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User’s Guide
April 2001
PMP PD & PS
SLVU048
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Preface
Read This First
How to Use This Manual
This document contains the following chapters:
- Chapter 1—Introduction
- Chapter 2—48-V Telecom Hot Swap
- Chapter 3—Schematics of the EVM and the Interface Card
- Chapter 4—Layouts of the EVM and the Interface Card
- Chapter 5—Setup of the EVM
- Chapter 6—Test Points
FCC Warning
This equipment is intended for use in a laboratory test environment only. It gen-
erates, uses, and can radiate radio frequency energy and has not been tested
for compliance with the limits of computing devices pursuant to subpart J of
part 15 of FCC rules, which are designed to provide reasonable protection
against radio frequency interference. Operation of this equipment in other en-
vironments may cause interference with radio communications, in which case
the user at his own expense will be required to take whatever measures may
be required to correct this interference.
iii
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Contents
1
2
3
4
5
6
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
48-V Telecom Hot-Swap EVM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Schematics of the EVM and the Interface Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Layouts of the EVM and the Interface Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
Setup of the EVM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Test Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
Figures
3–1
3–2
4–1
4–2
5–1
Schematic of the Interface Card (SLVP155) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Schematic of the 48-V Hot-Swap EVM (SLVP184) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
Top Layer of the Interface Card and Placement of the Components . . . . . . . . . . . . . . . . . . 4-2
Top Layer of the 48-V Hot-Swap EVM and Placement of Components . . . . . . . . . . . . . . . 4-3
Evaluation Setup of the Hot-Swap Board EVM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2
Tables
3–1
3–2
Components on the Interface Card (SLVP155), Bill of Materials . . . . . . . . . . . . . . . . . . . . . 3-3
Components on the 48-V Hot-Swap EVM (SLVP184), Bill of Materials . . . . . . . . . . . . . . . 3-3
v
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Chapter 1
Introduction
Fast development of telecommunications and networks has accelerated
growth of products with hot-plug capability to ensure that systems are always
on. Many hot-swap or hot-plug devices are already available in the worldwide
market. However, most such devices are for low-voltage applications,
whereas 48-V is a standard voltage in most communication systems. The
TPS23xx series of hot-swap controllers are principally designed for low
voltage applications, but can also be used in very high voltage systems if
appropriately designed.
The TPS2330 is a Texas Instruments hot-swap controller that eliminates high-
frequency hot-plug or hot-removal transients, reduces inrush current, and pro-
vides overcurrent protection. To demonstrate this hot-swap controllability at
high-voltage systems, an evaluation module has been developed, as present-
ed in this user’s guide. The evaluation module (EVM) can help designers eval-
uate the hot-swap controller and simulate hot-insertion and hot-removal ac-
tions under varied conditions.
Users will need a 48-V dc voltage supply to test the operation of the EVM.
1-1
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1-2
Introduction
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Chapter 2
48ĆV Telecom HotĆSwap EVM
With the rapid growth of internet and telecommunications in general, more and
more electronic systems are required to run continuously. Therefore,
redundant systems or modules may be required to prevent the crashing of
systems. While redundant systems have proved feasible, they are also very
costly. Further, a simple redundant system as a backup is often inadequate
because any errant part in the backup can jeopardize the whole system. Thus,
we should develop ways to update the system regularly or remove errant parts
and insert new modules while the system is still running. Central to such
requirements for today’s electronic systems is the hot-plug or hot-swap
capability.
The TPS2330 is a single-channel hot-swap controller that uses external
N-channel MOSFETs in hot-swap applications. The device integrates features
such as overcurrent protection, inrush current control, output-power status
reporting, and separation of load transients from actual load increases, which
are the critical requirements for hot-swap applications. For a detailed
description of functions and characteristics of the TPS2300, refer to the data
sheet, literature number SLVS265A. Check data sheet and ordering
information on Web site:
Because telecommunications applications often use –48-V or 48-V power
supplies, a few external components (including a Zener diode and a resistor)
are needed to make the TPS2330 suitable to meet the voltage requirements.
To assist designers in the evaluation of the hot-swap controllers for such high-
voltage applications, a set of evaluation modules has been developed: one is
the 48-V telecom hot-swap EVM, and the other is an interface card.
The following chapters will present the schematics, layouts, and evaluation
procedures for the EVM.
2-1
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2-2
48-V Telecom Hot-Swap EVM
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Chapter 3
Schematics of the EVM and the Interface Card
The evaluation kit includes two boards: one is the hot-swappable
TPS2330EVM-184 48-V hot-swap EVM (SLVP184 board) where the
TPS2330 controls voltage ramp-up and reduces inrush current during hot-plug
events; the other is an interface card (SLVP155 board) that supplies power to
the 48-V hot-swap board.
Figures 3–1 and 3–2 show the schematic of the interface card and the
schematic of the hot-swappable EVM respectively.
Figure 3–1. Schematic of the Interface Card (SLVP155)
P1
J1
VIN3: 3 – 12 V
+
+
C1
150 µF
C4
10 µF
C7
1 µF
Key
J2
J3
GND
VIN1: 3 – 12 V
C2
C5
C8
150 µF
10 µF
1 µF
R1
10 kΩ
J4
J5
GND
VIN2: 3 – 5 V
+
C3
220 µF
C6
10 µF
C9
1 µF
S1
J6
R2
10 kΩ
GND
3-1
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Because the interface card was originally designed for universal application
purposes, some of the components shown in the schematic above may not be
on the board when shipped with this EVM kit. Refer to the bill of materials table
for a complete component list.
A key is installed in the edge connector on the interface board (SLVP155) to
ensure that the hot-swap board can only be inserted the right direction.
Figure 3–2. Schematic of the 48-V Hot-Swap EVM (SLVP184)
56 kΩ
56 kΩ
56 kΩ
R14
R13
R12
R11
R10
R7
56 kΩ
56 kΩ
56 kΩ
56 kΩ
56 kΩ
R2
R1
C1
3-2
Schematics of the EVM and the Interface Card
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The bills of materials (BOM) for both boards are shown in Tables 3–1 and 3–2,
respectively.
Table 3–1.Components on the Interface Card (SLVP155), Bill of Materials
Ref Des
C1, C2, C3
C4, C6
C5
Qty
Not used
Not used
1
Part Number
Description
Mfg
Size
12061C104KAT2A Capacitor, ceramic, 0.1-µF, 1100-V, +X7R, 10%, Y5V
Taiyo
Yuden
1210
C7, C8, C9
J3, J4
J1,J2,J5, J6
P1
Not used
2
Not used
1
3267
Connector, banana jack, uninsulated
Pomona
50–22SN–11
Connector, 44-pin edge w/mtg tabs (for 0.062” PCB)
Resistor, chip, 10 kΩ, 1/10 W, 5%
SW–1C–200 MA-SL
Cinch
Std
R1, R2
S1
Not used Std
1206
Not used EG1218
TP1
1
240–345
Test point, red, 1 mm
Farnell
Farnell
TP5
1
240–333
Test point, black, 1 mm
TP2–TP3
TP4,TP6
Key
Not used
Not used
1
4
4
50–PK–3
Key for P1 (Newark #57F3275)
Cinch
534–1804
Spacer, aluminum, 4–40 female, 0.625” long
Screw, pan head phillips, 4–40 × 0.25”
Mouser
Table 3–2.Components on the 48-V Hot-Swap EVM (SLVP184), Bill of Materials
RefDes
Qty
Part Number
Description
Mfg
Size
805
C1
C3
1
08055A102JAT2A
Capacitor, ceramic, 0.001-µF, 50-V, COG, 5%
AVX
1
GRM4034X7R104K50V Capacitor, ceramic, 0.1-µF, 25-V, X7R, 10%
Murata
AVX
805
C2, C6, C7
3
12061C104KAT2A
Capacitor, ceramic, 0.1-µF, 100-V, X7R, 10%
Capacitor, ceramic, 4.7-µF, 35-V
1206
C4
C5
C8
P1
D1
J1
1
GMK316F475Z
Taiyo-Yuden 1206
1
SEK101M100ST
Capacitor, OS-CON, 100-µF, 100-V, 20%
Capacitor, ceramic, 0.1-µF, 50-V, 10%
Connector, 44-pin dual edge PCB pattern
Diode, Zener, 5.1-V, 49-mA, 1W
Sanyo
Kemet
NA
0.500”
1
C0805C104k5RAC
805
1
NA
1
1N4733A
On Semi
Sullins
Std
DO-41
1
PTC36SAAN
Header, 3-pin, 100-mil spacing, (36-pin strip)
Resistor, chip, 5.1 kΩ, 1/8-W, 1%
Resistor, chip, 33 kΩ, 1/10-W, 5%
Resistor, chip, 0-Ω, 1/8-W, 5%
R4
R6
R8
R3
R5
1
Std
Std
Std
Std
Std
Std
805
805
805
805
805
1206
1
Std
1
Std
1
Resistor, chip, 100 kΩ, 1/8-W, 5%
Resistor, chip, 890 kΩ, 1/8-W, 5%
Resistor, chip, 56 kΩ, 1/8-W, 5%
Std
1
Std
R1, R2, R7,
R10, R11,
R12, R13,
R14
8
Std
U1
1
TPS2330ID
IC, single hot-swap power controller w/circuit
breaker and PG
TI
SO14
TP5
1
6
240-333
240-345
Test point, black, 1 mm
Test point, red, 1 mm
Farnell
Farnell
TP1-TP4,
TP6, TP7
Q2
1
IRF530N
MOSFET, N-ch,100-V, 17A, .11-mΩ
IRF
TO-22
0AB
3-3
Schematics of the EVM and the Interface Card
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C4 and C8 on SLVP184 adjust the output turnon ramp-up rate and propagation
delay time. Reducing the capacitance of C8 will increase the output ramp-up
speed, and decreasing the value of C4 will reduce the output turnon delay time
and increase the output ramp-up rate.
3-4
Schematics of the EVM and the Interface Card
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Chapter 4
Layouts of the EVM and the Interface Card
The following figures illustrate the placements of the components and the
top-layer layouts for both the 48-V hot-swap EVM and the interface card
respectively. All the components are placed on the top layers except for the
0.1-µF capacitor (C8) on SLVP184 that has now been included on the bottom
layer. (The bottom layers are mainly ground planes).
4-1
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Figure 4–1. Top Layer of the Interface Card and Placement of the Components
Top Layer
Top Assembly
4-2
Layouts of the EVM and the Interface Card
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Figure 4–2. Top Layer of the 48-V Hot-Swap EVM and Placement of Components
Top Layer
Top Assembly
4-3
Layouts of the EVM and the Interface Card
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4-4
Layouts of the EVM and the Interface Card
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Chapter 5
Setup of the EVM
For proper operation of the EVM, one 48-V power supply, and a voltage meter
or an oscilloscope are required.
Refer to the setup diagram in Figure 5–1 and follow these steps for hot plug
testing:
1) Verify that the power-supply voltage is set at 48 V. Make sure the supply
has the capability to provide the current loads need. Turn off the supply.
2) Connect a meter or oscilloscope to monitor the voltages from Vout+ (pin 1
of J1) to Vout– (pin 2 of J1) on the SLVP184 board.
3) Plug the supply into the interface card; connect the supply from IN1 to
ground. Then turn on the power supply. Check the voltage from VIN1 to
GND, which should be about 48 V.
4) Plug the hot-swap board (SLVP184) into the interface board (SLVP155).
The key installed between pins 1 and 2 of the edge connector insures that
the board can only be inserted in the correct direction.
5) Test points or headers are provided for oscilloscope probes and/or multi-
meters. Read the voltage from the multimeters connecting from Vout+ to
Vout– on SLVP184. The value of the meter should be about 48 V. Other-
wise, the board may have problems or the testing may not be correct.
6) Unplug the SLVP184 board from the interface card.
More evaluations such as adding loads to the output rails, can be performed
by following procedures similar to those presented above.
5-1
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Figure 5–1. Evaluation Setup of the Hot-Swap Board EVM
Power Supply
48–V, 1–A Supply
–
+
Plug SLVP184 board
into edge connector.
Note key and slot loctions.
5-2
Setup of the EVM
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Chapter 6
Test Points
Two test points are available on the interface card (SLVP155):
TP1 – VIN1 (input voltage)
TP5 – GND (ground)
On the 481-V hot-swap EVM, there are total 7 test points:
TP1 – Gate of the IRF530N MOSFET
TP2 – Input (VIN) of TPS2330
TP3 – VIN+ (EVM positive input rail, same as Vout+)
TP4 – Vout+ (EVM positive output rail, same as VIN+)
TP5 – Power-good output
TP6 – Vout– (EVM negative output rail)
TP7 – VIN– (EVM negative input rail)
6-1
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6-2
Test Points
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