DELL AW2521HB
1
1. Disassembly Procedures
Unlock 4 screws on rear cover
S1
S2
Turn off power
S6
Use hands or scraper bar to
disassemble Rear Cover from the
monitor.
Place the monitor on a soft cloth or
cushion
Carefully slide and remove the I/O
cover from the monitor.
Notice the disassembly order:
Left Side=> Top Side=>Right
Side=>Bottom Side
Disconnect the cables from the monitor
and slide them out through the cable-
management slot on the stand riser
S3
(Screw Torque: 8-10 kgf)
Remove USB FFC and Audio FFC from
I/F BD
S7
Press and hold the stand release button
S4
Disconnect LED Driver BD wire and
CTRL FFC cable from I/F BD
S8
Take off Rear Cover
Lift the stand up and away from the
monitor.
S5
DELL AW2521HB
3
Disconnect USB FFC and Audio FFC
from USB BD
Tear off 6 tapes on Backlight Wire
S17
S19
Disconnect Backlight Wire from I/F BD
Remove FFC cable from Rear Cover,
CTRL BD and CTRL+KEY BD
S18
Unlock 6 screws to disassemble CTRL
BD and CTRL+KEY BD from Rear
Cover
Disconnect “CTRL+LENS BD FFC”
from I/F BD and remove it from Panel
and Main SHD
S20
Disconnect Light Sensor BD FFC from
I/F BD and remove it from Panel and
Main SHD
(Screw Torque: 2.0±0.5 kgf)
S21
Unlock MF screw*16 to disassemble
the Middle Frame from Panel (Yellow
Mark)
Disassemble Light Sensor BD from
Middle Frame
S22
S
S
Unlock 4 screws to disassemble Main
SHD from Panel (Blue Mark)
Unlock 2 screws to disassemble Power
Button module from Middle Frame
(Screw Torque-MF: 4.5±0.5 kgf)
(Screw Torque-Main SHD: 4.0±0.5 kgf)
Tear off an acetate tape and a tensile
tape from EDP cable
(Screw Torque:1.1±0.1kgf)
S23
Disconnect FFC cable from
“CTRL+LENS BD” (Power CTRL BD)
S28
Disconnect EDP cable from Panel
Take off Main SHD from Panel
S24
Tear off “MYLAR PWR-LENS“ from
“CTRL+LENS BD” (Power CTRL BD)
S29
S30
Tear off the adhesive tape from the
connector of Backlight wire
S25
Unlock 2 screws to disassemble
“CTRL+LENS BD” (Power CTRL BD)
from Power Button
Disconnect Backlight Wire from Panel
(Screw Torque: 2±0.5kgf)
DELL AW2521HB
5
Unlock 1 screw to disassemble Docking
BD from Main SHD
Disassemble I/F BD and SPS BD from
Main SHD
S31
S34
Disassemble wire from Docking BD
Disconnect I/F BD to Docking BD wire
from I/F BD
S35
Disconnect wire from I/F BD and SPS
BD
(Screw Torque: 8.5±1.0kgf)
Disassemble Safety mylar from Main
SHD
S32
Disconnect Fan Cable from I/F BD
Tear off an adhesive tape from EDP
cable on I/F BD
S36
S33
Disconnect EDP cable from I/F BD
Unlock 9 PCBA screws to disassemble
I/F BD and SPS BD
Unlock 4 screws to disassemble G-
SYNC+Heatsink Module from I/F BD
S37
(Screw Torque: 8.5±1kgf)
(Screw Torque: 4.0±0.5 kgf)
Remove electrolyte capacitors (red mark) from printed circuit boards
S38
S38-1 Cut the glue between bulk cap. and PCB with a knife
S38-2 Ensure cutting path within the glue, don’t touch bulk cap. or PCB
DELL AW2521HB
7
S38-3 Take out bulk cap. pin solder with soldering iron and absorber
S39-4 Lift the bulk cap. up and away from the PCB
DELL AW2521HB
8
2. Product material information
The following substances, preparations, or components should be disposed of or
recovered separately from other WEEE in compliance with Article 4 of EU Council
Directive 75/442/EEC.
Capacitors / condensers (containing
PCB/PCT)
No used
Mercury containing components
Batteries
No used
No used
Printed circuit boards (with a surface greater
than 10 square cm)
Product has printed circuit boards
(with a surface greater than 10 square
cm)
Component contain toner, ink and liquids
Plastic containing BFR
Component and waste contain asbestos
CRT
Component contain CFC, HCFC, HFC and
HC
No used
No used
No used
No used
No used
Gas discharge lamps
No used
LCD display > 100 cm2
Product has an LCD greater than 100
cm2
External electric cable
Product has external cables
No used
No used
Product has electrolyte capacitors
(height >25mm, diameter > 25mm)
Component contain refractory ceramic fibers
Component contain radio-active substances
Electrolyte capacitors (height
> 25mm, diameter > 25mm)
3. Tools Required
List the type and size of the tools that would typically can be used to disassemble the
product to a point where components and materials requiring selective treatment can be
removed.
Tool Description:
- Screwdriver
- Scraper Bar
- Penknife
- Soldering iron and absorber
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