TS64M~1
GRMMC4
MMCmobile
Description
Features
TS64MRMMC4 ~ TS1GRMMC4 is a 64MB ~ 1GB
MMCmobile memory card. It’s a fastest, low-power,
highly integration memory card. TS64MRMMC4 ~
TS1GRMMC4 is designed to provide an inexpensive,
mechanically robust storage medium in card form for
multimedia consumer applications and mobile
devices (handheld PCs, digital cameras, MP3
players, etc.) to store, copy, and move data at
high-speed transfer rate.
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Storage Capacity: 64MB ~ 1GB
Support Dual Operating Voltage: 2.7~3.6V/1.65~1.95V
Support clock frequencies: 0~52MHz
Support different Bus width: x1, x4, x8
Operating Temperature: -25°C ~ 85°C
Data access mode: Byte mode
Fully compatible with MultiMediaCard system
specification version 4.0 and backwards compatibility
with previous specification
•
Form Factor: 18mm x 24mm x 1.4mm
Placement
Front
Back
Pin Definition
MMC Mode
SPI Mode
Pin No.
Name
Type
Description
Data
Name
CS
Type
Description
Chip select
Data in
1
2
DAT3
CMD
I/O/PP
I/O/PP/OD
S
I
I/PP
S
Command/Response
Ground
Power supply
Clock
DI
3
VSS1
VDD
VSS
VDD
SCLK
VSS2
DO
Ground
4
S
S
Power supply
Clock
5
CLK
I
I
6
VSS2
DAT0
DAT1
DAT2
DAT4
DAT5
DAT6
DAT7
S
Ground
Data
S
Ground
7
I/O/PP
I/O/PP
I/O/PP
I/O/PP
I/O/PP
I/O/PP
I/O/PP
O/PP
Data out
8
9
10
11
12
13
Data
Data
Data
Data
Not used
Not used
Not used
Not used
Not used
Not used
Data
Data
S: Power Supply; I:Input; O:Output; PP:Push-Pull; OD:Open-Drain; NC:Not Connected
1
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TS64M~1
GRMMC4
MMCmobile
Temperature Characteristics
Parameter
Min.
Max.
Unit
Operating temperature
-25
85
℃
Electrical Characteristics
• Absolute Maximum Ratings
Parameter
Power Supply Voltage
Input Voltage
Symbol
VCC
Rating
-0.6~+4.6
-0.6~+4.6
-0.6~+4.6
Unit
V
VIN
V
Input/Output Voltage
VI/O
V
• Recommended Operation Conditions
Parameter
Symbol
Min.
Typ.
Max.
Unit
Power Supply Voltage (High Voltage Range)
VDDH
VDDL
2.7
3.3
3.6
V
Power Supply Voltage (Low Voltage Range)
1.65
1.8
1.95
V
3
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TS64M~1
GRMMC4
MMCmobile
DC Characteristics
• High Voltage Power Supply
(Ta=-25℃to 85℃,VDDH=2.7V to3.6V)
Typ.
Parameter
Output Low Voltage (OD)
Output High Voltage (PP)
Output Low Voltage (PP)
Input High Voltage
Symbol
VODOL
VOH
VOL
VIH
Min.
Max.
Unit
V
Condition
0.3
IOL =2mA
0.75* VDDH
V
IOH =-100uA
0.125* VDDH
VDDH +0.3
0.25* VDDH
20(TBD)
400(TBD)
-10/+10
-10/+10
7
V
IOL =100uA
0.625* VDDH
-0.3
V
Input Low Voltage
VIL
V
Operating Current
ICC
mA
uA
uA
uA
pF
V
IVCCF =0mA
Stand-by Current
ISB
Input Leakage Current
Output Leakage Current
Pin Capacitance
ILI
VIN =0 to VDDH
ILO
VOUT =0 to VDDH
CP
1.8
Power Output Voltage
VF
1.50
1.95
IF＜＝240mA
• Low Voltage Power Supply
(Ta=-25℃to 85℃,VDDL=1.65V to 1.95V)
Typ.
Parameter
Output High Voltage
Output Low Voltage
Input High Voltage
Input Low Voltage
Symbol
VOH
VOL
VIH
Min.
Max.
Unit
V
Condition
IOH =-100uA
IOL =100uA
VDDL -0.2
0.2
V
0.7* VDDL
-0.3
VDDL +0.3
0.3* VDDL
20(TBD)
400(TBD)
-10/+10
-10/+10
7
V
VIL
V
Operating Current
ICC
mA
uA
uA
uA
pF
IVCCF =0mA
Stand-by Current
ISB
Input Leakage Current
Output Leakage Current
Pin Capacitance
ILI
VIN =0 to VDDL
ILO
VOUT =0 to VDDL
CP
4
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TS64M~1
GRMMC4
MMCmobile
AC Characteristics
• High Speed Card Interface Timing
(Ta=-25℃to 85℃,VDDH=2.7V to3.6V)
Parameter
Clock Frequency (Data Transfer Mode)
Clock Frequency (Identification Mode)
Clock Low Time
Symbol
fpp
Min.
26
Max.
52
Unit
MHz
KHz
ns
Notes
fOD
0
400
tWL
6.5
Clock Rise Time
tTLH
tTHL
tISU
3
3
ns
Clock Fall Time
ns
Input Set-up Time
3
3
5
ns
Input Hold Time
tIH
ns
CL＜＝30pF
CL＜＝30pF
CL＜＝30pF
Output Delay Time
tDLY
14
3
ns
Signal Rise Time
Signal Fall Time
trise
tfall
ns
ns
3
5
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TS64M~1
GRMMC4
MMCmobile
• Backwards Compatible Card Interface Timing
(Ta=-25℃to 85℃,VDDH=2.7V to3.6V)
Parameter
Clock Frequency (Data Transfer Mode)
Clock Frequency (Identification Mode)
Clock Low Time
Symbol
fpp
Min.
0
Max.
20
Unit
MHz
KHz
ns
Notes
fOD
0
400
tWL
10
Clock Rise Time
tTLH
tTHL
tISU
10
10
ns
Clock Fall Time
ns
Input Set-up Time
3
3
ns
Input Hold Time
tIH
ns
CL＜＝30pF
Output Delay Time
tDLY
9.7
35
ns
6
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TS64M~1
GRMMC4
MMCmobile
• Command Latch Cycle
Parameter
Symbol Min. Unit
Notes
30
15
40
90
90
75
45
90
30
CLE Setup Time
CLE Hold Time
CE Setup Time
CE Hold Time
tCLS1
tCLH1
tCS1
ns
ns
ns
ns
ns
ns
ns
ns
ns
CL<=80pF
CL<=80pF
CL<=80pF
CL<=80pF
CL<=80pF
CL<=80pF
CL<=80pF
CL<=80pF
CL<=80pF
tCH1
ALE Setup Time
ALE Hold Time
WE Pulse Width
Data Setup Time
Data Hold Time
tALS1
tALH1
tWP1
tDS1
tDH1
• Address Latch Cycle
7
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TS64M~1
GRMMC4
MMCmobile
Parameter
Symbol
tCLS2
tCS2
Min. Unit
Remark
CL<=80pF
CL<=80pF
CL<=80pF
CL<=80pF
CL<=80pF
CL<=80pF
CL<=80pF
CL<=80pF
CL<=80pF
90
195
30
CLE Setup Time
ns
ns
ns
ns
ns
ns
ns
ns
ns
CE Setup Time
ALE Setup Time
ALE Hold Time
Write Cycle Time
WE Pulse Width
WE High Hold Time
Data Setup Time
Data Hold Time
tALS2
tALH2
tWC2
tWP2
15
150
45
105
90
tWH2
tDS2
30
tDH2
• Input Data Latch Cycle
8
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TS64M~1
GRMMC4
MMCmobile
Parameter
Symbol
tCLH3
tCH3
Min.
285
195
90
Unit
Remark
CLE Hold Time
ns CL<=80pF
ns CL<=80pF
ns CL<=80pF
ns CL<=80pF
ns CL<=80pF
ns CL<=80pF
ns CL<=80pF
ns CL<=80pF
CE Hold Time
ALE Setup Time
Write Cycle Time
WE Pulse Width
WE High Hold Time
Data Setup Time
Data Hold Time
tALS3
tWC3
tWP3
60
45
15
tWH3
tDS3
30
30
tDH3
9
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TS64M~1
GRMMC4
MMCmobile
• Serial Access Cycle after Read
Parameter
Symbol Min.
Unit
Remark
285
60
CE Access Time
Read Cycle Time
RE Pulse Width
RE High Hold Time
Data Setup Time
Data Hold Time
Ready to RE Low
tCEA4
tRC4
tRP4
ns CL<=80pF
ns CL<=80pF
ns CL<=80pF
ns CL<=80pF
ns CL<=80pF
ns CL<=80pF
ns CL<=80pF
45
15
tREH4
tDS4
tDH4
tRR4
5(TBD)
5(TBD)
285
10
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TS64M~1
GRMMC4
MMCmobile
Reliability and Durability
Temperature
Operation: -25°C / 85°C
Storage: -40°C (168h) / 85°C (500h)
Junction temperature: max. 95°C
Operation: 25°C / 95% rel. humidity
Stress: 40°C / 93% rel. hum./500h
Salt Water Spray: 3% NaCl/35C; 24h acc. MIL STD Method 1009
Contact Pads:
Moisture and corrosion
ESD protection
+/-4kV, Human body model according to ANSI EOS/ESD-S5.1-1998
Non Contact Pads area:
+/-8kV(coupling plane discharge)
+/-15kV(air discharge)
Human body model according to IEC61000-4-2
10.000 mating cycles; test procedure: t.b.d.
t.b.d.
Durability
Bending
Torque
t.b.d.
Drop test
1.5m free fall
UV light exposure
Visual inspection
Shape and form
UV: 200nm, 15Ws/cm² according to ISO 7816-1
No warp page; no mold skin; complete form; no cavities surface smoothness sigma
-0.1 mm/cm² within contour; no cracks; no pollution (fat, oil dust, etc.)
Above technical information is based on MMC4.0 standard specification and tested to be reliable. However, Transcend
makes no warranty, either expressed or implied, as to its accuracy and assumes no liability in connection with the use of
this product. Transcend reserves the right to make changes in specifications at any time without prior notice.
11
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