Product Manual
EE25 Series
ST940813AM
ST940814AM
ST930813AM
ST930814AM
ST920813AM
ST920814AM
100384290
Rev. E
August 2007
Contents
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Drive specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Specification summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Formatted capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Default logical geometry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Physical organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Recording and interface technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Physical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Seek time. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Start/stop times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Power specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Conducted noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Voltage tolerance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Power-management modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Environmental specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Ambient temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Temperature gradient. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Altitude . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Vibration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Acoustics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Electromagnetic immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Agency certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Safety certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Electromagnetic compatibility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
FCC verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Environmental protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Corrosive environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Configuring and mounting the drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Handling and static discharge precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Jumper settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Master/slave configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Cable-select option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Drive mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.0
ATA interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.1 ATA interface signals and connector pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Supported ATA commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Identify Device command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Set Features command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Seagate Technology support services. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
EE25 Series Product Manual, Rev. E
i
ii
EE25 Series Product Manual, Rev. E
List of Figures
Figure 4.
Typical 5V startup and operation current profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Temperature vs. altitude capability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Jumper settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Mounting dimensions—top, side and end view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
EE25 Series Product Manual, Rev. E
iii
iv
EE25 Series Product Manual, Rev. E
1.0
Introduction
This manual describes the functional, mechanical and interface specifications for the following Seagate® EE25
Series drives:
ST940813AM
ST940814AM
ST930813AM
ST930814AM
ST920813AM
ST920814AM
OEM
40 GBytes
40 GBytes
30 Gbytes
30 Gbytes
20 Gbytes
20 Gbytes
Aftermarket
OEM
Aftermarket
OEM
Aftermarket
These drives provide the following key features:
• Extreme operating environment capabilities:
OEM temperature range: -30°C to 85°C
Aftermarket temperature range: -20°C to 75°C
• 5,400-RPM spindle speed and 8-Mbyte buffer combine for superior performance.
• Quiet operation. Fluid Dynamic Bearing (FDB) motor.
• High instantaneous (burst) data transfer rates (up to 100 Mbytes per second) using Ultra DMA mode 5.
• Tunneling Magnetoresistive (TMR) recording heads.
• State-of-the-art cache and on-the-fly error-correction algorithms.
• Full-track multiple-sector transfer capability without local processor intervention.
• 800 Gs nonoperating shock and 200 Gs operating shock.
• SeaTools™ diagnostic software performs a drive self-test that eliminates unnecessary drive returns.
• The 3D Defense System™, which includes Drive Defense, Data Defense, and Diagnostic Defense, offers the
industry’s most comprehensive protection for disc drives.
• Support for S.M.A.R.T. drive monitoring and reporting.
• Support for Read Multiple and Write Multiple commands.
• Support for autodetection of master/slave drives that use cable select (CSEL).
EE25 Series Product Manual, Rev. E
1
2
EE25 Series Product Manual, Rev. E
2.0
Drive specifications
Unless otherwise noted, all specifications are measured under ambient conditions, at 25°C, and nominal
power. For convenience, the phrases the drive and this drive are used throughout this manual to indicate
ST940813AM, ST940814AM, ST930813AM, ST930814AM, ST920813AM, and ST920814AM model drives.
2.1
Specification summary
The specifications listed in the following two tables are for quick reference. For details on specification mea-
surement or definition, see the appropriate section of this manual.
EE25 Series Product Manual, Rev. E
3
Table 1:
Specifications for 40 and 30 Gbyte models
ST940813AM
ST940814AM
(Aftermarket)
ST930813AM
(OEM)
ST930814AM
(Aftermarket)
Drive specification
(OEM)
Formatted (512 bytes/sector)*
Guaranteed sectors
Bytes per sector
Physical read/write heads
Discs
40 Gbytes
30 Gbytes
58,605,120
78,140,160
512
2
1
Cache
8 Mbytes
Recording density, BPI
Track density. TPI
Areal density
540.1k bits/inch at ID
119k tracks/inch at ID
2
64.3 Gbits/inch at ID
Spindle speed
5,400 RPM
Internal data transfer rate
I/O data transfer rate
ATA data-transfer modes supported
Height
321.1 Mbits/sec max
100 Mbytes/sec
PIO modes 0–4; Multiword DMA modes 0–2; Ultra DMA modes 0–5
9.5 +/-0.2 mm (0.374 +/-.008 inches)
69.85 +/-0.25 mm (2.750 +/-0.010 inches)
100.2 +/-0.25 mm (3.945 +/-0.010 inches)
100 grams (0.22 lb) (typical)
Width
Length
Weight
Average latency
5.6 msec
Power-on to ready
-20 to 85°C)
-30 to -20°C
3 sigma maximum at extreme temperature
3.0 seconds (typical)
15 seconds (typical)
30 seconds
Standby to ready
-20 to 85°C
-30 to -20°C
3 sigma maximum at extreme temperature
3.0 seconds (typical)
15 seconds (typical)
30 seconds
Track-to-track seek time
Average seek time
Average seek, read
Average seek, write
Full-stroke seek
Startup current 5V
Seek power
1.0 ms (read, typical), 1.5 ms (write, typical)
12.5 msec (typical)
12.5 msec (typical)
14.5 msec (typical)
22 msec (typical); 24 msec (max)
1.1 amps (typical)
1.90 watts / 0.38 amps (typical)
1.90 watts / 0.38 amps (typical)
1.70 watts / 0.34 amps (typical)
0.99 watts / 0.20 amps (typical)
0.26 watts / 0.05 amps (typical)***
0.26 watts / 0.05 amps (typical)***
5V ± 5%
Read power
Write power
Idle mode
Standby mode
Sleep mode
Voltage tolerance (including noise)
Ambient temperature
-30° to 85°C (OEM); -20° to 75°C (aftermarket);
–40° to 95°C (OEM and aftermarket)
Operating
Nonoperating
Temperature gradient
3°C (operating)
(°C per minute, max, noncondensing)
3°C (nonoperating)
Relative humidity (noncondensing)
5% to 90% (operating)
5% to 95% (nonoperating)
Relative humidity gradient
30% per hour max
4
EE25 Series Product Manual, Rev. E
ST940813AM
(OEM)
ST940814AM
(Aftermarket)
ST930813AM
(OEM)
ST930814AM
(Aftermarket)
Drive specification
Wet bulb temperature
40°C (operating, max)
40°C (nonoperating, max)
Altitude, operating (at 25°C)
–304.8 m to 4,419.6 m (–1000 ft to 14,500 ft)
Altitude, nonoperating (below mean sea level, max)
–304.8 m to 12,192 m (–1,000 ft to 40,000 ft)
Shock, operating
at 2 msec
200 Gs max
110 Gs max
at 11 msec
Shock, nonoperating
at 2 msec
800 Gs max
800 Gs max
400 Gs max
at 1 msec
at 0.5 msec
Vibration, operating (swept sine)
(max displacement may apply below 10 hz)
2.0 G (10 - 200 Hz)
1.0 G (200 - 500 Hz)
Vibration, nonoperating
5.0 Gs (0 to peak, 5–500 Hz); (X, Y, Z axis 0, 22, 45° angles)
(max displacement may apply below 22 hz)
Drive acoustics, sound power
Idle**
2.3 Bels (typical)
2.5 Bels (max)
Normal seek
2.5 Bels (typical)
2.7 Bels (max)
Performance seek
2.8 Bels (typical)
3.0 Bels (max)
14
Nonrecoverable read errors
1 per 10 bits read
Mean Time Before Failure (MTBF)
550,000 power-on hours
At 8,760 POH (Power On Hours) per year
Max case temperature: 70°C at the case measurement location shown in
Figure 3.
Load/Unload (U/UL) cycles
25°C, 50% relative humidity
600,000 software-controlled power on/off cycles
30,000 hard power on/off cycles
32°C, 80% relative humidity
5°C, 80% relative humidity
5°C, 10% relative humidity
60°C, 20% relative humidity
600,000 software-controlled power on/off cycles
30,000 hard power on/off cycles
Service life
Warranty
10 years (form, fit, and function replacement)
1 year standard (up to 5 years max with additional warranty purchase).
To determine the warranty for a specific drive, use a web browser to access the
following web page:
From this page, click on the “Verify Your Warranty” link. You will be asked to
provide the drive serial number, model number (or part number) and country of
purchase. The system will display the warranty information for your drive.
*One Gbyte equals one billion bytes when referring to hard drive capacity. Accessible capacity may vary depending on operating environment
and formatting.
**During periods of drive idle, some offline activity may occur, according to the S.M.A.R.T. specification, which may increase acoustic and
power to operational levels.
***Typical host systems will pull power to the drive when entering S3 and S4; while in the S3 and S4 states, drive sleep and drive standby
modes will not contribute to battery power consumption.
EE25 Series Product Manual, Rev. E
5
Table 2:
Specifications for 20 Gbyte models
ST920813AM
(OEM)
ST920814AM
(Aftermarket)
Drive specification
Formatted (512 bytes/sector)*
Guaranteed sectors
Bytes per sector
Physical read/write heads
Discs
20 Gbytes
39,070,080
512
1
1
Cache
8 Mbytes
Recording density, BPI
Track density. TPI
Areal density
540.1k bits/inch at ID
119k tracks/inch at ID
2
64.3 Gbits/inch at ID
Spindle speed
5,400 RPM
Internal data transfer rate
I/O data transfer rate
ATA data-transfer modes supported
Height
321.1 Mbits/sec max
100 Mbytes/sec
PIO modes 0–4; Multiword DMA modes 0–2; Ultra DMA modes 0–5
9.5 +/-0.2 mm (0.374 +/-.008 inches)
69.85 +/-0.25 mm (2.750 +/-0.010 inches)
100.2 +/-0.25 mm (3.945 +/-0.010 inches)
100 grams (0.22 lb) (typical)
Width
Length
Weight
Average latency
5.6 msecs
Power-on to ready
-20 to 85°C)
-30 to -20°C
3 sigma maximum at extreme temperature
3.0 seconds (typical)
15 seconds (typical)
30 seconds
Standby to ready
-20 to 85°C
-30 to -20°C
3 sigma maximum at extreme temperature
3.0 seconds (typical)
15 seconds (typical)
30 seconds
Track-to-track seek time
Average seek time
Average seek, read
Average seek, write
Full-stroke seek
Startup current 5V
Seek power
1.0 msec (read, typical), 1.5 msec (write, typical)
12.5 msec (typical)
12.5 msec (typical)
14.5 msec (typical)
22 msec (typical); 24 msec (max)
1.1 amps (typical)
1.90 watts / 0.38 amps (typical)
1.90 watts / 0.38 amps (typical)
1.70 watts / 0.34 amps (typical)
0.99 watts / 0.20 amps (typical)
0.26 watts / 0.05 amps (typical)***
0.26 watts / 0.05 amps (typical)***
5V ± 5%
Read power
Write power
Idle mode
Standby mode
Sleep mode
Voltage tolerance (including noise)
Ambient temperature
Operating
Nonoperating
-30° to 85°C (OEM); -20° to 75°C (aftermarket);
–40° to 95°C (OEM and aftermarket)
Temperature gradient
3°C per minute, noncondensing (operating)
3°C per minutes, max, noncondensing (nonoperating)
Relative humidity (noncondensing)
Relative humidity gradient
5% to 90% (operating)
5% to 95% (nonoperating)
30% per hour max
6
EE25 Series Product Manual, Rev. E
ST920813AM
(OEM)
ST920814AM
(Aftermarket)
Drive specification
Wet bulb temperature
40°C (operating, max)
40°C (nonoperating, max)
Altitude, operating (at 25°C)
–304.8 m to 4,419.6 m (–1000 ft to 14,500 ft)
Altitude, nonoperating (below mean sea level, max)
–304.8 m to 12,192 m (–1,000 ft to 40,000 ft)
Shock, operating
at 2 msec
200 Gs max
110 Gs max
at 11 msec
Shock, nonoperating
at 2 msec
800 Gs max
800 Gs max
400 Gs max
at 1 msec
at 0.5 msec
Vibration, operating
(max displacement may apply below 10 hz)
2.0 G (10 - 200 Hz)
1.0 G (200 - 500 Hz)
Vibration, nonoperating
5.0 Gs (0 to peak, 5–500 Hz)
(max displacement may apply below 22 hz)
Drive acoustics, sound power
Idle**
2.3 Bels (typical)
2.5 Bels (max)
Normal seek
2.5 Bels (typical)
2.7 Bels (max)
Performance seek
2.8 Bels (typical)
3.0 Bels (max)
14
Nonrecoverable read errors
1 per 10 bits read
Mean Time Before Failure (MTBF)
550,000 power-on hours
At 8,760 POH (Power On Hours) per year
Max case temperature: 70°C at the case measurement location shown in
Figure 3.
Load/Unload (U/UL) cycles
25°C, 50% relative humidity
600,000 software-controlled power on/off cycles
30,000 hard power on/off cycles
32°C, 80% relative humidity
5°C, 80% relative humidity
5°C, 10% relative humidity
60°C, 20% relative humidity
600,000 software-controlled power on/off cycles
30,000 hard power on/off cycles
Service life
Warranty
10 years (form, fit, and function replacement)
1 year standard (up to 5 years max with additional warranty purchase).
To determine the warranty for a specific drive, use a web browser to access the
following web page:
From this page, click on the “Verify Your Warranty” link. You will be asked to
provide the drive serial number, model number (or part number) and country of
purchase. The system will display the warranty information for your drive.
*One Gbyte equals one billion bytes when referring to hard drive capacity. Accessible capacity may vary depending on operating environment
and formatting.
**During periods of drive idle, some offline activity may occur, according to the S.M.A.R.T. specification, which may increase acoustic and
power to operational levels.
***Typical host systems will pull power to the drive when entering S3 and S4; while in the S3 and S4 states, drive sleep and drive standby
modes will not contribute to battery power consumption.
EE25 Series Product Manual, Rev. E
7
2.2
Formatted capacity
Model
Formatted capacity*
Guaranteed sectors
78,140,160
Bytes per sector
ST940813AM
ST940814AM
ST930813AM
ST930814AM
ST920813AM
ST920814AM
40 Gbytes
40 Gbytes
30 Gbytes
30 Gbytes
20 Gbytes
20 Gbytes
512
512
512
512
512
512
78,140,160
58,605,120
58,605,120
39,070,080
39,070,080
*One Gbyte equals one billion bytes when referring to hard drive capacity. Accessible capacity may vary depending on operating environment
and formatting.
2.3
Default logical geometry
Cylinders
Read/write heads
Sectors per track
16,383
16
63
LBA mode
When addressing these drives in LBA mode, all blocks (sectors) are consecutively numbered from 0 to n–1,
where n is the number of guaranteed sectors as defined above.
2.4
Physical organization
Model
Read/write heads
Number of discs
ST940813AM
ST940814AM
ST930813AM
ST930814AM
ST920813AM
ST920814AM
2
2
2
2
1
1
1
1
1
1
1
1
8
EE25 Series Product Manual, Rev. E
2.5
Recording and interface technology
Technology
Interface
Specification
Parallel ATA
Recording density BPI
Track density TPI
Areal density
540.1k bits/inch typical
119k tracks/inch typical
2
64.3 Gbits/inch max
Spindle speed
5,400 RPM (± 0.2%)
321.1 Mbits/sec max
100 Mbytes/sec max
1:1
Internal data-transfer rate
I/O data transfer rate
Interleave
Cache buffer
8 Mbytes (8,192 kbytes)
2.6
Physical characteristics
Height
(mm)
(inches)
9.5 +/–0.2
0.374 +/–0.008
Width
(mm)
(inches)
69.85 +/–0.25
2.750 +/–0.010
Length
(mm)
(inches)
100.2 +/–0.25
3.945 +/–0.010
Typical weight
(grams)
(pounds)
100
0.22
2.7
Seek time
Seek measurements are taken with nominal power. All times are measured using drive diagnostics. The spec-
ifications below are defined as follows:
• Track-to-track seek time is an average of all possible single-track seeks in both directions.
• Average seek time is a true statistical random average of at least 5,000 measurements of seeks between
random tracks, less overhead.
Note. These drives are designed to consistently meet the seek times represented in this manual. Physical
seeks, regardless of mode (such as track-to-track and average), are expected to meet or exceed the
noted values. However, due to the manner in which these drives are formatted, benchmark tests that
include command overhead or measure logical seeks may produce results that vary from these speci-
fications.
EE25 Series Product Manual, Rev. E
9
Read seek times vs temperature
85°C
msec
Typical
25°C
-20°C
-30°C
msec
msec
msec
Max
Typical
Max
Typical
Max
Typical
Max
Track-to-track
Average
1
1
0.5
11
1
0.5
11
6
1
6
11
22
5.6
15
28
13
24
14
28
11
23
5.6
17
29
Full-stroke
22
22
Average latency
5.6
5.6
Write seek times vs temperature
85°C
msec
Typical
25°C
msec
Typical
-20°C
msec
Typical
-30°C
msec
Typical Max
Max
Max
Max
Track-to-track
Average
1
2
1
2
1
7
1
7
14
23
5.6
19
30
14
25
5.6
15
27
14
25
5.6
16
30
15
25
5.6
19
30
Full-stroke
Average latency
2.8
Start/stop times
Typical
Max
Power-on to Ready
-20 to 85°C
-30 to -20°C
3 sigma at extreme temperature
3.0 seconds
15 seconds
-
8.0 seconds
-
30 seconds
Standby to Ready
-20 to 85°C
3.0 seconds
15 seconds
-
8.0 seconds
-
30 seconds
-30 to -20°C
3 sigma at extreme temperature
Spin down (secs typical at 1 to 85°C)
Spin down (secs typical at -30 to 0°C)
5.0
15
8.0
20
10
EE25 Series Product Manual, Rev. E
2.9
Power specifications
The drive receives DC power (+5V) through the interface connector.
2.9.1 Power consumption
Power requirements for the drives are listed in the table on page 11. Typical power measurements are based
on an average of drives tested, under nominal conditions, using 5.0V input voltage at 25°C ambient tempera-
ture.
• Spinup power
Spinup power is measured fromthe time ofpower-onto thetimethat the drive spindle reaches operating speed.
• Seek mode
During seek mode, the read/write actuator arm moves toward a specific position on the disc surface and does
not execute a read or write operation. Servo electronics are active. Seek mode power is measured based on
three random seek operations every 100 msecs. This mode is not typical.
• Read/write power and current
Read/write power is measured with the heads on track, based on three 63 sector read or write operations
every 100 msecs.
• Idle mode power*
Idle mode power is measured with the drive up to speed, with servo electronics active and with the heads in
a random track location.
• Standby mode
During Standby mode, the drive accepts commands, but the drive is not spinning, and the servo and read/
write electronics are in power-down model
+5V average
Power dissipation
85C
25C
-20C
-30C
Watts
4.5
Amps
0.9
Watts
Amps
1.0
Watts
Amps
1.0
Watts
6.5
Amps
1.3
Spinup, typical
Spinup, maximum
Idle, performance mode*
Idle, active*
Idle, low power mode*
Seeking
5
5
5
1.0
5.5
1.1
5.5
1.1
7.5
1.5
1.35
0.96
0.82
1.57
1.57
1.38
0.30
0.30
0.27
0.19
0.16
0.31
0.31
0.27
0.06
0.06
1.72
0.99
0.88
1.90
1.90
1.70
0.26
0.26
0.34
0.2
2.18
2.05
1.95
2.38
2.40
2.45
0.22
0.22
0.43
0.41
0.39
0.47
0.48
0.49
0.04
0.04
2.76
2.69
2.67
2.97
2.97
3.00
0.22
0.22
0.55
0.53
0.53
0.59
0.59
0.60
0.04
0.04
0.17
0.38
0.38
0.34
0.05
0.05
Read
Write
Standby
Sleep
*During periods of drive idle, some offline activity may occur according to the S.M.A.R.T. specification, which may increase acoustic and
power to operational levels.
EE25 Series Product Manual, Rev. E
11
2.9.1.1
Typical current profile
Figure 1. Typical 5V startup and operation current profile
2.9.2
Conducted noise
Input noise ripple is measured at the host system power supply across an equivalent 15-ohm resistive load on
the +5 volt line.
Using 5-volt power, the drive is expected to operate with a maximum of 100 mV peak-to-peak square-wave
injected noise at up to 10 MHz.
Note. Equivalent resistance is calculated by dividing the nominal voltage by the typical RMS read/write cur-
rent.
2.9.3
Voltage tolerance
Voltage tolerance (including noise):
5V ± 5%
12
EE25 Series Product Manual, Rev. E
2.9.4
Power-management modes
The drive provides programmable power management to provide greater energy efficiency. In most systems,
you can control power management through the system setup program. The drive features the following
power-management modes:
Power modes
Active (operating)
Idle, performance
Idle, active
Heads
Spindle
Rotating
Rotating
Rotating
Rotating
Stopped
Stopped
Buffer
Tracking
Tracking
Floating
Parked
Parked
Parked
Enabled
Enabled
Disabled
Disabled
Disabled
Disabled
Idle, low power
Standby
Sleep
• Active mode
The drive is in Active mode during the read/write and seek operations.
• Idle mode
The buffer remains enabled, and the drive accepts all commands and returns to Active mode any time disc
access is necessary.
• Standby mode
The drive enters Standby mode when the host sends a Standby Immediate command. If the host has set the
standby timer, the drive can also enter Standby mode automatically after the drive has been inactive for a
specifiable length of time. The standby timer delay is established using a Standby or Idle command. In Standby
mode, the drive buffer is enabled, the heads are parked and the spindle is at rest. The drive accepts all
commands and returns to Active mode any time disc access is necessary.
• Sleep mode
The drive enters Sleep mode after receiving a Sleep command from the host. In Sleep mode, the drive buffer
is disabled, the heads are parked and the spindle is at rest. The drive leaves Sleep mode after it receives a
Hard Reset or Soft Reset from the host. After receiving a reset, the drive exits Sleep mode and enters Standby
mode with all current translation parameters intact.
• Idle and Standby timers
Each time the drive performs an Active function (read, write or seek), the standby timer is reinitialized and
begins counting down from its specified delay times to zero. If the standby timer reaches zero before any drive
activity is required, the drive makes a transition to Standby mode. In both Idle and Standby mode, the drive
accepts all commands and returns to Active mode when disc access is necessary.
EE25 Series Product Manual, Rev. E
13
2.10
Environmental specifications
Ambient temperature
2.10.1
Ambient temperature is defined as the temperature of the environment immediately surrounding the drive.
Actual drive case temperature, measured on baseplate, should not exceed 90°C (194°F) within the operating
ambient conditions.
Operating
OEM: -30° to 85°C (-86° to 185°F)
Aftermarket: -20° to 75°C (-68° to 167°F)
Nonoperating
–40° to 95°C (–140° to 203°F)
2.10.2
2.10.3
Temperature gradient
Operating
3°C per minute (37°F per minute max), without condensation
3°C per minute (37°F per minute max)
Nonoperating
Humidity
2.10.3.1
2.10.3.2
Relative humidity
Operating 5% to 90% noncondensing (30% per hour max)
Nonoperating 5% to 95% noncondensing (30% per hour max)
Wet bulb temperature
Operating 40°C (104°F max)
Nonoperating 40°C (104°F max)
2.11
Altitude
Operating
Nonoperating
–304.8 m to 5,000 m (–1,000 ft to 16,400 ft) at 25°C.
–304.8 m to 12,192 m (–1,000 ft to 40,000 ft)
14
EE25 Series Product Manual, Rev. E
5500
5000
4500
4000
3500
3000
2500
75C
85C
-30
-10
10
30
50
70
90
Temperature (degrees C)
Altitude (m)
Figure 2. Temperature vs. altitude capability
2.11.1
Shock
All shock specifications assume that the drive is mounted securely with the input shock applied at the drive
mounting screws. Shock may be applied in the X, Y or Z axis.
2.11.1.1
Operating shock
These drives comply with the performance levels specified in this document when subjected to a maximum
operating shock of 200 Gs based on half-sine shock pulses of 2 msec. Shocks should not be repeated more
than two times per second. For 11 msec shock duration, these drives will withstand operating shock up to 110
Gs.
2.11.1.2
Nonoperating shock
The nonoperating shock level that the drive can experience without incurring physical damage or degradation
in performance when subsequently put into operation is 800 Gs based on a nonrepetitive half-sine shock pulse
of 2 msec duration.
The nonoperating shock level that the drive can experience without incurring physical damage or degradation
in performance when subsequently put into operation is 800 Gs based on a nonrepetitive half-sine shock pulse
of 1 msec duration.
The nonoperating shock level that the drive can experience without incurring physical damage or degradation
in performance when subsequently put into operation is 400 Gs based on a nonrepetitive half-sine shock pulse
of 0.5 msec duration.
EE25 Series Product Manual, Rev. E
15
2.11.2
Vibration
All vibration specifications assume that the drive is mounted securely with the input vibration applied at the
drive mounting screws. Vibration may be applied in the X, Y or Z axis.
2.11.2.1
Operating vibration
The following table lists the maximum vibration levels that the drive may experience while meeting the perfor-
mance standards specified in this document.
10–200 Hz 2.0 G (0 to peak)
200–500 Hz 1.0 G (0 to peak)
2.11.2.2
Nonoperating vibration
The following table lists the maximum nonoperating vibration that the drive may experience without incurring
physical damage or degradation in performance when subsequently put into operation.
5–500 Hz
5.0 Gs (0 to peak). Max displacement may apply below 22 Hz.
2.12
Acoustics
Drive acoustics are measured as overall A-weighted acoustic sound power levels (no pure tones). All mea-
surements are consistent with ISO document 7779. Sound power measurements are taken under essentially
free-field conditions over a reflecting plane. For all tests, the drive is oriented with the cover facing upward.
Note. For seek mode tests, the drive is placed in seek mode only. The number of seeks per second is
defined by the following equation:
(Number of seeks per second = 0.4 / (average latency + average access time)
Acoustic mode
Idle*
Normal Seek
Performance Seek
2.3 bels (typ)
2.5 bels (max)
2.5 bels (typ)
2.7 bels (max)
2.8 bels (typ)
3.0 bels (max)
*During periods of drive idle, some offline activity may occur according to the S.M.A.R.T. specification, which may increase acoustic and
power to operational levels.
16
EE25 Series Product Manual, Rev. E
2.13
Electromagnetic immunity
When properly installed in a representative host system, the drive operates without errors or degradation in
performance when subjected to the rradio frequency (RF) environments defined in the following table:
Performance
level
Reference
standard
Test
Description
Electrostatic discharge
Radiated RF immunity
Contact, HCP, VCP: ± 4 kV; Air: ± 8 kV
B
A
EN 61000-4-2: 95
EN 61000-4-3: 96
80 to 2,000 MHz, 10 V/m,
80% AM with 1 kHz sine
900 MHz, 3 V/m, 50% pulse modulation @ 200 Hz
ENV 50204: 95
Electrical fast transient
Surge immunity
± 1 kV on AC mains, ± 0.5 kV on external I/O
± 1 kV differential, ± 2 kV common, AC mains
B
B
A
EN 61000-4-4: 95
EN 61000-4-5: 95
EN 61000-4-6: 97
Conducted RF immunity
150 kHz to 80 MHz, 3 Vrms, 80% AM with 1 kHz
sine
Power Frequency H-field 1 A/m, 50Hz/60Hz, 3 axes
immunity
A
EN 61000-4-8: 97
EN 61000-4-11: 94
Voltage dips, interrupts
30% Reduction for 25 cycles
>95% Reduction for 250 cycles
>95%, 0.5 cycles
C
C
B
A - 1) No upset or degradation in performance beyond manufacturer’s specified limits.
2) No data loss.
B - 1) Unit self recovers without user intervention.
2) No data loss.
C - 1) Upset OK provided that unit will function after user intervention.
2.14
Reliability
Measurement type
Specification
14
Nonrecoverable read errors
1 per 10 bits read, max.
Mean time between failures
(MTBF)
550,000 power-on hours
At 8,760 POH (Power On Hours) per year
Load/Unload (U/UL)
25°C, 50% relative humidity
600,000 software-controlled power on/off cycles
30,000 hard power on/off cycles
32°C, 80% relative humidity
5°C, 80% relative humidity
5°C, 10% relative humidity
60°C, 20% relative humidity
600,000 software-controlled power on/off cycles
30,000 hard power on/off cycles
Service Life
Warranty
10 years, form, fit, and function replacement
1 year standard (up to 5 years with additional warranty purchase).
To determine the warranty for a specific drive, use a web browser to access the fol-
lowing web page:
From this page, click on the “Verify Your Warranty” link. You will be asked to pro-
vide the drive serial number, model number (or part number) and country of pur-
chase. The system will display the warranty information for your drive.
EE25 Series Product Manual, Rev. E
17
2.15
Agency certification
Safety certification
2.15.1
The drives are recognized in accordance with UL 1950 and CSA C22.2 (950) and meet all applicable sections
of IEC950 and EN 60950 as tested by TUV North America.
2.15.2
Electromagnetic compatibility
Hard drives that display the CE mark comply with the European Union (EU) requirements specified in the Elec-
tromagnetic Compatibility Directive (89/336/EEC). Testing is performed to the levels specified by the product
standards for Information Technology Equipment (ITE). Emission levels are defined by EN 55022, Class B and
the immunity levels are defined by EN 55024.
Seagate uses an independent laboratory to confirm compliance with the EC directives specified in the previous
paragraph. Drives are tested in representative end-user systems. Although CE-marked Seagate drives comply
with the directives when used in the test systems, we cannot guarantee that all systems will comply with the
directives. The drive is designed for operation inside a properly designed enclosure, with properly shielded I/O
cable (if necessary) and terminators on all unused I/O ports. Computer manufacturers and system integrators
should confirm EMC compliance and provide CE marking for their products.
Korean RRL
If these drives have the Korea Ministry of Information and Communication (MIC) logo, they comply with para-
graph 1 of Article 11 of the Electromagnetic Compatibility control Regulation and meet the Electromagnetic
Compatibility (EMC) Framework requirements of the Radio Research Laboratory (RRL) Ministry of Information
and Communication Republic of Korea.
These drives have been tested and comply with the Electromagnetic Interference/Electromagnetic Susceptibil-
ity (EMI/EMS) for Class B products. Drives are tested in a representative, end-user system by a Korean-recog-
nized lab.
• EUT name: EE25 Series
• Certificate numbers:STX-EE251 (B)
• Trade name or applicant: Seagate Technology International
• Manufacturing date: March 2006
• Manufacturer/nationality: Seagate Technology International
Australian C-Tick (N176)
If these models have the C-Tick marking, they comply with the Australia/New Zealand Standard AS/NZS3548
1995 and meet the Electromagnetic Compatibility (EMC) Framework requirements of the Australian Communi-
cation Authority (ACA).
2.15.3
FCC verification
These drives are intended to be contained solely within a personal computer or similar enclosure (not attached
as an external device). As such, each drive is considered to be a subassembly even when it is individually mar-
keted to the customer. As a subassembly, no Federal Communications Commission verification or certification
of the device is required.
Seagate Technology LLC has tested this device in enclosures as described above to ensure that the total
assembly (enclosure, disc drive, motherboard, power supply, etc.) does comply with the limits for a Class B
computing device, pursuant to Subpart J, Part 15 of the FCC rules. Operation with noncertified assemblies is
likely to result in interference to radio and television reception.
18
EE25 Series Product Manual, Rev. E
Radio and television interference. This equipment generates and uses radio frequency energy and if not
installed and used in strict accordance with the manufacturer’s instructions, may cause interference to radio
and television reception.
This equipment is designed to provide reasonable protection against such interference in a residential installa-
tion. However, there is no guarantee that interference will not occur in a particular installation. If this equipment
does cause interference to radio or television, which can be determined by turning the equipment on and off,
you are encouraged to try one or more of the following corrective measures:
• Reorient the receiving antenna.
• Move the device to one side or the other of the radio or TV.
• Move the device farther away from the radio or TV.
• Plug the computer into a different outlet so that the receiver and computer are on different branch outlets.
If necessary, you should consult your dealer or an experienced radio/television technician for additional sug-
gestions. You may find helpful the following booklet prepared by the Federal Communications Commission:
How to Identify and Resolve Radio-Television Interference Problems. This booklet is available from the Super-
intendent of Documents, U.S. Government Printing Office, Washington, DC 20402. Refer to publication num-
ber 004-000-00345-4.
2.16
Environmental protection
Seagate designs its products to meet environmental protection requirements worldwide, including regulations
restricting certain chemical substances.
2.16.1
European Union Restriction of Hazardous Substances (RoHS)
The European Union Restriction of Hazardous Substances (RoHS) Directive restricts the presence of chemical
substances, including Lead (Pb), in electronic products effective July 2006.
A number of parts and materials in Seagate products are procured from external suppliers. We rely on the
rep-resentations of our suppliers regarding the presence of RoHS substances in these parts and materials. Our
supplier contracts require compliance with our chemical substance restrictions, and our suppliers document
their compliance with our requirements by providing material content declarations for all parts and materials for
the disc drives documented in this publication. Current supplier declarations include disclosure of the inclusion
of any RoHS-regulated substance in such parts or materials.
Seagate also has internal systems in place to ensure ongoing compliance with the RoHS Directive and all laws
and regulations which restrict chemical content in electronic products. These systems include standard
operat-ing procedures that ensure that restricted substances are not utilized in our manufacturing operations,
labora-tory analytical validation testing, and an internal auditing process to ensure that all standard operating
procedures are complied with.
2.17
Corrosive environment
Seagate electronic drive components pass accelerated corrosion testing equivalent to 10 years exposure to
light industrial environments containing sulfurous gases, chlorine and nitric oxide, classes G and H per ASTM
B845. However, this accelerated testing cannot duplicate every potential application environment.
Users should use caution exposing any electronic components to uncontrolled chemical pollutants and corro-
sive chemicals as electronic drive component reliability can be affected by the installation environment. The sil-
ver, copper, nickel and gold films used in Seagate products are especially sensitive to the presence of sulfide,
chloride, and nitrate contaminants. Sulfur is found to be the most damaging. In addition, electronic components
should never be exposed to condensing water on the surface of the printed circuit board assembly (PCBA) or
EE25 Series Product Manual, Rev. E
19
exposed to an ambient relative humidity greater than 95%. Materials used in cabinet fabrication, such as vulca-
nized rubber, that can outgas corrosive compounds should be minimized or eliminated. The useful life of any
electronic equipment may be extended by replacing materials near circuitry with sulfide-free alternatives.
20
EE25 Series Product Manual, Rev. E
3.0
Configuring and mounting the drive
This section contains the specifications and instructions for configuring and mounting the drive.
3.1
Handling and static discharge precautions
After unpacking, and before installation, the drive may be exposed to potential handling and electrostatic dis-
charge (ESD) hazards. Observe the following standard handling and static-discharge precautions:
Caution:
• Keep the drive in the electrostatic discharge (ESD) bag until you are ready for installation to limit the drive’s
exposure to ESD.
• Before handling the drive, put on a grounded wrist strap, or ground yourself frequently by touching the metal
chassis of a computer that is plugged into a grounded outlet. Wear a grounded wrist strap throughout the entire
installation procedure.
• Handle the drive only by its edges or frame.
• The drive is fragile—handle it with care. Do not press down on the drive top cover.
• Always rest the drive on a padded, antistatic surface until you mount it in the computer.
• Do not touch the connector pins or the printed circuit board.
• Do not remove the factory-installed labels from the drive or cover them with additional labels. Removal voids
the warranty. Some factory-installed labels contain information needed to service the drive. Other labels are
used to seal out dirt and contamination.
3.2
Jumper settings
3.2.1
Master/slave configuration
Use the options jumper block shown in Figure 3 to configure the drive for operation. This jumper block is the
4-pin header adjacent to pins 1 and 2 of the I/O signal pins. For additional information about using the Cable
The “Drive is master (or single drive)” option is the default setting.
Drive is master (or single drive)
Drive is slave
Cable select
Figure 3. Jumper settings
EE25 Series Product Manual, Rev. E
21
3.2.2
Cable-select option
Computers that use cable select determine the master and slave drives by selecting or deselecting pin 28,
CSEL, on the interface bus. Master and slave drives are determined by their physical position on the cable. To
enable cable select, set a jumper as shown in Figure 3. Refer to your computer manual to determine whether
your computer supports this option.
3.3
Drive mounting
You can mount the drive using four screws in the side-mounting holes or four screws in the bottom-mounting
holes. See Figure 4 for drive mounting dimensions (dimensions in inches with mm in parentheses). Follow
these important mounting precautions when mounting the drive:
• Allow a minimum clearance of 0.030 inches (0.76 mm) around the entire perimeter of the drive for cooling.
• Use only M3 x 0.5 mounting screws.
• Do not overtighten the mounting screws (maximum torque: 4.0 inch-lb).
• Four (4) threads (0.080 inches) minimum screw engagement recommended.
3.945 +/-0.010
(100.2 +/-.25)
0.490 +/- .010
(12.446 +/- .254)
.157
(3.9878)
.399
(10.135)
0.673 +/- .010
(17.09 +/- .254)
Breather Hole
Do not cover
or seal.
2.750 +/- .010
(69.85 +/- .25)
3.567
(90.60)
Recommended case temp.
measurement location
.551
2X M3 X 0.5-6H
Mounting holes
Both sides
(13.99)
.374 +/- .008
(9.5 +/- .2)
.12 min. full thread
2X .118 (3.00)
Both sides
4X M3 X 0.5-6H
Mounting holes
.10 min. full thread
3.567
(90.60)
.551
(13.99)
inches
(mm)
2.430
(61.72)
.399
(10.135)
.160
(4.06)
Detail A
Detail A
Figure 4. Mounting dimensions—top, side and end view
22
EE25 Series Product Manual, Rev. E
4.0
ATA interface
These drives use the industry-standard ATA task file interface that supports 16-bit data transfers. It supports
ATA programmed input/output (PIO) modes 0–4; multiword DMA modes 0–2, and Ultra DMA modes 0–5. The
drive also supports the use of the IORDY signal to provide reliable high-speed data transfers.
For detailed information about the ATA interface, refer to the AT Attachment - 6 with Packet Interface (ATA/
ATAPI-6), ANSI NCITS 361-200, subsequently referred to as the ATA-6 Standard.
4.1
ATA interface signals and connector pins
The following table summarizes the signals on the 44-pin ATA interface connector. For a detailed description of
these signals, refer to the ATA-6 Standard.
Connector
Contact
Cable
Conductor
Cable
Conductor
Connector
Contact
Signal Name
Signal Name
RESET-
DD7
1
1
2
2
Ground
DD8
3
3
4
4
DD6
5
5
6
6
DD9
DD5
7
7
8
8
DD10
DD4
9
9
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
DD11
DD3
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
DD12
DD2
DD13
DD1
DD14
DD0
DD15
Ground
DMARQ
DIOW-
DIOR-
IORDY
DMACK-
INTRQ
DA1
(keypin)
Ground
Ground
Ground
PSYNC:CSEL
Ground
IOCS16-
PDIAG-
DA2
DA0
CS1FX-
DASP-
+5 V (Logic)
Ground (Return)
CS3FX-
Ground
+5V (Motor)
No connection
EE25 Series Product Manual, Rev. E
23
4.1.1
Supported ATA commands
The following table lists ATA-standard commands that the drive supports. For a detailed description of the ATA
commands, refer to the ATA-6 Standard.
Command name
ATA-standard commands
ATA Device Configuration Overlay
ATA Service
Command code (in hex)
B1
A2
H
H
Check Power Mode
Download Microcode
Execute Device Diagnostics
Flush Cache
98 E5
H,
H
92
90
H
H
E7
H
H
Format Track (Legacy)
Identify Device
50
EC
H
Idle
97 E3
H,
H
Idle Immediate
95 E1
H,
H
Initialize (Set) Device Parameters
Read Buffer
91
H
E4
H
Read DMA
C8 C9
H,
H
Read Log Extended
Read Multiple
22
H
C4
H
H
Read Native Max Address
Read Sectors
F8
20 21
H,
H
Read Verify Sectors
Recalibrate
40 41
H, H
10
H
Security Disable Password
Security Erase Prepare
Security Erase Unit
Security Freeze Lock
Security Set Password
Security Unlock
F6
F3
F4
F5
F1
F2
H
H
H
H
H
H
H
H
Seek
70
91
Set Drive Parameters
Set Features
EF
H
H
Set Max Address
F9
24
EE25 Series Product Manual, Rev. E
Command name
Command code (in hex)
Note: Individual Set Max com-
mands are identified by the value Password
placed in the Set Max Features
register as defined to the right.
Address
00
01
02
03
H
H
H
H
H
Lock
Unlock
Freeze Lock 04
Set Multiple Mode
Sleep
C6
H
99 E6
H,
H
S.M.A.R.T.
B0
H
Standby
96 E2
H, H
Standby Immediate
Vendor Unique
Write Buffer
94 E0
H, H
9A FA FB
H,
H
H,
H
E8
Write DMA
CA CB
H, H
Write Log Extended
Write Multiple
Write Sectors
32
H
C5
H
30 31
H,
H
ATA-standard power-management commands
Check Power Mode
Idle
98 or E5
H
H
H
H
H
H
H
97 or E3
H
Idle Immediate
95 or E1
H
Sleep
99 or E6
H
Standby
96 or E2
H
Standby Immediate
ATA-standard security commands
Security Set Password
Security Unlock
94 or E0
H
F1
F2
F3
F4
F5
F6
H
H
H
H
H
H
Security Erase Prepare
Security Erase Unit
Security Freeze Lock
Security Disable Password
EE25 Series Product Manual, Rev. E
25
4.1.2
Identify Device command
The Identify Device command (command code EC ) transfers information about the drive to the host following
H
power up. The data, shown below, is organized as a single 512-byte block of data. All reserved bits or words
should be set to zero. Parameters listed with an “x” are drive-specific or vary with the state of the drive. See
Section 2.0 on page 3 for default parameter settings.
The following commands contain drive-specific features that may not be included in the ATA-6 Standard.
Word
Description
Value
0C5A
0
Configuration information:
• Bit 15: 0 = ATA; 1 = ATAPI
• Bit 7: removable media
• Bit 6: removable controller
• Bit 0: reserved
H
1
Number of logical cylinders
16,383
2
ATA-reserved
0000
16
H
3
Number of logical heads
4
Retired
0000
0000
H
H
5
Retired
6
Number of logical sectors per logical track: 63
Retired
003F
H
H
7–9
10–19
20
0000
Serial number: (20 ASCII characters, 0000 = none)
ASCII
H
Retired
Retired
Obsolete
0000
0400
0000
x.xx
H
H
H
21
22
23–26
Firmware revision
(8 ASCII character string, padded with blanks to end of string)
27–46
Drive model number (40 ASCII characters, padded with blanks
to end of string)
ST940813AM
ST940814AM
ST930813AM
ST930814AM
ST920813AM
ST920814AM
47
(Bits 7–0) Maximum sectors per interrupt on Read multiple and
Write multiple (16)
8010
H
48
49
50
51
52
53
54
55
56
Reserved
0000
H
Standard Standby timer, IORDY supported and may be disabled
ATA-reserved
2F00
H
H
H
H
H
0000
0200
0200
0007
PIO data-transfer cycle timing mode
Retired
Words 54–58, 64–70 and 88 are valid
Number of current logical cylinders
Number of current logical heads
Number of current logical sectors per logical track
xxxx
xxxx
xxxx
H
H
H
26
EE25 Series Product Manual, Rev. E
Word
57–58
59
Description
Value
Current capacity in sectors
xxxx
xxxx
H
H
Number of sectors transferred during a Read Multiple or Write
Multiple command
60–61
Total number of user-addressable LBA sectors available
ST940813AM = 78,140,160
ST940814AM = 78,140,160
ST930813AM = 58,605,120
ST930814AM = 58,605,120
ST920813AM = 39,070,080
ST920814AM = 39,070,080
62
63
Retired
0000
H
H
Multiword DMA active and modes supported (see note following
this table)
xx07
64
65
Advanced PIO modes supported (modes 3 and 4 supported)
0003
0078
H
Minimum multiword DMA transfer cycle time per word (120
nsec)
H
66
Recommended multiword DMA transfer cycle time per word
(120 nsec)
0078
H
67
Minimum PIO cycle time without IORDY flow control (240 nsec)
Minimum PIO cycle time with IORDY flow control (120 nsec)
ATA-reserved
00F0
H
H
H
H
H
68
0078
0000
0000
0000
69–74
75
Queue depth
76–79
80
ATA-reserved
Major version number
007E
H
H
81
Minor version number
0000
82
Command sets supported
346B
H
83
Command sets supported
7D01
H
84
Command sets support extension
Command sets enabled
4003
H
85
34xx
H
H
86
Command sets enabled
3xxx
87
Command sets enable extension
4003
H
88
Ultra DMA support and current mode
(see note following this table)
xx3F
H
89
Security erase time
0000
0000
0040
H
H
H
90
Enhanced security erase time
Advanced power management value
Master password revision code
Hardware reset value (see description following this table)
Auto acoustic management setting
ATA-reserved
91
92
FFFE
H
93
xxxx
xxxx
H
94
H
95–127
128
0000
0001
H
Security status
H
EE25 Series Product Manual, Rev. E
27
Word
Description
Value
xxxx
129–159
160–254
255
Seagate-reserved
ATA-reserved
Integrity word
H
0000
xxA5
H
H
Note. See the bit descriptions below for words 63, 88, 93 and 94 of the Identify Drive data.
Description (if bit is set to 1)
Bit
0
Word 63
Multiword DMA mode 0 is supported.
Multiword DMA mode 1 is supported.
Multiword DMA mode 2 is supported.
Multiword DMA mode 0 is currently active.
Multiword DMA mode 1 is currently active.
Multiword DMA mode 2 is currently active.
1
2
8
9
10
Bit
0
Word 88
Ultra DMA mode 0 is supported.
Ultra DMA mode 1 is supported.
Ultra DMA mode 2 is supported.
Ultra DMA mode 3 is supported.
Ultra DMA mode 4 is supported.
Ultra DMA mode 0 is currently active.
Ultra DMA mode 1 is currently active.
Ultra DMA mode 2 is currently active.
Ultra DMA mode 3 is currently active.
Ultra DMA mode 4 is currently active.
Ultra DMA mode 5 is currently active.
1
2
3
4
8
9
10
11
12
13
Bit
Word 93
13
1 = 80-conductor cable detected, CBLID above VIH
0 = 40-conductor cable detected, CBLID below VIL
28
EE25 Series Product Manual, Rev. E
4.1.3
Set Features command
This command controls the implementation of various features that the drive supports. When the drive receives
this command, it sets BSY, checks the contents of the Features register, clears BSY and generates an inter-
rupt. If the value in the register does not represent a feature that the drive supports, the command is aborted.
Power-on default has the read look-ahead and write caching features enabled. The acceptable values for the
Features register are defined as follows:
02
03
Enable write cache (default).
H
Set transfer mode (based on value in Sector Count register).
H
Sector Count register values:
00
01
08
09
Set PIO mode to default (PIO mode 2).
Set PIO mode to default and disable IORDY (PIO mode 2).
PIO mode 0
H
H
H
H
PIO mode 1
0A
PIO mode 2
H
0B
PIO mode 3
H
0C
PIO mode 4 (default)
Multiword DMA mode 0
Multiword DMA mode 1
Multiword DMA mode 2
Ultra DMA mode 0
H
20
21
22
40
41
42
43
44
45
H
H
H
H
H
H
H
H
H
Ultra DMA mode 1
Ultra DMA mode 2
Ultra DMA mode 3
Ultra DMA mode 4
Ultra DMA mode 5
05
55
82
Enable advanced power management
Disable read look-ahead (read cache) feature.
Disable write cache.
H
H
H
AA
Enable read look-ahead (read cache) feature (default).
Report full capacity available
H
F1
H
Note. At power-on or after a hardware or software reset the default values of the features are as indicated
above.
EE25 Series Product Manual, Rev. E
29
30
EE25 Series Product Manual, Rev. E
5.0
Seagate Technology support services
Internet
For information regarding Seagate products and services, visit www.seagate.com. Worldwide support is
available 24 hours daily by email for your questions.
Presales Support:
Technical Support:
Warranty Support:
mySeagate
my.seagate.com is the industry's first Web portal designed specifically for OEMs and distributors. It provides
self-service access to critical applications, personalized content and the tools that allow our partners to
manage their Seagate account functions. Submit pricing requests, orders and returns through a single,
password-protected Web interface-anytime, anywhere in the world.
spp.seagate.com
spp.seagate.com supports Seagate resellers with product information, program benefits and sales tools. You
may register for customized communications that are not available on the web. These communications contain
product launch, EOL, pricing, promotions and other channel-related information. To learn more about the
benefits or to register, go to spp.seagate.com, any time, from anywhere in the world.
Seagate Service Centers
Presales Support
Our Presales Support staff can help you determine which Seagate products are best suited for your specific
application or computer system, as well as product availability and compatibility.
Technical Support
Seagate technical support is available to assist you online at support.seagate.com or through one of our call
centers. Have your system configuration information and your “ST” model number available.
SeaTDD™ (+1-405-324-3655) is a telecommunications device for the deaf (TDD). You can send questions or
comments 24 hours daily and exchange messages with a technical support specialist during normal business
hours for the call center in your region.
EE25 Series Product Manual, Rev. E
31
Customer Service Operations
Warranty Service
Seagate offers worldwide customer support for Seagate products. Seagate distributors, OEMs and other direct
customers should contact their Seagate Customer Service Operations (CSO) representative for warranty-
related issues. Resellers or end users of drive products should contact their place of purchase or Seagate
warranty service for assistance. Have your serial number and model or part number available.
Data Recovery Services
Seagate offers data recovery services for all formats and all brands of storage media. Our data recovery
services labs are currently located throughout the world. . Additional information, including an online request
form and data loss prevention resources, is available at http://services.seagate.com/index.aspx
Authorized Service Centers
Seagate Service Centers are available on a global basis for the return of defective products. Contact your
customer support representative for the location nearest you.
USA/Canada/Latin America support services
For an extensive list of telephone numbers to technical support, presales and warranty service in USA/
Global Customer Support
Presales, Technical, and Warranty Support
Call Center
USA, Canada,
and Mexico
Toll-free
Direct dial
1-800-SEAGATE
+1-405-324-4700
Data Recovery Services
Call Center
Toll-free
Direct dial
FAX
USA, Canada,
and Mexico
1-800-475-01435
+1-905-474-2162
1-800-475-0158
+1-905-474-2459
Europe, the Middle East and Africa Support Services
For an extensive list of telephone numbers to technical support, presales and warranty service in Europe, the
Asia/Pacific Support Services
For an extensive list of telephone numbers to technical support, presales and warranty service in Asia/Pacific,
32
EE25 Series Product Manual, Rev. E
discs 8
dissipation 11
Index
Numerics
A
acoustics 16
E
enclosures 18
errors 17
altitude 14
autodetection 1
European Union Restriction of Hazardous Substanc-
es 19
B
BPI 9
burst 1
F
C
frequency 17
certification 18
commands 24
G
compliance 18
H
CSEL 22
C-Tick 18
cycles 17
handling 21
height 9
humidity 14
I
D
density 9
IEC950 18
EE25 Series Product Manual, Rev. E
33
interference 18
precautions 22
interleave 9
R
J
K
L
length 9
Load/Unload 17
register 29
reliability 17
resistance 12
M
master/slave 1
modes 23
monitoring 1
MTBF 17
RF 17
RoHS 19
S
S.M.A.R.T. 25
N
screws 22
SeaTools 1
sectors 8
Seek 24
Seeking 11
shock 15
noise 12
O
P
pins 23
PIO 23
signals 23
34
EE25 Series Product Manual, Rev. E
36
EE25 Series Product Manual, Rev. E
Seagate Technology LLC
920 Disc Drive, Scotts Valley, California 95066-4544, USA
Publication Number: 100384290, Rev. E, Printed in U.S.A.
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