C156-E228-02EN
MCM3064SS, MCM3130SS
MCP3064SS, MCP3130SS
OPTICAL DISK DRIVES
PRODUCT MANUAL
Revision History
(1/1)
Revised section (*1)
(Added/Deleted/Altered)
Edition
Date
Details
01
02
March, 2002
January, 2004
—
—
—
—
*1
Section(s) with asterisk (*) refer to the previous edition when those were deleted.
C156-E228-02EN
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Preface
This manual describes the MCM3064SS, MCM3130SS, MCP3064SS and MCP3130SS
3.5-inch optical disk drives.
This manual provides an overview of the above optical disk drives, and explains their
specifications, the requirements and procedures for installing them in a system, and how to
clean them.
The manual is intended for users who have a basic understanding of optical disk drives and
their use in computer systems.
See "Manual Organization" for details of the organization of manuals related to optical
disk drives and the scope of this manual. Use the other manuals shown in "Manual
Organization" together with this manual when necessary.
The organization of this manual, related reference manual and conventions for alert
messages follow.
Overview of Manual
This manual consists of the following six chapters, glossary, and abbreviation:
Chapter 1 General Description
This chapter introduces the MCM3064SS, MCM3130SS, MCP3064SS and MCP3130SS
optical disk drives and describes their features, drive configuration, and system
configuration.
Chapter 2 Specifications
This chapter describes the specifications of the MCM3064SS, MCM3130SS, MCP3064SS
and MCP3130SS optical disk drives and the specifications of optical disk cartridges.
Chapter 3 Installation Requirements
This chapter describes the basic environmental, mounting, power supply, and connection
requirements for installing the MCM3064SS, MCM3130SS, MCP3064SS and
MCP3130SS optical disk drives in a user system.
Chapter 4 Installation
This chapter describes installation of the MCM3064SS, MCM3130SS, MCP3064SS and
MCP3130SS optical disk drive and includes:
•
•
•
•
•
•
Notes on handling the drive
Connection modes
Settings
Mounting
Cable connections
Operation, confirmation, and preparation for use after installation
C156-E228-02EN
i
Preface
•
Notes on removing the installed drive
Chapter 5 Operation and Cleaning
This chapter describes how to operate and clean MCM3064SS, MCM3130SS,
MCP3064SS and MCP3130SS optical disk drives. This chapter also describes how to
operate and clean optical disk cartridges.
Chapter 6 Diagnostics and Maintenance
This chapter describes the self-diagnostics functions and maintenance of the MCM3064SS,
MCM3130SS, MCP3064SS and MCP3130SS optical disk drives.
Chapter 7 SCSI BUS
This chapter describes in detail the configuration, physical/electrical conditions, interface
protocol and operation of the SCSI (Small Computer System Interface), which is an
interface for connecting the MCM3064SS, MCM3130SS, MCP3064SS and MCP3130SS
optical disk drive and the user system to each other.
Glossary
The glossary describes the technical terms that need to be understood to read this manual.
Acronyms and Abbreviations
This manual contains a list of the abbreviations used in this manual and their meanings.
CONVENTIONS USED IN THIS MANUAL
Throughout this manual, the MCM3064SS, MCM3130SS, MCP3064SS and MCP3130SS
optical disk drives are described as an "ODD," "drive," "unit," "target (TARG)," or
"device."
Decimal values are indicated without any modifiers added.
Hexadecimal values are indicated as X'17B9', 17B9h, 17B9H, and 17B9H.
Binary values are indicated as "010" and 010b.
If "BUSY LED" is described in this manual, this refers to the LED that is located on the
front side (cartridge-loading side) and that indicates the BUSY state of the device. It is
described as "LED on the front panel."
ii
C156-E228-02EN
Preface
Conventions for Alert Messages
This manual uses the following conventions to show the alert messages. An alert message
consists of an alert signal and alert statements. The alert signal consists of an alert symbol
and a signal word or just a signal word.
The following are the alert signals and their meanings:
This indicates a hazardous situation likely to result in
serious personal injury if the user does not perform the
procedure correctly.
This indicates a hazardous situation could result in serious
personal injury if the user does not perform the procedure
correctly.
This indicates a hazardous situation could result in minor
or moderate personal injury if the user does not perform
the procedure correctly. This alert signal also indicates
that damages to the product or other property, may occur if
the user does not perform the product correctly.
This indicates information that could help the user use the
product more efficiently.
In the text, the alert signal is centered, followed below by the indented message. A wider
line space precedes and follows the alert message to show where the alert message begins
and ends. The following is an example:
(Example)
While the write cache feature is enabled, a write error is reported in the
completion status of another command that is subsequent to the concerned
write command. Note that, if the host performs only retry of an error-
reporting command, data in the block in which the error has occurred is not
correctly written.
The main alert messages in the text are also listed in the “Important Alert Items.”
Attention
Please forward any comments you may have regarding this manual.
To make this manual easier for users to understand, opinions from readers are needed.
Please write your opinions or requests on the Comment at the back of this manual and
forward it to the address described in the sheet.
C156-E228-02EN
iii
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Important Alert Items
Important Alert Messages
The important alert messages in this manual are as follows:
A hazardous situation could result in minor or moderate personal injury if the
user does not perform the procedure correctly. Also, damage to the product
or other property, may occur if the user does not perform the procedure
correctly.
Task
Installation
Alert message
Page
2-6
Data loss: Data is not guaranteed if a power failure occurs or the I/F
cable is pulled out while:
•
•
•
Data is being written to a data block
A disk is being initialized (formatted)
Defect processing is in progress
Data is not guaranteed either if the drive is moved with the optical disk
cartridge inserted or the drive is exposed to excessive shock or
vibration.
3-23
4-1
Data loss: When the verify function is invalid, the write data quality is
not guaranteed. This mode should not be used for storing important
data. When using the mode for storing important data, a preventive
system measure such as file duplication is required.
1) Shock or vibration applied to the drive that exceeds the values
defined in the standard damage the drive. Use care when
unpacking.
2) Do not leave the drive in dirty or contaminated environments.
3) Since static discharge may destroy the CMOS devices in the drive,
pay attention to the following points after unpacking:
•
•
Use an antistatic mat and wrist strap when handling the drive.
Hold the mounting frame when handling the drive. Do not
touch the PCA except when setting the switches.
4) When handling the drive, hold both sides of the mounting frame.
When touching other than both sides of the mounting frame, avoid
putting force.
5) Do not forcibly push up the end of the header pin of the printed
circuit board unit when handling or setting the drive.
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v
Important Alert Items
Task
Alert message
Page
4-2
Before moving the drive, remove the optical disk cartridge. If the drive is
moved with the optical disk cartridge loaded in it, the head may move
back and forth in the drive to damage the head or disk and reading the
data may fail
Installation
1) The user must not change the settings of terminals not described in
this section. The terminals must remain as set when shipped.
4-5
2) Do not change terminal settings when the power is on.
3) To strap setting terminals, use the jumper shipped with the drive.
1) Make sure that the system power is off.
4-13
4-14
2) Do not connect or disconnect any cable when the power is on.
1) Be careful of the insertion directions of SCSI connectors. For a
system in which the terminating resistor power is supplied via the
SCSI cable, connecting connectors in the wrong direction may cause
the following:
The overcurrent protection fuse of the terminating resistor power
supply (SCSI device) may blow when power is turned on.
The cable may burn if overcurrent protection is not provided.
2) Be careful of cable connector positions when connecting more than
one SCSI device. The SCSI device having the terminating resistor
must be connected to the end of the cable.
3) The cables must be kept away from the rotating part of the spindle
motor.
Before demounting the optical disk drive, turn off the system power. Do
not remove screws securing the cables and drive when the power is on.
4-17
5-6
Cleaning cartridge
Device Damage: Be sure to use the dedicated head cleaner shown
above.
5-10
5-11
5-11
Disk damage: To clean a disk, use the cleaning solution and cleaning
cloth specified in Table 5.2.
Disk damage: Do not use this cleaning kit on a floppy disk or an
optical disk cartridge to be used on other optical disk drives.
Disk damage: Clean a cartridge in a dust-free environment.
Fujitsu recommends wearing disposable gloves during cleaning so that
no fingerprints are left on a disk.
5-12
5-13
6-3
Disk damage: Do not press hard or apply excessive shock to an optical
disk cartridge case while setting it in the setting case.
Eye inflammation: If the cleaning solution gets into your eyes,
immediately wash the solution away with water.
Maintenance and Repair
Data loss: For a repair request, you normally do not need to include
any optical disk cartridge with an optical disk drive. However, you do
need to include a cartridge if errors keep occurring with a specific
cartridge. In such a case, be sure to save data stored in the cartridge
before sending it in. Fujitsu shall bear no responsibility for any data lost
during service or repair.
vi
C156-E228-02EN
MANUAL ORGANIZATION
OPTICAL DISK DRIVES
PRODUCT MANUAL
(C156-E228)
1.
2.
3.
4.
5.
6.
GENERAL DESCRIPTION
SPECIFICATIONS
INSTALLATION REQUIREMENTS
HOST INTERFACE
<This manual>
OPERATION AND CLEANING
DIAGNOSTICS AND MAINTENANCE
OPTICAL DISK DRIVES
SCSI Logical Specifications
(C156-E092)
1.
2.
3.
4.
5.
6.
COMMAND PROCESSING
DATA BUFFER MANAGEMENT
COMMAND SPECIFICATIONS
SENSE DATA AND ERROR RECOVERY
SCSI MESSAGES
ERROR RECOVERY
C156-E228-02EN
vii
REFERENCED STANDARDS
The product specifications and functions described in this manual conform to the following
standards:
Specification
Name
Concerned organization
(document) number
ANSI X3.131-1986
ANSI X3.131-1994
ISO/IEC 10090
American National Standard for Information
System - small ComputerSystem Interface (SCSI)
American National
Standards Institute (ANSI)
American National Standard for Information
System - small ComputerSystem Interface-2 (SCSI-2) Standards Institute (ANSI)
American National
90mm Optical Disk Cartridges, rewritable and read
only, for data interchange.
ISO/IEC (*1)
ISO/IEC 13963
Data Interchange on 90mm Optical Disk cartridges
Capacity: 230 megabytes per cartridges.
ISO/IEC (*1)
ISO/IEC 15041
Data Interchange on 90mm Optical Disk Cartridges
Capacity: 640 megabytes per cartridges.
ISO/IEC JTC1 (*1)
Cherry Book Version GIGAMO 1.3GB 90mm Magneto-Optical Disk
FUJITSU LIMITED
1.0
System.
SONY CORPORATION
*1
ISO= International Organization for Standardization
IEC= International Electrical for Commission
JTC1= Joint Technical Committee 1
viii
C156-E228-02EN
Contents
CHAPTER 1 General Description................................................................ 1-1
1.1 Features..................................................................................................... 1-1
1.1.1 Performance and Functions................................................................. 1-1
1.1.2 Reliability............................................................................................ 1-3
1.1.3 Maintainability/operability ................................................................. 1-3
1.1.4 Adaptability......................................................................................... 1-3
1.1.5 Interface............................................................................................... 1-4
1.2 Configuration of Optical Disk Drive........................................................ 1-6
1.2.1 Appearance.......................................................................................... 1-6
1.2.2 Configuration ...................................................................................... 1-7
1.2.3 Mechanical section.............................................................................. 1-7
1.2.4 Control circuit section......................................................................... 1-8
CHAPTER 2 Specifications ......................................................................... 2-1
2.1 Specifications of Optical Disk Drives...................................................... 2-1
2.1.1 Catalog and order numbers ................................................................. 2-1
2.1.2 Specifications of drives....................................................................... 2-2
2.1.3 Environmental and power requirements ............................................. 2-4
2.1.4 Error rate ............................................................................................. 2-5
2.1.5 Reliability............................................................................................ 2-6
2.2 Specifications of Optical Disk Cartridges................................................ 2-7
2.2.1 Recommended optical disk cartridges ................................................ 2-7
2.2.2 Appearance.......................................................................................... 2-8
2.2.3 Specifications of disk........................................................................ 2-10
2.3 Defect Management................................................................................ 2-11
2.3.1 Defect management schematic diagram ........................................... 2-11
CHAPTER 3 Installation Requirements...................................................... 3-1
3.1 Environmental Requirements................................................................... 3-1
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Contents
3.1.1 Temperature measurement points........................................................3-1
3.1.2 Temperature requirements...................................................................3-2
3.1.3 Temperature rise..................................................................................3-3
3.1.4 Air flow ...............................................................................................3-4
3.1.5 Air cleanliness .....................................................................................3-4
3.2 Mounting Requirements ...........................................................................3-4
3.2.1 Outer dimensions.................................................................................3-4
3.2.2 Installation direction..........................................................................3-10
3.2.3 Center of gravity................................................................................3-11
3.2.4 Precautions on mounting...................................................................3-12
3.3 Power Supply Requirements...................................................................3-14
3.4 Connection Requirement ........................................................................3-17
3.4.1 Connectors and terminals ..................................................................3-17
3.4.2 Cable connection requirements .........................................................3-19
3.4.3 External operator panel .....................................................................3-20
3.4.4 External operator panel settings (CNH2)..........................................3-23
CHAPTER 4 Installation ...............................................................................4-1
4.1 Notes on Drive Handling ..........................................................................4-1
4.2 Connection Modes....................................................................................4-4
4.3 Settings......................................................................................................4-5
4.3.1 Setting switches (SW1) .......................................................................4-7
4.3.2 Setting of supplying power to SCSI terminating resistor..................4-10
4.3.3 SCSI terminating resistor mode.........................................................4-11
4.4 Mounting.................................................................................................4-12
4.4.1 Checks before mounting the drive.....................................................4-12
4.4.2 Mounting procedure ..........................................................................4-13
4.5 Cable Connections..................................................................................4-13
4.6 Operation Confirmation and Preparation for Use after Installation .......4-14
4.6.1 Confirming initial operations ............................................................4-14
4.6.2 SCSI connection check......................................................................4-15
4.7 Dismounting Drive..................................................................................4-17
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Contents
CHAPTER 5 Operation and Cleaning ......................................................... 5-1
5.1 Operation of Optical Disk Drive .............................................................. 5-1
5.1.1 Appearance of optical disk drive ........................................................ 5-1
5.1.2 Precautions .......................................................................................... 5-2
5.1.3 Inserting an optical disk cartridge....................................................... 5-2
5.1.4 Removing an optical disk cartridge .................................................... 5-4
5.2 Cleaning of Optical Disk Drive................................................................ 5-5
5.3 Operation of Optical Disk Cartridge ........................................................ 5-6
5.3.1 Appearance.......................................................................................... 5-6
5.3.2 Write protect tab.................................................................................. 5-8
5.3.3 Precautions .......................................................................................... 5-9
5.4 Cleaning the Optical Disk Cartridge ...................................................... 5-10
5.4.1 Cleaning tool for optical disk cartridge ............................................ 5-10
5.4.2 Cleaning of optical disk cartridge..................................................... 5-11
CHAPTER 6 Diagnostics and Maintenance ............................................... 6-1
6.1 Diagnostics ............................................................................................... 6-1
6.1.1 Initial self-diagnostics......................................................................... 6-1
6.1.2 Diagnostic command........................................................................... 6-2
6.1.3 Test program ....................................................................................... 6-2
6.2 Maintenance Information ......................................................................... 6-2
6.2.1 Maintenance requirements .................................................................. 6-2
6.2.2 Revision number ................................................................................. 6-3
CHAPTER 7 SCSI BUS................................................................................. 7-1
7.1 System Configuration............................................................................... 7-1
7.2 Interface Signal Definition ....................................................................... 7-3
7.3 Physical Requirements ............................................................................. 7-6
7.3.1 Interface connector.............................................................................. 7-6
7.3.2 Interface cable..................................................................................... 7-9
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Contents
7.4 Electrical Requirements..........................................................................7-11
7.4.1 SCSI interface....................................................................................7-11
7.4.2 Power supply for terminating resistor...............................................7-12
7.4.3 Signal driving conditions...................................................................7-13
7.5 Timing Rule............................................................................................7-15
7.6 Bus Phases ..............................................................................................7-18
7.6.1 BUS FREE phase...............................................................................7-18
7.6.2 ARBITRATION phase......................................................................7-20
7.6.3 SELECTION phase ...........................................................................7-22
7.6.4 RESELECTION phase ......................................................................7-24
7.6.5 INFORMATION TRANSFER phases ..............................................7-26
7.6.6 COMMAND phase............................................................................7-33
7.6.7 DATA phase......................................................................................7-33
7.6.8 STATUS phase..................................................................................7-36
7.6.9 MESSAGE phase ..............................................................................7-36
7.6.10 Signal requirements concerning transition between bus phases .......7-37
7.6.11 Time monitoring feature....................................................................7-38
7.7 Bus Conditions........................................................................................7-40
7.7.1 ATTENTION condition ....................................................................7-40
7.7.2 RESET condition...............................................................................7-42
7.8 Bus Sequence..........................................................................................7-45
Glossary .......................................................................................................GL-1
Acronyms and Abbreviations.......................................................................AB-1
Index ............................................................................................................... IN-1
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Contents
Illustrations
FIGURES
Figure 1.1 The optical disk drive (with panel)............................................. 1-6
Figure 1.2 The optical disk drive (without panel)........................................ 1-6
Figure 1.3 Configuration of optical disk drive............................................. 1-7
Figure 1.4 Block diagram of the control circuit section............................... 1-9
Figure 2.1 Optical disk cartridge ................................................................. 2-8
Figure 2.2 Algorithms for alternate processing.......................................... 2-11
Figure 2.3 Example of alternate processing............................................... 2-12
Figure 3.1 Surface temperature measurement point ................................... 3-1
Figure 3.2 Outer dimensions ....................................................................... 3-5
Figure 3.3 Outer dimensions ....................................................................... 3-7
Figure 3.4 Installation directions................................................................ 3-10
Figure 3.5 Center of gravity ....................................................................... 3-11
Figure 3.6 Mounting frame structure ......................................................... 3-12
Figure 3.7 Service areas ............................................................................. 3-13
Figure 3.8 MCM3130SS current waveform (+5 VDC) ............................. 3-14
Figure 3.9 Power on/off sequence (1) ........................................................ 3-15
Figure 3.10 Power on/off sequence (2) ........................................................ 3-15
Figure 3.11 Power on/off sequence (3) ........................................................ 3-15
Figure 3.12 AC noise filter (recommended) ................................................ 3-16
Figure 3.13 Connector and terminal locations ............................................. 3-17
Figure 3.14 Power supply connector............................................................ 3-18
Figure 3.15 Cable connection mode............................................................. 3-19
Figure 3.16 External operator panel circuit example................................... 3-21
Figure 3.17 External operator panel interface connector............................. 3-22
Figure 4.1 Individual packaging style.......................................................... 4-3
Figure 4.2 Gathered packaging style............................................................ 4-3
Figure 4.3 SCSI bus connection modes ....................................................... 4-4
Figure 4.4 Positions of setting terminals and switches ................................ 4-6
Figure 4.5 Setting switch (SW1).................................................................. 4-7
Figure 4.6 SCSI connection check ............................................................. 4-16
Figure 5.1 Optical disk drive front view (with panel).................................. 5-1
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Contents
Figure 5.2 Inserting an optical disk cartridge...............................................5-3
Figure 5.3 Removing an optical disk cartridge ............................................5-5
Figure 5.4 Appearance of optical disk cartridge ..........................................5-7
Figure 5.5 Write protect tab..........................................................................5-8
Figure 5.6 Opening a shutter ......................................................................5-11
Figure 5.7 Setting an optical disk cartridge into the setting case...............5-12
Figure 5.8 Placing the setting case cover ...................................................5-12
Figure 5.9 Cleaning of disk surface............................................................5-13
Figure 6.1 Revision label..............................................................................6-3
Figure 6.2 Revision number indication ........................................................6-4
Figure 7.1 Example of SCSI configuration ..................................................7-2
Figure 7.2 Interface signals ..........................................................................7-3
Figure 7.3 DATA BUS and SCSI ID............................................................7-4
Figure 7.4 SCSI interface connector (ODD side).........................................7-6
Figure 7.5 SCSI interface connector (cable side).........................................7-7
Figure 7.6 SCSI interface connector pin assignments (single-ended type)..7-8
Figure 7.7 Connection of interface cable....................................................7-10
Figure 7.8 SCSI termination circuit............................................................7-12
Figure 7.9 BUS FREE phase ......................................................................7-19
Figure 7.10 ARBITRATION phase..............................................................7-21
Figure 7.11 SELECTION phase...................................................................7-23
Figure 7.12 RESELECTION phase..............................................................7-25
Figure 7.13 INFORMATION TRANSFER phase (phase control) ..............7-27
Figure 7.14 Transfer in asynchronous mode ................................................7-29
Figure 7.15 Transfer in synchronous mode..................................................7-32
Figure 7.16 Data transfer rate in asynchronous mode..................................7-34
Figure 7.17 Data transfer rate in synchronous mode....................................7-35
Figure 7.18 Switching direction of transfer over the data bus .....................7-38
Figure 7.19 ATTENTION condition ............................................................7-42
Figure 7.20 RESET condition.......................................................................7-44
Figure 7.21 Bus phase sequence...................................................................7-46
Figure 7.22 Example of bus phase transition on execution
of a single command ................................................................7-48
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Contents
TABLES
Table 2.1 Representative model names and order numbers ....................... 2-1
Table 2.2 Specifications.............................................................................. 2-2
Table 2.3 Environmental and power requirements .................................... 2-4
Table 2.4 Recommended optical disk cartridges........................................ 2-7
Table 2.5 Disk specifications.................................................................... 2-10
Table 3.1 Temperature requirements at measurement points..................... 3-2
Table 3.2 Temperatures at measuring points (Reference) .......................... 3-3
Table 3.3 Recommended components for connection.............................. 3-20
Table 3.4 External operator panel interface.............................................. 3-22
Table 3.5 Device type mode setting.......................................................... 3-23
Table 3.6 Write verify mode setting ......................................................... 3-23
Table 3.7 Logical specification type setting ............................................. 3-24
Table 4.1 SCSI ID setting (SW1)................................................................ 4-8
Table 4.2 SCSI data bus parity checking (SW1) ........................................ 4-8
Table 4.3 Write cache mode setting............................................................ 4-9
Table 4.4 Device type mode settings .......................................................... 4-9
Table 4.5 Spindle automatic stop mode setting ........................................ 4-10
Table 4.6 SCSI terminating resistor power supply (CNH1)..................... 4-10
Table 4.7 SCSI terminating resistor mode (CNH1).................................. 4-11
Table 4.8 Setting checklist........................................................................ 4-12
Table 5.1 Head cleaner................................................................................ 5-5
Table 5.2 Cleaning kit............................................................................... 5-10
Table 5.3 Packing list for cleaning kit ...................................................... 5-10
Table 6.1 Diagnostics function ................................................................... 6-1
Table 7.1 INFORMATION TRANSFER phase identification................... 7-5
Table 7.2 Interface cable requirements....................................................... 7-9
Table 7.3 Requirements for terminating resistor power supply................ 7-12
Table 7.4 Signal status .............................................................................. 7-13
Table 7.5 Signal driving method............................................................... 7-13
Table 7.6 Bus phases and signal sources .................................................. 7-14
Table 7.7 Timing specifications ............................................................... 7-15
Table 7.8 SCSI BUS Timing specifications.............................................. 7-17
Table 7.9 Parameters used for synchronous data transfer ........................ 7-35
Table 7.10 Setting value of SCSI time monitoring..................................... 7-39
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CHAPTER 1 General Description
1.1 Features
1.2 Configuration of Optical Disk Drive
This chapter describes the features and configuration of the MCM3064SS,
MCM3130SS, MCP3064SS and MCP3130SS optical disk drives.
As successors to the MCE3064SS and MCE3130SS optical disk drives, the
MCM3064SS, MCM3130SS, MCP3064SS and MCP3130SS optical disk drives
(hereafter called the optical disk drives) achieve high-speed operation while
maintaining compatibility with the MCE3064SS and MCE3130SS.
The flexibility and expandability realized through SCSI interfaces as well as the
high performance and command sets of the optical disk drives allow the user to
construct disk subsystems featuring advanced functions, high performance, large-
scale storage and high reliability.
1.1 Features
This section describes the features of the optical disk drives in terms of
performance, reliability, maintainability/operability, adaptability, and interface.
1.1.1 Performance and Functions
(1) Half-height standard 90mm(3.5-inch) size (25.4 mm height)
The optical disk drives can be directly connected to the system SCSI bus. The
drive employs the same form factor as that for the 90mm(3.5-inch) 25.4-mm
height hard disk drive.
(2) High-speed data transfer
The MCM3130SS and MCP3130SS rotate disks at 3,637 revolutions per minute
when 1.3 GB disks are used. When other media are used, the speed is 5,455
revolutions per minute.
The MCM3064SS and MCP3064SS rotate disks at 5,455 revolutions per minute.
In the disk drive, the MCM3130SS and MCP3130SS realize high-speed data
transfers at rates of 3.92 to 6.70 MB/s (1.3 GB) and the MCM3064SS and
MCP3064SS realize at rates of 3.52 to 5.87 MB/s (640 MB). The maximum
synchronous data transfer speed of the SCSI bus is 20 MB/s.
The data transfer capacity can be used effectively through a large capacity data
buffer of the optical disk drive.
C156-E228-02EN
1-1
General Description
(3) High-speed mean seek time
This drive features a linear voice coil motor for high-speed head positioning.
The average seek time per 1,000 random seeks is 23 ms. (However, this does not
include command overhead or address check.)
(4) Compatibility with international standards (media interchangeability)
The MCM3130SS and MCP3130SS optical disk drives support the use of
90mm(3.5-inch) optical disks in the 1.3 GB format as well as in the 128-MB, 230-
MB, 540-MB and 640-MB formats compatible with ISO standards.
The MCM3064SS and MCP3064SS optical disk drives support the use of optical
disks in the 128-MB, 230-MB, 540-MB and 640-MB formats compatible with
ISO standards.
(5) Dust resistance
With this optical disk drive, the need for a cooling fan has been eliminated owing
to its low power consumption. The optical disk drive also has a simple sealed
structure. The device is sealed with a metal plate. The drive conforms to class 5
million or less particle level. (Class 5 million: This means there are 5 million
dust particles of 0.5 mm diameter or larger per cubic foot. This is equivalent to
0.15 mg/m3.)
(6) Lower power consumption
The power consumption of the MCM3064SS, MCM3130SS, MCP3064SS and
MCP3130SS optical disk drive is 6.1 W, eliminating the need for a cooling fan.
(These power consumption values are typical values during read and write
operation.)
The minimum power consumption in the power save modes are 1.2 W.
(7) Automatic spindle stop function
If the optical disk drive is not accessed for a certain duration, it stops disk rotation
to minimize dust accumulation on the disk. This duration can be specified using
the MODE SELECT command.
1-2
C156-E228-02EN
1.1 Features
1.1.2 Reliability
(1) Mean time between failures (MTBF)
The mean time between failures (MTBF) for this optical disk drive is 120,000
hours or more.
(2) Enhanced error recovery
If an error occurs on the optical disk drive, the system executes appropriate retry
processing to recover from it. This drive features enhanced Reed-Solomon error
correction code (ECC) to assure error-free operation.
(3) Automatic allocation of alternate data blocks
This drive features a function which automatically allocates alternate data blocks
in cases where defective data blocks are detected while data is being written to an
optical disk.
1.1.3 Maintainability/operability
(1) Diagnostics function
This drive has a diagnostics function for checking optical disk drive operations.
The diagnostics function facilitates test and restoration.
(2) Five-year service life (no overhaul)
This drive will not require overhaul within the first five years of installation if
appropriately maintained (both disks and optical parts cleaned using cleaning
tools) and handled as recommended.
1.1.4 Adaptability
(1) Wide-ranging operating environments
This drive, requiring low power consumption because of LSIs adopted, can be
used in wide-ranging environments (5 to 45°C for drive's ambient environment
and a general office environment). The ambient cleanliness must be class 5
million or less particle level.
(2) Low noise
This drive operates quietly at 30 dB or less (A-character) during seek operations
and will not degrade the office environment (except when an optical disk is
ejected).
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1-3
General Description
(3) Safety standards
The optical disk drive is certified under the following standards:
•
•
•
•
•
UL1950 (U.S. safety standard)
CDRH (U.S. laser standard) (Class 1)
CSA C22.2 No. 950 (Canada safety standard)
EN60950 (European safety standard)
EN60825-1 (European laser standard) (Class 1)
(4) Radio wave standards
This optical disk device, while installed, is certified under the following
standards:
EN55022 class B, EN55024 (European EMC standard)
AS/NZS3548 class B (Australian EMC standard)
CNS13438 class B (Taiwanese EMC standard)
1.1.5 Interface
(1) Conformation to SCSI-2
The optical disk drives conform to the basic specifications of SCSI-2.
SCSI commands specify data with logical block addresses, thus allowing data to
be manipulated independent of the physical characteristics of the optical disk
derives. This facilitates easy development of software whose functions can be
flexibly expanded in the future.
(2) Continuous block processing
Logical block addresses are used for data block addressing. Irrespective of the
physical attributes of track boundaries, you can have the initiator access data by
specifying a block number in logically continuous data space.
(3) High-capacity data buffer
This drive has a 2 MB data buffer. This data buffer is used to transfer data
between the SCSI bus and a disk. Since data is stored in this buffer, the host can
execute input-output processing effectively by using the data transfer capability of
the SCSI bus irrespective of the effective data transfer rate of the optical disk
drive.
1-4
C156-E228-02EN
1.1 Features
(4) Read-ahead cache feature
The read-ahead cache feature enables high-speed sequential data access as
follows:
After executing a command to read data from the disk, the drive automatically
reads the next data block and stores it in the data buffer (pre-reading). If the next
command requests this data, the drive can transfer data from the buffer without
accessing the disk again.
(5) Write cache feature
When the host system issues the write command to the optical disk drive, this
drive would report completion of the command after completion of the write and
verify operations if the write cache feature were not used. If the write cache
feature is used, this drive reports completion of the command when data transfer
to buffer is completed, without waiting for completion of the write and verify
operations. This drive performs the write and verify operations asynchronously
with the interface operation. Therefore, enabling the write cache reduces the
apparent write command processing time recognized by the host system and
improves the I/O performance of the host system.
Enable or disable the write cache feature using the MODE SELECT command.
While the write cache feature is enabled, a write error is reported in
the completion status of another command that is subsequent to the
concerned write command. Note that, if the host performs only
retry of an error-reporting command, data in the block in which the
error has occurred is not correctly written.
(6) Defective block slipping
While initializing a disk, the optical disk drive slips defective data blocks to
reallocate logical data blocks so they are physically continuous. This enables
high-speed continuous data block processing without rotational delay due to
defective data blocks.
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1-5
General Description
1.2 Configuration of Optical Disk Drive
1.2.1 Appearance
Figures 1.1 and 1.2 show the optical disk drive.
Figure 1.1 The optical disk drive (with panel)
Figure 1.2 The optical disk drive (without panel)
1-6
C156-E228-02EN
1.2 Configuration of Optical Disk Drive
1.2.2 Configuration
Figure 1.3 shows the configuration of the optical disk drive.
The optical disk drive consists of a mechanical section, a fixed optics section, a
control circuit section, and an actuator.
The mechanical section includes the spindle motor, actuator section, bias magnet,
and cartridge holder vertical motion mechanism.
The fixed optics section consists of the optical components, position detector, and
LD controller.
The control circuit section includes the drive control circuit section and I/F circuit
section.
Control circuit section
Mechanical section
Fixed optics section
Spindle motor
Actuator
Figure 1.3 Configuration of optical disk drive
1.2.3 Mechanical section
(1) Loading and ejecting an optical disk cartridge
The optical disk drive includes a cartridge load mechanism and an auto eject
mechanism. If an optical disk cartridge is manually inserted in the drive's slot as
far as it will go, the cartridge load mechanism automatically lowers the cartridge
and mounts it on the spindle motor. If the Eject button on the front panel is
pressed, the auto eject mechanism automatically ejects the cartridge.
(2) Spindle motor
An optical disk cartridge hub and the spindle motor shaft are magnetically
combined. Therefore, a disk rotates as fast as the spindle motor shaft rotates. The
spindle motor, a DC brushless motor, provides high-speed rotation at 5,455 rpm
and 3,637 rpm and high-accuracy rotation at ± 0.1%.
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1-7
General Description
(3) Actuator section
The actuator section consists of a focus actuator and a tracking actuator. The
former focuses a laser beam on the surface of an optical disk while the latter
moves the beam spot along the radius, on the surface of an optical disk (seek
operation).
The actuator section is directly driven by a linear voice coil motor. The tracking
actuator is based on the pulse-width modulation (PWM) system and realizes low
power consumption and high-speed access.
(4) Separate optical sections
The optical head section has a split structure in which the fixed optics section is
separated from the moving optics section to minimize seek time and positioning
error. This reduces the weight of the moving parts.
The fixed optics section consists of the laser diodes, collimator lens, separation
prism, condensing lens, and the optical detector.
A laser diode for recording and playback transmits one laser beam to the actuator
section.
(5) Panel
The central part of the panel is hollowed out to provide enough space to enable
the cartridge to be inserted by pushing it with a finger, thereby facilitating
insertion.
The panel is also simply designed using an eject button that also serves as LED
light emitting part.
1.2.4 Control circuit section
Figure 1.4 is a block diagram of the control circuit section and the peripheral
sections.
1-8
C156-E228-02EN
1.2 Configuration of Optical Disk Drive
SCSI controller circuit
section
MPU
ODC
DSP
User Logic
LSI i/f
Mecha section
Head section
Laser Diode
Photo Diode
APC Amp
SCSI I/F
LPC Amp
Head Amp
F-ROM
D-RAM
Actuator section
Focus Act.
Track Act.
Spindle Motor
Temperature Sensor
Driver circuit section
Read Amp
Power Amp
Filter
Bias Coil
Eject Motor
Sensor
Cartridge Sensor
Motor Driver
Figure 1.4 Block diagram of the control circuit section
The control circuit consists of a SCSI controller, which controls operations
between the SCSI interface and the drive interface, and a device circuit section,
which controls the drive circuit.
(1) SCSI controller circuit section
The SCSI controller circuit, which uses an LSI for improved reliability, controls
the drive through SCSI interface control, read-write control, beam control, etc., by
using one high-speed microprocessor (MPU).
(2) Drive circuit section
The drive circuit section consists of the laser diode light emitting control circuit,
signal reproduction circuit, servo/seek control circuit, rotation control circuit, and
other control circuits. In particular, the servo/seek control circuit consists of a
DSP (digital signal processor) for circuit reduction and the realization of a simple
configuration.
The drive circuit section performs the seek, erase, record, and playback operations
while controlling the focus tracking of the beam.
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1-9
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CHAPTER 2 Specifications
2.1 Specifications of Optical Disk Drives
2.2 Specifications of Optical Disk Cartridges
2.3 Defect Management
This chapter provides the specifications of the optical disk drives and the optical
disk cartridge.
2.1 Specifications of Optical Disk Drives
2.1.1 Catalog and order numbers
Table 2.1 lists the model names (catalog numbers) and order numbers of optical
disk drives.
Table 2.1 Representative model names and order numbers
Model name
Order No.
Panel
Panel color
Mounting screws
(catalog number)
MCM3064SS
MCM3130SS
MCP3064SS
MCP3130SS
CA06086-B431
CA06123-B431
CA06298-B631
CA06363-B631
With panel
With panel
With panel
With panel
Light gray
Light gray
Light gray
Light gray
Metric screws (M3)
Metric screws (M3)
Metric screws (M3)
Metric screws (M3)
C156-E228-02EN
2-1
Specifications
2.1.2 Specifications of drives
Table 2.2 lists the specifications of MCM3064SS, MCM3130SS, MCP3064SS
and MCP3130SS optical disk drives.
Table 2.2 Specifications (1 of 2)
[MCM3064SS, MCM3130SS, MCP3064SS and MCP3130SS]
Item
Specifications
Optical disk media
128 MB media
181 MB
230 MB media
325 MB
540 MB media
819 MB
640 MB media
818 MB
1.3 GB media (*7)
1.688 GB
Storage capacity Unformatted
(one side)
Formatted
128 MB
230 MB
538 MB
643 MB
1.283 GB
Capacity per
track
Unformatted
18,100 bytes
18,100 bytes
(logical track
capacity)
19,450 bytes
(logical track
capacity)
43,928 bytes
(logical track
capacity)
45,798 bytes
(logical track
capacity)
Formatted
12,800 bytes
12,800 bytes
(logical track
capacity)
12,800 bytes
(logical track
capacity)
34,816 bytes
(logical track
capacity)
34,816 bytes
(logical track
capacity)
Capacity per
sector
Unformatted
Formatted
725 bytes
512 bytes
725 bytes
778 bytes
2,584 bytes
2,631 bytes
512 bytes
17,940
≤1,025
25
512 bytes
42,042
≤2,250
25
2,048 bytes
18,480
≤2,244
17
2,048 bytes
36,855
≤4,437
17
Number of user tracks/side (*1) 10,000
Number of alternate sectors/side ≤1,024
Number of sectors/track
Data transfer rate
25
1.65 MB/s
(maximum)
0.39 MB/s
2.00 to 3.16 MB/s 3.54 to 5.94 MB/s 3.52 to 5.87 MB/s 3.92 to 6.70 MB/s
(maximum) (maximum) (maximum) (maximum)
0.47 to 0.75 MB/s 0.78 to 1.30 MB/s 0.93 to 1.55 MB/s 0.99 to 1.70 MB/s
continuous writing continuous writing continuous writing continuous writing continuous writing
(execution)
1.16 MB/s
(execution)
(execution)
(execution)
(execution)
1.40 to 2.23 MB/s 2.33 to 3.91 MB/s 2.79 to 4.66 MB/s 2.98 to 5.09 MB/s
continuous reading continuous reading continuous reading continuous
continuous reading
(execution)
(execution)
(execution)
(execution)
reading
(execution)
Average seek time (*2)
Average latency
Rotational speed
Heads
23 ms (typ)
5.5 ms
8.2 ms
5,455 rpm ±0.1%
3,637 rpm ±0.1%
Positioner + Separated optical components
1 (Linear voice coil motor)
Positioner type
Servo tracking method
Recording density
ISO continuous servo method
24,424 bpi
(1.04µm/bit)
15,875 TPI
29,308 bpi
(0.87µm/bit)
18,275 TPI
52,900 bpi
(0.48µm/bit)
23,090 TPI
89,100 bpi
(0.285µm/bit)
28,200 TPI
Loading time (*3)
Unloading time (*4)
Load/unload life
Host interface
8 sec. (typ)
4 sec. (typ)
20,000
12 sec. (typ)
SCSI-2 (FAST20)
Data transfer rate (*5)
Synchronous mode: 20 MB/s (max.)
Asynchronous mode: 5 MB/s (max.)
2-2
C156-E228-02EN
2.1 Specifications of Optical Disk Drives
Table 2.2 Specifications (2 of 2)
Item
Specifications
540 MB media
Optical disk media
128 MB media 230 MB media
2 MB
640 MB media
1.3 GB media (*7)
Data buffer
Error correction (*6)
Correctable up to 8-byte/interleave
Bit error rate: 10-12 or less
*1
*2
The number of user tracks indicates the maximum user zone which includes
the spare area and slipping area.
Mathematical average of 1,000 times of random seek, which does not
include command overhead or track address recognition time.
Furthermore, it may depend on the quality of the media and the drive
installation environment.
*3
*4
Loading time is the time that elapses from the time an optical disk cartridge
is inserted, to the time the optical disk drive is ready for processing of an
access command.
Unloading time is the time that elapses from the time the eject button is
pressed or the eject command is issued, to the time an optical disk cartridge
is ejected.
*5
*6
*7
The maximum SCSI data transfer rate may be limited by the initiator
response time, SCSI bus transfer characteristics, or transfer distance.
The bit error rate must be 10-12 or less using a disk whose raw error rate is
10-4 or less.
The MCM3064SS and MCP3064SS do not support 1.3-gigabyte MO disks.
Power save mode
Power save mode
1
2
3
Time for entering power save
mode (continuous time
2 sec.
5 min
33 min
without accessing from SCSI)
Power consumption (*8)
3.9 W
2.0 W
1.2 W
Returning time to normal
mode (*8)
100 ms
1.0 sec.
5.0 sec.
Power save mode 1: Read Amp., Bias off
Power save mode 2: Servo off, Clock frequency down
Power save mode 3: Spindle off, LD off
*8
Average values in case of environment of a temperature of 25-C, voltage of
5 V and without terminating resistor.
C156-E228-02EN
2-3
Specifications
2.1.3 Environmental and power requirements
Table 2.3 lists the environmental and power requirements.
Table 2.3 Environmental and power requirements (1 of 2)
Item
Specification
Power
Average
+5 VDC±5% (*1), 1.2A (2.7A max)
requirements
Ripple requirement 100mV pp (DC-1 MHz)
Power
Ready
3.9 W (typ) (*2)
consumption Random seek, read or write 6.1 W (typ) (*2)
(Average)
Power save Pre-idle mode 3.9 W (typ) (*2)
mode
Idle mode
2.0 W (typ) (*2)
Standby mode 1.2 W (typ) (*2)
Sleep mode
1.2 W (typ) (*2)
Outer
dimensions
With panel
101.6×150.0×25.4 mm
(W × D × H) Without panel
101.6×148.4×25.4 mm
Weight
410 g (with panel)
Environmental Operating
requirements
Temperature: 5 to 45°C (gradient 15°C /h or less)
(*3)
Relative humidity: 10 to 85% (No condensation)
Maximum wet bulb temperature: 29°C or lower
Temperature: 0 to 50°C
Idle
Relative humidity: 10 to 85% (No condensation)
Maximum wet bulb temperature: 36°C or lower
Temperature: –40 to 60°C (24 hours or less)
Temperature: –20 to 60°C (24 hours or more)
Relative humidity: 5 to 90% (No condensation)
Maximum wet bulb temperature: 41°C or lower
–5° to +10° (*3)
Transport
Installation
Tilt angle
2-4
C156-E228-02EN
2.1 Specifications of Optical Disk Drives
Table 2.3 Environmental and power requirements (2 of 2)
Item
Specification
Vibration/
shock
Operating
3.92 m/s2 {0.4 G} (5 to 500 Hz, Sine Sweep)
Shock 19.6 m/s2 {2 G}
(10 ms, Half Sine Pulse)
Idle
9.8 m/s2 {1.0 G} (5 to 500 Hz, Sine Sweep)
No cartridge, power ON
Shock 49 m/s2 {5 G}
(10 ms, Half Sine Pulse)
Transport
Shock 980 m/s2 {100 G} (10 ms, Half Sine Pulse)
Requirement: Packing specifications specified by Fujitsu
Altitude
Operating
Idle
3,000 m (10,000 ft) or less
12,000 m (40,000 ft) or less
Not required
Ambient
Air flow
cleanliness
Air purity
General office environment or better
(dust particle level: Class 5 million or less particle level)
*1
During random seek or read/write but excluding pulse waveform at 500 µs
or less
*2
*3
Average value at an ambient temperature of 25°C and a voltage of 5 V
The performance is specified at an ambient temperature of 25°C and level
placement at 0°.
Note:
1.
The current limiter value on the power supply must not exceed 5 A.
2.
The specifications for during transport are under the packaging conditions
specified by Fujitsu.
3.
Note that, concerning the power requirements, a voltage drop may occur
depending on the power cable in use.
2.1.4 Error rate
Data blocks to be accessed should be evenly distributed on the disk. Errors due to
disk defects are not included.
(1) Bit error rate after ECC processing
The error rate after ECC processing must be 10-12 or less. An optical disk whose
raw error rate is 10-4 or less should be used.
(2) Positioning error rate
The positioning error rate must be 10-6 or less (with retry).
C156-E228-02EN
2-5
Specifications
2.1.5 Reliability
(1) Mean time between failures (MTBF)
The MTBF is 120,000 hours or more. Failures due to disk errors are not included.
Conditions
•
•
•
Power-on time: 200 hours/month or less
LD-on time: 20% or less of power-on time
Ambient temperature: 25°C
Note: The MTBF is defined as follows:
Total operating time in all fields (hours)
Number of device failure in all fields
MTBF =
1) Operating time is the total time in which power is supplied.
2) Device failures include failures requiring repair, readjustment, or
replacement. However, they do not include failures that are not due to the
optical disk drive itself but to external factors such as careless device
handling, nonsupport of environmental requirements, power failures, host
system errors, and interface cable errors.
(2) Service Life
This drive will not require overhaul within the first five years of installation if
properly maintained (both disk media and optical parts cleaned) and handled as
recommended.
Data loss:
Data is not guaranteed if a power failure occurs or the I/F cable is
pulled out while:
•
•
•
Data is being written to a data block
A disk is being initialized (formatted)
Defect processing is in progress
Data is not guaranteed either if the drive is moved with the optical
disk cartridge inserted or the drive is exposed to excessive shock or
vibration.
2-6
C156-E228-02EN
2.2 Specifications of Optical Disk Cartridges
2.2 Specifications of Optical Disk Cartridges
2.2.1 Recommended optical disk cartridges
Optical disk cartridges basically comply with the ISO/IEC 10090 standard for 128
MB capacity, ISO/IEC 13963 standard for the 230 MB capacity, and ISO/IEC
15041 standard for the 540 and 640 MB capacity.
Table 2.4 shows the specifications of the optical disk cartridges recommended for
this optical disk drive. The specified drive performance may not be obtained if
other disk cartridges are used.
Table 2.4 Recommended optical disk cartridges
Model
Drawing number
Optical disk cartridge (540 MB) with Media ID
Optical disk cartridge (640 MB) with Media ID
Optical disk cartridge (1.3 GB) with Media ID
CA90002-C037
CA90002-C016
CA90002-C017
C156-E228-02EN
2-7
Specifications
2.2.2 Appearance
Figure 2.1 shows an optical disk cartridge. The names of the components of an
optical disk cartridge are also shown.
(a) Shutter closed
(2) Shutter
(1) Cartridge case
(3) Write protect tab
Figure 2.1 Optical disk cartridge (1 of 2)
(b) Shutter open
(4) Disk
(5) Hub
Figure 2.1 Optical disk cartridge (2 of 2)
2-8
C156-E228-02EN
2.2 Specifications of Optical Disk Cartridges
The following explains the components of the optical disk cartridge shown in
Figure 2.1.
1) Cartridge case
The disk housing is provided to protect the disk from damage when handling
it, and facilitates replacement of the disk.
The cartridge case has a label and a write protect tab on it.
2) Shutter
The shutter protects the disk from contamination. This metallic door opens
when the cartridge is inserted into the optical disk drive.
3) Write protect tab
Slide the write protect tab to enable or disable writing to the disk.
4) Disk
Stores data that can be read or written using a laser beam.
5) Hub
The hub is the central disk part to be connected to the spindle of the optical
disk drive.
The hub is used for radial centering and axial positioning.
C156-E228-02EN
2-9
Specifications
2.2.3 Specifications of disk
Table 2.5 lists the disk specifications.
Table 2.5 Disk specifications
Item
Read cycle
Specification
Reliability
>108
Erase/write/read cycle
Load/unload cycle
>106
25,000
Archival life (in accordance with
acceleration test results)
>10 years (*1)
>10 years (*2)
5 to 55°C
Shelf life (in accordance with acceleration
test results)
Environmental
requirements
Operating temperature
Operating relative humidity
Storage temperature
Storage humidity
3 to 85% RH (*3)
–20 to 55°C
3 to 90% RH (*3)
*1
*2
*3
Archival life indicates the maximum period during which recorded
information can be read from a disk.
Shelf life indicates the maximum period during which information can be
written to an unrecorded disk.
Maximum wet bulb temperature = 29°C.
Note: Non-recommended disks, if used, must be subject to a compatibility check
by the customer.
(1) 128 MB media
The ISO/IEC10090 defines 128-MB media specification.
(2) 230 MB media
The ISO/IEC13963 defines 230-MB media specification.
(3) 540 MB/640 MB media
The ISO/IEC15041 defines 540 MB/640 MB media specification.
(4) 1.3 GB media
The Cherry Book version 1.0 defines 1.3 GB media specification.
2-10
C156-E228-02EN
2.3 Defect Management
2.3 Defect Management
2.3.1 Defect management schematic diagram
Defective sectors on the disk must be replaced with good sectors in accordance
with the defect management scheme as follows: Sectors found defective during
surface inspection are handled using a sector slipping algorithm. Sectors found
defective after initialization are replaced using a linear replacement algorithm.
Figure 2.2 shows the sector slipping and linear replacement algorithms.
(a) Sector slipping algorithm
(b) Linear replacement algorithm
Figure 2.2 Algorithms for alternate processing
During initialization, the user area is divided into several groups. Each of the
groups contains data sectors and spare sectors. Spare sectors are used as
replacements for defective data sectors. During initialization, the surface
inspection over the user area can be performed.
Figure 2.3 shows an example of alternate processing.
C156-E228-02EN
2-11
Specifications
Figure 2.3 Example of alternate processing
2-12
C156-E228-02EN
CHAPTER 3 Installation Requirements
3.1 Environmental Requirements
3.2 Mounting Requirements
3.3 Power supply Requirements
3.4 Connection Requirement
This chapter describes environmental, mounting, power supply, and connection
requirements.
3.1 Environmental Requirements
The optical disk drive must be installed in an environment complying with the
ambient environmental requirements defined in Section 2.1.3.
3.1.1 Temperature measurement points
While the drive is operating, the ambient temperatures measured 3 cm away from
the surfaces of the optical disk drive must satisfy the ambient environmental
requirements specified in Section 2.1.3. As for the surface temperatures during
operation, the contact temperatures measured at the points shown in Figure 3.1
must satisfy the temperature requirements specified in Section 3.1.2.
(a) Inside optical disk cartridge
Opening of disk outer wall
Hole for inserting thermocouple
Tip of thermocouple
Figure 3.1 Surface temperature measurement point (1 of 2)
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3-1
Installation Requirements
(b) IC (controller, read Amp)
IC (controller)
IC (read Amp)
Figure 3.1 Surface temperature measurement point (2 of 2)
3.1.2 Temperature requirements
Table 3.1 shows the temperature requirement at the measurement point shown in
Figure 3.1.
Table 3.1 Temperature requirements at measurement points
Measurement point
Inside the cartridge
Maximum allowable surface temperature
55°C (*1)
85°C
IC (controller) surface
IC (read Amp.) surface
85°C
*1
60°C for the optical disk cartridges recommended by Fujitsu (except 1.3
GB).
The following describes a procedure for measuring the temperature inside a
cartridge.
1) At the bottom of the cartridge, open a hole large enough for the thermocouple
to be inserted as shown in Figure 3.1.
2) Disassemble the cartridge.
3-2
C156-E228-02EN
3.1 Environmental Requirements
3) Cut off part of the wall surrounding the optical disk (disk outer wall) as
shown in Figure 3.1.
At this point, cut off a section 5 to 10 mm in width from the disk outer wall.
4) Using an adhesive agent, affix the tip of the thermocouple to the opening of
the disk outer wall.
5) Pass the thermocouple through the hole in the cartridge and reassemble the
cartridge.
Using an adhesive agent, etc., fill any gap between the hole and the
thermocouple.
Note:
The surface of the cartridge shown in Figure 3.1 has been cut away to
illustrate the elements inside the cartridge. Do not actually cut away the
surface.
If the external environment temperature rises above the specified value,
the drive will take protective action to deal with the temperature increase
by automatically placing an interval between commands before
responding to a command.
3.1.3 Temperature rise
Table 3.2 Temperatures at measuring points (Reference)
[Ambient temperature of the optical disk drive: 45°C]
Measurement point
Random seek
Criteria
Inside cartridge
53°C
73°C
75°C
51°C
55°C
85°C
85°C
−
IC (controller) surface
IC (read Amp.) surface
Thermal sensor
Notes:
1. The above data was taken in a constant temperature chamber in which the
temperature around the optical disk drive was kept at 45°C. The data was not
taken with the drive installed in a box in which the drive is actually used.
2. Note that, when installed in a box, the ambient temperature around the drive
will differ depending on the air circulation conditions of the box, and the
temperature increase inside the cartridge will differ accordingly.
C156-E228-02EN
3-3
Installation Requirements
3.1.4 Air flow
It is recommended that this optical disk drive be installed in a fanless cabinet.
However, if the power supply is included in the same cabinet, the “Temperature
Conditions” in 3.1.2 must be met. Furthermore, we recommend that the speed of
air drawing in by the device from the left side of the cartridge loading slot in the
front panel dose not exceed 0.3m/s for MCM3064SS or MCM3130SS, and dose
not exceed 0.1m/s for MCP3064SS or MCP3130SS. If this unit is to be used as a
built-in drive, the system fan (if one is supplied) must meet the same conditions.
3.1.5 Air cleanliness
The air cleanliness in the device environment is expressed by the number of dust
particles per unit area. Fujitsu recommends using the optical disk drive in the
environment of class 5 million or less particle level. (Class 5 million: This means
there are 5 million dust particles of 0.5 µm diameter or larger per cubic foot. This
is equivalent to 0.15 mg/m3.)
3.2 Mounting Requirements
3.2.1 Outer dimensions
Figures 3.2 to 3.3 show the outer dimensions of the optical disk drive and the
positions of the mounting holes.
3-4
C156-E228-02EN
3.2 Mounting Requirements
Figure 3.2 Outer dimensions (1 of 2)
C156-E228-02EN
3-5
Installation Requirements
Panel
Below 3.3
Position when loading a cartridge
Position after a cartridge is loaded
Center of a cartridge when loaded
Bottom of
the frame
A-A Section
Figure 3.2 Outer dimensions (2 of 2)
Notes
1. Fujitsu recommends using the dimensions indicated by asterisks in the above
figure for the size of the panel opening.
2. If the specified dimensions are not used, the MO disks might be damaged
when a cartridge is loaded.
3-6
C156-E228-02EN
3.2 Mounting Requirements
Figure 3.3 Outer dimensions (1 of 3)
C156-E228-02EN
3-7
Installation Requirements
Oblong hole: 2±0.1 (width)
× 2.5±0.1 (length)
(Width of C 0.5)
Details of C part
Details on D part
Figure 3.3 Outer dimensions (2 of 3)
3-8
C156-E228-02EN
3.2 Mounting Requirements
Figure 3.3 Outer dimensions (3 of 3)
C156-E228-02EN
3-9
Installation Requirements
3.2.2 Installation direction
Figure 3.4 shows the permissible installation directions for the optical disk drive.
The mounting angle tolerance must be within -5° to 10° relative to the horizontal
plane.
(-) shows that the cartridge insertion slot faces downward.
Eject button/Busy LED
Disk insertion slot
Horizontal
Vertical
Manual eject hole
(Two orientations)
Figure 3.4 Installation directions
3-10
C156-E228-02EN
3.2 Mounting Requirements
3.2.3 Center of gravity
Figure 3.5 shows the center of gravity of the optical disk drive.
Figure 3.5 Center of gravity
C156-E228-02EN
3-11
Installation Requirements
3.2.4 Precautions on mounting
(1) Mounting frame structure and clearance
a) For vibration resistance and heat dissipation, mount this optical disk drive
using a frame having an embossed structure shown in Figure 3.6 or a similar
structure providing an equivalent function.
b) A mounting screw must have an inward projection (entry depth) of 3 mm or
less from the outer surface of the mounting frame of the optical disk drive as
shown in Figure 3.6.
c) The upward-downward and left-right clearance between the external surface
of the mounting frame of the optical disk drive and the user's emboss-
structure frame must be at least 1.5 mm.
d) The floating clearance of the optical disk drive must be 1.5 mm or more.
e) When mounting the optical disk drive, the screw tightening torque must be
0.4 to 0.45Nm (4 to 4.6kgf-cm).
If the screw tightening torque exceeds the prescribed value, the unit fixture
tap may break, leading to degraded device performance.
f) When the optical disk drive (with a panel) is mounted in a cabinet, there
should be no distortion or deformation in the target housing or the mounting
fittings. Furthermore, the optical disk drive's panel must not be deformed.
If the drive is used with the panel deformed, ejection of the cartridge will
be faulty.
Make sure that the door closes from any position after mounting the optical
disk drive.
1.5 or
more
1.5 or
more
3 or less
1.5 or
more
φ15
or less
Optical disk drive
1.5 or
more
(Unit: mm)
Mounted on the side
φ15
or less
1.5 or
more
1.5 or
more
1.5 or
more
Optical disk drive
3 or
less
1.5 or
more
Mounted on the bottom
Figure 3.6 Mounting frame structure
3-12
C156-E228-02EN
3.2 Mounting Requirements
(2) Checking the panel function
There must not be any deformation in the panel after the optical disk drive is
installed in a cabinet. Make sure that the door of the disk insertion slot closes
from any location with the drive installed in the cabinet.
(3) Service areas
Figure 3.7 shows the locations that need to be accessed for installation, and after
installation is carried out.
Figure 3.7 Service areas
(4) External magnetic fields
Mount the optical disk drive away from powerful magnetic materials (e.g., a
speaker) to avoid any adverse effects from external magnetic fields.
(5) Leak magnetic field
The VCM drive magnetic circuit may leak a magnetic field (Up to 2.5 mT at a
distance of 4 mm from the drive surface).
Do not place any devices sensitive to a magnetic field near the
optical disk drive.
(6) External light source
Mount the optical disk drive away from strong light sources (e.g., camera flash).
(7) System ground (handling of SG and FG)
The optical disk drive must be grounded to the signal ground (SG) of the power
supply of the user's system. This SG line must be supplied with the system as well
as the power line.
C156-E228-02EN
3-13
Installation Requirements
The optical disk drive can be mounted in a 120 mm (5 inch) device
bay of the PC chassis using either a metal frame or a plastic
(nonconductive material) frame.
If a plastic frame is used, the personal computer's FG and the optical
disk drive's FG are not shorted. Consequently, the static electricity
tolerance is inferior to that realized when a metal frame is used.
Fujitsu recommends using a metal frame. In particular, a metal
frame must be used especially when high static electricity tolerance
is required.
3.3 Power Supply Requirements
(1) Allowable input voltage and current
The DC power supply input voltage must satisfy the requirements described in
Section 2.1.3, "Environmental and power requirements" when measured at the
power supply connector pin (receiving end) of the optical disk drive (For other
requirements, see items (4) and (5) below).
(2) Current waveform (reference)
Figure 3.8 shows the current waveform while a disk is inserted.
Figure 3.8 MCM3130SS current waveform (+5 VDC)
(3) Power on/off sequence
a) In a system which uses the terminating resistor power supply signal
(TERMPWR) of the SCSI bus, the requirements for +5 VDC given in Figure
3.9 must be satisfied between the drive and at least one of the SCSI devices
supplying power to that signal.
3-14
C156-E228-02EN
3.3 Power Supply Requirements
Figure 3.9 Power on/off sequence (1)
b) In a system which does not use the terminating resistor power supply signal
(TERMPWR) of the SCSI bus, the requirements for +5 VDC given in Figure
3.10 must be satisfied between the drive and the SCSI device with the
terminating resistor circuit.
4.75V
4.75V
0.5V
0.5V
Figure 3.10
Power on/off sequence (2)
c) Between the drive and other SCSI devices on the SCSI bus, the +5 VDC
power on/off sequence is as follows:
In a system with all its SCSI devices designed to prevent noise leakage to the
SCSI bus when the power is turned on or off, the power sequence does
not matter if the requirement in (a) or (b) is satisfied.
In a system containing an SCSI device which is not designed to prevent noise
leakage to the SCSI bus, the requirement given in Figure 3.11 must be
satisfied between the SCSI device and the drive.
Figure 3.11
Power on/off sequence (3)
C156-E228-02EN
3-15
Installation Requirements
(4) Power supply to SCSI terminating resistor
If the power for the terminating resistor is supplied from the drive to other SCSI
devices through the SCSI bus, the current-carrying capacity of the +5 VDC power
supply line to the optical disk drive must be designed with consideration of an
increase of up to 900 mA.
Select a method of power supply to the drive in accordance with the setting
terminal of the optical disk drive. See Subsection 4.3.3.
(5) Noise filter
To eliminate AC line noise, a noise filter should be installed at the AC input
terminal on the power supply unit of the drive. The noise filter specifications are
as follows:
Attenuation: 40 dB or more at 10 MHz
Circuit configuration: The T-configuration shown in Figure 3.12.
Figure 3.12
AC noise filter (recommended)
3-16
C156-E228-02EN
3.4 Connection Requirement
3.4 Connection Requirement
3.4.1 Connectors and terminals
This drive is equipped with the connectors and terminals shown below for external
connection. Figure 3.13 shows their locations.
Power supply connector
SCSI connector
External operator panel terminal (CNH2)
Figure 3.13
Connector and terminal locations
C156-E228-02EN
3-17
Installation Requirements
(1) Power supply connector
Figure 3.14 shows the shape and pin assignment of the DC power supply input
connector.
1
2
3
4
+12 VDC or N.C.
+12 VDC RETURN (GND) or N.C.
+5 VDC RETURN (GND)
+5 VDC
Figure 3.14
Power supply connector
(2) SCSI connector
The connector for the SCSI bus is an unshielded standard connector with two rows
of 25 pins on 2.54 mm centers.
See Chapter 7 for details on the electrical requirements of the interface signals.
For cables using pin 01 as shield ground, note that the shield of the
connector on the drive is not connected to ground.
3-18
C156-E228-02EN
3.4 Connection Requirement
3.4.2 Cable connection requirements
Figure 3.15 shows the cable connection mode between the drive, host system, and
power supply unit. Table 3.3 lists recommended components for the connection.
Figure 3.15
Cable connection mode
C156-E228-02EN
3-19
Installation Requirements
Table 3.3 Recommended components for connection
Category
Name
Model
Manufacturer
Symbol in
Figure 3.15
SCSI cable
Cable socket
(closed-end type)
FCN-707B050-AU/B
FCN-707B050-AU/O
Fujitsu Ltd.
S01
Cable socket
Fujitsu Ltd.
(through-end type)
Signal cable
UL20184-
Hitachi Cable, Ltd.
—
LT25PX28AWG
455-248-50
1-480424-0
SPECTRA-STRIP
AMP
Power supply cable
Housing for cable
socket
S2
Contact
Cable
170121-4
AWG18
AMP
—
—
External operator panel Housing for cable
socket
LPC-16F02
Honda-Tsushin
SH2
Receptacle
Cable
LPC-F104N
AWG28
Honda-Tsushin
—
—
(1) SCSI cable
A terminating resistor is mounted on the drive when the drive is shipped. A
terminating resistor must be disconnected when the drive is not connected to an
end of the SCSI cable. Select a method of power supply to the terminating resistor
circuit according to the setting pins on the drive. See Section 4.2 for details.
(2) Power supply cable
The drive must be star-chain-connected to the DC power supply unit (one-to-one
connection) to reduce the influence of load variations.
3.4.3 External operator panel
Some set switch settings can be manipulated through the external operator panel
interface.
Figure 3.16 shows a recommended circuit for the external operator panel. Since
an external operator panel is not provided as an option, the user must design one
based on the system requirements and the recommended circuit.
3-20
C156-E228-02EN
3.4 Connection Requirement
Provide switches and LEDs (required for the system) on the external
operator panel. See the recommended circuit shown in Figure 3.21.
A signal which is not set on the external operator panel connected to
CNH2 must be set using SW1. The SW1, and CNH1 corresponding
to the signal set on the external operator panel must be set to OFF
position.
For details, see Subsection 4.3.1.
Figure 3.17 shows the external operator panel connector and Table 3.4 shows the
specification of the external operator panel connector interface.
Not assigned
Not assigned
SCSI terminating register mode
*1: This signal indicates that the cartridge is in drive.
H; Exist L: None (TTL level signal)
*2: This signal is used for ejecting the cartridge from the host system
*3: For the LED, the following specification must be satisfied.
Format current: 20 mA or less
Note: The cable length must not exceed 30 cm.
Figure 3.16
External operator panel circuit example
C156-E228-02EN
3-21
Installation Requirements
Figure 3.17
External operator panel interface connector
Table 3.4 External operator panel interface
Signal
Pin
Reference
setting
Function
signal
SCSI-ID 4
2
4
6
9
SW1-01
SW1-02
SW1-03
SW1-06
Equivalent to ON position of SW1-01 by
shorting with 0 V.
SCSI-ID 2
Equivalent to ON position of SW1-02 by
shorting with 0 V.
SCSI-ID 1
Equivalent to ON position of SW1-03 by
shorting with 0 V.
Device type mode
Equivalent to ON position of SW1-06 by
shorting with 0 V. See 3.4.4 (1)
Not assigned
Verify mode
Not assigned
SCSI type-0
10
11
13
14
15
–
–
–
–
–
See 3.4.4 (3)
–
See 3.4.4 (5)
SCSI terminating
resistor mode
CNH1(5-6) Equivalent to shorting CNH1 05-06 by shorting
with 0 V.
+LED
–LED
*EJSW
3
5
7
–
–
–
LED+terminal for external connection
LED–terminal for external connection
External eject instruction input (TTL-IC level)
L level: Equivalent to pushing eject switch
H level: Equivalent to not pushing eject switch
CTRGIN
1
–
–
External cartridge sensor output (TTL-IC level)
L level: No cartridge in drive
H level: Cartridge in drive
0 V (GND)
8, 12, 16
0 V
3-22
C156-E228-02EN
3.4 Connection Requirement
3.4.4 External operator panel settings (CNH2)
(1) Device type mode
Table 3.5 shows the device type settings which are returned when the INQUIRY
command is issued to the optical disk drive.
Table 3.5 Device type mode setting
Device Type
CNH 2/Pin 9 - GND
X'07' (Optical memory device)
X'00' (Direct access device)
Short
Open *
* Setting when shipped
(2) Verify mode
The default setting of the verify function is specified. When the verify mode is
invalid, verification is not performed when the WRITE command is issued. With
the verification invalid, the writing speed is increased by about 20% (depending
on the situation). Table 3.6 shows the verify mode settings. The verification can
also be specified as valid or invalid by the MODE SELECT command.
Table 3.6 Write verify mode setting
Write verify mode
CNH 2/Pin 11 - GND
Short
Does not perform verification for the WRITE
command (invalid)
Performs verification for the WRITE command
(valid).
Open*
* Setting when shipped
Data loss: When the verify function is invalid, the write data
quality is not guaranteed. This mode should not be used for storing
important data. When using the mode for storing important data, a
preventive system measure such as file duplication is required.
C156-E228-02EN
3-23
Installation Requirements
(3) SCSI type 0
The command specification and message specification are specified. The SCSI-1
specification is compatible with that of the old unit (M2511A). Table 3.7 shows
the command and message specification settings.
Table 3.7 Logical specification type setting
Command specification and message specification CNH 2/Pin 14 - GND
SCSI-2 specification
SCSI-1 specification
Open*
Short
* Setting when shipped
3-24
C156-E228-02EN
CHAPTER 4 Installation
4.1
4.2
4.3
4.4
4.5
4.6
4.7
Notes on Drive Handling
Connection Modes
Settings
Mounting
Cable Connections
Operation Confirmation and Preparation for Use after Installation
Dismounting Drive
This chapter describes notes on handling the drives, connection modes, settings,
mounting the drives, cable connections, and operation confirmation and
preparation for use after installation, and notes on demounting the drives.
4.1 Notes on Drive Handling
(1) General notes
Note the following points to maintain drive performance and reliability:
1) Shock or vibration applied to the drive that exceeds the values
defined in the standard damage the drive. Use care when
unpacking.
2) Do not leave the drive in dirty or contaminated environments.
3) Since static discharge may destroy the CMOS devices in the
drive, pay attention to the following points after unpacking:
•
Use an antistatic mat and wrist strap when handling the
drive.
•
Hold the mounting frame when handling the drive. Do
not touch the PCA except when setting the switches.
4) When handling the drive, hold both sides of the mounting
frame. When touching other than both sides of the mounting
frame, avoid putting force.
5) Do not forcibly push up the end of the header pin of the printed
circuit board unit when handling or setting the drive.
(2) Unpackaging
a) Make sure that the UP label on the package is pointing upward and start
unpacking on a level surface. Handle the drive on a soft surface such as a
rubber mat, not on a hard surface such as a desk.
C156-E228-02EN
4-1
Installation
b) Use care to avoid exerting excessive pressure on the unit when removing the
cushions.
c) Use care to avoid exerting excessive pressure on the PCA surface and
interface connectors when removing the drive from the antistatic bag.
d) If the temperature difference between installation locations is 10 degrees or
more, leave the drive in the new location for at least two hours before
unpackaging it.
(3) Installation
a) Do not connect or disconnect the connectors or change the terminal settings
when the power is on.
b) Do not move the drive with the power on.
c) Eject the optical disk cartridge, lock the carriage securing the head, turn off
the power, then move the drive.
Before moving the drive, remove the optical disk cartridge. If the
drive is moved with the optical disk cartridge loaded in it, the head
may move back and forth in the drive to damage the head or disk
and reading the data may fail.
(4) Packaging
a) Before packaging, remove the optical cartridge.
b) Store the drive in an antistatic plastic bag with desiccant (silica gel).
c) Use the same cushions and packaging supplied with the drive. If they are not
available, ensure that adequate shock absorbent material is used. In this case,
some method of protecting the PCA surface and interface connectors must be
used.
d) Ap "UP" and "Handle With Care" labels to the outside of the package.
Figure 4.1 shows the individual packaging style and Figure 4.2 shows the gathered
packaging style. (The form and material of the cushion may be changed.)
4-2
C156-E228-02EN
4.1 Notes on Drive Handling
Drive
Drive
Desiccant
Ejecting Jig
Holder
Desiccant
Ejecting Jig
Holder
Packing box for
each individual unit
Label
Carton of
Box
packing boxes
Label
Figure 4.1 Individual packaging style
Figure 4.2 Gathered packaging style
(5) Transportation
a) Transport the package with the UP sign upward.
b) After unpacking, minimize the transportation distance and use cushions to
avoid shock and vibration. Transport the drive in one of the orientations
described in Subsection 3.2.2 after unpacking. (The horizontal direction is
recommended.)
(6) Storage
a) Use moistureproof packaging when storing the drive.
b) The storage environment must satisfy the requirements specified in
Subsection 2.1.3 when the drive is not operating.
c) To prevent condensation, avoid sharp changes in temperature.
C156-E228-02EN
4-3
Installation
4.2 Connection Modes
Figure 4.3 shows examples of connections between the host system and the optical
disk drive. Up to eight devices including the host adapter, optical disk drive, and
other SCSI equipment can be connected to the SCSI bus in arbitrary combinations.
Install a terminating resistor on the SCSI devices connected to either end of the
SCSI cable.
See Section 3.4 for the cable connection requirements and power cable
connections.
(a) Connecting one optical disk drive
(b) Connecting more than one optical disk drive (single host)
Figure 4.3 SCSI bus connection modes (1 of 2)
4-4
C156-E228-02EN
4.3 Settings
(c) Connecting more than one optical disk drive (multi-host)
Figure 4.3 SCSI bus connection modes (2 of 2)
4.3 Settings
Before installing the drive in the system, set the following setting terminal, setting
switches, and SCSI terminating resistors:
•
•
Setting terminal : CNH1
Setting switches : SW1
Figure 4.4 shows the positions of the setting terminal and switch.
1) The user must not change the settings of terminals not described
in this section. The terminals must remain as set when shipped.
2) Do not change terminal settings when the power is on.
3) To strap setting terminals, use the jumper shipped with the
drive.
C156-E228-02EN
4-5
Installation
Figure 4.4 Positions of setting terminals and switches
Setting items are as follows:
•
SW1
SCSI ID
SCSI data bus parity check
Write cache mode
Device type mode
Spindle automatic stop mode
Factory test mode (user setting inhibited)
•
•
CNH1
SCSI terminating resistor power supply
SCSI terminating resistor mode
CNH2
SCSI ID
Device type mode
Verify mode
SCSI type-0
•
•
SCSI connector
SCSI signal
Power connector
+5VDC
GND
4-6
C156-E228-02EN
4.3 Settings
4.3.1 Setting switches (SW1)
Figure 4.5 shows the types of switches and their settings when the drive was
shipped.
• SW1
SCSI ID
SCSI ID
SCSI ID
OFF
1
2
3
4
5
6
7
8
Setting
switch
Board
Switch number
Signal name
At shipment
SW1
01
02
03
SCSI ID
OFF
OFF
OFF
04
05
06
07
08
SCSI data bus parity check
Write cache mode
ON
OFF
ON
Device type mode
Spindle automatic stop mode
Factory test mode (user setting inhibited)
ON
OFF
Figure 4.5 Setting switch (SW1)
C156-E228-02EN
4-7
Installation
(1) SCSI ID
Table 4.1 shows the SCSI ID settings of the drive.
Table 4.1 SCSI ID setting (SW1)
SCSI ID
SW1-01
SW1-02
SW1-03
0 (*1)
OFF
OFF
OFF
OFF
ON
OFF
OFF
ON
OFF
ON
1
2
3
4
5
6
7
OFF
ON
ON
OFF
OFF
ON
OFF
ON
ON
ON
OFF
ON
ON
ON
*1
Setting when shipped
1) Each SCSI device connected to the same SCSI bus must have a
unique SCSI ID.
2) If contention occurs in the ARBITRATION phase, the priority
of the SCSI use authority depends on SCSI IDs as follows:
7 > 6 > 5 > 4 > 3 > 2 > 1 > 0
(2) SCSI data bus parity checking
Table 4.2 shows the settings which determine whether to check the SCSI bus
parity bit. Regardless of the settings, the parity bit is ensured for data transmitted
by the drive.
Table 4.2 SCSI data bus parity checking (SW1)
SCSI data bus parity checking by drive
SW1-04
Checked
ON (*1)
OFF
Not checked
*1
Setting when shipped
4-8
C156-E228-02EN
4.3 Settings
(3) Write cache mode
The write cache mode can be set. The write cache mode can also be enabled or
disabled by the MODE SELECT command.
When the write cache mode is enabled, the cache control page is added to the code
page of the mode parameter even if the SCSI-1 is set. Table 4.3 shows the settings
of the write cache mode.
Table 4.3 Write cache mode setting
Write cache mode
SW1-05
ON
Write cache is enabled at executing the
WRITE/WRITE AND VERIFY command.
Write cache is disabled at executing the
WRITE/WRITE AND VERIFY command
OFF (*1)
*1
Setting when shipped
When the write cache feature is enabled, a write error is reported at
the completion status of next command. At a system so that the
initiator retries the command, a retry process may be failed.
(4) Device type mode
The device type settings, which are returned when the INQUIRY command is
issued to the optical disk drive, are shown below.
Table 4.4 Device type mode settings
Device type
Setting terminal (SW1-06)
X‘00’ (Direct access device)
OFF
X‘07’ (Optical memory device)
ON (*1)
*1
Setting when shipped
(5) Spindle automatic stop mode
Normally, with the cartridge loaded, the spindle rotation is maintained until the
spindle is instructed to stop by the START/STOP UNIT command. The spindle
auto stop function automatically stops the spindle after the command has not been
issued from the host for about 33 minutes (default value). When the command is
issued from the host with the spindle automatically stopped, the optical disk derive
turns the spindle again and performs processing in the same manner as in a ready
state without posting a not ready state.
C156-E228-02EN
4-9
Installation
The access supervision time from the host is about 33 minutes as the default.
However, it can be changed by the MODE SELECT command.
The spindle auto stop mode can also be changed by the MODE SELECT
command.
Table 4.5 shows spindle auto stop mode setting.
Table 4.5 Spindle automatic stop mode setting
Spindle auto stop
SW1-07
The spindle motor automatically stops.
ON (*1)
OFF
The spindle motor does not automatically stop.
*1
Setting when shipped
The characteristic of the spindle auto stop function are as follows:
•
Reduces the deposition of dust which could cause a cartridge error.
•
Not suitable for a system requiring quick response because it takes a
few seconds to start the spindle.
4.3.2 Setting of supplying power to SCSI terminating resistor
Table 4.6 shows how to supply power to the SCSI terminating resistor module on
the drive and how to use TERMPWR lines on the SCSI bus.
Table 4.6 SCSI terminating resistor power supply (CNH1)
SCSI terminating resistor power supply
CNH1 01-02
Short (*1)
CNH1 03-04
Short (*1)
Power is supplied from both of the drive and
TERMPWR pin.
Power is supplied from the drive only.
(TERMPWR pin is not used)
Short
Open
Open
Open
Short
Open
Power is supplied from TEMPWR pin only.
(Drive’s power supply is not used)
No power is supplied.
*1
Setting when shipped
4-10
C156-E228-02EN
4.3 Settings
4.3.3 SCSI terminating resistor mode
Enabling or disabling the SCSI terminating resistor, module on the PCA can be
set.
When the drive positions at other than the end of the SCSI bus, the SCSI
terminating resistor should be disabled. Table 4.7 shows the SCSI terminating
resistor mode setting.
Table 4.7 SCSI terminating resistor mode (CNH1)
SCSI terminating resistor mode
CNH 1 05-06
SCSI terminating resistor module on the PCA is enabled.
SCSI terminating resistor module on the PCA is disabled.
Short (*1)
Open
*1
Setting when shipped
Note:
Open CNH1 5-6 pins when the SCSI terminating resistor set by CHN 2-15 pin.
C156-E228-02EN
4-11
Installation
4.4 Mounting
4.4.1 Checks before mounting the drive
Before mounting the optical disk drive in the system cabinet, check whether the
setting switches and terminals are set correctly.
Table 4.8 shows the checklist.
Table 4.8 Setting checklist
Setting item
Setting on: Default
Check
1
SCSI ID
(SCSI ID=
)
SW1-01
SW1-02
SW1-03
OFF o OFF o ON
OFF o OFF o ON
OFF o OFF o ON
2
3
4
5
6
SCSI data bus parity check
Write cache mode
SW1-04
SW1-05
SW1-06
SW1-07
SW1-08
ON o OFF o ON
OFF o OFF o ON
ON o OFF o ON
ON o OFF o ON
OFF o OFF o ON
Device type mode
Spindle automatic stop mode
Factory test mode
(user setting inhibited)
Setting item
Setting on: Default
Check
1
2
3
Supplied from both ODD and
TERMPWR pin.
CNH1 1-2
CNH1 3-4
Short o Short o Open
Short o Short o Open
Supplied from ODD
CNH1 1-2
CNH1 3-4
Short o Short o Open
Short o Short o Open
Supplied from TERMPWR pin. CNH1 1-2
CNH1 3-4
Short o Short o Open
Short o Short o Open
Check item
Check
1
2
Drive location on SCSI bus
o Other
o Either
than end end
SCSI terminating resistor mode (CNH1 5-6)
o Open
o Short
4-12
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4.5 Cable Connections
4.4.2 Mounting procedure
How the drive is mounted depends on the system cabinet structure. Determine the
mounting procedure in consideration of the requirements of each system. This
section contains the general mounting procedure and check items.
See Section 3.2 for details on mounting drive.
1) For a system with an external operator panel mounted, connect the external
operator panel cable before mounting the drive in the system cabinet because
it is difficult to access the connector after the drive is mounted.
2) Tighten four mounting screws to secure the drive in the system cabinet.
The drive has ten mounting holes (both sides: 3×2, bottom: 4). Secure the
drive using the four mounting holes on both sides or the bottom.
Use mounting screws whose lengths are 3 mm or less from the external wall
of the mounting frame of the drive when they are tightened. (See Figure
3.6)
When mounting with screws, the screw tightening torque should be 0.4 to
0.45Nm (4 to 4.6kgf-cm).
Be careful not to damage the parts on the PCA when mounting the drive.
3) After securing the drive, make sure that the drive does not touch the chassis of
the system cabinet. There must be at least 1.5 mm clearance between the
drive and chassis. (See Figure 3.6)
4.5 Cable Connections
Use the following cables to connect the drive to the system. See Subsection 3.4.2
for details on the connector positions and cable requirements.
•
•
•
Power supply cable
SCSI cable
External operator panel cable (if required)
The general procedure for cable connection and notes on connecting cables are
given below. Pay attention to the insertion direction of each cable connector.
1) Make sure that the system power is off.
2) Do not connect or disconnect any cable when the power is on.
1) Connect the power cable.
2) Connect the external operator panel (only if required for the system).
3) Connect the SCSI cable.
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Installation
4) After each cable connector is connected, secure the cable so that the cable
does not touch the drive or the parts on the PCA or obstruct the flow of
cooling air in the system cabinet.
1) Be careful of the insertion directions of SCSI connectors. For a
system in which the terminating resistor power is supplied via
the SCSI cable, connecting connectors in the wrong direction
may cause the following:
The overcurrent protection fuse of the terminating resistor
power supply (SCSI device) may blow when power is turned
on.
The cable may burn if overcurrent protection is not provided.
2) Be careful of cable connector positions when connecting more
than one SCSI device. The SCSI device having the terminating
resistor must be connected to the end of the cable.
3) The cables must be kept away from the rotating part of the
spindle motor.
4.6 Operation Confirmation and Preparation for Use after
Installation
4.6.1 Confirming initial operations
This section provides the operation check procedures after the power is turned on.
(1) Initial operation when the power is turned on
•
•
•
When the power is turned on, the drive starts initial self-diagnosis. The LED
on the front panel is on for 1 second during initial self-diagnosis.
If an error is detected during initial self-diagnosis, the LED on the front panel
blinks.
In case of not inserted the cartridge, when the power is turned on, the eject
motor automatically turns once.
(2) Checks if errors occur at initial self-diagnosis
•
•
Make sure that the cables are connected correctly.
Make sure that the supply voltage is correct. (Measure the voltage at the
power supply connector of the optical drive.)
•
•
Make sure that the settings of all terminals are correct.
If the LED on the front panel blinks continuously, an error was detected
during initial self-diagnosis. In this case, issue the REQUEST SENSE
command from the initiator (host system) to obtain sense data for error
analysis.
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4.6 Operation Confirmation and Preparation for Use after Installation
The BUSY LED is on while the optical disk drive is executing seek,
write, or read operations. The BUSY LED is on momentarily, so it
seems as if it blinked or is off.
The eject motor turns once when the power is turned on so that in
case the spindle motor position deviates due to shocks received by
the drive during transport the position is corrected to allow the
cartridge to be inserted normally. If the cartridge fails to be inserted,
remove the cartridge and turn on the drive power to turn the eject
motor once and reinsert the cartridge.
4.6.2 SCSI connection check
When initial operation checks out normally after the power is turned on, check
whether the drive is correctly connected to the SCSI bus from the host system.
Checking the SCSI connection depends on the host system configuration. This
section describes the general procedure.
(1) Procedure
Figure 4.6 shows the recommended checking procedure.
Note:
Steps a) to c) correspond to a) to c) in Figure 4.6.
a) Issue the TEST UNIT READY command and check that the drive is
connected correctly to the SCSI bus.
b) Use the WRITE BUFFER and READ BUFFER commands to check whether
the SCSI bus operates normally. Use data whose bits change to 0 or 1 at least
once. (Example: A X'00' to X'FF'increment pattern)
c) Check whether the settings are correct. Also, make sure that the controller
and drive operate normally.
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Installation
Figure 4.6 SCSI connection check
4-16
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4.7 Dismounting Drive
(2) If processing terminates abnormally:
a) If sense data has been obtained by the REQUEST SENSE command, analyze
the sense data. If the error is recoverable, retry the processing.
b) Check the following items for SCSI cable connection:
All connectors, including other SCSI devices, are connected correctly.
A terminating resistor is correctly mounted at both ends of the cable.
Power is supplied to the terminating resistors correctly.
c) Check the settings of all terminals are correct. Note that the procedure of
checking the SCSI connection depends on the setting of "spindle automatic
stop".
4.7 Dismounting Drive
How to demount an optical disk drive (for setting terminal checking, setting
change, or device replacement) depends on the system cabinet configuration.
Determine the demounting procedure in consideration of the requirements of each
system. This section describes the general demounting procedure and notes on
demounting drives.
Before demounting the optical disk drive, turn off the system power.
Do not remove screws securing the cables and drive when the power
is on.
1) Remove the power cable.
2) Remove the SCSI cable.
3) When an external operator panel is mounted, remove its cable. If it is difficult
to access the connector, remove the cable after step e).
4) Remove the DC ground cable.
5) Remove the four screws securing the drive, then remove the drive from the
system cabinet.
6) When storing or transporting the drive, put the drive into an antistatic bag.
(See Section 4.1.)
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CHAPTER 5 Operation and Cleaning
5.1 Operation of Optical Disk Drive
5.2 Cleaning of Optical Disk Drive
5.3 Operation of Optical Disk Cartridge
5.4 Cleaning of Optical Disk Cartridge
This chapter describes how to operate and clean the optical disk drive and an
optical disk cartridge.
5.1 Operation of Optical Disk Drive
The optical disk drive has automatic load and eject functions. All of the operator
must do about the drive is to insert an optical disk cartridge and push the eject
button. This section explains loading and ejecting an optical disk cartridge,
assuming that the drive is mounted horizontally. You can operate the drive in the
same manner even when it is mounted vertically.
Figure 5.1 shows the front view of the optical disk drive. The following sections
explain the names and functions of parts that a user should know for operation as
well as methods of loading and ejecting an optical disk cartridge.
5.1.1 Appearance of optical disk drive
1) Disk insertion slot
2) Eject button/BUSY LED
3) Manual eject hole
Figure 5.1 Optical disk drive front view (with panel)
The following explains the parts and functions of the optical disk drive (the
following numbers correspond to those in Figures 5.1):
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5-1
Operation and Cleaning
1) Disk insertion slot
Insert and eject an optical disk cartridge into and out of this slot.
2) Eject button & BUSY LED (indicator lamp)
On this optical disk drive, the eject button serves also as the BUSY LED
(indicator lamp). Eject an optical disk cartridge by pressing this button,
which also goes on in green during seeking and during erasing, writing or
reading of data. When ejection is disabled by an SCSI command, an optical
disk cartridge cannot be taken out.
3) Manual eject hole
Use this hole to eject an optical disk cartridge manually at power-off.
5.1.2 Precautions
To maintain the performance and reliability of the drive and to prevent data from
being damaged, observe the following instructions:
•
Do not eject an optical disk cartridge while the drive is in the Busy state.
Particularly, do not manually eject the cartridge by force.
•
Be extra careful not to insert the wrong media such as a floppy disk or foreign
matter, which causes a malfunction of the drive.
5.1.3 Inserting an optical disk cartridge
Insert an optical disk cartridge as follows (see Figure 5.2):
(1) While the drive is powered on:
1) Make sure that there is no other optical disk cartridge in the drive.
2) Hold an optical disk cartridge with the printed shutter surface facing upward.
3) Press the opening section of the cartridge against the disk insertion slot.
4) Hold the center of the rear half of the cartridge to insert the cartridge straight
into the slot until the cartridge is lowered to the bottom (a little inside the
operator panel).
The cartridge starts to be loaded when it has been inserted. The BUSY LED
indicator lamp goes on immediately and goes off in a few seconds, indicating the
completion of loading.
Notes:
1. Insert a cartridge as far as it will go until the BUSY LED indicator lamp goes
on.
2. A cartridge may not be sufficiently inserted if you press only the left or right
edge of the rear half of the cartridge. Be sure to push the central part straight
into the slot as far as it will go.
5-2
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5.1 Operation of Optical Disk Drive
3. If the BUSY LED indicator lamp does not go on after a cartridge is inserted,
press the eject/BUSY LED button once to eject the cartridge and insert it
again.
4. Do not forcibly insert a cartridge if you have any difficulty inserting it. If you
do, the drive may be damaged. In such a case, be sure to remove the cartridge
once and check the insertion orientation and the face and back of the cartridge
before inserting it again.
(2) While the drive is powered off:
1) Make sure that there is no other optical disk cartridge in the drive.
2) Hold an optical disk cartridge with the printed shutter surface facing upward.
3) Press the opening section of the cartridge against the disk insertion slot.
4) Hold the center of the rear half of the cartridge to insert the cartridge straight
into the slot until the cartridge is lowered to the bottom (a little inside the
operator panel).
The cartridge remains where it has been inserted. If you power on the drive, the
BUSY LED indicator lamp goes on.
Notes:
1. If the BUSY LED indicator lamp does not go on when the power is turned on,
press the eject button to eject the cartridge and then insert it again until the
lamp goes on.
2. A cartridge may not be sufficiently inserted if you press only the left or right
edge of the rear half of the cartridge. Be sure to push the central part straight
into the slot as far as it will go.
3. Do not forcibly insert a cartridge if you have any difficulty inserting it. If you
do, the drive may be damaged. In such a case, be sure to remove the cartridge
once and check the insertion orientation and the face and back of the cartridge
before inserting it again.
Push on the back of the cartridge somewhere within the area extending 20 mm
from left of center to 20mm from right of center, up to the location shown on
the right.
Figure 5.2 Inserting an optical disk cartridge
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5-3
Operation and Cleaning
If you insert an optical disk cartridge with the printed shutter facing
upward by pressing on the rear of cartridge at the left edge, you may
hear an audible click but the drive may not become READY. In
such a case, press the cartridge further by pressing on the back of the
cartridge from the center (somewhere near the notched section of the
panel front) until the LED indication lamp goes on. If this happens,
the cartridge has been normally inserted.
5.1.4 Removing an optical disk cartridge
Remove an optical disk cartridge as described below.
(1) While the drive is powered on:
1) Press the eject switch to remove an optical disk cartridge (see Figure 5.3).
Notes:
1. No optical disk cartridge can be removed if the SCSI command inhibits
ejection.
2. Remove an optical disk cartridge after it is completely ejected.
3. Be careful not to let a cartridge drop out of the drive when it is ejected. This
may happen depending on the ambient environment and the cartridge's
condition even if the drive installation conditions are met.
(2) While the drive is powered off:
While the drive is powered off, you cannot remove an optical disk cartridge by
pressing the eject switch.
To remove a cartridge in such a case, insert an accessory eject jig or a pin about 1
mm in diameter into the manual eject hole (see Figure 5.1) and push on it.
Notes:
1. NEVER eject a cartridge while the BUSY LED lamp is on. The data may be
destroyed or the drive may be damaged.
2. Note that a cartridge may drop out of the drive when it is ejected.
3. Do not carry the optical disk drive around while a cartridge is loaded in it.
5-4
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5.2 Cleaning of Optical Disk Drive
Figure 5.3 Removing an optical disk cartridge
5.2 Cleaning of Optical Disk Drive
The drive performance may deteriorate if dust, particle or cigarette smoke deposits
accumulate on the lens actuator of the drive. Clean the lens actuator periodically
using following head cleaner (*1).
*1 How often the lens actuator should be cleaned varies depending on the
environment in which the optical disk drive has been installed. Usually, clean
the lens actuator once every three months.
Table 5.1 Head cleaner
Product name
Head cleaner
Product number
0240470
Order number
CA90002-C980
Clean the lens actuator using the head cleaner as follows:
1) Power on the optical disk drive.
2) Insert the head cleaner.
3) When the head cleaner is automatically loaded, the optical head positioner
moves back and forth to cause the head cleaner's cleaning brush to clean the
object lens.
4) When the cleaning is finished, the head cleaner is automatically ejected.
Note: The cleaning time is around 15 seconds.
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5-5
Operation and Cleaning
Device Damage:
Be sure to use the dedicated head cleaner shown above.
Check the state of the cleaning brush by opening the shutter of the
head cleaner. If the tips of the brush bristles are spread out, the lens
cannot be completely cleaned. In such a case, use a new head
cleaner.
5.3 Operation of Optical Disk Cartridge
5.3.1 Appearance
Figure 5.4 shows the appearance of an optical disk cartridge. It also shows the
names of components of an optical disk cartridge that you should be familiar with
for operation and cleaning.
See Section 2.3.2, "Appearance" for the functions of these components.
5-6
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5.3 Operation of Optical Disk Cartridge
(a) Shutter closed
(2) Shutter
(1) Cartridge case
(3) Write protect tab
(b) Shutter open
(4) Disk
(5) Hub
Figure 5.4 Appearance of optical disk cartridge
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5-7
Operation and Cleaning
5.3.2 Write protect tab
Move the write protect tab to enable or disable writing to an optical disk cartridge.
Use a fingernail or something similar to move the write protect tab (it must be
completely moved to one end because there is some play in the middle).
Figure 5.5 shows where the write protect tab is located on a optical disk cartridge
and how the write protect tab should be moved (see the Write Enabled and Write
Disabled indications printed on the label).
Write protect tab
Tab moved
to this end
Tab moved
to this end
Write enabled
Write disabled
Note: The write protect tab should be at each of the shaded portions.
Figure 5.5 Write protect tab
5-8
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5.3 Operation of Optical Disk Cartridge
5.3.3 Precautions
To maintain the performance and reliability of an optical disk cartridge, keep the
following points in mind when using, storing, or transporting an optical disk
cartridge:
(1) Using a cartridge
•
Do not use a cartridge in an environment where it is exposed to direct sunlight
or sharp temperature changes, or high temperature or humidity.
•
•
•
Do not press hard, drop, or otherwise apply excessive shock or vibration to a
cartridge case or shutter.
Do not use a cartridge in an environment filled with dust, particle, or cigarette
smoke.
Do not open the shutter or touch the surface of a disk with bare fingers.
(2) Storing a cartridge
•
•
Do not place a heavy object on a cartridge.
Do not store a cartridge in an environment where it is exposed to direct
sunlight or sharp temperature changes, or high temperature or humidity.
•
Do not store a cartridge in an environment filled with dust, particle, or
cigarette smoke.
(3) Transporting a cartridge
•
Transport a cartridge sealed in a nylon bag or the equivalent, to protect it from
moisture during transportation.
•
Put a cartridge in a solid container and cover the cartridge with appropriate
cushioning materials to protect it from damage during transportation.
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Operation and Cleaning
5.4 Cleaning the Optical Disk Cartridge
You must periodically clean an optical disk cartridge because the accumulation of
dust, particle, or cigarette smoke deposits on the disk lowers the performance of
the cartridge. How often the cartridge should be cleaned varies depending on the
environment in which the optical disk drive has been installed. Usually, clean the
cartridge once every 300 hours of operation or once in two to three months.
5.4.1 Cleaning tool for optical disk cartridge
Use the following cleaning kit to clean an optical disk cartridge.
(1) Cleaning kit
This cleaning kit is for a 3.5-inch optical disk cartridge only. Read the attached
instruction manual and use the cleaning kit correctly. Table 5.2 shows the
specifications of the cleaning kit.
Table 5.2 Cleaning kit
Product name
Cleaning kit
Product number
0632440
Order number
CA90003-0702
Table 5.3 shows the packing list of the cleaning kit.
Table 5.3 Packing list for cleaning kit
Name
Quantity
Setting case
1
Cleaning cloth
Cleaning solution
5 pieces (70mm × 70mm)
1 bottle (20ml)
The following refill kit is available for the cleaning solution and cloth.
•
Product number 0632450
•
Order number CA90002-D901
Disk damage: To clean a disk, use the cleaning solution and
cleaning cloth specified in Table 5.2.
If a cleaning solution or cleaning cloth other than the one specified is used, the
surface of a disk may be damaged.
5-10
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5.4 Cleaning the Optical Disk Cartridge
(2) Precautions on use and storage of cleaning kit
Keep the following in mind when using or storing the cleaning kit:
•
•
Tighten the cap after using the cleaning solution.
Do not insert a floppy disk or stack floppy disks in the setting case because a
magnet is used at the disk revolving knob of the setting case.
•
•
Do not use or store the cleaning kit in an environment where it is exposed to
direct sunlight or near a flame.
Keep the cleaning kit out of the reach of children.
Disk damage: Do not use this cleaning kit on a floppy disk or an
optical disk cartridge to be used on other optical disk drives.
5.4.2 Cleaning of optical disk cartridge
Clean an optical disk cartridge as follows:
Disk damage: Clean a cartridge in a dust-free environment.
Fujitsu recommends wearing disposable gloves during cleaning so
that no fingerprints are left on a disk.
1) Slide the cartridge shutter until it is completely open (see Figure 5.6).
Figure 5.6 Opening a shutter
2) Set the cartridge with the printed shutter surface facing downward and with
the shutter completely open, into the shutter stopper of the setting case as
shown in Figure 5.7.
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5-11
Operation and Cleaning
Cartridge
Shutter
Spindle
Optical disk
Shutter stopper
Setting case lid
Setting case
Figure 5.7 Setting an optical disk cartridge into the setting case
Disk damage: Do not press hard or apply excessive shock to an
optical disk cartridge case while setting it in the setting case.
3) Place the setting case cover over the cartridge while inserting the disk
revolving knob pin into the center hub of the cartridge (see Figure 5.8).
Optical disk
Disk revolving knob
Cartridge opening
Setting case cover
Optical disk hub
Figure 5.8 Placing the setting case cover
4) When wiping the disk, remove from the disk surface any fragments that may
damage it.
5) Moisten the accessory cleaning cloth with a few drops of the cleaning
solution.
5-12
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5.4 Cleaning the Optical Disk Cartridge
Eye inflammation: If the cleaning solution gets into your eyes,
immediately wash the solution away with water.
6) Gently wipe the disk surface, going from the center to the edge of the disk.
7) After wiping, turn the disk-revolving knob and then wipe the next section in
the same manner (see Figure 5.9).
Cleaning cloth
Figure 5.9 Cleaning of disk surface
8) Wipe off any excess cleaning solution remaining on the disk surface, using a
new portion of the cleaning cloth (where no cleaning solution is absorbed).
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5-13
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CHAPTER 6 Diagnostics and Maintenance
6.1
6.2
Diagnostics
Maintenance Information
This chapter provides diagnostics and maintenance information.
6.1 Diagnostics
Table 6.1 lists test items during diagnostics.
The optical disk drive has a self-diagnostics function. This function can check the
normality of basic operations of the drive.
To check the generation operations including the operations of the interface with
the host system, provide a test program that can run in the host system (see Section
6.1.3).
Table 6.1 Diagnostics function
Description of diagnostics
Initial self-diagnostics
Diagnostics item
Basic operations
(hardware function test)
Diagnostic command
Test program
Basic operations
General operations
6.1.1 Initial self-diagnostics
When the power is turned on, the optical disk drive executes initial self-
diagnostics. The initial self-diagnostics tests basic hardware operations.
The hardware function test checks the normality of the basic operations of the
controller. This test includes the normality check of the ROM that stores
microcodes, microprocessor (MPU) peripheral circuit test, memory (RAM) test,
and data buffer test.
The LED on the drive front panel blinks if an error is detected during initial self-
diagnostics.
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Diagnostics and Maintenance
6.1.2 Diagnostic command
The host system issues the EXECUTIVE DEVICE DIAGNOSTIC command to
cause the ODD to execute self-diagnostics.
See the description on the EXECUTIVE DEVICE DIAGNOSTIC command for
more information.
6.1.3 Test program
To check the operations of the interface with the host system and the general
operations in an environment that simulates an actual operation status, provide a
test program that can run in the host system.
The configuration and function of the test program depend on the requirements of
the user system.
To comprehensively test the functions of the optical disk drive, the Fujitsu
recommends that the test program include the following test items:
(1) Random/sequential read test
Use the READ or VERIFY command to test the positioning (seek) and read
operations in both random access mode and sequential access mode.
(2) Write/read test
Using a disk whose data may be erased, execute write/read test based on arbitrary
data patterns.
6.2 Maintenance Information
6.2.1 Maintenance requirements
(1) Preventive maintenance
No preventive maintenance is required.
(2) Service life
This drive will not require overhaul within the first five years of installation if it is
used in an appropriate environment and handled as recommended.
(3) Service system and repair
Fujitsu provides a service system and repair facility for its optical disk drives.
Submit to your Fujitsu representative information required to replace or repair a
drive. Normally, the information includes:
a) Optical disk drive model, product number (P/N), revision number, serial
number (S/N), and date of manufacture
6-2
C156-E228-02EN
6.2 Maintenance Information
b) Failure status
−
−
−
Date of failure
System configuration
Environment conditions (temperature, humidity, supply voltage, etc.)
c) Failure history
d) Failure description
−
−
−
−
Description of failure
Issued commands and specified parameters
Sense data
Other error analysis information
Data loss: For a repair request, you normally do not need to
include any optical disk cartridge with an optical disk drive.
However, you do need to include a cartridge if errors keep occurring
with a specific cartridge. In such a case, be sure to save data stored
in the cartridge before sending it in. Fujitsu shall bear no
responsibility for any data lost during service or repair.
See Section 5.3.3, "Precautions" for information on packing and handling a drive
when you send it to Fujitsu.
6.2.2 Revision number
The revision number of an optical disk drive is represented with an alphabetic
character followed by a single-digit number. The revision number is shown on a
revision label attached to the drive. For example, Figure 6.1 shows the format of a
revision label.
Revision number
Figure 6.1 Revision label
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6-3
Diagnostics and Maintenance
(1) Indication of revision number at shipment
The revision number indicated on the drive at the time of shipment is indicated by
marking (crossing out) the numbers up to the pertinent number using double lines
(=) in the line of the pertinent alphabetic character (see Figure 6.2).
(2) Change of revision number in the field
To change the revision number in the field because of parts replacement or
modification, indicate the new revision number by circling the number in the line
of the pertinent alphabetic character (see Figure 6.2).
If a revision number is changed after shipment, Fujitsu issues "Revision Number
Change Request/Notice" to indicate the new revision number. The user must
update the revision label as described above after applying the change.
Indication of revision number at shipment
REV.NO. A 0 1 2 3 4 5 6 7 8 9
Revision A2
Revision A3
Change of revision number in field
REV.NO. A 0 1 2 3 4 5 6 7 8 9
Note: "A" in Revision Number is impressed.
Figure 6.2 Revision number indication
6-4
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CHAPTER 7 SCSI BUS
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
System Configuration
Interface Signal Definition
Physical Requirements
Electrical Requirements
Timing Rule
Bus Phases
Bus Conditions
Bus Sequence
This chapter describes the structure of the SCSI bus, electrical conditions,
interface protocol and their operations.
The ODD operates on the SCSI bus as a TARG. In this chapter, the
ODD is represented as "TARG" except where some special
distinction must be made.
7.1 System Configuration
Up to eight SCSI devices can be connected to the SCSI bus. Figure 7.1 shows a
sample system configurations of a multi-host system. Number of devices to be
connected is restricted according to the synchronized transfer speed. Refer to the
related specifications for detail. Communication on the SCSI bus is allowed
between only two SCSI devices, an initiator (INIT) and a target (TARG), at any
given time.
In the configured system, any combination is allowed for an SCSI device to work
as an INIT and as a TARG. Also, there may be an SCSI device that works as both
an INIT and a TARG.
A unique address (SCSI ID) is assigned to each SCSI device. The SCSI ID
corresponds to one bit of the SCSI data bus. The INIT designates an I/O device
connected to the TARG by its logical unit number (LUN).
The SCSI ID of the ODD can be selectable among #0 to #7, but the LUN is fixed
to #0.
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7-1
SCSI BUS
Host
system A
Host
system B
Figure 7.1 Example of SCSI configuration
A unique device address (SCSI ID: #n in Figure 7.1) is assigned to each SCSI
device. Input-output devices connected to or under an SCSI device operating as a
target are accessed in logical units. A unique device address (LUN: logical unit
number) is assigned to each logical unit.
An initiator specifies an SCSI ID to select an SCSI device operating as a target,
then specifies an LUN to select the input-output device connected to or under the
target.
An optical disk drive is constructed with all volumes as a single logical unit.
Specificable SCSI IDs and LUN are as follows:
•
•
SCSI ID: #0 to #7 selectable (setting terminal or external input)
LUN: #0 (fixed)
7-2
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7.2 Interface Signal Definition
7.2 Interface Signal Definition
There is a total of eighteen signals. Nine are used for control and nine are used for
data (1 byte data + 1 odd parity bit). Figure 7.2 shows interface signal lines.
Figure 7.2 Interface signals
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7-3
SCSI BUS
(1) DB 7 to 0, P (DATA BUS)
These signals form a bidirectional data bus consisting eight data bits and an odd
parity bit.
MSB (27): DB7, LSB (20): DB0
The DATA BUS is used to transfer commands, data, status, or messages in the
INFORMATION TRANSFER phase. SCSI IDs are sent to the DATA BUS in the
ARBITRATION phase for determining the priority of bus arbitration. In the
SELECTION or RESELECTION phase, SCSI IDs of the INIT and the TARG are
indicated on the DATA BUS. Figure 7.3 shows the correspondence between
DATA BUS bits and SCSI IDs.
Figure 7.3 DATA BUS and SCSI ID
When the DB(n) signal is true, the data bit (n) is 1, and when false, it is 0.
The use of a parity bit is a system option. The ODD handles parity as shown
below:
•
The ODD implements the bus parity check feature, which can be enabled or
disabled by a setting terminal on the ODD. For the setting terminal, refer to
Item (2) in Subsection 4.3.1 in OEM Manual -Specifications & Installation-.
•
Parity values are always guaranteed when valid data is transferred to the data
bus from the ODD in a phase other than the ARBITRATION phase.
(2) BSY (BUSY)
This signal indicates that the SCSI bus is being used. In the ARBITRATION
phase, it indicates an arbitration request.
7-4
C156-E228-02EN
7.2 Interface Signal Definition
(3) SEL (SELECT)
This signal is used by an INIT to select a TARG (SELECTION phase) or by a
TARG to reselect an INIT (RESELECTION phase).
(4) C/D (CONTROL/DATA)
This signal is driven by a TARG to identify the type of information transferred on
the DATA BUS in combination of I/O and MSG signals. (See Table 7.1)
(5) I/O (INPUT/OUTPUT)
This signal is driven by a TARG to specify the information transfer direction on
the DATA BUS or to identify a SELECTION or RESELECTION phase. (See
Table 7.1)
(6) MSG (MESSAGE)
This signal is driven by a TARG to indicate that a message is being transferred on
the DATA BUS. (See Table 7.1)
(7) REQ (REQUEST)
This signal is driven by a TARG to indicate a transfer request to an INIT in
INFORMATION TRANSFER phase.
(8) ACK (ACKNOWLEDGE)
This signal is driven by an INIT to indicate a response for REQ signal to a TARG
in the INFORMATION TRANSFER phase.
(9) ATN (ATTENTION)
This signal is driven by an INIT to indicate that the INIT has a message to be
transferred to the TARG and is used to generate an ATTENTION condition.
(10)RST (RESET)
This signal indicates the RESET condition which is used to clear all SCSI devices
on the bus.
Table 7.1 INFORMATION TRANSFER phase identification
C/D
I/O MSG
DB7-0, P
Direction
Phase
0
0
1
0
1
0
0
0
0
Data
Data
Command (CDB)
DATA OUT
DATA IN
COMMAND
INIT → TARG
INIT ← TARG
INIT → TARG
1
0
0
1
1
1
0
1
0
1
0
1
1
1
1
Status
–
–
Message
Message
STATUS
not used
not used
MESSAGE OUT
INIT ← TARG
–
–
INIT → TARG
INIT ← TARG
MESSAGE IN
C156-E228-02EN
7-5
SCSI BUS
7.3 Physical Requirements
SCSI devices are daisy-chained together. Both ends of the interface cable are
terminated with resistors.
7.3.1 Interface connector
The nonshielded SCSI connector installed on the ODD is a 50-conductor
connector consisting of two rows of 25 male pins with adjacent pins 2.54 mm (0.1
in.) apart. See Figure 7.4.
The nonshielded cable connector shall be a 50-conductor connector consisting of
two rows of 25 female contacts with adjacent contacts 2.54 mm (0.1 in.) apart. The
use of keyed connectors is recommended to prevent accidental misinsertion. See
Figure 7.5.
Figure 7.6 shows the nonshielded connector pin assignments for SCSI.
Symbol
mm
Remark
D1
D2
D3
D4
2.54
2.54
5.08
6.25
————
————
————
————
Note: The tolerance is ±0.127 mm unless otherwise specified.
Figure 7.4 SCSI interface connector (ODD side)
7-6
C156-E228-02EN
7.3 Physical Requirements
Symbol
mm
Remarks
C1
C2
C3
C4
C5
C6
C7
C8
2.540
60.960
2.540
3.302
32.385
68.072
6.096
7.620
————
————
————
————
————
————
————
Maximum value
Notes: 1. The tolerance is ± 0.127 mm unless otherwise specified.
2. A connector cover and strain relief are not shown in this figure.
Figure 7.5 SCSI interface connector (cable side)
C156-E228-02EN
7-7
SCSI BUS
01
03
05
07
09
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
G
G
–DB0
–DB1
–DB2
–DB3
–DB4
–DB5
–DB6
–DB7
–DBP
G
02
04
06
08
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
G
G
G
G
G
G
G
G
G
G
G
G
Open
G
TERMPWR*
G
G
G
G
–ATN
G
G
G
–BSY
–ACK
–RST
–MSG
–SEL
–C/D
–REQ
–I/O
G
G
G
G
G
G
G
*
Terminating resistor power supply (jumper selectable: input only, both input
and output, or open)
Figure 7.6 SCSI interface connector pin assignments (single-ended type)
Note that shielded end processing is not performed with the
connector on the main unit's optical disk unit for cables that use pin
No.9 as the shielded ground.
7-8
C156-E228-02EN
7.3 Physical Requirements
7.3.2 Interface cable
For the interface cable, a 25-pair, twisted-pair cable that satisfies the requirements
listed in Table 7.2 should be used.
Table 7.2 Interface cable requirements
Item
Conductor size
28 AWG or bigger
Characteristic impedance
100Ω to 132Ω
In the 25-pair twisted cable, pins n and n + 1 (where n is odd) on the interface
connector must be connected to a pair. Cables having the same characteristic
impedance must be used in the same SCSI bus to reduce signal reflection and
maintain transmission characteristics.
The maximum length of the interface cable is 6 m. But the cable length is
restricted according to the synchronized transfer speed. When an SCSI device is
connected to the interface cable except at one of the ends, the connection to the
SCSI connector must be at a cable branchpoint. When an SCSI device is
connected to an end of the SCSI bus, there must not be any cable wiring after the
SCSI device unless the cable has a terminating resistor. (See Figure 7.7.)
C156-E228-02EN
7-9
SCSI BUS
(a) Connection to a middle point of the cable
(b) Connection to the end of the cable
7
Figure 7.7 Connection of interface cable
7-10
C156-E228-02EN
7.4 Electrical Requirements
7.4 Electrical Requirements
7.4.1 SCSI interface
(1) Driver and receiver
For the interface signal driver, an open-collector or tri-state buffer circuit that
satisfies the following output characteristics is used. All signals are negative logic
(true = "L").
The receiver and non-driver of the SCSI device under the power-on state should
satisfy the following input characteristics on each signal.
Output characteristics
VOL = 0.0 to 0.50 VDC (@ IOL = 48 mA)
VOH = 2.5 to 5.25 VDC
Input characteristics
VIL = 0.0 to 0.80 VDC
IIL = –0.4 to 0.0 mA (@ VI = 0.5 VDC)
VIH = 2.0 to 5.25 VDC
IIH = 0.0 to 0.1 mA (@ VI = 2.7 VDC)
Input hysteresis = 0.2 VDC min.
Input capacitance = 25 PF max.
Note:
The SCSI device under the power-off state should satisfy the
characteristics of IIL and IIH.
Recommended circuit
Driver: MB463 (Fujitsu) or SN7438 (TI) (Open-collector NAND gate)
Receiver: SN74LS240 or SN74LS19 (TI) (Schmitt trigger input inverter)
C156-E228-02EN
7-11
SCSI BUS
(2) Termination circuit
The termination circuit is a resistor termination as shown in Figure 7.8. The
termination circuits are installed in SCSI devices which are connected at both ends
of the interface cable.
Resistor
110Ω, 0.5%
TERMPWR
or +5 VDC
VIN
2.6V
Generater
–SCSI LINE 1
–SCSI LINE 2
–SCSI LINE 3
R2
R3
•
•
•
•
•
•
•
•
•
R18
–SCSI LINE 18
Figure 7.8 SCSI termination circuit
7.4.2 Power supply for terminating resistor
The TERMPWR signal on the interface connector is used to supply power to the
terminating resistor circuit connected to both ends of the cable. In a system
configuration where the terminating resistor is installed outside the SCSI device or
if there is a possibility of the power to the SCSI device with the terminating
resistor being cut off, power for the terminating resistor must be supplied to the
TERMPWR line from an SCSI device on the bus. The SCSI device always
working as an INIT (example: host adapter) should supply that power. Power
must be supplied to the TERMPWR line through a diode or other element to
prevent reverse current.
Table 7.3 lists the requirements for terminating the resistor power supply (Vterm)
Table 7.3 Requirements for terminating resistor power supply
Item
Single-ended type
Output voltage
Current capacity
Sink current
4.25 to 5.25 VDC
900 mA min.
1.0 mA max.
7-12
C156-E228-02EN
7.4 Electrical Requirements
7.4.3 Signal driving conditions
(1) Signal status value
Table 7.4 shows the correspondence between the input interface signal level at the
receiving end and its logic state.
Table 7.4 Signal status
Logic state
Signal level (at receiving end)
Single-ended type
True, "1", or asserted
Low (0.0 to 0.8 VDC)
High (2.0 to 5.25 VDC)
False, "0", negated,, or released
(2) Signal driving method
Two driving methods are available: "OR-tied" type and "non-OR-tied" type as
indicated in Table 7.5.
Table 7.5 Signal driving method
Signal status
Driving method
"OR-tied" type
"Non-OR-tied" type
False (*1)
True
No SCSI device drives a signal. The
signal becomes false when the
terminating resistor circuit is biased.
A particular SCSI device drives the
signal false. Otherwise, no SCSI
device drives the signal.
An SCSI device drives the signal true.
*1
–
In this manual, the signal is said to be false if one of the following
conditions is satisfied.
The signal is actually driven by an SCSI device to become false (non-OR-
tied type).
–
No SCSI device is driving the signal (OR-tied type or non-OR-tied type).
In the interface operating sequence, the driving method of the BSY and RST
signals which may be driven by two or more SCSI devices simultaneously must be
the "OR-tied" type. Signals other than BSY, RST, or DBP are not driven by more
than one SCSI device. Signals other than BSY or RST can be driven by either the
"OR-tied" type or "non-OR-tied" type. The DBP signal must not be driven false in
the ARBITRATION phase. For signals other than BSY or RST, both "OR-tied"
and "non-OR-tied" types can be mixed on the SCSI bus.
C156-E228-02EN
7-13
SCSI BUS
(3) Signal sources
Table 7.6 lists signal sources for each interface phase.
Table 7.6 Bus phases and signal sources
Signal
C/D
MSG
DB7-0,
BSY
SEL
I/O
REQ ACK
ATN
TRS
P
Bus phase
BUS FREE
N
A
N
W
I
N
N
N
T
T
T
T
T
T
T
N
N
N
N
T
T
T
T
T
T
N
N
N
N
T
T
T
T
T
T
N
N
N
N
I
N
ID
I
N
N
I
A
A
A
A
A
A
A
A
A
A
ARBIRATION
SELECTION
RESELECTION
COMMAND
DATA IN
I&T
I&T
T
T
T
I
I
N
N
N
N
N
N
I
T
I
T
I
I
DATA OUT
STATUS
T
I
I
T
I
T
T
I
I
MESSAGE IN
MESSAGE OUT
T
I
I
T
I
I
A: Any SCSI device can drive the signal. Two or more SCSI devices may
drive the signal at the same time.
I:
Only the SCSI device which operates as an INIT can drive the signal.
I&T: INIT, TARG, or both can drive this signal according to the interface
sequence.
In the RESELECTION phase, there is a sequence to be driven
simultaneously by both.
ID: Each SCSI device which is actively arbitrating the bus drives a unique data
bit (SCSI ID). The parity bit may be undriven or driven to the true state, but
must never be driven to the false state.
N: Not to be driven by any SCSI device. The terminator pulls the signal to the
false state.
T:
Only the SCSI device which operates as an TARG can drive the signal.
W: Only one SCSI device which wins ARBITRATION can drive the signal.
7-14
C156-E228-02EN
7.5 Timing Rule
7.5 Timing Rule
Table 7.7 gives the timing required for operations on the SCSI bus.
Table 7.7 lists SCSI FAST-20 timing specifications for operations on the SCSI
bus. Table 7.8 lists asynchronous, SCSI-1, and FAST-SCSI timing specifications.
Table 7.7 Timing specifications (1 of 3)
No.
1
Name
Standard
Timing specification
Arbitration Delay
2.4 µs min.
The minimum wait period between the time the SCSI
device sends a BSY signal and the time the value on the
data bus for determining the priority of bus use is judged
in the ARBITRATION phase. A maximum time is not
defined.
2
3
Assertion Period
Bus Clear Delay
15 ns min.
Minimum pulse width of an ACK signal sent by INIT
and an REQ signal sent by TARG for synchronous data
transfer.
800 ns max.
Maximum allowable period between the time either of
the following events occurs and the time the SCSI
device stops driving all bus signals.
(1) Detection of the BUS FREE phase (when both
BSY and SEL signal become false during Bus
Settle Delay).
Note:
Maximum allowable period between the time both
BSY and SEL signal became false and the time the
bus is released is 1,200 ns.
An SCSI device that requires a period longer than
Bus Settle Delay for the detection of the BUS
FREE phase must release the bus within (Bus
Clear Delay) minus (Bus Settle Delay excess time).
(2) Another SCSI device asserts the SEL signal during
an ARBITRATION phase.
(3) The RST signal becomes true (RESET condition).
4
5
Bus Free Delay
Bus Set Delay
800 ns min.
1.8 µs max.
Minimum wait period between the time the SCSI device
detects a BUS FREE phase and the time it sends a BSY
signal to initiate an ARBITRATION phase.
Maximum allowable period between the time an SCSI
device detects a BUS FREE phase and the time it sends
BSY and SCSI ID signals to initiate an ARBITRATION
phase.
C156-E228-02EN
7-15
SCSI BUS
Table 7.7 Timing specifications (2 of 3)
No.
Name
Bus Settle Delay
Standard
Timing specification
6
7
8
9
400 ns min.
Minimum wait period between the time a particular
control signal condition changes and the time the bus
condition is stabilized.
Cable Skew Delay 3 ns max.
Data release Delay 400 ns max.
Maximum allowable difference in transmission time
over the interface cable between any two bus signals
from any two SCSI devices.
Maximum allowable period between the time an I/O
signal changes its status from false to true and the time
the INIT stops driving data bus signals.
Deskew Delay
15 ns min.
Time for compensation for skew involved in bus signal
transmission.
10 Hold Time
16.5 ns min.
In synchronous data transfer mode, the minimum time
during which the transfer data on the DATA BUS from
the leading edge of the REQ or ACK signal pulse must
be maintained to compensate for the hold time in the
SCSI device receiving data.
11 Negation Period
15 ns min.
In synchronous data transfer mode, the minimum time
from the trailing edge of an REQ signal to the leading
edge of the next REQ signal, or from the trailing edge of
an ACK signal to the leading edge of the next ACK
signal.
12 Power-On to
Selection Time
10 sec max.
250 ms max.
Maximum time from when the TARG is turned on to the
time the TARG can post the correct status and sense data
for the TEST UNIT READY, INQUIRY or REQUEST
SENSE command.
13 Reset to Selection
Time
Maximum time from when the RESET condition (hard
RESET) is released to the time the TARG can post the
correct status and sense data for the TEST UNIT
READY, INQUIRY or REQUEST SENSE command.
14 Reset Hold Time
25µs min.
The minimum time during which the RST signal must
be held true to create a RESET condition. A maximum
time is not defined.
15 Selection Abort
Time
200µs max.
In a SELECTION or RESELECTION phase, the
maximum allowable period between the time the SCSI
device recognizes itself as selected and the time it
replies with a BSY signal.
16 Selection Timeout 250 ms min.
Delay
In a SELECTION or RESELECTION phase, the
[Recommended minimum time during which the INIT or TARG waits
value]
for a BSY signal from the SCSI device to be selected
before it initiates timeout processing.
7-16
C156-E228-02EN
7.5 Timing Rule
Table 7.7 Timing specifications (3 of 3)
No.
Name
Standard
50 ns
Timing specification
17 Transfer Period
In synchronous data transfer mode, the minimum time
(minimum repetition time) from the leading edge of an
REQ signal to the leading edge of the next REQ signal
or from the leading edge of an ACK signal to the
leading edge of the next ACK signal. The actual value
is defined using a SYNCHRONOUS DATA
TRANSFER REQUEST message exchanged between
the INIT and TARG.
Table 7.8 SCSI BUS Timing specifications
No.
Name
Synchronous data transfer mode
Asynchronous
data transfer
mode
Fast-20
Fast-SCSI
SCSI-1
1
2
3
4
5
6
7
8
9
Arbitration Delay
Bus Clear Delay
2.4µs
800ns
800ns
400ns
3ns
2.4µs
800ns
800ns
400ns
4ns
2.4µs
800ns
800ns
400ns
4ns
2.4µs
800ns
800ns
400ns
4ns
Bus Free Delay
Bus Settle Delay
Cable Skew Delay
Data Release Delay
Receive Assertion Period
Receive Hold Time
Receive Negation Period
400ns
11ns
400ns
22ns
400ns
70ns
400ns
––
11.5ns
11ns
25ns
25ns
––
22ns
70ns
––
10 Receive Setup Time
11 Reset Hold Time
6.5ns
25ns
15ns
15ns
––
25ns
25ns
25ns
200ns
250ns
45ns
––
12 Selection Abort Time
13 Selection Time-out Delay
14 System Deskew Delay
200ns
250ns
15ns
200ns
250ns
20ns
200ns
250ns
45ns
15 Transfer Period during
50ns
100ns
200ns
Synchronous Data Transfer Phases
16 Transmit Assertion Period
17 Transmit Hold Time
15ns
16.5ns
15ns
30ns
33ns
30ns
23ns
80ns
53ns
80ns
23ns
––
––
––
––
18 Transmit Negation Period
19 Transmit Setup Time
11.5ns
C156-E228-02EN
7-17
SCSI BUS
7.6 Bus Phases
The SCSI bus must be in one of the following eight phases:
•
•
•
•
•
•
•
•
BUS FREE phase
ARBITRATION phase
SELECTION phase
RESELECTION phase
COMMAND phase
DATA phase
INFORMATION TRANSFER phase
STATUS phase
MESSAGE phase
The SCSI bus can never be in more than one phase at any given time.
Note:
In the following bus phase definition, signals are false unless
otherwise defined. Signals on the timing charts are assumed to be
positive logic.
7.6.1 BUS FREE phase
No SCSI device uses the bus during a BUS FREE phase. SCSI devices shall
detect the BUS FREE phase after SEL and BSY signals are both false for at least
Bus Settle Delay.
SCSI devices which have detected the BUS FREE phase shall release all bus
signals within Bus Clear Delay after BSY and SEL become false for a Bus Settle
Delay. If an SCSI device requires more than Bus Settle Delay to detect the BUS
FREE phase, it shall release all bus signals within the following period (t):
t = (Bus Clear Delay) – (Period required for BUS FREE phase detection)
+ (Bus Settle Delay)
The maximum time allowed for releasing the bus after both SEL and BSY
becomes false is 1.2 µs.
Figure 7.9 shows the BUS FREE phase.
7-18
C156-E228-02EN
7.6 Bus Phases
Bus Settle Delay (Min)
Bus Clear Delay (Max)
Bus Settle Delay +
Bus Clear Delay (Max)
Figure 7.9 BUS FREE phase
Transition to a BUS FREE phase occurs when the TARG stops the BSY signal in
one of the following events:
•
•
•
•
•
When the RESET condition has been detected
When the TARG has received ABORT message
When the TARG has received a BUS DEVICE RESET message
When the TARG has sent a DISCONNECT message normally
When the TARG has sent a COMMAND COMPLETE message normally
If a SELECTION or RESELECTION phase is terminated unsuccessfully, the
SCSI bus enters a BUS FREE phase. This BUS FREE phase is generated when
the SEL signal becomes false.
In cases other than the above, if the TARG negates the BSY signal to enter a BUS
FREE phase, the TARG informs the INIT that it has detected an ERROR
condition on the SCSI bus. The TARG can enter a BUS FREE phase forcibly
regardless of the ATN signal status; the INIT must treat that phase transition as
indicating abnormal end of a command. The TARG clears all retained data or
status and terminates the command being executed. It can then create sense data
indicating the detailed error condition. If the INIT detects a BUS FREE phase
when it is not expected, it should issue a REQUEST SENSE command to read the
sense data.
C156-E228-02EN
7-19
SCSI BUS
7.6.2 ARBITRATION phase
The ARBITRATION phase allows one SCSI device to gain control of the SCSI
bus so that an INIT starts the SELECTION phase or a TARG starts the
RESELECTION phase.
Implementation of the ARBITRATION phase is a system option. This phase is
required for system that has two or more INITs or uses the RESELECTION phase.
The procedure to obtain control of the SCSI bus is as follows (see Figure 7.10):
1) The SCSI device shall wait for a BUS FREE phase (see Subsection 7.6.1).
2) The SCSI device shall wait at least Bus Free Delay after Bus Free phase
detection.
3) Then the SCSI device that arbitrates the bus asserts the DATA BUS bit
corresponding to its own SCSI ID and BSY signal within Bus Set Delay after
last observation of the BUS FREE phase (*1).
4) After waiting at least Arbitration Delay since the SCSI device asserted the
BSY signal, the SCSI device shall examine the value on the DATA BUS to
determine the priority of the bus arbitration. (The priority of the bus
arbitration is in the descending order of data bus bit numbers; the highest
priority is DB7 (ID#7) and the lowest priority is DB0 (ID#0)).
−
When the SCSI device detects any ID bit which is assigned higher
priority than its own SCSI ID, the SCSI device shall release its signals
(BSY and its SCSI ID), then may return to step 1). (The SCSI device #1
in Figure 7.10 has lost the arbitration.)
−
−
The SCSI device which detects no higher SCSI ID bit on the DATA
BUS can obtain the bus control, then it shall assert SEL signal. (The
SCSI device #7 in Figure 7.10 has won the arbitration.)
Any other SCSI device that is participating in the ARBITRATION
phase shall release its signals within Bus Clear Delay after the SEL
signal becomes true, then may return to step 1). (The SCSI device #3 in
Figure 7.10 has lost the arbitration.)
5) The SCSI device which wins arbitration (SCSI device #7 in Figure 7.10) shall
wait at least Bus Clear Delay + Bus Settle Delay after asserting the SEL
signal before changing any signal state.
*1: When an SCSI device sends its SCSI ID to the DATA BUS, it asserts only the
bit at the position corresponding to its own ID and leaves the other seven bits
false. The parity bit (DBP signal) is not driven or is driven true, rather than
false. The parity bit on the DATA BUS is unpredictable during an
ARBITRATION phase.
7-20
C156-E228-02EN
7.6 Bus Phases
Bus Settle Delay
(Min)
Arbitration
Delay (Min)
Arbitration Delay
(Min)
Bus Clear Delay
(Max)
Tf: Bus Free Delay (Min)
Ts: Bus Set Delay (Max)
Bus Clear Delay +
Bus Settle Delay (Min)
Figure 7.10
ARBITRATION phase
C156-E228-02EN
7-21
SCSI BUS
7.6.3 SELECTION phase
An INIT can select a TARG in the SELECTION phase.
Note:
I/O signal is false during a SELECTION phase. (The I/O signal
identifies the phase as SELECTION or RESELECTION).
(1) Start sequence without ARBITRATION phase
In systems with the ARBITRATION phase not implemented, the INIT starts the
SELECTION phase in the following sequence (See Figure 7.11).
1) The INIT shall wait for at least Bus Clear Delay after BUS FREE phase
detection.
2) The INIT then asserts its SCSI ID and that of the desired TARG on the data
bus.
3) After waiting at least Deskew Delay × 2, the INIT asserts the SEL signal and
waits for a response from the TARG (BSY signal).
(2) Start sequence with ARBITRATION phase
In systems with ARBITRATION phase implemented, the INIT starts the
SELECTION phase in the following sequence (See Figure 7.11).
1) The INIT shall wait for at least Bus Clear Delay + Bus Settle Delay after
turning SEL signal on during the ARBITRATION phase.
2) The INIT then asserts its SCSI ID and that of the desired TARG on the data
bus.
At this time, the SCSI device becomes an INIT without driving the I/O signal.
3) The INIT releases the BSY signal after waiting at least Deskew Delay × 2.
The INIT shall then wait at least Bus Settle Delay before looking for the
response from the TARG (BSY signal).
(3) Response sequence
When the SCSI device (TARG) detects that the SEL signal and the data bus bit
(DBn) corresponding to its SCSI ID are true and the BSY and I/O signals are false
for more than Bus Settle Delay, it must recognize that itself is selected by the
SELECTION phase. At this time, the selected TARG may sample all bits on the
data bus to identify the INIT's SCSI ID.
The TARG must respond to the INIT by making the BSY signal true within
Selection Abort Time after detecting that itself is selected. If the SCSI ID with
three or more bits is detected on the data bus or a parity error is detected in the
system making the data bus parity bit effective, the TARG must respond to the
SELECTION phase.
The values on the DATA BUS can be changed after this time.
7-22
C156-E228-02EN
7.6 Bus Phases
Bus Settle Delay (Min)
Bus Clear Delay (Min)
Deskew Delay × 2 (Min)
Deskew Delay × 2 (Min)
Deskew Delay × 2 (Min)
µ
Bus Clear Delay + Bus Settle Delay (Min)
Deskew Delay × 2 (Min)
Figure 7.11
SELECTION phase
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7-23
SCSI BUS
(4) Timeout procedure
If the INIT cannot detect the response from TARG when the Selection Timeout
Delay (or longer) has passed after starting the SELECTION phase, the timeout
procedure shall be performed through one of the following schemes:
•
•
The INIT asserts the RST signal and creates the RESET condition.
The INIT maintains SEL signal true and releases the data bus (SCSI IDs).
Subsequently, the INIT waits for the response from TARG for at least
Selection About Time + Deskew Delay × 2. If no response is detected, the
INIT releases the SEL signal allowing the SCSI bus to go to the BUS FREE
phase. If the INIT detects the response from TARG during this period, the
INIT considers the SELECTION phase to have completed normally.
7.6.4 RESELECTION phase
The TARG selects an INIT during the RESELECTION phase. The
RESELECTION phase can only be used in systems with ARBITRATION phase
implemented.
The TARG reconnects the INIT using this RESELECTION phase when the
TARG restarts the command processing that is in the disconnect state on the SCSI
bus.
(1) Start sequence
A TARG performs the RESELECTION phase in the following sequence after
obtaining control of the SCSI bus through the ARBITRATION phase:
1) The TARG waits at least Bus Clear Delay + Bus Settle Delay after asserting
the SEL signal.
2) The TARG sends the SCSI ID of TARG itself and INIT and asserts the I/O
signal. (The TARG can obtain control of the SCSI bus by asserting the I/O
signal.)
3) The TARG releases the BSY signal after waiting at least Deskew Delay × 2,
then wait at least Bus Settle Delay before looking for the response from the
INIT (BSY signal).
7-24
C156-E228-02EN
7.6 Bus Phases
Deskew Delay × 2 (Min)
Deskew Delay × 2 (Min)
Bus Clear Delay + Bus Settle Delay (Min)
Figure 7.12
RESELECTION phase
(2) Response sequence
When the SCSI device (INIT) detects that the SEL signal, I/O signal and data bus
bit (DBn) corresponding to the own SCSI ID are true and the BSY signal is false
for Bus Settle Delay or more, the INIT shall recognize that the INIT itself is
selected in the RESELECTION phase. At this time, the selected INIT performs
sampling to identify the SCSI ID of the TARG that requests the reconnection.
The INIT shall respond to the TARG by asserting the BSY signal within Selection
Abort Time.
When other than 2-bit SCSI ID is detected or when the parity error is detected on
the system in which the parity bit of the data bus is valid, the INIT shall not
respond to the RESELECTION phase.
After the TARG detects the response (BSY signal) from the INIT, the TARG
asserts the BSY signal, then release the SEL signal after Deskew Delay × 2 or
more. After this time, the TARG may change the I/O signal state and data bus
value.
When the INIT detects that the SEL signal is false, the INIT stops sending the
BSY signal.
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SCSI BUS
(3) Timeout procedure
If the TARG cannot detect a response from the INIT when the Selection Timeout
Delay or longer has passed in the RESELECTION phase, the timeout procedure
shall be performed though one of the following schemes:
1) The INIT asserts the RST signal to generate the RESET condition.
2) TARG terminates releasing SCSI ID to DATA BUS with maintaining SEL
signal and I/O signal in TRUE status. Subsequently, the INIT waits for the
response from TARG for at least Selection Abort Time + Deskew Delay × 2.
If no response is detected, the INIT releases the SEL signal allowing the SCSI
bus to go to the BUS FREE phase. If the INIT detects the response from
TARG during this period, the INIT considers the SELECTION phase to have
completed normally.
The ODD performs process 2) above as RESELECTION-phase time-out
processing.
7.6.5 INFORMATION TRANSFER phases
COMMAND, DATA, STATUS, and MESSAGE phases are generally called
INFORMATION TRANSFER phases. In these phases, data and control
information are transferred between the INIT and the TARG through the data bus.
The type of INFORMATION TRANSFER phase is determined by the
combination of C/D, I/O, and MSG signals (see Table 7.1). Since these three
signals are specified by the TARG, phase transition is controlled by the SCSI
device operating as a TARG. The INIT can request the TARG to initiate an
MESSAGE OUT phase by sending an ATN signal. Besides, the TARG can
change the bus phase to BUS FREE by ceasing transmission of the BSY signal.
Information transfer in an INFORMATION TRANSFER phase is controlled by
REQ and ACK signals. The REQ signal is sent by the TARG to request data
transfer, and the ACK signal is a response from the INIT. One pair of REQ and
ACK signals causes one byte of information to be transferred. According to the
method of sending an REQ signal and checking the replied ACK signal
(REQ/ACK handshake), two data transfer modes are defined: synchronous and
asynchronous.
During operation in an INFORMATION TRANSFER phase, the BSY signal must
be kept true by the TARG. The SEL signal must be false. The TARG must
establish the status of three signals C/D, I/O, and MSG which specify the phase
type at least Bus Settle Delay before the leading edge of the REQ signal which
requests transfer of the first byte. The TARG must maintain that status until the
trailing edge of the ACK signal corresponding to the last byte in the phase (see
Figure 7.13).
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C156-E228-02EN
7.6 Bus Phases
Bus Settle Delay (Min)
7
Figure 7.13
INFORMATION TRANSFER phase (phase control)
1. After the ACK signal becomes false during the
INFORMATION TRANSFER phase, the TARG can begin to
prepare for a new phase by changing the status of C/D, I/O, and
MSG signals. The status of these three signals can change in
any order or at once. The status of one signal may change more
than once; however, the TARG should change the status of each
signal only once.
2. Note that a new INFORMATION TRANSFER phase starts
when the REQ signal that requests transfer of the first byte in
the phase becomes true. The phase ends when one of C/D, I/O,
or MSG signal changes after the ACK signal becomes false. The
period between the time one phase ends and the time the REQ
signal to initiate the next new phase becomes true is not defined.
3. The INIT can predict the next new phase (expected phase) from
the status change of C/D, I/O, and MSG signals or from the type
of the preceding execution phase executed. However, note that
the expected phase does not come into effect until the REQ
signal becomes true.
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SCSI BUS
(1) Asynchronous transfer
In asynchronous transfer mode, information transfer is controlled by the INIT and
TARG which are checking the status transition (from false to true and vice versa)
of REQ and ACK signals (interlock type). Asynchronous transfer can be used in
all types of INFORMATION TRANSFER phase (COMMAND, DATA,
STATUS, MESSAGE). Figure 7.14 shows the timing rule of the asynchronous
transfer.
a. Transfer from TARG to INIT
The TARG specifies the information transfer direction by the I/O signal. If
the I/O signal is true, the information on the DATA BUS is transferred from
the TARG to the INIT. Information transfer processing is as follows:
1) The TARG asserts the REQ signal at least Deskew Delay + Cable Skew
Delay after sending valid information on the data bus (DB7 to DB0, P).
It must maintain the state of DB7 to DB0, P until the ACK signal
becomes true on the TARG.
2) INIT fetches the data from the data bus (DB7 to DB0, P) after the REQ
signal becomes true. It asserts the ACK signal to report the completion
of reception.
3) After the ACK signal becomes true on the TARG, the TARG negates the
REQ signal. Thereafter, the TARG can change the data of the data bus.
4) The INIT negates the ACK signal after the REQ signal becomes false.
5) After the ACK signal becomes false, the TARG proceeds to transfer the
next byte.
b. Transfer from INIT to TARG
When the I/O signal is false, information on the data bus is transferred from
the INIT to the TARG. Information transfer processing is as follows.
1) The TARG asserts the REQ signal to request the INIT to send
information.
2) The INIT asserts the ACK signal at least Deskew Delay + Cable Skew
Delay after sending valid information of the requested type on the data
bus (DB7 to DB0, P). The information on the DATA BUS must be
maintained until the REQ signal becomes false on the INIT.
3) The TARG fetches data from the data bus (DB7 to DB0, P) after the
ACK signal becomes true and negates the REQ signal to report the
completion of reception.
4) When the REQ signal becomes false on the INIT, the INIT negates the
ACK signal. After that, the INIT can change data on the data bus.
5) The TARG proceeds to the transfer of the next byte after the ACK signal
becomes false.
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C156-E228-02EN
7.6 Bus Phases
Deskew Delay + Cable Skew Delay (Min)
Deskew Delay + Cable Skew Delay (Min)
Figure 7.14
Transfer in asynchronous mode
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7-29
SCSI BUS
(2) Synchronous mode
Information is transferred through offset-interlock of REQ/ACK handshake.
Operation in this mode is only available for the DATA phase.
The default data transfer mode is asynchronous mode. When power
is first switched on, a RESET condition develops or a BUS
DEVICE RESET message is exchanged, data transfer is performed
in asynchronous mode until the message described below is
exchanged, even if synchronous mode transfer is permitted with the
setting terminal.
Before synchronous mode transfer can be used, a SYNCHRONOUS DATA
TRANSFER REQUEST message must be exchanged between the INIT and
TARG to define synchronous mode transfer between them. Then, the following
transfer parameters are determined to define a range of possible transfer rates
between the SCSI devices.
•
REQ/ACK Offset: Number of REQ signals that the TARG can send before
receiving the ACK signal.
•
Transfer Period: Minimum repetition cycle of REQ and ACK signals.
The TARG can send more than one REQ pulse before receiving the ACK pulse
from the INIT if the number of REQ pulses is within the range defined by the
REQ/ACK Offset parameter. When the difference between the number of REQ
pulses sent by the TARG and the number of ACK pulses received by the TARG
reaches the number assigned to the REQ/ACK Offset parameter, the TARG must
not send an REQ pulse until it receives the leading edge of the next ACK pulse.
For normal termination of transfer in a DATA phase, the number of REQ pulses
and the number of ACK pulses must be equal.
The TARG must satisfy the following timing requirements concerning the
transmission of the REQ signal at the connector pin on the TARG:
•
•
The minimum pulse width is Assertion Period.
The minimum period from the trailing edge of a pulse to the leading edge of
the next pulse is Negation Period.
•
The period between the leading edges of a pulse and the next pulse is equal to
or greater than the time defined by the Transfer Period parameter.
The INIT must respond to the TARG by sending as the same number of ACK
pulses as the REQ pulses received from the TARG. It can send an ACK signal
when it receives the leading edge of the corresponding REQ signal. The INIT
must satisfy the following timing requirements concerning the transmission of the
ACK signal at the SCSI connector pin on the INIT:
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C156-E228-02EN
7.6 Bus Phases
•
•
The minimum pulse width is Assertion Period.
The minimum period between the trailing edge of a pulse and the leading
edge of the next pulse is Negation Period.
•
The period between the leading edges of a pulse and the next pulse is equal to
or greater than the time defined by the Transfer Period parameter.
Figure 7.15 shows the timing rule of the synchronous mode.
a. Transfer from TARG to INIT
The TARG specifies the data transfer direction by the I/O signal. If the I/O
signal is true, data is transferred from the TARG to the INIT. Transfer
processing is as follows:
1) After the TARG sends valid data on the data bus (DB7 to DB0, P), if a
period elapses that is equal to or longer than the sum of the Deskew
Delay time and the Cable Skew Delay time, the TARG sends the REQ
pulse.
2) Starting with the rise of the REQ pulse, the TARG must hold values on
the data bus valid for a period equal to or longer than the sum of the
Deskew Delay time, the Cable Skew Delay time, and the Hold time. The
TARG must send a REQ pulse having a width of at least the Assertion
Period.
3) After compensating for the period defined in 2, the TARG transfers
subsequent data in bytes within the range defined by the REQ/ACK
Offset parameter.
4) Starting with the rise of the REQ pulse, the INIT reads data on the data
bus (DB7 to DB0, P) within the Hold time. After reading the data, the
INIT sends the ACK pulse as a receive completion notification.
b. Transfer from INIT to TARG
If the I/O signal is false, data is transferred from the INIT to the TARG.
Transfer processing is as follows:
1) The TARG repeats the sending of the REQ pulse to request that data be
sent until the number of REQ pulses reaches a value specified by the
REQ/ACK Offset parameter.
2) The INIT transfers one byte of data each time the INIT receives the REQ
pulse from the TARG. Upon receiving the REQ pulse, the INIT sends
valid data on the data bus (DB7 to DB0, P). After the elapse of a period
equal to or longer than the sum of the Deskew Delay time and the Cable
Skew Delay time, the INIT sends the ACK pulse.
3) Starting with the rise of the ACK pulse, the INIT must hold the values on
the data bus valid for a period equal to or longer than the sum of the
Deskew Delay time, the Cable Skew Delay time, and the Hold time. The
TARG must send an ACK pulse having a width of at least the Assertion
Period.
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SCSI BUS
4) Starting with the rise of the ACK pulse, the TARG reads data on the data
bus (DB7 to DB0, P) within the Hold time.
(3) Time monitoring of ACK response wait
When the ODD operates as a TARG, wait time for ACK response to REQ can be
monitored.
Figure 7.15
Transfer in synchronous mode
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7.6 Bus Phases
7.6.6 COMMAND phase
The COMMAND phase is a bus phase in which the TARG requests the INIT to
transfer command information (CDB) to the TARG. The TARG keeps the C/D
signal true and the I/O and MSG signals false during REQ/ACK handshaking in
this phase.
7.6.7 DATA phase
The DATA phase is divided into DATA IN and DATA OUT phases according to
the direction of data transfer. In a DATA phase, synchronous data transfer can be
performed.
(1) DATA IN phase
In a DATA IN phase, the TARG requests to transfer data from the TARG to the
INIT. The TARG keeps the I/O signal true and the C/D and MSG signals false
during REQ/ACK handshaking in this phase.
(2) DATA OUT phase
In a DATA OUT phase, the TARG requests to transfer data from the INIT to the
TARG. The TARG keeps the C/D, I/O, and MSG signals false during REQ/ACK
handshaking in this phase.
(3) Data transfer rate in asynchronous mode
Figure 7.16 shows the REQ/ACK handshake timing that the ODD observes in a
DATA phase where asynchronous transfer is used. The data transfer rate on the
SCSI bus depends on sum of the ACK response time in the INIT and the signal
delay time of the interface cable (T1 and T2 in Figure 7.16).
C156-E228-02EN
7-33
SCSI BUS
Figure 7.16
Data transfer rate in asynchronous mode
(4) Data transfer rate in synchronous mode
Table 7.9 lists parameters for synchronous data transfer that can be performed by
the ODD. Values assigned to these parameters are determined by
SYNCHRONOUS DATA TRANSFER REQUEST messages transferred between
the INIT and TARG. In a system with more than one INIT, parameters may vary
from one INIT to another. The data transfer rate is determined by the value
assigned to the Transfer Period parameter. To maintain this transfer rate,
however, an appropriate value must be assigned to the REQ/ACK Offset
parameter considering the INIT's ACK pulse response performance and the
interface cable length.
The formulas below give the approximate average data transfer rate that can be
achieved on the SCSI bus in synchronous mode. (See Figure 7.17) The notation
used in the formulas is as follows:
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C156-E228-02EN
7.6 Bus Phases
1) If (n×T1) ≥ (T2 + 700),
Average data transfer rate in SCSI = 1000/T1 (MB/s)
2) If (n×T1) > (T2 + 700),
Average data transfer rate in SCSI = (n×1000)/(T2 + 700) (MB/s)
where,
n: Value assigned to REQ/ACK Offset parameter
T1: Value in ns assigned to Transfer Period parameter (see Table 7.9)
T2: Average time in ns from REQi pulse transmission to corresponding ACKi
response at the pertinent pins of the SCSI connector on the ODD
Table 7.9 Parameters used for synchronous data transfer
Parameter
REQ/ACK Offset
Value
Transter rate
1 to 16
Transfer Period
(Minimum REQ Interval sent
from ODD)
(T1 in Figure 7.21)
X '0C'
X '12'
X '19'
X '25'
X '32'
X '3E'
X '4B'
(50 ns)
Max.
Max.
Max.
Max.
Max.
Max.
Max.
20.0 MB/s*1
(75 ns)
13.3 MB/s*1
10.0 MB/s*1
6.6 MB/s*1
5.0 MB/s*1
4.0 MB/s*1
3.3 MB/s*1
(100 ns)
(150 ns)
(200 ns)
(250 ns)
(300 ns)
*1. If a single-ended SCSI bus is used, the maximum transfer rate must be
specified considering the bus configuration, the number of connected SCSI
devices, and transmission characteristics.
Figure 7.17
Data transfer rate in synchronous mode
C156-E228-02EN
7-35
SCSI BUS
7.6.8 STATUS phase
In a STATUS phase, the TARG requests to transfer status information from the
TARG to the INIT. The TARG keeps the C/D and I/O signals true and the MSG
signal false during REQ/ACK handshaking in this phase.
7.6.9 MESSAGE phase
The MESSAGE phase is divided into MESSAGE IN and MESSAGE OUT phases
depending on the direction of message information transfer. In either phase, more
than one message can be transferred. The first byte transferred in a MESSAGE
phase must be a single-byte message or the first byte of a multiple-byte message.
If the message consists of more than one byte, all bytes must be transferred in a
single MESSAGE phase. For details of message types and their operation, see
Chapter 5, "MCD3130SS, MCE3130SS, MCK3130SS, MCM3064SS,
MCM3130SS Optical Disk Drives SCSI Logical Interface Specifications."
(1) MESSAGE IN phase
In a MESSAGE IN phase, the TARG requests to transfer message information
from the TARG to the INIT. The TARG keeps the C/D, I/O, and MSG signals
true during REQ/ACK handshaking in this phase.
(2) MESSAGE OUT phase
In a MESSAGE OUT phase, the TARG requests to transfer message information
from the INIT to the TARG. The TARG keeps the C/D and MSG signals true and
I/O signal false during REQ/ACK handshaking in this phase.
The TARG executes this phase in response to the ATTENTION condition
(described in Subsection 7.7.1) created by the INIT, and must remain in the
MESSAGE OUT phase.
Note:
When the TARG returns a MESSAGE REJECT message to reject an
invalid or incorrect message or when the TARG enters a BUS FREE
phase as directed by a received message or returns a message
(SYNCHRONOUS DATA TRANSFER REQUEST message, for
example) in a prompt response to a received message, it can
terminate the MESSAGE OUT phase regardless of whether the ATN
signal is true or false.
When the TARG detects a parity error in the received message information, the
TARG can request the INIT to retry message transmission by sending a REQ
signal after sensing the ATN signal false without having to change the bus phase
(that is, while remaining in the MESSAGE OUT phase). Upon receiving this
REQ signal, the INIT must retransmit all of the same message bytes that were
transmitted in the MESSAGE OUT phase in the same sequence. If the message
consists of more than one byte, the INIT must make the ATN signal true before
returning the ACK signal for the first byte and must keep it true until the last byte
is transferred.
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7.6 Bus Phases
Unless a parity error is detected, the TARG can execute the received message
immediately after its reception. If a parity error is detected, the TARG ignores
that part of the message which has been received after the detection of the parity
error. Suppose that when the INIT retransmits a series of messages in the
MESSAGE OUT phase, the TARG has already executed some messages. In this
event, the TARG must handle the received messages so that no logical
contradiction will occur (for example, the TARG must ignore received messages
that have already been executed).
If the TARG receives all message information normally without detecting a parity
error, the TARG must enter an INFORMATION TRANSFER phase other than a
MESSAGE OUT phase and must send at least one byte of information in order to
advise the INIT that message transfer retry is unnecessary. However, for some
types of message (ABORT and BUS DEVICE RESET, for example), the TARG
can report the normal completion of message reception by entering a BUS FREE
phase.
7.6.10 Signal requirements concerning transition between bus phases
When the SCSI bus is at a midpoint between two INFORMATION TRANSFER
phases (during the period of bus phase transition), interface signals must satisfy
the requirements below.
1) The status of the BSY, SEL, REQ, and ACK signals must not change.
2) The status of the ATN and RST signals can change within the range
determined by the ATTENTION condition (see Subsection 7.7.1) or RESET
condition (see Subsection 7.7.2).
3) The status of the C/D, I/O and MSG signals and the DATA BUS (DBn) can
change. However, the direction of data transfer over the DATA BUS must
satisfy the following rule. (See Figure 7.18.)
•
When changing the direction of transfer from Out (from INIT to TARG) to In
(from TARG to INIT), the TARG must begin to drive the data bus (DBn) at
least Data Release Delay + Bus Settle Delay after making the I/O signal true.
The INIT must stop driving the data bus within Data Release Delay after the
I/O signal becomes true.
•
When changing the direction of transfer from In (from TARG to INIT) to Out
(from INIT to TARG), the TARG must stop driving the data bus (DBn)
within Deskew Delay after making the I/O signal false.
C156-E228-02EN
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SCSI BUS
Data Release Delay + Bus Settle Delay (Min)
Deskew Delay (Max)
Data Release Delay (Max)
Figure 7.18
Switching direction of transfer over the data bus
7.6.11 Time monitoring feature
The ODD has a time monitoring feature for the SCSI bus to prevent hang-up of
the SCSI bus in the case that the TARG cannot receive a response from the INIT
in the RESELECTION or INFORMATION TRANSFER phase.
(1) Time monitoring in RESELECTION phase
The ODD monitors the time of the response (BSY signal) from the INIT in the
RESELECTION phase. When the INIT does not send the BSY signal within a
specified period, the ODD executes the timeout process (see Subsection 7.6.4) to
free the SCSI bus and then executes the retry process (see Section 6.1) of the
RESELECTION phase in "MCD3130SS, MCE3130SS, MCK3130SS,
MCM3064SS, MCM3130SS Optical Disk Drives SCSI Logical Interface
Specifications."
(2) Time monitoring in INFORMATION TRANSFER phase
The ODD monitors the timing of the ACK signal against the REQ signal in the
INFORMATION TRANSFER phase. Time monitoring is executed during the
following period:
•
COMMAND, STATUS, or MESSAGE phase:
Time taken from the moment of sending the REQ signal of the first byte to the
moment of completing the reception of the ACK signal of the last byte of the
phase.
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C156-E228-02EN
•
DATA phase:
Time taken for completing eight REQ/ACK handshakes (average).
Note:
When the ACK signal is returned repeatedly within an interval of
500 ms or more, timeout may occur even if eight REQ/ACK
handshakes on average had been terminated with the time listed in
Table 7.10.
When timeout is detected, the ODD clears the command being executed and
forces the SCSI bus into the BUS FREE phase (see Section 6.1) in "MCD3130SS,
MCE3130SS, MCK3130SS, MCM3064SS, MCM3130SS Optical Disk Drives
SCSI Logical Interface Specifications."
Table 7.10 Setting value of SCSI time monitoring
Monitoring time in
INFORMATION
TRANSFER phase
Monitoring time in
RESELECTION phase RESELECTION phase
Number of retries in
About 30 sec
About 250 ms
10 times
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7-39
SCSI BUS
7.7 Bus Conditions
Two types of asynchronous operations, an ATTENTION condition and a RESET
condition, are provided to control and modify the bus phase transition sequence
(bus condition).
7.7.1 ATTENTION condition
The ATTENTION condition allows an INIT to report that the INIT has messages
to be sent to the TARG. The TARG receives a message from the INIT by
executing the MESSAGE OUT phase. Figure 7.19 shows the ATTENTION
condition.
(1) Generation and release of ATTENTION condition (INIT)
By making the ATN signal true, the INIT can generate the ATTENTION
condition any time except during the ARBITRATION or BUS FREE phase.
Consider the generation of a new ATTENTION condition in the INFORMATION
TRANSFER phase. To inform the TARG of the ATTENTION condition before
the transition to the next new bus phase, the INIT must set the ATN signal true
before Deskew Delay × 2 or more from the timing of setting the ACK signal false
for the last byte being transferred in the current bus phase. If the ATN sending
timing is delayed, the TARG may not be informed of the ATTENTION condition
until the next bus phase. The INIT may not operate as it should.
When transferring message information in several bytes in the MESSAGE OUT
phase, the INIT must keep the ATN signal true. The INIT can make the ATN
signal false any time except while the ACK signal is true in the MESSAGE OUT
phase. When transferring the last byte in the MESSAGE OUT phase, the INIT
generally makes the ATN signal false during the period between the time the REQ
signal becomes true and the time it returns the ACK signal. In this case, the INIT
must set the ATN signal false before Deskew Delay × 2 or more from the time of
setting the ACK signal true.
The INIT must make the ATN signal false before making the ACK signal true to
transfer the last message byte if so specified for the particular type of message to
the TARG. (See "MCD3130SS, MCE3130SS, MCK3130SS, MCM3064SS,
MCM3130SS Optical Disk Drives SCSI Logical Interface Specifications.")
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7.7 Bus Conditions
(2) Response against ATTENTION condition (TARG)
The TARG must enter the MESSAGE OUT phase and respond to the
ATTENTION condition under the following situations. After terminating the
MESSAGE OUT phase and sending back a MESSAGE REJECT message, the
TARG must reenter the MESSAGE OUT phase if the ATN signal is true.
•
•
When the ATN signal becomes true in the COMMAND phase, the TARG
must initiate the MESSAGE OUT phase immediately after the command
(command descriptor block [CDB]) has completed the transfer of all or some
bytes.
When the ATN signal becomes true in the DATA phase, the TARG must
enter the MESSAGE OUT phase immediately after the DATA phase. The
TARG can enter the MESSAGE OUT phase at any time. (For example, the
data transfer need not be terminated at a logical data block boundary.) The
INIT must continue REQ/ACK handshaking (DATA phase) until the bus
phase changes.
•
•
When the ATN signal becomes true in the STATUS phase, the TARG must
enter the MESSAGE OUT phase after the status byte transfer is completed.
When the ATN signal becomes true in the MESSAGE IN phase, the TARG
must enter the MESSAGE OUT phase immediately after transferring the
current message.
•
•
When the ATN signal becomes true in the SELECTION phase, the selected
TARG must enter the MESSAGE OUT phase immediately after the
SELECTION phase.
When the ATN signal becomes true in the RESELECTION phase, the TARG
must enter the MESSAGE OUT phase after the IDENTIFY message
transmission is completed.
C156-E228-02EN
7-41
SCSI BUS
Deskew Delay
× 2 (Min)
Deskew Delay × 2 (Min)
Figure 7.19
ATTENTION condition
The ATTENTION condition generated by the INIT in the
SELECTION phase determines the message level to be used in the
command execution sequence. (Details are explained in Subsection
5.1.3. of “MCD3130SS, MCE3130SS, MCK3130SS, MCM3064SS,
MCM3130SS OPTICAL DISK DRIVES SCSI LOGICAL
INTERFACE SPECIFICATIONS.”) If the ATTENTION condition
is not generated in the SELECTION phase, the TARG uses a
COMMAND COMPLETE message only. The TARG does not
respond to the ATTENTION condition even if it was generated in
the subsequent bus phase. Therefore, the TARG does not enter the
MESSAGE OUT phase.
7.7.2 RESET condition
The RESET condition allows all SCSI devices to immediately release the bus.
RESET has higher priority than any other phases and bus conditions. Any SCSI
device can generate the RESET condition at any time by keeping the RST signal
true for 25 µs (Reset Hold Time) or more. The state of all bus signals except RST
signals are undefined during the RESET condition.
7-42
C156-E228-02EN
7.7 Bus Conditions
All SCSI devices must deactivate all the bus signals except RST signals and
release the bus within 800 ns (Bus Clear Delay) after the RST signal becomes true.
After the RESET condition, the SCSI bus must enter the BUS FREE phase.
Figure 7.20 shows the RESET condition.
The following are the ODD operations when the RESET condition is detected.
1) All commands including those being executed and those in a stack are
cleared.
2) The reserve status of the disk drive is reset.
3) The operation mode set by a message or the command is initialized as when
power is turned on.
The current value in the parameter set by a MODE SELECT command is
initialized to the saved value last established. If the value is not saved, it is
initialized to the default value.
Parameters defined for synchronous transfer between the ODD and SCSI
device is cleared. The mode defined for data transfer among all SCSI devices
is initialized to asynchronous mode.
4) The UNIT ATTENTION condition is generated for all SCSI devices.
5) The sense data is no longer retained and is cleared.
6) All data read into the data buffer in advance by the read-ahead cache feature
is invalidated.
1. The ODD does not generate a RESET condition.
2. The ODD provides only the "hard" RESET condition specified
by the SCSI standard.
3. Reset Hold Time is specified to guarantee that any SCSI device
can recognize the occurrence the RESET condition. On the
ODD, even if the pulse width is less than 25 µs, the RESET
condition is effective.
C156-E228-02EN
7-43
SCSI BUS
Rest Hold Time (Min)
Bus Clear Delay (Max)
Figure 7.20
RESET condition
7-44
C156-E228-02EN
7.8 Bus Sequence
7.8 Bus Sequence
SCSI bus phases are switched in the specified sequence according to the command
operation executed in the TARG. After a TARG has asserted the BSY signal in
the SELECTION or RESELECTION phase, the bus phase sequence other than
ATTENTION condition and RESET condition is controlled by the TARG.
All bus phases can be aborted through the RESET condition so that the BUS
FREE phase is always created. Also, any other phase can be followed by the BUS
FREE phase.
Note:
The TARG can enter the BUS FREE phase in order to report an error
condition. For details, see Subsection 7.6.1.
Figure 7.21 shows the allowable bus phase sequence applied to systems without
the ARBITRATION phase and systems with the ARBITRATION phase. Figure
7.22 provides an example of bus phase sequence during single command
execution.
the ARBITRATION phase, systems with the ARBITRATION
phase, systems with the MESSAGE OUT phase, and systems
without the MESSAGE OUT phase. The generation of the
ATTENTION condition determines whether or not systems use the
MESSAGE OUT phase. If the ATTENTION condition is not
generated, the TARG assumes that the INIT is supporting only a
COMMAND COMPLETE message and the TARG operates so that
it will not use other messages in the subsequent command execution
sequence. The ATN signal status is ignored; therefore, the TARG
does not enter the MESSAGE OUT phase.
C156-E228-02EN
7-45
SCSI BUS
Figure 7.21
Bus phase sequence (1 of 2)
7-46
C156-E228-02EN
7.8 Bus Sequence
Figure 7.21
Bus phase sequence (2 of 2)
C156-E228-02EN
7-47
SCSI BUS
Figure 7.22
Example of bus phase transition on execution
of a single command (1 of 5)
7-48
C156-E228-02EN
7.8 Bus Sequence
Figure 7.22
Example of bus phase transition on execution
of a single command (2 of 5)
C156-E228-02EN
7-49
SCSI BUS
Figure 7.22
Example of bus phase transition on execution
of a single command (3 of 5)
7-50
C156-E228-02EN
7.8 Bus Sequence
Figure 7.22
Example of bus phase transition on execution
of a single command (4 of 5)
C156-E228-02EN
7-51
SCSI BUS
Figure 7.22
Example of bus phase transition on execution
of a single command (5 of 5)
7-52
C156-E228-02EN
Glossary
Axial acceleration
Acceleration in the recording layer along the line perpendicular to the disk
reference surface at a specified rotation speed. Axial acceleration is detected by
optical means.
Axial displacement
A displacement at a point in the recording layer in a direction perpendicular to the
disk reference surface from its standard position. The standard position in the
recording layer is detected optically using the thickness and refraction rate of the
protective layer, based on the disk reference surface.
Case
A cover of an optical disk. The case protects the disk from being damaged during
handling and also allows the operator to replace disks easily. The case also
provides for a label, write protection tab, automatic handling support, and media
identification hole.
CDB (Command Descriptor Block)
A series of data describing input-output commands. The CDB is sent from the
initiator to the target.
Clamp area
Command
A disk ring area on which the clamp mechanism applies a clamp force.
An input-output instruction to the target. Described as CDB.
Control track
A track used to store media parameters and format information required to record
and read data to or from an optical disk.
Defect management
In real time processing mode, defect management refers to an automatic program
used to change the power, focus, tracking of reading and recording if an error is
detected and used to decide whether numerous error sectors should be discarded.
In batch mode, defect management refers to a guideline used to re-record or save
data in a disk.
C156-E228-02EN
GL-1
Glossary
Disk reference surface
An ideal flat ring surface of an ideal spindle that comes into contact with the
clamp area on a disk. The disk reference surface is perpendicular to the rotation
axis.
Error correction code
An error correction code designed to correct specific errors in data.
Error detection and correction
A series of methods used to add a redundant code to data in the existing format
and then record data. In read mode, the decoder removes a redundant code and
detects and corrects errors using the redundant information.
Interleaving section
A process that physically arranges data units so that data resists burst errors.
LUN (Logical Unit Number)
A device address used to identify a logical unit.
Recording layer
A disk layer in which data should be recorded during manufacturing or recording.
Recording power
An incidence power specified on the incidence surface and used to form marks.
Sense code
Sense data
Sense key
Spindle
A single-byte code set in sense data. This information is used to identify the type
of error detected.
Information generated by the target to report detailed error information if a
command end status contains any error information.
A 4-bit code set in sense data. This information is used to classify the type of
error detected.
A disk drive component that comes into contact with a disk and a hub.
GL-2
C156-E228-02EN
Glossary
Status
Single-byte information reported from the target to the initiator at the end of
execution of each command. The status indicates the end status of a command.
C156-E228-02EN
GL-3
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Acronyms and Abbreviations
A
E
AC
Alternating current
Acknowledge
Automatic laser power control
Address mark
EBC
EBP
ECC
EN
Enable blank check
Erase by-pass
Error correcting code
European Norm
ACK
ALPC
AM
ANSI
American National Standards
Institute
EVPD
Enable vital product data
F
ARRE
Automatic read reallocation
enabled
FG
FIFO
Frame ground
First in first out
FmtData Format data
ASC
ASCII
Additional sense code
American Standard Code
forInformation Interchange
Additional sense code qualifier
Attention
FOV
FRU
Format options valid
Field replaceable unit
ASCQ
ATN
AWG
American Wire Gauge
G
AWRE Automatic write
reallocationenabled
GND
Ground
I
B
I/O
IC
ID
IDD
IEC
Input/output
Integrated circuit
Identifier
Intelligent disk drive
International Electrotechnical
Commission
BCV
BPV
BSY
Buffer control valid
Bit pointer valid
Busy
BytChk Byte check
C
Immed
IP
ISO
Immediate
C/D
CDB
CDRH
Control/data
Initialize pattern
International Standardization
Organization
Command descriptor block
Center for Devices and
Radiological Health
CRC
CSA
Cyclic redundancy code
Canadian Standards Association
L
LD
Laser diode
LED
LoEj
LSB
LUN
Light emitting diode
Load eject
Least significant byte
Logical unit number
D
DB
Data bus
Disable block descriptor
Data bus parity
DBD
DBP
DC
DCRT
DDS
DMA
DPO
DPRY
DSP
Direct current
M
Disable certification
Disk definition sector
Defect management area
Disable page out
Disable primary
Digital signal prosessor
MPU
MSB
MSG
MTBF
MTTR
Microprocessor unit
Most significant byte
Message
Mean time between failures
Mean time to repair
C156-E228-02EN
AB-1
Acronyms and Abbreviations
N
T
N.C.
No connection
TTL
Typ
Transister-transister-logic
Typical
O
U
ODD
ODF
OEM
Optical disk drive
Offset detection flag
Original equipment manufacturer
UB
UL
User band
Underwriters Laboratories
Incorporated
P
V
PA
Postamble
P/N
PC
Part number
Page control
VCM
VDE
Voice coil motor
Verband Deutscher
Elektrotechniker
Variable frequency oscillator
Valid
PCA
PCF
PCR
PDL
PEP
PF
Printed circuit assembly
Page control field
Parameter code reset
Primary defect list
Phase encoded part
Page format
VFO
VLD
VPD
VU
Vital product data
Vendor unique
PLL
PMI
PPC
PWM
Phase-locked loop
Partial medium indicator
Parameter pointer control
Pulse width modulation
R
RAM
Random-access memory
RelAdr Relative addressing
REQ
RH
ROM
rpm
RST
RSV
Request
Relative humidity
Read only memory
revolutions per minute
Reset
Reserved
S
S/N
Serial number
SB
Spare band
SCT
SDL
SDTR
SEL
SFP
SG
Sector
Secondary defect list
Synchronous data transfer request
Select
Standard formatted part
Signal groun
SKSV
SM
Sense key specific valid
Sector mark
SNSKEY Sense key
SP
Save page
SP
STPF
SYNC
Save parameter
Stop format
Synchronization mark
AB-2
C156-E228-02EN
Index
128 MB media 2-10
1.3 GB media 2-11
Canada safety standard 1-4
cartridge case 2-9
230 MB media 2-10
25.4 mm height 1-1
540 MB/640 MB media 2-10
catalog 2-1
C/D 7-5
CDRH 1-4
center of gravity 3-11
change of revision number in field 6-4
checking panel function 3-13
checks before mounting the drive 4-12
checks if errors occur at initial self-diagnosis
4-14
A
ACK 7-5
actuator section 1-8
adaptability 1-3
air cleanliness 3-4
algorithm for alternate processing 2-11
allowable input voltage and current 3-14
appearance 1-6, 2-8, 5-6
cleaning 5-1
kit 5-10
optical disk cartridge 5-10
tool for optical disk cartridge 5-10
appearance of
cleaning of
optical disk cartridge 5-7
optical disk drive 5-1
disk surface 5-14
optical disk cartridge 5-11
optical disk drive 5-5
ARBITRATION phase 7-20, 7-21
asynchronous transfer 7-28
ATN 7-5
ATTENTION 7-5
ATTENTION condition 7-40
Australian EMC standard 1-4
automatic allocation of alternate data block
1-3
automatic spindle stop function 1-2
COMMAND phase 7-33
compatibility with international standard
(media interchangeability) 1-2
configuration 1-7
optical disk drive 1-6, 1-7
confirming initial operation 4-14
conformation to SCSI-2 1-4
connecting
one optical disk drive 4-4
more than one optical disk drive 4-4, 4-5
B
connection
mode 4-4
of interface cable 7-10
requirement 3-17
bit error rate after ECC processing 2-5
block diagram of control circuit section 1-9
BSY 7-4
bus condition 7-40
BUS FREE phase 7-18
connection to
middle point of cable 7-10
end of cable 7-10
connector 3-17
bus phase 7-18
sequence 7-46, 7-47
connector and terminal location 3-17
continuous block processing 1-4
control circuit section 1-8
CONTROL/DATA 7-5
bus sequence 7-45
BUSY 7-4
C
CSA C22.2 No. 950 1-4
current waveform
(+5 VDC) 3-14
(reference) 3-14
cable connection 4-13
mode 3-19
requirement 3-19
cable side 7-7
C156-E228-02EN
IN-1
Index
D
F
DATA BUS and SCSI ID 7-4
DATA IN phase 7-33
DATA OUT phase 7-33
DATA phase 7-33
feature 1-1
five-year service life 1-3
function 1-1
data transfer rate
G
in asynchronous mode 7-33
in synchronous mode 7-34, 7-35
general
defective block slipping 1-5
defect management 2-11
schematic diagram 2-11
description 1-1
note 4-1
generation and release of ATTENTION
condition (INIT) 7-40
device type mode 3-23
setting 3-23
diagnostic 6-1
command 6-2
H
half-height standard 90mm (3.5-inch) size
(25.4 mm height) 1-1
head cleaner 5-5
function 1-3, 6-1
disk specification 2-10
dismounting drive 4-17
drive circuit section 1-9
driver and receiver 7-11
dust resistance 1-2
high-capacity data buffer 1-4
high-speed
data transfer 1-1
mean seek time 1-2
E
I
EN60825-1 1-4
EN60950 1-4
electrical requirement 7-11
enhanced error recovery 1-3
if processing terminates abnormally 4-17
INIT 7-40
INFORMATION TRANSFER phase 7-26
identification 7-5
environmental 2-4
requirement 3-1
indication of revision number at shipment
6-4
error rate 2-5
initial self-diagnostic 6-1
European
INPUT/OUTPUT 7-5
inserting optical disk cartridge 5-2, 5-3
inside optical disk cartridge 3-1
safety standard 1-4
laser standard 1-4
example of
installation 4-1, 4-2
direction 3-10
alternate processing 2-12
bus phase transition on execution of a single
command 7-48 to 7-52
SCSI configuration 7-2
requirement 3-1
interface 1-4
external
connector 7-6
light source 3-13
magnetic field 3-13
signal definition 7-3
interface cable 7-9
requirement 7-9
external operator panel 3-20
circuit example 3-21
interface 3-22
interlock type 7-28
I/O 7-5
interface connector 3-22
settings 3-23
L
leak magnetic field 3-13
loading and ejecting optical disk cartridge
1-7
IN-2
C156-E228-02EN
Index
logical specification type setting 3-24
lower power consumption 1-2
low noise 1-3
P
packing 4-2
packing list for cleaning kit 5-10
packing style
individual 4-3
gathered 4-3
M
maintainability 1-3
panel 1-8
parameters used for synchronous data
transfer 7-35
maintenance 6-1
information 6-2
requirement 6-2
MESSAGE 7-5
phase 7-36
performance 1-1
phase control 7-27
MESSAGE IN phase 7-36
MESSAGE OUT phase 7-36
MCM3130SS current waveform (+5 VDC)
3-14
mean time between failure 1-3, 2-6
mechanical section 1-7
media interchangeability 1-2
physical requirement 7-6
placing setting case cover 5-12
positioning error rate 2-5
positions of setting terminal and switch 4-5
power on/off sequence 3-14, 3-15
power requirement 2-4
power supply
mounting 4-12
frame structure 3-12
procedure 4-13
requirement 3-14
cable 3-20
connector 3-16
for terminating resistor 7-12
to SCSI terminating resistor 3-16
requirement 3-4
MPU 6-1
MSG 7-5
power switch off setting 3-17
MTBF 1-3, 2-6
multi-host 4-5
precaution 5-2, 5-9
on mounting 3-12
on use and storage of cleaning kit 5-11
pre-idle mode 4-40
preventive maintenance 6-2
procedure 4-15
N
no overhaul 1-3
noise filter 3-16
notes on drive handling 4-1
R
radio wave standard 1-4
RAM 6-1
random/sequential read test 6-2
read-ahead cache feature 1-4
recommended components for connection
3-20
recommended optical disk cartridge 2-7
reliability 1-3, 2-6
removing optical disk cartridge 5-4
representative model name 2-1
REQ 7-5
REQUEST 7-5
requirement for terminating resistor power
supply 7-12
O
ODD side 7-6
opening shutter 5-11
operability 1-3
operation 5-1
confirmation and preparation for use after
installation 4-14
of optical disk cartridge 5-6
of optical disk drive 5-1
optical disk cartridge 2-8
optical disk drive
(without panel) 1-6
(with panel) 1-6
front view (with panel) 5-1
order number 2-1
outer dimension 3-4 to 3-9
RESELECTION phase 7-24
C156-E228-02EN
IN-3
Index
driving method 7-13
source 7-14
status value 7-13
requirements concerning transition between
bus phases 7-37
RESET 7-5
condition 7-42, 7-44
response against ATTENTION condition
(TARG) 7-41
response sequence 7-22, 7-25
specification 2-1
specification of
disk 2-10
revision
label 6-3
number 6-3
number indication 6-4
drive 2-2
optical disk cartridge 2-7
optical disk drive 2-1
RST 7-5
spindle motor 1-7
start sequence 7-24
S
without ARBITRATION phase 7-22
with ARBITRATION phase 7-22
safety standard 1-4
SCSI BUS 7-1
STATUS phase 7-36
storage 4-3
connection mode 4-4, 4-5
timing specification 7-17
SCSI cable 3-20
storing cartridge 5-9
SCSI connection check 4-15, 4-16
SCSI connector 3-18
surface temperature measurement point 3-1
synchronous mode 7-29
SCSI controller circuit section 1-9
SCSI data bus parity checking 4-8
(SW1) 4-8
system ground (handling of SG and FG)
3-13
system configuration 7-1
SCSI ID 4-8
switching direction of transfer over data bus
7-38
setting (SW1) 4-8
SCSI interface 7-11
connector 7-6, 7-7
T
connector pin assignment 7-8
Taiwanese EMC standard 1-4
TARG 7-40
SCSI terminating resistor mode 4-11
(CNH1) 4-11
SCSI terminating resistor power supply
(CNH1) 4-10
temperature measurement point 3-1
(reference) 3-3
temperature requirement 3-2
at measurement point 3-2
SCSI termination circuit 7-12
SCSI type 0 3-24
SEL 7-5
SELECT 7-5
SELECTION phase 7-22, 7-23
separte optical section 1-8
temperature rise 3-3
terminal 3-17
termination circuit 7-12
test program 6-2
time monitoring
service
of ACK response wait 7-32
in INFORMATION TRANSFER phase
7-38
area 3-13
life 2-6, 6-2
system and repair 6-2
in RESELECTION phase 7-38
feature 7-38
setting 4-5
checklist 4-12
of supplying power to SCSI terminating
resistor 4-10
optical disk cartridge into setting case 5-12
switches (SW1) 4-7
timing
rule 7-15
specification 7-15 to 7-17
timeout procedure 7-24, 7-26
value of SCSI time monitoring 7-39
transfer
from INIT to TARG 7-28, 7-31
from TARG to INIT 7-28, 7-31
in asynchronous mode 7-29
in synchronous mode 7-32
single-ended type 7-8
single
host 4-4
IN-4
C156-E228-02EN
Index
transportation 4-3
W
transporting cartridge 5-9
while drive is
U
powered off 5-3, 5-4
powered on 5-2, 5-4
UL1950 1-4
unpackaging 4-1
drive 3-18
wide-ranging operating environment 1-3
write cache
feature 1-5
using cartridge 5-9
mode 4-9
mode setting 4-9
U.S.
safety standard 1-4
laser standard 1-4
write protect tab 2-9, 5-8
write/read test 6-2
write verify mode setting 3-23
V
verify mode 3-23
C156-E228-02EN
IN-5
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Date issued:
Manual name: MCM3064SS, MCM3130SS,
MCP3064SS, MCP3130SS OPTICAL
DISK DRIVES PRODUCT MANUAL
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C156-E228-02EN
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