Cypress CY14B101Q2 User Manual

CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
PRELIMINARY  
1 Mbit (128K x 8) Serial SPI nvSRAM  
Low Power Consumption  
Single 3V +20%, –10% operation  
Average Vcc current of 10 mA at 40 MHz operation  
Features  
1 Mbit NonVolatile SRAM  
Internally organized as 128K x 8  
Industry Standard Configurations  
Commercial and industrial temperatures  
CY14B101Q1 has identical pin configuration to industry stan-  
dard 8-pin NV Memory  
®
STORE to QuantumTrap nonvolatile elements initiated au-  
®
tomatically on power down (AutoStore ) or by user using  
HSB pin (Hardware Store) or SPI instruction (Software Store)  
®
RECALL to SRAM initiated on power up (Power Up Recall )  
or by SPI Instruction (Software RECALL)  
8-pin DFN and 16-pin SOIC Packages  
RoHS compliant  
Automatic STORE on power down with a small capacitor  
High Reliability  
Functional Overview  
Infinite Read, Write, and RECALLl cycles  
200,000 STORE cycles to QuantumTrap  
Data Retention: 20 Years  
The  
Cypress  
CY14B101Q1/CY14B101Q2/CY14B101Q3  
combines a 1 Mbit nonvolatile static RAM with a nonvolatile  
element in each memory cell. The memory is organized as 128K  
words of 8 bits each. The embedded nonvolatile elements incor-  
porate the QuantumTrap technology, creating the world’s most  
reliable nonvolatile memory. The SRAM provides infinite read  
and write cycles, while the QuantumTrap cell provides highly  
reliable nonvolatile storage of data. Data transfers from SRAM to  
the nonvolatile elements (STORE operation) takes place  
automatically at power down. On power up, data is restored to  
the SRAM from the nonvolatile memory (RECALL operation).  
Both STORE and RECALL operations can also be triggered by  
the user.  
High Speed Serial Peripheral Interface (SPI)  
40 MHz Clock rate  
Supports SPI Modes 0 (0,0) and 3 (1,1)  
Write Protection  
Hardware Protection using Write Protect (WP) Pin  
Software Protection using Write Disable Instruction  
Software Block Protection for 1/4,1/2, or entire Array  
VCC  
VCAP  
Logic Block Diagram  
Quantum Trap  
128K X 8  
Power Control  
CS  
WP  
SCK  
Instruction decode  
Write protect  
Control logic  
STORE/RECALL  
Control  
STORE  
HSB  
SRAM ARRAY  
HOLD  
RECALL  
128K X 8  
Instruction  
register  
D0-D7  
A0-A16  
Address  
Decoder  
Data I/O register  
Status register  
SO  
SI  
Cypress Semiconductor Corporation  
Document #: 001-50091 Rev. *A  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised February 2, 2009  
CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
PRELIMINARY  
SRAM Write  
Device Operation  
All writes to nvSRAM are carried out on the SRAM and do not  
use up any endurance cycles of the nonvolatile memory. This  
enables user to perform infinite write operations. A Write cycle is  
performed through the SPI WRITE instruction. The WRITE  
instruction is issued through the SI pin of the nvSRAM and  
consists of the WRITE opcode, three bytes of address, and one  
byte of data. Write to nvSRAM is done at SPI bus speed with zero  
cycle delay.  
CY14B101Q1/CY14B101Q2/CY14B101Q3 is 1 Mbit nvSRAM  
memory with a nonvolatile element in each memory cell. All the  
reads and writes to nvSRAM happen to the SRAM which gives  
nvSRAM the unique capability to handle infinite writes to the  
memory. The data in SRAM is secured by a STORE sequence  
which transfers the data in parallel to the nonvolatile Quantum  
Trap cells. A small capacitor (V  
) is used to AutoStore the  
CAP  
SRAM data in nonvolatile cells when power goes down providing  
power down data security. The Quantum Trap nonvolatile  
elements built in the reliable SONOS technology make nvSRAM  
the ideal choice for secure data storage.  
The device allows burst mode writes to be performed through  
SPI. This enables write operations on consecutive addresses  
without issuing a new WRITE instruction. When the last address  
in memory is reached, the address rolls over to 0x0000 and the  
device continues to write.  
The 1 Mbit memory array is organized as 128K words x 8 bits.  
The memory can be accessed through a standard SPI interface  
that enables very high clock speeds upto 40 MHz with zero cycle  
delay read and write cycles. This device supports SPI modes 0  
and 3 (CPOL, CPHA = 0, 0 & 1, 1) and operates as SPI slave.  
The SPI write cycle sequence is defined explicitly in the Memory  
Access section of SPI Protocol Description.  
The device is enabled using the Chip Select pin ( ) and  
accessed through Serial Input (SI), Serial Output (SO), and  
Serial Clock (SCK) pins.  
SRAM Read  
CS  
A read cycle is performed at the SPI bus speed and the data is  
read out with zero cycle delay after the READ instruction is  
performed. The READ instruction is issued through the SI pin of  
the nvSRAM and consists of the READ opcode and 3 bytes of  
address. The data is read out on the SO pin.  
This device provides the feature for hardware and software write  
protection through WP pin and WRDI instruction respectively  
along with mechanisms for block write protection (1/4, 1/2, or full  
array) using BP0 and BP1 pins in the status register. Further, the  
HOLD pin can be used to suspend any serial communication  
without resetting the serial sequence.  
This device allows burst mode reads to be performed through  
SPI. This enables reads on consecutive addresses without  
issuing a new READ instruction. When the last address in  
memory is reached in burst mode read, the address rolls over to  
0x0000 and the device continues to read.  
CY14B101Q1/CY14B101Q2/CY14B101Q3 uses the standard  
SPI opcodes for memory access. In addition to the general SPI  
instructions for read and write, it provides four special  
instructions which enable access to four nvSRAM specific  
functions: STORE, RECALL, AutoStore Disable (ASDISB), and  
AutoStore Enable (ASENB).  
The SPI read cycle sequence is defined explicitly in the Memory  
Access section of SPI Protocol Description.  
STORE Operation  
The major benefit of nvSRAM SPI over serial EEPROMs is that  
all reads and writes to nvSRAM are performed at the speed of  
SPI bus with zero delay. Therefore, no wait time is required after  
any of the memory accesses. The STORE and RECALL  
operations need finite time to complete and all memory accesses  
are inhibited during this time. While a STORE or RECALL  
operation is in progress, the busy status of the device is indicated  
by the Hardware STORE Busy (HSB) pin and also reflected on  
the RDY bit of the Status Register.  
STORE operation transfers the data from the SRAM to the  
nonvolatile Quantum Trap cells. The device stores data to the  
nonvolatile cells using one of three STORE operations:  
AutoStore, activated on device power down; Software STORE,  
activated by a STORE instruction in the SPI; Hardware STORE,  
activated by the HSB. During the STORE cycle, an erase of the  
previous nonvolatile data is first performed, followed by a  
program of the nonvolatile elements. After a STORE cycle is  
initiated, further input and output are disabled until the cycle is  
completed.  
The Device is available in three different pin configurations that  
enable the user to choose a part which fits in best in their appli-  
cation. The Feature summary is given in Table 2.  
The HSB signal or the RDY bit in the Status register can be  
monitored by the system to detect if a STORE cycle is in  
progress. The busy status of nvSRAM is indicated by HSB being  
pulled LOW or RDY bit being set to ‘1’. To avoid unnecessary  
nonvolatile STOREs, AutoStore and Hardware STORE opera-  
tions are ignored unless at least one write operation has taken  
place since the most recent STORE or RECALL cycle. Software  
initiated STORE cycles are performed regardless of whether a  
write operation has taken place.  
Table 2. Feature Summary  
Feature  
WP  
CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
Yes  
No  
No  
Yes  
No  
Yes  
Yes  
Yes  
Yes  
Yes  
V
CAP  
HSB  
No  
AutoStore  
No  
Yes  
Yes  
AutoStore Operation  
Power Up  
RECALL  
Yes  
The AutoStore operation is a unique feature of nvSRAM which  
automatically stores the SRAM data to QuantumTrap during  
power down. This Store mechanism is implemented using a  
Hardware  
STORE  
No  
No  
Yes  
Yes  
Software  
STORE  
Yes  
Yes  
Document #: 001-50091 Rev. *A  
Page 3 of 22  
 
CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
PRELIMINARY  
capacitor (V  
) and enables the device to safely STORE the  
Figure 3. AutoStore Mode  
CAP  
data in the nonvolatile memory when power goes down.  
Vcc  
During normal operation, the device draws current from V to  
CC  
charge the capacitor connected to the V  
pin. When the  
CAP  
0.1uF  
voltage on the V pin drops below V  
during power down,  
CC  
SWITCH  
the device inhibits all memory accesses to nvSRAM and  
automatically performs a conditional STORE operation using the  
Vcc  
charge from the V  
capacitor. The AutoStore operation is not  
CAP  
initiated if no write cycle has been performed since last RECALL.  
During power down, the memory accesses are inhibited after the  
CS  
VCAP  
voltage on V pin drops below V  
. To avoid inadvertent  
CC  
SWITCH  
writes, it must be ensured that CS is not left floating prior to this  
event. Therefore, during power down the device must be  
VCAP  
VSS  
deselected and CS must be allowed to follow V  
.
CC  
Figure 3 shows the proper connection of the storage capacitor  
(V ) for AutoStore operation. Refer to DC Electrical Charac-  
CAP  
teristics on page 13 for the size of the V  
.
CAP  
Note CY14B101Q1 does not support AutoStore operation. The  
user must perform Software STORE operation by using the SPI  
STORE instruction to secure the data.  
RECALL Operation  
A RECALL operation transfers the data stored in the nonvolatile  
Quantum Trap elements to the SRAM. A RECALL may be  
initiated in two ways: Hardware RECALL, initiated on power up;  
and Software RECALL, initiated by a SPI RECALL instruction.  
Software Store Operation  
Software STORE enables the user to trigger a STORE operation  
through a special SPI instruction. This operation is initiated  
irrespective of whether a write has been performed since last nv  
operation.  
Internally, RECALL is a two-step procedure. First, the SRAM  
data is cleared. Next, the nonvolatile information is transferred  
into the SRAM cells. All memory accesses are inhibited while a  
RECALL cycle is in progress. The RECALL operation does not  
alter the data in the nonvolatile elements.  
A STORE cycle takes t  
to complete, during which all the  
STORE  
memory accesses to nvSRAM are inhibited. The RDY bit of the  
Status register or the HSB pin may be polled to find the Ready  
Hardware Recall (Power Up)  
or Busy status of the nvSRAM. After the t  
cycle time is  
STORE  
completed, the SRAM is activated again for read and write  
operations.  
During power up, when V  
crosses V  
, an automatic  
CC  
SWITCH  
RECALL sequence is initiated which transfers the content of  
nonvolatile memory on to the SRAM. The data would previously  
have been stored on the nonvolatile memory through a STORE  
sequence.  
Hardware STORE and HSB pin Operation  
The HSB pin in CY14B101Q3 is used to control and  
acknowledge STORE operations. If no STORE or RECALL is in  
progress, this pin can be used to request a Hardware STORE  
cycle. When the HSB pin is driven LOW, nvSRAM conditionally  
A Power Up Recall cycle takes t time to complete and the  
memory access is disabled during this time. HSB pin can be  
used to detect the Ready status of the device. user  
FA  
initiates a STORE operation after t  
duration. An actual  
DELAY  
STORE cycle starts only if a write to the SRAM has been  
performed since the last STORE or RECALL cycle. Reads and  
Software RECALL  
Software RECALL enables the user to initiate a RECALL  
operation to restore the content of nonvolatile memory on to the  
SRAM. A Software RECALL is issued by using the SPI  
instruction for RECALL.  
Writes to the memory are inhibited for t  
duration or as long  
STORE  
as HSB pin is LOW.  
The HSB pin also acts as an open drain driver that is internally  
driven LOW to indicate a busy condition, when a STORE cycle  
(initiated by any means) or Power up RECALL is in progress.  
Upon completion of the STORE operation, the nvSRAM remains  
disabled until the HSB pin returns HIGH. Leave the HSB pin  
unconnected if not used.  
A Software RECALL takes t  
to complete during which all  
RECALL  
memory accesses to nvSRAM are inhibited. The controller must  
provide sufficient delay for the RECALL operation to complete  
before issuing any memory access instructions.  
Disabling and Enabling AutoStore  
Note CY14B101Q1/CY14B101Q2 do not have HSB pin. RDY bit  
of the SPI status register may be probed to determine the Ready  
or Busy status of nvSRAM  
If the application does not require the AutoStore feature, it can  
be disabled by using the ASDISB instruction. If this is done, the  
nvSRAM does not perform a STORE operation at power down.  
AutoStore can be re-enabled by using the ASENB instruction.  
However, these operations are not nonvolatile and if the user  
needs this setting to survive power cycle, a STORE operation  
must be performed following Autostore Disable or Enable  
operation.  
Document #: 001-50091 Rev. *A  
Page 4 of 22  
 
CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
PRELIMINARY  
Note CY14B101Q2/CY14B101Q3 has AutoStore Enabled from  
the factory. In CY14B101Q1, V pin is not present and  
not selected, data through the SI pin is ignored and the serial  
output pin (SO) remains in a high impedance state.  
CAP  
AutoStore option is not available. The Autostore Enable and  
Disable instructions to CY14B101Q1 are ignored.  
Note A new instruction must begin with the falling edge of Chip  
Select (CS). Therefore, only one opcode can be issued for each  
active Chip Select cycle.  
Note If AutoStore is disabled and V  
is not required, leave it  
CAP  
open. V  
pin must never be connected to GND. Power Up  
CAP  
Serial Clock (SCK)  
Recall operation cannot be disabled in any case.  
Serial Peripheral Interface  
SPI Overview  
Serial clock is generated by the SPI master and the communi-  
cation is synchronized with this clock after CS goes LOW.  
CY14B101Q1/CY14B101Q2/CY14B101Q3 enables SPI modes  
0 and 3 for data communication. In both these modes, the inputs  
are latched by the slave device on the rising edge of SCK and  
outputs are issued on the falling edge. Therefore, the first rising  
edge of SCK signifies the arrival of first bit (MSB) of SPI  
instruction on the SI pin. Further, all data inputs and outputs are  
synchronized with SCK.  
The SPI is a four-pin interface with Chip Select (CS), Serial Input  
(SI), Serial Output (SO) and Serial Clock (SCK) pins.  
CY14B101Q1/CY14B101Q2/CY14B101Q3 provides serial  
access to nvSRAM through SPI interface. The SPI bus on this  
device can run at speeds up to 40 MHz  
The SPI is a synchronous serial interface which uses clock and  
data pins for memory access and supports multiple devices on  
the data bus. A device on SPI bus is activated using a chip select  
pin.  
Data Transmission - SI and SO  
SPI data bus consists of two lines, SI and SO, for serial data  
communication. The SI is also referred to as MOSI (Master Out  
Slave In) and SO is referred to as MISO (Master In Slave Out).  
The master issues instructions to the slave through the SI pin,  
while the slave responds through the SO pin. Multiple slave  
devices may share the SI and SO lines as described earlier.  
The relationship between chip select, clock, and data is dictated  
by the SPI mode. This device supports SPI modes 0 and 3. In  
both these modes, data is clocked into nvSRAM on rising edge  
of SCK starting from the first rising edge after CS goes active.  
The SPI protocol is controlled by opcodes. These opcodes  
specify the commands from the bus master to the slave device.  
After CS is activated the first byte transferred from the bus  
master is the opcode. Following the opcode, any addresses and  
data are then transferred. The CS must go inactive after an  
operation is complete and before a new opcode can be issued.  
The commonly used terms used in SPI protocol are given below:  
Most Significant Bit (MSB)  
The SPI protocol requires that the first bit to be transmitted is the  
Most Significant Bit (MSB). This is valid for both address and  
data transmission.  
The 1 Mbit serial nvSRAM requires a 3-byte address for any read  
or write operation. However, since the actual address is only 17  
bits, it implies that the first seven bits which are fed in are ignored  
by the device. Although these seven bits are ‘don’t care’,  
Cypress recommends that these bits are treated as 0s to enable  
seamless transition to higher memory densities.  
SPI Master  
The SPI Master device controls the operations on a SPI bus. An  
SPI bus may have only one master with one or more slave  
devices. All the slaves share the same SPI bus lines and master  
may select any of the slave devices using the Chip Select pin.  
All the operations must be initiated by the master activating a  
slave device by pulling the CS pin of the slave LOW. The master  
also generates the Serial Clock (SCK) and all the data trans-  
mission on SI and SO lines are synchronized with this clock.  
Serial Opcode  
After the slave device is selected with CS going LOW, the first  
byte received is treated as the opcode for the intended operation.  
CY14B101Q1/CY14B101Q2/CY14B101Q3 uses the standard  
opcodes for memory accesses. In addition to the memory  
accesses, it provides additional opcodes for the nvSRAM  
specific functions: STORE, RECALL, AutoStore Enable, and  
AutoStore Disable. Refer to Table 3 on page 7 for details.  
SPI Slave  
SPI slave device is activated by the master through the Chip  
Select line. A slave device gets the Serial Clock (SCK) as an  
input from the SPI master and all the communication is synchro-  
nized with this clock. SPI slave never initiates a communication  
on the SPI bus and acts on the instruction from the master.  
Invalid Opcode  
If an invalid opcode is received, the opcode is ignored and the  
device ignores any additional serial data on the SI pin and no  
valid data is sent out on the SO pin. Opcode for a new instruction  
is recognized only after the next falling edge of CS.  
CY14B101Q1/CY14B101Q2/CY14B101Q3 operates as a SPI  
slave and may share the SPI bus with other SPI slave devices.  
Status Register  
Chip Select (CS)  
CY14B101Q1/CY14B101Q2/CY14B101Q3 has an 8-bit status  
register. The bits in the status register are used to configure the  
SPI bus. These bits are described in Table 5 on page 8.  
For selecting any slave device, the master needs to pull down  
the corresponding CS pin. Any instruction can be issued to a  
slave device only while the CS pin is LOW. When the device is  
Document #: 001-50091 Rev. *A  
Page 5 of 22  
CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
PRELIMINARY  
Figure 4. System Configuration Using SPI nvSRAM  
S C K  
M O SI  
M IS O  
SC K  
S I  
S O  
SC K  
SI  
S O  
uC ontroller  
C Y 14B 101Q x  
C Y 14B 101Q x  
C S  
H O LD  
C S  
H O LD  
C S 1  
H O LD 1  
C S 2  
H O LD 2  
The two SPI modes are shown in Figure 5 and Figure 6. The  
status of clock when the bus master is in Standby mode and not  
transferring data is:  
SPI Modes  
CY14B101Q1/CY14B101Q2/CY14B101Q3 may be driven by a  
microcontroller with its SPI peripheral running in either of the  
following two modes:  
SCK remains at 0 for Mode 0  
SPI Mode 0 (CPOL=0, CPHA=0)  
SCK remains at 1 for Mode 3  
CPOL and CPHA bits must be set in the SPI controller for either  
Mode 0 or Mode 3. The device detects the SPI mode from the  
status of SCK pin when the device is selected by bringing the CS  
pin LOW. If SCK pin is LOW when device is selected, SPI Mode  
0 is assumed and if SCK pin is HIGH, it works in SPI Mode 3.  
SPI Mode 3 (CPOL=1, CPHA=1)  
For both these modes, input data is latched-in on the rising edge  
of Serial Clock (SCK) starting from the first rising edge after CS  
goes active. If the clock starts from a HIGH state (in mode 3), the  
first rising edge, after the clock toggles, is considered. The output  
data is available on the falling edge of Serial Clock (SCK).  
Figure 6. SPI Mode 3  
Figure 5. SPI Mode 0  
CS  
CS  
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
SCK  
SI  
SCK  
SI  
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
MSB  
LSB  
MSB  
LSB  
Document #: 001-50091 Rev. *A  
Page 6 of 22  
   
CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
PRELIMINARY  
Active Power and Standby Power Modes  
When Chip Select (CS) is LOW, the device is selected, and is in  
the Active Power mode. The device consumes I current, as  
Select (CS) is HIGH, the device is deselected and the device  
goes into the Standby Power mode if a STORE or RECALL cycle  
is not in progress. If a STORE or RECALL cycle is in progress,  
device goes into the Standby Power Mode after the STORE or  
RECALL cycle is completed. In the Standby Power mode, the  
SPI Operating Features  
Power Up  
CC  
Power up is defined as the condition when the power supply is  
turned on and V crosses Vswitch voltage. During this time, the  
CC  
Chip Select (CS) must be allowed to follow the V  
Therefore, CS must be connected to V through a suitable pull  
voltage.  
CC  
CC  
up resistor. As a built-in safety feature, Chip Select (CS) is both  
edge sensitive and level sensitive. After power up, the device is  
not selected until a falling edge is detected on Chip Select (CS).  
This ensures that Chip Select (CS) must have been HIGH,  
before going Low to start the first operation.  
current drawn by the device drops to I  
.
SB  
SPI Functional Description  
As described earlier, nvSRAM performs a Power Up Recall  
operation after power up and therefore, all memory accesses are  
The CY14B101Q1/CY14B101Q2/CY14B101Q3 uses an 8-bit  
instruction register. Instructions and their opcodes are listed in  
Table 3. All instructions, addresses, and data are transferred with  
the MSB first and start with a HIGH to LOW CS transition. There  
are, in all, 12 SPI instructions which provide access to most of  
the functions in nvSRAM. Further, the WP and HOLD pins  
provide additional functionality driven through hardware.  
disabled for t  
duration after power up. The HSB pin can  
RECALL  
be probed to check the ready or busy status of nvSRAM after  
power up.  
Power On Reset  
A Power On Reset (POR) circuit is included to prevent  
inadvertent writes. At power up, the device does not respond to  
Table 3. Instruction Set  
any instruction until the V  
reaches the Power On Reset  
CC  
threshold voltage (V  
). After V  
transitions the POR  
Instruction  
Category  
Instruction  
Name  
SWITCH  
CC  
Opcode  
Operation  
threshold, the device is internally reset and performs an Power  
Up Recall operation. The device is in the following state after  
POR:  
WREN  
0000 0110 Set Write Enable  
Latch  
Deselected (after Power up, a falling edge is required on Chip  
Select (CS) before any instructions are started).  
WRDI  
0000 0100  
0000 0101  
0000 0001  
Reset Write  
Enable Latch  
Status Register  
Control Instruc-  
tions  
RDSR  
WRSR  
READ  
WRITE  
Read Status  
Register  
Standby Power mode  
Not in the Hold Condition  
Write Status  
Register  
Status register state:  
Write Enable (WEN) bit is reset to 0.  
WPEN, BP1, BP0 unchanged from previous power down  
0000 0011 Read Data From  
Memory Array  
SRAM  
Read/Write  
Instructions  
The WPEN, BP1, and BP0 bits of the Status Register are nonvol-  
atile bits and remain unchanged from the previous power down.  
0000 0010  
Write Data To  
Memory Array  
Before selecting and issuing instructions to the memory, a valid  
STORE  
0011 1100 Software STORE  
and stable V  
voltage must be applied. This voltage must  
CC  
RECALL  
0110 0000  
Software  
RECALL  
remain valid until the end of the transmission of the instruction.  
Special NV  
Instructions  
Power Down  
ASENB  
ASDISB  
0101 1001 AutoStore Enable  
0001 1001 AutoStore Disable  
At power down (continuous decay of V ), when V drops from  
CC  
CC  
the normal operating voltage and below the V  
threshold  
SWITCH  
Reserved  
- Reserved - 0001 1110  
Reserved for  
Internal use  
voltage, the device stops responding to any instruction sent to it.  
If a write cycle is in progress during power down, it is allowed  
t
time to complete after Vcc transitions below V  
,
DELAY  
SWITCH  
after which all memory accesses are inhibited and a conditional  
AutoStore operation is performed (AutoStore is not performed if  
no writes have happened since last RECALL cycle). This feature  
prevents inadvertent writes to nvSRAM from happening during  
power down.  
The SPI instructions are divided based on their functionality in  
the following types:  
Status Register Access: WRSR and RDSR instructions  
Write Protection Functions: WREN and WRDI instructions  
along with WP pin and WEN, BP0, and BP1 bits  
SRAM memory Access: READ and WRITE instructions  
nvSRAM special instructions: STORE, RECALL, ASENB,  
and ASDISB  
However, to completely avoid the possibility of inadvertent writes  
during power down, ensure that the device is deselected and is  
in Standby Power Mode, and the Chip Select (CS) follows the  
voltage applied on V  
.
CC  
Document #: 001-50091 Rev. *A  
Page 7 of 22  
 
CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
PRELIMINARY  
RDSR instruction. However, only WPEN, BP1, and BP0 bits of  
the Status Register can be modified by using WRSR instruction.  
WRSR instruction has no effect on WEN and RDY bits. The  
default value shipped from the factory for BP1, BP2 and WPEN  
bits is ‘0’.  
Status Register  
The status register bits are listed in Table 3. The status register  
consists of Ready bit (RDY) and data protection bits BP1, BP0,  
WEN, and WPEN. The RDY bit can be polled to check the Ready  
or Busy status while a nvSRAM STORE cycle is in progress. The  
status register can be modified by WRSR instruction and read by  
Table 4. Status Register Format  
Bit 7  
Bit 6  
Bit 5  
Bit 4  
Bit 3  
Bit 2  
Bit 1  
Bit 0  
WPEN (0)  
X
X
X
BP1 (0)  
BP0 (0)  
WEN  
RDY  
Table 5. Status Register Bit Definition  
Bit  
Definition  
Description  
Bit 0 (RDY)  
Ready  
Read Only bit indicates the ready status of device to perform a memory access. This bit is  
set to “1” by the device while a STORE or Software RECALL cycle is in progress.  
Bit 1 (WEN)  
Write Enable  
WEN indicates if the device is write-enabled. Setting WEN = '1' enables writes and setting  
WEN = '0' disables all write operations  
Bit 2 (BP0)  
Bit 3 (BP1)  
Block Protect bit ‘0’  
Block Protect bit ‘1’  
Used for block protection. For details see Table 6 on page 9.  
Used for block protection. For details see Table 6 on page 9.  
Bit 7 (WPEN) Write Protect Enable bit Used for enabling the function of Write Protect Pin (WP). For details see Table 7 on page 10.  
WRSR instruction is a write instruction and needs writes to be  
enabled (WEN bit set to ‘1’) using the WREN instruction before  
it is issued. The instruction is issued after the falling edge of CS  
using the opcode for WRSR followed by 8 bits of data to be  
stored in the Status Register. Since, only bits 2, 3, and 7 can be  
modified by WRSR instruction, it is recommended to leave the  
other bits as ‘0’ while writing to the Status Register  
Read Status Register (RDSR) Instruction  
The Read Status Register instruction provides access to the  
status register. This instruction is used to probe the Write Enable  
Status of the device or the Ready status of the device. RDY bit  
is set by the device to 1 whenever a STORE cycle is in progress.  
The Block Protection and WPEN bits indicate the extent of  
protection employed.  
Note In CY14B101Q1/CY14B101Q2/CY14B101Q3, the values  
written to Status Register are saved to nonvolatile memory only  
after a STORE operation. If AutoStore is disabled (or while using  
CY14B101Q1), any modifications to the Status Register must be  
secured by using a Software STORE operation  
This instruction is issued after the falling edge of CS using the  
opcode for RDSR.  
Write Status Register (WRSR) Instruction  
The WRSR instruction enables the user to write to the Status  
register. However, this instruction cannot be used to modify bit 0  
and bit 1 (WEN and RDY). The BP0 and BP1 bits can be used  
to select one of four levels of block protection. Further, WPEN bit  
can be set to ‘1’ to enable the use of Write Protect (WP) pin.  
Note CY14B101Q2 does not have WP pin. Any modification to  
bit 7 of the Status register has no effect on the functionality of  
CY14B101Q2.  
Figure 7. Read Status Register (RDSR) Instruction Timing  
CS  
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
SCK  
SI  
0
0
0
0
0
1
0
1
MSB  
LSB  
HI-Z  
SO  
D4  
D2  
D7 D6 D5  
MSB  
D3  
D1 D0  
LSB  
Data  
Document #: 001-50091 Rev. *A  
Page 8 of 22  
 
CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
PRELIMINARY  
Figure 8. Write Status Register (WRSR) Instruction Timing  
CS  
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
SCK  
Data in  
Opcode  
D2  
SI  
1
D7  
MSB  
0
0
0
D3  
0
0
0
0
0
0
0
0
0
LSB  
HI-Z  
SO  
Write Disable (WRDI) Instruction  
Write Protection and Block Protection  
Write Disable instruction disables the write by clearing the WEN  
bit to ‘0’ in order to protect the device against inadvertent writes.  
This instruction is issued following falling edge of CS followed by  
opcode for WRDI instruction. The WEN bit is cleared on the  
rising edge of CS following a WRDI instruction.  
CY14B101Q1/CY14B101Q2/CY14B101Q3 provides features  
for both software and hardware write protection using WRDI  
instruction and WP. Additionally, this device also provides block  
protection mechanism through BP0 and BP1 pins of the Status  
Register.  
Figure 10. WRDI Instruction  
The write enable and disable status of the device is indicated by  
WEN bit of the status register. The write instructions (WRSR and  
WRITE) and nvSRAM special instruction (STORE, RECALL,  
ASENB, and ASDISB) need the write to be enabled (WEN bit =  
1) before they can be issued.  
CS  
0
1
2
3
4
5
6
7
SCK  
SI  
Write Enable (WREN) Instruction  
On power up, the device is always in the write disable state. The  
following WRITE, WRSR, or nvSRAM special instruction must  
therefore be preceded by a Write Enable instruction. If the device  
is not write enabled (WEN = ‘0’), it ignores the write instructions  
and returns to the standby state when CS is brought HIGH. A  
new CS falling edge is required to re-initiate serial communi-  
cation. The instruction is issued following the falling edge of CS.  
When this instruction is used, the WEN bit of status register is  
set to ‘1’. WEN bit defaults to ‘0’ on power up.  
0
0
0
0
0
1
0
0
Hi-Z  
SO  
Block Protection  
Block protection is provided using the BP0 and BP1 pins of the  
Status register. These bits can be set using WRSR instruction  
and probed using the RDSR instruction. The nvSRAM is divided  
into four array segments. One-quarter, one-half, or all of the  
memory segments can be protected. Any data within the  
protected segment is read only. Table 6 shows the function of  
Block Protect bits.  
Note After completion of a write instruction (WRSR or WRITE)  
or nvSRAM special instruction (STORE, RECALL, ASENB, and  
ASDISB) instruction, WEN bit is cleared to ‘0’. This is done to  
provide protection from any inadvertent writes. Therefore,  
WREN instruction needs to be used before a new write  
instruction is issued.  
Figure 9. WREN Instruction  
Table 6. Block Write Protect Bits  
StatusRegister  
Bits  
CS  
Level  
Array Addresses Protected  
0
1
2
3
4
5
6
7
BP1  
BP0  
SCK  
SI  
0
0
0
1
1
0
1
0
1
None  
1 (1/4)  
2 (1/2)  
3 (All)  
0x18000-0x1FFFF  
0x10000-0x1FFFF  
0x00000-0x1FFFF  
0
0
0
0
0
1
1
0
Hi-Z  
SO  
Document #: 001-50091 Rev. *A  
Page 9 of 22  
 
CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
PRELIMINARY  
Serial Output (SO) pin. The following sequence needs to be  
followed for a read operation: After the CS line is pulled LOW to  
select a device, the read opcode is transmitted through the SI  
line followed by three bytes of address. The Most Significant  
address byte contains A16 in bit 0 and other bits as ‘don’t cares’.  
Address bits A15 to A0 are sent in the following two address  
bytes. After the last address bit is transmitted on the SI pin, the  
data (D7-D0) at the specific address is shifted out on the SO line  
on the falling edge of SCK. Any other data on SI line after the last  
address bit is ignored.  
Write Protect (WP) Pin  
The write protect pin (WP) is used to provide hardware write  
protection. WP pin enables all normal read and write operations  
when held HIGH. When the WP pin is brought LOW and WPEN  
bit is “1”, all write operations to the status register are inhibited.  
The hardware write protection function is blocked when the  
WPEN bit is “0”. This enables the user to install the device in a  
system with the WP pin tied to ground, and still write to the status  
register.  
WP pin can be used along with WPEN and Block Protect bits  
(BP1 and BP0) of the status register to inhibit writes to memory.  
When WP pin is LOW and WPEN is set to “1”, any modifications  
to status register are disabled. Therefore, the memory is  
protected by setting the BP0 and BP1 bits and the WP pin inhibits  
any modification of the status register bits, providing hardware  
write protection.  
CY14B101Q1/CY14B101Q2/CY14B101Q3 allows reads to be  
performed in bursts through SPI which can be used to read  
consecutive addresses without issuing a new READ instruction.  
If only one byte is to be read, the CS line must be driven HIGH  
after one byte of data comes out. However, the read sequence  
may be continued by holding the CS line LOW and the address  
is automatically incremented and data continues to shift out on  
SO pin. When the last data memory address (0x1FFFF) is  
reached, the address rolls over to 0x0000 and the device  
continues to read.  
Note WP going LOW when CS is still LOW has no effect on any  
of the ongoing write operations to the status register.  
Note CY14B101Q2 does not have WP pin and therefore does  
not provide hardware write protection.  
Write Sequence (WRITE)  
Table 7 summarizes all the protection features of this device  
The write operations on this device are performed through the  
Serial Input (SI) pin. To perform a write operation, if the device is  
write disabled, then the device must first be write enabled  
through the WREN instruction. When the writes are enabled  
(WEN = ‘1’), WRITE instruction is issued after the falling edge of  
CS. A WRITE instruction constitutes transmitting the WRITE  
opcode on SI line followed by 3 bytes address sequence and the  
data (D7-D0) which is to be written. The Most Significant address  
byte contains A16 in bit 0 with other bits being ‘don’t cares’.  
Address bits A15 to A0 are sent in the following two address  
bytes.  
Table 7. Write Protection Operation  
Protected Unprotected  
Status  
WPEN WP WEN  
Blocks  
Blocks  
Protected  
Writable  
Writable  
Writable  
Register  
X
0
1
1
X
0
1
1
1
Protected  
Protected  
Protected  
Protected  
Protected  
Writable  
Protected  
Writable  
X
LOW  
HIGH  
CY14B101Q1/CY14B101Q2/CY14B101Q3 enables writes to be  
performed in bursts through SPI which can be used to write  
consecutive addresses without issuing a new WRITE instruction.  
If only one byte is to be written, the CS line must be driven HIGH  
after the D0 (LSB of data) is transmitted. However, if more bytes  
are to be written, CS line must be held LOW and address is  
incremented automatically. The following bytes on the SI line are  
treated as data bytes and written in the successive addresses.  
When the last data memory address (0x1FFFF) is reached, the  
address rolls over to 0x0000 and the device continues to write.  
The WEN bit is reset to “0” on completion of a WRITE sequence.  
Memory Access  
All memory accesses are done using the READ and WRITE  
instructions. These instructions cannot be used while a STORE  
or RECALL cycle is in progress. A STORE cycle in progress is  
indicated by the RDY bit of the status register and the HSB pin.  
Read Sequence (READ)  
The read operations on this device are performed by giving the  
instruction on Serial Input pin (SI) and reading the output on  
Figure 11. Read Instruction Timing  
CS  
0
1
0
1
2
3
4
5
6
7
2
3
4
5
6
7
20 21 22 23  
0
1
2
3
4
5
6
7
SCK  
Op-Code  
17-bit Address  
A16  
SI  
0
0
0
0
0
0
0
0
0
1
1
A3  
A2 A1 A0  
0
0
0
0
MSB  
LSB  
SO  
D7 D6 D5 D4 D3  
D2  
D1  
D0  
MSB  
LSB  
Data  
Document #: 001-50091 Rev. *A  
Page 10 of 22  
 
CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
PRELIMINARY  
Figure 12. Burst Mode Read Instruction Timing  
CS  
20 21 22 23  
0
1
0
1
2
3
4
5
6
7
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
0
1
2
3
4
5
6
7
7
SCK  
Op-Code  
17-bit Address  
A16  
1
1
0
0
0
0
0
0
0
A3 A2 A1 A0  
SI  
0
0
0
0
0
0
MSB  
LSB  
Data Byte N  
Data Byte 1  
SO  
D7 D6 D5 D4  
D0  
D3 D2  
D7 D0 D7 D6 D5 D4  
D1  
D3 D2 D1 D0  
MSB  
MSB  
LSB  
LSB  
Figure 13. Write Instruction Timing  
CS  
0
1
0
1
2
3
4
5
7
2
3
4
5
6
7
20 21 22 23  
0
1
2
3
4
5
6
7
6
SCK  
Op-Code  
17-bit Address  
D4  
D2  
D1 D0  
SI  
0
0
D7 D6 D5  
LSB  
MSB  
D3  
0
0
0
0
0
0
1
0
A16  
A3  
A2 A1 A0  
0
0
0
0
0
MSB  
LSB  
Data  
HI-Z  
SO  
Figure 14. Burst Mode Write Instruction Timing  
CS  
22 23  
20 21  
0
1
0
1
2
3
4
5
6
7
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
0
1
2
3
4
5
6
7
7
SCK  
Data Byte N  
Data Byte 1  
Op-Code  
17-bit Address  
A16  
D7 D6 D5 D4  
MSB  
D7 D0 D7 D6 D5 D4  
D3 D2  
D3 D2  
1
0
0
0
0
0
0
0
0
A3 A2 A1 A0  
LSB  
D1 D0  
D1 D0  
0
0
0
0
0
0
SI  
MSB  
LSB  
HI-Z  
SO  
Table 8. nvSRAM Special Instructions  
nvSRAM Special Instructions  
Function Name  
STORE  
Opcode  
0011 1100  
0110 0000  
Operation  
Software STORE  
Software RECALL  
CY14B101Q1/CY14B101Q2/CY14B101Q3  
provides  
four  
special instructions which enables access to four nvSRAM  
specific functions: STORE, RECALL, ASDISB, and ASENB.  
Table 8 lists these instructions.  
RECALL  
ASENB  
0101 1001 AutoStore Enable  
0001 1001 AutoStore Disable  
Software STORE  
ASDISB  
When a STORE instruction is executed, nvSRAM performs a  
Software STORE operation. The STORE operation is issued  
irrespective of whether a write has taken place since last STORE  
or RECALL operation.  
To issue this instruction, the device must be write enabled (WEN  
bit = ‘1’). The instruction is performed by transmitting the STORE  
opcode on the SI pin following the falling edge of CS. The WEN  
Document #: 001-50091 Rev. *A  
Page 11 of 22  
 
CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
PRELIMINARY  
bit is cleared on the positive edge of CS following the STORE  
instruction.  
Figure 15. Software STORE Operation  
AutoStore Enable (ASENB)  
The AutoStore Enable instruction enables the AutoStore on  
CY14B101Q1. This setting is not nonvolatile and needs to be  
followed by a STORE sequence to survive the power cycle.  
CS  
To issue this instruction, the device must be write enabled (WEN  
= ‘1’). The instruction is performed by transmitting the ASENB  
opcode on the SI pin following the falling edge of CS. The WEN  
bit is cleared on the positive edge of CS following the ASENB  
instruction.  
0
1
2
3
4
5
6
7
SCK  
SI  
0
0
1
1
1
1
0
0
Note If ASDISB and ASENB instructions are executed in  
CY14B101Q1, the device is busy for the duration of software  
Hi-Z  
sequence processing time (t ). However, ASDISB and ASENB  
SS  
SO  
instructions have no effect on CY14B101Q1 as AutoStore is  
internally disabled.  
Software RECALL  
Figure 18. AutoStore Enable Operation  
When a RECALL instruction is executed, nvSRAM performs a  
Software RECALL operation. To issue this instruction, the device  
must be write enabled (WEN = ‘1’).  
CS  
0
1
2
3
4
5
6
7
The instruction is performed by transmitting the RECALL opcode  
on the SI pin following the falling edge of CS. The WEN bit is  
cleared on the positive edge of CS following the RECALL  
instruction.  
SCK  
SI  
0
1
0
1
1
0
0
1
Figure 16. Software RECALL Operation  
Hi-Z  
SO  
CS  
0
1
2
3
4
5
6
7
HOLD Pin Operation  
SCK  
SI  
The HOLD pin is used to pause the serial communication. When  
the device is selected and a serial sequence is underway, HOLD  
is used to pause the serial communication with the master device  
without resetting the ongoing serial sequence. To pause, the  
HOLD pin must be brought LOW when the SCK pin is LOW. To  
resume serial communication, the HOLD pin must be brought  
HIGH when the SCK pin is LOW (SCK may toggle during HOLD).  
While the device serial communication is paused, inputs to the  
SI pin are ignored and the SO pin is in the high impedance state.  
0
1
1
0
0
0
0
0
Hi-Z  
SO  
AutoStore Disable (ASDISB)  
AutoStore is enabled by default in CY14B101Q2/CY14B101Q3.  
The ASDISB instruction disables the AutoStore. This setting is  
not nonvolatile and needs to be followed by a STORE sequence  
to survive the power cycle.  
This pin can be used by the master with the CS pin to pause the  
serial communication by bringing the pin HOLD LOW and  
deselecting an SPI slave to establish communication with  
another slave device, without the serial communication being  
reset. The communication may be resumed at a later point by  
selecting the device and setting the HOLD pin HIGH.  
To issue this instruction, the device must be write enabled (WEN  
= ‘1’). The instruction is performed by transmitting the ASDISB  
opcode on the SI pin following the falling edge of CS. The WEN  
bit is cleared on the positive edge of CS following the ASDISB  
instruction.  
Figure 19. HOLD Operation  
CS  
Figure 17. AutoStore Disable Operation  
SCK  
CS  
0
1
2
3
4
5
6
7
HOLD  
SO  
SCK  
SI  
0
0
0
1
1
0
0
1
Hi-Z  
SO  
Document #: 001-50091 Rev. *A  
Page 12 of 22  
CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
PRELIMINARY  
Transient Voltage (<20 ns) on  
Any Pin to Ground Potential .................. –2.0V to V + 2.0V  
Maximum Ratings  
CC  
Exceeding maximum ratings may shorten the useful life of the  
device. These user guidelines are not tested.  
Package Power Dissipation  
Capability (T = 25°C) ................................................... 1.0W  
A
Storage Temperature ................................. –65°C to +150°C  
Maximum Accumulated Storage Time  
Surface Mount Lead Soldering  
Temperature (3 Seconds).......................................... +260°C  
DC Output Current (1 output at a time, 1s duration).....15 mA  
At 150°C Ambient Temperature........................ 1000h  
At 85°C Ambient Temperature..................... 20 Years  
Static Discharge Voltage.......................................... > 2001V  
(per MIL-STD-883, Method 3015)  
Ambient Temperature with  
Power Applied ............................................ –55°C to +150°C  
Latch-up Current.................................................... > 200 mA  
Supply Voltage on V Relative to GND ........–0.5V to +4.1V  
Table 9. Operating Range  
CC  
DC Voltage Applied to Outputs  
in High-Z State.......................................0.5V to V + 0.5V  
Range  
Commercial  
Industrial  
Ambient Temperature  
0°C to +70°C  
V
CC  
CC  
2.7V to 3.6V  
2.7V to 3.6V  
Input Voltage..........................................0.5V to V + 0.5V  
CC  
–40°C to +85°C  
DC Electrical Characteristics  
Over the Operating Range (V = 2.7V to 3.6V)  
CC  
Parameter  
Description  
Average V Current At f = 40 MHz  
SCK  
Test Conditions  
Min  
Max  
10  
Unit  
mA  
I
CC1  
CC2  
cc  
I
I
Average V Current All Inputs Don’t Care, V = Max.  
10  
mA  
CC  
CC  
during STORE  
Average current for duration t  
STORE  
AverageV  
Current All Inputs Don’t Care, V = Max.  
5
mA  
CC4  
CAP  
CC  
during AutoStore  
Cycle  
Average current for duration t  
STORE  
I
I
V
Standby Current  
5
mA  
µA  
SB  
[4]  
IX  
CC  
InputLeakageCurrent V = Max, V < V < V  
(except HSB)  
–1  
–100  
–1  
+1  
CC  
SS  
IN  
CC  
InputLeakageCurrent V = Max, V < V < V  
(for HSB)  
+1  
+1  
µA  
µA  
CC  
CC  
SS  
IN  
CC  
I
Off State Output  
Leakage Current  
V
= Max, V < V  
< V  
OZ  
SS  
OUT CC  
V
V
V
V
Input HIGH Voltage  
Input LOW Voltage  
2.0  
V
+ 0.5  
CC  
V
V
IH  
V
– 0.5  
SS  
0.8  
IL  
Output HIGH Voltage I  
= –2 mA  
= 4 mA  
2.4  
V
OH  
OL  
OUT  
Output LOW Voltage  
Storage Capacitor  
I
0.4  
V
OUT  
Between V  
pin and V , 5V Rated  
61  
180  
µF  
V
CAP  
SS  
CAP  
Notes  
4. The HSB pin has I  
= -2 uA for V of 2.4V when both active high and LOW drivers are disabled. When they are enabled standard V and V are valid. This  
OUT  
OH  
OH  
OL  
parameter is characterized but not tested.  
V (Storage capacitor) nominal value is 68 uF.  
CAP  
5.  
Document #: 001-50091 Rev. *A  
Page 13 of 22  
     
CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
PRELIMINARY  
Data Retention and Endurance  
Parameter  
Description  
Min  
Unit  
Years  
K
DATA  
Data Retention  
20  
R
NV  
Nonvolatile STORE Operations  
200  
C
Capacitance  
Description  
Input Capacitance  
Test Conditions  
T = 25°C, f = 1MHz,  
Max  
6
Unit  
pF  
Parameter  
C
IN  
A
V
= 3.0V  
CC  
C
Output Pin Capacitance  
8
pF  
OUT  
Thermal Resistance  
[6]  
Description  
Test Conditions  
8-SOIC  
8-DFN  
Unit  
Parameter  
ΘJA  
Thermal Resistance  
(Junction to Ambient)  
Test conditions follow standard test  
methods and procedures for measuring  
thermal impedance, per EIA / JESD51.  
TBD  
TBD  
°C/W  
ΘJC  
Thermal Resistance  
(Junction to Case)  
TBD  
TBD  
°C/W  
Figure 20. AC Test Loads and Waveforms  
577Ω  
R1  
577Ω  
R1  
3.0V  
OUTPUT  
3.0V  
OUTPUT  
R2  
789Ω  
R2  
789Ω  
5 pF  
30 pF  
AC Test Conditions  
Input Pulse Levels.................................................... 0V to 3V  
Input Rise and Fall Times (10% - 90%) ....................... <3 ns  
Input and Output Timing Reference Levels.....................1.5V  
Note  
6. These parameters are guaranteed by design and are not tested.  
Document #: 001-50091 Rev. *A  
Page 14 of 22  
 
CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
PRELIMINARY  
AC Switching Characteristics  
40MHz  
Cypress  
Parameter  
Alt.  
Parameter  
Description  
Unit  
Min  
Max  
f
t
t
t
t
t
t
t
t
t
t
t
t
t
t
f
t
t
t
t
t
t
t
t
t
t
t
t
t
t
Clock Frequency, SCK  
40  
MHz  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
SCK  
SCK  
WL  
WH  
CE  
CES  
CEH  
SU  
H
Clock Pulse Width Low  
Clock Pulse Width High  
CS High Time  
11  
11  
20  
10  
10  
5
CL  
CH  
CS  
CS Setup Time  
CSS  
CSH  
SD  
CS Hold Time  
Data In Setup Time  
Data In Hold Time  
HOLD Hold Time  
HOLD Setup Time  
Output Valid  
5
HD  
5
HH  
HD  
CD  
V
5
SH  
9
CO  
HOLD to Output High Z  
HOLD to Output Low Z  
Output Hold Time  
Output Disable Time  
15  
15  
HHZ  
HLZ  
OH  
HZ  
LZ  
0
HO  
DIS  
25  
HZCS  
Figure 21. Synchronous Data Timing (Mode 0)  
t
CS  
CS  
t
t
t
CSS  
t
CH  
CL  
CSH  
SCK  
SI  
t
t
HD  
SD  
VALID IN  
t
t
t
CO  
HZCS  
OH  
HI-Z  
HI-Z  
SO  
Figure 22. HOLD Timing  
CS  
SCK  
t
t
HH  
HH  
t
t
SH  
SH  
HOLD  
SO  
t
t
HLZ  
HHZ  
Document #: 001-50091 Rev. *A  
Page 15 of 22  
CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
PRELIMINARY  
AutoStore or Power Up RECALL  
CY‘4B101QxA  
Parameters  
Description  
Unit  
Min  
Max  
Power Up RECALL Duration  
STORE Cycle Duration  
20  
ms  
ms  
ns  
t
t
t
FA  
[9]  
8
STORE  
DELAY  
Time Allowed to Complete SRAM Cycle  
25  
V
t
Low Voltage Trigger Level  
VCC Rise Time  
2.65  
V
μs  
V
SWITCH  
150  
VCCRISE  
HSB Output Driver Disable Voltage  
1.9  
V
HDIS  
LZHSB  
HHHD  
t
t
HSB To Output Active Time  
HSB High Active Time  
5
μs  
ns  
500  
Switching Waveforms  
Figure 23. AutoStore or Power Up RECALL  
V
SWITCH  
V
HDIS  
8
V
8
t
t
Note  
VCCRISE  
Note  
STORE  
11  
STORE  
Note  
t
HHHD  
t
HHHD  
HSB OUT  
Autostore  
t
DELAY  
t
t
LZHSB  
LZHSB  
t
DELAY  
POWER-UP  
RECALL  
t
t
FA  
FA  
Read and Write  
Inhibited (RWI)  
POWER  
DOWN  
AUTOSTORE  
POWER-UP  
RECALL  
Read and Write  
BROWN  
OUT  
AUTOSTORE  
POWER-UP  
RECALL  
Read and Write  
Notes  
7.  
8. If an SRAM write has not taken place since the last nonvolatile cycle, AutoStore or Hardware Store is not initiated  
9. On a Hardware STORE, Software Store / RECALL, AutoStore Enable / Disable and AutoStore initiation, SRAM operation continues to be enabled for time t  
t
starts from the time V rises above V  
CC SWITCH.  
FA  
.
DELAY  
10. Read and Write cycles are ignored during STORE, RECALL, and while VCC is below V  
SWITCH.  
11. HSB pin is driven high to VCC only by internal 100kOhm resistor, HSB driver is disabled.  
Document #: 001-50091 Rev. *A  
Page 16 of 22  
       
CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
PRELIMINARY  
Software Controlled STORE and RECALL Cycles  
CY14B101Q1  
Parameter  
Description  
Unit  
Min  
Max  
200  
100  
t
t
RECALL Duration  
Soft Sequence Processing Time  
μs  
RECALL  
μs  
SS  
Switching Waveforms  
Figure 24. Software STORE Cycle  
CS  
0
1
2
3
4
5
6
7
SCK  
SI  
0
0
1
1
1
1
0
0
t
STORE  
Hi-Z  
RWI  
RDY  
Figure 25. Software RECALL Cycle  
CS  
0
0
1
1
2
1
3
4
5
6
7
SCK  
SI  
0
0
0
0
0
t
RECALL  
Hi-Z  
RWI  
RDY  
Notes  
12. This is the amount of time it takes to take action on a soft sequence command. Vcc power must remain HIGH to effectively register command.  
13. Commands such as STORE and RECALL lock out IO until operation is complete which further increases this time. See the specific command.  
Document #: 001-50091 Rev. *A  
Page 17 of 22  
   
CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
PRELIMINARY  
Hardware STORE Cycle  
CY14B101Q1  
Parameter  
Description  
Unit  
Min  
Max  
t
t
HSB To Output Active Time when write latch not set  
Hardware STORE Pulse Width  
25  
ns  
ns  
DHSB  
15  
PHSB  
Switching Waveforms  
Figure 26. Hardware STORE Cycle  
Write Latch set  
t
PHSB  
HSB (IN)  
t
STORE  
t
t
HHHD  
DELAY  
HSB (OUT)  
SO  
t
LZHSB  
RWI  
Write Latch not set  
t
PHSB  
HSB (IN)  
HSB pin is driven high to V  
only by Internal  
CC  
100K: resistor, HSB driver is disabled  
SRAM is disabled as long as HSB (IN) is driven LOW.  
HSB (OUT)  
RWI  
t
t
t
DELAY  
DHSB  
DHSB  
Document #: 001-50091 Rev. *A  
Page 18 of 22  
CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
PRELIMINARY  
Ordering Information  
Package  
Operating  
Range  
Ordering Code  
Package Type  
8 DFN (with WP)  
Diagram  
001-50671  
001-50671  
001-50671  
001-50671  
001-50671  
001-50671  
001-50671  
001-50671  
51-85022  
51-85022  
51-85022  
51-85022  
CY14B101Q1-LHXIT  
CY14B101Q1-LHXI  
CY14B101Q1-LHXCT  
CY14B101Q1-LHXC  
CY14B101Q2-LHXIT  
CY14B101Q2-LHXI  
CY14B101Q2-LHXCT  
CY14B101Q2-LHXC  
CY14B101Q3-SFXIT  
CY14B101Q3-SFXI  
CY14B101Q3-SFXCT  
CY14B101Q3-SFXC  
Industrial  
Commercial  
Industrial  
8 DFN (with WP)  
8 DFN (with WP)  
8 DFN (with WP)  
8 DFN (with V  
8 DFN (with V  
8 DFN (with V  
8 DFN (with V  
16 SOIC  
)
)
)
)
CAP  
CAP  
CAP  
CAP  
Commercial  
Industrial  
16 SOIC  
16 SOIC  
Commercial  
16 SOIC  
All the above parts are Pb - free. The above table contains advance information. Contact your local Cypress sales representative for availability of these parts.  
Part Numbering Nomenclature  
CY 14 B 101 Q 1-SF X C T  
Option:  
T - Tape & Reel  
Blank - Std.  
Temperature:  
C - Commercial (0 to 70  
°
C)  
I - Industrial (-40 to 85  
°C)  
Pb-Free  
Package:  
SF - 16 SOIC  
LH - 8 DFN  
1 - 8 DFN (with WP)  
2 - 8 DFN (With V  
)
CAP  
3 - 16 SOIC  
Q - Serial SPI nvSRAM  
Density:  
101 - 1 Mb  
Voltage:  
B - 3.0V  
nvSRAM  
14 - Auto Store + Software STORE + Hardware STORE  
Cypress  
Document #: 001-50091 Rev. *A  
Page 19 of 22  
CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
PRELIMINARY  
Package Diagrams  
Figure 27. 8-Pin (300 mil) DFN Package (001-50671)  
NOTES:  
1. ALL DIMENSIONS ARE IN MILLIMETERS  
2. PACKAGE WEIGHT: TBD  
3. BASED ON REF JEDEC # MO-240 EXCEPT DIMENSIONS (L) and (b)  
001-50671 *A  
Document #: 001-50091 Rev. *A  
Page 20 of 22  
CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
PRELIMINARY  
Package Diagrams (continued)  
Figure 28. 16-Pin (300 mil) SOIC (51-85022)  
51-85022 *B  
Document #: 001-50091 Rev. *A  
Page 21 of 22  
CY14B101Q1  
CY14B101Q2  
CY14B101Q3  
PRELIMINARY  
Document History Page  
Document Title: CY14B101Q1/CY14B101Q2/CY14B101Q3 1 MBit (128K x 8) Serial SPI nvSRAM  
Document Number: 001-50091  
Orig. of  
Change  
Submission  
Date  
REV.  
ECN NO.  
Description of Change  
Updated the “Feature” section  
**  
2607408  
GSIN/  
12/19/08  
GVCH/AESA  
Updated nvSRAM STORE, RECALL, AutoStore Enable/Disable sections  
Removed Soft Sequence  
Added SPI instructions for STORE, RECALL, AutoStore Enable and Disable  
Updated SPI with following changes:  
-- Added more information for protocol  
-- Added four new SPI instruction  
-- WEN bit cleared on CS going high edge after Write instructions and four  
nvSRAM special instructions  
Added RDY bit to Status Register for indicating Store/Recall in progress  
Other changes as per new EROS  
Removed 8 SOIC package  
Added two new 8DFN packages  
Changed tCO parameter to 9 ns  
*A  
2654487 GVCH/PYRS 02/04/2009 Moved from Advance information to Preliminary  
Changed part number from CY14B101QxA to CY14B101Qx  
Updated pin description of V  
pin  
CAP  
Updated Device operation and SPI peripheral interface description  
Added Factory setting values for BP1, BP2 and WPEN bits  
Updated Real Time Clock operation description  
Changed I  
from 5mA to 10mA  
CC2  
Sales, Solutions, and Legal Information  
Worldwide Sales and Design Support  
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office  
closest to you, visit us at cypress.com/sales.  
Products  
PSoC  
PSoC Solutions  
General  
Clocks & Buffers  
Wireless  
Low Power/Low Voltage  
Precision Analog  
LCD Drive  
Memories  
Image Sensors  
CAN 2.0b  
USB  
© Cypress Semiconductor Corporation, 2008-2009. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of  
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for  
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as  
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems  
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),  
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,  
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress  
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without  
the express written permission of Cypress.  
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES  
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not  
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where  
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer  
assumes all risk of such use and in doing so indemnifies Cypress against all charges.  
Use may be limited by and subject to the applicable Cypress software license agreement.  
Document #: 001-50091 Rev. *A  
Revised February 2, 2009  
Page 22 of 22  
AutoStore and QuantumTrap are trademarks of Cypress Semiconductor Corp. All products and company names mentioned in this document are the trademarks of their respective holders.  

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