Cypress FLEx36 CYD02S36VA User Manual

CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
FLEx36™ 3.3V 32K/64K/128K/256K/512 x 36  
Synchronous Dual-Port RAM  
Features  
Functional Description  
True dual-ported memory cells that enable simultaneous  
access of the same memory location  
The FLEx36™ family includes 1-Mbit, 2-Mbit, 4-Mbit, 9-Mbit, and  
18-Mbit pipelined, synchronous, true dual-port static RAMs that  
are high speed, low power 3.3V CMOS. Two ports are provided,  
permitting independent, simultaneous access to any location in  
memory. A particular port can write to a certain location while  
another port is reading that location. The result of writing to the  
same location by more than one port at the same time is  
undefined. Registers on control, address, and data lines allow for  
minimal setup and hold time.  
Synchronous pipelined operation  
Family of 1-Mbit, 2-Mbit, 4-Mbit, 9-Mbit and 18-Mbit devices  
Pipelined output mode allows fast operation  
0.18 micron CMOS for optimum speed and power  
High speed clock to data access  
During a Read operation, data is registered for decreased cycle  
time. Each port contains a burst counter on the input address  
register. After externally loading the counter with the initial  
address, the counter increments the address internally (more  
details to follow). The internal Write pulse width is independent  
of the duration of the R/W input signal. The internal Write pulse  
is self-timed to allow the shortest possible cycle times.  
3.3V low power  
Active as low as 225 mA (typ.)  
Standby as low as 55 mA (typ.)  
Mailbox function for message passing  
Global master reset  
A HIGH on CE0 or LOW on CE1 for one clock cycle powers down  
the internal circuitry to reduce the static power consumption. One  
cycle with chip enables asserted is required to reactivate the  
outputs.  
Separate byte enables on both ports  
Commercial and industrial temperature ranges  
IEEE 1149.1-compatible JTAG boundary scan  
256 Ball FBGA (1-mm pitch)  
Additional features include: readback of burst-counter internal  
address value on address lines, counter-mask registers to  
control the counter wrap-around, counter interrupt (CNTINT)  
flags, readback of mask register value on address lines,  
retransmit functionality, interrupt flags for message passing,  
JTAG for boundary scan, and asynchronous Master Reset  
(MRST).  
Counter wrap around control  
Internal mask register controls counter wrap-around  
Counter-interrupt flags to indicate wrap-around  
Memory block retransmit operation  
The CYD18S36V devices in this family has limited features.  
Please see Address Counter and Mask Register Operations  
on page 5 for details.  
Counter readback on address lines  
Mask register readback on address lines  
Dual Chip Enables on both ports for easy depth expansion  
Seamless migration to next-generation dual-port family  
Seamless Migration to Next-Generation Dual-Port  
Family  
Cypress offers a migration path for all devices in this family to the  
next-generation devices in the Dual-Port family with a compatible  
footprint. Please contact Cypress Sales for more details.  
Table 1. Product Selection Guide  
1 Mbit  
2 Mbit  
4 Mbit  
9 Mbit  
18 Mbit  
Density  
(32K x 36)  
CYD01S36V  
167  
(64K x 36)  
(128K x 36)  
(256K x 36)  
(512K x 36)  
Part Number  
CYD02S36V/36VA  
CYD04S36V  
CYD09S36V  
CYD18S36V  
Max. Speed (MHz)  
167  
4.4  
167  
4.0  
167  
4.0  
133  
5.0  
Max. Access Time – Clock to Data  
(ns)  
4.0  
Typical Operating Current (mA)  
Package  
225  
225  
225  
270  
315  
256 FBGA  
256 FBGA  
256 FBGA  
256 FBGA  
256 FBGA  
(17 mm x 17 mm) (17 mm x 17 mm) (17 mm x 17 mm) (17 mm x 17 mm) (23 mm x 23 mm)  
Cypress Semiconductor Corporation  
Document Number: 38-06076 Rev. *G  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised Decenber 09, 2008  
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Pin Configurations  
Figure 1. Pin Diagram - 256-Ball FBGA (Top View)  
CYD01S36V/CYD02S36V/36VA/CYD04S36V/CYD09S36V/CYD18S36V  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
DQ32L DQ30L DQ28L DQ26L DQ24L DQ22L DQ20L DQ18L DQ18R DQ20R DQ22R DQ24R DQ26R DQ28R DQ30R DQ32R  
DQ33L DQ31L DQ29L DQ27L DQ25L DQ23L DQ21L DQ19L DQ19R DQ21R DQ23R DQ25R DQ27R DQ29R DQ31R DQ33R  
A
B
C
D
E
F
RETL  
[2,3]  
N C  
N C  
REVL  
[2,4]  
TRST  
[2,5]  
NC  
N C  
N C  
RETR  
[2,3]  
DQ34L DQ35L  
INTL  
MRST  
VTTL  
INTR  
DQ35R DQ34R  
[2,5]  
[2,5]  
[2,5]  
[2,5]  
LOWSP  
DL [2,4]  
LOWSP  
WRPL VREFL FTSELL  
[2,3]  
FTSEL VREFL WRPR  
A0L  
A2L  
A1L  
A3L  
VSS  
VTTL  
VSS  
A1R  
A3R  
A5R  
A7R  
A9R  
A11R  
A13R  
A0R  
A2R  
[2,4]  
[2,3]  
R
[2,3]  
[2,3]  
CE0L  
[11]  
CE1L  
[10]  
VDDIO VDDIO VDDIO CE1R  
R
CE0R  
VDDIOL VDDIOL VDDIOL VCORE VCORE  
R
R
[10]  
CNTINT  
L [12]  
CNTINT  
VDDIO  
R
A4L  
A5L  
BE3L VDDIOL  
REV  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
BE3R  
A4R  
BUSYR  
[2,5]  
BUSYL  
[2,5]  
VDDIO  
R
L
A6L  
A7L  
BE2L  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
VSS  
BE2R  
A6R  
G
H
J
[2,3]  
A8L  
A9L  
CL  
VTTL VCORE  
VCORE VTTL  
CR  
A8R  
PORTS  
PORTS  
A10L  
A12L  
A14L  
A11L  
A13L  
VSS  
OEL  
TD1L[2, VCORE  
VSS  
OER  
A10R  
A12R  
A14R  
VDDIO  
BE1R  
R
BE1L VDDIOL  
K
L
A15L  
[6]  
ADSL  
[11]  
VDDIO  
BE0R  
R
ADSR  
A15R  
[6]  
BE0L VDDIOL  
REVL  
A16L  
[7]  
A17L  
[8]  
VDDIO VDDIO VDDIO REVR  
A17R  
[8]  
A16R  
R/WL  
VDDIOL VDDIOL VDDIOL VCORE VCORE  
R/WR  
M
[2,4]  
R
R
R
CNT/M  
SKR  
PortST  
D0L  
[2,4]  
PortST  
D0R  
[2,4]  
CNT/M  
READY  
L [2,5]  
READY  
A18L  
[9]  
A19L  
[2,5]  
VREFL  
[2,4]  
REV  
REV  
VREFR  
A19R  
A18R  
L
R
VTTL  
VTTL  
N
[2,3]  
[2,3]  
CNTEN CNTRS  
CNTRS CNTEN  
N C  
N C  
N C  
N C  
DQ16L DQ17L  
TCK  
TMS  
DQ1L  
DQ0L  
TDO  
DQ1R  
DQ0R  
TDI  
DQ17R DQ16R  
P
R
T
[2,5]  
[2,5]  
[2,5]  
L [11]  
TL [10]  
DQ15L DQ13L DQ11L  
DQ9L  
DQ7L  
DQ6L  
DQ5L  
DQ4L  
DQ3L  
DQ2L  
DQ3R  
DQ2R  
DQ5R  
DQ4R  
DQ7R  
DQ6R  
DQ9R DQ11R DQ13R DQ15R  
DQ8R DQ10R DQ12R DQ14R  
DQ14L DQ12L DQ10L DQ8L  
Notes  
2. This ball represents a next generation Dual-Port feature. For more information about this feature, contact Cypress Sales.  
3. Connect this ball to VDDIO. For more information about this next generation Dual-Port feature contact Cypress Sales.  
4. Connect this ball to VSS. For more information about this next generation Dual-Port feature, contact Cypress Sales.  
5. Leave this ball unconnected. For more information about this feature, contact Cypress Sales.  
6. Leave this ball unconnected for 32K x 36configuration.  
7. Leave this ball unconnected for a 64K x 36, 32K x 36 configurations.  
8. Leave this ball unconnected for a 128K x 36, 64K x 36 and 32K x 36 configurations.  
9. Leave this ball unconnected for a 256K x 36, 128K x 36, 64K x 36, and 32K x 36 configurations.  
10. These balls are not applicable for CYD18S36V device. They need to be tied to VDDIO.  
11. These balls are not applicable for CYD18S36V device. They need to be tied to VSS.  
12. These balls are not applicable for CYD18S36V device. They need to be no connected.  
Document Number: 38-06076 Rev. *G  
Page 3 of 28  
                     
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Pin Definitions  
Left Port  
Right Port  
–A  
Description  
A
–A  
A
Address Inputs.  
0L  
18L  
0R  
18R  
BE –BE  
BE –BE  
Byte Enable Inputs. Asserting these signals enables Read and Write operations to the  
corresponding bytes of the memory array.  
0L  
3L  
0R  
3R  
[2,5]  
BUSY  
BUSY  
Port Busy Output. When the collision is detected, a BUSY is asserted.  
Input Clock Signal.  
L
R
C
C
L
R
CE0  
CE0  
Active Low Chip Enable Input.  
L
R
CE1  
CE1  
Active High Chip Enable Input.  
L
R
DQ –DQ  
DQ –DQ  
35R  
Data Bus Input/Output.  
0L  
35L  
0R  
OE  
OE  
Output Enable Input. This asynchronous signal must be asserted LOW to enable the DQ  
data pins during Read operations.  
L
R
INT  
INT  
Mailbox Interrupt Flag Output. The mailbox permits communications between ports. The  
L
R
upper two memory locations can be used for message passing. INT is asserted LOW  
L
when the right port writes to the mailbox location of the left port, and vice versa. An interrupt  
to a port is deasserted HIGH when it reads the contents of its mailbox.  
[2,4]  
LowSPD  
LowSPD  
Port Low Speed Select Input.  
L
R
[2,4]  
PORTSTD[1:0]  
PORTSTD[1:0]  
Port Address/Control/Data IO Standard Select Inputs.  
L
R
R/W  
R/W  
Read/Write Enable Input. Assert this pin LOW to write to, or HIGH to Read from the dual  
port memory array.  
L
R
[2,5]  
[2,5]  
READY  
READY  
Port Ready Output. This signal is asserted when a port is ready for normal operation.  
Port Counter/Mask Select Input. Counter control input.  
Port Counter Address Load Strobe Input. Counter control input.  
Port Counter Enable Input. Counter control input.  
L
R
CNT/MSK  
CNT/MSK  
R
L
ADS  
ADS  
R
L
CNTEN  
CNTEN  
R
L
CNTRST  
CNTRST  
Port Counter Reset Input. Counter control input.  
L
R
CNTINT  
CNTINT  
Port Counter Interrupt Output. This pin is asserted LOW when the unmasked portion of  
L
R
the counter is incremented to all “1s”.  
[2,3]  
WRP  
WRP  
Port Counter Wrap Input. The burst counter wrap control input.  
L
R
[2,3]  
RET  
RET  
Port Counter Retransmit Input. Counter control input.  
L
R
[2,3]  
FTSEL  
FTSEL  
Flow-Through Select. Use this pin to select Flow-Through mode. When is de-asserted,  
L
R
the device is in pipelined mode.  
[2,4]  
VREF  
VREF  
Port External High-Speed IO Reference Input.  
Port IO Power Supply.  
L
R
V
V
DDIOL  
DDIOR  
[2, 3, 4]  
REV  
REV  
Reserved pins for future features.  
L
R
MRST  
Master Reset Input. MRST is an asynchronous input signal and affects both ports. A  
maser reset operation is required at power up.  
TRST  
JTAG Reset Input.  
TMS  
JTAG Test Mode Select Input. It controls the advance of JTAG TAP state machine. State  
machine transitions occur on the rising edge of TCK.  
TDI  
TCK  
TDO  
JTAG Test Data Input. Data on the TDI input is shifted serially into selected registers.  
JTAG Test Clock Input.  
JTAG Test Data Output. TDO transitions occur on the falling edge of TCK. TDO is  
normally three-stated except when captured data is shifted out of the JTAG TAP.  
V
Ground Inputs.  
SS  
CORE  
V
Core Power Supply.  
V
LVTTL Power Supply for JTAG IOs  
TTL  
Document Number: 38-06076 Rev. *G  
Page 4 of 28  
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Master Reset  
Address Counter and Mask Register  
Operations[19]  
The FLEx36 family devices undergo a complete reset by taking  
its MRST input LOW. The MRST input can switch asynchro-  
nously to the clocks. An MRST initializes the internal burst  
counters to zero, and the counter mask registers to all ones  
(completely unmasked). MRST also forces the Mailbox Interrupt  
(INT) flags and the Counter Interrupt (CNTINT) flags HIGH.  
MRST must be performed on the FLEx36 family devices after  
power up.  
This section describes the features only apply to 1Mbit, 2 Mbit,  
4 Mbit and 9 Mbit devices. It does not apply to 18Mbit device.  
Each port of these devices has a programmable burst address  
counter. The burst counter contains three registers: a counter  
register, a mask register, and a mirror register.  
The counter register contains the address used to access the  
RAM array. It is changed only by the Counter Load, Increment,  
Counter Reset, and by master reset (MRST) operations.  
Mailbox Interrupts  
The mask register value affects the Increment and Counter  
Reset operations by preventing the corresponding bits of the  
counter register from changing. It also affects the counter  
interrupt output (CNTINT). The mask register is changed only by  
the Mask Load and Mask Reset operations, and by the MRST.  
The mask register defines the counting range of the counter  
register. It divides the counter register into two regions: zero or  
more “0s” in the most significant bits define the masked region,  
one or more “1s” in the least significant bits define the unmasked  
region. Bit 0 may also be “0,” masking the least significant  
counter bit and causing the counter to increment by two instead  
of one.l  
The upper two memory locations may be used for message  
passing and permit communications between ports. Table 2  
shows the interrupt operation for both ports of CYD18S36V. The  
highest memory location, 7FFFF is the mailbox for the right port  
and 7FFFE is the mailbox for the left port. Table 2 shows that to  
set the INT flag, a Write operation by the left port to address  
R
7FFFF asserts INT LOW. At least one byte must be active for a  
R
Write to generate an interrupt. A valid Read of the 7FFFF  
location by the right port resets INT HIGH. At least one byte  
R
must be active in order for a Read to reset the interrupt. When  
one port Writes to the other port’s mailbox, the INT of the port  
that the mailbox belongs to is asserted LOW. The INT is reset  
when the owner (port) of the mailbox Reads the contents of the  
mailbox. The interrupt flag is set in a flow-thru mode (i.e., it  
follows the clock edge of the writing port). Also, the flag is reset  
in a flow-thru mode (i.e., it follows the clock edge of the reading  
port).  
The mirror register is used to reload the counter register on  
increment operations (see “retransmit,” below). It always  
contains the value last loaded into the counter register, and is  
changed only by the Counter Load, and Counter Reset opera-  
tions, and by the MRST.  
Table 3 on page 6 summarizes the operation of these registers  
and the required input control signals. The MRST control signal  
is asynchronous. All the other control signals in Table 3 on page  
6 (CNT/MSK, CNTRST, ADS, CNTEN) are synchronized to the  
port’s CLK. All these counter and mask operations are  
independent of the port’s chip enable inputs (CE0 and CE1).  
Each port can read the other port’s mailbox without resetting the  
interrupt. And each port can write to its own mailbox without  
setting the interrupt. If an application does not require message  
passing, INT pins must be left open.  
Table 2. Interrupt Operation Example  
Left Port  
Function  
Right Port  
R/W  
CE  
L
A
INT  
X
R/W  
CE  
X
A
INT  
L
L
L
0L–18L  
L
R
R
0R–18R  
R
Set Right INT Flag  
L
X
X
H
7FFFF  
X
X
H
L
X
R
Reset Right INT Flag  
X
X
L
7FFFF  
7FFFE  
X
H
R
Set Left INT Flag  
X
X
L
L
X
L
Reset Left INT Flag  
L
7FFFE  
H
X
X
X
L
Notes  
13. This family of Dual-Ports does not use V  
, and these pins are internally NC. The next generation Dual-Port family, the FLEx36-E™, uses V  
of 1.5V or 1.8V.  
CORE  
CORE  
Please contact local Cypress FAE for more information.  
14. CE is internal signal. CE = LOW if CE = LOW and CE = HIGH. For a single Read operation, CE only needs to be asserted once at the rising edge of the CLK and  
0
1
can be deasserted after that. Data is out after the following CLK edge and is three-stated after the next CLK edge.  
15. OE is “Don’t Care” for mailbox operation.  
16. At least one of BE0, BE1, BE2, or BE3 must be LOW.  
17. A17x is a NC for CYD04S36V, therefore the Interrupt Addresses are 1FFFF and 1FFFE. A17x and A16x are NC for CYD02S36V/36VA, therefore the Interrupt Addresses  
are FFFF and FFFE; A17x, A16x and A15x are NC for CYD01S36V, therefore the Interrupt Addresses are 7FFF and 7FFE.  
18. “X” = “Don’t Care,” “H” = HIGH, “L” = LOW.  
19. This section describes the CYD09S36V, CYD04S36V, CYD02S36V/36VA, and CYD01S36V which have 18, 17, 16 and 15 address bits.  
Document Number: 38-06076 Rev. *G  
Page 5 of 28  
               
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Counter enable (CNTEN) inputs are provided to stall the  
operation of the address input and use the internal address  
generated by the internal counter for fast, interleaved memory  
applications. A port’s burst counter is loaded when the port’s  
address strobe (ADS) and CNTEN signals are LOW. When the  
port’s CNTEN is asserted and the ADS is deasserted, the  
address counter increments on each LOW to HIGH transition of  
that port’s clock signal. This Read’s or Write’s one word from/into  
each successive address location until CNTEN is deasserted.  
The counter can address the entire memory array, and loops  
back to the start. Counter reset (CNTRST) is used to reset the  
unmasked portion of the burst counter to 0s. A counter-mask  
register is used to control the counter wrap.  
Counter Reset Operation  
All unmasked bits of the counter and mirror registers are reset to  
“0.” All masked bits remain unchanged. A Mask Reset followed  
by a Counter Reset resets the counter and mirror registers to  
00000, as does master reset (MRST).  
Counter Load Operation  
The address counter and mirror registers are both loaded with  
the address value presented at the address lines.  
Table 3. Address Counter and Counter-Mask Register Control Operation (Any Port)  
CLK MRST CNT/MSK  
CNTRST  
ADS  
CNTEN  
Operation  
Description  
X
L
X
X
X
X
Master Reset  
Reset address counter to all 0s and mask  
register to all 1s.  
H
H
H
H
L
X
L
X
L
Counter Reset  
Counter Load  
Reset counter unmasked portion to all 0s.  
H
Load counter with external address value  
presented on address lines.  
H
H
H
L
H
Counter Readback Read out counter internal value on address  
lines.  
H
H
H
H
H
H
H
H
L
Counter Increment Internally increment address counter value.  
H
Counter Hold  
Constantlyholdtheaddressvalueformultiple  
clock cycles.  
H
H
L
L
L
X
L
X
L
Mask Reset  
Mask Load  
Reset mask register to all 1s.  
H
Load mask register with value presented on  
the address lines.  
H
H
L
L
H
H
L
H
X
Mask Readback  
Reserved  
Read out mask register value on address  
lines.  
H
Operation undefined  
Note  
20. Counter operation and mask register operation is independent of chip enables.  
Document Number: 38-06076 Rev. *G  
Page 6 of 28  
   
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
after the next rising edge of the port’s clock. If address readback  
occurs while the port is enabled (CE0 LOW and CE1 HIGH), the  
data lines (DQs) are three-stated. Figure 2 on page 8 shows a  
block diagram of the operation.  
Counter Increment Operation  
Once the address counter register is initially loaded with an  
external address, the counter can internally increment the  
address value, potentially addressing the entire memory array.  
Only the unmasked bits of the counter register are incremented.  
The corresponding bit in the mask register must be a “1” for a  
counter bit to change. The counter register is incremented by 1  
if the least significant bit is unmasked, and by 2 if it is masked. If  
all unmasked bits are “1,” the next increment wraps the counter  
back to the initially loaded value. If an Increment results in all the  
unmasked bits of the counter being “1s,” a counter interrupt flag  
(CNTINT) is asserted. The next Increment returns the counter  
register to its initial value, which was stored in the mirror register.  
Retransmit  
Retransmit is a feature that allows the Read of a block of memory  
more than once without the need to reload the initial address.  
This eliminates the need for external logic to store and route  
data. It also reduces the complexity of the system design and  
saves board space. An internal “mirror register” is used to store  
the initially loaded address counter value. When the counter  
unmasked portion reaches its maximum value set by the mask  
register, it wraps back to the initial value stored in this “mirror  
register.” If the counter is continuously configured in increment  
mode, it increments again to its maximum value and wraps back  
to the value initially stored into the “mirror register.” Thus, the  
repeated access of the same data is allowed without the need  
for any external logic.  
The counter address can instead be forced to loop to 00000 by  
externally connecting CNTINT to CNTRST.  
An increment that  
results in one or more of the unmasked bits of the counter being  
“0” de-asserts the counter interrupt flag. The example in Figure  
3 on page 9 shows the counter mask register loaded with a mask  
value of 0003Fh unmasking the first 6 bits with bit “0” as the LSB  
and bit “16” as the MSB. The maximum value the mask register  
can be loaded with is 3FFFFh. Setting the mask register to this  
value allows the counter to access the entire memory space. The  
address counter is then loaded with an initial value of 8h. The  
base address bits (in this case, the 6th address through the 16th  
address) are loaded with an address value but do not increment  
once the counter is configured for increment operation. The  
counter address starts at address 8h. The counter increments its  
internal address value till it reaches the mask register value of  
3Fh. The counter wraps around the memory block to location 8h  
at the next count. CNTINT is issued when the counter reaches  
its maximum value.  
Mask Reset Operation  
The mask register is reset to all “1s,” which unmasks every bit of  
the counter. Master reset (MRST) also resets the mask register  
to all “1s.”  
Mask Load Operation  
The mask register is loaded with the address value presented at  
the address lines. Not all values permit correct increment opera-  
n
n
tions. Permitted values are of the form 2 – 1 or 2 – 2. From the  
most significant bit to the least significant bit, permitted values  
have zero or more “0s,” one or more “1s,” or one “0.” Thus  
7FFFF, 003FE, and 00001 are permitted values, but 7F0FF,  
003FC, and 00000 are not.  
Counter Hold Operation  
The value of all three registers can be constantly maintained  
unchanged for an unlimited number of clock cycles. Such  
operation is useful in applications where wait states are needed,  
or when address is available a few cycles ahead of data in a  
shared bus interface.  
Mask Readback Operation  
The internal value of the mask register can be read out on the  
address lines. Readback is pipelined; the address is valid t  
after the next rising edge of the port’s clock. If mask readback  
occurs while the port is enabled (CE0 LOW and CE1 HIGH), the  
data lines (DQs) are three-stated. Figure 2 on page 8 shows a  
block diagram of the operation.  
CM2  
Counter Interrupt  
The counter interrupt (CNTINT) is asserted LOW when an  
increment operation results in the unmasked portion of the  
counter register being all “1s.” It is deasserted HIGH when an  
Increment operation results in any other value. It is also  
de-asserted by Counter Reset, Counter Load, Mask Reset and  
Mask Load operations, and by MRST.  
Counting by Two  
When the least significant bit of the mask register is “0,” the  
counter increments by two. This may be used to connect the x36  
devices as a 72-bit single port SRAM in which the counter of one  
port counts even addresses and the counter of the other port  
counts odd addresses. This even-odd address scheme stores  
one half of the 72-bit data in even memory locations, and the  
other half in odd memory locations.  
Counter Readback Operation  
The internal value of the counter register can be read out on the  
address lines. Readback is pipelined; the address is valid t  
CA2  
Note  
21. CNTINT and CNTRST specs are guaranteed by design to operate properly at speed grade operating frequency when tied together.  
Document Number: 38-06076 Rev. *G  
Page 7 of 28  
 
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
[1]  
Figure 2. Counter, Mask, and Mirror Logic Block Diagram  
CNT/MSK  
CNTEN  
ADS  
Decode  
Logic  
CNTRST  
MRST  
Bidirectional  
Address  
Lines  
Mask  
Register  
Counter/  
Address  
Register  
Address  
Decode  
RAM  
Array  
CLK  
Load/Increment  
17  
17  
From  
Address  
Lines  
Mirror  
Counter  
To Readback  
and Address  
Decode  
1
0
1
0
From  
Increment  
Logic  
Mask  
Register  
17  
Wrap  
17  
17  
17  
Bit 0  
From  
Mask  
From  
Counter  
+1  
+2  
Wrap  
Detect  
Wrap  
To  
1
0
17  
1
0
Counter  
Document Number: 38-06076 Rev. *G  
Page 8 of 28  
 
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Figure 3. Programmable Counter-Mask Register Operation  
CNTINT  
Example:  
Load  
Counter-Mask  
Register = 3F  
H
0
0
0s  
0
1
1
1
1
1
1
16 15  
6
5
4
3
2
1
0
Mask  
2
2
2
2
2
2
2
2
2
Register  
bit-0  
Masked Address  
Unmasked Address  
Load  
Address  
Counter = 8  
H
L
X
X
Xs  
Xs  
Xs  
X
0
0
1
0
0
1
0
16 15  
6
6
5
5
4
3
2
2
1
0
2
2
2
2
2
2
2
2
2
2
2
Address  
Counter  
bit-0  
Max  
Address  
Register  
X
X
X
2
1
1
1
1
1
16 15  
4
3
1
0
2
2
2
2
2
2
Max + 1  
Address  
Register  
H
X
X
X
0
0
1
0
0
0
16 15  
6
5
4
3
2
1
0
2
2
2
2
2
2
2
2
2
IEEE 1149.1 Serial Boundary Scan (JTAG)[23]  
Boundary Scan Hierarchy for 9-Mbit and 18-Mbit  
Devices  
The FLEx36 family devices incorporate an IEEE 1149.1 serial  
boundary scan test access port (TAP). The TAP controller  
functions in a manner that does not conflict with the operation of  
other devices using 1149.1-compliant TAPs. The TAP operates  
using JEDEC-standard 3.3V IO logic levels. It is composed of  
three input connections and one output connection required by  
the test logic defined by the standard.  
Internally, the devices have multiple DIEs. Each DIE contains all  
the circuitry required to support boundary scan testing. The  
circuitry includes the TAP, TAP controller, instruction register,  
and data registers. The circuity and operation of the DIE  
boundary scan are described in detail below.  
The scan chain for 9-Mbit and 18-Mbit devices uses a hierar-  
chical approach as shown in Figure 4 on page 10 and Figure 5  
on page 10. TMS and TCK are connected in parallel to each DIE  
to drive all 2- or 4-TAP controllers in unison. In many cases, each  
DIE is supplied with the same instruction. In other cases, it might  
be useful to supply different instructions to each DIE. One  
example would be testing the device ID of one DIE while  
bypassing the rest.  
Performing a TAP Reset  
A reset is performed by forcing TMS HIGH (V ) for five rising  
DD  
edges of TCK. This reset does not affect the operation of the  
devices, and may be performed while the device is operating. An  
MRST must be performed on the devices after power up.  
Performing a Pause/Restart  
Each pin of the devices is typically connected to multiple DIEs.  
For connectivity testing with the EXTEST instruction, it is  
desirable to check the internal connections between DIEs and  
the external connections to the package. This can be accom-  
plished by merging the netlist of the devices with the netlist of the  
user’s circuit board. To facilitate boundary scan testing of the  
devices, Cypress provides the BSDL file for each DIE, the  
internal netlist of the device, and a description of the device scan  
chain. The user can use these materials to easily integrate the  
devices into the board’s boundary scan environment. Further  
information can be found in the Cypress application note Using  
JTAG Boundary Scan For System in a Package (SIP) Dual-Port  
SRAMs.  
When a SHIFT-DR PAUSE-DR SHIFT-DR is performed the scan  
chain outputs the next bit in the chain twice. For example, if the  
value expected from the chain is 1010101, the device outputs a  
11010101. This extra bit causes some testers to report an  
erroneous failure for the devices in a scan test. Therefore the  
tester must be configured to never enter the PAUSE-DR state.  
Notes  
22. The “X” in this diagram represents the counter upper bits.  
23. Boundary scan is IEEE 1149.1-compatible. See “Performing a Pause/Restart” for deviation from strict 1149.1 compliance.  
Document Number: 38-06076 Rev. *G  
Page 9 of 28  
     
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Figure 4. Scan Chain for 18-Mbit Device  
TDO  
TDO  
D4  
TDI  
TDO  
D2  
TDI  
TDO  
D3  
TDI  
TDO  
D1  
TDI  
TDI  
Figure 5. Scan Chain for 9-Mbit Device  
TDO  
TDO  
D2  
TDI  
TDO  
D1  
TDI  
TDI  
Table 4. Identification Register Definitions  
Instruction Field  
Revision Number (31:28)  
Cypress Device ID (27:12)  
Value  
Description  
0h  
Reserved for version number.  
C002h  
C001h  
C092h  
034h  
1
Defines Cypress part number for CYD04S36V, CYD09S36V and CYD18S36V  
Defines Cypress part number for CYD02S36V/36VA  
Defines Cypress part number for CYD01S36V  
Cypress JEDEC ID (11:1)  
ID Register Presence (0)  
Allows unique identification of the DP family device vendor.  
Indicates the presence of an ID register.  
Table 5. Scan Register Sizes  
Register Name  
Instruction  
Bit Size  
4
1
Bypass  
Identification  
Boundary Scan  
32  
n
Note  
24. See details in the device BSDL files.  
Document Number: 38-06076 Rev. *G  
Page 10 of 28  
     
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Table 6. Instruction Identification Codes  
Instruction Code  
EXTEST  
Description  
0000  
1111  
1011  
0111  
0100  
Captures the Input/Output ring contents. Places the BSR between the TDI and TDO.  
Places the BYR between TDI and TDO.  
BYPASS  
IDCODE  
HIGHZ  
Loads the IDR with the vendor ID code and places the register between TDI and TDO.  
Places BYR between TDI and TDO. Forces all device output drivers to a High-Z state.  
Controls boundary to 1/0. Places BYR between TDI and TDO.  
CLAMP  
SAMPLE/PRELOAD 1000  
Captures the input/output ring contents. Places BSR between TDI and TDO.  
Resets the non-boundary scan logic. Places BYR between TDI and TDO.  
NBSRST  
1100  
RESERVED  
All other codes Other combinations are reserved. Do not use other than the above.  
Document Number: 38-06076 Rev. *G  
Page 11 of 28  
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Output Current into Outputs (LOW)............................. 20 mA  
Static Discharge Voltage...........................................> 2000V  
(JEDEC JESD22-A114-2000B)  
Maximum Ratings  
Exceeding maximum ratings  
device. User guidelines are not tested.  
may shorten the useful life of the  
Latch-up Current.....................................................> 200 mA  
Operating Range  
Storage Temperature.................................. –65°C to +150°C  
Ambient Temperature with  
Power Applied ............................................ –55°C to +125°C  
Supply Voltage to Ground Potential................–0.5V to +4.6V  
DC Voltage Applied to  
Ambient  
V
CORE  
Range  
V
DDIO/VTTL  
Temperature  
Commercial 0°C to +70°C 3.3V±165 mV 1.8V±100 mV  
Outputs in High-Z State .......................... –0.5V to V +0.5V  
Industrial  
–40°C to +85°C 3.3V±165 mV 1.8V±100 mV  
DD  
DC Input Voltage .............................. –0.5V to V + 0.5V  
DD  
Electrical Characteristics Over the Operating Range  
-167  
-133  
-100  
Parameter  
Description  
Unit  
Min Typ. Max Min Typ. Max Min Typ. Max  
V
Output HIGH Voltage (V = Min, I = –4.0 mA)  
2.4  
2.4  
2.4  
V
V
V
V
μA  
μA  
OH  
OL  
IH  
DD  
OH  
V
V
V
I
Output LOW Voltage (V = Min, I = +4.0 mA)  
0.4  
0.8  
0.4  
0.4  
DD  
OL  
Input HIGH Voltage  
Input LOW Voltage  
Output Leakage Current  
Input Leakage Current Except TDI, TMS, MRST  
Input Leakage Current TDI, TMS, MRST  
2.0  
2.0  
2.0  
0.8  
10  
10  
0.8  
10  
10  
IL  
–10  
–10  
–1.0  
10 –10  
10 –10  
0.1 –1.0  
–10  
–10  
OZ  
I
I
I
IX1  
0.1 –1.0  
225 300  
0.1 mA  
mA  
IX2  
CC  
Operating Current for  
CYD01S36V  
225 300  
(V = Max.,I  
= 0 mA), Outputs CYD02S36V/  
CYD02S36VA/  
DD  
OUT  
Disabled  
CYD04S36V  
mA  
mA  
mA  
CYD09S36V  
CYD18S36V  
Standby Current (Both Ports TTL Level)  
450 600  
370 540  
410 580  
315 450  
I
I
I
I
I
I
90 115  
160 210  
90  
160 210  
55 75  
115  
SB1  
SB2  
SB3  
SB4  
SB5  
CE and CE V , f = f  
L
R
IH  
MAX  
Standby Current (One Port TTL Level)  
mA  
mA  
mA  
CE | CE V , f = f  
L
R
IH  
MAX  
Standby Current (Both Ports CMOS Level)  
55  
75  
CE and CE V – 0.2V, f = 0  
L
R
DD  
Standby Current (One Port CMOS Level)  
160 210  
160 210  
75  
CE | CE V , f = f  
L
R
IH  
MAX  
Operating Current (VDDIO = Max, CYD18S36V  
Iout = 0 mA, f = 0) Outputs Disabled  
75 mA  
mA  
CORE  
Core Operating Current for (V = Max, I  
= 0 mA),  
0
0
0
0
0
0
DD  
OUT  
Outputs Disabled  
Capacitance  
Part Number  
Parameter  
Description  
Input Capacitance  
Test Conditions  
T = 25°C, f = 1 MHz,  
Max  
13  
Unit  
pF  
CYD01S36/  
C
IN  
A
CYD02S36V/36VA/  
CYD04S36V  
V
= 3.3V  
DD  
C
C
C
C
C
Output Capacitance  
Input Capacitance  
Output Capacitance  
Input Capacitance  
Output Capacitance  
10  
22  
10  
40  
20  
pF  
pF  
pF  
pF  
pF  
OUT  
IN  
CYD09S36V  
OUT  
IN  
CYD18S36V  
OUT  
Notes  
25. The voltage on any input or IO pin cannot exceed the power pin during power up.  
26. Pulse width < 20 ns.  
27. I  
, I  
, I  
and I  
are not applicable for CYD18S36V because it cannot be powered down by using chip enable pins.  
SB1 SB2 SB3  
SB4  
28. C  
also references C  
.
OUT  
IO  
29. Except INT and CNTINT which are 20 pF.  
Document Number: 38-06076 Rev. *G  
Page 12 of 28  
         
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Figure 6. AC Test Load and Waveforms  
3.3V  
Z0 = 50Ω  
R = 50Ω  
OUTPUT  
R1 = 590 Ω  
OUTPUT  
C = 10 pF  
C = 5 pF  
R2 = 435 Ω  
VTH = 1.5V  
(a) Normal Load (Load 1)  
(b) Three-state Delay (Load 2)  
3.0V  
90%  
10%  
90%  
10%  
ALL INPUT PULSES  
Vss  
< 2 ns  
< 2 ns  
Switching Characteristics Over the Operating Range  
-167  
-133  
-100  
CYD01S36V  
CYD02S36V/  
CYD02S36VA  
CYD04S36V  
CYD09S36V  
CYD01S36V  
CYD02S36V  
CYD18S36V  
CYD04S36V  
Parameter  
Description  
CYD18S36V  
Unit  
CYD09S36V  
Min  
Max  
Min  
Max  
Min  
Max  
Min  
Max  
f
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
Maximum Operating Frequency  
Clock Cycle Time  
167  
133  
133  
100  
MHz  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
MAX2  
CYC2  
CH2  
6.0  
2.7  
2.7  
7.5  
3.0  
3.0  
7.5  
3.4  
3.4  
10.0  
4.5  
Clock HIGH Time  
Clock LOW Time  
4.5  
CL2  
Clock Rise Time  
2.0  
2.0  
2.0  
2.0  
2.0  
2.0  
3.0  
3.0  
R
F
Clock Fall Time  
Address Setup Time  
Address Hold Time  
Byte Select Setup Time  
Byte Select Hold Time  
Chip Enable Setup Time  
Chip Enable Hold Time  
R/W Setup Time  
2.3  
0.6  
2.3  
0.6  
2.3  
0.6  
2.3  
0.6  
2.3  
0.6  
2.3  
0.6  
2.3  
0.6  
2.3  
0.6  
2.3  
2.5  
0.6  
2.5  
0.6  
2.5  
0.6  
2.5  
0.6  
2.5  
0.6  
2.5  
0.6  
2.5  
0.6  
2.5  
0.6  
2.5  
2.2  
1.0  
2.2  
1.0  
NA  
NA  
2.2  
1.0  
2.2  
1.0  
NA  
NA  
NA  
NA  
NA  
NA  
NA  
2.7  
1.0  
2.7  
1.0  
NA  
NA  
2.7  
1.0  
2.7  
1.0  
NA  
NA  
NA  
NA  
NA  
NA  
NA  
SA  
HA  
SB  
HB  
SC  
HC  
SW  
R/W Hold Time  
HW  
SD  
Input Data Setup Time  
Input Data Hold Time  
ADS Setup Time  
HD  
SAD  
HAD  
SCN  
HCN  
SRST  
HRST  
SCM  
ADS Hold Time  
CNTEN Setup Time  
CNTEN Hold Time  
CNTRST Setup Time  
CNTRST Hold Time  
CNT/MSK Setup Time  
Note  
30. Except JTAG signals (t and t < 10 ns [max.]).  
r
f
Document Number: 38-06076 Rev. *G  
Page 13 of 28  
 
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Switching Characteristics Over the Operating Range (continued)  
-167  
-133  
-100  
CYD01S36V  
CYD01S36V  
CYD02S36V/  
CYD02S36VA  
CYD04S36V  
CYD09S36V  
CYD02S36V  
Parameter  
Description  
CYD18S36V  
CYD18S36V  
Unit  
CYD04S36V  
CYD09S36V  
Min  
Max  
Min  
Max  
Min  
Max  
Min  
Max  
t
t
t
t
t
t
t
CNT/MSK Hold Time  
0.6  
0.6  
NA  
NA  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
HCM  
Output Enable to Data Valid  
OE to Low Z  
4.4  
4.4  
5.5  
5.5  
OE  
OLZ  
0
0
0
0
0
0
0
0
OE to High Z  
4.0  
4.4  
4.0  
4.0  
4.4  
4.4  
4.4  
4.4  
5.5  
5.0  
NA  
NA  
5.5  
5.2  
NA  
NA  
OHZ  
Clock to Data Valid  
Clock to Counter Address Valid  
CD2  
CA2  
CM2  
Clock to Mask Register Readback  
Valid  
t
t
t
t
t
t
t
Data Output Hold After Clock HIGH  
Clock HIGH to Output High Z  
Clock HIGH to Output Low Z  
Clock to INT Set Time  
1.0  
0
1.0  
0
1.0  
0
1.0  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
DC  
4.0  
4.0  
6.7  
6.7  
5.0  
5.0  
4.4  
4.4  
7.5  
7.5  
5.7  
5.7  
4.7  
4.7  
7.5  
7.5  
NA  
NA  
5.0  
5.0  
CKHZ  
CKLZ  
1.0  
0.5  
0.5  
0.5  
0.5  
1.0  
0.5  
0.5  
0.5  
0.5  
1.0  
0.5  
0.5  
NA  
NA  
1.0  
0.5  
0.5  
NA  
NA  
10.0  
10.0  
NA  
SINT  
Clock to INT Reset Time  
RINT  
Clock to CNTINT Set Time  
Clock to CNTINT Reset time  
SCINT  
RCINT  
NA  
Port to Port Delays  
t
Clock to Clock Skew  
5.2  
6.0  
5.7  
8.0  
ns  
CCS  
Master Reset Timing  
t
t
t
t
t
Master Reset Pulse Width  
5.0  
6.0  
5.0  
5.0  
6.0  
5.0  
5.0  
6.0  
5.0  
5.0  
8.5  
5.0  
cycles  
ns  
RS  
Master Reset Setup Time  
RS  
Master Reset Recovery Time  
Master Reset to Outputs Inactive  
cycles  
ns  
RSR  
RSF  
RSINT  
10.0  
10.0  
10.0  
10.0  
10.0  
NA  
10.0  
NA  
Master Reset to Counter and Mailbox  
Interrupt Flag Reset Time  
ns  
JTAG Timing  
167/133/100  
Parameter  
Description  
Unit  
Min  
Max  
10  
f
t
t
t
t
t
t
t
t
t
Maximum JTAG TAP Controller Frequency  
TCK Clock Cycle Time  
MHz  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
JTAG  
TCYC  
TH  
100  
40  
40  
10  
10  
10  
10  
TCK Clock HIGH Time  
TCK Clock LOW Time  
TL  
TMS Setup to TCK Clock Rise  
TMS Hold After TCK Clock Rise  
TDI Setup to TCK Clock Rise  
TDI Hold After TCK Clock Rise  
TCK Clock LOW to TDO Valid  
TCK Clock LOW to TDO Invalid  
TMSS  
TMSH  
TDIS  
TDIH  
TDOV  
TDOX  
30  
0
Notes  
31. This parameter is guaranteed by design, but it is not production tested.  
32. Test conditions used are Load 2.  
Document Number: 38-06076 Rev. *G  
Page 14 of 28  
   
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
JTAG Switching Waveform  
t
t
TL  
TH  
Test Clock  
TCK  
t
TCYC  
t
TMSS  
t
TMSH  
Test Mode Select  
TMS  
t
TDIS  
t
TDIH  
Test Data-In  
TDI  
Test Data-Out  
TDO  
t
TDOV  
t
TDOX  
Switching Waveforms  
Figure 7. Master Reset  
tRS  
MRST  
tRSF  
ALL  
ADDRESS/  
DATA  
tRSS  
INACTIVE  
LINES  
tRSR  
ALL  
OTHER  
INPUTS  
ACTIVE  
TMS  
tRSINT  
CNTINT  
INT  
TDO  
Document Number: 38-06076 Rev. *G  
Page 15 of 28  
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Switching Waveforms (continued)  
Figure 8. Read Cycle  
tCYC2  
tCH2  
tCL2  
CLK  
CE  
tSC  
tHC  
tSC  
tHC  
tSB  
tHB  
BE0–BE3  
R/W  
tSW  
tSA  
tHW  
tHA  
ADDRESS  
DATAOUT  
An  
An+1  
An+2  
An+3  
tDC  
1 Latency  
tCD2  
Qn  
Qn+1  
Qn+2  
tOHZ  
tCKLZ  
tOLZ  
OE  
t
OE  
Notes  
33. OE is asynchronously controlled; all other inputs (excluding MRST and JTAG) are synchronous to the rising clock edge.  
34. ADS = CNTEN = LOW, and MRST = CNTRST = CNT/MSK = HIGH.  
35. The output is disabled (high-impedance state) by CE = V following the next rising edge of the clock.  
IH  
36. Addresses do not have to be accessed sequentially since ADS = CNTEN = V with CNT/MSK = V constantly loads the address on the rising edge of the CLK.  
IL  
IH  
Numbers are for reference only.  
Document Number: 38-06076 Rev. *G  
Page 16 of 28  
       
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Switching Waveforms (continued)  
Figure 9. Bank Select Read  
tCYC2  
tCH2  
tCL2  
CLK  
tHA  
tSA  
A3  
A4  
ADDRESS(B1)  
A5  
A0  
A1  
A2  
tHC  
tSC  
CE(B1)  
tCD2  
tCD2  
tCD2  
tCKHZ  
tHC  
tCKHZ  
tSC  
Q0  
Q3  
Q1  
DATAOUT(B1)  
ADDRESS(B2)  
tHA  
tSA  
tDC  
A2  
tDC  
A3  
tCKLZ  
A4  
A5  
A0  
A1  
tHC  
tSC  
CE(B2)  
tCD2  
tCKHZ  
tCD2  
tSC  
tHC  
DATAOUT(B2)  
Q4  
Q2  
tCKLZ  
tCKLZ  
Figure 10. Read-to-Write-to-Read (OE = LOW)  
tCYC2  
tCH2  
tCL2  
CLK  
CE  
tSC  
tHC  
tSW  
tHW  
R/W  
tSW  
tHW  
An  
An+1  
An+2  
An+2  
An+2  
tSD tHD  
Dn+2  
An+3  
ADDRESS  
DATAIN  
tSA  
tHA  
tCD2  
tDC  
tCKHZ  
Qn  
DATAOUT  
READ  
NO OPERATION  
WRITE  
Notes  
37. In this depth-expansion example, B1 represents Bank #1 and B2 is Bank #2; each bank consists of one Cypress FLEx36 device from this data sheet. ADDRESS  
(B1)  
= ADDRESS  
.
(B2)  
38. ADS = CNTEN= BE0 – BE3 = OE = LOW; MRST = CNTRST = CNT/MSK = HIGH.  
39. Output state (HIGH, LOW, or high-impedance) is determined by the previous cycle control signals.  
40. During “No Operation,” data in memory at the selected address may be corrupted and must be rewritten to ensure data integrity.  
41. CE = OE = BE0 – BE3 = LOW; CE = R/W = CNTRST = MRST = HIGH.  
0
1
42. CE = BE0 – BE3 = R/W = LOW; CE = CNTRST = MRST = CNT/MSK = HIGH. When R/W first switches low, since OE = LOW, the Write operation cannot be completed  
0
1
(labelled as no operation). One clock cycle is required to three-state the IO for the Write operation on the next rising edge of CLK.  
Document Number: 38-06076 Rev. *G  
Page 17 of 28  
           
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Switching Waveforms (continued)  
Figure 11. Read-to-Write-to-Read (OE Controlled)  
tCYC2  
tCH2  
tCL2  
CLK  
CE  
tSC  
tHC  
tHW  
tSW  
R/W tSW  
tHW  
An  
An+1  
An+2  
An+3  
An+4  
An+5  
ADDRESS  
tSA  
tHA  
tSD tHD  
Dn+2  
DATAIN  
Dn+3  
tCD2  
tCD2  
DATAOUT  
Qn  
Qn+4  
tOHZ  
OE  
READ  
WRITE  
READ  
Figure 12. Read with Address Counter Advance  
tCYC2  
tCL2  
tCH2  
CLK  
tSA  
tHA  
ADDRESS  
An  
tSAD  
tHAD  
ADS  
tSAD  
tHAD  
CNTEN  
tSCN  
tHCN  
tSCN  
tHCN  
tCD2  
Qx–1  
Qx  
tDC  
Qn  
Qn+1  
COUNTER HOLD  
Qn+2  
DATAOUT  
Qn+3  
READ  
READ WITH COUNTER  
READ WITH COUNTER  
EXTERNAL  
ADDRESS  
Document Number: 38-06076 Rev. *G  
Page 18 of 28  
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Switching Waveforms (continued)  
Figure 13. Write with Address Counter Advance  
tCYC2  
tCL2  
tCH2  
CLK  
tSA  
tHA  
An  
ADDRESS  
INTERNAL  
ADDRESS  
An  
An+1  
An+2  
An+3  
An+4  
tSAD  
tHAD  
ADS  
CNTEN  
DATAIN  
tSCN  
tHCN  
Dn  
Dn+1  
Dn+1  
Dn+2  
Dn+3  
Dn+4  
tSD  
tHD  
WRITE EXTERNAL  
ADDRESS  
WRITE WITH WRITE COUNTER  
COUNTER HOLD  
WRITE WITH COUNTER  
Document Number: 38-06076 Rev. *G  
Page 19 of 28  
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Switching Waveforms (continued)  
Figure 14. Counter Reset  
tCYC2  
tCH2 tCL2  
CLK  
tHA  
Am  
tSA  
Ap  
An  
ADDRESS  
INTERNAL  
Ax  
Ap  
An  
1
0
Am  
ADDRESS  
tHW  
tSW  
R/W  
ADS  
CNTEN  
CNTRST  
tHRST  
tSRST  
tHD  
tSD  
DATAIN  
D0  
tCD2  
tCD2  
DATAOUT  
Q0  
Qn  
Q1  
tCKLZ  
READ  
ADDRESS 1  
READ  
ADDRESS An  
COUNTER  
RESET  
WRITE  
ADDRESS 0  
READ  
ADDRESS 0  
READ  
ADDRESS Am  
Notes  
43. CE = BE0 – BE3 = LOW; CE = MRST = CNT/MSK = HIGH.  
0
1
44. No dead cycle exists during counter reset. A Read or Write cycle may be coincidental with the counter reset.  
45. Retransmit happens if the counter remains in increment mode after it wraps to initially loaded value  
Document Number: 38-06076 Rev. *G  
Page 20 of 28  
     
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Switching Waveforms (continued)  
Figure 15. Readback State of Address Counter or Mask Register  
tCYC2  
tCH2 tCL2  
CLK  
tCA2 or tCM2  
tSA  
tHA  
EXTERNAL  
An*  
An  
ADDRESS  
A0–A16  
INTERNAL  
ADDRESS  
A
A
A
A
A
n+4  
n+1  
n+2  
n+3  
n
tSAD  
tHAD  
ADS  
CNTEN  
tSCN  
tHCN  
tCD2  
tCKHZ  
Qn  
tCKLZ  
DATAOUT  
Qn+1  
Qx-1  
Qn+2  
Qx-2  
Q
n+3  
LOAD  
EXTERNAL  
ADDRESS  
READBACK  
COUNTER  
INTERNAL  
ADDRESS  
INCREMENT  
Notes  
46. CE = OE = BE0 – BE3 = LOW; CE = R/W = CNTRST = MRST = HIGH.  
0
1
47. Address in output mode. Host must not be driving address bus after t  
in next clock cycle.  
CKLZ  
48. Address in input mode. Host can drive address bus after t  
.
CKHZ  
49. An * is the internal value of the address counter (or the mask register depending on the CNT/MSK level) being Read out on the address lines.  
Document Number: 38-06076 Rev. *G  
Page 21 of 28  
       
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Switching Waveforms (continued)  
Figure 16. Left_Port (L_Port) Write to Right_Port (R_Port) Read  
tCYC2  
tCL2  
tCH2  
CLKL  
tHA  
tSA  
L_PORT  
ADDRESS  
An  
tSW  
tHW  
R/WL  
tCKHZ  
tSD  
tHD  
tCKLZ  
L_PORT  
DATAIN  
Dn  
tCCS  
tCYC2  
tCL2  
CLKR  
tCH2  
tSA  
tHA  
R_PORT  
ADDRESS  
An  
R/WR  
tCD2  
R_PORT  
DATAOUT  
Qn  
tDC  
Notes  
50. CE = OE = ADS = CNTEN = BE0 – BE3 = LOW; CE = CNTRST = MRST = CNT/MSK = HIGH.  
0
1
51. This timing is valid when one port is writing, and other port is reading the same location at the same time. If t  
is violated, indeterminate data is Read out.  
CCS  
52. If t  
< minimum specified value, then R_Port Reads the most recent data (written by L_Port) only (2 * t  
+ t  
) after the rising edge of R_Port's clock. If t  
>
CCS  
CYC2  
CD2  
CCS  
minimum specified value, then R_Port Reads the most recent data (written by L_Port) (t  
+ t  
) after the rising edge of R_Port's clock.  
CYC2  
CD2  
Document Number: 38-06076 Rev. *G  
Page 22 of 28  
     
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Switching Waveforms (continued)  
Figure 17. Counter Interrupt and Retransmit  
tCYC2  
tCL2  
tCH2  
CLK  
tSCM  
tHCM  
CNT/MSK  
ADS  
CNTEN  
COUNTER  
INTERNAL  
ADDRESS  
3FFFE  
tSCINT  
3FFFC  
Last_Loaded  
3FFFD  
3FFFF  
tRCINT  
Last_Loaded +1  
CNTINT  
Notes  
53. CE = OE = BE0 – BE3 = LOW; CE = R/W = CNTRST = MRST = HIGH.  
0
1
54. CNTINT is always driven.  
55. CNTINT goes LOW when the unmasked portion of the address counter is incremented to the maximum value.  
56. The mask register assumed to have the value of 3FFFFh.  
Document Number: 38-06076 Rev. *G  
Page 23 of 28  
       
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Switching Waveforms (continued)  
Figure 18. MailBox Interrupt Timing  
tCYC2  
tCL2  
tCH2  
CLKL  
tSA tHA  
7FFFF  
L_PORT  
ADDRESS  
An+1  
An  
An+2  
An+3  
tSINT  
tRINT  
INTR  
tCYC2  
tCL2  
tCH2  
CLKR  
tSA tHA  
Am  
R_PORT  
ADDRESS  
Am+1  
7FFFF  
Am+3  
Am+4  
Table 7. Read/Write and Enable Operation (Any Port)  
Inputs  
Outputs  
Operation  
OE  
CLK  
CE  
CE  
R/W  
DQ DQ  
0
1
0
35  
X
H
X
X
High-Z  
Deselected  
Deselected  
Write  
X
X
L
X
L
L
L
L
H
H
H
X
L
High-Z  
D
IN  
H
X
D
Read  
OUT  
H
X
High-Z  
Outputs Disabled  
Notes  
57. CE = OE = ADS = CNTEN = LOW; CE = CNTRST = MRST = CNT/MSK = HIGH.  
0
1
58. Address “7FFFF” is the mailbox location for R_Port of the 9-Mbit device.  
59. L_Port is configured for Write operation, and R_Port is configured for Read operation.  
60. At least one byte enable (BE0 – BE3) is required to be active during interrupt operations.  
61. Interrupt flag is set with respect to the rising edge of the Write clock, and is reset with respect to the rising edge of the Read clock.  
62. OE is an asynchronous input signal.  
63. When CE changes state, deselection and Read happen after one cycle of latency.  
64. CE = OE = LOW; CE = R/W = HIGH.  
0
1
Document Number: 38-06076 Rev. *G  
Page 24 of 28  
               
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Ordering Information  
512K  
×
36 (18-Mbit) 3.3V Synchronous CYD18S36V Dual-Port SRAM  
Package  
Speed(  
MHz)  
Operating  
Range  
Ordering Code  
Package Type  
Name  
133 CYD18S36V-133BBC  
CYD18S36V-133BBI  
BB256B  
BB256B  
BB256B  
BB256B  
256-ball Grid Array 23 mm × 23 mm with 1.0-mm pitch (BGA) Commercial  
256-ball Grid Array 23 mm × 23 mm with 1.0-mm pitch (BGA) Industrial  
256-ball Grid Array 23 mm × 23 mm with 1.0-mm pitch (BGA) Commercial  
256-ball Grid Array 23 mm × 23 mm with 1.0-mm pitch (BGA) Industrial  
100 CYD18S36V-100BBC  
CYD18S36V-100BBI  
256K  
×
36 (9-Mbit) 3.3V Synchronous CYD09S36V Dual-Port SRAM  
Package  
Speed(  
MHz)  
Operating  
Range  
Ordering Code  
Package Type  
Name  
BB256  
BB256  
BB256  
167 CYD09S36V-167BBC  
133 CYD09S36V-133BBC  
CYD09S36V-133BBI  
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Commercial  
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Commercial  
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Industrial  
128K  
×
36 (4-Mbit) 3.3V Synchronous CYD04S36V Dual-Port SRAM  
Package  
Speed(  
MHz)  
Operating  
Range  
Ordering Code  
Package Type  
Name  
BB256  
BB256  
BB256  
167 CYD04S36V-167BBC  
133 CYD04S36V-133BBC  
CYD04S36V-133BBI  
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Commercial  
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Commercial  
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Industrial  
64K  
×
36 (2-Mbit) 3.3V Synchronous CYD02S36V Dual-Port SRAM  
Speed(  
MHz)  
Package  
Name  
Operating  
Range  
Ordering Code  
Package Type  
167 CYD02S36V-167BBC  
CYD02S36VA-167BBC  
133 CYD02S36V-133BBC  
CYD02S36V-133BBI  
BB256  
BB256  
BB256  
BB256  
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Commercial  
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA)  
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Commercial  
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Industrial  
32K  
×
36 (1-Mbit) 3.3V Synchronous CYD01S36V Dual-Port SRAM  
Speed(  
MHz)  
Package  
Name  
Operating  
Range  
Ordering Code  
Package Type  
167 CYD01S36V-167BBC  
133 CYD01S36V-133BBC  
CYD01S36V-133BBI  
BB256  
BB256  
BB256  
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Commercial  
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Commercial  
256-ball Grid Array 17 mm × 17 mm with 1.0-mm pitch (BGA) Industrial  
Document Number: 38-06076 Rev. *G  
Page 25 of 28  
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Package Diagrams  
Figure 19. 256-Ball FBGA (17 x 17 mm) BB256  
TOP VIEW  
BOTTOM VIEW  
Ø0.05 M C  
Ø0.25 M C A B  
PIN 1 CORNER  
Ø0.45 0.05(256X)-CPLD DEVICES (37K & 39K)  
PIN 1 CORNER  
+0.10  
Ø0.50 (256X)-ALL OTHER DEVICES  
-0.05  
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16  
16 15 14 13 12 11 10  
9
8
7
6
5
4
3
2
1
A
B
C
D
E
A
B
C
D
E
F
F
G
H
J
G
H
J
K
L
K
L
M
N
P
R
T
M
N
P
R
T
1.00  
B
7.50  
15.00  
A
17.00 0.10  
A
SEATING PLANE  
0.20(4X)  
A1  
C
REFERENCE JEDEC MO-192  
A1 0.36 0.56  
1.40 MAX. 1.70 MAX.  
A
51-85108-*F  
Document Number: 38-06076 Rev. *G  
Page 26 of 28  
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Package Diagrams (continued)  
Figure 20. 256-ball FBGA (23 mm x 23 mm x 1.7 mm) BB256B  
TOP VIEW  
Ø0.05 M C  
Ø0.25 M C A B  
PIN 1 CORNER  
+0.10  
Ø0.50 (256X)  
-0.05  
PIN 1 CORNER  
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16  
16 15 14 13 12 11 10  
9
8
7
6
5
4
3
2
1
A
B
C
D
E
A
B
C
D
E
F
F
G
H
J
G
H
J
K
L
K
L
M
N
P
R
T
M
N
P
R
T
1.00  
B
7.50  
15.00  
A
23.00 0.10  
0.20(4X)  
SEATING PLANE  
JEDEC MO-192  
51-85201-*A  
C
Document Number: 38-06076 Rev. *G  
Page 27 of 28  
CYD01S36V  
CYD02S36V/36VA/CYD04S36V  
CYD09S36V/CYD18S36V  
Document History Page  
Document Title: CYD01S36V CYD02S36V/36VA/CYD04S36V CYD09S36V/CYD18S36V FLEx363.3V  
32K/64K/128K/256K/512 x 36 Synchronous Dual-Port RAM  
Document Number: 38-06076  
Orig. of  
Change  
Submission  
Date  
REV.  
ECN NO.  
Description of Change  
**  
232012  
244232  
WWZ  
WWZ  
See ECN New data sheet  
*A  
See ECN Changed pinout  
Changed FTSEL# to FTSEL in the block diagram  
*B  
313156  
YDT  
See ECN Changed pinout D10 from NC to VSS to reflect test mode pin swap, C10 from  
rev[2,4] to VSS to reflect SC removal.  
Changed tRSCNTINT to tRSINT  
Added tRSINT to the master reset timing diagram  
Added CYD01S36V to data sheet  
Added I  
and changed I  
SB5  
IX2  
*C  
*D  
321033  
327338  
YDT  
AEQ  
See ECN Added CYD18S36V-133BBI to the Ordering Information Section  
See ECN Change Pinout C10 from VSS to NC[2,5]  
Change Pinout G5 from VDDIO to REV [2,3]  
L
L
*E  
*F  
*G  
365315  
2193427  
2623658  
YDT  
See ECN Added note for V  
CORE  
Removed preliminary status  
NXR/AESA  
VKN/PYRS  
See ECN Changed t and t Spec from 4ns to 4.4ns for -167.  
CD2  
OE  
Template Update.  
12/17/08  
Added CYD02S36VA-15AXC part  
Sales, Solutions and Legal Information  
Worldwide Sales and Design Support  
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office  
closest to you, visit us at cypress.com/sales.  
Products  
PSoC  
PSoC Solutions  
General  
Clocks & Buffers  
Wireless  
Low Power/Low Voltage  
Precision Analog  
LCD Drive  
Memories  
Image Sensors  
CAN 2.0b  
USB  
© Cypress Semiconductor Corporation, 2005-2008. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of  
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for  
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as  
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems  
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),  
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,  
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress  
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without  
the express written permission of Cypress.  
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES  
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not  
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where  
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer  
assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
Use may be limited by and subject to the applicable Cypress software license agreement.  
Document Number: 38-06076 Rev. *G  
Revised Decenber 09, 2008  
Page 28 of 28  
FLEx36 and FLEx36-E are trademarks of Cypress Semiconductor Corporation. All other trademarks or registered trademarks referenced herein are property of the respective corporations. All products  
and company names mentioned in this document may be the trademarks of their respective holders.  

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