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Intel® 6700PXH 64-bit PCI Hub
Thermal/Mechanical Design Guidelines
August 2004
Document Number: 302817-003
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Contents
1
Introduction.....................................................................................................................7
1.1
1.2
Definition of Terms...............................................................................................7
Reference Documents .........................................................................................8
2
3
Packaging Technology...................................................................................................9
2.1 Package Mechanical Requirements...................................................................10
Thermal Specifications.................................................................................................11
3.1
3.2
Thermal Design Power (TDP) ............................................................................11
Die Case Temperature Specifications ................................................................11
4
5
Thermal Simulation ......................................................................................................13
Thermal Metrology........................................................................................................15
5.1
Die Case Temperature Measurements...............................................................15
5.1.1 Zero Degree Angle Attach Methodology................................................15
6
Reference Thermal Solution ........................................................................................17
6.1
6.2
6.3
6.4
6.5
Operating Environment ......................................................................................17
Heatsink Performance........................................................................................17
Mechanical Design Envelope.............................................................................18
Board-Level Components Keepout Dimensions.................................................18
Torsional Clip Heatsink Thermal Solution Assembly ..........................................18
6.5.1 Heatsink Orientation..............................................................................20
6.5.2 Extruded Heatsink Profiles ....................................................................20
6.5.3 Mechanical Interface Material................................................................20
6.5.4 Thermal Interface Material.....................................................................21
6.5.5 Heatsink Clip.........................................................................................21
6.5.6 Clip Retention Anchors..........................................................................22
Reliability Guidelines..........................................................................................22
6.6
A
B
Thermal Solution Component Suppliers.....................................................................23
A.1 Torsional Clip Heatsink Thermal Solution...........................................................23
Mechanical Drawings ...................................................................................................25
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Figures
2-1. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Top View) .............................9
2-2. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Side View).............................9
2-3. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Bottom View) ......................10
5-1. Zero Degree Angle Attach Heatsink Modifications ...................................................16
5-2. Zero Degree Angle Attach Methodology (Top View) ................................................16
6-1. Reference Heatsink Measured Thermal Performance Versus Approach Velocity ....17
6-2. Torsional Clip Heatsink Volumetric Envelope for the Intel® 6700PXH 64-bit PCI Hub
Chipset Component ...........................................................................................18
6-3. Torsional Clip Heatsink Board Component Keepout ................................................19
6-4. Retention Mechanism Component Keepout Zones ..................................................19
6-5. Torsional Clip Heatsink Assembly............................................................................20
6-6 Heatsink Rails to PXH Package Footprint.................................................................20
6-7. Torsional Clip Heatsink Extrusion Profile .................................................................21
B-1. Torsional Clip Heatsink Assembly Drawing .............................................................26
B-2. Torsional Clip Heatsink Drawing..............................................................................27
B-3.Torsional Clip Drawing .............................................................................................28
Tables
3-1. Intel® 6700PXH 64-bit PCI Hub Thermal Specifications...........................................11
6-1. Chomerics* T710 TIM Performance as a Function of Attach Pressure.....................21
6-2. Reliability Guidelines ...............................................................................................22
B-1. Mechanical Drawing List..........................................................................................25
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Revision History
Revision
Number
Description
Date
-001
-002
Initial release
Jul 2004
Aug 2004
Added “reference thermal solution rails to PXH package” footprint drawing in
Section 6.5
-003
Removed inaccurate text in three graphics
Sep 2004
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Introduction
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1 Introduction
As the complexity of computer systems increases, so do the power dissipation requirements. Care
must be taken to ensure that the additional power is properly dissipated. Typical methods to improve
heat dissipation include selective use of ducting, and/or passive heatsinks.
The goals of this document are to:
•
Outline the thermal and Mechanical operating limits and specifications for the Intel®
6700PXH 64-bit PCI Hub component.
•
Describe a reference thermal solution that meets the specification of Intel® 6700PXH 64-bit
PCI Hub component.
Properly designed thermal solution provides adequate cooling to maintain the PXH component die
temperatures at or below thermal specifications. This is accomplished by providing a low local-
ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient
thermal resistance. By maintaining the PXH component die temperature at or below the specified
limits, a system designer can ensure the proper functionality, performance, and reliability of the
chipset. Operation outside the functional limits can degrade system performance and may cause
permanent changes in the operating characteristics of the component.
The simplest and most cost effective method to improve the inherent system cooling characteristics
is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is
required, component thermal solutions may be implemented in conjunction with system thermal
solutions. The size of the fan or heatsink can be varied to balance size and space constraints with
acoustic noise.
This document addresses thermal design and specifications for the Intel® 6700PXH 64-bit PCI Hub
components only. For thermal design information on other chipset components, refer to the
respective component datasheet.
Unless otherwise specified, the term “PXH” refers to the Intel® 6700PXH 64-bit PCI Hub.
1.1
Definition of Terms
BGA
Ball grid array. A package type, defined by a resin-fiber substrate, onto which a die is
mounted, bonded and encapsulated in molding compound. The primary electrical
interface is an array of solder balls attached to the substrate opposite the die and molding
compound.
BLT
MCH
PXH
Bond line thickness. Final settled thickness of the thermal interface material after
installation of heatsink.
Memory controller hub. The chipset component that contains the processor interface, the
memory interface, and the hub interface.
Intel® 6700PXH 64-bit PCI Hub. The chipset component that performs PCI bridging
functions between the PCI Express* interface and the PCI Bus. It contains two PCI bus
interfaces that can be independently configured to operate in PCI (33 or 66 MHz) or
PCI-X mode 1 (66, 100, or 133 MHz), for either 32 or 64 bit PCI devices.
Intel® 6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines
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Introduction
Tcase_max Maximum die temperature allowed. This temperature is measured at the geometric center
of the top of the package die.
Tcase_min Minimum die temperature allowed. This temperature is measured at the geometric center
of the top of the package die.
TDP
Thermal design power. Thermal solutions should be designed to dissipate this target
power level. TDP is not the maximum power that the chipset can dissipate.
1.2
Reference Documents
The reader of this specification should also be familiar with material and concepts presented in the
following documents:
•
Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R
(ICH5R) Datasheet
•
Intel® 82801EB I/O Controller Hub 5 (ICH5) and Intel® 82801ER I/O Controller Hub 5 R
(ICH5R) Thermal Design Guide
•
•
•
•
•
•
•
•
Intel®6700PXH 64-bit PCI Hub (PXH) Thermal/Mechanical Design Guide
Intel® 6700PXH 64-bit PCI Hub (PXH) Datasheet
Intel® 6700PXH 64-bit PCI Hub (PXH) Specification Update
Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide
Intel® 6300ESB I/O Controller Hub Datasheet
Intel® 6300ESB I/O Controller Hub (ICH) Specification Update
BGA/OLGA Assembly Development Guide
Various system thermal design suggestions (http://www.formfactors.org)
Note: Unless otherwise specified, these documents are available through your Intel field sales
representative. Some documents may not be available at this time.
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2 Packaging Technology
The Intel® 6700PXH 64-bit PCI Hub component uses a 31 mm x 31 mm, 8-layer FC-BGA package
(see Figure 2-1Figure 2-1Figure 2-1, Figure 2-2Figure 2-2Figure 2-2, and Figure 2-3Figure
2-3Figure 2-3).
Figure 2-1. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Top View)
Die
Keepout
Area
Handling
Exclusion
Area
0.491 in.
0.291 in.
PXH
Die
0.247 in.
17.00 mm 21.00 mm 31.00 mm
0.547 in.
0.200 in.
17.00 mm
21.00 mm
31.00 mm
Figure 2-2. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Side View)
0.84 ± 0.05 mm
Substrate
2.445 ± 0.102 mm
2.010 ± 0.099 mm
Decoup
Cap
Die
0.7 mm Max
0.20
See note 4.
0.20
–C–
Seating Plane
0.435 ± 0.025 mm
See Note 3
See Note 1
Notes:
1.Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach).
2.All dimensions and tolerances conform to ANSI Y14.5M-1994.
3.BGA has a pre-SMT height of 0.5 mm and post-SMT height of 0.41-0.46 mm.
4.Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly
concave (bowl shaped) orientation after reflow.
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Packaging TechnologyPackaging TechnologyPackaging Technology
Figure 2-3. Intel® 6700PXH 64-bit PCI Hub Package Dimensions (Bottom View)
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
0.635
4X
31.000 + 0.100
K
J
H
G
F
15.500
4X
E
D
C
B
A
1.270
23X
+
+
2
4
6
8
10
12
14
16
18
20
22 24
21 23
A
1
3
5
7
9
11
13
15
17
19
23X 1.270
(0.895)
8X 14.605
29.2100
31.000 + 0.100
0.200
B
C
A
NOTES:
1. All dimensions are in millimeters.
2. All dimensions and tolerances conform to ANSI Y14.5M-1994.
2.1
Package Mechanical Requirements
The PXH package has an exposed bare die, which is capable of sustaining a maximum static normal
load of 15-lbf. The package is NOT capable of sustaining a dynamic or static compressive load
applied to any edge of the bare die. These mechanical load limits must not be exceeded during
heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use
condition.
Notes
1. The heatsink attach solutions must not include continuous stress onto the chipset package with
the exception of a uniform load to maintain the heatsink-to-package thermal interface.
2. These specifications apply to uniform compressive loading in a direction perpendicular to the
bare die/IHS top surface.
3. These specifications are based on limited testing for design characterization. Loading limits
are for the package only.
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3 Thermal Specifications
3.1
Thermal Design Power (TDP)
Analysis indicates that real applications are unlikely to cause the PXH component to consume
maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more
realistic power level for thermal design purposes, Intel characterizes power consumption based on
known platform benchmark applications. The resulting power consumption is referred to as the
Thermal Design Power (TDP). TDP is the target power level that the thermal solutions should be
designed to. TDP is not the maximum power that the chipset can dissipate.
For TDP specifications, see Table 3-1 for the PXH component. Flip chip ball grid array (FC-BGA)
packages have poor heat transfer capability into the board and have minimal thermal capability
without a thermal solution. Intel recommends that system designers plan for a heatsink when using
the PXH component.
3.2
Die Case Temperature Specifications
To ensure proper operation and reliability of the PXH component, the die temperatures must be at or
between the maximum/minimum operating temperature ranges as specified in Table 3-1Table 3-
1Table 3-1. System and/or component level thermal solutions are required to maintain these
temperature specifications. Refer to Chapter 5 for guidelines on accurately measuring package die
temperatures.
Table 3-1. Intel® 6700PXH 64-bit PCI Hub Thermal Specifications
Parameter
Value
Notes
Tcase
105°C
5°C
_max
Tcase_min
TDP Segment A @ 66 MHz and Segment B @ 66 MHz
TDP Segment A @ 100 MHz and Segment B @ 100 MHz
TDP Segment A @ 133 MHz and Segment B @ 133 MHz
TDP Segment A @ 66 MHz and Segment B @ 100 MHz
TDP Segment A @ 66 MHz and Segment B @ 133 MHz
TDP Segment A @ 100 MHz and Segment B @ 133 MHz
9.0 watts
8.9 watts
8.6 watts
8.9 watts
8.8 watts
8.7 watts
Note: These specifications are based on silicon characterization, however, they may be updated as further
data becomes available.
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Thermal SpecificationsThermal Simulation
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4 Thermal Simulation
Intel provides thermal simulation models of the Intel® 6700PXH 64-bit PCI Hub component and
associated user's guides to aid system designers in simulating, analyzing, and optimizing their
thermal solutions in an integrated, system-level environment. The models are for use with the
commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool
“FLOTHERM”* (version 3.1 or higher) by Flomerics, Inc. These models are also available in
IcePak* format. Contact your Intel field sales representative to order the Icepak thermal model and
user's guide.
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Thermal SimulationThermal Simulation
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5 Thermal Metrology
The system designer must make temperature measurements to accurately determine the thermal
performance of the system. Intel has established guidelines for proper techniques to measure the
PXH die temperatures. Section 5.1 provides guidelines on how to accurately measure the PXH die
temperatures.
5.1
Die Case Temperature Measurements
To ensure functionality and reliability, the Tcase of the PXH must be maintained at or between the
maximum/minimum operating range of the temperature specification as noted in Table 3-1Table 3-
1Table 3-1. The surface temperature at the geometric center of the die corresponds to Tcase
.
Measuring Tcase requires special care to ensure an accurate temperature measurement.
Temperature differences between the temperature of a surface and the surrounding local ambient air
can introduce errors in the measurements. The measurement errors could be due to a poor thermal
contact between the thermocouple junction and the surface of the package, heat loss by radiation
and/or convection, conduction through thermocouple leads, or contact between the thermocouple
cement and the heatsink base (if a heatsink is used). For maximum measurement accuracy, only the
0° thermocouple attach approach is recommended.
5.1.1
Zero Degree Angle Attach Methodology
1. Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0.06 in.) deep hole centered on the bottom of
the heatsink base.
2. Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered hole to one
edge of the heatsink. The slot should be parallel to the heatsink fins (see Figure 5-1Figure
5-1Figure 5-1).
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.
4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts
should match the slot and hole milled into the heatsink base.
5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of
the top surface of the die using a high thermal conductivity cement. During this step, ensure
no contact is present between the thermocouple cement and the heatsink base because any
contact will affect the thermocouple reading. It is critical that the thermocouple bead
makes contact with the die (see Figure 5-2Figure 5-2Figure 5-2).
6. Attach heatsink assembly to the PXH and route thermocouple wires out through the milled
slot.
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Thermal MetrologyThermal MetrologyThermal Metrology
Figure 5-1. Zero Degree Angle Attach Heatsink Modifications
NOTE: Not to scale.
Figure 5-2. Zero Degree Angle Attach Methodology (Top View)
Die
Thermocouple
Wire
Cement +
Thermocouple Bead
Substrate
001321
NOTE: Not to scale.
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6 Reference Thermal Solution
Intel has developed one reference thermal solution to meet the cooling needs of the PXH component
under operating environments and specifications defined in this document. This chapter describes
the overall requirements for the reference thermal solution including critical-to-function dimensions,
operating environment, and validation criteria. Other chipset components may or may not need
attached thermal solutions, depending on your specific system local-ambient operating conditions.
6.1
6.2
Operating Environment
The PXH reference thermal solution was designed assuming a maximum local-ambient temperature
of 55°C. The minimum recommended airflow velocity through the cross section of the heatsink fins
is 200 linear feet per minute (lfm). The approaching airflow temperature is assumed to be equal to
the local-ambient temperature. The thermal designer must carefully select the location to measure
airflow to obtain an accurate estimate. These local-ambient conditions are based on a 35°C external-
ambient temperature at sea level. (External-ambient refers to the environment external to the
system.)
Heatsink Performance
Figure 6-1Figure 6-1Figure 6-1 depicts the measured thermal performance of the reference thermal
solution versus approach air velocity. Since this data was measured at sea level, a correction factor
would be required to estimate thermal performance at other altitudes.
Figure 6-1. Reference Heatsink Measured Thermal Performance Versus Approach Velocity
6.0
5.5
5.0
4.5
4.0
3.5
50
100
150
200
250
300
Flow Rate (LFM)
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Reference Thermal SolutionReference Thermal SolutionReference Thermal Solution
6.3
Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or implementation
requirements, the height, width, and depth constraints typically placed on the PXH thermal solution
are shown in Figure 6-2Figure 6-2Figure 6-2.
When using heatsinks that extend beyond the PXH reference heatsink envelope shown in
Figure 6-2Figure 6-2Figure 6-2, any motherboard components placed between the heatsink and
motherboard cannot exceed 2.40 mm (0.094 in.) in height.
Figure 6-2. Torsional Clip Heatsink Volumetric Envelope for the Intel® 6700PXH 64-bit PCI Hub
Chipset Component
3.01mm.
Heatsink Fin
1.86mm.
14.71mm
Heatsink Base
Motherboard
Die + TIM
FCBGA +
Solder Balls
31.00mm.
Heatsink
Fin
31.00mm.
3.00mm.
6.4
6.5
Board-Level Components Keepout Dimensions
The locations of hole pattern and keepout zones for the reference thermal solution are shown in
Figure 6-3Figure 6-3Figure 6-3 and Figure 6-4Figure 6-4Figure 6-4.
Torsional Clip Heatsink Thermal Solution Assembly
The reference thermal solution for the PXH component is a passive extruded heatsink with thermal
interface. It is attached using a clip with each end hooked through an anchor soldered to the board.
Figure 6-5Figure 6-5Figure 6-5 shows the reference thermal solution assembly and associated
components. Figure 6-6Figure 6-6Figure 6-6 shows the position of the heatsink rails relative to the
PXH package top surface.
Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in
Appendix B. Appendix A contains vendor information for each thermal solution component.
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Reference Thermal SolutionReference Thermal SolutionReference Thermal Solution
Figure 6-3. Torsional Clip Heatsink Board Component Keepout
Component
keepout area
1.756
PXH
1.886
2x 0.943
Parallel Mean
Airflow
Direction
Max
component
Height 0.50
2x 0.878
NOTE: All dimensions are in inches.
Figure 6-4. Retention Mechanism Component Keepout Zones
Component
Keepout Area
0.500
2x 0.060
0.120
0.345
(0.345)
0.225
0.050"
Component
0.170
0.750
See Detail
A
Keepout
(0.165)
Detail A
0.100
0.165
0.083
2x 0.038
Plated Through
Hole
0.173
0.345
0.200
0.100
2x 0.056
Trace
Component
Keepout
Keepout
NOTE: All dimensions are in inches.
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Reference Thermal SolutionReference Thermal SolutionReference Thermal Solution
6.5.1
Heatsink Orientation
Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned
with the direction of the heatsink fins.
Figure 6-5. Torsional Clip Heatsink Assembly
Figure 6-6 Heatsink Rails to PXH Package Footprint
6.5.2
Extruded Heatsink Profiles
The reference torsional clip heatsink uses an extruded heatsink for cooling the PXH component.
Figure 6-7Figure 6-7Figure 6-7 shows the heatsink profile. Appendix A lists a supplier for this
extruded heatsink. Other heatsinks with similar dimensions and increased thermal performance may
be available. Full mechanical drawing of this heatsink is provided in Appendix B.
6.5.3
Mechanical Interface Material
There is no mechanical interface material associated with this reference solution.
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Reference Thermal SolutionReference Thermal SolutionReference Thermal Solution
6.5.4
Thermal Interface Material
A thermal interface material provides improved conductivity between the die and heatsink. The
reference thermal solution uses Chomerics* T-710, 0.127 mm (0.005 in.) thick, 8 mm x 8 mm
square.
Note: Unflowed or “dry” Chomerics* T710 has a material thickness of 0.005 inch. The flowed or “wet”
Chromerics T710 has a material thickness of ~0.0025 inch after it reaches its phase change
temperature.
6.5.4.1
Effect of Pressure on TIM Performance
As mechanical pressure increases on the TIM, the thermal resistance of the TIM decreases. This
phenomenon is due to the decrease of the bond line thickness (BLT). BLT is the final settled
thickness of the thermal interface material after installation of heatsink. The effect of pressure on the
thermal resistance of the Chomerics T710 TIM is shown in Table 6-1Table 6-1Table 6-1. The
heatsink clip provides enough pressure for the TIM to achieve a thermal conductivity of 0.17°C
inch2/W.
Table 6-1. Chomerics* T710 TIM Performance as a Function of Attach Pressure
Pressure (psi)
Thermal Resistance (°C × in2)/W
5
0.37
0.30
0.21
0.17
10
20
30
NOTE: All measured at 50°C.
6.5.5
Heatsink Clip
The reference solution uses a wire clip with hooked ends. The hooks attach to wire anchors to fasten
the clip to the board. See Appendix B for a mechanical drawing of the clip.
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Reference Thermal SolutionReference Thermal SolutionReference Thermal Solution
Figure 6-7. Torsional Clip Heatsink Extrusion Profile
6.5.6
Clip Retention Anchors
For Intel® 6700PXH 64-bit PCI Hub-based platforms that have very limited board space, a clip
retention anchor has been developed to minimize the impact of clip retention on the board. It is
based on a standard three-pin jumper and is soldered to the board like any common through-hole
header. A new anchor design is available with 45° bent leads to increase the anchor attach reliability
over time. See Appendix A for the part number and supplier information.
6.6
Reliability Guidelines
Each motherboard, heatsink and attach combination may vary the mechanical loading of the
component. Based on the end user environment, the user should define the appropriate reliability
test criteria and carefully evaluate the completed assembly prior to use in high volume. Some
general recommendations are shown in Table 6-2Table 6-2Table 6-2.
Table 6-2. Reliability Guidelines
Test (1)
Requirement
Pass/Fail Criteria (2)
Mechanical Shock
Random Vibration
Temperature Life
50 g, board level, 11 msec, 3 shocks/axis.
Visual Check and Electrical
Functional Test
7.3 g, board level, 45 min/axis, 50 Hz to 2000 Hz.
Visual Check and Electrical
Functional Test
Visual Check
85°C, 2000 hours total, checkpoints at 168, 500,
1000, and 2000 hours.
Thermal Cycling
Humidity
–5°C to +70°C, 500 cycles.
Visual Check
Visual Check
85% relative humidity, 55°C, 1000 hours.
NOTES:
1. It is recommended that the above tests be performed on a sample size of at least twelve assemblies from
three lots of material.
2. Additional pass/fail criteria may be added at the discretion of the user.
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A Thermal Solution Component
Suppliers
A.1
Torsional Clip Heatsink Thermal Solution
Supplier
Part
Intel Part Number
Contact Information
(Part Number)
Heatsink Assembly includes:
Harry Lin (USA)
714-739-5797
•
Unidirectional Fin
Heatsink
C76435-001
CCI/ACK*
Monica Chih (Taiwan)
866-2-29952666, x131
•
•
Thermal Interface
Material
Torsional Clip
Harry Lin (USA)
714-739-5797
Undirectional Fin Heatsink
(31.0 x 31.0 x 12.2 mm)
C76434-001
A69230-001
C17725-001
A13494-005
CCI/ACK
Monica Chih (Taiwan)
866-2-29952666, x131
Todd Sousa (USA)
360-606-8171
Thermal Interface
(Chomerics* T-710)
Chomerics*
69-12-22066-T710
Harry Lin (USA)
714-739-5797
Heatsink Attach Clip
Solder-Down Anchor
CCI/ACK
Monica Chih (Taiwan)
866-2-29952666, x131
Julia Jiang (USA)
408-919-6178
Foxconn*
(HB96030-DW)
Note: The enabled components may not be currently available from all suppliers. Contact the supplier
directly to verify time of component availability.
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Thermal Solution Component Suppliers
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B Mechanical Drawings
Table B-1Table B-1Table B-1 lists the mechanical drawings included in this appendix.
Table B-1. Mechanical Drawing List
Drawing Description
Figure Number
Torsional Clip Heatsink Assembly Drawing
Figure B-1Figure B-
1Figure B-1
Torsional Clip Heatsink Drawing
Torsional Clip Drawing
Figure B-2Figure B-
2Figure B-2
Figure B-3Figure B-
3Figure B-3
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