
4
5 3 2 .  
0 0 0 0 .  
6
0 0 0 .  
x 2  
x 2  
9 6 0 .  
5 4 2 4 .  
6 5 3 5 .  
6 6 . 2 1  
4
6
. 1 2 3  
4 0 1 .  
8 6 1 6 .  
0 4 . 4 7  
Figure 25. Socket F (1207) 2U-4P Mounting Holes, Contact Pads, and No-Routing Zone  
Appendix C  
Keep-Out Drawings for Custom 2U-4P Systems Based on the  
Socket F (1207) Processor  
55  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
1 . 8 2 9  
5 . 2 1 0  
1 6 . 5 5  
1 6 . 3 8  
4 8 . 7 0  
1
. 9 9 1  
0 . 0 0 0  
7 . 2 0 4  
0 0 0 .  
9 3 . 1 8  
Figure 26. Socket F (1207) 2U-4P Socket Outline and Socket Window  
56  
Keep-Out Drawings for Custom 2U-4P Systems Based on the  
Appendix C  
Socket F (1207) Processor  
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32800 Rev. 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
x 2  
9 2 4 3 .  
8 3 2 .  
3 5 . 8 2  
8 9 . 7 1  
x 2  
4
0 6 2 2 .  
1 4 . 5 7  
0 0 0 0 .  
0 0 0 .  
6 9 0 3 .  
9 5 . 1 7  
x
2
6 2 6 1 .  
6
1 . 3 2  
x 2  
1 6 8 1 .  
1 7 . 4 2  
Figure 27. Socket F (1207) 2U-4P Heat Sink Height Restriction Zone  
Appendix C  
Keep-Out Drawings for Custom 2U-4P Systems Based on the  
Socket F (1207) Processor  
57  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
6 1 6 3 .  
1 4 . 8 0  
0 0 0 0 .  
0 0 0 .  
8 5 9 1 .  
9 5 . 4 0  
Figure 28. Socket F (1207) 2U-4P Board No-Through-Hole Keep-Out  
58  
Keep-Out Drawings for Custom 2U-4P Systems Based on the  
Appendix C  
Socket F (1207) Processor  
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32800 Rev. 3.00 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
6 6 1 3 .  
7
1 4 8 0 .  
6 8 . 7 4  
x 2  
9 4 2 .  
4 3 8 2 .  
5
8 9 7 1 .  
6 8 . 6 1  
x 2  
x 2  
4 3 2 .  
9 6 1 .  
5
5
1 9 . 4 9  
1 9 . 3 3  
x 2  
3 3 1 .  
x 2  
3
2 3 0 .  
9 1 5 .  
0 0 0 0 .  
0 0 0 .  
x 2  
x 2  
7
8
3 9 0 .  
8 6 0 .  
9 0 . 1 0  
4 0 . 2 2  
x 2  
0
3 8 1 .  
4 0 . 3 5  
8 9 5 1 .  
9 5 4 0 .  
Figure 29. Socket F (1207) 2U-4P Backplate Contact Zone  
Appendix C  
Keep-Out Drawings for Custom 2U-4P Systems Based on the  
59  
Socket F (1207) Processor  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.02 August 2006  
60  
Keep-Out Drawings for Custom 2U-4P Systems Based on the  
Appendix C  
Socket F (1207) Processor  
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32800 Rev. 3.02 August 2006  
Thermal Design Guide for Socket F (1207) Processors  
Appendix D Flow Simulation Results for Custom  
2U-4P Systems Based on Socket F  
(1207) Processors  
Appendix D describes the flow simulation results for 2U-4P systems based on socket F (1207)  
processors.  
Figure 30 shows a floor plan of an AMD reference custom 2U-4P system.  
Figure 30. Floor-Plan of AMD Reference Custom 2U-4P System  
Figure 31 shows a streamline plot of an AMD reference 2U-4P system.  
Appendix D  
Flow Simulation Results for Custom 2U-4P Systems Based on  
Socket F (1207) Processors  
61  
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Thermal Design Guide for Socket F (1207) Processors  
32800 Rev. 3.00 August 2006  
Figure 31. Streamline Plot of AMD Reference Custom 2U-4P System  
Thermal simulation of the 2U-4P system shown in Figure 30 on page 61 with the heat sink and fan  
described in Chapter 5 on page 29 predicts a flow rate through the heat sink of approximately 18  
CFM and an air inlet temperature at the processor heat sinks of 3°C above external ambient  
temperature.  
62  
Flow Simulation Results for Custom 2U-4P Systems Based on  
Socket F (1207) Processors  
Appendix D  
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