Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series
Datasheet DC-DC Power Modules
Xeta iHG Half Brick
48V Input, 3.3V/70A Output
TDK Innoveta Inc.
3320 Matrix Drive, Suite 100
Plano, Texas 75082
Phone (877) 498-0099 Toll Free
Information furnished by TDK Innoveta is believed to be accurate and reliable. However, TDK Innoveta
(469) 916-4747
(877) 498-0143 Toll Free
(214) 239-3101
assumes no responsibility for its use, nor for any infringement of patents or other rights of third parties,
which may result from its use. No license is granted by implication or otherwise under any patent or patent
Fax
rights of TDK Innoveta. TDK Innoveta components are not designed to be used in applications, such as life
support systems, wherein failure or malfunction could result in injury or death. All sales are subject to TDK
Innoveta’s Terms and Conditions of Sale, which are available upon request. Specifications are subject to
change without notice.
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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series
Ordering information:
Output
Current/
Power
070
Main
Output
Voltage
033
Product
Identifier
Package
Size
Input
Voltage
Output
Units
# of
Outputs
Mechanical
Feature
Electrical
Feature Set
Platform
i
H
G
48
A
V
-
0
02
02-R
Standard,
RoHS
0 - No base
plate
1- With base
plate
TDK
Innoveta
Xeta
Half Brick
36-75V
70
Amps
033 – 3.3V
Single
Compliant
Feature
Set
000
On/Off
Logic
Positive
Omit
pin3
Yes
Pin
Length
0.145”
Base-
plate
No
Output OVP
Output OCP
OTP
Latching
Latching
Auto-Recovery
Auto-Recovery
Auto-Recovery
Auto-Recovery
Auto-Recovery
001
002
003
Negative
Positive
Negative
Yes
Yes
Yes
Auto-Recovery
Auto-Recovery
Auto-Recovery
0.145”
0.145”
0.145”
No
No
No
Auto-Recovery
Auto-Recovery
OVP: Over Voltage Protection; OCP: Over Current Protection; OTP: Over Temperature Protection.
Product Offering:
Maximum Output
Code
Input Voltage
36V to 75V
Output Voltage
3.3V
Output Current
70A
Efficiency
90%
Power
iHG48070A033V-002-R
231W
TDK Innoveta Inc
3320 Matrix Drive, Suite 100
Richardson, Texas 75082
Phone (877) 498-0099 Toll Free
(469) 916-4747
Fax
(877) 498-0143 Toll Free
(214) 239-3101
℡
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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series
Mechanical Specification:
Dimensions are in mm [in]. Unless otherwise specified tolerances are: x.x ± 0.5 [0.02], x.xx and x.xxx ± 0.25 [0.010].
2.03 [0.080] Dia Pin
3.00 [0.118] Dia Stand-off
2 Places
1.02 [0.040] Dia Pin
1.83 [0.072] Dia Stand-off
6 Places
1
2
9
8
7
6
5
4
Recommeded hole pattern (top view)
Pin Assignment:
PIN
1
2
FUNCTION
PIN
FUNCTION
Trim
Sense (+)
Vout (+)
Vin (+)
On/Off
N/A
7
8
9
3
4
5
6
Vin (-)
Vout (-)
Sense (-)
Pin base material is copper with matte tin plating. The maximum module weight is 63g.
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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series
Absolute Maximum Ratings:
Stress in excess of Absolute Maximum Ratings may cause permanent damage to the device.
Characteristic
Min
Max
Unit
Notes & Conditions
Continuous Input Voltage
-0.5
80
Vdc
Transient Input Voltage
Isolation Voltage
---
---
100
1500
125
Vdc
Vdc
˚C
100mS max.
Storage Temperature
-55
Measured at the location specified in the thermal
measurement figure.
Operating Temperature Range (Tc)
-40
123
˚C
*
Engineering estimate
Input Characteristics:
Unless otherwise specified, specifications apply over all Rated Input Voltage, Resistive Load, and Temperature conditions.
Characteristic
Min
Typ
Max
Unit
Notes & Conditions
Operating Input Voltage
36
48
75
Vdc
Maximum Input Current
Turn-on Voltage
Turn-off Voltage
Hysteresis
---
---
---
---
---
8
A
Vin = 0 to Vin,max, Io,max, Vo=Vo,nom
34.2
32.5
1.7
36
---
---
Vdc
Vdc
Vdc
Vo = 0 to 0.1*Vo,nom; on/off =on,
Io=Io,max, Tc=25˚C
Vo = 0 to 0.1*Vo,nom; Vin = Vi,nom,
Io=Io,max,Tc=25˚C
Io=Io,max,Tc=25˚C, Vo=0.1 to
0.9*Vo,nom
Startup Delay Time from application of input voltage
Startup Delay Time from on/off
---
---
---
8
3
---
---
---
mS
mS
mS
Output Voltage Rise Time
24
Vin=0V to Vin,max and module on/off
pin is in ‘off’ state
Standby Current
0
5
7
mA
Inrush Transient
---
---
---
---
14
60
0.1
---
---
A2s
See input/output ripple measurement
figure; BW = 20 MHz
Input Reflected Ripple
Input Ripple Rejection
mApp
dB
@120Hz
*
Engineering Estimate
Caution: The power modules are not internally fused. An external input line normal blow fuse with a maximum value of 15A is required; see the Safety
Considerations section of the data sheet.
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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series
Electrical Data (continued):
Operating at Tc = 25˚C unless otherwise specified
Characteristic
Output Voltage Initial Setpoint
Min
3.25
Typ
3.3
Max
3.35
Unit
Vdc
Notes & Conditions
Vin=Vin,nom; Io=Io,max
Output Voltage Tolerance
3.2
---
3.4
Vdc
Over all rated input voltage, load, and
temperature conditions to end of life
Vin=Vin,nom; Io=Io,max
Efficiency
---
---
---
---
0
90
3
---
%
mV
mV
mV
A
Line Regulation
Load Regulation
Temperature Regulation
Output Current
10*
10*
50*
70
Vin=Vin,min to Vin,max
Io=Io,min to Io,max
1
20
---
Tc=Tc,min to Tc,max
At Io < 20% of Io,max, the load transient
performance may degrade slightly
Output Current Limiting Threshold
Short Circuit Current
---
---
82
2
---
---
A
A
Vo = 0.9*Vo,nom, Tc < Tc,max
Vo = 0.25V, Tc = 25C (hiccup mode)
Output Ripple and Noise Voltage
---
---
25
50*
---
mVpp
Vin=48V and Tc=25˚C. Measured across one
10uF, one 0.47uF, one 0.1uF ceramic
capacitors, and one 220uF electrolytic
capacitor – see input/output ripple
5.5
mVrms
measurement figure; BW = 20MHz
Output Voltage Adjustment Range
Output Voltage Sense Range
50
---
---
---
110
---
%Vo,nom
%Vo,nom
Dynamic Response:
Recovery Time
Vin=Vin,nom; load step from 50% to 75% of
Io,max, di/dt = 0.1A/uS, with at least one
0.1uF, one 0.47uF, one 10uF ceramic
capacitors, and 220uF electrolytic capacitor
across the output terminals
---
---
200
70
---
---
µS
Transient Voltage
mV
For applications with large step load changes
and/or high di/dt load changes, please
contact TDK Innoveta for support.
Io=Io,max
Output Voltage Overshoot during startup
Switching Frequency
0
0
0
mV
kHz
V
---
260
---
Fixed
Output Over Voltage Protection
External Load Capacitance
All line, load, and temperature conditions
3.8*
230
4.1
---
4.4*
40,000**
uF
All charge and pre-bias start conditions.
Cext,min required for the 100% load dump.
Minimum ESR > 2 mΩ
Isolation Capacitance
Isolation Resistance
Vref
---
2000
---
---
---
pF
All line, load, and temperature conditions
15
All line, load, and temperature conditions
Required for trim calculation
MΩ
1.225
V
* Engineering Estimate
** Contact TDK Innoveta for applications that require additional capacitance
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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series
Electrical Characteristics:
94
90
86
82
78
74
35
30
25
20
15
10
5
0
7
14
21
28
35
42
49
56
63
70
7
14
21
28
35
42
49
56
63
70
Output Current (A)
Output Current (A)
Vin = 36V
Vin = 48V
Vin = 75V
Vin = 60V
Vin = 36V
Vin = 48V
Vin = 75V
Vin = 60V
Efficiency vs. Input Voltage at Ta=25C, (test in socket)
Power Dissipation vs. Input Voltage at Ta=25C
Start-up from on/off Switch at 48V input and Full Load.
Ch. 1: ON/OFF Ch. 3: Vo Ch. 4: Io
Typical Output Ripple at 48V Input and Full Load at
Ta=25C Ch. 3: Vo
Start-up from Input Voltage Application at Full Load.
Transient Response. Load Step from 50% to 75% of
Full Load with di/dt= 0.1A/uS. Ch. 1: Vo Ch. 3: Io
Ch. 1: Vin
Ch. 3: Vo
Ch. 4: Io Load
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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series
Electrical Characteristics (continued):
3.6
3
10
8
2.4
1.8
1.2
0.6
0
6
4
2
0
0
10
20
30
40
50
60
70
80
90
30
35
40
45
50
55
60
65
70
75
Output Current (A)
Input Voltage (V)
Vin = 36V
Vin = 48V
Vin = 75V
Vin = 60V
Io_min = 7A
Io_mid = 35A
Io_max = 70.7A
Output Current Limit Characteristics vs. Input Voltage
Typical Input Current vs. Input Voltage Characteristics
3.3
3.299
3.298
3.297
3.296
3.295
3.299
3.298
3.297
3.296
3.295
3.294
7
14
21
28
35
42
49
56
63
70
36
40
44
48
52
56
60
64
68
72
76
Output Current (A)
Input Voltage (V)
Vin = 36V
Vin = 48V
Vin = 75V
Vin = 60V
Io_min = 7A
Io_mid = 35A
Io_max = 70.7A
Typical Output Voltage vs. Load Current at Ta=25C.
Typical Output Voltage vs. Input Voltage at Ta=25C.
%
Change
of Vout
Trim
Down
Resistor
(Kohm)
%
Change
of Vout
Trim Up
Resistor
(Kohm)
3.6
3
2.4
1.8
1.2
0.6
0
-3%
-5%
31.33K
18K
+3%
+5%
57.16K
34.57K
17.63K
-10%
8K
+10%
e.g. trim up 5%
30
31
32
33
34
35
36
37
38
3.3
5%
− 2 ⋅ (1+ 5%) +1
Input Voltage (V)
1.225
Rup
=
= 34.57(kΩ)
Io_min = 7A
Io_mid = 35A
Io_max = 70.7A
Typical Output Voltage vs. Low Voltage Input Turn-on
and Turn-off at Ta=25C
Calculated Resistor Values for Output Voltage Adjustment
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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series
Electrical Characteristics (continued):
1000
100
10
1
10000
1000
100
10
0
0
2
4
6
8
10
0
10
20
30
40
% Increase in Output Voltage, (%)
% Decrease in Output Voltage, (%)
∆
∆
Output Trim down curve for output voltage adjustment
Trim up curve for output voltage adjustment
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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series
Thermal Performance:
70
60
50
40
30
20
70
60
50
40
30
20
30
40
50
60
70
80
90
100
110
120
130
30
40
50
60
70
80
90
100
110
120
130
Ambient Temperature (C)
Ambient Temperature (C)
NC 0.3 m/s (60 LFM)
1.5 m/s (300 LFM)
0.5 m/s (100 LFM)
2.0 m/s (400 LFM)
1.0 m/s (200 LFM)
3.0 m/s (600 LFM)
NC 0.3 m/s (60 LFM)
1.5 m/s (300 LFM)
0.5 m/s (100 LFM)
2.0 m/s (400 LFM)
1.0 m/s (200 LFM)
3.0 m/s (600 LFM)
Max MOSFET Temperature
Max MOSFET Temperature
Maximum output current vs. ambient temperature at nominal
input voltage for airflow rates natural convection (0.3m/s) to
3.0m/s with airflow from pin 4 to 1.
Maximum output current vs. ambient temperature at nominal
input voltage for airflow rates natural convection (0.3m/s) to
3.0m/s with airflow from pin 1 to pin 4.
Thermal
Measurement
Location (Drain
pad of MOSFET)
Thermal measurement location – top view
The thermal curves provided are based upon measurements made in TDK Innoveta’s experimental test setup that is
described in the Thermal Management section. Due to the large number of variables in system design, TDK Innoveta
recommends that the user verify the module’s thermal performance in the end application. The critical component
should be thermo-coupled and monitored, and should not exceed the temperature limit specified in the derating curve
above. It is critical that the thermocouple be mounted in a manner that gives direct thermal contact otherwise significant
measurement errors may result.
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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series
Thermal Management:
The cross section of the airflow passage is
An important part of the overall system
design process is thermal management;
thermal design must be considered at all
levels to ensure good reliability and lifetime
of the final system. Superior thermal design
and the ability to operate in severe
application environments are key elements
of a robust, reliable power module.
rectangular with the spacing between the
top of the module and a parallel facing PCB
kept at a constant (0.5 in). The power
module’s orientation with respect to the
airflow direction can have a significant
impact on the unit’s thermal performance.
Adjacent PCB
A finite amount of heat must be dissipated
from the power module to the surrounding
environment. This heat is transferred by the
three modes of heat transfer: convection,
conduction and radiation. While all three
modes of heat transfer are present in every
application, convection is the dominant
mode of heat transfer in most applications.
However, to ensure adequate cooling and
proper operation, all three modes should be
considered in a final system configuration.
Module
Centerline
A
I
R
F
L
O
12.7
(0.50)
The open frame design of the power module
provides an air path to individual
components. This air path improves
convection cooling to the surrounding
environment, which reduces areas of heat
concentration and resulting hot spots.
76 (3.0)
AIRFLOW
Air Velocity and Ambient Temperature
Air Passage
Test Setup: The thermal performance data
of the power module is based upon
measurements obtained from a wind tunnel
test with the setup shown in the wind tunnel
figure. This thermal test setup replicates the
typical thermal environments encountered in
most modern electronic systems with
Measurement Location
Centerline
Wind Tunnel Test Setup Figure
Dimensions are in millimeters (inches)
Thermal Derating: For proper application of
the power module in a given thermal
environment, output current derating curves
are provided as a design guideline in the
Thermal Performance section for the power
module of interest. The module temperature
should be measured in the final system
configuration to ensure proper thermal
management of the power module. For
thermal performance verification, the module
temperature should be measured at the
distributed
power
architectures.
The
electronic equipment in networking, telecom,
wireless, and advanced computer systems
operates in similar environments and utilizes
vertically mounted printed circuit boards
(PCBs) or circuit cards in cabinet racks.
The power module is mounted on a 0.087
inch thick, 12-layer, 2oz/layer PCB and is
vertically oriented within the wind tunnel.
Power is routed on the internal layers of the
PCB. The outer copper layers are thermally
decoupled from the converter to better
simulate the customer’s application. This
also results in a more conservative derating.
location
indicated
in
the
thermal
measurement location figure in the Thermal
Performance section for the power module
of interest. In all conditions, the power
module should be operated below the
maximum operating temperature shown on
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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series
the derating curve. For improved design
margins and enhanced system reliability, the
power module may be operated at
temperatures below the maximum rated
operating temperature.
Heat transfer by convection can be
enhanced by increasing the airflow rate that
the power module experiences.
The
maximum output current of the power
module is a function of ambient temperature
(TAMB) and airflow rate as shown in the
thermal performance figures on the thermal
performance page for the power module of
interest. The curve in the figures is shown
for natural convection and up. The data for
the natural convection condition has been
collected at 0.3 m/s (60 ft/min) of airflow,
which is the typical airflow generated by
other heat dissipating components in many
of the systems that these types of modules
are used in.
In the final system
configurations, the airflow rate for the natural
convection condition can vary due to
temperature gradients from other heat
dissipating components.
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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series
Operating Information:
Over-Current-Protection (OCP): The power
The standard on/off logic is positive logic. The
modules have current limit protection to
protect the module during output overload and
short circuit conditions. During overload
conditions, the power modules may protect
themselves by entering a hiccup current limit
mode. The modules will operate normally once
the output current returns to the specified
power module will turn on if terminal 2 is left
open and will be off if terminal 2 is connected
to terminal 4. An optional negative logic is
available. The power module will turn on if
terminal 2 is connected to terminal 4, and it
will be off if terminal 2 is left open.
operating range.
A
latched over-current
protection option is also available. Consult the
TDK Innoveta technical support for details.
Vin (+)
On/ Off
Output Over-Voltage-Protection (OVP): The
power modules have
a
control circuit,
independent of the main control loop, that
reduces the risk of over voltage appearing at
the output of the power module during a fault
condition. If there is a fault in the voltage
regulation loop, the over voltage protection
circuitry will cause the power module to shut
down. The module will try to auto re-start in 1
+/- 0.2 sec time period. An optional feature
with latched OVP protection can also be
offered. Consult the TDK Innoveta technical
support for details.
Vin(-)
An On/Off Control Circuit
Output Voltage Adjustment: The output
voltage of the power module may be adjusted
by using an external resistor connected
between the Vout trim terminal (pin 7) and
either the Sense (+) or Sense (-) terminal. If
the output voltage adjustment feature is not
used, pin 7 should be left open. Care should
be taken to avoid injecting noise into the
power module’s trim pin. A small 0.01uF
capacitor between the power module’s trim pin
and Sense (-) pin may help to avoid this.
Thermal Protection: When the power
modules exceed the maximum operating
temperature, the modules may turn-off to
safeguard the power unit against thermal
damage. The module will auto restart as the
unit is cooled below the over temperature
threshold.
A
latched
over-temperature
protection option is also available. Consult the
TDK Innoveta technical support for details.
Vout(+)
Remote On/Off: - The power modules have
an internal remote on/off circuit. The user must
supply an open-collector or compatible switch
between the Vin(-) pin and the on/off
Sense(+)
Trim
pin. The maximum voltage generated by the
power module at the on/off terminal is 15V.
The maximum allowable leakage current of
the switch is 50uA. The switch must be
capable of maintaining a low signal Von/off <
0.8V while sinking 400uA.
Rdown
Sense(-)
Vout(-)
Circuit to decrease output voltage
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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series
With a resistor between the trim and Sense (-)
terminals, the output voltage is adjusted down.
Electrical Characteristics section for the power
module of interest.
To adjust the output voltage down
a
percentage of Vout (%Vo) from Vo,nom, the
trim resistor should be chosen according to
the following equation:
The maximum power available from the power
module is fixed. As the output voltage is
trimmed up, the maximum output current must
be decreased to maintain the maximum rated
power of the module.
100%
Rdown = (
− 2) kΩ
∆
down
As the output voltage is trimmed, the output
over-voltage set point is not adjusted.
Trimming the output voltage too high may
cause the output over voltage protection circuit
to be triggered.
where
Vnom −Vdesired
∆
=
⋅100%
down
Vnom
The current limit set point does not increase
as the module is trimmed down, so the
available output power is reduced.
Remote Sense: The power modules feature
remote sense to compensate for the effect of
output distribution drops. The output voltage
sense range defines the maximum voltage
allowed between the output power terminals
and output sense terminals, and it is found on
the electrical data page for the power module
of interest. If the remote sense feature is not
being used, the Sense(+) terminal should be
connected to the Vo(+) terminal and the
Sense (-) terminal should be connected to the
Vo(-) terminal. The output voltage at the Vo(+)
and Vo(-) terminals can be increased by either
the remote sense or the output voltage
adjustment feature. The maximum voltage
increase allowed is the larger of the remote
sense range or the output voltage adjustment
range; it is not the sum of both.
Vout(+)
Sense(+)
Rup
Trim
Sense(-)
Vout(-)
Circuit to increase output voltage
With a resistor between the trim and sense (+)
terminals, the output voltage is adjusted up.
To adjust the output voltage up a percentage
of Vout (%Vo) from Vo,nom the trim resistor
should be chosen according to the following
equation:
As the output voltage increases due to the use
of the remote sense, the maximum output
current must be decreased for the power
module to remain below its max power rating.
Vnom
−
2
⋅
(1+ ∆up
)
+
1
EMC Considerations: TDK Innoveta power
modules are designed for use in a wide variety
of systems and applications. For assistance
with designing for EMC compliance, please
contact TDK Innoveta technical support.
V
ref
Rup =
kΩ
∆
up
where
Vdesired −Vnom
∆up =
⋅100% and
Vnom
Input Impedance: The source impedance of
the power feeding the DC/DC converter
module will interact with the DC/DC converter.
To minimize the interaction, a 220-470uF input
electrolytic capacitor should be present.
The value of Vref is found in the Electrical
Data section for the power module of interest.
Trim up and trim down curves are found in the
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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series
Input/Output Ripple and Noise Measurements:
12uH
1
2
Battery
+
+
Voutput
-
RLoad
Cext
Cin
Vinput
-
220uF
esr<0.1
100KHz
esr<0.7
100KHz
Ground Plane
The input reflected ripple is measured with a current probe and oscilloscope. The ripple current is the current through the
12uH inductor. The capacitor Cin shall be at least 100uF/100V. One 220uF or two 100uF/100V capacitors in parallel are
recommended.
The output ripple measurement is made approximately 9 cm (3.5 in.) from the power module using an oscilloscope and
BNC socket. The capacitor Cext is located about 5 cm (2 in.) from the power module; its value varies from code to code
and is found on the electrical data page for the power module of interest under the ripple & noise voltage specification in
the Notes & Conditions column.
When the supply to the DC-DC converter is
less than 60Vdc, the power module meets all
Safety Considerations:
of the requirements for SELV. If the input
voltage is a hazardous voltage that exceeds
60Vdc, the output can be considered SELV
only if the following conditions are met:
1) The input source is isolated from the
ac mains by reinforced insulation.
2) The input terminal pins are not
accessible.
All TDK Innoveta products are certified to
regulatory standards by an independent,
Certified Administrative Agency laboratory.
UL 1950, 3rd edition (US & Canada), and
other global certifications are typically
obtained for each product platform.
Various safety agency approvals are pending
on the iHG product family. For safety agency
approval of the system in which the DC-DC
power module is installed, the power module
must be installed in compliance with the
creepage and clearance requirements of the
safety agency. The isolation is basic
insulation. For applications requiring basic
insulation, care must be taken to maintain
minimum creepage and clearance distances
when routing traces near the power module.
3) One pole of the input and one pole of
the output are grounded or both are
kept floating.
4) Single fault testing is performed on
the end system to ensure that under a
single fault, hazardous voltages do
not appear at the module output.
To preserve maximum flexibility, the power
modules are not internally fused. An external
input line normal blow fuse with the maximum
rating stipulated in the Electrical Data section
is required by safety agencies. A lower value
fuse can be selected based upon the
maximum dc input current and maximum
inrush energy of the power module.
As part of the production process, the power
modules are hi-pot tested from primary and
secondary at a test voltage of 1500Vdc. The
case pin is considered a primary pin for the
purpose of hi-pot testing.
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Data Sheet: Xeta iHG48070A033V, 3.3V/70A Output Half Brick Series
Reliability:
Quality:
The power modules are designed using TDK
Innoveta’s stringent design guidelines for
component derating, product qualification, and
design reviews. Early failures are screened
out by both burn-in and an automated final
test. The MTBF is calculated to be greater
than 3M hours using the Telcordia TR-332
calculation method.
TDK Innoveta’s product development process
incorporates advanced quality planning tools
such as FMEA and Cpk analysis to ensure
designs are robust and reliable. All products
are assembled at ISO certified assembly
plants.
Warranty:
Improper handling or cleaning processes can
adversely affect the appearance, testability,
and reliability of the power modules. Contact
TDK Innoveta technical support for guidance
regarding proper handling, cleaning, and
soldering of TDK Innoveta’s power modules.
TDK Innoveta’s comprehensive line of power
solutions includes efficient, high-density DC-
DC converters. TDK Innoveta offers a three-
year limited warranty. Complete warranty
information is listed on our web site or is
available upon request from TDK Innoveta.
TDK Innoveta Inc.
3320 Matrix Drive, Suite 100
Plano, Texas 75082
Phone (877) 498-0099 Toll Free
(469) 916-4747
Information furnished by TDK Innoveta is believed to be accurate and reliable. However, TDK Innoveta
assumes no responsibility for its use, nor for any infringement of patents or other rights of third parties,
which may result from its use. No license is granted by implication or otherwise under any patent or patent
rights of TDK Innoveta. TDK Innoveta components are not designed to be used in applications, such as life
support systems, wherein failure or malfunction could result in injury or death. All sales are subject to TDK
Innoveta’s Terms and Conditions of Sale, which are available upon request. Specifications are subject to
change without notice.
Fax
(877) 498-0143 Toll Free
(214) 239-3101
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