System Board D2529
for TX300 S4
Technical Manual
Edition November 2007
Contents
D2529 (TX300 S4)
Technical Manual
1
Introduction
This technical manual describes the system board D2529, which can be
equipped with one or two Intel® processors.
You will find further information in the BIOS description.
Further information about drivers is provided in the readme files on the hard
disk, on the supplied “ServerStart“ or “Update“ CDs.
Notational conventions
The meanings of the symbols and fonts used in this manual are as follows:
italics
indicates commands, menu items, file and path
names or software programs
fixed font
indicate system output on the monitor
semi-bold fixed
font
indicates values to be entered through the keyboard
[Key symbol]
indicates keys according to their representation on the
keyboard
If capital letters are to be entered explicitly, then the
Shift key is shown, e.g. [SHIFT] - [A] for A.
If two keys need to be pressed at the same time, then
this is shown by placing a hyphen between the two key
symbols.
“quotation marks”
indicates names and terms that are being empha-
sized.
Ê
indicates an operation that to be performed
V
I
CAUTION!
indicates warnings, which, if ignored, will endanger
your health, destroy the system or lead to the loss of
data.
indicates additional information, notes and tips
Table 1: Notational conventions
D2529 (TX300 S4)
Technical Manual
5
2
Important notes
In this chapter you will find essential information regarding safety when working
with your server.
V
CAUTION!
With the system board installed you must open the system to access the
system board. How to access the system board of your system is
described in the appropriate service supplement.
When handling the system board, refer to the specific notes on safety in
the operating manual and/or service supplement for the respective
server.
2.1
Notes on safety
V
CAUTION!
●
The actions described in these instructions should only be performed
by authorized, qualified personnel. Equipment repairs should only be
performed by qualified staff. Any failure to observe the guidelines in
this manual, and any unauthorized openings and improper repairs
could expose the user to risks (electric shock, fire hazards) and could
also damage the equipment. Please note that any unauthorized
openings of the device will result in the invalidation of the warranty
and exclusion from all liability.
●
●
Transport the device only in the antistatic original packaging or in
packaging that protects it from knocks and jolts.
Only install expansions that are allowed for the system board. If you
install other expansions, you may damage the requirements and rules
governing safety and electromagnetic compatibility or your system.
Information on which system expansions are suitable can be
obtained from the customer service centre or your sales outlet.
●
The warranty expires if the device is damaged during the installation
or replacement of system expansions.
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7
Notes on safety
Important notes
V
●
Components can become very hot during operation. Ensure you do
not touch components when making extensions to the system board.
There is a danger of burns!.
●
●
Transmission lines to peripheral devices must be adequately
shielded.
To the LAN wiring the requirements apply in accordance with the
standards EN 50173 and EN 50174-1/2. As minimum requirement
the use of a protected LAN line of category 5 for 10/100 MBps
Ethernet, and/or of category 5e for Gigabit Ethernet is considered.
The requirements of the specification ISO/IEC 11801 are to be
considered.
●
Never connect or disconnect data transmission lines during a storm
(lightning hazard).
Batteries
V
CAUTION!
●
Incorrect replacement of lithium battery may lead to a risk of
explosion. The batteries may only be replaced with identical batteries
or with a type recommended by the manufacturer.
It is essential to observe the instructions in chapter “Replacing the
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D2529 (TX300 S4)
Important notes
Notes on safety
Modules with electrostatic-sensitive components
Systems and components that might be damaged by electrostatic discharge
(ESD) are marked with the following label:
Figure 1: ESD label
When you handle components fitted with ESDs, you must observe the following
points under all circumstances:
●
You must always discharge yourself of static charges (e.g. by touching a
grounded object) before working.
●
●
The equipment and tools you use must be free of static charges.
Remove the power plug from the power socket before inserting or removing
boards containing ESDs.
●
●
●
Always hold boards with ESDs by their edges.
Never touch pins or conductors on boards fitted with ESDs.
Use a grounding cable designed for this purpose to connect yourself to the
system unit as you install/deinstall the board.
●
Place all components on a static-safe base.
I
You will find a detailed description for handling ESD components in the
relevant European or international standards (EN 61340-5-1,
ANSI/ESD S20.20).
D2529 (TX300 S4)
Technical Manual
9
CE Certificate
Important notes
Notes about boards
●
●
●
During installation/deinstallation of the system board, observe the specific
instructions described in the service manual for the server.
Remove the plug from the mains outlet so that system and system board are
totally disconnected from the mains voltage.
To prevent damage to the system board, the components and conductors on
it, please take great care when you insert or remove boards. Take great care
to ensure that extension boards are slotted in straight, without damaging
components or conductors on the system board, or any other components,
for example EMI spring contacts.
●
●
Be careful with the locking mechanisms (catches, centring pins etc.) when
you replace the system board or components on it, for example memory
modules or processors.
Never use sharp objects (screwdrivers) for leverage.
2.2
CE Certificate
The shipped version of this board complies with the requirements
of the EEC directive 89/336/EEC "Electromagnetic compatibility".
Compliance was tested in a typical PRIMERGY configuration.
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D2529 (TX300 S4)
Important notes
Environmental Protection
2.3
Environmental Protection
Environmentally friendly product design and development
This product has been designed in accordance with standards for ”environmen-
tally friendly product design and development“. This means that the designers
have taken into account important criteria such as durability, selection of
materials and coding, emissions, packaging, the ease with which the product
can be dismantled and the extent to which it can be recycled.
This saves resources and thus reduces the harm done to the environment.
Notes on saving energy
Devices that do not have to be on permanently should not be switched on until
they need to be used and should be switched off during long breaks and on
completion of work.
Notes on packaging
Please do not throw away the packaging. We recommend that you do not throw
away the original packaging in case you need it later for transporting.
Notes on dealing with consumables
Please dispose batteries in accordance with local government regulations.
Do not throw batteries and accumulators into the household waste. They must
be disposed of in accordance with local regulations concerning special waste.
All batteries containing pollutants are marked with a symbol (a crossed-out
rubbish bin on wheels). In addition, the marking is provided with the chemical
symbol of the heavy metal decisive for the classification as a pollutant:
Cd Cadmium
Hg Mercury
Pb Lead
Notes on labeling plastic housing parts
Please avoid attaching your own labels to plastic housing parts wherever
possible, since this makes it difficult to recycle them.
D2529 (TX300 S4)
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11
Environmental Protection
Important notes
Returning, recycling and disposal
The device may not be disposed of with household rubbish. This
appliance is labelled in accordance with European Directive
2002/96/EC concerning used electrical and electronic appliances
(waste electrical and electronic equipment - WEEE).
The guideline determines the framework for the return and
recycling of used appliances as applicable throughout the EU. To
return your used device, please use the return and collection
systems available to you. You will find further information on this at
For details on returning and reuse of devices and consumables within Europe,
refer to the “Returning used devices” manual, or contact your Fujitsu Siemens
Computers branch office/subsidiary or our recycling centre in Paderborn:
Fujitsu Siemens Computers
Recycling Center
D-33106 Paderborn
Tel. +49 5251 8 18010
Fax +49 5251 8 18015
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3
Features
3.1
Overview
Processors
–
–
–
1 or 2 dual or quad core Intel® Xeon™ processors
2 processor sockets LGA771 for dual core Intel® Xeon™ processors
1x6, 2x6, 2x4 or 4 MB Second-Level-Cache (on-die unified, 64 byte cache-
line size)
–
–
–
32 KB L1 Cache (on-die, data per core)
32 KB L1 Cache (on-die, instruction per core)
2 x 266 MHz or 333 MHz data bus (equals FSB 1066 or 1333: quadruple
data rate (or quad pumping) delivers 4 bits of data per clock cycle)
2 VRM 11.0 onboard (EVRD)
–
Main memory
–
–
2 sots for memory riser cards with 8 PCI slots each
FBD PC2-4200F or FDB PC2-5300F Fully Buffered DIMM memory modules
with 512 MB, 1 Gbyte, 2 Gbyte and 4 Gbyte
Maximum 64 Gbyte
–
–
–
–
–
–
–
–
–
Minimum 1 Gbyte
Maximum 4x8 Gbyte/s bandwidth
Supports 4 FBD memory channels
ECC multiple bit error detection and single bit error correction
Memory scrubbing function
Single Device Data Correction (SDDC) function (Chipkill™)
Mirroring
Sparing
Chips on the system board
–
–
–
–
Intel® Blackford chip set (Intel 5000P chipset)
Single-channel Gigabit LAN controller (Broadcom 5708C)
Super I/O controller (SMSC 47M107)
Flash EPROM for:
–
local BIOS; flashable via bootable USB device, LAN or optional floppy
disk
–
–
SMSC8700 Fast Ethernet RMII Phy
iRMC S2 with integrated VGA graphic controller
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Overview
Features
–
ADM7462 thermal system management controller
Internal connectors
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
1 floppy disk connector (26 pin)
1 USB connector
3 Serial ATA
Power connector 24 pin (12V, -12V, 5V, 3.3V and 5V auxiliary)
Dual 12V power connector
Single 12V power connector
PC98 connector
Front panel
dual USB type C (for USB 2.0 port on front side)
2 USB for streamer
4 fan direct connectors
1 connector for 2 CPU fans
Intrusion connector
2 slots for memory riser cards
1 SMB connector
1 HD LED activity connector
External connectors
–
–
–
–
–
–
–
2 serial ports (COM1, COM2)
1 parallel port (optional)
2 PS/2 interfaces for keyboard and mouse
2 UHCI USB 2.0 ports with 480 Mbits/s (rear side) combined with
1 RJ45 LAN connector (dedicated service LAN)
1 VGA port
1 dual RJ45 LAN connector
PCI slots
–
–
–
1 PCI-X 1.0b (64 Bit / 133 MHz)
2 PCI-Express 1.0a (2 Gbyte/s bandwidth)
4 PCI-Express 1.0a, alternatively configurable as 4x2 Gbyte/s or
2x4 Gbyte/s bandwidth
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D2529 (TX300 S4)
Features
Overview
BIOS features
–
–
–
–
–
–
–
–
Phoenix System-BIOS V 4.06
SMBIOS 2.4 (DMI)
MultiProcessor Specification 1.4
Server Hardware Design Guide
WfM
ACPI support
USB keyboard/mouse
boot possible from:
–
–
–
–
floppy disk drive (USB, Standard)
hard disk (SATA, SAS)
CD/DVD (SATA)
LAN (PXE, iSCSI)
–
–
–
–
console redirection support
OEM logo
CPU, memory disable
spare memory support
Environmental protection
3V-Battery in holder for recycling
Form factor
–
–
290 x 460 mm
ACPI 2.0, OnNow, PCI-X 1.0b, PCI-Express 1.0a, LPC 1.1, WfM 2.0,
SHDG 3.0, MPS 1.4, IPMI 2.0 and PCI Express Card
Electromechanical Specification Rev. 1.0, USB2.0, SATAII 1.0
CSS (Customer Self Service)
This system board supports the CSS functionality. You will find a description of
CSS functionality in the operating manual of your server.
TPM (option)
The system board is optional equipped with a TPM (Trusted Platform Module)
by the manufacturer. This module enables programs from third party manufac-
turers to store key information (e.g. drive encryption using Windows Bitlocker
Drive Encryption).
D2529 (TX300 S4)
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15
Overview
Features
The TPM is activated via the BIOS system (for more information, refer to the
Fujitsu Siemens Computers BIOS manual).
V
CAUTION!
–
When using the TPM, note the program descriptions provided by the
third party manufacturers.
–
You must also create a backup of the TPM content. To do this, follow
the third party manufacturer's instructions. Without this backup, if the
TPM or the system board is faulty you will not be able to access your
data.
–
If a failure occurs, please inform your service about the TPM
activation before it takes any action, and be prepared to provide them
with your backup copies of the TPM content.
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D2529 (TX300 S4)
Features
Main memory
3.2
Main memory
The system board supports up to 64 Gbyte main memory. Two slots for riser
cards with 8 FBD slots each are available . Each memory bank can be
populated with two 512 Mbyte, 1 Gbyte, 2 Gbyte or 4 Gbyte FBD PC2-4200F or
FDB PC2-5300F fully buffered DIMM memory modules.
ECC with memory scrubbing and with the Single Device Data Correction
(SDDC) function is supported.
I
You will find the descriptions how to install memory modules in the
Options Guide of your server.
Slots for riser cards
DIMM C/D (branch 1)
DIMM A/B (branch 0)
Figure 2: Slots for the riser cards
If only one riser card is occupied slot DIMM A/B will be populated.
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Main memory
Features
Module population
DIMM 4D
DIMM 4C
DIMM 3D
DIMM 3C
DIMM 2D
DIMM 2C
DIMM 1D
DIMM 4B
DIMM 4A
DIMM 3B
DIMM 3A
DIMM 2B
DIMM 2A
DIMM 1B
DIMM 1A
DIMM 1C
DIMM C/D
DIMM A/B
Figure 3: Layout of the memory modules
–
The memory banks have to be populated sequentially top down in pairs of
FBD PC2-4200F oder FBD PC2-5300 Fully Buffered DIMM memory
modules.
–
Each pair consists of identical memory modules.
There are three modes of operation for the main memory:
–
–
–
Non-mirrored mode
Mirrored mode
Sparing mode
Depending on the mode of operation there are different population requiren-
ments.
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D2529 (TX300 S4)
Features
Main memory
Non-mirrored mode
Using one riser card the module population is as follows:
1A + 1B (minimum configuration) - 2A + 2B - 3A + 3B - 4A + 4B
Using two riser cards the population can be alternating (higher performance) or
consecutive.
Riser card A/B
Riser card C/D
Alternating
population
1A + 1B
(minimum configuration)
- -
Upgrade 1
- -
1C + 1D
- -
Upgrade 2
2A + 2B
- -
Upgrade 3
2C +2D
- -
Upgrade 4
3A + 3B
- -
Upgrade 5
3C + 3D
Upgrade 6
4A + 4B
Upgrade 7
4C + 4D
- -
Consecutive population
1A + 1B
(minimum configuration)
Upgrade 2 - 4
Upgrade 5 - 8
2A + 2B
3A + 3B
4A + 4B
- -
- -
1C + 1D
2C + 2D
3C + 3D
4C + 4D
Table 2: Alternating and consecutive population for 2 riser cards
Mirrored mode
The mirrored mode requires memory modules in matched sets of four, two in
each riser card.
1A + 1B, 1C + 1D (minimum configuration)
2A + 2B, 2C + 2D (upgrade 1); 3A + 3B, 3C + 3D (upgrade 2); 4A + 4B, 4C + 4D
(upgrade 3)
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PCI(e) slots
Features
Sparing mode
Only one riser card is required for the sparing mode. The last populated bank
will be in hotspare mode.
1A + 1B, 2A +2B
minimum configuration, bank 2 in hotspare mode
1A + 1B, 2A +2B, 3A +3B
upgrade 1, bank 3 in hotspare mode
1A + 1B, 2A +2B, 3A +3B, 4A + 4B
upgrade 2, bank 4 in hotspare mode
3.3
PCI(e) slots
Slot 7 PCI Express
Slot 6 PCI Express
Slot 5 PCI Express
7
6
5
4
3
2
1
Slot 4 PCI X
Slot 3 PCI Express
Slot 2 PCI Express
Slot 1 PCI Express
Figure 4: Mechanical PCI slots (the PCI slot numbers on the rear)
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D2529 (TX300 S4)
Features
PCI(e) slots
PCI slots
The following table shows an overview of the PCI slots:
PCI slot
Bit
Frequency Description
in MHz
1
2
3
4
5
6
7
PCI e x4 slot
PCI e x4 slot
PCI e x4/x8 slot
64 Bit 133
64-Bit PCI-X slot
PCI e x4 slot
PCI e x4/x8 slot
PCI e x4 slot
Slot 3 and slot 6 are automatically used as x8 slots, if slot 2 respectivly slot 5
are not occupied.
PCI, PCI-X, PCI Express interrupts
Each device connected to a PCI bus or PCI Express can use up to four interrupt
signals depending on the functionality.
PCI and PCI-X buses use four lines named INTA to INTD, typically connected
to all devices on the bus in order to periodically balance interrupt load. An
interrupt signal may thereby be used simultaneously by multiple devices
(interrupt sharing).
PCI Express devices send their interrupts through messages. The interrupts are
defined by the system design.
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21
PCI(e) slots
Features
The following interrupt signals are used in the system:
Slot/device
VGA
Property
iRMC Grafik
BCM5708
BCM5708
PCI e x4
PCIe x8
Interruptsignal
Int A
LAN 1
Int B
LAN 2
Int C
Steckplatz 7
Steckplatz 6
Steckplatz 5
Steckplatz 4
Steckplatz 3
Steckplatz 2
Steckplatz 1
Int A, B, C, D
Int A, B, C, D
Int A, B, C, D
PCIe x4
PCI (133 MHz) Int A, B, C, D
PCIe x8
PCIe x4
PCIe x4
Int A, B, C, D
Int B, C, D, A
Int A, B, C, D
Assignment of the PCI interrupts
If you select Auto in the BIOS setup, the interrupts are assigned automatically
and no further settings are required.
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D2529 (TX300 S4)
Features
Screen resolution
3.4
Screen resolution
Depending on the operating system used the screen resolutions in the following
table refer to the graphic controller on the system board. The graphic controller
is integrated in the iRMC (integrated Remote Management Controller).
Screen resolution
640 x 480 Hz
Max. color depth
32 Bit
Max. frequency
85 Hz
800 x 600 Hz
32 Bit
85 Hz
1024 x 768 Hz
1152 x 864 Hz
1280 x 1024 Hz
1600 x 1200 Hz
32 Bit
75 Hz
24 Bit
60 Hz
24 Bit
60 Hz
16 Bit
60 Hz
If you are using an external graphic controller, you will find details of supported
screen resolutions in the operating manual or technical manual supplied with
the graphic controller.
3.5
Temperature / system monitoring
Temperature and system monitoring aim to reliably protect the computer
hardware against damage and to provide any information about the system
status.
Temperature and system monitoring is managed via an onboard controller.
The following functions are supported:
Temperature monitoring
Measurement of the processor and the system board internal temperature by a
temperature sensor, measurement of the ambient temperature by a I2C temper-
ature sensor.
Fan speed monitoring
The CPU, power supply unit and system fans are monitored. Fans that are no
longer available, blocked or sticky fans are detected.
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Temperature / system monitoring
Features
Fan speed control
The fan speed is controlled according to temperature.
The criteria are the ambient temperature, the CPU temperature, and the
memory temperature.
Sensor monitoring
If the I2C temperature sensor is defect or missing, all fans monitored by this
sensor, run with maximum speed to achieve the greatest possible protection of
the hardware.
Voltage monitoring (of the internal voltages)
If one of the internal voltages reaches its upper or lower threshold an alarm is
generated.
Cover monitoring
Unauthorized opening of the cover is detected, even when the system is
switched off (power down mode). However, this will only be indicated when the
system is switched on again.
System Event Log (SEL)
All monitored events of the system board are signalized via the Global Error
LED and recorded in the System Event Log. They could be retrieved in the BIOS
Setup or via ServerView.
PRIMERGY Diagnostic LEDs
LEDs on the system board enable to identify defective modules and compo-
nents as well as gaining information on the PDA.
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D2529 (TX300 S4)
LEDs
Features
DIMM 4D
DIMM 4C
DIMM 3D
DIMM 3C
DIMM 2D
DIMM 2C
DIMM 1D
DIMM 4B
DIMM 4A
DIMM 3B
DIMM 3A
DIMM 2B
DIMM 2A
DIMM 1B
DIMM 1A
DIMM 1C
L
Figure 6: LEDs on the riser card
LED s A, B and C are visible from outside on the rear of the server. All the other
LEDs are only visible, if the cover of the server has been opened.
If the server has been powered off (power-plugs must be disconnected) it is
possible to indicate the faulty component by pressing the indicate CSS button.
The LEDs have the following meaning:
LED
Anzeige
Bedeutung
A - CSS
yellow
indicates a prefailure
(Customer Self
Service)
yellow flashing indicates a failure
B - GEL
(Global Error
LED)
orange
indicates a prefailure
orange
flashing
indicates a failure. Reasons for a failure
may be:
- overheating of one of the sensors
- sensor defect
- fan defect
- CPU error
- voltage incorrect
- Software detected an error
C - Identification blue
server is identified via ServerView
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D2529 (TX300 S4)
Features
LEDs
LED
Anzeige
off
Bedeutung
D - PCI card
PCI card ok
orange
orange
off
PCUI card failure
CPU error (Local Diagnostic LED)
CPU ok
E - CPU
F - Fan
green
orange
fan ok
fan error (Local Diagnostic LED)
G- iRMC
green flashing iRMC - Server Management Controller ok
off
H - Board Error red
iRMC not active
configuration error. The system board will
be held in reset.
Possible configuration errors are e.g.: old
CPU populated, CPUs with different FSB
requirements populated, CPU1 not
populated.
I - Main Power
K - Aux Power
green
system running
yellow
off
auxiliary power ok
auxiliary power not available
memory module ok
error in memorymodule
siehe page 31
L - Memoryr
off
orange
M - LAN-Trans- yellow
ferrate
N -LAN-
green/
siehe page 31
Link/Aktivität
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Features
Interfaces and connectors
1
2
3
4
5
6
7
8
9
= PCI slots
= external ports
12 = SATA4
13 = SATA2
= slots for main memory modules 14 = CPU 1/2 fan
= Power supply PWR2
= Power supply PWR3
= PC98
15 = Intrusion
16 = USB 2 AUX
17 = USB 1 AUX
= Power supply PWR1
= Front panel
18 = CSS push-button
19 = USB intern
= USB front
21 = HD LED
10 = Floppy disk drive
11 = SATA1
22 = LPC bus (for assembly only)
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Interfaces and connectors
Features
3.7.1 External ports
1
3
4
2
12 11
10 9
8
7 6
5
Figure 8: External ports of the system board D2529
1 = Printer port (optional)
2 = PS/2 mouse connector
3 = LAN connector (service LAN)
4 = LAN connector 2
7
8
9
= USB port 4
= VGA port
= Serial interface COM1
10 = Serial interface COM2
11 = PS/2 keyboard connector
12 = CSS LED (yellow)/
5 = LAN connector 1
6 = USB port 3
Global Error LED (orange)/
Identifications LED (blue)
The serial interface COM1 can be used as default interface or to communicate
with the iRMC.
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D2529 (TX300 S4)
Features
Interfaces and connectors
LAN connectors
The system board is populated with three LAN controllers.
–
2 Gigabit LAN controllers (BCM5708) for system LAN 1 and system LAN 2
System LAN 1 and system LAN 2 support:
–
–
–
transfer rates of 10 Mbit/s, 100 Mbit/s and 1 Gbit/s
WOL function through Magic Packet™
Intel PXE. It is possible to boot tehe system without its own boot hard disk
via LAN.
In addition system LAN 1 can be used as shared service LAN.
1 dedicated service LAN controller
–
–
–
–
supports the transfer rates of 10 Mbit/s and 100 Mbit/s
serves as management interface
is prepared for RemoteView
The LAN connectors are equipped each with two LEDs (light emitting diode)
indicating the transfer rate and the activity.
LED 2
LED 1
Figure 9: LAN connector single-channel Gigabit LAN controller
LAN 1 LANtransfer green + off
transfer rate 10 Mbit/s
rate
yellow
green
yellow
green
on
on
on
off
transfer rate 100 Mbit/s
transfer rate 1000 Mbit/s
LAN connection
LAN 2 LAN
link/activity
no LAN connection
flashing LAN transfer
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Settings with DIP switches
Features
LED 2
LED 1
Figure 10: LAN connector service LAN controller
LAN 1 LAN transfer green
off
on
on
off
transfer rate 10 Mbit/s
transfer rate 100 Mbit/s
LAN connection
rate
green
LAN 2 LAN
link/activity
green
no LAN connection
flashing LAN transfer
3.8
Settings with DIP switches
Figure 11: DIP switch
I
Preset for switches 1 to 4 = Off.
Recovering System BIOS (recovery switch) - switch 1
Switch 1 enables recovery of the old system BIOS after an attempt to update
has failed. To restore the old system BIOS you need a Flash BIOS medium
(please call our customer service centre).
on
off
The system boots from the Flash BIOS medium (floppy disk, DVD/CD-
ROM, USB sstick) and reprograms the system BIOS on the board.
The System BIOS is started with the system BIOS from the system board
(default setting).
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Features
Settings with DIP switches
Skipping the password query - switch 2
Switch 2 is used to define whether the password is queried at system startup, if
the password protection is enabled in BIOS Setup (in Security menu, the
Password field must be set to Enabled).
on
off
The password query is skipped. Passwords are deleted.
The password query is effective (default setting).
Write protection for Flash BIOS - switch 3
Switch 3 is used to define whether the System BIOS is write protected or not.
on
off
The System BIOS can neither be written to nor deleted. Flash-BIOS
update from floppy disk is not possible.
The System BIOS can be written or deleted. Flash-BIOS update from
floppy disk is possible (default setting)
Write protection for floppy disks - switch 4
Switch 4 is used to define whether floppy disks can be written or deleted in the
floppy disk drive. To write and delete floppy disks, the write-protection in BIOS
Setup must be disabled (in menu Security, the field Diskette Write must be set to
Enabled).
on
off
The floppy disk drive is write-protected.
Floppy disks can be read, written and deleted (default setting).
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Settings with DIP switches
Features
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4
Replacing the lithium battery
In order to save the system information permanently, a lithium battery is
installed to provide the CMOS-memory with a current. When the charge is too
low or the battery is empty, a corresponding error message is provided. The
lithium battery must then be replaced.
V
CAUTION!
The lithium battery must be replaced with an identical battery or a battery
type recommended by the manufacturer (CR2450).
Do not throw lithium batteries into the trash can. It must be disposed of
in accordance with local regulations concerning special waste.
Make sure that you insert the battery the right way round. The plus pole
must be on the top!
4
2
3
1
Figure 12: Replacing the lithium battery
Ê
Press the locking spring into direction of the arrow (1), so that the lithium
battery jumps out of its socket.
Ê
Ê
Remove the battery (2).
Insert a new lithium battery of the same type into the socket (3) and (4).
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Abbreviations
The technical terms and abbreviations given below represent only a selection of
the full list of common technical terms and abbreviations.
Not all technical terms and abbreviations listed here are valid for the described
system board.
ACPI
Advanced Configuration and Power Interface
ASR&R
Automatic Server Recovery and Restart
ATA
Advanced Technology Attachment
BBU
Battery Backup Unit
BIOS
Basic Input Output System
BMC
Baseboard Management Controller
CMOS
Complementary Metal Oxide Semiconductor
COM
COMmunication port
CPU
Central Processing Unit
DDR
Double Data Rate
DIMM
Dual In-line Memory Module
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Abbreviations
DIP
Dual In-line Package
DMI
Desktop Management Interface
Dynamic Random Access Memory
Error Correction Code
DRAM
ECC
EEPROM
Electrical Erasable Programmable Read Only Memory
EPROM
Erasable Programmable Read Only Memory
EMRL
EVRD
FBD
HPC
ICE
Embedded RAID Logic
Enterprise VRD
Fully Buffered DIMM
Hot-plug Controller
In Circuit Emulation
IDE
Integrated (intelligent) Drive Electronics
Integrated Mirror Enhanced
Intelligent Organization Of PCI
IME
IOOP
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D2529 (TX300 S4)
Abbreviations
IPMB
IPMI
iRMC
iSCSI
LAN
LED
LPC
MPS
MTS
NMI
Intelligent Platform Management Bus
Intelligent Platform Management Interface
integrated Remote Management Controller
internet Small Computer System Interface
Local Area Network
Light Emitting Diode
Low Pin Count
Multi Processor Specification
MegaTransfers per Second
Non Maskable Interrupt
OEM
OHCI
OS
Original Equipment Manufacturer
Open Host Controller Interface
Operating System
PCI
Peripheral Components Interconnect
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Abbreviations
PDA
Prefailure Detection and Analyzing
PIO
Programmed Input Output
Programmable Logic Device
Power Supply (Unit)
PLD
PS(U)
PWM
PXE
Puls Wide Modulation
Preboot eXecution Environment
Redundant Array of Inexpensive Disks
Remote Service Board
ReSeT
RAID
RSB
RST
RTC
Real Time Clock
SAS
SATA
SCSI
SDDC
Serial Attached SCSI
Serial ATA
Small Computer Systems Interface
Single Device Data Correction
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D2529 (TX300 S4)
Abbreviations
SDRAM
Synchronous Dynamic Random Access Memory
SHDG
SMB
SMM
SMP
TMP
UHCI
USB
VGA
VRD
VRM
WfM
WOL
Server Hardware Design Guide
System Management Bus
Server Management Mode
Symmetrically Multi Processing
Trusted Platform Module
Unified Host Controller Interface
Universal Serial Bus
Video Graphics Adapter
Voltage Regulator Down
Voltage Regulator Module
Wired for Management
Wake up On LAN
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