Intel 6700PXH User Manual

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Intel® 6700PXH 64-bit PCI Hub  
Thermal/Mechanical Design Guidelines  
August 2004  
Document Number: 302817-003  
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Contents  
1
Introduction.....................................................................................................................7  
1.1  
1.2  
Definition of Terms...............................................................................................7  
Reference Documents .........................................................................................8  
2
3
Packaging Technology...................................................................................................9  
2.1 Package Mechanical Requirements...................................................................10  
Thermal Specifications.................................................................................................11  
3.1  
3.2  
Thermal Design Power (TDP) ............................................................................11  
Die Case Temperature Specifications ................................................................11  
4
5
Thermal Simulation ......................................................................................................13  
Thermal Metrology........................................................................................................15  
5.1  
Die Case Temperature Measurements...............................................................15  
5.1.1 Zero Degree Angle Attach Methodology................................................15  
6
Reference Thermal Solution ........................................................................................17  
6.1  
6.2  
6.3  
6.4  
6.5  
Operating Environment ......................................................................................17  
Heatsink Performance........................................................................................17  
Mechanical Design Envelope.............................................................................18  
Board-Level Components Keepout Dimensions.................................................18  
Torsional Clip Heatsink Thermal Solution Assembly ..........................................18  
6.5.1 Heatsink Orientation..............................................................................20  
6.5.2 Extruded Heatsink Profiles ....................................................................20  
6.5.3 Mechanical Interface Material................................................................20  
6.5.4 Thermal Interface Material.....................................................................21  
6.5.5 Heatsink Clip.........................................................................................21  
6.5.6 Clip Retention Anchors..........................................................................22  
Reliability Guidelines..........................................................................................22  
6.6  
A
B
Thermal Solution Component Suppliers.....................................................................23  
A.1 Torsional Clip Heatsink Thermal Solution...........................................................23  
Mechanical Drawings ...................................................................................................25  
Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines  
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Figures  
2-1. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Top View) .............................9  
2-2. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Side View).............................9  
2-3. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Bottom View) ......................10  
5-1. Zero Degree Angle Attach Heatsink Modifications ...................................................16  
5-2. Zero Degree Angle Attach Methodology (Top View) ................................................16  
6-1. Reference Heatsink Measured Thermal Performance Versus Approach Velocity ....17  
6-2. Torsional Clip Heatsink Volumetric Envelope for the Intel® 6700PXH 64-bit PCI Hub  
Chipset Component ...........................................................................................18  
6-3. Torsional Clip Heatsink Board Component Keepout ................................................19  
6-4. Retention Mechanism Component Keepout Zones ..................................................19  
6-5. Torsional Clip Heatsink Assembly............................................................................20  
6-6 Heatsink Rails to PXH Package Footprint.................................................................20  
6-7. Torsional Clip Heatsink Extrusion Profile .................................................................21  
B-1. Torsional Clip Heatsink Assembly Drawing .............................................................26  
B-2. Torsional Clip Heatsink Drawing..............................................................................27  
B-3.Torsional Clip Drawing .............................................................................................28  
Tables  
3-1. Intel® 6700PXH 64-bit PCI Hub Thermal Specifications...........................................11  
6-1. Chomerics* T710 TIM Performance as a Function of Attach Pressure.....................21  
6-2. Reliability Guidelines ...............................................................................................22  
B-1. Mechanical Drawing List..........................................................................................25  
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Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines  
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Revision History  
Revision  
Number  
Description  
Date  
-001  
-002  
Initial release  
Jul 2004  
Aug 2004  
Added “reference thermal solution rails to PXH package” footprint drawing in  
Section 6.5  
-003  
Removed inaccurate text in three graphics  
Sep 2004  
Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines  
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Introduction  
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Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines  
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1 Introduction  
As the complexity of computer systems increases, so do the power dissipation requirements. Care  
must be taken to ensure that the additional power is properly dissipated. Typical methods to improve  
heat dissipation include selective use of ducting, and/or passive heatsinks.  
The goals of this document are to:  
Outline the thermal and Mechanical operating limits and specifications for the Intel®  
6700PXH 64-bit PCI Hub component.  
Describe a reference thermal solution that meets the specification of Intel® 6700PXH 64-bit  
PCI Hub component.  
Properly designed thermal solution provides adequate cooling to maintain the PXH component die  
temperatures at or below thermal specifications. This is accomplished by providing a low local-  
ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient  
thermal resistance. By maintaining the PXH component die temperature at or below the specified  
limits, a system designer can ensure the proper functionality, performance, and reliability of the  
chipset. Operation outside the functional limits can degrade system performance and may cause  
permanent changes in the operating characteristics of the component.  
The simplest and most cost effective method to improve the inherent system cooling characteristics  
is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is  
required, component thermal solutions may be implemented in conjunction with system thermal  
solutions. The size of the fan or heatsink can be varied to balance size and space constraints with  
acoustic noise.  
This document addresses thermal design and specifications for the Intel® 6700PXH 64-bit PCI Hub  
components only. For thermal design information on other chipset components, refer to the  
respective component datasheet.  
Unless otherwise specified, the term “PXH” refers to the Intel® 6700PXH 64-bit PCI Hub.  
1.1  
Definition of Terms  
BGA  
Ball grid array. A package type, defined by a resin-fiber substrate, onto which a die is  
mounted, bonded and encapsulated in molding compound. The primary electrical  
interface is an array of solder balls attached to the substrate opposite the die and molding  
compound.  
BLT  
MCH  
PXH  
Bond line thickness. Final settled thickness of the thermal interface material after  
installation of heatsink.  
Memory controller hub. The chipset component that contains the processor interface, the  
memory interface, and the hub interface.  
Intel® 6700PXH 64-bit PCI Hub. The chipset component that performs PCI bridging  
functions between the PCI Express* interface and the PCI Bus. It contains two PCI bus  
interfaces that can be independently configured to operate in PCI (33 or 66 MHz) or  
PCI-X mode 1 (66, 100, or 133 MHz), for either 32 or 64 bit PCI devices.  
Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines  
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Introduction  
Tcase_max Maximum die temperature allowed. This temperature is measured at the geometric center  
of the top of the package die.  
Tcase_min Minimum die temperature allowed. This temperature is measured at the geometric center  
of the top of the package die.  
TDP  
Thermal design power. Thermal solutions should be designed to dissipate this target  
power level. TDP is not the maximum power that the chipset can dissipate.  
1.2  
Reference Documents  
The reader of this specification should also be familiar with material and concepts presented in the  
following documents:  
Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R  
(ICH5R) Datasheet  
Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R  
(ICH5R) Thermal Design Guide  
Intel®6700PXH 64-bit PCI Hub (PXH) Thermal/Mechanical Design Guide  
Intel® 6700PXH 64-bit PCI Hub (PXH) Datasheet  
Intel® 6700PXH 64-bit PCI Hub (PXH) Specification Update  
Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide  
Intel® 6300ESB I/O Controller Hub Datasheet  
Intel® 6300ESB I/O Controller Hub (ICH) Specification Update  
BGA/OLGA Assembly Development Guide  
Various system thermal design suggestions (http://www.formfactors.org)  
Note: Unless otherwise specified, these documents are available through your Intel field sales  
representative. Some documents may not be available at this time.  
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2 Packaging Technology  
The Intel® 6700PXH 64-bit PCI Hub component uses a 31 mm x 31 mm, 8-layer FC-BGA package  
(see Figure 2-1Figure 2-1Figure 2-1, Figure 2-2Figure 2-2Figure 2-2, and Figure 2-3Figure  
2-3Figure 2-3).  
Figure 2-1. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Top View)  
Die  
Keepout  
Area  
Handling  
Exclusion  
Area  
0.491 in.  
0.291 in.  
PXH  
Die  
0.247 in.  
17.00 mm 21.00 mm 31.00 mm  
0.547 in.  
0.200 in.  
17.00 mm  
21.00 mm  
31.00 mm  
Figure 2-2. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Side View)  
0.84 ± 0.05 mm  
Substrate  
2.445 ± 0.102 mm  
2.010 ± 0.099 mm  
Decoup  
Cap  
Die  
0.7 mm Max  
0.20  
See note 4.  
0.20  
–C–  
Seating Plane  
0.435 ± 0.025 mm  
See Note 3  
See Note 1  
Notes:  
1.Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach).  
2.All dimensions and tolerances conform to ANSI Y14.5M-1994.  
3.BGA has a pre-SMT height of 0.5 mm and post-SMT height of 0.41-0.46 mm.  
4.Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly  
concave (bowl shaped) orientation after reflow.  
Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines  
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Packaging TechnologyPackaging TechnologyPackaging Technology  
Figure 2-3. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Bottom View)  
AD  
AC  
AB  
AA  
Y
W
V
U
T
R
P
N
M
L
0.635  
4X  
31.000 + 0.100  
K
J
H
G
F
15.500  
4X  
E
D
C
B
A
1.270  
23X  
+
+
2
4
6
8
10  
12  
14  
16  
18  
20  
22 24  
21 23  
A
1
3
5
7
9
11  
13  
15  
17  
19  
23X 1.270  
(0.895)  
8X 14.605  
29.2100  
31.000 + 0.100  
0.200  
B
C
A
NOTES:  
1. All dimensions are in millimeters.  
2. All dimensions and tolerances conform to ANSI Y14.5M-1994.  
2.1  
Package Mechanical Requirements  
The PXH package has an exposed bare die, which is capable of sustaining a maximum static normal  
load of 15-lbf. The package is NOT capable of sustaining a dynamic or static compressive load  
applied to any edge of the bare die. These mechanical load limits must not be exceeded during  
heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use  
condition.  
Notes  
1. The heatsink attach solutions must not include continuous stress onto the chipset package with  
the exception of a uniform load to maintain the heatsink-to-package thermal interface.  
2. These specifications apply to uniform compressive loading in a direction perpendicular to the  
bare die/IHS top surface.  
3. These specifications are based on limited testing for design characterization. Loading limits  
are for the package only.  
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3 Thermal Specifications  
3.1  
Thermal Design Power (TDP)  
Analysis indicates that real applications are unlikely to cause the PXH component to consume  
maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more  
realistic power level for thermal design purposes, Intel characterizes power consumption based on  
known platform benchmark applications. The resulting power consumption is referred to as the  
Thermal Design Power (TDP). TDP is the target power level that the thermal solutions should be  
designed to. TDP is not the maximum power that the chipset can dissipate.  
For TDP specifications, see Table 3-1 for the PXH component. Flip chip ball grid array (FC-BGA)  
packages have poor heat transfer capability into the board and have minimal thermal capability  
without a thermal solution. Intel recommends that system designers plan for a heatsink when using  
the PXH component.  
3.2  
Die Case Temperature Specifications  
To ensure proper operation and reliability of the PXH component, the die temperatures must be at or  
between the maximum/minimum operating temperature ranges as specified in Table 3-1Table 3-  
1Table 3-1. System and/or component level thermal solutions are required to maintain these  
temperature specifications. Refer to Chapter 5 for guidelines on accurately measuring package die  
temperatures.  
Table 3-1. Intel® 6700PXH 64-bit PCI Hub Thermal Specifications  
Parameter  
Value  
Notes  
Tcase  
105°C  
5°C  
_max  
Tcase_min  
TDP Segment A @ 66 MHz and Segment B @ 66 MHz  
TDP Segment A @ 100 MHz and Segment B @ 100 MHz  
TDP Segment A @ 133 MHz and Segment B @ 133 MHz  
TDP Segment A @ 66 MHz and Segment B @ 100 MHz  
TDP Segment A @ 66 MHz and Segment B @ 133 MHz  
TDP Segment A @ 100 MHz and Segment B @ 133 MHz  
9.0 watts  
8.9 watts  
8.6 watts  
8.9 watts  
8.8 watts  
8.7 watts  
Note: These specifications are based on silicon characterization, however, they may be updated as further  
data becomes available.  
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Thermal SpecificationsThermal Simulation  
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4 Thermal Simulation  
Intel provides thermal simulation models of the Intel® 6700PXH 64-bit PCI Hub component and  
associated user's guides to aid system designers in simulating, analyzing, and optimizing their  
thermal solutions in an integrated, system-level environment. The models are for use with the  
commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool  
“FLOTHERM”* (version 3.1 or higher) by Flomerics, Inc. These models are also available in  
IcePak* format. Contact your Intel field sales representative to order the Icepak thermal model and  
user's guide.  
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Thermal SimulationThermal Simulation  
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5 Thermal Metrology  
The system designer must make temperature measurements to accurately determine the thermal  
performance of the system. Intel has established guidelines for proper techniques to measure the  
PXH die temperatures. Section 5.1 provides guidelines on how to accurately measure the PXH die  
temperatures.  
5.1  
Die Case Temperature Measurements  
To ensure functionality and reliability, the Tcase of the PXH must be maintained at or between the  
maximum/minimum operating range of the temperature specification as noted in Table 3-1Table 3-  
1Table 3-1. The surface temperature at the geometric center of the die corresponds to Tcase  
.
Measuring Tcase requires special care to ensure an accurate temperature measurement.  
Temperature differences between the temperature of a surface and the surrounding local ambient air  
can introduce errors in the measurements. The measurement errors could be due to a poor thermal  
contact between the thermocouple junction and the surface of the package, heat loss by radiation  
and/or convection, conduction through thermocouple leads, or contact between the thermocouple  
cement and the heatsink base (if a heatsink is used). For maximum measurement accuracy, only the  
0° thermocouple attach approach is recommended.  
5.1.1  
Zero Degree Angle Attach Methodology  
1. Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0.06 in.) deep hole centered on the bottom of  
the heatsink base.  
2. Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered hole to one  
edge of the heatsink. The slot should be parallel to the heatsink fins (see Figure 5-1Figure  
5-1Figure 5-1).  
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.  
4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts  
should match the slot and hole milled into the heatsink base.  
5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of  
the top surface of the die using a high thermal conductivity cement. During this step, ensure  
no contact is present between the thermocouple cement and the heatsink base because any  
contact will affect the thermocouple reading. It is critical that the thermocouple bead  
makes contact with the die (see Figure 5-2Figure 5-2Figure 5-2).  
6. Attach heatsink assembly to the PXH and route thermocouple wires out through the milled  
slot.  
Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines  
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Thermal MetrologyThermal MetrologyThermal Metrology  
Figure 5-1. Zero Degree Angle Attach Heatsink Modifications  
NOTE: Not to scale.  
Figure 5-2. Zero Degree Angle Attach Methodology (Top View)  
Die  
Thermocouple  
Wire  
Cement +  
Thermocouple Bead  
Substrate  
001321  
NOTE: Not to scale.  
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6 Reference Thermal Solution  
Intel has developed one reference thermal solution to meet the cooling needs of the PXH component  
under operating environments and specifications defined in this document. This chapter describes  
the overall requirements for the reference thermal solution including critical-to-function dimensions,  
operating environment, and validation criteria. Other chipset components may or may not need  
attached thermal solutions, depending on your specific system local-ambient operating conditions.  
6.1  
6.2  
Operating Environment  
The PXH reference thermal solution was designed assuming a maximum local-ambient temperature  
of 55°C. The minimum recommended airflow velocity through the cross section of the heatsink fins  
is 200 linear feet per minute (lfm). The approaching airflow temperature is assumed to be equal to  
the local-ambient temperature. The thermal designer must carefully select the location to measure  
airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C external-  
ambient temperature at sea level. (External-ambient refers to the environment external to the  
system.)  
Heatsink Performance  
Figure 6-1Figure 6-1Figure 6-1 depicts the measured thermal performance of the reference thermal  
solution versus approach air velocity. Since this data was measured at sea level, a correction factor  
would be required to estimate thermal performance at other altitudes.  
Figure 6-1. Reference Heatsink Measured Thermal Performance Versus Approach Velocity  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
50  
100  
150  
200  
250  
300  
Flow Rate (LFM)  
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Reference Thermal SolutionReference Thermal SolutionReference Thermal Solution  
6.3  
Mechanical Design Envelope  
While each design may have unique mechanical volume and height restrictions or implementation  
requirements, the height, width, and depth constraints typically placed on the PXH thermal solution  
are shown in Figure 6-2Figure 6-2Figure 6-2.  
When using heatsinks that extend beyond the PXH reference heatsink envelope shown in  
Figure 6-2Figure 6-2Figure 6-2, any motherboard components placed between the heatsink and  
motherboard cannot exceed 2.40 mm (0.094 in.) in height.  
Figure 6-2. Torsional Clip Heatsink Volumetric Envelope for the Intel® 6700PXH 64-bit PCI Hub  
Chipset Component  
3.01mm.  
Heatsink Fin  
1.86mm.  
14.71mm  
Heatsink Base  
Motherboard  
Die + TIM  
FCBGA +  
Solder Balls  
31.00mm.  
Heatsink  
Fin  
31.00mm.  
3.00mm.  
6.4  
6.5  
Board-Level Components Keepout Dimensions  
The locations of hole pattern and keepout zones for the reference thermal solution are shown in  
Figure 6-3Figure 6-3Figure 6-3 and Figure 6-4Figure 6-4Figure 6-4.  
Torsional Clip Heatsink Thermal Solution Assembly  
The reference thermal solution for the PXH component is a passive extruded heatsink with thermal  
interface. It is attached using a clip with each end hooked through an anchor soldered to the board.  
Figure 6-5Figure 6-5Figure 6-5 shows the reference thermal solution assembly and associated  
components. Figure 6-6Figure 6-6Figure 6-6 shows the position of the heatsink rails relative to the  
PXH package top surface.  
Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in  
Appendix B. Appendix A contains vendor information for each thermal solution component.  
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Reference Thermal SolutionReference Thermal SolutionReference Thermal Solution  
Figure 6-3. Torsional Clip Heatsink Board Component Keepout  
Component  
keepout area  
1.756  
PXH  
1.886  
2x 0.943  
Parallel Mean  
Airflow  
Direction  
Max  
component  
Height 0.50  
2x 0.878  
NOTE: All dimensions are in inches.  
Figure 6-4. Retention Mechanism Component Keepout Zones  
Component  
Keepout Area  
0.500  
2x 0.060  
0.120  
0.345  
(0.345)  
0.225  
0.050"  
Component  
0.170  
0.750  
See Detail  
A
Keepout  
(0.165)  
Detail A  
0.100  
0.165  
0.083  
2x 0.038  
Plated Through  
Hole  
0.173  
0.345  
0.200  
0.100  
2x 0.056  
Trace  
Component  
Keepout  
Keepout  
NOTE: All dimensions are in inches.  
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Reference Thermal SolutionReference Thermal SolutionReference Thermal Solution  
6.5.1  
Heatsink Orientation  
Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned  
with the direction of the heatsink fins.  
Figure 6-5. Torsional Clip Heatsink Assembly  
Figure 6-6 Heatsink Rails to PXH Package Footprint  
6.5.2  
Extruded Heatsink Profiles  
The reference torsional clip heatsink uses an extruded heatsink for cooling the PXH component.  
Figure 6-7Figure 6-7Figure 6-7 shows the heatsink profile. Appendix A lists a supplier for this  
extruded heatsink. Other heatsinks with similar dimensions and increased thermal performance may  
be available. Full mechanical drawing of this heatsink is provided in Appendix B.  
6.5.3  
Mechanical Interface Material  
There is no mechanical interface material associated with this reference solution.  
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Reference Thermal SolutionReference Thermal SolutionReference Thermal Solution  
6.5.4  
Thermal Interface Material  
A thermal interface material provides improved conductivity between the die and heatsink. The  
reference thermal solution uses Chomerics* T-710, 0.127 mm (0.005 in.) thick, 8 mm x 8 mm  
square.  
Note: Unflowed or “dry” Chomerics* T710 has a material thickness of 0.005 inch. The flowed or “wet”  
Chromerics T710 has a material thickness of ~0.0025 inch after it reaches its phase change  
temperature.  
6.5.4.1  
Effect of Pressure on TIM Performance  
As mechanical pressure increases on the TIM, the thermal resistance of the TIM decreases. This  
phenomenon is due to the decrease of the bond line thickness (BLT). BLT is the final settled  
thickness of the thermal interface material after installation of heatsink. The effect of pressure on the  
thermal resistance of the Chomerics T710 TIM is shown in Table 6-1Table 6-1Table 6-1. The  
heatsink clip provides enough pressure for the TIM to achieve a thermal conductivity of 0.17°C  
inch2/W.  
Table 6-1. Chomerics* T710 TIM Performance as a Function of Attach Pressure  
Pressure (psi)  
Thermal Resistance (°C × in2)/W  
5
0.37  
0.30  
0.21  
0.17  
10  
20  
30  
NOTE: All measured at 50°C.  
6.5.5  
Heatsink Clip  
The reference solution uses a wire clip with hooked ends. The hooks attach to wire anchors to fasten  
the clip to the board. See Appendix B for a mechanical drawing of the clip.  
Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines  
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Reference Thermal SolutionReference Thermal SolutionReference Thermal Solution  
Figure 6-7. Torsional Clip Heatsink Extrusion Profile  
6.5.6  
Clip Retention Anchors  
For Intel® 6700PXH 64-bit PCI Hub-based platforms that have very limited board space, a clip  
retention anchor has been developed to minimize the impact of clip retention on the board. It is  
based on a standard three-pin jumper and is soldered to the board like any common through-hole  
header. A new anchor design is available with 45° bent leads to increase the anchor attach reliability  
over time. See Appendix A for the part number and supplier information.  
6.6  
Reliability Guidelines  
Each motherboard, heatsink and attach combination may vary the mechanical loading of the  
component. Based on the end user environment, the user should define the appropriate reliability  
test criteria and carefully evaluate the completed assembly prior to use in high volume. Some  
general recommendations are shown in Table 6-2Table 6-2Table 6-2.  
Table 6-2. Reliability Guidelines  
Test (1)  
Requirement  
Pass/Fail Criteria (2)  
Mechanical Shock  
Random Vibration  
Temperature Life  
50 g, board level, 11 msec, 3 shocks/axis.  
Visual Check and Electrical  
Functional Test  
7.3 g, board level, 45 min/axis, 50 Hz to 2000 Hz.  
Visual Check and Electrical  
Functional Test  
Visual Check  
85°C, 2000 hours total, checkpoints at 168, 500,  
1000, and 2000 hours.  
Thermal Cycling  
Humidity  
–5°C to +70°C, 500 cycles.  
Visual Check  
Visual Check  
85% relative humidity, 55°C, 1000 hours.  
NOTES:  
1. It is recommended that the above tests be performed on a sample size of at least twelve assemblies from  
three lots of material.  
2. Additional pass/fail criteria may be added at the discretion of the user.  
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A Thermal Solution Component  
Suppliers  
A.1  
Torsional Clip Heatsink Thermal Solution  
Supplier  
Part  
Intel Part Number  
Contact Information  
(Part Number)  
Heatsink Assembly includes:  
Harry Lin (USA)  
714-739-5797  
Unidirectional Fin  
Heatsink  
C76435-001  
CCI/ACK*  
Monica Chih (Taiwan)  
866-2-29952666, x131  
Thermal Interface  
Material  
Torsional Clip  
Harry Lin (USA)  
714-739-5797  
Undirectional Fin Heatsink  
(31.0 x 31.0 x 12.2 mm)  
C76434-001  
A69230-001  
C17725-001  
A13494-005  
CCI/ACK  
Monica Chih (Taiwan)  
866-2-29952666, x131  
Todd Sousa (USA)  
360-606-8171  
Thermal Interface  
(Chomerics* T-710)  
Chomerics*  
69-12-22066-T710  
Harry Lin (USA)  
714-739-5797  
Heatsink Attach Clip  
Solder-Down Anchor  
CCI/ACK  
Monica Chih (Taiwan)  
866-2-29952666, x131  
Julia Jiang (USA)  
408-919-6178  
Foxconn*  
(HB96030-DW)  
Note: The enabled components may not be currently available from all suppliers. Contact the supplier  
directly to verify time of component availability.  
Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines  
23  
R
Thermal Solution Component Suppliers  
24  
Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines  
R
B Mechanical Drawings  
Table B-1Table B-1Table B-1 lists the mechanical drawings included in this appendix.  
Table B-1. Mechanical Drawing List  
Drawing Description  
Figure Number  
Torsional Clip Heatsink Assembly Drawing  
Figure B-1Figure B-  
1Figure B-1  
Torsional Clip Heatsink Drawing  
Torsional Clip Drawing  
Figure B-2Figure B-  
2Figure B-2  
Figure B-3Figure B-  
3Figure B-3  
Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines  
25  

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