User’s Guide
2001
Mixed-Signal Products
SLOU023A
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Preface
Related Documentation From Texas Instruments
TI Plug-N-Play Audio Amplifier Evaluation Platform (literature
number SLOU011) provides detailed information on the evaluation
platform and its use with TI audio evaluation modules.
TPA112 150-mW Stereo Audio Power Amplifier (literature
number SLOS212) This is the data sheet for the TPA112 audio
amplifier integrated circuit.
FCC Warning
This equipment is intended for use in a laboratory test environment only. It
generates, uses, and can radiate radio frequency energy and has not been
tested for compliance with the limits of computing devices pursuant to subpart
J of part 15 of FCC rules, which are designed to provide reasonable protection
against radio frequency interference. Operation of this equipment in other
environments may cause interference with radio communications, in which
case the user at his own expense will be required to take whatever measures
may be required to correct this interference.
Trademarks
TI is a trademark of Texas Instruments Incorporated.
iii
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iv
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Contents
1
2
3
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.1
1.2
1.3
Feature Highlights . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
TPA112 MSOP EVM Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
Quick Start . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.1
2.2
2.3
Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Quick Start List for Platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
Quick Start List for Stand-Alone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.1
3.2
Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
The TPA112 MSOP Audio Amplifier Evaluation Module . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
3.2.1 TPA112 Audio Amplifier IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
3.2.2 Module Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
Using The TPA112 MSOP EVM With The Plug-N-Play Evaluation Platform . . . . . . . . . 3-6
3.3.1 Installing and Removing EVM Boards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
3.3.2 Signal Routing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
3.3.3 Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
3.3.5 Inputs and Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
Using The TPA112 MSOP EVM Stand-Alone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
3.4.1 TPA112 MSOP EVM Connected as a Stereo Headphone Amplifier . . . . . . . . 3-10
TPA112 MSOP Audio Amplifier Evaluation Module Parts List . . . . . . . . . . . . . . . . . . . . 3-11
3.3
3.4
3.5
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Figures
1–1
2–1
2–2
3–1
3–2
3–3
3–4
3–5
3–6
3–7
The TI TPA112 MSOP Audio Amplifier Evaluation Module . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
Quick Start Platform Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
Quick Start Module Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
The TI Plug-N-Play Audio Amplifier Evaluation Platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
TPA112 MSOP EVM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
TPA112 MSOP EVM Schematic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
TPA112 Audio Amplifier IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
Platform Signal Routing and Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
Typical Headphone Plug . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
TPA112 MSOP EVM Connected as a Stereo Headphone Amplifier . . . . . . . . . . . . . . . . . 3-10
Tables
2–1
Typical TI Plug-N-Play Platform Jumper and Switch Settings for the
TPA112 MSOP EVM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Platform Jumper and Switch Settings for the TPA112 MSOP EVM . . . . . . . . . . . . . . . . . . . 2-3
TPA112 MSOP EVM Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11
2–2
3–1
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Chapter 1
Introduction
This chapter provides an overview of the Texas Instruments (TI ) TPA112
MSOP audio amplifier evaluation module (SLOP126). It includes a list of EVM
features, a brief description of the module illustrated with a pictorial diagram,
and a list of EVM specifications.
Topic
Page
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3
1.3 TPA112 MSOP EVM Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3
1-1
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Features
1.1 Features
The TI TPA112 MSOP audio amplifier evaluation module and the TI
plug-n-play audio amplifier evaluation platform include the following features:
TPA112 MSOP Stereo Audio Power Amplifier Evaluation Module
Dual channel, single-ended operation
150-mW output power per channel into 8 Ω at 5 V
2.5-V to 5.5-V operation
Distortion — THD+N is less than 0.01% @ 1 kHz and less than 0.02%
from 20 Hz to 20 kHz into 10-kΩ loads; less than 0.06% @ 1 kHz and
less than 1% from 20 Hz to 20 kHz into 32-Ω loads; and less than 0.1%
@ 1 kHz and less than 2% from 20 Hz to 20 kHz into 8-Ω loads
Internal thermal and short-circuit protection
Quick and Easy Configuration With the TI Plug-N-Play Audio Amplifier
Evaluation Platform
Evaluation module is designed to simply plug into the platform,
automatically making all signal, control, and power connections
Platform provides flexible power options
Jumpers on the platform select power and module control options
Switches on the platform route signals
Platform provides quick and easy audio input and output connections
Platform Power Options
Onboard 9-V battery
External 5-V – 15-V (V ) supply inputs
CC
External regulated V
supply input
DD
Socket for onboard 5-V V
voltage regulator EVM
DD
Onboard overvoltage and reverse polarity power protection
Platform Audio Input and Output Connections
Left and right RCA phono jack inputs
Miniature stereo phone jack input
Left and right RCA phono jack outputs
Left and right compression speaker terminal outputs
Miniature stereo headphone jack output
1-2
Introduction
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Description
1.2 Description
The TPA112 MSOP audio power amplifier evaluation module is a complete,
low-power stereo audio power amplifier for high-fidelity line-level output,
headphone, and small speaker applications. It consists of the TI TPA112
150-mWstereoaudiopoweramplifierICinaverysmallMSOPpackage, along
with a small number of other parts mounted on a circuit board that is
approximately one and a quarter inches square (Figure 1–1).
Figure 1–1. The TI TPA112 Audio Amplifier Evaluation Module
Vdd
GND
TEXAS
INSTRUMENTS
+
C5
IN1–
C4 R7
IN1+
C1
R8
R1
R2
R3
R4
C2
Vo1
GND
R5
R6
C6
U2
C3
C7
R10
R9
GND
Vo2
JP1
IN2–
SLOP126
TPA112 MSOP EVM
IN2+
†
Due to the very small size of the MSOP IC package, the standard part number TPA112 is replaced with the code TIAAD
Single in-line header pins are mounted to the underside of the module circuit
board to allow the EVM to either be plugged into the TI plug-n-play audio
amplifier evaluation platform, or to be wired directly into existing circuits and
equipment when used stand-alone.
The platform has room for a single TPA112 evaluation module. It is a
convenient vehicle for demonstrating TI’s audio power amplifier and related
evaluation modules. The EVMs simply plug into the platform, which
automatically provides power to the modules, interconnects them correctly,
andconnectsthemtoaversatilearrayofstandardaudioinputandoutputjacks
and connectors. Easy-to-use configuration controls allow the platform and
EVMs to quickly model many possible end-equipment configurations.
There is nothing to build, nothing to solder, and nothing but the speakers
included with the platform to hook up.
1.3 TPA112 MSOP EVM Specifications
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5 V to 5.5 V
DD
Supply current, I
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 mA, max
DD
Continuous output power, P : 8 Ω, V =5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 mW
O
DD
Audio input voltage, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
+ 0.3 Vpp, max
I
DD
Minimum load impedance, R . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Ω
L
1-3
Introduction
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1-4
Introduction
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Chapter 2
Quick Start
The steps in this chapter can be followed to quickly prepare the TPA112MSOP
audio amplifier EVM for use. Using the TPA112 MSOP EVM with the TI
plug-n-play audio amplifier evaluation platform is a quick and easy way to
connect power, signal and control inputs, and signal outputs to the EVM using
standard connectors. However, the audio amplifier evaluation module can be
used stand-alone by making connections directly to the module pins, and can
be wired directly into existing circuits or equipment.
The platform switch and jumper settings shown in Table 2–1 are typical for the
TPA112 MSOP EVM.
Table 2–1. Typical TI Plug-N-Play Platform Jumper and Switch Settings for the
TPA112 MSOP EVM
EVM
JP6
JP7
JP8
S2
S3
TPA112
X
X
X
Note 2
U5
Notes: 1) X = Don’t care
2) Set S2 to ON when signal conditioning board is installed in U1; set S2
to OFF when no signal conditioning board is installed.
Topic
Page
2.1 Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2
2.2 Quick Start List for Platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–3
2.3 Quick Start List for Stand-Alone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4
2-1
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Precautions
2.1 Precautions
Power Supply Input Polarity and Maximum Voltage
Always ensure that the polarity and voltage of the external power
connected to V
power input connector J1, J2, and/or V
power
CC
DD
input connector J6 are correct. Overvoltage or reverse-polarity
power applied to these terminals can open onboard soldered-in
fuses and cause other damage to the platform, installed evaluation
modules, and/or the power source.
Inserting or Removing EVM Boards
Do not insert or remove EVM boards with power applied — damage
to the EVM board, the platform, or both may result.
Figure 2–1. Quick Start Platform Map
5b
5b
1
10
5b
ICC
JP4
C1+
F1
VR1
DC
Power
In/Out
5a
Power
Input
5b
R2
R1
Audio
Power
Amps
Signal Conditioning
Audio
Input
7
Speaker
Output
Mode
Mute
Polarity
Lo
****CAUTION****
Do not insert or remove
EVM boards with power
applied
Hi
Stereo
Headphone
Output
8
Plug-N-Play Audio Amplifier
Evaluation Platform
SLOP097 Rev. C.1
HP Out
R3
R4
R5
3
2
4
2-2
Quick Start
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Quick Start List for Platform
2.2 Quick Start List for Platform
Follow these steps when using the TPA112 MSOP EVM with the TI plug-n-play
audio amplifier evaluation platform (see the platform user’s guide, SLOU011,
for additional details). Numbered callouts for selected steps are shown in
Figure 2–1 and details appear in Chapter 3.
Platform preparations
1) EnsurethatallexternalpowersourcesaresettoOFF andthattheplatform
power switch S1 is set to OFF.
2) Install a TPA112 MSOP module in platform socket U5, taking care to align
the module pins correctly.
3) Use switch S2 to select or bypass the signal conditioning EVM (U1).
4) Set Hp source switch S3 to U5 to route the output signal to the headphone
Jack (J10).
Table 2–2. Platform Jumper and Switch Settings for the TPA112 MSOP EVM
EVM
JP6
JP7
JP8
S2
S3
TPA112
X
X
X
Note 2
U5
Notes: 1) X = Don’t care
2) Set S2 to ON when signal conditioning board is installed in U1; set S2
to OFF when no signal conditioning board is installed.
Power supply
5) Select and connect the power supply:
a) Connect an external regulated power supply set to a voltage between
2.5 V and 5.5 V to platform V power input connector J6, taking care
DD
to observe marked polarity,
or
b) Install a 3-V to 5-V voltage regulator EVM (SLVP097 or equiv.) in
platform socket U6. Install a 9-V battery in B1 or connect a 7 V – 12
V power source to a platform V power input J1 or J2 and jumper the
CC
appropriate power input (see platform user’s guide).
Inputs and outputs
6) Ensure that signal source level is set to minimum.
7) Connect the audio source to left and right RCA phono jacks J3 and J5 or
stereo miniature phone jack J4.
8) Connect 32-Ω headphones to headphone jack J10.
Power up
9) Verify correct voltage and input polarity and set the external power supply
to ON. If V and an onboard regulator EVM are used to provide V , set
CC
DD
platform power switch S1 to ON.
Platform LED2 should light indicating the presence of V , and the evaluation
DD
modules installed on the platform should begin operation.
10) Adjust the signal source level as needed.
2-3
Quick Start
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Quick Start List for Stand-Alone
2.3 Quick Start List for Stand-Alone
Follow these steps to use the TPA112 MSOP EVM stand-alone or to connect
it into existing circuits or equipment. Connections to the TPA112 MSOP
module header pins can be made via individual sockets, wire-wrapping, or
soldering to the pins, either on the top or the bottom of the module circuit board
(Figure 2–2). Details appear in Chapter 3.
Figure 2–2. Quick Start Module Map
Vdd
GND
TEXAS
INSTRUMENTS
+
C5
IN1–
C4 R7
IN1+
C1
R8
R1
R2
R3
R4
C2
Vo1
GND
R5
R6
C6
U2
C3
C7
R10
R9
GND
Vo2
JP1
IN2–
SLOP126
TPA112 MSOP EVM
IN2+
†
Due to the very small size of the MSOP IC package, the standard part number TPA112 is replaced with the code TIAAD
Power supply
1) Ensure that all external power sources are set to OFF.
2) Connect an external regulated power supply set to 5 V to the module VDD
and GND pins, taking care to observe marked polarity.
Inputs and outputs
3) Ensure that the signal source level is set to minimum.
4) Connect a differential audio signal source between module pins IN1+ and
IN1– (right channel) and between pins IN2+ and IN2– (left channel). If a
single-ended audio source is used, connect it to IN1– and IN2– (right and
left channels), and ground both IN1+ and IN2+.
5) Connect 32-Ω headphones to the module V 1, V 2 pins through 33 µF
O
O
to 1000 µF output-coupling capacitors (figure 3–8) and return to the GND
pin, or
6) For line output, connections to the V 1 and V 2 pins must be made
O
O
through 33 µF to 1000 µF output-coupling capacitors and returned to
GND.
Power-up
7) Verify correct voltage and input polarity and set the external power supply
to ON.
The EVM should begin operation.
8) Adjust the signal source level as needed.
2-4
Quick Start
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Chapter 3
Details
This chapter provides details on the TPA112 IC, the evaluation module, the
steps in the Quick-Start List, additional application information, and a parts list
for the TPA112 MSOP evaluation module.
Topic
Page
3.1 Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2
3.2 The TPA112 MSOP Audio Power Amplifier Evaluation Module . . . . 3–3
3.3 Using The TPA112 MSOP EVM With The Plug-N-Play
Evaluation Platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–6
3.4 Using The TPA112 MSOP EVM Stand-Alone . . . . . . . . . . . . . . . . . . . 3–10
3.5 TPA112 MSOP Audio Power Amplifier EVM Parts List . . . . . . . . . . . 3–11
3-1
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Precautions
3.1 Precautions
Power Supply Input Polarity and Maximum Voltage
Always ensure that the polarity and voltage of the external power
connected to V
power input connector J1, J2, and/or V
power
CC
DD
input connector J6 are correct. Overvoltage or reverse-polarity
power applied to these terminals can open onboard soldered-in
fuses and cause other damage to the platform, installed evaluation
modules, and/or the power source.
Inserting or Removing EVM Boards
Do not insert or remove EVM boards with power applied — damage
to the EVM board, the platform, or both may result.
Figure 3–1. The TI Plug-N-Play Audio Amplifier Evaluation Platform
ICC
JP4
C1+
F1
VR1
DC
Power
In/Out
Power
Input
R2
R1
Audio
Power
Amps
Signal Conditioning
Audio
Input
Speaker
Output
Mode
Mute
Polarity
Lo
****CAUTION****
Do not insert or remove
EVM boards with power
applied
Hi
Stereo
Headphone
Output
Plug-N-Play Audio Amplifier
Evaluation Platform
SLOP097 Rev. C.1
HP Out
R3
R4
R5
3-2
Details
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The TPA112 MSOP Audio Power Amplifier Evaluation Module
3.2 The TPA112 MSOP Audio Power Amplifier Evaluation Module
The TPA112 MSOP audio power amplifier evaluation module is powered by
a TPA112 150-mW stereo audio amplifier IC. It can drive either line-level
outputs, 32-Ω headphones, or 8-Ω speakers. A single-supply operational
amplifier (TLV2211) on the module provides a buffered midpoint voltage to
properly bias the noninverting inputs of the TPA112 amplifier IC.
The evaluation module can be used with the TI plug-n-play audio amplifier
evaluation platform (Figure 3–1) or wired directly into circuits or equipment.
The module has single in-line header connector pins mounted to the under
side of the board. These pins allow the module to be plugged into the TI
platform, whichautomaticallymakesallthesignalinputandoutput, power, and
control connections to the module. The module connection pins are on
0.1-inch centers to allow easy use with standard perf board and plug
board-based prototyping systems. Or, the EVM can be wired directly into
existing circuits and equipment when used stand-alone.
The module appears in Figure 3–2 and its schematic is shown in Figure 3–3.
Figure 3–2. TPA112 MSOP EVM
Vdd
GND
TEXAS
INSTRUMENTS
+
C5
IN1–
C4 R7
IN1+
C1
R8
R1
R2
R3
R4
C2
Vo1
GND
R5
R6
C6
U2
C3
C7
R10
R9
GND
Vo2
JP1
IN2–
SLOP126
TPA112 MSOP EVM
IN2+
†
Due to the very small size of the MSOP IC package, the standard part number TPA112 is replaced with the code TIAAD
Figure 3–3. TPA112 MSOP EVM Schematic Diagram
Vo1
C4
R7
0.1 µF
8
20 kΩ
1
V
DD
Vo1
V
DD
IN–
R8
82 kΩ
2.5 to 5.5 V
C6
1 µF
+
C5
10 µF
Audio
Input 1
2
3
C1
0.1 µF
R1
20 kΩ
GND
IN 1–
7
IN+
IN 1+
Vo2
Vo2
R10
82 kΩ
R2
82 kΩ
TPA112
MSOP
V
DD
C2
0.1 µF
R5
20 kΩ
R4
20 kΩ
6
5
4
IN 2–
Mid
GND
U2
+
IN+
IN 2+
R3
82 kΩ
_
C3
Mid
Audio
Input 2
C7
0.1 µF
1 µF
U1
R9
20 kΩ
IN–
R6, 20 kΩ
3-3
Details
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The TPA112 MSOP Audio Power Amplifier Evaluation Module
3.2.1 TPA112 Audio Amplifier IC
The TPA112 audio amplifier IC is a CMOS device intended primarily for
high-performance line-level output, headphone driver, and small speaker
applications. It is supplied in both a SOIC and a very small surface-mount
MSOP package and has been designed to operate from low supply voltages
(between approximately 2.5 V and 5.5 V) and to deliver up to approximately
150 mW into 8-Ω speakers. As a line-level driver, distortion levels (THD+N)
are below 0.02% into 10-kΩ loads across the audio band (20 Hz to 20 kHz).
As a headphone driver, distortion levels are below 1% into 32-Ω loads across
the audio band. And as a speaker driver, distortion levels are below 2% into
8-Ω loads across the audio band. Typical applications include portable
computers, desktop computers, personal audio, toys, games, and similar
audio applications.
The IC includes two separate internal amplifiers with onboard short-circuit and
over-temperature protection circuits (Figure 3–4). The load for each channel
is connected between the V pin and GND through a coupling capacitor. For
O
more information, see the TPA112 amplifier IC data sheet, TI Literature
Number SLOS212.
Figure 3–4. TPA112 Amplifier IC
V
8
1
DD
Short-Circuit
Protection
V
DD
IN1–
2
3
V
1
O
O
–
IN1+
+
IN2–
6
5
V
2
7
4
–
IN2+
+
Over-Temperature
Protection
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The TPA112 MSOP Audio Power Amplifier Evaluation Module
3.2.2 Module Gain
The TPA112 MSOP evaluation module has a set gain of 4 (inverting) for each
channel. However, the gain can be adjusted to a maximum of approximately
10 (inverting) by changing the value of feedback resistors (R8 and R10, Figure
3–3). Use the following equation to determine the value of R
F:
RF
RI
Gain
–
The TPA112 amplifier IC, like most other amplifiers, exhibits its best distortion
and noise performance at lower gain levels. In addition, higher gain levels
require a small compensation capacitor to ensure stability (see the TPA112
data sheet).
Gain versus total harmonic distortion (THD) and gain versus signal-to-noise
ratio (SNR) should be considered in each application. Both the module input
signal level and the TPA112 MSOP module gain should be adjusted to obtain
the lowest overall distortion level for a particular overall gain. A quick rule of
thumb (everything else being equal): the module input signal level should be
as high as possible without clipping or overloading the TPA112 input, and the
TPA112 gain should be kept as low as possible.
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Using The TPA112 MSOP EVM With the Plug-N-Play Evaluation Platform
3.3 Using The TPA112 MSOP EVM With the Plug-N-Play Evaluation Platform
The TPA112 MSOP audio amplifier evaluation module is designed for use with
the TI plug-n-play audio amplifier evaluation platform. It simply plugs into
socket U5.
The following paragraphs provide additional details for using the TPA112 EVM
with the platform.
3.3.1 Installing and Removing EVM Boards
TI plug-n-play evaluation modules use single-in-line header pins installed on
the underside of the module circuit board to plug into sockets on the platform.
The EVM pins and the platform sockets are keyed such that only the correct
type of EVM can be installed in a particular socket, and then only with the
proper orientation.
Evaluation modules are easily removed from the platform by simply prying
them up and lifting them out of their sockets. Care must be taken, however, to
prevent bending the pins.
3.3.1.1 EVM Insertion
1) Remove all power from the evaluation platform.
2) Locate socket U5 on the platform.
3) Orient the module correctly.
4) Carefully align the pins of the module with the socket pin receptacles.
5) Gently press the module into place.
6) Check to be sure that all pins are seated properly and that none are bent
over.
3.3.1.2 EVM Removal
1) Remove all power from the evaluation platform.
2) Using an appropriate tool as a lever, gently pry up one side of the module
a short distance.
3) Change to the opposite side of the module and use the tool to pry that side
up a short distance.
4) Alternate between sides, prying the module up a little more each time to
avoid bending the pins, until it comes loose from the socket.
5) Lift the EVM off the platform.
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Using The TPA112 MSOP EVM With the Plug-N-Play Evaluation Platform
3.3.2 Signal Routing
Signal flow on the platform is controlled by two signal routing switches, as
shown in Figure 3–5.
Figure 3–5. Platform Signal Routing and Outputs
U2 Stereo Power
Amplifier EVM
Off
U3
+
Mono Power
Amplifier EVM
R
R
L
R
–
J7, J8, J9
Speaker
Outputs
U1
Signal
Conditioning
Audio
Input
S2
U4
–
L
Mono Power
Amplifier EVM
+
L
On
U2–U4
R
+
R
U5
TPA112 MSOP
Headphone
Amplifier EVM
–
J10
Headphone
Output
GND
S3
L
–
+
L
U5
3.3.2.1 Signal Conditioning
The audio signal from the input jacks can be applied to the signal conditioning
socket (U1) if an EVM is installed there, or socket U1 can be bypassed and the
audio input signal applied directly to the inputs of the TPA112 power amplifiers.
Switch S2 selects or bypasses signal conditioning.
3.3.2.2 Headphone Output Jack
Switch S3 is the source select for the stereo headphone output jack, J10. The
headphone jack is capacitively coupled (via 470 µF electrolytics). It can output
either the signal from the the TPA112 MSOP headphone amplifier in socket U5
or the signal from power amplifiers installed in socket U2 or in sockets U3 and
U4, as determined by the setting of headphone source select switch S3.
When S3 is set to the headphone amplifier position (U5), the headphone jack
is connected to the headphone amplifier EVM output lines. When a plug is
inserted into the jack, signals output through J10 are returned to platform
ground.
Switch S3 connects the headphone jack to either the headphone amplifier
platform socket (U5) or to the platform power amplifier sockets (U2 – U4).
3-7
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Using The TPA112 MSOP EVM With the Plug-N-Play Evaluation Platform
3.3.3 Power Requirements
TheTPA112MSOPaudiopoweramplifierevaluationmodulecanoperatefrom
a V voltage between approximately 2.5 V and 5.5 V.
DD
The TI plug-n-play audio amplifier evaluation platform with a voltage regulator
EVM installed on it can provide a regulated 3.3-V or 5-V V supply from a
DD
wide variety of unregulated V
voltage inputs between approximately 5.5 V
CC
and 12 V, including an onboard 9-V battery. Or, an external regulated power
source can be used to supply V voltage to the platform and the TPA112
DD
evaluation module installed on it.
The platform is equipped with overvoltage and reverse-polarity supply voltage
input protection in the form of fused crowbar circuits.
V
voltage applied to platform screw terminals J6 MUST NOT exceed
DD
the absolute maximum rating for the TPA112 amplifier IC installed on the
evaluation module (5.5 V), or damage to the IC may result. In no case
shouldV voltageoftheincorrectpolarityorinexcessof6.1Vbeapplied
DD
to screw terminals J6 of the platform, or the power protection circuit on the
V
line will trip.
DD
V
voltage applied to the platform MUST NOT exceed the maximum
CC
voltage input specified for the voltage regulator module installed in socket
U6 (12 V for the SLVP097), or damage to the voltage regulator module
may result. In no case should V
voltage applied to the platform exceed
CC
15 V, or the overvoltage protection circuit on the V
bus will trip.
CC
3-8
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Using The TPA112 MSOP EVM With the Plug-N-Play Evaluation Platform
3.3.4 Inputs and Outputs
The TI plug-n-play audio amplifier evaluation platform is equipped with several
standard conectors for audio inputs and outputs.
3.3.4.1 Inputs
In most cases, audio signals enter the platform through either a pair of RCA
phono jacks (J3 and J5) or a miniature (1/8″) stereo phone jack (J4). Certain
signal conditioning and amplifier EVMs, however, may have additional signal
input connectors mounted on the module circuit board.
The platform audio signal input jacks (J3, J4, and J5) are of the closed-circuit
type, grounding the signal input lines when no plugs are inserted.
3.3.4.2 Outputs
Output signals from the headphone amplifier (U5) leave the platform through
a miniature (1/8″) stereo headphone jack (J10). Amplified audio output signals
from the power amplifiers (U2 – U4) leave the platform through left and right
RCA phono jacks (J7 and J9), left and right pairs of compression connectors
for stripped speaker wires (J8), and optionally, through the headphone jack.
The audio output lines from the power amplifiers are separate all the way to
the edge of the platform (output jacks J7, J8, and J9) — the OUT– lines from
the power amplifier sockets are not tied to each other or to platform ground.
This allows the power amplifier EVMs to operate in the highly-efficient
bridge-tied load configuration.
The headphone jack (J10) is capacitively coupled to source select switch S3,
which connects J10 to the output lines of either the headphone amplifier
socket or the power amplifier sockets (Figure 3–5). When the TPA112 MSOP
EVM output signal is routed to J10 by S3, signals output via J10 are returned
to platform ground when a plug is inserted (Figure 3–6).
Figure 3–6. Typical Headphone Plug
Left
Right
GND
3-9
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Using The TPA112 MSOP EVM Stand-Alone
3.4 Using The TPA112 MSOP EVM Stand-Alone
Using the TPA112 MSOP audio power amplifier evaluation module
stand-alone is much the same as using it with the platform. The same 2.5-V
to 5.5-V power supply requirement exists.
3.4.1 TPA112 MSOP EVM Connected as a Stereo Headphone Amplifier
Figure 3–7. TPA112 MSOP EVM Connected as a Stereo Headphone Amplifier
5 VDC
Vdd
GND
TEXAS
INSTRUMENTS
+
Audio
Input
(Right)
C5
IN1–
C4 R7
IN1+
C1
R8
R1
R2
R3
R4
C2
Vo1
+
+
GND
33 µF – 1000 µF
R5
R6
C6
U2
C3
C7
R10
R9
33 µF – 1000 µF
GND
Vo2
JP1
Audio
Input
(Left)
IN2–
SLOP126
TPA112 MSOP EVM
IN2+
†
Due to the very small size of the MSOP IC package, the standard part number TPA112 is replaced with the code TIAAD
3-10
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TPA112 MSOP Audio Power Amplifier Evaluation Module Parts List
3.5 TPA112 MSOP Audio Power Amplifier Evaluation Module Parts List
Table 3–1. TPA112 MSOP EVM Parts List
EVM
Qty.
Manufacturer/
Part Number
Ref.
Description
Size
Vendor/Number
Newark
C3, C6
Capacitor, 1 µF, +80%/
–20%, nonpolarized, SMD
0603
2
1
4
6
4
1
Murata
GRM39-Y5V105Z10PT
C5
Capacitor, 10 µF, 6.3 V,
A
Panasonic
ECS-TOJY106R
Digi-Key
PCS1106CT-ND
SMD
C1, C2,
C4, C7
Capacitor, 0.1 µF, +80%/
–20%, nonpolarized, SMD
0603
Murata
GRM39-Y5V104Z10PT
Newark
R1, R9,
R4 – R7
Resistor, 20 kΩ, 1/16 W,
5%, SMD
0603
Panasonic
ERJ-3GSYJ203
Digi-Key
P20KGCT-ND
R2, R3,
R8, R10
Resistor, 82 kΩ, 1/16 W,
5%, SMD
0603
Panasonic
ERJ-3GSYJ823
Digi-Key
P82KGCT-ND
U1
IC, TPA112, audio
amplifier, 150 mW,
2-channel, SMD
MSOP-8
TI
†
TPA112DGN
U2
IC, TLV2211,
SOT23
1
TI
single-supply operational
amplifier, SMD
Terminal post headers
11
1
Sullins
Digi-Key
S1022-36-ND
PCB1
PCB, TPA112 MSOP EVM
SLOP126
†
Due to the very small size of the MSOP IC package, the standard part number TPA112 is replaced with the code TIAAD
3-11
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