Intel Computer Hardware E8500 User Manual

®
Intel E8500 Chipset North  
Bridge (NB) and eXternal Memory  
Bridge (XMB)  
Thermal/Mechanical Design Guide  
March 2005  
Document Number 306749-001  
Contents  
1
Introduction.........................................................................................................................7  
2
3
Packaging Technology.....................................................................................................11  
Thermal Specifications.....................................................................................................15  
4
5
Thermal Simulation ..........................................................................................................17  
Thermal Metrology ...........................................................................................................19  
6
7
8
NB Reference Thermal Solution #1..................................................................................23  
NB Reference Thermal Solution #2..................................................................................31  
XMB Reference Thermal Solution....................................................................................37  
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Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
3
A
B
Thermal Solution Component Suppliers ..........................................................................43  
Mechanical Drawings.......................................................................................................47  
Figures  
6-1  
First NB Reference Heatsink Measured Thermal Performance vs.  
Second NB Reference Heatsink Measured Thermal Performance vs.  
7-1  
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4
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
Revision History  
Document  
Number  
Revision  
Number  
Description  
Date  
306749  
001  
Initial release of this document  
March 2005  
NOTE: Not all revisions may be published.  
§
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6
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
1 Introduction  
As the complexity of computer systems increases, so do the power dissipation requirements. Care  
must be taken to ensure that the additional power is properly dissipated. Typical methods to  
improve heat dissipation include selective use of ducting, and/or passive heatsinks.  
The goals of this document are to:  
®
Outline the thermal and mechanical operating limits and specifications for the Intel E8500  
®
chipset North Bridge (NB) component and the Intel E8500 chipset eXternal Memory Bridge  
(XMB) component.  
Describe two reference thermal solutions that meet the specification of the E8500 chipset NB  
component.  
Describe a reference thermal solution that meets the specification of the E8500 chipset XMB  
component.  
Properly designed thermal solutions provide adequate cooling to maintain the E8500 chipset die  
temperatures at or below thermal specifications. This is accomplished by providing a low local-  
ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient  
thermal resistance. By maintaining the E8500 chipset die temperature at or below the specified  
limits, a system designer can ensure the proper functionality, performance, and reliability of the  
chipset. Operation outside the functional limits can degrade system performance and may cause  
permanent changes in the operating characteristics of the component.  
The simplest and most cost effective method to improve the inherent system cooling characteristics  
is through careful chassis design and placement of fans, vents, and ducts. When additional cooling  
is required, component thermal solutions may be implemented in conjunction with system thermal  
solutions. The size of the fan or heatsink can be varied to balance size and space constraints with  
acoustic noise.  
This document addresses thermal design and specifications for the E8500 chipset NB and XMB  
components only. For thermal design information on other chipset components, refer to the  
®
respective component datasheet. For the Intel 6700PXH 64-bit PCI Hub, refer to the  
®
Intel 6700PXH 64-bit PCI Hub Thermal Design Guidelines. For the ICH5, refer to the  
®
®
Intel 82801EB I/O Controller Hub 5 (ICH5) and Intel 82801ER I/O Controller Hub 5 R  
(ICH5R) Thermal Design Guide.  
1.1  
Design Flow  
To develop a reliable, cost-effective thermal solution, several tools have been provided to the  
system designer. Figure 1-1 illustrates the design process implicit to this document and the tools  
appropriate for each step.  
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Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
7
   
Introduction  
Figure 1-1. Thermal Design Process  
001239  
1.2  
Definition of Terms  
BGA  
Ball grid array. A package type, defined by a resin-fiber substrate, onto which a  
die is mounted, bonded and encapsulated in molding compound. The primary  
electrical interface is an array of solder balls attached to the substrate opposite  
the die and molding compound.  
BLT  
ICH5  
IHS  
Bond line thickness. Final settled thickness of the thermal interface material  
after installation of heatsink.  
I/O controller hub. The chipset component that contains the primary PCI  
interface, LPC interface, USB, S-ATA, and other legacy functions.  
Integrated Heat Spreader, Integral part of the NB package. It enhances  
dissipation of heat generated by the NB die and provides interface surface  
between NB die and cooling solution.  
IMI  
Independent memory Interfaces. Port connecting the NB to the XMB  
®
Intel 6700PXH The chipset component that performs PCI bridging functions between the PCI  
64-bit PCI Hub  
Express* interface and the PCI Bus. It contains two PCI bus interfaces that can  
be independently configured to operate in PCI (33 or 66 MHz) or PCI-X*  
mode 1 (66, 100 or 133 MHz), for either 32- or 64-bit PCI devices.  
T
Maximum die temperature allowed. This temperature is measured at the  
geometric center of the top of the package die.  
case_max  
T
Minimum die temperature allowed. This temperature is measured at the  
geometric center of the top of the package die.  
case_min  
TDP  
Thermal design power. Thermal solutions should be designed to dissipate this  
target power level. TDP is not the maximum power that the chipset can  
dissipate.  
TIM  
NB  
Thermal interface material. Thermally conductive material installed between  
two surfaces to improve heat transfer and reduce interface contact resistance.  
®
Intel E8500 chipset North Bridge Component. The chipset component that  
provides the interconnect to the processors, XMBs and various I/O components.  
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8
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
   
Introduction  
®
XMB  
Intel E8500 chipset eXternal Memory Bridge Component. The chipset  
component that bridges the IMI and DDR interfaces.  
1.3  
Reference Documents  
The reader of this specification should also be familiar with material and concepts presented in the  
following documents:  
®
®
Intel 82801EB I/O Controller Hub 5 (ICH5) and Intel 82801ER I/O Controller Hub 5 R  
(ICH5R) Thermal Design Guide  
®
®
Intel 82801EB I/O Controller Hub 5 (ICH5) and Intel 82801ER I/O Controller Hub 5 R  
(ICH5R) Datasheet  
®
Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines  
®
Intel 6700PXH 64-bit PCI Hub Datasheet  
®
Intel E8500 Chipset North Bridge (NB) Datasheet  
®
Intel E8500 Chipset North Bridge (NB) Specification Update  
®
Intel E8500 Chipset eXternal Memory Bridge (XMB) Datasheet  
®
Intel E8500 Chipset eXternal Memory Bridge (XMB) Specification Update  
®
64-bit Intel Xeon™ Processor MP with up to 8MB L3 Cache Datasheet  
®
64-bit Intel Xeon™ Processor MP with up to 8MB L3 Cache Thermal/Mechanical Design  
Guidelines  
®
64-bit Intel Xeon™ Processor MP with 1MB L2 Cache Datasheet  
®
64-bit Intel Xeon™ Processor MP with 1MB L2 Cache Thermal/Mechanical Design  
Guidelines  
BGA/OLGA Assembly Development Guide  
Various system thermal design suggestions (http://www.formfactors.org)  
Note: Unless otherwise specified, these documents are available through your Intel field sales  
representative. Some documents may not be available at this time.  
§
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Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
9
 
Introduction  
®
10  
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
2 Packaging Technology  
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The E8500 chipsets consist of four individual components: the NB, the XMB, the Intel 6700PXH  
64-bit PCI Hub and the I/O controller hub (ICH5r). The E8500 chipset NB component use a  
42.5 mm squared, 12-layer flip chip ball grid array (FC-BGA) package (see Figure 2-1 through  
Figure 2-3). The E8500 chipset XMB component uses a 37.5mm squared, 10-layer FB-BGA  
package (see Figure 2-4 through Figure 2-6). For information on the Intel 6700PXH 64-bit PCI  
®
Hub package, refer to the Intel 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guide. For  
®
information on the ICH5 package, refer to the Intel 82801EB I/O Controller Hub 5 (ICH5) and  
®
Intel 82801ER I/O Controller Hub 5 R (ICH5R) Thermal Design Guide.  
Figure 2-1. NB Package Dimensions (Top View)  
Handling  
Exclusion  
Area  
38.5 mm  
NB  
38.5 mm  
42.5 mm  
IHS  
42.5 mm  
Figure 2-2. NB Package Dimensions (Side View)  
4.23 ± 0.146 mm  
IHS  
3.79 ± 0.144 mm  
2.44 ± 0.071 mm  
Substrate  
0.20  
See Note 4  
0.20 –C–  
See Note 1  
Seating Plane  
0.435 ± 0.025 mm  
See Note 3  
Notes:  
1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)  
2. All dimensions and tolerances conform to ANSI Y14.5M-1994  
3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm  
4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped)  
orientation after reflow  
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Intel 8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
11  
     
Packaging Technology  
Figure 2-3. NB Package Dimensions (Bottom View)  
AV  
A
U
A
AT  
R
A
AP  
N
AM  
AL  
AK  
AJ  
A
H
AG  
AF  
AE  
A
A
C
D
AB  
AA  
W
U
R
N
L
Y
V
T
42.5 + 0.05  
P
M
K
H
F
20.202  
J
G
E
37X 1.092  
D
B
C
A
2
4
6
8
10  
12  
14  
16  
18  
20  
22  
24  
26  
28  
30  
32  
34  
36  
38  
1
3
5
7
9
11  
13  
15  
17  
19  
21  
23  
25  
27  
29  
31  
33  
35  
37  
A
37X 1.092  
20.202  
B
42.5 + 0.05  
0.2  
C
A
NOTES:  
1. All dimensions are in millimeters.  
2. All dimensions and tolerances conform to ANSI Y14.5M-1994.  
®
12  
Intel 8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
 
Packaging Technology  
Figure 2-4. XMB Package Dimensions (Top View)  
Die  
Keepout  
Area  
Handling  
Exclusion  
Area  
14.02mm.  
8.88mm.  
XMB  
Die  
11.73mm. 6.65mm.  
23.50mm. 27.50mm. 37.50mm.  
23.50mm.  
27.50mm.  
37.50mm.  
Figure 2-5. XMB Package Dimensions (Side View)  
Substrate  
Decoup  
2.535 ± 0.123 mm  
Die  
Cap  
2.100 ± 0.121 mm  
0.84 ± 0.05 mm  
0.7 mm Max  
0.20  
See Note 4  
0.20 –C–  
Seating Plane  
0.435 ± 0.025 mm  
See Note 3  
See Note 1  
Notes:  
1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)  
2. All dimensions and tolerances conform to ANSI Y14.5M-1994  
3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm  
4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave  
(bowl shaped) orientation after reflow  
®
Intel 8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
13  
   
Packaging Technology  
Figure 2-6. XMB Package Dimensions (Bottom View)  
AV  
A
U
A
AT  
R
A
AP  
N
AM  
AL  
AK  
AJ  
A
H
AG  
AF  
AE  
A
A
C
D
AB  
AA  
W
U
R
N
L
Y
V
T
42.5 + 0.0  
P
M
K
H
F
20.202  
J
G
E
37X 1.092  
D
B
C
A
2
4
6
8
10  
12  
14  
16  
18  
20  
22  
24  
26  
28  
30  
32  
34  
36  
38  
1
3
5
7
9
11  
13  
15  
17  
19  
21  
23  
25  
27  
29  
31  
33  
35  
37  
A
37X 1.092  
20.202  
B
42.5 + 0.05  
0.2  
C
A
2.1  
Package Mechanical Requirements  
The E8500 chipset NB package has an IHS and the XMB package has an exposed bare die which is  
capable of sustaining a maximum static normal load of 15-lbf. The package is NOT capable of  
sustaining a dynamic or static compressive load applied to any edge of the bare die. These  
mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing,  
standard shipping conditions and/or any other use condition.  
Notes:  
1. The heatsink attach solutions must not include continuous stress onto the chipset package with  
the exception of a uniform load to maintain the heatsink-to-package thermal interface.  
2. These specifications apply to uniform compressive loading in a direction perpendicular to the  
bare die/IHS top surface.  
3. These specifications are based on limited testing for design characterization. Loading limits  
are for the package only  
§
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14  
Intel 8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
   
3 Thermal Specifications  
3.1  
Thermal Design Power (TDP)  
Analysis indicates that real applications are unlikely to cause the E8500 chipset NB/XMB  
components to consume maximum power dissipation for sustained time periods. Therefore, in  
order to arrive at a more realistic power level for thermal design purposes, Intel characterizes  
power consumption based on known platform benchmark applications. The resulting power  
consumption is referred to as the Thermal Design Power (TDP). TDP is the target power level that  
the thermal solutions should be designed to. TDP is not the maximum power that the chipset can  
dissipate.  
For TDP specifications, see Table 3-1 for the E8500 chipset NB component and Table 3-2 for the  
E8500 chipset XMB component FC-BGA packages have poor heat transfer capability into the  
board and have minimal thermal capability without a thermal solution. Intel recommends that  
system designers plan for one or more heatsinks when using the E8500 chipsets NB/XMB  
components.  
3.2  
Die Case Temperature Specifications  
To ensure proper operation and reliability of the E8500 chipset NB/XMB components, the die  
temperatures must be at or between the maximum/minimum operating temperature ranges as  
specified in Table 3-1 and Table 3-2. System and/or component level thermal solutions are required  
to maintain these temperature specifications. Refer to Section 5 for guidelines on accurately  
measuring package die temperatures.  
®
Table 3-1. Intel E8500 Chipset NB Thermal Specifications  
Parameter  
Value  
Notes  
Tcase_max  
104°C  
5°C  
Tcase_min  
TDPwith 1 XMB attached  
TDPwith 2 XMBs attached  
TDPwith 3 XMBs attached  
TDPwith 4 XMBs attached  
17.9W  
19.8W  
22.4W  
24.5W  
NOTE:  
1. These specifications are based on silicon characterization, however, they may be updated as further data  
becomes available.  
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Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
15  
         
Thermal Specifications  
®
Table 3-2. Intel E8500 Chipset XMB Thermal Specifications  
Parameter  
Value  
Notes  
Tcase_max  
Tcase_min  
105°C  
5°C  
TDPdual channel  
TDPdual channel  
TDPdual channel  
9.1W  
9.3W  
8.5W  
DDR-266  
DDR-333  
DDR2-400  
NOTE:  
1. These specifications are based on silicon characterization, however, they may be updated as further data  
becomes available.  
§
®
16  
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
   
4 Thermal Simulation  
Intel provides thermal simulation models of the E8500 chipset NB/XMB components and  
associated user's guides to aid system designers in simulating, analyzing, and optimizing their  
thermal solutions in an integrated, system-level environment. The models are for use with the  
commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool  
FLOTHERM* (version 3.1 or higher) by Flomerics, Inc. These models are also available in  
ICEPAK* format. Contact your Intel field sales representative to order the thermal models and  
user's guides.  
§
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Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
17  
Bridge (XMB) Thermal/Mechanical Design Guide  
 
Thermal Simulation  
®
18  
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
5 Thermal Metrology  
The system designer must make temperature measurements to accurately determine the thermal  
performance of the system. Intel has established guidelines for proper techniques to measure the  
NB/XMB die temperatures. Section 5.1 provides guidelines on how to accurately measure the  
NB/XMB die temperatures. Section 5.2 contains information on running an application program  
that will emulate anticipated maximum thermal design power. The flowchart in Figure 5-1 offers  
useful guidelines for thermal performance and evaluation.  
5.1  
Die Case Temperature Measurements  
To ensure functionality and reliability, the T  
of the NB/XMB must be maintained at or between  
case  
the maximum/minimum operating range of the temperature specification as noted in Table 3-1 and  
Table 3-2. The surface temperature at the geometric center of the die corresponds to T  
.
case  
Measuring T  
requires special care to ensure an accurate temperature measurement.  
case  
Temperature differences between the temperature of a surface and the surrounding local ambient  
air can introduce errors in the measurements. The measurement errors could be due to a poor  
thermal contact between the thermocouple junction and the surface of the package, heat loss by  
radiation and/or convection, conduction through thermocouple leads, and/or contact between the  
thermocouple cement and the heatsink base (if a heatsink is used). For maximize measurement  
accuracy, only the 0° thermocouple attach approach is recommended.  
Zero Degree Angle Attach Methodology  
1. Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0.06 in.) deep hole centered on the bottom of  
the heatsink base.  
2. Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered hole to one  
edge of the heatsink. The slot should be parallel to the heatsink fins (see Figure 5-2).  
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.  
4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts  
should match the slot and hole milled into the heatsink base.  
5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of  
the top surface of the die using a high thermal conductivity cement. During this step, ensure no  
contact is present between the thermocouple cement and the heatsink base because any contact  
will affect the thermocouple reading. It is critical that the thermocouple bead makes  
contact with the die (see Figure 5-3).  
6. Attach heatsink assembly to the NB/XMB and route thermocouple wires out through the  
milled slot.  
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Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
19  
     
Thermal Metrology  
Figure 5-1. Thermal Solution Decision Flowchart  
001240  
Figure 5-2. Zero Degree Angle Attach Heatsink Modifications  
NOTE: Not to scale.  
Figure 5-3. Zero Degree Angle Attach Methodology (Top View)  
Die  
Thermocouple  
Wire  
Cement +  
Thermocouple Bead  
Substrate  
001321  
NOTE: Not to scale.  
®
20  
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
     
Thermal Metrology  
5.2  
Power Simulation Software  
The power simulation software is a utility designed to dissipate the thermal design power on an  
E8500 chipset NB component or XMB component when used in conjunction with the 64-bit Intel  
Xeon™ processor MP. The combination of the above mentioned processor and the higher  
®
bandwidth capability of the E8500 chipsets enable higher levels of system performance. To assess  
the thermal performance of the chipset thermal solution under “worst-case realistic application”  
conditions, Intel is developing a software utility that operates the chipset at near worst-case thermal  
power dissipation.  
The power simulation software being developed should only be used to test thermal solutions at or  
near the thermal design power. Figure 5-1 shows a decision flowchart for determining thermal  
solution needs. Real world applications may exceed the thermal design power limit for transient  
time periods. For power supply current requirements under these transient conditions, please refer  
to each component's datasheet for the ICC (Max Power Supply Current) specification. Contact  
your Intel field sales representative to order the power utility software and user's guide.  
§
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Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
21  
 
Thermal Metrology  
®
22  
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
6 NB Reference Thermal Solution #1  
Intel has developed two different reference thermal solutions designed to meet the cooling needs of  
the E8500 chipset NB component under operating environments and specifications defined in this  
st  
document. This chapter describes the overall requirements for the 1 NB reference thermal  
solution including critical-to-function dimensions, operating environment, and validation criteria.  
Other chipset components may or may not need attached thermal solutions, depending on your  
®
specific system local-ambient operating conditions. For information on the Intel 6700PXH 64-bit  
®
PCI Hub, refer to thermal specification in the Intel 6700PXH 64-bit PCI Hub  
Thermal/Mechanical Design Guide. For information on the ICH5, refer to thermal specification in  
®
®
the Intel 82801EB I/O Controller Hub 5 (ICH5) and Intel 82801ER I/O Controller Hub 5 R  
(ICH5R) Thermal Design Guide.  
6.1  
Operating Environment  
The reference thermal solution was designed assuming a maximum local-ambient temperature of  
52°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is  
400 linear feet per minute (lfm). The approaching airflow temperature is assumed to be equal to the  
local-ambient temperature. The thermal designer must carefully select the location to measure  
airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C  
external-ambient temperature at sea level. (External-ambient refers to the environment external to  
the system.)  
The fasteners associated for this reference thermal solution is intended to be used on 0.062”  
thickness motherboard  
6.2  
Heatsink Performance  
st  
Figure 6-1 depicts the measured thermal performance of the 1 NB reference thermal solution  
versus approach air velocity. Since this data was measured at sea level, a correction factor would be  
required to estimate thermal performance at other altitudes.  
®
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
23  
     
NB Reference Thermal Solution #1  
Figure 6-1. First NB Reference Heatsink Measured Thermal Performance vs.  
Approach Velocity  
Ȍ
1.50  
1.40  
1.30  
1.20  
1.10  
1.00  
0.90  
0.80  
100  
200  
300  
400  
500  
600  
700  
Flow Rate (LFM)  
6.3  
Mechanical Design Envelope  
While each design may have unique mechanical volume and height restrictions or implementation  
requirements, the height, width, and depth constraints typically placed on the E8500 chipset NB  
thermal solution are shown in Figure 6-2.  
When using heatsinks that extend beyond the NB reference heatsink envelope shown in  
Figure 6-2, any motherboard components placed between the heatsink and motherboard cannot  
exceed 4.14 mm (0.16 in.) in height.  
®
24  
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
   
NB Reference Thermal Solution #1  
Figure 6-2. First NB Reference Heatsink Volumetric Envelope  
H e a ts in k  
F in  
H e a ts in k B a s e  
IH S  
+
T IM 2  
F C B G A  
+
S o ld e r B a lls  
M o th e rb o a rd  
6 4 .5 2 m m .  
4 2 .5 0 m m .  
T N B  
H e a ts in k  
H e a ts in k  
F in  
H e a ts in k B a s e  
6.4  
Board-Level Components Keepout Dimensions  
The location of hole pattern and keepout zones for the reference thermal solution are shown in  
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Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
25  
     
NB Reference Thermal Solution #1  
6.5  
First NB Heatsink Thermal Solution Assembly  
The reference thermal solution for the chipset NB component is a passive extruded heatsink with  
thermal interface. It is attached to the board by using four retaining Tuflok* fasteners. Figure 6-4  
shows the reference thermal solution assembly and associated components.  
Full mechanical drawings of the thermal solution assembly and the heatsink are provided in  
Appendix B. Appendix A contains vendor information for each thermal solution component.  
Figure 6-3. First NB Heatsink Board Component Keepout  
64.500mm.  
55.245mm.  
42.500mm.  
42.500mm. 55.245mm. 64.500mm.  
NB Location  
4X Ø 5.5mm  
4X Ø 2.95 ± 0.0254mm  
No Component Keep Out Area  
4.14mm Max Component Height  
Heatsink Mounting Hole  
NOTE: All dimensions are in millimeters.  
®
26  
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
   
NB Reference Thermal Solution #1  
6.5.1  
Heatsink Orientation  
Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned  
with the direction of the heatsink fins.  
Figure 6-4. First NB Heatsink Assembly  
6.5.2  
Extruded Heatsink Profiles  
The reference NB thermal solution uses an extruded heatsink for cooling the chipset NB.  
Figure 6-5 shows the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other  
heatsinks with similar dimensions and increased thermal performance may be available. Full  
mechanical drawing of this heatsink is provided in Appendix B.  
6.5.3  
6.5.4  
Mechanical Interface Material  
There is no mechanical interface material associated with this reference solution.  
Thermal Interface Material  
A TIM provides improved conductivity between the die and heatsink. The reference thermal  
solution uses Chomerics THERMFLOW* T710, 0.127 mm (0.005 in.) thick, 38.5 mm x 38.5 mm  
(1.5 in. x 1.5 in.) square.  
Note: Unflowed or “dry” Chomerics THERMFLOW T710 has a material thickness of 0.005 inch.  
The flowed or “wet” Chomerics THERMFLOW T710 has a material thickness of ~0.0025 inch  
after it reaches its phase change temperature.  
6.5.4.1  
Effect of Pressure on TIM Performance  
As mechanical pressure increases on the TIM, the thermal resistance of the TIM decreases. This  
phenomenon is due to the decrease of the bond line thickness (BLT). BLT is the final settled  
thickness of the thermal interface material after installation of heatsink. The effect of pressure on  
®
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
27  
               
NB Reference Thermal Solution #1  
the thermal resistance of the Chomerics THERMFLOW T710 TIM is shown in Table 6-1 The  
heatsink clip provides enough pressure for the TIM to achieve a thermal conductivity of 0.17°C  
2
inch /W.  
Table 6-1. Chomerics THERMFLOW* T710 TIM Performance as a Function of Attach Pressure  
Pressure (psi)  
Thermal Resistance (°C × in2)/W  
5
0.37  
0.30  
0.21  
0.17  
10  
20  
30  
NOTE:  
1. All measured at 50°C.  
6.5.5  
Heatsink Retaining Fastener  
The reference solution uses four heatsink retaining Tufloks. The fasteners attach the heatsink to the  
motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting holes.  
These fasteners are intended to be used on a 0.062” thickness motherboard with either of the two  
NB reference thermal solutions. See Appendix B for a mechanical drawing of the fastener.  
Figure 6-5. First NB Heatsink Extrusion Profile  
®
28  
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
     
NB Reference Thermal Solution #1  
6.6  
Reliability Guidelines  
Each motherboard, heatsink and attach combination may vary the mechanical loading of the  
component. Based on the end user environment, the user should define the appropriate reliability  
test criteria and carefully evaluate the completed assembly prior to use in high volume. Some  
general recommendations are shown in Table 6-2.  
Table 6-2. Reliability Guidelines  
Test (1)  
Requirement  
Pass/Fail Criteria (2)  
Mechanical  
Shock  
50 g, board level, 11 msec, 3 shocks/axis  
Visual Check and Electrical Functional  
Test  
Random  
Vibration  
7.3 g, board level, 45 min/axis, 50 Hz to  
2000 Hz  
Visual Check and Electrical Functional  
Test  
Temperature Life 85°C, 2000 hours total, checkpoints at 168,  
500, 1000, and 2000 hours  
Visual Check  
Thermal Cycling  
Humidity  
–5°C to +70°C, 500 cycles  
Visual Check  
Visual Check  
85% relative humidity, 55°C, 1000 hours  
NOTES:  
1. It is recommended that the above tests be performed on a sample size of at least twelve assemblies from  
three lots of material.  
2. Additional pass/fail criteria may be added at the discretion of the user.  
§
®
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
29  
     
NB Reference Thermal Solution #1  
®
30  
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
7 NB Reference Thermal Solution #2  
Intel has developed two different reference thermal solutions designed to meet the cooling needs of  
the E8500 chipset NB component under operating environments and specifications defined in this  
document. This chapter describes the overall requirements for the 2nd NB reference thermal  
solution including critical-to-function dimensions, operating environment, and validation criteria.  
Other chipset components may or may not need attached thermal solutions, depending on your  
®
specific system local-ambient operating conditions. For information on the Intel 6700PXH 64-bit  
®
PCI Hub, refer to thermal specification in the Intel 6700PXH 64-bit PCI Hub  
Thermal/Mechanical Design Guidelines. For information on the ICH5, refer to thermal  
®
®
specification in the Intel 82801EB I/O Controller Hub 5 (ICH5) and Intel 82801ER I/O  
Controller Hub 5 R (ICH5R) Thermal Design Guide.  
7.1  
Operating Environment  
The reference thermal solution was designed assuming a maximum local-ambient temperature of  
52°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is  
400 linear feet per minutes (lfm). The approaching airflow temperature is assumed to be equal to  
the local-ambient temperature. The thermal designer must carefully select the location to measure  
airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C  
external-ambient temperature at sea level. (External-ambient refers to the environmental external  
to the system.)  
The fastener for this reference thermal solution is intended to be used on motherboard with  
thickness between 0.085” and 0.093”.  
7.2  
Heatsink Performance  
nd  
Figure 7-1 depicts the measured thermal performance of the 2 NB reference thermal solution  
versus approach air velocity. Since this data was measured at sea level, a correction factor would be  
required to estimate thermal performance at other altitudes.  
®
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
31  
     
NB Reference Thermal Solution #2  
Figure 7-1. Second NB Reference Heatsink Measured Thermal Performance vs.  
Approach Velocity  
2.3  
2
1.7  
1.4  
1.1  
0.8  
0.5  
0
100  
200  
300  
400  
500  
600  
Flow Rate (LFM)  
7.3  
Mechanical Design Envelope  
While each design may have unique mechanical volume and height restrictions or implementation  
requirements, the height, width, and depth constraints typically placed on the E8500 chipset NB  
thermal solution are shown in Figure 7-2.  
When using heatsinks that extend beyond the NB reference heatsink envelope shown in Figure 7-2,  
any motherboard components placed between the heatsink and motherboard cannot exceed  
4.14 mm (0.16 in.) in height.  
®
32  
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
   
NB Reference Thermal Solution #2  
Figure 7-2. Second NB Reference Heatsink Volumetric Envelope  
H e a ts in k  
F in  
H e a ts in k B a s e  
IH S  
+
T IM  
2
F C B G A  
M o th e rb o a rd  
6 4 .5 2 m m .  
4 2 .5 0 m m .  
H e a ts in k B a s e  
H e a ts in k  
F in  
7.4  
7.5  
Board-Level Components Keepout Dimensions  
Please refer to Section 6.4 for detail.  
Second NB Heatsink Thermal Solution Assembly  
The reference thermal solution for the chipset NB component is a passive extruded heatsink with  
thermal interlace. It is attached to the board by using four retaining Tuflok fasteners. Figure 7-3  
shows the reference thermal solution assembly and associated components.  
Full mechanical drawings of the thermal solution assembly and the heatsink are provided in  
Appendix B. Appendix A contains vendor information for each thermal solution component.  
®
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
33  
     
NB Reference Thermal Solution #2  
Figure 7-3. Second NB Heatsink Assembly  
7.5.1  
Heatsink Orientation  
Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned  
with the direction of the heatsink fins.  
7.5.2  
7.5.3  
Extruded Heatsink Profiles  
Please refer to Section 6.5.2 for detail.  
Mechanical Interface Material  
There is no mechanical interface material associated with this reference solution.  
7.5.4  
Thermal Interface Material  
Please refer to Section 6.5.4 for detail.  
7.5.4.1  
Effect of Pressure on TIM Performance  
Please refer to Section 6.5.4.1 for detail.  
7.5.5  
Heatsink Retaining Fastener  
The reference solution uses four heatsink retaining Tufloks. The fasteners attached the heatsink to  
the motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting  
holes. These fasteners are intended to be used on 0.085” to 0.093” thickness motherboard with  
either of the two NB reference thermal solutions. See Appendix B for a mechanical drawing of the  
fastener.  
®
34  
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
           
NB Reference Thermal Solution #2  
7.6  
Reliability Guidelines  
Please refer to Section 6.6 for detail.  
§
®
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
35  
 
NB Reference Thermal Solution #2  
®
36  
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
8 XMB Reference Thermal Solution  
Intel has developed one different reference thermal solution designed to meet the cooling needs of  
the E8500 chipset XMB component under operating environments and specifications defined in  
this document. This chapter describes the overall requirements for the XMB reference thermal  
solution including critical-to-function dimensions, operating environment, and validation criteria.  
Other chipset components may or may not need attached thermal solutions, depending on your  
®
specific system local-ambient operating conditions. For information on the Intel 6700PXH 64-bit  
®
PCI Hub, refer to thermal specification in the Intel 6700PXH 64-bit PCI Hub  
Thermal/Mechanical Design Guide. For information on the ICH5, refer to thermal specification in  
®
®
the Intel 82801EB I/O Controller Hub 5 (ICH5) and Intel 82801ER I/O Controller Hub 5 R  
(ICH5R) Thermal Design Guide.  
8.1  
Operating Environment  
The reference thermal solution was designed assuming a maximum local-ambient temperature of  
57°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is  
300 linear feet per minute (lfm). The approaching airflow temperature is assumed to be equal to the  
local-ambient temperature. The thermal designer must carefully select the location to measure  
airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C  
external-ambient temperature at sea level. (External-ambient refers to the environment external to  
the system.)  
The fasteners associated for this reference thermal solution is intended to be used on 0.062”  
thickness motherboard.  
8.2  
Heatsink Performance  
Figure 8-1 depicts the measured thermal performance of the XMB reference thermal solution  
versus approach air velocity. Since this data was measured at sea level, a correction factor would be  
required to estimate thermal performance at other altitudes.  
Figure 8-1. XMB Reference Heatsink Measured Thermal Performance vs. Approach Velocity  
5.5  
5
4.5  
4
3.5  
3
2.5  
0
100  
200  
300  
400  
500  
600  
Flow Rate (LFM)  
®
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
37  
       
XMB Reference Thermal Solution  
8.3  
Mechanical Design Envelope  
While each design may have unique mechanical volume and height restrictions or implementation  
requirements, the height, width and depth constraints typically placed on the E8500 chipset XMB  
thermal solution are showing in Figure 8-2.  
When using heatsinks that extend beyond the XMB reference heatsink envelope shown in  
Figure 8-2, any motherboard components placed between the heatsink and motherboard cannot  
exceed 2.48 mm (0.10 in.) in height.  
Figure 8-2. XMB Reference Heatsink Volumetric Envelope  
Heatsink Fin  
Heatsink Base  
Motherboard  
Die + TIM  
FCBGA + Solder Balls  
63.50mm.  
Heatsink Fin  
45.50mm.  
8.4  
8.5  
Board-Level Components Keepout Dimensions  
The locations of holes pattern and keepout zones for the reference thermal solution are shown in  
XMB Heatsink Thermal Solution Assembly  
The reference thermal solution for the chipset XMB component is a passive extruded heatsink with  
thermal interface. It is attached to the board by using four retaining Tuflok fasteners. Figure 8-4  
shows the reference thermal solution assembly and associated components.  
®
38  
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
       
XMB Reference Thermal Solution  
Full mechanical drawings of the thermal solution assembly and the heatsink are provided in  
Appendix B. Appendix A contains vendor information for each thermal solution component.  
Figure 8-3. XMB Heatsink Board Component Keepout  
63.500mm.  
55.250mm.  
37.500mm.  
37.5mm  
38.097mm. 48.260mm.  
XMB Location  
4X Ø 5.5mm  
4X Ø 2.95 ± 0.0254mm  
No Component Keep Out Area  
2.48mm Max Component Height  
Heatsink Mounting Hole  
8.5.1  
Heatsink Orientation  
Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned  
with the direction of the heatsink fins.  
Figure 8-4. XMB Heatsink Assembly  
®
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
39  
Bridge (XMB) Thermal/Mechanical Design Guide  
     
XMB Reference Thermal Solution  
8.5.2  
Extruded Heatsink Profiles  
The reference XMB thermal solution uses an extruded heatsink for cooling the chipset XMB.  
Figure 8-5 shows the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other  
heatsinks with similar dimensions and increased thermal performance may be available. A full  
mechanical drawing of this heatsink is provided in Appendix B.  
8.5.3  
8.5.4  
Mechanical Interface Material  
There is no mechanical interface material associated with this reference solution.  
Thermal Interface Material  
A TIM provides improved conductivity between the die and the heatsink. The reference thermal  
solution uses Chomerics THERMFLOW T710, 0.127 mm (0.005 in.) thick, 17.8 mm x 17.8 mm  
(0.7 in. x 0.7 in.) square.  
Note: Unflowed or “dry” Chomerics THERMFLOW T710 has a material thickness of 0.005 inch.  
The flowed or “wet” Chomerics THERMFLOW T710 has a material thickness of ~0.0025 inch  
after it reaches its phase change temperature.  
8.5.4.1  
Effect of Pressure on TIM Performance  
Please refer to Section 6.5.4.1 for detail.  
8.5.5  
Heatsink Retaining Fastener  
The reference solution uses four heatsink retaining Tufloks. The fasteners attached the heatsink to  
the motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting  
hole. These fasteners are intended to be used on a 0.062” thickness motherboard. See Appendix B  
for a mechanical drawing of the fastener.  
®
40  
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
       
XMB Reference Thermal Solution  
Figure 8-5. XMB Heatsink Extrusion Profile  
8.6  
Reliability Guidelines  
Please refer to Section 6.6 for detail.  
§
®
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
41  
   
XMB Reference Thermal Solution  
®
42  
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
A Thermal Solution Component  
Suppliers  
Table A-1.  
NB Heatsink Thermal Solution #1  
Supplier  
(Part Number)  
Part  
Intel Part Number  
Contact Information  
Harry Lin (USA)  
Heatsink Assembly includes:  
C23120-001  
CCI/ACK  
Unidirectional Fin Heatsink  
Thermal Interface Material  
Retaining Fastener  
714-739-5797  
Monica Chih (Taiwan)  
866-2-29952666, x131  
Unidirectional Fin Heatsink  
(64.52 x 64.52 x 50.8 mm)  
C19221-001  
CCI/ACK  
Harry Lin (USA)  
714-739-5797  
Monica Chih (Taiwan)  
866-2-29952666, x131  
Thermal Interface  
(T710)  
689850-001  
-
Chomerics  
Todd Sousa (USA)  
(69-12-21937-T710)  
360-606-8171  
Retaining Fastener  
ITW Fastex*  
Ron Schmidt (USA)  
847-299-2222  
(8034-00-9909)  
Henry Lu (Taiwan)  
(886) 7-811-9206 Ext. 10  
®
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
43  
     
Thermal Solution Component Suppliers  
Table A-2.  
NB Heatsink Thermal Solution #2  
Intel Part Number  
Contact Information  
Supplier  
(Part Number)  
Part  
Heatsink Assembly includes:  
C44148-001  
CCI/ACK  
Harry Lin (USA)  
Unidirectional Fin Heatsink  
Thermal Interface Material  
Retaining Fastener  
714-739-5797  
Monica Chih (Taiwan)  
866-2-29952666, x131  
Unidirectional Fin Heatsink  
(64.52 x 64.52 x 50.8 mm)  
C44147-001  
CCI/ACK  
Harry Lin (USA)  
714-739-5797  
Monica Chih (Taiwan)  
866-2-29952666, x131  
Thermal Interface  
(T710)  
689850-001  
-
Chomerics  
Todd Sousa (USA)  
(69-12-21937-T710)  
360-606-8171  
Retaining Fastener  
ITW Fastex*  
Ron Schmidt (USA)  
847-299-2222  
(8047-00-9909)  
Henry Lu (Taiwan)  
(886) 7-811-9206 Ext. 10  
Table A-3.  
XMB Heatsink Thermal Solution  
Supplier  
(Part Number)  
Part  
Intel Part Number  
Contact Information  
Heatsink Assembly includes:  
C23124-001  
CCI/ACK  
Harry Lin (USA)  
Unidirectional Fin Heatsink  
Thermal Interface Material  
Retaining Fastener  
714-739-5797  
Monica Chih (Taiwan)  
866-2-29952666, x131  
Unidirectional Fin Heatsink  
(64.52 x 64.52 x 50.8 mm)  
C19222-001  
689850-001  
CCI/ACK  
Harry Lin (USA)  
714-739-5797  
Monica Chih (Taiwan)  
866-2-29952666, x131  
Thermal Interface  
(T-710)  
Chomerics  
Todd Sousa (USA)  
(69-12-22000-T710)  
360-606-8171  
®
44  
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
   
Thermal Solution Component Suppliers  
Table A-3.  
XMB Heatsink Thermal Solution  
Retaining Fastener  
-
ITW Fastex*  
(8034-00-9909)  
Ron Schmidt (USA)  
847-299-2222  
Henry Lu (Taiwan)  
(886) 7-811-9206 Ext. 10  
Note: The enabled components may not be currently available from all suppliers. Contact the supplier  
directly to verify time of component availability.  
§
®
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
45  
Thermal Solution Component Suppliers  
®
46  
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
B Mechanical Drawings  
Table B-1. Mechanical Drawing List  
Drawing Description  
Figure Number  
NB Heatsink #1 Assembly Drawing  
NB Heatsink #1 Drawing  
Figure B-1  
Figure B-2  
Figure B-3  
Figure B-4  
Figure B-5  
Figure B-6  
NB Heatsink #2 Assembly Drawing  
NB Heatsink #2 Drawing  
XMB Heatsink Assembly Drawing  
XMB Heatsink Drawing  
®
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
47  
Bridge (XMB) Thermal/Mechanical Design Guide  
     
Mechanical Drawings  
Figure B-1. NB Heatsink #1 Assembly Drawing  
®
48  
Intel 8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
 
Mechanical Drawings  
Figure B-2. NB Heatsink #1 Drawing  
®
Intel 8500 Chipset North Bridge (NB) and eXternal Memory  
49  
Bridge (XMB) Thermal/Mechanical Design Guide  
 
Mechanical Drawings  
Figure B-3. NB Heatsink #2 Assembly Drawing  
®
50  
Intel 8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
 
Mechanical Drawings  
Figure B-4. NB Heatsink #2 Drawing  
®
Intel 8500 Chipset North Bridge (NB) and eXternal Memory  
51  
Bridge (XMB) Thermal/Mechanical Design Guide  
 
Mechanical Drawings  
Figure B-5. XMB Heatsink Assembly Drawing  
®
52  
Intel 8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  
 
Mechanical Drawings  
Figure B-6. XMB Heatsink Drawing  
®
Intel 8500 Chipset North Bridge (NB) and eXternal Memory  
53  
Bridge (XMB) Thermal/Mechanical Design Guide  
 
Mechanical Drawings  
§
®
54  
Intel E8500 Chipset North Bridge (NB) and eXternal Memory  
Bridge (XMB) Thermal/Mechanical Design Guide  

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