Intel 632xESB User Manual

®
Intel 631xESB/632xESB I/O  
Controller Hub for Embedded  
Applications  
Thermal and Mechanical Design Guidelines  
February 2007  
Order Number: 315263-001  
Contents—Intel® 6321ESB ICH  
Contents  
Figures  
9
Torsional Clip Heatsink Measured Thermal Performance Versus Approach Velocity and Target  
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Introduction—Intel® 6321ESB ICH  
1.0  
Introduction  
As the complexity of computer systems increases, so do the power dissipation  
requirements. Care must be taken to ensure that the additional power is properly  
dissipated. Typical methods to improve heat dissipation include selective use of  
ducting, and/or passive heatsinks.  
The goals of this document are to:  
• Outline the thermal and mechanical operating limits and specifications for the  
Intel® 6321ESB I/O Controller Hub.  
• Describe a reference thermal solution that meets the specification of Intel®  
6321ESB I/O Controller Hub in Embedded applications.  
Properly designed thermal solutions provide adequate cooling to maintain the Intel®  
6321ESB I/O Controller Hub component die temperatures at or below thermal  
specifications. This is accomplished by providing a low local-ambient temperature,  
ensuring adequate local airflow, and minimizing the die to local-ambient thermal  
resistance. By maintaining the Intel® 6321ESB I/O Controller Hub component die  
temperature at or below the specified limits, a system designer can ensure the proper  
functionality, performance, and reliability of the chipset. Operation outside the  
functional limits can degrade system performance and may cause permanent changes  
in the operating characteristics of the component.  
The simplest and most cost-effective method to improve the inherent system cooling  
characteristics is through careful chassis design and placement of fans, vents, and  
ducts. When additional cooling is required, component thermal solutions may be  
implemented in conjunction with system thermal solutions. The size of the fan or  
heatsink can be varied to balance size and space constraints with acoustic noise.  
This document addresses thermal design and specifications for the Intel® 6321ESB I/O  
Controller Hub component only. For thermal design information on other chipset  
components, refer to the respective component datasheet.  
1.1  
Design Flow  
To develop a reliable, cost-effective thermal solution, several tools have been provided  
to the system designer. Figure 1 illustrates the design process implicit to this document  
and the tools appropriate for each step.  
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Intel® 6321ESB ICH—Introduction  
Figure 1.  
Thermal Design Process  
Step 1: Thermal  
Simulation  
y Thermal Model  
y Thermal Model User's Guide  
Step 2: Heatsink Selection  
y Thermal Reference  
y Mechanical Reference  
Step 3: Thermal Validation  
y Thermal Testing Software  
y Software User's Guide  
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Introduction—Intel® 6321ESB ICH  
1.2  
Definition of Terms  
Table 1.  
Definition of Terms  
Term  
Definition  
Bond line thickness. Final settled thickness of the  
thermal interface material after installation of  
heatsink.  
BLT  
Flip Chip Ball Grid Array. A ball grid array packaging  
technology where the die is exposed on the package  
substrate.  
FCBGA  
The chipset component that integrates an Ultra ATA  
100 controller, six Serial ATA host controller ports,  
one EHCI host controller supporting eight external  
USB 2.0 ports, LPC interface controller, flash BIOS  
interface controller, PCI/PCI-X interface controller,  
PCI Express interface, BMC controller, Azalia / AC'97  
digital controller, integrated LAN controller, an ASF  
controller and a ESI for communication with the MCH.  
Intel® 6321ESB I/O Controller Hub  
Linear Feet Per Minute. A measure of airflow emitted  
from a forced convection device, such as an axial fan  
or blower.  
LFM  
Memory controller hub. The chipset component that  
contains the processor interface, the memory  
interface, and the South Bridge Interface.  
MCH  
Maximum die temperature allowed. This temperature  
is measured at the geometric center of the top of the  
package die.  
Tcase-max  
Tcase-min  
Minimum die temperature allowed. This temperature  
is measured at the geometric center of the top of the  
package die.  
Thermal Design Power. Thermal solutions should be  
designed to dissipate this target power level. TDP is  
not the maximum power that the chipset can  
dissipate.  
TDP  
Case-to-ambient thermal characterization parameter.  
A measure of the thermal solution thermal  
performance including the TIM using total package  
power. Defined as (TCASE – TLA) / Total Package  
Power.  
ΨCA  
Note: Heat source must be specified when using Ψ  
calculations.  
Case-to-Sink thermal characterization parameter. A  
measure of the thermal interface material  
performance using total package power. Defined as  
(TCASE - TSINK)/ Total Package Power.  
ΨCS  
Note: Heat source must be specified when using Ψ  
calculations.  
Sink-to-Ambient thermal characterization parameter.  
A measure of the heat sink performance using total  
package power. Defined as (TSINK - TLA)/Total  
Package Power.  
ΨSA  
Note: Heat source must be specified when using Ψ  
calculations.  
1.3  
Reference Documents  
The reader of this specification should also be familiar with material and concepts  
presented in the following documents:  
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Intel® 6321ESB ICH—Introduction  
Table 2.  
Referenced Documents  
Title  
Location  
Intel® 631xESB / 632xESB I/O Controller Hub Datasheet  
Intel® 631xESB / 632xESB I/O Controller Hub Specification Update  
Intel® 631xESB/632xESB I/O Controller Hub Thermal/Mechanical  
Design Guide  
Reference# 31307301  
Intel® 6700PXH 64-bit PCI Hub/6702PXH 64-bit PCI Hub (PXH/PXH- http://www.intel.com/design/  
V) Thermal Mechanical Design Guidelines  
Intel® 6700PXH 64-bit PCI Hub (PXH) Datasheet  
BGA/OLGA Assembly Development Guide  
Various system thermal design suggestions  
1.  
Unless otherwise specified, these documents are available through your Intel field sales  
representative. Some documents may not be available at this time.  
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Packaging Technology—Intel® 6321ESB ICH  
2.0  
Packaging Technology  
The Intel® 6321ESB I/O Controller Hub component uses a 40 mm x 40 mm, 10-layer  
FC-BGA3 package (see Figure 2 and Figure 3).  
Figure 2.  
Intel® 6321ESB I/O Controller Hub Package Dimensions (Top View)  
Die  
Keepout  
Area  
Handling  
Exclusion  
Area  
19.49mm.  
10.78mm.  
6.17mm.  
ESB2  
Die  
20.19mm. 13.99mm.  
26.0mm. 30.0mm. 40.0mm.  
3.10mm.  
26.0mm.  
30.0mm.  
40.0mm.  
Figure 3.  
Intel® 6321ESB I/O Controller Hub Package Dimensions (Side View)  
Substrate  
Decoup  
2.535 ± 0.123 mm  
Die  
Cap  
0.84 ± 0.05 mm  
2.100 ± 0.121 mm  
0.7 mm Max  
0.20  
See note 4.  
0.20 –C–  
Seating Plane  
0.435 ± 0.025 mm  
See note 3  
See note 1.  
Notes:  
1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)  
2. All dimensions and tolerances conform to ANSI Y14.5M-1994  
3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm  
4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave  
(bowl shaped) orientation after reflow  
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Intel® 6321ESB ICH—Packaging Technology  
Figure 4.  
Intel® 6321ESB I/O Controller Hub Package Dimensions (Bottom View)  
AT  
A
R
A
AP  
N
AM  
AL  
AK  
AJ  
A
H
AG  
AF  
AE  
A
D
A
C
AB  
AA  
W
U
R
N
L
40 + 0.05  
- A -  
Y
V
T
P
M
K
H
F
19.11  
J
G
E
35X 1.092  
C
A
B
A
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32 34 36  
11 13 15 17 19 21 23 25 27 29 31 33 35  
1
3
5
7
9
35X  
1.092  
19.11  
B
40 + 0.05  
0.2  
C
A
Notes:  
1.  
2.  
3.  
All dimensions are in millimeters.  
All dimensions and tolerances conform to ANSI Y14.5M-1994.  
Package Mechanical Requirements  
The Intel® 6321ESB I/O Controller Hub package has an exposed bare die which is  
capable of sustaining a maximum static normal load of 15-lbf. The package is NOT  
capable of sustaining a dynamic or static compressive load applied to any edge of the  
bare die. These mechanical load limits must not be exceeded during heatsink  
installation, mechanical stress testing, standard shipping conditions and/or any other  
use condition.  
Notes:  
1.  
2.  
3.  
The heatsink attach solutions must not include continuous stress onto the chipset package with the  
exception of a uniform load to maintain the heatsink-to-package thermal interface.  
These specifications apply to uniform compressive loading in a direction perpendicular to the bare die/  
IHS top surface.  
These specifications are based on limited testing for design characterization. Loading limits are for the  
package only.  
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Thermal Specifications—Intel® 6321ESB ICH  
3.0  
Thermal Specifications  
3.1  
Thermal Design Power (TDP)  
Analysis indicates that real applications are unlikely to cause the Intel® 6321ESB I/O  
Controller Hub component to consume maximum power dissipation for sustained time  
periods. Therefore, in order to arrive at a more realistic power level for thermal design  
purposes, Intel characterizes power consumption based on known platform benchmark  
applications. The resulting power consumption is referred to as the Thermal Design  
Power (TDP). TDP is the target power level that the thermal solutions should be  
designed to. TDP is not the maximum power that the chipset can dissipate.  
For TDP specifications, see Table 3. Flip chip ball grid array (FC-BGA) packages have  
poor heat transfer capability into the board and have minimal thermal capability  
without a thermal solution. Intel recommends that system designers plan for a heatsink  
when using the Intel® 6321ESB I/O Controller Hub component.  
3.2  
Die Case Temperature  
To ensure proper operation and reliability of the Intel® 6321ESB I/O Controller Hub  
component, the die temperatures must be at or between the maximum/minimum  
operating temperature ranges as specified in Table 3. System and/or component level  
thermal solutions are required to maintain these temperature specifications. Refer to  
Chapter 6.0 for guidelines on accurately measuring package die temperatures.  
Table 3.  
Intel® 6321ESB I/O Controller Hub Thermal Specifications  
Parameter  
Tcase_max  
Value  
Notes  
105°C  
5°C  
Tcase_min  
TDP  
12.4W  
Note:  
These specifications are based on silicon characterization; however, they may be  
updated as further data becomes available.  
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Intel® 6321ESB ICH—Thermal Simulation  
4.0  
Thermal Simulation  
Intel provides thermal simulation models of the Intel® 6321ESB I/O Controller Hub  
component and associated user's guides to aid system designers in simulating,  
analyzing, and optimizing their thermal solutions in an integrated, system-level  
environment. The models are for use with the commercially available Computational  
Fluid Dynamics (CFD)-based thermal analysis tool Flotherm* (version 5.1 or higher) by  
Flomerics, Inc*. These models are also available in IcePak* format. Contact your Intel  
field sales representative to order the thermal models and user's guides.  
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Thermal Solution Requirements—Intel® 6321ESB ICH  
5.0  
Thermal Solution Requirements  
5.1  
Characterizing the Thermal Solution Requirement  
The idea of a “thermal characterization parameter” Ψ (the Greek letter psi), is a  
convenient way to characterize the performance needed for the thermal solution and to  
compare thermal solutions in identical situations (i.e., heating source, local ambient  
conditions, etc.). The thermal characterization parameter is calculated using total  
package power, whereas actual thermal resistance, θ (theta), is calculated using actual  
power dissipated between two points. Measuring actual power dissipated into the heat  
sink is difficult, since some of the power is dissipated via heat transfer into the package  
and board.  
The case-to-local ambient thermal characterization parameter (Ψ ) is used as a  
CA  
measure of the thermal performance of the overall thermal solution. It is defined by  
Equation 1 and measured in units of °C/W.  
Equation 1. Case-to-Local Ambient Thermal Characterization Parameter (Ψ  
)
CA  
T
– T  
CASE  
LA  
-------------------------  
Ψ
=
CA  
TDP  
The case-to-local ambient thermal characterization parameter, Ψ , is comprised of  
CA  
Ψ
Ψ
, the thermal interface material (TIM) thermal characterization parameter, and of  
, the sink-to-local ambient thermal characterization parameter:  
CS  
SA  
Equation 2. Case-to-Local Ambient Thermal Characterization Parameter (Ψ  
)
CA  
Ψ
= Ψ + Ψ  
CS SA  
CA  
Ψ
is strongly dependent on the thermal conductivity and thickness of the TIM  
CS  
between the heat sink and device package.  
Ψ
is a measure of the thermal characterization parameter from the bottom of the  
SA  
heat sink to the local ambient air. Ψ is dependent on the heat sink material, thermal  
SA  
conductivity, and geometry. It is also strongly dependent on the air velocity through  
the fins of the heat sink. Figure 5 illustrates the combination of the different thermal  
characterization parameters.  
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Intel® 6321ESB ICH—Thermal Solution Requirements  
Figure 5.  
Processor Thermal Characterization Parameter Relationships  
TA  
ΨSA  
ΨCS  
HEATSINK  
ΨCA  
TIM  
TS  
TC  
Device  
Example 1. Calculating the Required Thermal Performance  
The cooling performance, Ψ is defined using the thermal characterization parameter  
CA,  
previously described. The process to determine the required thermal performance to  
cool the device includes:  
1. Define a target component temperature T  
and corresponding TDP.  
CASE  
2. Define a target local ambient temperature, T .  
LA  
3. Use Equation 1 and Equation 2 to determine the required thermal performance  
needed to cool the device.  
The following provides an example of how you might determine the appropriate  
performance targets.  
Assume:  
• TDP = 12.4 W and T  
= 105° C  
CASE  
• Local processor ambient temperature, T = 65° C.  
LA  
Then the following could be calculated using Equation 1 for the given chipset  
configuration:  
T
– T  
105 – 65  
------------------------- ---------------  
= 3.23°  
C
W
CASE  
LA  
---  
Ψ
=
=
CA  
TDP  
12.4  
To determine the required heat sink performance, a heat sink solution provider would  
need to determine Ψ performance for the selected TIM and mechanical load  
CS  
configuration. If the heat sink solution were designed to work with a TIM material  
performing at Ψ ≤ 0.35 °C/W, solving from Equation 2, the performance needed from  
CS  
the heat sink is:  
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Thermal Solution Requirements—Intel® 6321ESB ICH  
C
W
---  
Ψ
= Ψ  
Ψ  
= 3.23 – 0.35 = 2.88°  
CS  
SA  
CA  
If the local ambient temperature is relaxed to 45° C, the same calculation can be  
carried out to determine the new case-to-ambient thermal resistance:  
T – T  
105 – 45  
C
W
C
LA  
----------------- --------------  
= 4.84°  
---  
Ψ
=
=
CA  
TDP  
12.4  
It is evident from the above calculations that a reduction in the local ambient  
temperature has a significant effect on the case-to-ambient thermal resistance  
requirement. This effect can contribute to a more reasonable thermal solution including  
reduced cost, heat sink size, heat sink weight, and a lower system airflow rate.  
®
Table 4 summarizes the thermal budget required to adequately cool the Intel  
6321ESB I/O Controller Hub in one configuration using a TDP of 12.4 W. Further  
calculations would need to be performed for different TDPs. Since the results are based  
on air data at sea level, a correction factor would be required to estimate the thermal  
performance at other altitudes.  
Table 4.  
Required Heat Sink Thermal Performance (Ψ  
)
CA  
Device  
ΨCA (º C/W) at TLA = 45º C  
ΨCA (º C/W) at TLA = 65º C  
Intel® 6321ESB I/O Controller  
Hub @ 12.4 W  
4.84  
3.23  
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Intel® 6321ESB ICH—Thermal Metrology  
6.0  
Thermal Metrology  
The system designer must make temperature measurements to accurately determine  
the thermal performance of the system. Intel has established guidelines for proper  
techniques to measure the Intel® 6321ESB I/O Controller Hub die temperatures.  
®
Section 6.1 provides guidelines on how to accurately measure the Intel 6321ESB ICH  
die temperatures. The flowchart in Figure 6 offers useful guidelines for thermal  
performance and evaluation.  
6.1  
Die Case Temperature Measurements  
®
To ensure functionality and reliability, the Tcase of the Intel 6321ESB ICH must be  
maintained at or between the maximum/minimum operating range of the temperature  
specification as noted in Table 3. The surface temperature at the geometric center of  
the die corresponds to Tcase. Measuring Tcase requires special care to ensure an  
accurate temperature measurement.  
Temperature differences between the temperature of a surface and the surrounding  
local ambient air can introduce errors in the measurements. The measurement errors  
could be due to a poor thermal contact between the thermocouple junction and the  
surface of the package, heat loss by radiation and/or convection, conduction through  
thermocouple leads, and/or contact between the thermocouple cement and the  
heatsink base. For maximize measurement accuracy, only the 0° thermocouple attach  
approach is recommended.  
6.1.1  
Zero Degree Angle Attach Methodology  
1. Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0.06 in.) deep hole centered on the  
bottom of the heatsink base.  
2. Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered  
hole to one edge of the heatsink. The slot should be parallel to the heatsink fins  
(see Figure 7).  
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.  
4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The  
cutouts should match the slot and hole milled into the heatsink base.  
5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to  
the center of the top surface of the die using a high thermal conductivity cement.  
During this step, ensure no contact is present between the thermocouple cement  
and the heatsink base because any contact will affect the thermocouple reading. It  
is critical that the thermocouple bead makes contact with the die (see Figure 8).  
6. Attach heatsink assembly to the MCH and route thermocouple wires out through  
the milled slot.  
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Thermal Metrology—Intel® 6321ESB ICH  
Figure 6.  
Thermal Solution Decision Flowchart  
Start  
Attach  
thermocouples  
using recommended  
metrology. Setup  
the system in the  
desired  
Run the Power  
program and  
monitor the  
device die  
Attach device  
to board  
using normal  
reflow  
Tdie >  
Specification?  
No  
temperature.  
process.  
configuration.  
End  
Select  
Heatsink  
Heatsink  
Required  
Yes  
001240  
Figure 7.  
Zero Degree Angle Attach Heatsink Modifications  
Note: Not to scale.  
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Intel® 6321ESB ICH—Thermal Metrology  
Figure 8.  
Zero Degree Angle Attach Methodology (Top View)  
Die  
Thermocouple  
Wire  
Cement +  
Thermocouple Bead  
Substrate  
Note: Not to scale.  
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Reference Thermal Solution—Intel® 6321ESB ICH  
7.0  
Reference Thermal Solution  
Intel has developed one reference thermal solution to meet the cooling needs of the  
Intel® 6321ESB I/O Controller Hub component under operating environments and  
specifications defined in this document. This chapter describes the overall requirements  
for the Torsional Clip Heatsink reference thermal solution including critical-to-function  
dimensions, operating environment, and validation criteria. Other chipset components  
may or may not need attached thermal solutions, depending on your specific system  
local-ambient operating conditions.  
7.1  
7.2  
Operating Environment  
®
The Intel 6321ESB ICH reference thermal solution was designed assuming a  
maximum local-ambient temperature of 65°C. The minimum recommended airflow  
velocity through the cross section of the heatsink fins is 150 linear feet per minute  
(LFM). The approaching airflow temperature is assumed to be equal to the local-  
ambient temperature. The thermal designer must carefully select the location to  
measure airflow to obtain an accurate estimate. These local-ambient conditions are  
based on a 55°C external-ambient temperature at sea level. (External-ambient refers  
to the environment external to the system.)  
Heatsink Performance  
Figure 9 depicts the measured thermal performance of the reference thermal solution  
versus approach air velocity. Since this data was measured at sea level, a correction  
factor would be required to estimate thermal performance at other altitudes.  
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Intel® 6321ESB ICH—Reference Thermal Solution  
Figure 9.  
Torsional Clip Heatsink Measured Thermal Performance Versus Approach  
Velocity and Target at 65C Local-Ambient  
8.000  
7.000  
Thermal Target  
6.000  
Simulation results with  
EOLife TIMperformance  
5.000  
4.000  
3.000  
2.000  
1.000  
0.000  
0
50  
100  
150  
200  
250  
300  
350  
400  
LFM through fin area  
7.3  
Mechanical Design Envelope  
While each design may have unique mechanical volume and height restrictions or  
implementation requirements, the height, width, and depth constraints typically placed  
®
on the Intel 6321ESB ICH thermal solution are shown in Figure 10.  
When using heatsinks that extend beyond the Intel® 6321ESB I/O Controller Hub  
reference heatsink envelope shown in Figure 10, any motherboard components placed  
between the heatsink and motherboard cannot exceed 2.46 mm (0.10 in.) in height.  
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Reference Thermal Solution—Intel® 6321ESB ICH  
Figure 10.  
Torsional Clip Heatsink Volumetric Envelope for the Intel® 6321ESB I/O  
Controller Hub  
ESB2  
Passive  
Heatsink  
Die + TIM  
FCBGA + Solder Balls  
Motherboard  
42.30 mm  
Passive  
Heatsink  
7.4  
Board-Level Components Keepout Dimensions  
The location of holes pattern and keepout zones for the reference thermal solution are  
shown in Figure 11. This reference thermal solution has the same mounting hole  
pattern as that of the Intel® E7500/E7501/E7505 chipset.  
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Intel® 6321ESB ICH—Reference Thermal Solution  
7.5  
Torsional Clip Heatsink Thermal Solution Assembly  
®
The reference thermal solution for the Intel 6321ESB ICH component is a passive  
heatsink with thermal interface. It is attached using a clip with each end hooked  
through an anchor soldered to the board. Figure 12 shows the reference thermal  
solution assembly and associated components. The torsional clip and the clip retention  
anchor are the same as the one used on the Intel® E7500/E7501/E7505 and 3100  
chipset reference thermal solutions.  
Full mechanical drawings of the thermal solution assembly and the heatsink clip are  
Component Suppliers” contains vendor information for each thermal solution  
component.  
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Reference Thermal Solution—Intel® 6321ESB ICH  
Figure 11.  
Torsional Clip Heatsink Board Component Keepout  
Note: Same Keepout zones as Intel ® 3100 Chipset  
7.5.1  
Heatsink Orientation  
Since this solution is based on a unidirectional heatsink, mean airflow direction must be  
aligned with the direction of the heatsink fins.  
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Intel® 6321ESB ICH—Reference Thermal Solution  
Figure 12.  
Torsional Clip Heatsink Assembly  
7.5.2  
7.5.3  
Mechanical Interface Material  
There is no mechanical interface material associated with this reference solution.  
Thermal Interface Material  
A Thermal Interface Material (TIM) provides improved conductivity between the die and  
heatsink. The reference thermal solution uses Honeywell* PCM45F, 0.254 mm (0.010  
in.) thick, 15 mm x 15 mm (0.59 in. x 0.59 in.) square.  
Note:  
Unflowed or "dry" Honewell PCM-45F has a material thickness of 0.010 inch. The  
flowed or "wet" Honeywell PCM-45F has a material thickness of ~0.003 inch after it  
reaches its phase change temperature.  
7.5.3.1  
Effect of Pressure on TIM Performance  
As mechanical pressure increases on the TIM, the thermal resistance of the TIM  
decreases. This phenomenon is due to the decrease of the bond line thickness (BLT).  
BLT is the final settled thickness of the thermal interface material after installation of  
heatsink. The effect of pressure on the thermal resistance of the Honeywell PCM45 F  
TIM is shown in Table 5.  
Intel provides both End of Line and End of Life TIM thermal resistance values of  
Honeywell PCM45F. End of Line and End of Life TIM thermal resistance values are  
obtained through measurement on a Test Vehicle similar to the Intel® 631xESB/  
632xESB I/O's physical attributes using an extruded aluminum heatsink. The End of  
Line value represents the TIM performance post heatsink assembly while the End of  
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Reference Thermal Solution—Intel® 6321ESB ICH  
Life value is the predicted TIM performance when the product and TIM reaches the end  
of its life. The heatsink clip provides enough pressure for the TIM to achieve End of Line  
2
thermal resistance of 0.345 °C x in /W and End of Life thermal resistance of 0.459°C  
2
in /W.  
Table 5.  
Honeywell PCM45 F TIM Performance as a Function of Attach Pressure  
Thermal Resistance (°C × in2)/W  
Pressure on IHS(psi)  
End of Line End of Life  
End of Line End of Life  
2.18  
0.391  
0.345  
0.551  
0.459  
4.35  
Note: All measured at 50ºC.  
7.5.4  
7.5.5  
Heatsink Clip  
The reference solution uses a wire clip with hooked ends. The hooks attach to wire  
anchors to fasten the clip to the board. See Appendix B, “Mechanical Drawings” for a  
mechanical drawing of the clip.  
Clip Retention Anchors  
For Intel® 6321ESB I/O Controller Hub-based platforms that have very limited board  
space, a clip retention anchor has been developed to minimize the impact of clip  
retention on the board. It is based on a standard three-pin jumper and is soldered to  
the board like any common through-hole header. A new anchor design is available with  
45° bent leads to increase the anchor attach reliability over time. See Appendix A,  
“Thermal Solution Component Suppliers” for the part number and supplier information.  
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Intel® 6321ESB ICH—Reliability Guidelines  
8.0  
Reliability Guidelines  
Each motherboard, heatsink and attach combination may vary the mechanical loading  
of the component. Based on the end user environment, the user should define the  
appropriate reliability test criteria and carefully evaluate the completed assembly prior  
to use in high volume. Some general recommendations are shown in Table 6.  
Table 6.  
Reliability Guidelines  
Test (1)  
Requirement  
Pass/Fail Criteria (2)  
Mechanical Shock  
50 g, board level, 11 msec, 3 shocks/axis  
Visual Check and Electrical Functional Test  
7.3 g, board level, 45 min/axis, 50 Hz to  
2000 Hz  
Random Vibration  
Temperature Life  
Visual Check and Electrical Functional Test  
Visual Check  
85°C, 2000 hours total, checkpoints at  
168, 500, 1000, and 2000 hours  
Thermal Cycling  
Humidity  
-5°C to +70°C, 500 cycles  
Visual Check  
Visual Check  
85% relative humidity, 55°C, 1000 hours  
Notes:  
1.  
It is recommended that the above tests be performed on a sample size of at least twelve assemblies  
from three lots of material.  
Additional pass/fail criteria may be added at the discretion of the user.  
2.  
§ §  
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Thermal Solution Component Suppliers—Intel® 6321ESB ICH  
Appendix A Thermal Solution Component Suppliers  
A.1  
Torsional Clip Heatsink Thermal Solution  
Intel Part  
Number  
Supplier  
Part  
Contact Information  
Wendy Lin  
510-770-8566, x211  
Wendy@coolermaster.com  
(Part Number)  
AdvancedTCA* and  
Embedded Form Factor Heat  
Sink  
ECB-00306-01-GP  
(Aluminum)  
N/A  
N/A  
Paula Knoll  
858-705-1274  
Honeywell*  
PCM45F  
Thermal Interface  
(PCM45F)  
Harry Lin (USA)  
714-739-5797  
Monica Chih (Taiwan)  
866-2-29952666, x131  
Heatsink Attach Clip  
A69230-001  
CCI/ACK  
Foxconn*  
Bob Hall (USA)  
503-693-3509, x235  
Heat Sink Attach Clip  
Solder-Down Anchor  
A69230-001  
A13494-005  
Julia Jiang (USA)  
408-919-6178  
Foxconn  
(HB96030-DW)  
Note: The enabled components may not be currently available from all suppliers. Contact the supplier  
directly to verify time of component availability.  
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Intel® 6321ESB ICH—Mechanical Drawings  
Appendix B Mechanical Drawings  
Table 7 lists the mechanical drawings included in this appendix.  
Table 7.  
Mechanical Drawing List  
Drawing Description  
Figure Number  
Torsional Clip Heatsink Assembly Drawing  
Torsional Clip Heatsink Drawing  
Heat Sink Foam Gasket Drawing  
Torsional Clip Drawing  
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Mechanical Drawings—Intel® 6321ESB ICH  
Figure 13. Torsional Clip Heatsink Assembly Drawing  
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Intel® 6321ESB ICH—Mechanical Drawings  
Figure 14. Torsional Clip Heatsink Drawing  
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Mechanical Drawings—Intel® 6321ESB ICH  
Figure 15. Heat Sink Foam Gasket Drawing  
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Intel® 6321ESB ICH—Mechanical Drawings  
Figure 16. Torsional Clip Drawing  
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