Cypress CY7C1460AV33 User Manual

CY7C1460AV33

CY7C1462AV33

CY7C1464AV33

36-Mbit (1M x 36/2M x 18/512K x 72)

Pipelined SRAM with NoBL™ Architecture

Functional Description

Features

• Pin-compatible and functionally equivalent to ZBT™

• Supports 250-MHz bus operations with zero wait states

— Available speed grades are 250, 200 and 167 MHz

The CY7C1460AV33/CY7C1462AV33/CY7C1464AV33 are

3.3V, 1M x 36/2M x 18/512K x72 Synchronous pipelined burst

SRAMs with No Bus Latency™ (NoBL™) logic, respectively.

They are designed to support unlimited true back-to-back

Read/Write operations with no wait states. The

• Internally self-timed output buffer control to eliminate

the need to use asynchronous OE

CY7C1460AV33/CY7C1462AV33/CY7C1464AV33

are

equipped with the advanced (NoBL) logic required to enable

consecutive Read/Write operations with data being trans-

ferred on every clock cycle. This feature dramatically improves

the throughput of data in systems that require frequent

• Fully registered (inputs and outputs) for pipelined

operation

• Byte Write capability

Write/Read

transitions.

The

• 3.3V power supply

CY7C1460AV33/CY7C1462AV33/CY7C1464AV33 are pin

compatible and functionally equivalent to ZBT devices.

• 3.3V/2.5V I/O power supply

• Fast clock-to-output times

— 2.6 ns (for 250-MHz device)

• Clock Enable (CEN) pin to suspend operation

• Synchronous self-timed writes

All synchronous inputs pass through input registers controlled

by the rising edge of the clock. All data outputs pass through

output registers controlled by the rising edge of the clock. The

clock input is qualified by the Clock Enable (CEN) signal,

which when deasserted suspends operation and extends the

previous clock cycle.

• CY7C1460AV33, CY7C1462AV33 available in

JEDEC-standard lead-free 100-pin TQFP, lead-free and

non-lead-free 165-ball FBGA package. CY7C1464AV33

available in lead-free and non-lead-free 209-ball FBGA

package

Write operations are controlled by the Byte Write Selects

(BW –BW

for

CY7C1464AV33,

BW –BW

for

CY7C1460AV33 and BW –BW for CY7C1462AV33) and a

Write Enable (WE) input. All writes are conducted with on-chip

synchronous self-timed write circuitry.

• IEEE 1149.1 JTAG-Compatible Boundary Scan

• Burst capability—linear or interleaved burst order

• “ZZ” Sleep Mode option and Stop Clock option

Three synchronous Chip Enables (CE , CE , CE ) and an

asynchronous Output Enable (OE) provide for easy bank

selection and output tri-state control. In order to avoid bus

contention, the output drivers are synchronously tri-stated

during the data portion of a write sequence.

Logic Block Diagram-CY7C1460AV33 (1M x 36)

ADDRESS

A0, A1, A

A1'

A0'

BURST

LOGIC

MODE

ADV/LD

CLK

CEN

WRITE ADDRESS

ADV/LD

BWa

BWb

BWc

BWd

WRITE REGISTRY

AND DATA COHERENCY

CONTROL LOGIC

MEMORY

ARRAY

DQs

WRITE

DRIVERS

DQPa

DQPb

DQPc

DQPd

INPUT

READ LOGIC

CE1

CE2

CE3

SLEEP

CONTROL

Cypress Semiconductor Corporation

Document #: 38-05353 Rev. *D

•

198 Champion Court

•

San Jose, CA 95134-1709

•

408-943-2600

Revised June 22, 2006

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CY7C1460AV33

CY7C1462AV33

CY7C1464AV33

Pin Configurations

100-pin TQFP Pinout

DQPc

DQc

DDQ

DQPb

DQb

DDQ

DQPa

DQa

DDQ

DQc

DQb

DQc

DQb

DDQ

DQa

DDQ

DQc

DQb

CY7C1462AV33

(2M × 18)

CY7C1460AV33

(1M × 36)

DQa

DQd

DQb

DQa

DQd

DQb

DDQ

DQa

DDQ

DQd

DQa

DQb

DQa DQPb

DQa

DDQ

DQd

DQPd

DQa

DQPa

Document #: 38-05353 Rev. *D

Page 3 of 27

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CY7C1460AV33

CY7C1462AV33

CY7C1464AV33

Pin Configurations (continued)

165-ball FBGA (15 x 17 x 1.4 mm) Pinout

CY7C1460AV33 (1M × 36)

NC/576M

NC/1G

DQP_c

ADV/LD

CE₁

BW_c

BW_d

V_SS

V_DD

BW_b

BW_a

V_SS

CEN

CE2

V_DDQ

CLK

V_SS

V_DD

DQ_c

V_SS

V_DDQ

DQ_b

DQP_b

DQ_b

DQ_c

V_DDQ

V_DD

V_SS

V_DD

V_DDQ

DQ_b

DQ_d

V_DDQ

DQ_a

DQ_d

V_DDQ

V_DD

V_SS

V_DD

V_SS

V_DDQ

DQ_a

DQP_a

DQP_d

NC/144M NC/72M

TDI

TDO

NC/288M

MODE

TMS

TCK

CY7C1462AV33 (2M × 18)

NC/576M

NC/1G

CE₁

BW_b

CEN

ADV/LD

CE2

V_DDQ

BW_a

V_SS

CLK

V_SS

V_DD

DQ_b

V_SS

V_DD

V_DDQ

DQP_a

DQ_a

DQ_b

V_DDQ

V_DD

V_SS

V_DD

V_DDQ

DQ_a

DQ_b

V_DDQ

DQ_a

DQ_b

V_DDQ

V_DD

V_SS

V_DD

V_SS

V_DDQ

DQ_a

DQP_b

NC/144M NC/72M

TDI

TDO

NC/288M

MODE

TMS

TCK

Document #: 38-05353 Rev. *D

Page 4 of 27

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CY7C1460AV33

CY7C1462AV33

CY7C1464AV33

Pin Configurations (continued)

209-ball FBGA (14 x 22 x 1.76 mm) Pinout

CY7C1464AV33 (512K x 72)

DQg

DQb

DQg

ADV/LD

DQb

BWS

DQb

BWS

DQg

DQPc

DQc

NC/576M

BWS

DQb

DQPb

DQf

DQg

NC/1G

DQb

DQPg

DQc

DDQ

DQPf

DQf

CEN

DQc

DDQ

DQf

DDQ

DQf

DDQ

DQc

DQf

DQc

DDQ

DQf

CLK

DQh

DDQ

DQa

DDQ

DQh

DQa

DDQ

DQh

DQPd

DQd

DDQ

DQa

DQPa

DQe

DQPh

DQd

DDQ

DQPe

DQe

MODE

NC/72M

NC/288M

NC/144M

DQd

DQe

TDI

TDO

TCK

TMS

Pin Definitions

Pin Name

I/O Type

Pin Description

Input-

Synchronous

Address Inputs used to select one of the address locations. Sampled at the rising

edge of the CLK.

Input-

Synchronous

Byte Write Select Inputs, active LOW. Qualified with WE to conduct writes to the SRAM.

Sampled on the rising edge of CLK. BW controls DQ and DQP , BW controls DQ and

DQP , BW controls DQ and DQP , BW controls DQ and DQP , BW controls DQ and

DQP .

Input-

Synchronous

Write Enable Input, active LOW. Sampled on the rising edge of CLK if CEN is active

LOW. This signal must be asserted LOW to initiate a write sequence.

ADV/LD

Input-

Synchronous

Advance/Load Input used to advance the on-chip address counter or load a new

address. When HIGH (and CEN is asserted LOW) the internal burst counter is advanced.

When LOW, a new address can be loaded into the device for an access. After being

deselected, ADV/LD should be driven LOW in order to load a new address.

Document #: 38-05353 Rev. *D

Page 5 of 27

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CY7C1460AV33

CY7C1462AV33

CY7C1464AV33

Pin Definitions (continued)

Pin Name

CLK

I/O Type

Pin Description

Input-

Clock

Clock Input. Used to capture all synchronous inputs to the device. CLK is qualified with

CEN. CLK is only recognized if CEN is active LOW.

Input-

Synchronous

Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction

with CE and CE to select/deselect the device.

Input-

Synchronous

Chip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in

conjunction with CE and CE to select/deselect the device.

Input-

Synchronous

Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction

with CE and CE to select/deselect the device.

Input-

Output Enable, active LOW. Combined with the synchronous logic block inside the device

Asynchronous to control the direction of the I/O pins. When LOW, the I/O pins are allowed to behave as

outputs. When deasserted HIGH, I/O pins are tri-stated, and act as input data pins. OE is

masked during the data portion of a write sequence, during the first clock when emerging

from a deselected state and when the device has been deselected.

CEN

Input-

Synchronous

Clock Enable Input, active LOW. When asserted LOW the clock signal is recognized by

the SRAM. When deasserted HIGH the clock signal is masked. Since deasserting CEN

does not deselect the device, CEN can be used to extend the previous cycle when required.

I/O-

Synchronous

Bidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is

triggered by the rising edge of CLK. As outputs, they deliver the data contained in the

memory location specified by A during the previous clock rise of the read cycle. The

direction of the pins is controlled by OE and the internal control logic. When OE is asserted

LOW, the pins can behave as outputs. When HIGH, DQ –DQ are placed in a tri-state

condition. The outputs are automatically tri-stated during the data portion of a write

sequence, during the first clock when emerging from a deselected state, and when the

device is deselected, regardless of the state of OE.

DQP DQP

I/O-

Synchronous

Bidirectional Data Parity I/O lines. Functionally, these signals are identical to DQ

[31:0]

DQP DQP

During write sequences, DQP is controlled by BW , DQP is controlled by BW , DQP is

DQP DQP

controlled by BW , and DQP is controlled by BW , DQP is controlled by BW , DQP is

DQP DQP

controlled by BW , DQP is controlled by BW , DQP is controlled by BW .

MODE

Input Strap Pin Mode Input. Selects the burst order of the device. Tied HIGH selects the interleaved burst

order. Pulled LOW selects the linear burst order. MODE should not change states during

operation. When left floating MODE will default HIGH, to an interleaved burst order.

TDO

TDI

JTAG serial output Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK.

Synchronous

JTAG serial input Serial data-In to the JTAG circuit. Sampled on the rising edge of TCK.

Synchronous

TMS

TCK

Test Mode Select This pin controls the Test Access Port state machine. Sampled on the rising edge of

Synchronous

TCK.

JTAG-Clock

Clock input to the JTAG circuitry.

Power Supply Power supply inputs to the core of the device.

I/O Power Supply Power supply for the I/O circuitry.

DDQ

Ground

N/A

Ground for the device. Should be connected to ground of the system.

No connects. This pin is not connected to the die.

NC/72M

N/A

Not connected to the die. Can be tied to any voltage level.

NC/144M

NC/288M

NC/576M

NC/1G

N/A

Not connected to the die. Can be tied to any voltage level.

ZZ “sleep” Input. This active HIGH input places the device in a non-time critical “sleep”

N/A

Input-

Asynchronous condition with data integrity preserved. During normal operation, this pin can be connected

to V or left floating. ZZ pin has an internal pull-down.

Document #: 38-05353 Rev. *D

Page 6 of 27

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CY7C1460AV33

CY7C1462AV33

CY7C1464AV33

Functional Overview

the internal burst counter regardless of the state of chip

enables inputs or WE. WE is latched at the beginning of a burst

cycle. Therefore, the type of access (Read or Write) is

maintained throughout the burst sequence.

The CY7C1460AV33/CY7C1462AV33/CY7C1464AV33 are

synchronous-pipelined Burst NoBL SRAMs designed specifi-

cally to eliminate wait states during Write/Read transitions. All

synchronous inputs pass through input registers controlled by

the rising edge of the clock. The clock signal is qualified with

the Clock Enable input signal (CEN). If CEN is HIGH, the clock

signal is not recognized and all internal states are maintained.

All synchronous operations are qualified with CEN. All data

outputs pass through output registers controlled by the rising

edge of the clock. Maximum access delay from the clock rise

Single Write Accesses

Write access are initiated when the following conditions are

satisfied at clock rise: (1) CEN is asserted LOW, (2) CE , CE ,

and CE are ALL asserted active, and (3) the write signal WE

is asserted LOW. The address presented to the address inputs

is loaded into the Address Register. The write signals are

latched into the Control Logic block.

(t ) is 2.6 ns (250-MHz device).

On the subsequent clock rise the data lines are automatically

tri-stated regardless of the state of the OE input signal. This

allows the external logic to present the data on DQ and DQP

Accesses can be initiated by asserting all three Chip Enables

(CE , CE , CE ) active at the rising edge of the clock. If Clock

Enable (CEN) is active LOW and ADV/LD is asserted LOW,

the address presented to the device will be latched. The

access can either be a read or write operation, depending on

(DQ

/DQP

for

for CY7C1460AV33 and DQ /DQP

a,b

CY7C1464AV33,

a,b,c,d,e,f,g,h

/DQP

a,b,c,d

a,b

for CY7C1462AV33). In addition, the address for the subse-

quent access (Read/Write/Deselect) is latched into the

Address Register (provided the appropriate control signals are

asserted).

the status of the Write Enable (WE). BW can be used to

[x]

conduct byte write operations.

Write operations are qualified by the Write Enable (WE). All

writes are simplified with on-chip synchronous self-timed write

circuitry.

On the next clock rise the data presented to DQ and DQP

(DQ

/DQP

for

CY7C1464AV33,

a,b,c,d,e,f,g,h

Three synchronous Chip Enables (CE , CE , CE ) and an

/DQP

for CY7C1460AV33 & DQ /DQP for

a,b,c,d

a,b

asynchronous Output Enable (OE) simplify depth expansion.

All operations (Reads, Writes, and Deselects) are pipelined.

ADV/LD should be driven LOW once the device has been

deselected in order to load a new address for the next

operation.

CY7C1462AV33) (or a subset for byte write operations, see

Write Cycle Description table for details) inputs is latched into

the device and the write is complete.

The data written during the Write operation is controlled by BW

(BW

for

CY7C1464AV33,

for

a,b,c,d,e,f,g,h

a,b,c,d

Single Read Accesses

CY7C1460AV33 and BW for CY7C1462AV33) signals. The

a,b

CY7C1460AV33/CY7C1462AV33/CY7C1464AV33 provides

byte write capability that is described in the Write Cycle

Description table. Asserting the Write Enable input (WE) with

the selected Byte Write Select (BW) input will selectively write

to only the desired bytes. Bytes not selected during a byte

A read access is initiated when the following conditions are

satisfied at clock rise: (1) CEN is asserted LOW, (2) CE , CE ,

and CE are ALL asserted active, (3) the Write Enable input

signal WE is deasserted HIGH, and (4) ADV/LD is asserted

LOW. The address presented to the address inputs is latched

into the Address Register and presented to the memory core

and control logic. The control logic determines that a read

access is in progress and allows the requested data to

propagate to the input of the output register. At the rising edge

of the next clock the requested data is allowed to propagate

through the output register and onto the data bus within 2.6 ns

(250-MHz device) provided OE is active LOW. After the first

clock of the read access the output buffers are controlled by

OE and the internal control logic. OE must be driven LOW in

order for the device to drive out the requested data. During the

second clock, a subsequent operation (Read/Write/Deselect)

can be initiated. Deselecting the device is also pipelined.

Therefore, when the SRAM is deselected at clock rise by one

of the chip enable signals, its output will tri-state following the

next clock rise.

write operation will remain unaltered.

synchronous

self-timed write mechanism has been provided to simplify the

write operations. Byte write capability has been included in

order to greatly simplify Read/Modify/Write sequences, which

can be reduced to simple byte write operations.

Because

the

are

CY7C1460AV33/CY7C1462AV33/CY7C1464AV33

common I/O devices, data should not be driven into the device

while the outputs are active. The Output Enable (OE) can be

deasserted HIGH before presenting data to the DQ and DQP

(DQ

/DQP

for

for CY7C1460AV33 and DQ /DQP

a,b

CY7C1464AV33,

a,b,c,d,e,f,g,h

/DQP

a,b,c,d

a,b

for CY7C1462AV33) inputs. Doing so will tri-state the output

drivers. As

(DQ

safety precaution, DQ and DQP

for CY7C1464AV33,

for CY7C1460AV33 and DQ /DQP

a,b

/DQP

a,b,c,d,e,f,g,h

/DQP

a,b,c,d

a,b

Burst Read Accesses

for CY7C1462AV33) are automatically tri-stated during the

data portion of a write cycle, regardless of the state of OE.

The CY7C1460AV33/CY7C1462AV33/CY7C1464AV33 have

an on-chip burst counter that allows the user the ability to

supply a single address and conduct up to four Reads without

reasserting the address inputs. ADV/LD must be driven LOW

in order to load a new address into the SRAM, as described in

the Single Read Access section above. The sequence of the

burst counter is determined by the MODE input signal. A LOW

input on MODE selects a linear burst mode, a HIGH selects an

interleaved burst sequence. Both burst counters use A0 and

A1 in the burst sequence, and will wrap-around when incre-

mented sufficiently. A HIGH input on ADV/LD will increment

Burst Write Accesses

The CY7C1460AV33/CY7C1462AV33/CY7C1464AV33 has

an on-chip burst counter that allows the user the ability to

supply a single address and conduct up to four WRITE opera-

tions without reasserting the address inputs. ADV/LD must be

driven LOW in order to load the initial address, as described

in the Single Write Access section above. When ADV/LD is

driven HIGH on the subsequent clock rise, the chip enables

(CE , CE , and CE ) and WE inputs are ignored and the burst

Document #: 38-05353 Rev. *D

Page 7 of 27

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CY7C1460AV33

CY7C1462AV33

CY7C1464AV33

counter is incremented. The correct BW (BW

for

a,b,c,d,e,f,g,h

Interleaved Burst Address Table

(MODE = Floating or V_DD

CY7C1464AV33, BW

for CY7C1460AV33 and BW for

a,b,c,d

a,b

)

CY7C1462AV33) inputs must be driven in each cycle of the

burst write in order to write the correct bytes of data.

First

Address

Second

Address

Third

Address

Fourth

Address

Sleep Mode

A1,A0

The ZZ input pin is an asynchronous input. Asserting ZZ

places the SRAM in a power conservation “sleep” mode. Two

clock cycles are required to enter into or exit from this “sleep”

mode. While in this mode, data integrity is guaranteed.

Accesses pending when entering the “sleep” mode are not

considered valid nor is the completion of the operation

guaranteed. The device must be deselected prior to entering

Linear Burst Address Table (MODE = GND)

the “sleep” mode. CE , CE , and CE , must remain inactive

for the duration of t

after the ZZ input returns LOW.

ZZREC

First

Second

Address

Third

Address

Fourth

Address

A1,A0

ZZ Mode Electrical Characteristics

Parameter

Description

Sleep mode standby current

Device operation to ZZ

ZZ recovery time

Test Conditions

Min.

Max.

100

Unit

ZZ > V − 0.2V

DDZZ

ZZ > V − 0.2V

ZZS

CYC

ZZ < 0.2V

ZZREC

ZZI

CYC

ZZ active to sleep current

ZZ Inactive to exit sleep current

This parameter is sampled

CYC

RZZI

Truth Table^{[1, 2, 3, 4, 5, 6, 7]}

Address

Operation

Deselect Cycle

Continue

Used

None

ADV/LD WE

CEN

CLK

L-H

Tri-State

Deselect Cycle

Read Cycle

(Begin Burst)

Read Cycle

(Continue Burst)

NOP/Dummy Read

(Begin Burst)

Dummy Read

External

L-H

Data Out (Q)

Tri-State

External

Tri-State

(Continue Burst)

Notes:

1. X = “Don't Care”, H = Logic HIGH, L = Logic LOW, CE stands for ALL Chip Enables active. BWx = L signifies at least one Byte Write Select is active, BWx =

Valid signifies that the desired byte write selects are asserted, see Write Cycle Description table for details.

2. Write is defined by WE and BW . See Write Cycle Description table for details.

3. When a write cycle is detected, all I/Os are tri-stated, even during byte writes.

4. The DQ and DQP pins are controlled by the current cycle and the OE signal.

5. CEN = H inserts wait states.

6. Device will power-up deselected and the I/Os in a tri-state condition, regardless of OE.

7. OE is asynchronous and is not sampled with the clock rise. It is masked internally during write cycles.During a read cycle DQ and DQP = Tri-state when OE

is inactive or when the device is deselected, and DQ =data when OE is active.

Document #: 38-05353 Rev. *D

Page 8 of 27

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CY7C1460AV33

CY7C1462AV33

CY7C1464AV33

Truth Table^{[1, 2, 3, 4, 5, 6, 7]}(continued)

Address

Operation

Write Cycle

(Begin Burst)

Write Cycle

(Continue Burst)

NOP/WRITE ABORT

(Begin Burst)

WRITE ABORT

(Continue Burst)

IGNORE CLOCK

EDGE

Used

ADV/LD WE

CEN

CLK

Data In (D)

External

L-H

None

Data In (D)

Tri-State

Current

(Stall)

SLEEP MODE

None

Tri-State

Partial Write Cycle Description^{[1, 2, 3, 8]}

Function (CY7C1460AV33)

Read

Write – No bytes written

Write Byte a – (DQ and DQP )

Write Byte b – (DQ and DQP )

Write Bytes b, a

Write Byte c – (DQ and DQP )

Write Bytes c, a

Write Bytes c, b

Write Bytes c, b, a

Write Byte d – (DQ and DQP )

Write Bytes d, a

Write Bytes d, b

Write Bytes d, b, a

Write Bytes d, c

Write Bytes d, c, a

Write Bytes d, c, b

Write All Bytes

[2,8]

Function (CY7C1462AV33)

Read

Write – No Bytes Written

Write Byte a – (DQ and DQP )

Write Byte b – (DQ and DQP )

Write Both Bytes

[2,8]

Function (CY7C1464AV33)

Read

Write – No Bytes Written

Write Byte X − (DQ and DQP

Write All Bytes

All BW = L

Note:

8. Table only lists a partial listing of the byte write combinations. Any combination of BW

is valid. Appropriate write will be done based on which byte write is active.

[a:d]

Document #: 38-05353 Rev. *D

Page 9 of 27

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CY7C1460AV33

CY7C1462AV33

CY7C1464AV33

Test Data-In (TDI)

IEEE 1149.1 Serial Boundary Scan (JTAG)

The TDI ball is used to serially input information into the

registers and can be connected to the input of any of the

registers. The register between TDI and TDO is chosen by the

instruction that is loaded into the TAP instruction register. TDI

is internally pulled up and can be unconnected if the TAP is

unused in an application. TDI is connected to the most signif-

icant bit (MSB) of any register. (See Tap Controller Block

Diagram.)

The CY7C1460AV33/CY7C1462AV33/CY7C1464AV33 incor-

porates a serial boundary scan test access port (TAP). This

part is fully compliant with 1149.1. The TAP operates using

JEDEC-standard 3.3V or 2.5V I/O logic level.

The

CY7C1460AV33/CY7C1462AV33/CY7C1464AV33

contains a TAP controller, instruction register, boundary scan

Disabling the JTAG Feature

Test Data-Out (TDO)

It is possible to operate the SRAM without using the JTAG

feature. To disable the TAP controller, TCK must be tied LOW

The TDO output ball is used to serially clock data-out from the

registers. The output is active depending upon the current

state of the TAP state machine. The output changes on the

falling edge of TCK. TDO is connected to the least significant

bit (LSB) of any register. (See Tap Controller State Diagram.)

(V ) to prevent clocking of the device. TDI and TMS are inter-

nally pulled up and may be unconnected. They may alternately

be connected to V through a pull-up resistor. TDO should be

left unconnected. Upon power-up, the device will come up in

a reset state which will not interfere with the operation of the

device.

TAP Controller Block Diagram

TAP Controller State Diagram

Bypass Register

TEST-LOGIC

RESET

Selection

Circuitry

Instruction Register

31 30 29

Identification Register

Selection

Circuitry

TDI

TDO

RUN-TEST/

IDLE

SELECT

DR-SCAN

SELECT

IR-SCAN

CAPTURE-DR

CAPTURE-IR

Boundary Scan Register

SHIFT-DR

SHIFT-IR

EXIT1-DR

EXIT1-IR

TCK

TMS

TAP CONTROLLER

PAUSE-DR

PAUSE-IR

EXIT2-DR

EXIT2-IR

Performing a TAP Reset

A RESET is performed by forcing TMS HIGH (VDD) for five

rising edges of TCK. This RESET does not affect the operation

of the SRAM and may be performed while the SRAM is

operating.

UPDATE-DR

UPDATE-IR

At power-up, the TAP is reset internally to ensure that TDO

comes up in a High-Z state.

The 0/1 next to each state represents the value of TMS at the

rising edge of TCK.

TAP Registers

Registers are connected between the TDI and TDO balls and

allow data to be scanned into and out of the SRAM test

circuitry. Only one register can be selected at a time through

the instruction register. Data is serially loaded into the TDI ball

on the rising edge of TCK. Data is output on the TDO ball on

the falling edge of TCK.

Test Access Port (TAP)

Test Clock (TCK)

The test clock is used only with the TAP controller. All inputs

are captured on the rising edge of TCK. All outputs are driven

from the falling edge of TCK.

Instruction Register

Test MODE SELECT (TMS)

Three-bit instructions can be serially loaded into the instruction

TDI and TDO balls as shown in the Tap Controller Block

Diagram. Upon power-up, the instruction register is loaded

with the IDCODE instruction. It is also loaded with the IDCODE

instruction if the controller is placed in a reset state as

described in the previous section.

The TMS input is used to give commands to the TAP controller

and is sampled on the rising edge of TCK. It is allowable to

leave this ball unconnected if the TAP is not used. The ball is

pulled up internally, resulting in a logic HIGH level.

Document #: 38-05353 Rev. *D

Page 10 of 27

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When the TAP controller is in the Capture-IR state, the two

least significant bits are loaded with a binary “01” pattern to

allow for fault isolation of the board-level serial test data path.

SAMPLE Z

The SAMPLE Z instruction causes the boundary scan register

to be connected between the TDI and TDO pins when the TAP

controller is in a Shift-DR state. The SAMPLE Z command puts

the output bus into a High-Z state until the next command is

given during the “Update IR” state.

Bypass Register

To save time when serially shifting data through registers, it is

sometimes advantageous to skip certain chips. The bypass

TDI and TDO balls. This allows data to be shifted through the

SRAM with minimal delay. The bypass register is set LOW

SAMPLE/PRELOAD

SAMPLE/PRELOAD is a 1149.1 mandatory instruction. When

the SAMPLE/PRELOAD instructions are loaded into the

instruction register and the TAP controller is in the Capture-DR

state, a snapshot of data on the inputs and output pins is

captured in the boundary scan register.

(V ) when the BYPASS instruction is executed.

Boundary Scan Register

The boundary scan register is connected to all the input and

bidirectional balls on the SRAM. The length of the Boundary

Scan Register for the SRAM in different packages is listed in

the Scan Register Sizes table.

The user must be aware that the TAP controller clock can only

operate at a frequency up to 20 MHz, while the SRAM clock

operates more than an order of magnitude faster. Because

there is a large difference in the clock frequencies, it is

possible that during the Capture-DR state, an input or output

will undergo a transition. The TAP may then try to capture a

signal while in transition (metastable state). This will not harm

the device, but there is no guarantee as to the value that will

be captured. Repeatable results may not be possible.

The boundary scan register is loaded with the contents of the

RAM I/O ring when the TAP controller is in the Capture-DR

state and is then placed between the TDI and TDO balls when

the controller is moved to the Shift-DR state. The EXTEST,

SAMPLE/PRELOAD and SAMPLE Z instructions can be used

to capture the contents of the I/O ring.

To guarantee that the boundary scan register will capture the

correct value of a signal, the SRAM signal must be stabilized

long enough to meet the TAP controller's capture set-up plus

The Boundary Scan Order tables show the order in which the

bits are connected. Each bit corresponds to one of the bumps

on the SRAM package. The MSB of the register is connected

to TDI, and the LSB is connected to TDO.

hold times (t and t ). The SRAM clock input might not be

captured correctly if there is no way in a design to stop (or

slow) the clock during a SAMPLE/PRELOAD instruction. If this

is an issue, it is still possible to capture all other signals and

simply ignore the value of the CK and CK# captured in the

boundary scan register.

Identification (ID) Register

The ID register is loaded with a vendor-specific, 32-bit code

during the Capture-DR state when the IDCODE command is

loaded in the instruction register. The IDCODE is hardwired

into the SRAM and can be shifted out when the TAP controller

is in the Shift-DR state. The ID register has a vendor code and

other information described in the Identification Register

Definitions table.

Once the data is captured, it is possible to shift out the data by

putting the TAP into the Shift-DR state. This places the

boundary scan register between the TDI and TDO pins.

PRELOAD allows an initial data pattern to be placed at the

latched parallel outputs of the boundary scan register cells

prior to the selection of another boundary scan test operation.

TAP Instruction Set

The shifting of data for the SAMPLE and PRELOAD phases

can occur concurrently when required—that is, while data

captured is shifted out, the preloaded data can be shifted in.

Overview

Eight different instructions are possible with the three bit

instruction register. All combinations are listed in the

Instruction Codes table. Three of these instructions are listed

as RESERVED and should not be used. The other five instruc-

tions are described in detail below.

BYPASS

When the BYPASS instruction is loaded in the instruction

advantage of the BYPASS instruction is that it shortens the

boundary scan path when multiple devices are connected

together on a board.

Instructions are loaded into the TAP controller during the

Shift-IR state when the instruction register is placed between

TDI and TDO. During this state, instructions are shifted

through the instruction register through the TDI and TDO balls.

To execute the instruction once it is shifted in, the TAP

controller needs to be moved into the Update-IR state.

EXTEST

The EXTEST instruction enables the preloaded data to be

driven out through the system output pins. This instruction also

selects the boundary scan register to be connected for serial

access between the TDI and TDO in the shift-DR controller

state.

IDCODE

The IDCODE instruction causes a vendor-specific, 32-bit code

to be loaded into the instruction register. It also places the

instruction register between the TDI and TDO balls and allows

the IDCODE to be shifted out of the device when the TAP

controller enters the Shift-DR state.

EXTEST OUTPUT BUS TRI-STATE

IEEE Standard 1149.1 mandates that the TAP controller be

able to put the output bus into a tri-state mode.

The IDCODE instruction is loaded into the instruction register

upon power-up or whenever the TAP controller is given a test

logic reset state.

The boundary scan register has a special bit located at bit #89

(for 165-FBGA package) or bit #138 (for 209-FBGA package).

Document #: 38-05353 Rev. *D

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When this scan cell, called the “extest output bus tri-state,” is

latched into the preload register during the “Update-DR” state

in the TAP controller, it will directly control the state of the

output (Q-bus) pins, when the EXTEST is entered as the

current instruction. When HIGH, it will enable the output

buffers to drive the output bus. When LOW, this bit will place

the output bus into a High-Z condition.

loaded into that shift-register cell will latch into the preload

directly control the output Q-bus pins. Note that this bit is

preset HIGH to enable the output when the device is

powered-up, and also when the TAP controller is in the

“Test-Logic-Reset” state.

Reserved

This bit can be set by entering the SAMPLE/PRELOAD or

EXTEST command, and then shifting the desired bit into that

cell, during the “Shift-DR” state. During “Update-DR,” the value

These instructions are not implemented but are reserved for

future use. Do not use these instructions.

TAP Timing

Test Clock

(TCK)

CYC

TMSS

TDIS

TMSH

Test Mode Select

(TMS)

TDIH

Test Data-In

(TDI)

TDOV

TDOX

Test Data-Out

(TDO)

DON’T CARE

UNDEFINED

[9, 10]

TAP AC Switching Characteristics Over the Operating Range

Parameter

Clock

Description

Min.

Max.

Unit

TCK Clock Cycle Time

TCK Clock Frequency

TCK Clock HIGH time

TCK Clock LOW time

MHz

TCYC

Output Times

TCK Clock LOW to TDO Valid

TCK Clock LOW to TDO Invalid

TDOV

TDOX

Set-up Times

TMS Set-up to TCK Clock Rise

TDI Set-up to TCK Clock Rise

Capture Set-up to TCK Rise

TMSS

TDIS

Hold Times

TMS Hold after TCK Clock Rise

TDI Hold after Clock Rise

TMSH

TDIH

Capture Hold after Clock Rise

Notes:

9. t and t refer to the set-up and hold time requirements of latching data from the boundary scan register.

10. Test conditions are specified using the load in TAP AC test Conditions. t /t = 1 ns.

Document #: 38-05353 Rev. *D

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3.3V TAP AC Test Conditions

2.5V TAP AC Test Conditions

Input pulse levels ................................................ V to 3.3V

Input pulse levels ................................................V to 2.5V

Input rise and fall times................................................... 1 ns

Input timing reference levels...........................................1.5V

Output reference levels...................................................1.5V

Test load termination supply voltage...............................1.5V

Input rise and fall time .....................................................1 ns

Input timing reference levels......................................... 1.25V

Output reference levels ................................................ 1.25V

Test load termination supply voltage ............................ 1.25V

3.3V TAP AC Output Load Equivalent

2.5V TAP AC Output Load Equivalent

1.5V

1.25V

50Ω

TDO

Z_O= 50Ω

20pF

TAP DC Electrical Characteristics And Operating Conditions

[11]

(0°C < TA < +70°C; V = 3.135V to 3.6V unless otherwise noted)

Parameter

Description

Test Conditions

Min.

2.4

2.0

2.9

2.1

Max.

Unit

Output HIGH Voltage

= –4.0 mA, V

= –1.0 mA, V

= –100 µA

= 3.3V

= 2.5V

OH1

DDQ

Output HIGH Voltage

Output LOW Voltage

Input HIGH Voltage

Input LOW Voltage

Input Load Current

= 3.3V

= 2.5V

= 3.3V

= 2.5V

= 3.3V

= 2.5V

= 3.3V

= 2.5V

= 3.3V

= 2.5V

OH2

OL1

OL2

DDQ

= 8.0 mA

= 1.0 mA

= 100 µA

0.4

0.2

2.0

1.7

+ 0.3

–0.3

–5

0.8

0.7

GND < V < V

DDQ

µA

Identification Register Definitions

CY7C1460AV33 CY7C1462AV33 CY7C1464AV33

Instruction Field

(1M ×36)

(2M ×18)

(512K ×72)

Description

Revision Number (31:29)

000

Describes the version number.

Reserved for Internal Use

[12]

Device Depth (28:24)

01011

001000

01011

001000

01011

Architecture/Memory Type(23:18)

001000

Defines memory type and archi-

tecture

Bus Width/Density(17:12)

100111

010111

110111

Defines width and density

Cypress JEDEC ID Code (11:1)

00000110100

00000110100 Allows unique identification of

SRAM vendor.

ID Register Presence Indicator (0)

Indicates the presence of an ID

Notes:

11. All voltages referenced to V (GND).

12. Bit #24 is “1” in the ID Register Definitions for both 2.5V and 3.3V versions of this device.

Document #: 38-05353 Rev. *D

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Scan Register Sizes

Bit Size (×36)

Bit Size (×18)

Bit Size (×72)

Instruction

Bypass

Boundary Scan Order (165-ball FBGA package)

Boundary Scan Order (209-ball FBGA package)

138

Identification Codes

Instruction

EXTEST

Code

Description

000

Captures I/O ring contents. Places the boundary scan register between TDI and TDO.

Forces all SRAM outputs to High-Z state.

IDCODE

001

010

Loads the ID register with the vendor ID code and places the register between TDI and

TDO. This operation does not affect SRAM operations.

SAMPLE Z

Captures I/O ring contents. Places the boundary scan register between TDI and TDO.

Forces all SRAM output drivers to a High-Z state.

RESERVED

011

100

Do Not Use: This instruction is reserved for future use.

SAMPLE/PRELOAD

Captures I/O ring contents. Places the boundary scan register between TDI and TDO.

Does not affect SRAM operation.

RESERVED

BYPASS

101

110

111

Do Not Use: This instruction is reserved for future use.

Places the bypass register between TDI and TDO. This operation does not affect SRAM

operations.

Document #: 38-05353 Rev. *D

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165-ball FBGA Boundary Scan Order ^[13]

CY7C1460AV33 (1M x 36), CY7C1462AV33 (2M x 18)

Bit#

ball ID

Bit#

ball ID

E11

D11

G10

F10

E10

D10

C11

A11

B11

A10

B10

Bit#

ball ID

Bit#

ball ID

10N

P11

P10

R10

R11

H11

N11

M11

L11

K11

J11

M10

L10

K10

J10

C10

Internal

H10

G11

F11

Note:

13. Bit# 89 is preset HIGH.

Document #: 38-05353 Rev. *D

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209-ball BGA Boundary Scan Order ^{[13, 14]}

CY7C14604V33 (512K x 72)

Bit#

Ball ID

Bit#

ball ID

Bit#

ball ID

Bit#

106

107

108

109

110

111

112

113

114

115

116

117

118

119

120

121

122

123

124

125

126

127

128

129

130

131

132

133

134

135

136

137

138

ball ID

10K

11J

10J

11H

10H

11G

10G

11F

10F

10E

11E

11D

10D

11C

10C

11B

10B

11A

10A

2 Mbit

1 Mbit

W11

W10

V11

V10

U11

U10

T11

T10

R11

R10

P11

P10

N11

N10

M11

M10

L11

L10

K11

100

101

102

103

104

105

Internal

Note:

14. Bit# 138 is preset HIGH.

Document #: 38-05353 Rev. *D

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Current into Outputs (LOW)......................................... 20 mA

Maximum Ratings

Static Discharge Voltage.......................................... > 2001V

(per MIL-STD-883, Method 3015)

(Above which the useful life may be impaired. For user guide-

lines, not tested.)

Latch-up Current.................................................... > 200 mA

Storage Temperature .................................–65°C to +150°C

Operating Range

Ambient Temperature with

Power Applied.............................................–55°C to +125°C

Ambient

Supply Voltage on V Relative to GND........ –0.5V to +4.6V

Range

Temperature

DDQ

Supply Voltage on V

Relative to GND ......–0.5V to +V

Commercial 0°C to +70°C

Industrial –40°C to +85°C

3.3V

–5%/+10%

2.5V –5% to

DDQ

DC to Outputs in Tri-State................... –0.5V to V

+ 0.5V

DDQ

DC Input Voltage....................................–0.5V to V + 0.5V

[15, 16]

Electrical Characteristics Over the Operating Range

DC Electrical Characteristics Over the Operating Range

Parameter

Description

Power Supply Voltage

I/O Supply Voltage

Test Conditions

Min.

3.135

2.375

2.4

Max.

Unit

3.6

for 3.3V I/O

for 2.5V I/O

DDQ

2.625

Output HIGH Voltage

Output LOW Voltage

for 3.3V I/O, I = −4.0 mA

for 2.5V I/O, I = −1.0 mA

2.0

for 3.3V I/O, I = 8.0 mA

0.4

for 2.5V I/O, I = 1.0 mA

[15]

Input HIGH Voltage

for 3.3V I/O

for 2.5V I/O

for 3.3V I/O

for 2.5V I/O

2.0

1.7

+ 0.3V

0.8

[15]

Input LOW Voltage

–0.3

–5

0.7

Input Leakage Current GND ≤ V ≤ V

except ZZ and MODE

µA

DDQ

Input Current of MODE Input = V

–30

–5

µA

Input = V

Input Current of ZZ

Input = V

µA

Output Leakage Current GND ≤ V ≤ V

Output Disabled

–5

µA

DDQ,

Operating Supply

f = f

= Max., I

= 0 mA,

4-ns cycle, 250 MHz

5-ns cycle, 200 MHz

6-ns cycle, 167 MHz

475

425

375

225

OUT

= 1/t

CYC

MAX

Automatic CE

Power-down

Current—TTL Inputs

Max. V , Device Deselected, All speed grades

SB1

SB2

SB3

SB4

≥ V or V ≤ V , f = f

MAX

1/t

CYC

Automatic CE

Power-down

Current—CMOS Inputs f = 0

Max. V , Device Deselected, All speed grades

120

200

135

≤ 0.3V or V > V

− 0.3V,

DDQ

Automatic CE

Power-down

Current—CMOS Inputs f = f

Max. V , Device Deselected, All speed grades

≤ 0.3V or V > V

− 0.3V,

CYC

DDQ

= 1/t

MAX

Automatic CE

Max. V , Device Deselected, All speed grades

Power-down

Current—TTL Inputs

≥ V or V ≤ V , f = 0

Notes:

15. Overshoot: V (AC) < V +1.5V (Pulse width less than t

/2), undershoot: V (AC)> –2V (Pulse width less than t

/2).

CYC

16. T

: Assumes a linear ramp from 0V to V (min.) within 200 ms. During this time V < V and V

< V

Power-up

DDQ DD

Document #: 38-05353 Rev. *D

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Capacitance^[17]

100 TQFP

Max.

165 FBGA

209 FBGA

Max.

Parameter

Description

Test Conditions

Max.

Unit

Input Capacitance

T = 25°C, f = 1 MHz,

6.5

= 2.5V V

= 2.5V

DDQ

Clock Input Capacitance

Input/Output Capacitance

CLK

I/O

5.5

Thermal Resistance^[17]

100 TQFP

Package

165 FBGA

Package

209 FBGA

Package

Parameters

Description

Test Conditions

Unit

Thermal Resistance

(Junction to Ambient)

Testconditionsfollowstandard

test methods and procedures

for measuring thermal

25.21

20.8

25.31

°C/W

Thermal Resistance

(Junction to Case)

2.28

3.2

4.48

°C/W

impedance, per EIA/JESD51.

AC Test Loads and Waveforms

3.3V I/O Test Load

OUTPUT

R = 317Ω

3.3V

OUTPUT

R = 50Ω

ALL INPUT PULSES

90%

V_DDQ

GND

90%

10%

Z = 50Ω

10%

5 pF

R = 351Ω

≤ 1 ns

INCLUDING

V = 1.5V

(a)

JIG AND

SCOPE

(b)

(c)

2.5V I/O Test Load

OUTPUT

R = 1667Ω

2.5V

OUTPUT

R = 50Ω

ALL INPUT PULSES

90%

V_DDQ

GND

90%

10%

Z = 50Ω

10%

5 pF

R =1538Ω

≤ 1 ns

INCLUDING

JIG AND

SCOPE

≤ 1 ns

V = 1.25V

(a)

(b)

(c)

Note:

17. Tested initially and after any design or process changes that may affect these parameters.

Document #: 38-05353 Rev. *D

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[22, 23]

Switching Characteristics Over the Operating Range

–250

Max.

–200

Max.

–167

Parameter

Description

Min.

Max.

Unit

[18]

(typical) to the first access read or write

Power

Clock

Clock Cycle Time

Maximum Operating Frequency

Clock HIGH

4.0

5.0

6.0

MHz

CYC

250

200

167

MAX

1.5

2.0

2.4

Clock LOW

Output Times

Data Output Valid After CLK Rise

OE LOW to Output Valid

2.6

3.2

3.0

3.4

EOV

DOH

CHZ

CLZ

Data Output Hold After CLK Rise

1.0

1.5

1.3

1.5

[19, 20, 21]

Clock to High-Z

2.6

3.0

3.4

[19, 20, 21]

Clock to Low-Z

[19, 20, 21]

HIGH to Output High-Z

EOHZ

EOLZ

[19, 20, 21]

OE LOW to Output Low-Z

Set-up Times

Address Set-up Before CLK Rise

Data Input Set-up Before CLK Rise

CEN Set-up Before CLK Rise

1.2

1.4

1.5

CENS

WES

ALS

CES

WE, BW Set-up Before CLK Rise

ADV/LD Set-up Before CLK Rise

Chip Select Set-up

Hold Times

Address Hold After CLK Rise

Data Input Hold After CLK Rise

CEN Hold After CLK Rise

0.3

0.4

0.5

CENH

WEH

ALH

CEH

WE, BW Hold After CLK Rise

ADV/LD Hold after CLK Rise

Chip Select Hold After CLK Rise

Notes:

18. This part has a voltage regulator internally; tpower is the time power needs to be supplied above Vdd minimum initially, before a Read or Write operation can be

initiated.

19. t

, t

, and t

are specified with AC test conditions shown in (b) of AC Test Loads. Transition is measured ± 200 mV from steady-state voltage.

CHZ CLZ EOLZ

EOHZ

20. At any given voltage and temperature, t

is less than t

and t

is less than t

to eliminate bus contention between SRAMs when sharing the same

EOHZ

EOLZ

CHZ

CLZ

data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed

to achieve High-Z prior to Low-Z under the same system conditions.

21. This parameter is sampled and not 100% tested.

22. Timing reference is 1.5V when V

3.3V and is 1.25V when V

2.5V.

DDQ=

23. Test conditions shown in (a) of AC Test Loads unless otherwise noted.

Document #: 38-05353 Rev. *D

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Switching Waveforms

[24, 25, 26]

Read/Write/Timing

CYC

CLK

CENS CENH

CEN

CES

CEH

ADV/LD

BWx

ADDRESS

DOH

OEV

CLZ

CHZ

Data

D(A1)

D(A2)

D(A2+1)

Q(A3)

Q(A4)

Q(A4+1)

D(A5)

Q(A6)

In-Out (DQ)

OEHZ

DOH

OELZ

WRITE

D(A1)

WRITE

D(A2)

BURST

WRITE

READ

Q(A3)

READ

Q(A4)

BURST

READ

WRITE

D(A5)

READ

Q(A6)

WRITE

D(A7)

DESELECT

D(A2+1)

Q(A4+1)

DON’T CARE

UNDEFINED

Notes:

24. For this waveform ZZ is tied low.

25. When CE is LOW, CE is LOW, CE is HIGH and CE is LOW. When CE is HIGH,CE is HIGH or CE is LOW or CE is HIGH.

26. Order of the Burst sequence is determined by the status of the MODE (0 = Linear, 1 = Interleaved).Burst operations are optional.

Document #: 38-05353 Rev. *D

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Switching Waveforms (continued)

[24, 25, 27]

NOP,STALL and DESELECT Cycles

CLK

CEN

ADV/LD

BWx

ADDRESS

CHZ

D(A4)

D(A1)

Q(A2)

Q(A3)

Q(A5)

Data

In-Out (DQ)

WRITE

D(A1)

READ

Q(A2)

STALL

READ

Q(A3)

WRITE

D(A4)

STALL

NOP

READ

Q(A5)

DESELECT

CONTINUE

DESELECT

DON’T CARE

UNDEFINED

[28, 29]

ZZ Mode Timing

CLK

ZZREC

ZZI

SUPPLY

DDZZ

RZZI

ALL INPUTS

(except ZZ)

DESELECT or READ Only

Outputs (Q)

High-Z

DON’T CARE

Notes:

27. The IGNORE CLOCK EDGE or STALL cycle (Clock 3) illustrated CEN being used to create a pause. A write is not performed during this cycle.

28. Device must be deselected when entering ZZ mode. See cycle description table for all possible signal conditions to deselect the device.

29. I/Os are in High-Z when exiting ZZ sleep mode.

Document #: 38-05353 Rev. *D

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Ordering Information

Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or

visit www.cypress.com for actual products offered.

Speed

(MHz)

Package

Diagram

Operating

Range

Ordering Code

Part and Package Type

167 CY7C1460AV33-167AXC 51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free

CY7C1462AV33-167AXC

Commercial

CY7C1460AV33-167BZC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm)

CY7C1462AV33-167BZC

CY7C1460AV33-167BZXC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free

CY7C1462AV33-167BZXC

CY7C1464AV33-167BGC 51-85167 209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm)

CY7C1464AV33-167BGXC

CY7C1460AV33-167AXI

CY7C1462AV33-167AXI

CY7C1460AV33-167BZI

CY7C1462AV33-167BZI

209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm) Lead-Free

51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free

lndustrial

51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm)

CY7C1460AV33-167BZXI 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free

CY7C1462AV33-167BZXI

CY7C1464AV33-167BGI

CY7C1464AV33-167BGXI

51-85167 209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm)

209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm) Lead-Free

200 CY7C1460AV33-200AXC 51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free

CY7C1462AV33-200AXC

Commercial

CY7C1460AV33-200BZC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm)

CY7C1462AV33-200BZC

CY7C1460AV33-200BZXC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free

CY7C1462AV33-200BZXC

CY7C1464AV33-200BGC 51-85167 209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm)

CY7C1464AV33-200BGXC

CY7C1460AV33-200AXI

CY7C1462AV33-200AXI

CY7C1460AV33-200BZI

CY7C1462AV33-200BZI

209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm) Lead-Free

51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free

lndustrial

51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm)

CY7C1460AV33-200BZXI 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free

CY7C1462AV33-200BZXI

CY7C1464AV33-200BGI

CY7C1464AV33-200BGXI

51-85167 209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm)

209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm) Lead-Free

Document #: 38-05353 Rev. *D

Page 22 of 27

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CY7C1462AV33

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Ordering Information (continued)

Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or

visit www.cypress.com for actual products offered.

Speed

(MHz)

Package

Diagram

Operating

Range

Ordering Code

Part and Package Type

250 CY7C1460AV33-250AXC 51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free

CY7C1462AV33-250AXC

Commercial

CY7C1460AV33-250BZC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm)

CY7C1462AV33-250BZC

CY7C1460AV33-250BZXC 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free

CY7C1462AV33-250BZXC

CY7C1464AV33-250BGC 51-85167 209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm)

CY7C1464AV33-250BGXC

CY7C1460AV33-250AXI

CY7C1462AV33-250AXI

CY7C1460AV33-250BZI

CY7C1462AV33-250BZI

209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm) Lead-Free

51-85050 100-Pin Thin Quad Flat Pack (14 x 20 x 1.4 mm) Lead-Free

Industrial

51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm)

CY7C1460AV33-250BZXI 51-85165 165-ball Fine-Pitch Ball Grid Array (15 x 17 x 1.4 mm) Lead-Free

CY7C1462AV33-250BZXI

CY7C1464AV33-250BGI

CY7C1464AV33-250BGXI

51-85167 209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm)

209-ball Fine-Pitch Ball Grid Array (14 × 22 × 1.76 mm) Lead-Free

Document #: 38-05353 Rev. *D

Page 23 of 27

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CY7C1462AV33

CY7C1464AV33

Package Diagrams

100-pin TQFP (14 x 20 x 1.4 mm) (51-85050)

16.00 0.20

1.40 0.05

14.00 0.10

100

0.30 0.08

0.65

TYP.

12° 1°

(8X)

SEE DETAIL

0.20 MAX.

1.60 MAX.

R 0.08 MIN.

0.20 MAX.

0° MIN.

SEATING PLANE

STAND-OFF

0.05 MIN.

0.15 MAX.

NOTE:

0.25

1. JEDEC STD REF MS-026

GAUGE PLANE

2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH

MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.0098 in (0.25 mm) PER SIDE

R 0.08 MIN.

0.20 MAX.

BODY LENGTH DIMENSIONS ARE MAX PLASTIC BODY SIZE INCLUDING MOLD MISMATCH

3. DIMENSIONS IN MILLIMETERS

0°-7°

0.60 0.15

0.20 MIN.

51-85050-*B

1.00 REF.

DETAIL

Document #: 38-05353 Rev. *D

Page 24 of 27

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Package Diagrams (continued)

165-ball FBGA (15 x 17 x 1.4 mm) (51-85165)

PIN 1 CORNER

BOTTOM VIEW

TOP VIEW

Ø0.05 M C

PIN 1 CORNER

Ø0.25 M C A B

Ø0.45 0.05(165X)

11 10

1.00

5.00

10.00

15.00 0.10

0.15(4X)

SEATING PLANE

51-85165-*A

Document #: 38-05353 Rev. *D

Page 25 of 27

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Package Diagrams (continued)

209-ball FBGA (14 x 22 x 1.76 mm) (51-85167)

51-85167-**

ZBT is a registered trademark of Integrated Device Technology, Inc. No Bus Latency and NoBL are trademarks of Cypress

Semiconductor. All product and company names mentioned in this document are trademarks of their respective holders.

Document #: 38-05353 Rev. *D

Page 26 of 27

of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be

used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its

products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress

products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

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CY7C1460AV33

CY7C1462AV33

CY7C1464AV33

Document History Page

Document Title: CY7C1460AV33/CY7C1462AV33/CY7C1464AV33 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM

with NoBL™ Architecture

Document Number: 38-05353

Orig. of

REV.

ECN No. Issue Date Change

Description of Change

254911

See ECN

SYT

New Data sheet

Part number changed from previous revision. New and old part number differ

by the letter “A”

303533

See ECN

SYT

Changed H9 pin from V

FBGA on Page # 5

to V on the Pin Configuration table for 209

SSQ SS

Changed the test condition from V = Min to V = Max for V in the

Electrical Characteristics table

^ReplacedΘ_JAand Θ_JCfrom TBD to respective Thermal Values for All

Packages on the Thermal Resistance Table

Changed I from 450, 400 & 350 mA to 475, 425 & 375 mA for 250, 200

and 167 MHz respectively

Changed I

from 190, 180 and 170 mA to 225 mA for 250, 200 and 167

SB1

MHz respectively

Changed I

from 80 mA to 100 mA for all frequencies

from 180, 170 & 160 mA to 200 mA for 250, 200 and 167 MHz

SB2

SB3

respectively

Changed I

from 100 mA to 110 mA for all frequencies

SB4

Changed C , C

and C to 6.5, 3 and 5.5 pF from 5, 5 and 7 pF for TQFP

IN CLK

I/O

Package

Changed t from 3.0 to 3.2 ns and t

from 1.3 ns to 1.5 ns for 200 MHz

DOH

Speed Bin

Added lead-free information for 100-pin TQFP and 165 FBGA and 209 BGA

packages

331778

See ECN

SYT

Modified Address Expansion balls in the pinouts for 165 FBGA and 209 BGA

Package as per JEDEC standards and updated the Pin Definitions accord-

ingly

Modified V

Changed C , C

test conditions

and C to 7, 7and 6 pF from 5, 5 and 7 pF for 165 FBGA

I/O

OL, OH

IN CLK

Package

Added Industrial Temperature Grade

Changed I and I from 100 and 110 mA to 120 and 135 mA respectively

SB2

SB4

Updated the Ordering Information by Shading and Unshading MPNs as per

availability

417509

See ECN

RXU

Converted from Preliminary to Final

Changed address of Cypress Semiconductor Corporation on Page# 1 from

“3901 North First Street” to “198 Champion Court”

Changed I current value in MODE from –5 & 30 µA to –30 & 5 µA respec-

tively and also Changed I current value in ZZ from –30 & 5 µA to –5 & 30

µA respectively on page# 18

Modified test condition from V < V to V < V

Modified “Input Load” to “Input Leakage Current except ZZ and MODE” in the

Electrical Characteristics Table

Replaced Package Name column with Package Diagram in the Ordering

Information table

Replaced Package Diagram of 51-85050 from *A to *B

473229

See ECN

NXR

Added the Maximum Rating for Supply Voltage on V

Relative to GND

DDQ

Changed t , t from 25 ns to 20 ns and t

from 5 ns to 10 ns in TAP

TH TL

TDOV

AC Switching Characteristics table

Updated the Ordering Information table.

Document #: 38-05353 Rev. *D

Page 27 of 27

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