MDS-NT1
SERVICE MANUAL
AEP Model
UK Model
E Model
Ver 1.0 2002.02
Model Name Using Similar Mechanism NEW
US and foreign patents licensed from Dolby
Laboratories Licensing Corporation.
MD Mechanism Type
Optical Pick-up Name
MDM-7S2B
KMS-262E
•
OpenMG, “MagicGate”, “MagicGate Memory
Stick”, “Memory Stick”, VAIO, MusicClip, Net MD,
and their logos are trademarks of Sony Corporation.
“WALKMAN ” is a trademark of Sony Corporation.
Microsoft, Windows, Windows NT and Windows Me-
dia are trademarks or registered trademarks of
Microsoft Corporation in the United States and/or
other countries.
SPECIFICATIONS
•
•
System
Disc
MiniDisc digital audio system
MiniDisc
Supplied accessories
Laser
Semiconductor laser (λ = 780 nm)
•
•
•
AC power adaptor (1)
Emission duration: continuous
USB cable (1)
Revolutions (CLV)
Error correction
800 rpm to 1800 rpm
Advanced Cross Interleave Reed
Solomon Code (ACIRC)
44.1 kHz
Adaptive Transform Acoustic
Coding (ATRAC)/ATRAC 3
EFM (Eight-to-Fourteen
Modulation)
2 stereo channels
5 to 20,000 Hz ±0.8 dB
Over 96 dB during playback
Below measurable limit
Audio connecting cord
(stereo mini-plug ×1 y stereo mini-plug ×1)
(1)
•
•
•
•
IBM and PC/AT are registered trademarks of Interna-
tional Business Machines Corporation.
Macintosh is a trademark of Apple Computer,Inc.in
the United States and/or other countries.
MMX and Pentium are trademarks or registered trade-
marks of Intel Corporation.
Sampling frequency
Coding
•
•
OpenMG Jukebox CD-ROM (1)
Modulation system
Operating instructions for OpenMG Jukebox
(1)
Number of channels
Frequency response
Signal-to-noise ratio
Wow and flutter
•
•
Do not connect the supplied AC power adaptor to a
switched AC outlet (e.g., on an amplifier).
Use only the supplied AC power adaptor. Do not
use any other AC power adaptor.
All other trademarks are trademarks of their respec-
tive owners.TM and ® marks are omitted in this manual.
Outputs
LINE (ANALOG) OUT Jack type: stereo-mini
Polarity of the plug
Rated output: 1 Vrms (at
50 kilohms)
Load impedance: Over 10 kilohms
Jack type: stereo-mini
PHONES
Rated output: 5 mW
Load impedance: 32 ohms
General
USB port
series B, self powerd, full speed
Design and specifications are subject to change
without notice.
Where purchased
Power requirements*
Europe and other countries 220 – 230 V AC, 50/60 Hz
* Using an AC power adaptor (supplied)
Power consumption
Dimensions (approx.)
6 W
152 × 52 × 249 mm (w/h/d) incl.
projecting parts and controls
Mass (approx.)
1.0 kg
MINIDISC DECK
9-873-614-01
2002B0500-1
C 2002.02
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
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MDS-NT1
ITEMS OF ERROR HISTORY MODE ITEMS AND CONTENTS
Selecting the Test Mode
Display
op rec tm
Details of History
Cumulative recording time is displayed.
When cumulative recording time is over 1 minute, the hour and minute are displayed as they are.
When it is under 1 minute, “Under 1 min” is displayed.
The displayed time shows how long the laser is in high power state.
It is about one fourth the actual recording time.
op play tm
spdl rp tm
retry err
Cumulative playing time is displayed.
When cumulative playing time is over 1 minute, the hour and minute are displayed as they are.
When it is under 1 minute, “Under 1 min” is displayed.
Cumulative spindle motor running time is displayed.
When cumulative spindle motor run time is over 1 minute, the hour and minute are displayed as they are.
When it is under 1 minute, “Under 1 min” is displayed.
Displays the total number of retries during recording and number of retry errors during play.
Displayed as “rss pss”.
“r” indicates the retries during recording while “p” indicates the retry errors during play.
The number of retries and retry errors are displayed in hexadecimal digits from 00 to FF.
total err
Displays the total number of errors.
Displayed as “total ss”.
The number of errors is displayed in hexadecimal digits from 00 to FF.
err history
Displays the 10 latest errors.
Displayed as “0s ErrCd@@”.
s indicates the history number. The smaller the number, the more recent is the error. (00 is the latest).
@@ indicates the error code.
Refer to the following table for the details. The error history can be switched by clicking the [JOG UP] or
[JOG DOWN].
retry adrs
er refresh
Displays the past five retry addresses.
Displays “ss ADRS ssss”, ss is the history number, ssss is the cluster with the retry error.
Select the error history number using the [JOG UP] or [JOG DOWN].
Mode to clear the error history and retry address history.
[Operating method]
1) Click the [JOG UP] or [JOG DOWN] when “er refresh” is displayed.
2) The display will change to “er refresh?”, and then click the [ENTER/YES].
The operation is over if “Complete!” is displayed.
After this mode was executed, check the following:
• The data have been cleared.
• Perform the recording and playing to check that the mechanism operates normally.
tm refresh
Mode to clear the “op rec tm” and “op play tm” histories.
These histories serve as approximate indications of when to replace the optical pick-up. If the optical pick-up
has been replaced, perform this operation and clear the history.
[Operating method]
1) Click the [JOG UP] or [JOG DOWN] when “tm refresh” is displayed.
2) The display will change to “tm refresh?”, and then click the [ENTER/YES].
The operation is over if “Complete!” is displayed.
After this mode was executed, check the following:
• The data have been cleared.
• Perform the recording and playing to check that the mechanism operates normally.
op change
Mode to clear cumulative time of “op rec tm” and “op play tm”.
These historical data are used to determine the timing when the optical pick-up is to be replaced. When the
optical pick-up was replaced, perform this operation to clear historical data.
[Operating method]
1) Click the [JOG UP] or [JOG DOWN] when “op change” is displayed.
2) The display will change to “op chang?”, and then click the [ENTER/YES].
The operation is over if “Complete!” is displayed.
spdl change
Mode to clear cumulative time of “spdl rp tm”.
This historical data is used to determine the timing when the spindle motor is to be replaced. When the spindle
motor was replaced, perform this operation to clear historical data.
[Operating method]
1) Click the [JOG UP] or [JOG DOWN] when “spdl change” is displayed.
2) The display will change to “spdl chang?”, and then click the [ENTER/YES].
The operation is over if “Complete!” is displayed.
3
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MDS-NT1
Table of Error Codes
Error Code
Details of Error
10
12
20
Loading failed
Loading switch combination is illegal
Head of PTOC could not be read within the
specified time
21
22
23
Head of PTOC could be read but its content is
erroneous
Access to UTOC could not be made within the
specified time
UTOC could be not read within the specified
3time
24
30
31
40
41
42
43
50
Content of UTOC is erroneous
Playing could not start
Content of sector is erroneous
Cause of retry occurred during normal recording
D-RAM overflowed and retry was executed
Retry was executed during the writing to TOC
S.F editing was interrupted by retry
Address could not be read except in access
processing
51
60
Focusing failed and it is out of control
Unlock retry
4
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MDS-NT1
TABLE OF CONTENTS
SELF-DIAGNOSIS FUNCTION ...........................
1. SERVICING NOTES ...............................................
2
7
2. GENERAL ................................................................... 12
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 13
3-2. Case (Upper) ................................................................... 14
3-3. Main Board...................................................................... 15
3-4. MD Mechanism Deck (MDM-7S2B) ............................. 15
3-5. Front Panel Section ......................................................... 16
3-6. BD Board, Over Write Head (HR901) ........................... 16
3-7. Holder Assy ..................................................................... 17
3-8. Loading Motor Assy (M103) .......................................... 17
3-9. Sled Motor Assy (M102) ................................................ 18
3-10. Optical Pick-Up (KMS-262E) ........................................ 18
3-11. Spindle Motor Assy (M101) ........................................... 19
4. TEST MODE.............................................................. 20
5. ELECTRICAL ADJUSTMENTS ........................ 24
6. DIAGRAMS
6-1. Block Diagram – SERVO Section – ............................... 36
6-2. Block Diagram – MAIN Section – ................................. 37
6-3. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 38
6-4. Printed Wiring Board – BD Board – .............................. 39
6-5. Schematic Diagram – BD Board (1/2) – ........................ 40
6-6. Schematic Diagram – BD Board (2/2) – ........................ 41
6-7. Printed Wiring Board
– MAIN Board (Component Side) – .............................. 42
6-8. Printed Wiring Board
– MAIN Board (Conductor Side) – ................................ 43
6-9. Schematic Diagram – MAIN Board (1/2) – ................... 44
6-10. Schematic Diagram – MAIN Board (2/2) – ................... 45
6-11. Printed Wiring Board – Panel Board – ........................... 46
6-12. Schematic Diagram – Panel Board – .............................. 47
6-13. IC Pin Function Description ........................................... 51
7. EXPLODED VIEWS
7-1. Case Section .................................................................... 59
7-2. Front Panel Section ......................................................... 60
7-3. Case (B) Section.............................................................. 61
7-4. MD Mechanism Deck Section-1 (MDX-7S2B) ............. 62
7-5. MD Mechanism Deck Section-2 (MDX-7S2B) ............. 63
8. ELECTRICAL PARTS LIST ............................... 64
5
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MDS-NT1
The laser component in this product
is capable of emitting radiation
exceeding the limit for Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
This appliance is classified as a CLASS 1
LASER product. The CLASS 1 LASER
PRODUCT MARKING is located on the
bottom exterior.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL
OR IN SUPPLEMENTS PUBLISHED BY SONY.
6
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MDS-NT1
SECTION 1
SERVICING NOTES
NOTES ON REPLACING BD BOARD OR MD MECHANISM
DECK
In replacing the BD board or MD mechanism deck, perform the
work through the steps provided below:
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
1. Remove the IC195 from the BD board to be replaced.
2. Remove the IC195 from new BD board.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
3. Mount the IC195 on new BD board, which was removed from
the BD board to be replaced.
4. Install new BD board in the set.
Note: The IC195 cannot be replaced with a new part. If IC195 is faulty,
replace the entire BD board.
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
– BD BOARD (Conductor Side) –
IC195
CLEANING OBJECTIVE LENS OF OPTICAL PICK-UP
• In cleaning the objective lens of optical pick-up, be sure the
following below.
1. In cleaning the lens, do not apply an excessive force.
As the optical pick-up is vulnerable, application of excessive
force could damage the lens holder.
2. In cleaning, do not use a cleaner other than exclusive cleaning
liquid (KK-91 or isopropyl alcohol).
3. Wipe the objective lens spirally from center toward outside.
(See Figure A)
OPERATION CHECK IN NORMAL MODE
The set alone is capable of performing the play function only. In
checking the recording and other functions, connect the set to the
PC with a USB cable and perform the operation on the application
software “OpenMG Jukebox” attached.
(Figure A)
4. Eject the disc, if loaded.
5. Disconnect the power cord from the socket to shut off the power
supply.
7
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MDS-NT1
JIG FOR CHECKING BD BOARD WAVEFORM
The special jig (J-2501-149-A) is useful for checking the waveform of the BD board. The names of terminals and the checking items to be
performed are shown as follows.
GND : Ground
I+3V : For measuring Iop (Check the deterioration of the optical pick-up laser)
Iop : For measuring Iop (Check the deterioration of the optical pick-up laser)
TE : Tracking error signal (Traverse adjustment)
VC : Reference level for checking the signal
RF : RF signal (Check jitter)
FE : Focus error signal
CN105
Iop
TE
VC
I+3V
GND
FE
RF
1
I+3V
Iop
I+3V
Iop
GND
TE
GND
TE
for
MDM-7S2B
FE
FE
VC
VC
RF
RF
7
8
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MDS-NT1
Note 1:The test mode and recording of this set are controlled by a personal computer, thus requiring the set to be connected to the PC.
Prepare the personal computer in which necessary software is already installed.
• Attached software “OpenMG Jukebox” (necessary for recording (check in, check out)) (Part No. : 4-237-880-01)
• Software for test mode “TestMode_S.exe” (“TestMode_S.exe” and essential files “data_files.csv”, “Net MDUSB.dil” are distributed to-
gether with the Service Manual. For the test mode, copy these three files in the same folder beforehand)
Note 2:In the operation in the test mode, the operational description requiring “click [xxx]” means that you have to click the button on the screen.
(“xxx” indicates the button name)
Iop DATA RECORDING AND DISPLAY WHEN OPTICAL PICK-UP AND NON-VOLATILE MEMORY (IC195 OF
BD BOARD) ARE REPLACED
The Iop value labeled on the optical pick-up can be recorded in the non-volatile memory. By recording the value, it will eliminate the need
to look at the value on the optical pick-up label. When replacing the optical pick-up or non-volatile memory (IC195 of BD board), record
the Iop value on the optical pick-up according to the following procedure.
Record Procedure:
B/>
x/Z
1. Press the [
] button and [
] button until the NetMD indicator turns off (for more than 3 seconds). (During this step, the USB
cable must be disconnected)
2. Connect the set to the PC with the attached USB cable.
3. Start up the software for test mode.
4. Click the [TEST MODE].
5. Click the [JOG UP] or [JOG DOWN] to display “[Service]”, and click the [ENTER/YES].
6. Click the [JOG UP] or [JOG DOWN] to display “Iop Write” (C05), and click the [ENTER/YES].
7. The display becomes “Ref=@@@.@” (@ is an arbitrary number) and the numbers which can be changed will blink.
8. Input the Iop value written on the optical pick-up label.
To select the number : Click the [JOG UP] or [JOG DOWN].
To select the digit : Click the [PUSH].
9. When the [ENTER/YES] is clicked, the display becomes “Measu=@@@.@” (@ is an arbitrary number).
10. As the adjustment results are recorded for the 6 value. Leave it as it is and click the [PUSH].
11. “Complete!” will be displayed momentarily. The value will be recorded in the non-volatile memory and the display will become “Iop
Write (C05)”.
12. Quit the software for test mode after the [REPEAT] clicked.
Note: When retrying this operation start from step1.
Display Procedure:
B/>
1. Press the [
x/Z
] button and [
] button until the NetMD indicator turns off (for more than 3 seconds). (During this step, the USB
cable must be disconnected)
2. Connect the set to the PC with the attached USB cable.
3. Start up the software for test mode.
4. Click the [TEST MODE].
5. Click the [JOG UP] or [JOG DOWN] to display “[Service]”, and click the [ENTER/YES].
6. Click the [JOG UP] or [JOG DOWN] to display “Iop Read” (C26), and click the [ENTER/YES].
7. “@@.@/##.#” is displayed and the recorded contents are displayed.
@@.@: indicates the Iop value on the optical pick-up label.
##.# : indicates the Iop value after adjustment
8. To end, click the [PUSH] and [MENU/NO] to display “Iop Read” (C26).
9. Quit the software for test mode after the [REPEAT] clicked.
Note: When retrying this operation start from step1.
9
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MDS-NT1
CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTS IN MD
Before performing repairs, perform the following checks to determine the faulty locations up to a certain extent.
Details of the procedures are described in “5. Electrical Adjustments”.
Note: This set uses optical pick-up KMS-262E in the production, but for the repair, only the KMS-262A is supplied. As a result, two types of optical
pick-ups are used for this set, and the specified values for the check and adjustment of the laser power vary depending on the type.Details of the
identify of KMS-262A/KMS-262E are described in “5-4. How to Identify Optical Pick-up KMS-262A/KMS-262E”. (See Page 26)
Criteria for Determination
(Unsatisfactory if specified value is not satisfied)
Measure if unsatisfactory:
Laser power check
(5-7-2 : See page 28)
• 0.90 mW power
• Clean the optical pick-up
• Adjust again
• Replace the optical pick-up
Specified value : 0.84 to 0.92 mW (KMS-262A)
0.90 to 0.96 mW (KMS-262E)
• 8.40 mW power
Specified value : 8.1 to 8.7 mW (KMS-262A)
8.4 to 8.9 mW (KMS-262E)
• Iop (at 8.4mW)
• Replace the optical pick-up
Labeled on the optical pick-up
Iop value ± 10mA
Auto check
• Unsatisfactory if displayed as “NG: XXXX”
• Replace the optical pick-up
(5-7-4 : See page 29)
NG
(XXXX is arbitrary number)
Temperature
• Unsatisfactory if displayed as “T=@@ (##) [NG” • Check for disconnection of the circuits around
compensation
offset check
(5-7-1 : See page 28)
NG
D101 (BD board)
• Check the signals around IC101, IC201, CN102,
CN103 (BD board)
(@@, ## are both arbitrary numbers)
Note:
The criteria for determination above is intended merely to determine if satisfactory or not, and does not serve as the specified value for adjustments.
When performing adjustments, use the specified values for adjustments.
10
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MDS-NT1
SERVICE MODE
Microcomputer Version Display
Procedure:
1. Press the [B/>] button and [x/Z] button until the NetMD indicator turns off (for more than 3 seconds). (During this step, the USB
cable must be disconnected)
2. Connect the set to the PC with the attached USB cable.
3. Start up the software for test mode.
4. Click the [TEST MODE].
5. Enter the test mode, then click the [JOG UP] or [JOG DOWN] to display “<INFORMATION> ”, and click the [ENTER/YES].
6. “NT1-V**.****” is displayed. In the event of different display, click the [ENTER/YES] until it is displayed.
“**.****” indicates the microcomputer version.
Software Reset
Procedure:
1. Press the [B/>] button and [x/Z] button until the NetMD indicator turns off (for more than 3 seconds). (During this step, the USB
cable must be disconnected)
2. Connect the set to the PC with the attached USB cable.
3. Start up the software for test mode.
4. Click the [TEST MODE].
5. Quit the software for test mode after the [REPEAT] clicked.
Note: When retrying this operation, start from step 1.
System Requirements
•
IBM PC/AT or Compatible (The software does not run on Macintosh.)
– CPU: MMX˛ Pentium® 233 MHz or higher (Pentium® II 400 MHz or higher is recommended)
– Hard disk drive space: 60 MB or more (The amount of necessary space depends on the version of the Windows OS or the size of
your audio files.)
– RAM: 64 MB or more
– CD-ROM drive (capable of software installation and playback of an audio CD)
– Sound Board
– USB port (supports USB 2.0 Full Speed. (previously USB 1.1))
•
Operating System: Windows® 98/Windows® 98 Second Edition/Windows® 2000 Professional/Windows® Me/Windows® XP Home
Edition/Windows® XP Professional (manufacturer installed)
The following environments are not supported.
– Windows® 95, Windows® NT, or other versions of Windows® NT (such as Server)
– An environment that is an upgrade of the original manufacturer-installed operating system, as in the following examples:
Windows® 3.1/Windows® 95 t Windows® 98 (or Windows® 98 Second Edition/Windows® Me)
Windows® Me/Windows® 2000 Professional t Windows® XP
– Multi-boot environment with Windows® 2000 (or Windows® XP) and Windows® 98 (or Windows® 98 Second Edition/Win-
dows® Me)
•
•
•
•
•
Display: High (16 bit) Color or more (800 × 480 dot or more)
Internet access: for Web registration and EMD services
Windows Media Player (Version 6.4 or higher) installed for playing MP3 files.
Windows Media Player (Version 7.0 or higher) installed for playing WMA files.
We do not assure the operation of MusicClip on the computer other than VAIO series computer.
Notes
•
•
We do not assure trouble-free operation for all computers satisfying the system requirements.
Trouble-free operation is not guaranteed following the self-conducted upgrade of home-built PCs oroperating systems.
11
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MDS-NT1
SECTION 2
GENERAL
This section is extracted from
instruction manual.
• LOCATION OF CONTROLS
– Rear View –
– Front View –
This chapter tells you about the location and function of the various buttons, controls on the MD deck.
1
2
3
1
6
5
4
1 N/> button
5 Net MD lamp
3
4
2
Press while the unit is stopped to start playback.
Press while the unit is playing to locate the
beginning of the next track.
Indicates the USB connection status between the
unit and the computer.
1 DC IN 9V jack
Lights dimly when the unit is connected only to a
wall outlet with the supplied AC adaptor.
Lights brightly when the unit is connected to a
computer with its operating system running.
Connect this jack to a wall outlet via the supplied
AC power adaptor to power the MD deck.
2 MD insertion slot
Insert the MD as illustrated below.
2 USB port
Connect this port to a USB port on your
computer with the supplied USB cable.
6 Playback indicator
Lights during playback.
With the labeled
side up
Flashes while the MD's TOC is being loaded by
the MD deck.
3 Headphones jack and PHONE LEVEL
control
Notes
Connect a headphones plug to this jack.
Turn the PHONE LEVEL control to adjust the
volume of the connected headphones.
• Except for operation of the x/Z button for ejecting
the MD, all other operations on the MD deck are
disabled while the Net MD is connected through the
supplied USB cable to a computer with its operating
system running.
Under these conditions, the Net MD lamp flashes
(the other indicators remain off) whenever you
attempt to do an operation that is disabled.
• The flashing of the Net MD lamp and flashing or
lighting up of the other indicators are indications
that the MD deck’s self-diagnosis function is active.
For details, see page 12.
With the arrow pointing
towards the deck
4 ANALOG OUT jack
3 x/Z button
Connect active speakers, etc. to this jack with the
supplied audio connecting cord (stereo mini-plug
×1 y stereo mini-plug ×1) or optional audio
Press while the unit is playing to stop playback.
Press while the unit is stopped to eject the MD.
4 Recording indicator
connecting cord (stereo mini-plug
×1 y phono
Lights up in the following cases:
plug ×2).
While an audio file is being transferred from the
connected computer to the MD deck (check-out).
While an audio file is being transferred from the
MD deck to the connected computer (check-in).
When TOC information (such as track
or
information) has not been recorded to the MD.
Flashes when overwriting of the MD’s TOC by
the MD deck is started by pressing x/Z .
12
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MDS-NT1
SECTION 3
DISASSEMBLY
• This set can be disassembled in the order shown below.
3-1. DISASSEMBLY FLOW
Note: The process described in
can be performed in any order.
Note: Without completing the process described in
, the next process can not be performed.
SET
3-2. CASE (UPPER)
(Page 14)
3-4. MD MECHANISM DECK
(MDM-7S2B)
3-3. MAIN BOARD
(Page 15)
(Page 15)
3-5. FRONT PANEL SECTION
3-6. BD (MD) BOARD
3-6. BD (MD) BOARD
(Page 16)
(Page 16)
(Page 16)
3-7. HOLDER ASSY
(Page 17)
3-6. OVER WRITE HEAD
(HR901)
(Page 16)
3-8. LOADING MOTOR ASSY
3-9. SLED MOTOR ASSY
(M102)
3-7. HOLDER ASSY
(Page 17)
(M103)
(Page 17)
(Page 18)
3-10. OPTICAL PICK-UP
(KMS-262E)
(Page 18)
3-11. SPINDLE MOTOR ASSY
(M101)
(Page 19)
13
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MDS-NT1
Note: Follow the disassembly procedure in the numerical order given.
3-2. CASE (UPPER)
Note 1: Fold down the flat type wire (7 core) in the direction of the
arrow at the first setout, then install the upper case.
wire (flat type) (7 core)
2 case (upper)
wire (flat type) (7core)
1 three screws
(BVTP3 × 10)
1 three screws
(BVTP3 × 10)
lead wire
Note 2: Check that the lead wire is connected vertically to the chassis
before installing the upper case.
If the lead wire is not connected vertically, it may be caught
between the upper case.
chassis
chassis
lead wire
lead wire
OK
NG
14
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MDS-NT1
3-3. MAIN BOARD
1 wire (flat type) (23 core)
(CN102)
1 wire (flat type) (27 core)
(CN101)
1 wire (flat type) (7 core)
(CN104)
3 screw
(BVTP3 × 8)
3 screw
(BVTP3 × 8)
4 MAIN board
2 screw
(BVTT3 × 8)
3-4. MD MECHANISM DECK
(MDM-7S2B)
1 wire (flat type) (23 core)
(CN102)
2 four screws
(BVTTWH M3)
1 wire (flat type) (27 core)
(CN101)
3 MD mechanism deck
(MDM-7S2B)
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3-5. FRONT PANEL SECTION
1 wire (flat type) (7 core)
4 two screws
(CN104)
(BVTT3 × 5)
5 front panel section
wire (flat type) (7 core)
Note: Set the wire (flat type) as illustrated,
then install the front panel section.
2 lead wire
3 two screws
(K3 × 8)
3-6. BD BOARD, OVER WRITE HEAD (HR901)
Note: By means of removing 1 connector (CN104),
BD board can be removed without removing
the over write head (HR901).
2 screw (P1.7 × 6)
3 over write head (HR901)
Note: The over write head (HR901) should be
handled with care as it is damaged easily.
4 Remove four solders.
8 BD board
BD board
(side B)
6
1 connector
(CN104)
4 Remove five solders.
7 flexible board (CN101)
5 two screws (PWH1.7 × 3.5)
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3-7. HOLDER ASSY
2 claw
3
6 holder assy
5
4 boss
4 boss
1 tension spring (holder)
3-8. LOADING MOTOR ASSY (M103)
1 belt (loading)
2 two screws
(PWH1.7 2.5)
×
3 loading motor assy
(M103)
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3-9. SLED MOTOR ASSY (M102)
3
5 With holding the claw,
slide the slider fully in the
direction of arrow A.
4 slider (EJ)
A
8 lever (head)
6 slider
2 guide (L)
1 two screws
(B2 6)
×
9 two screws
(PWH1.7
7 lever (CHG)
×
2.5)
0 sled motor assy
(M102)
3-10. OPTICAL PICK-UP (KMS-262E)
qa optical pick-up (KMS-262E)
7 Pull out the main shaft.
1 flexible board
0 SL base
9 screw
(P1.7
×
6)
6 two screws
(KTP2 6)
8
×
4 screw (B2 6)
×
5 base (BU-A)
3 gear (SD)
2 screw (M1.7)
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3-11. SPINDLE MOTOR ASSY (M101)
2 spindle motor assy
(M101)
1 three screws (M1.7)
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MDS-NT1
SECTION 4
TEST MODE
Note 1:The test mode and recording of this set are controlled by a personal computer, thus requiring the set to be connected to the PC.
Prepare the personal computer in which necessary software is already installed.
• Attached software “OpenMG Jukebox” (necessary for recording (check in, check out)) (Part No. : 4-237-880-01)
• Software for test mode “TestMode_S.exe” (“TestMode_S.exe” and essential files “data_files.csv”, “Net MDUSB.dil” are distributed to-
gether with the Service Manual. For the test mode, copy these three files in the same folder beforehand)
Note 2:In the operation in the test mode, the operational description requiring “click [xxx]” means that you have to click the button on the screen.
(“xxx” indicates the button name)
Note 3:MD always plays double speed.
4-1. PRECAUTIONS FOR USE OF TEST MODE
• The software for test mode is used.
Be sure to start the software for test mode after quitting the application software.
• As loading related operations will be performed regardless of the test mode operations being performed, be sure to check that the disc
is stopped before setting and removing it.
Even if the [EJECT] is clicked while the disc is rotating during continuous playback, continuous recording, etc., the disc will not stop
rotating.
Therefore, it will be ejected while rotating.
Be sure to click the [EJECT] button after clicking the [MENU/NO] and the rotation of disc is stopped.
4-1-1. Recording laser emission mode
• Continuous recording mode (CREC MODE)
• Laser power check mode (LDPWR CHECK)
• Laser power adjustment mode (LDPWR ADJUST)
• Iop check (Iop compare)
• Iop value non-volatile writing (Iop NV save)
• Traverse (MO) check (EF MO CHECK)
• Traverse (MO) adjustment (EF MO ADJUST)
4-2. SETTING THE TEST MODE
1. Press the [B/>] button and [x/Z] button until the NetMD indicator turns off (for more than 3 seconds). (During this step, the USB
cable must be disconnected)
2. Connect the set to the PC with the attached USB cable.
3. Start up the software for test mode.
4. Click the [TEST MODE].
5. When the test mode is set, “[Check]” will be displayed. Click the [JOG UP] or [JOG UP] switches between the following three
groups; ···Tt [Check] Tt [Service] Tt [Develop] Tt ···.
Note: Do not use the test mode in the [Develop] group.
If used, the unit may not operate normally.
If the [Develop] group is set accidentally, click the [MENU/NO] immediately to exit the [Develop] group.
4-3. RELEASING THE TEST MODE
Quit the software for test mode after [REPEAT] is clicked.
Note: When retrying test mode setting, perform the setting method from the start once again.
4-4. BASIC OPERATIONS OF THE TEST MODE
All operations are performed clicking the [JOG UP], [JOG DOWN], [PUSH], [ENTER/YES], and [MENU/NO].
The functions of these buttons are as follows.
Function name
[JOG UP], [JOG DOWN]
[PUSH]
Function
Select
Set Sub menu
[ENTER/YES]
Proceeds onto the next step. Finalizes input
Returns to previous step. Stops operations
[MENU/NO]
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4-5. SELECTING THE TEST MODE
There are 26 types of test modes as shown below. The groups can be switched by clicking the [JOG UP] or [JOG DOWN]. After selecting
the group to be used, click the [ENTER/YES]. After setting a certain group, click the [JOG UP] or [JOG DOWN] switches between these
modes.
Refer to “Group” in the table for details can be selected.
All items used for servicing can be treated using group [Service]. So be carefully not to enter other groups by mistake.
Note: Do not use the test mode in the [Develop] group.
If used, the unit may not operate normally.
If the [Develop] group is set accidentally, click the [MENU/NO] immediately to exit the [Develop] group.
Group
Display
No.
Details
Mark
Check
Service
AUTO CHECK
Err Display
C01 Automatic self-diagnosis
C02 Error history display, clear
TEMP ADJUST
C03 Temperature compensation offset adjustment
LDPWR ADJUST C04 Laser power adjustment
Iop Write
C05 Iop data writing
Iop NV Save
C06 Writes current Iop value in read nonvolatile memory using microprocessor
C07 Traverse (MO) adjustment
EF MO ADJUST
EF CD ADJUST
FBIAS ADJUST
AG Set (MO)
C08 Traverse (CD) adjustment
C09 Focus bias adjustment
C10 Auto gain output level adjustment (MO)
C11 Auto gain output level adjustment (CD)
C12 Temperature compensation offset check
C13 Laser power check
AG Set (CD)
TEMP CHECK
LDPWR CHECK
EF MO CHECK
EF CD CHECK
FBIAS CHECK
ScurveCHECK
VERIFYMODE
DETRK CHECK
0920 CHECK
Iop Read
C14 Traverse (MO) check
C15 Traverse (CD) check
C16 Focus bias check
C17 S-curve check
C18 Nonvolatile memory check
C19 Detrack check
C25 Most circumference check
C26 Iop data display
Iop Compare
C27 Comparison with initial Iop value written in nonvolatile memory
C28 Initialization of nonvolatile memory for adjustment values
C31 Display of microprocessor version, etc.
C36 Continuous playback mode
C37 Continuous recording mode
ADJ CLEAR
INFORMATION
CPLAY2MODE
CREC 2MODE
• For details of each adjustment mode, refer to “SECTION 5. Electrical Adjustments”.
For details of “Err Display”, refer to “Self-Diagnosis Function” on page 2.
• If a different mode has been selected by mistake, click the [MENU/NO] to release that mode.
• Modes with (×) in the Mark column are not used for servicing and therefore are not described in detail. If these modes are set acciden-
tally, click the [MENU/NO] to release the mode immediately.
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4-5-1. Operating the Continuous Playback Mode
1. Entering the continuous playback mode
(1) Set the disc in the unit. (Whichever recordable discs or discs for playback only are available)
(2) Click the [JOG UP] or [JOG DOWN] and display “CPLAY2MODE” (C36).
(3) Click the [ENTER/YES] to change the display to “CPLAY2MID”.
(4) When access completes, the display changes to “C =
AD = ”.
Note: The numbers “ ” displayed show you error rates and ADER.
2. Changing the parts to be played back
(1) Click the [ENTER/YES] during continuous playback to change the display as below.
“CREC 2MID” t “CREC 2OUT” t “CREC 2IN”
When clicked another time, the parts to be played back can be moved.
(2) When access completes, the display changes to “C =
Note: The numbers “ ” displayed show you error rates and ADER.
3. Ending the continuous playback mode
AD = ”.
(1) Click the [MENU/NO]. The display will change to “CPLAY2MODE” (C36).
(2) Click the [EJECT] and take out the disc.
Note: The playback start addresses for IN, MID, and OUT are as follows.
IN 40h cluster
MID 300h cluster
OUT 700h cluster
4-5-2. Operating the Continuous Recording Mode (Use only when performing self-recording/palyback check)
1. Entering the continuous recording mode
(1) Set a recordable disc in the unit.
(2) Click the [JOG UP] or [JOG DOWN] and display “CREC 2MODE” (C37).
(3) Click the [ENTER/YES] to change the display to “CREC 2MID”.
(4) When access completes, the display changes to “CREC 2 (
”.
Note: The numbers “ ” displayed shows you the recording position addresses.
2. Changing the parts to be recorded
(1) When the [ENTER/YES] is clicked during continuous recording, the display changes as below.
“CREC 2MID” t “CREC 2OUT” t “CREC 2IN”
When clicked another time, the parts to be recorded can be changed.
(2) When access completes, the display changes to “CREC 2 (
”.
Note: The numbers “ ” displayed shows you the recording position addresses.
3. Ending the continuous recording mode
(1) Click the [MENU/NO]. The display changes to “CREC 2MODE” (C37).
(2) Click the [EJECT] and take out the disc.
Note 1: The recording start addresses for IN, MID, and OUT are as follows.
IN 40h cluster
MID 300h cluster
OUT 700h cluster
Note 2: The [MENU/NO] can be used to stop recording anytime.
Note 3: Do not perform continuous recording for long periods of time above 5 minutes.
Note 4: During continuous recording, be careful not to apply vibration.
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4-6. AUTOMATIC SELF-DIAGNOSIS FUNCTION
This test mode performs CREC and CPLAY automatically for mainly checking the characteristics of the optical pick-up.
To perform this test mode, the laser power must first be checked.
Perform AUTO CHECK after the laser power check and Iop check.
Procedure:
1. Click the [ENTER/YES]. If “LDPWR
” is displayed, it means that the laser power check has not been performed. In this case,
perform the laser power check and Iop compare, and then repeat from step 1.
2. If a disc is in the mechanical deck, it will be ejected forcibly.
“DISC IN” will be displayed in this case. Load a test disc (MDW-74/GA-1) which can be recorded.
3. If a disk is loaded at step 2, the check will start automatically.
4. When “XX CHECK” is displayed, the item corresponding to XX will be performed.
When “06 CHECK” completes, the disc loaded at step 2 will be ejected. “DISC IN” will be displayed. Load the check disc (MD) TDYS-1.
5. When the disc is loaded in step 4, the check will automatically be resumed from “07 CHECK”.
6. After completing to test item 12, check OK or NG will be displayed. If all items are OK, “CHECKALL OK” will be displayed. If any item
is NG, it will be displayed as “NG:xxxx”.
When “CHECKALL OK” is displayed, it means that the optical pick-up is normal. Check the operations of the other spindle motor, thread
motor, etc.
When displayed as “NG:xxxx”, it means that the optical pick-up is faulty. In this case, replace the optical pick-up.
4-7. INFORMATION
Display the software version.
Procedure:
1. If displayed as “INFORMATION”, click the [ENTER/YES].
2. The software version will be displayed.
3. Click the [MENU/NO] to end this mode.
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MDS-NT1
SECTION 5
ELECTRICAL ADJUSTMENTS
Note 1:The test mode and recording of this set are controlled by a personal computer, thus requiring the set to be connected to the PC.
Prepare the personal computer in which necessary software is already installed.
• Attached software “OpenMG Jukebox” (necessary for recording (check in, check out)) (Part No. : 4-237-880-01)
• Software for test mode “TestMode_S.exe” (“TestMode_S.exe” and essential files “data_files.csv”, “Net MDUSB.dil” are distributed to-
gether with the Service Manual. For the test mode, copy these three files in the same folder beforehand)
Note 2:In the operation in the test mode, the operational description requiring “click [xxx]” means that you have to click the button on the screen.
(“xxx” indicates the button name)
Note 3:MD always plays double speed.
5-1. PARTS REPLACEMENT AND ADJUSTMENT
If malfunctions caused by Optical pick-up such as sound skipping are suspected, follow the following check.
Check before replacement
Start
5-7-2.
NG
Laser Power Check
(See page 28)
OK
5-7-3.
NG
Iop Compare
(See page 28)
OK
5-7-4.
NG
Replace optical pick-up or MDM-7S2B
Auto Check
(See page 29)
OK
Other faults are suspected.
Check the mechanism
(sled motor, etc).
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Adjustment flow
• Abbreviation
Start
OP: optical pick-up
YES
YES
YES
YES
YES
YES
YES
5-8. INITIAL SETTING OF ADJUSTMENT VALUE
(See page 31)
Replace OP or IC195*
NO
5-10. TEMPERATURE COMPENSATION OFFSET
ADJUSTMENT (See page 31)
Replace IC101, IC195*, or D101
NO
Replace OP, IC933, or IC195*
5-11. LASER POWER ADJUSTMENT (See page 31)
NO
Replace OP, IC701, IC933,
5-12. Iop NV SAVE (See page 32)
or IC195*
NO
5-13. TRAVERSE ADJUSTMENT (See page 32)
5-14. FOCUS BIAS ADJUSTMENT (See page 33)
5-17. AUTO GAIN CONTROL OUTPUT LEVEL
ADJUSTMENT (See page 34)
Replace OP, IC101, IC201,
or IC195*
NO
OP change in Err Display mode
Iop write
Replace OP
NO
Replace the spindle motor
NO
Spindle change in Err Display mode
5-7-4. Auto Check
(See page 29)
* The IC195 cannot be replaced with a new part.
For derail refer to “Notes on Replacing BD Board
or MD Mechanism Deck” (See page 7).
End adjustments
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5-2. PRECAUTIONS FOR CHECKING LASER DIODE
EMISSION
5-4. HOW TO IDENTIFY OPTICAL PICK-UP KMS-
262A/KMS-262E
To check the emission of the laser diode during adjustments, never
view directly from the top as this may lose your eye-sight.
This set uses optical pick-up KMS-262E in the production, but for
the repair, only the KMS-262A is supplied. As a result, two types
of optical pick-ups are used for this set, and the specified values
for the check and adjustment of the laser power vary depending
on the type. Therefore, in performing the check and adjustment of
the laser power, first make sure the type of optical pick-up. The
type of optical pick-up can be identified as follows.
5-3. PRECAUTIONS FOR USE OF OPTICAL PICK-
UP (KMS-262A/262E)
As the laser diode in the optical pick-up is easily damaged by static
electricity, solder the laser tap of the flexible board when using it.
Before disconnecting the connector, desolder first. Before con-
necting the connector, be careful not to remove the solder. Also
take adequate measures to prevent damage by static electricity.
Handle the flexible board with care as it breaks easily.
– KMS-262A –
[Top view] [Side view]
– KMS-262E –
[Top view]
[Side view]
pick-up
flexible board
laser tap
Optical pick-up flexible board
TYPE2 VR (small)
TYPE3 VR (large)
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5-5. PRECAUTIONS FOR ADJUSTMENTS
1. When replacing the following parts, perform the adjustments
and checks with in the order shown in the following table.
2. Set the test mode when performing adjustments.
After completing the adjustments, exit the test mode.
Perform the adjustments and checks in “group Service” of the
test mode.
5. When observing several signals on the oscilloscope, etc.,
make sure that VC and ground do not connect inside the oscil-
loscope.
(VC and ground will become short-circuited)
6. Using the above jig enables the waveform to be checked with-
out the need to solder.
(Refer to Servicing Note on page 8)
3. Perform the adjustments to be needed in the order shown.
4. Use the following tools and measuring devices.
• Check Disc (MD) TDYS-1 (Part No. : 4-963-646-01)
• Test Disk (MDW-74/GA-1) (Part No. : 4-229-747-01)
• Laser power meter LPM-8001 (Part No. : J-2501-046-A)
or
7. As the disc used will affect the adjustment results, make sure
that no dusts nor fingerprints are attached to it.
8. In normal operation check after the completion of adjustment,
be sure to perform the recording check (check in, check out)
using the software “OpenMG Jukebox” attached.
MD Laser power meter 8010S (Part No. : J-2501-145-A)*1
• Oscilloscope (Measure after performing CAL of prove)
• Digital voltmeter
*1 Laser power meter
When performing laser power checks and adjustment (electrical
adjustment), use of the new MD laser power meter 8010S (Part
No. : J-2501-145-A) instead of the conventional laser power me-
ter is convenient.
• Thermometer
• Jig for checking BD board waveform
(Part No. : J-2501-149-A)
It sharply reduces the time and trouble to set the laser power
meter sensor onto the objective lens of optical pick-up.
• Attached software “OpenMG Jukebox”
(Part No. : 4-237-880-01)
• Software for test mode
(Distributed together with the Service Manual)
• Attached USB cable (Part No. : 1-757-471-11)
• Personal computer (Refer to Servicing Notes)
Parts to be replaced
Adjustment
Optical
Pick-up
IC101
IC701
IC201
IC933
IC195*
D101
7. Initial setting of adjustment value
8. Recording of Iop information
9. Temperature compensation
offset adjustment
10. Laser power adjustment
11. Iop NV Save
12. Traverse adjustment
13. Focus bias adjustment
16. Auto gain adjustment
6-4. AUTO CHECK
* The IC195 cannot be replaced with a new part.
For detail refer to “Notes on Replacing BD Board or MD Mechanism Deck” (See page 7).
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Checking Procedure:
1. Set the laser power meter on the objective lens of the optical
pick-up.
Connect the digital volt meter to CN105 pin 1 (I+3V) and
CN105 pin 2 (Iop).
2. Then, click the [JOG UP] or [JOG DOWN] and display
“LDPWR CHECK” (C13).
5-6. USINGTHE CONTINUOUSLY RECORDED DISC
* This disc is used in focus bias adjustment and error rate check.
The following describes how to create a continuous recording
disc.
1. Insert a disc (blank disc) commercially available.
2. Check the [JOG UP] or [JOG DOWN] and display
“CREC 2MODE” (C37).
3. Click the [ENTER/YES] once and display “L 0.90 mW $ ”.
Check that the reading of the laser power meter become speci-
fied value.
3. Click the [ENTER/YES] again to display “CREC 2MID”.
Display “CREC 2 (0300)” and start to recording.
4. Complete recording within 5 minutes.
5. Click the [MENU/NO] and stop recording .
6. Click the [EJECT] and remove the disc.
Specified Value:
Laser power meter reading : 0.84 to 0.92 mW (KMS-262A)
0.90 to 0.96 mW (KMS-262E)
The above has been how to create a continuous recorded data for
the focus bias adjustment and error rate check.
4. Click the [ENTER/YES] once more and display “L 8.40 mW $
” (KMS-262A) or “L 8.65 mW $ ” (KMS-262E). Check
that the reading the laser power meter and digital volt meter sat-
isfy the specified value.
Note: Be careful not to apply vibration during continuous recording.
5-7. CHECKS PRIOR TO REPAIRS
These checks are performed before replacing parts according to
“approximate specifications” to determine the faulty locations. For
details, refer to “Checks Prior to Parts Replacement and Adjust-
ments” (see page 10).
Specified Value:
Laser power meter reading : 8.4 ± 0.3 mW (KMS-262A)
8.65 ± 0.25 mW (KMS-262E)
Digital voltmeter reading : Optical pick-up displayed value ± 10%
5-7-1. Temperature Compensation Offset Check
When performing adjustments, set the internal temperature and
room temperature to 22 to 28ºC.
(Optical pick-up label)
KMS262A
20101
B0825
(For details of the method for
checking this value, refer to “6-9.
Recording and Displaying the Iop
Information”)
Checking Procedure:
1. Click the [JOG UP] or [JOG DOWN] to display “TEMP
CHECK” (C12).
2. Click the [ENTER/YES].
Iop = 82.5 mA in this case
Iop (mA) = Digital voltmeter reading (mV)/1 (Ω)
3. “T=@@(##) [OK” should be displayed. If “T=@@ (##) [NG”
is displayed, it means that the results are bad.
(@@ indicates the current value set, and ## indicates the value
written in the non-volatile memory)
5. Click the [MENU/NO] and display “LDPWR CHECK” (C13)
and stop the laser emission.
(The [MENU/NO] is effective at all times to stop the laser emis-
sion)
5-7-2. Laser Power Check
Before checking, check the Iop value of the optical pick-up.
(Refer to 5-9. Recording and Displaying the Iop Information (see
page 31)
Note: After step 4, each time the [ENTER/YES] is clicked, the display
will be switched between “L 0.70 mW $ ” and “L 7.50 mW $
”, Nothing needs to be performed here.
Connection:
Checking Location: BD board (see page 35)
laser
power meter
5-7-3. Iop Compare
The current Iop value at laser power 8.4 mW output and reference
Iop value (set at shipment) written in the nonvolatile memory are
compared, and the rate of increase/decrease will be displayed in
percentage.
Optical pick-up
objective lens
Note: Perform this function with the optical pick-up set at room
digital voltmeter
BD board
temperature.
Procedure:
CN105 pin 1 (I +3 V)
+
–
1. Click the [JOG UP] or [JOGDOWN] to display “Iop Compare”
(C27).
CN105 pin 2 (Iop)
2. Click the [ENTER/YES] and start measurements.
3. When measurements complete, the display changes to
“±xx%yy”.
xx is the percentage of increase/decrease, and OK or NG is
displayed at yy to indicate whether the percentage of increase/
decrease is within the allowable range.
4. Click the [MENU/NO] to end this mode.
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5-7-6. Traverse Check
5-7-4. Auto Check
This test mode performs CREC and CPLAY automatically for
mainly checking the characteristics of the optical pick-up. To
perform this test mode, the laser power must first be checked.
Perform Auto Check after the laser power check and Iop compare.
Note 1:Data will be erased during MO reading if a recorded disc is
used in this adjustment.
Note 2:If the traverse waveform is not clear, connect the oscilloscope
as shown in the following figure so that it can be seen more
clearly.
oscilloscope
(DC range)
Procedure:
1. Click the [ENTER/YES]. If “LDPWR
” is displayed,
it means that the laser power check has not been performed. In
this case, perform the laser power check and Iop compare, and
then repeat from step 1.
BD board
330 k Ω
CN105 pin 4 (TE)
+
–
CN105 pin 6 (VC)
2. If a disc is in the mechanical deck, it will be ejected forcibly.
“DISC IN” will be displayed in this case. Load a test disc (MDW-
74/GA-1) which can be recorded.
3. If a disk is loaded at step 2, the check will start automatically.
4. When “XX CHECK” is displayed, the item corresponding to
XX will be performed.
10 pF
Connection:
oscilloscope
(DC range)
When “06 CHECK” completes, the disc loaded at step 2 will be
ejected. “DISC IN” will be displayed. Load the check disc (MD)
TDYS-1.
BD board
CN105 pin 4 (TE)
CN105 pin 6 (VC)
+
–
V: 0.1 V/div
H: 10 ms/div
5. When the disc is loaded, the check will automatically be resumed
from “07 CHECK”.
6. After completing to test item “12 check”, check OK or NG will
be displayed. If all items are OK, “CHECK ALL OK” will be
displayed. If any item is NG, it will be displayed as “NG:xxxx”.
Checking Procedure:
1. Connect an oscilloscope to CN105 pin 4 (TE) and CN105
pin 6 (VC) on the BD (MD) board.
2. Load a disc (any available on the market). (Refer to Note 1)
3. Click the [FF] to move the optical pick-up outside the pit and
click the [STOP] to stop.
4. Click the [JOG UP] or [JOG DOWN] to display “EF MO
CHECK”(C14).
5. Click the [ENTER/YES] to display “EFB = MO-R”.
(Laser power READ power/Focus servo ON/tracking servo
OFF/spindle (S) servo ON)
When “CHECK ALL OK” is displayed, it means that the optical
pick-up is normal. Check the operations of the other spindle motor,
sled motor, etc.
When displayed as “NG:xxxx”, it means that the optical pick-up
is faulty. In this case, replace the optical pick-up.
5-7-5. Other Checks
6. Observe the waveform of the oscilloscope, and check that the
specified value is satisfied. Do not click the [JOG UP] or
[JOG DOWN].
All the following checks are performed by the Auto Check mode.
They therefore need not be performed in normal operation.
5-7-6. Traverse Check
(Read power traverse checking)
5-7-7. Focus Bias Check
5-7-8. C PLAY Check
5-7-9. Self-Recording/Playback Check
Traverse Waveform
A
B
VC
Specified value : Below 10% offset value
I A – B I
2 (A + B)
Offset value (%) =
X 100
7. Click the [ENTER/YES] to display “EFB = MO-W”.
8. Observe the waveform of the oscilloscope, and check that the
specified value is satisfied. Do not click the [JOG UP] or
[JOG DOWN].
(Write power traverse checking)
Traverse Waveform
A
B
VC
Specified value : Below 10% offset value
I A – B I
2 (A + B)
Offset value (%) =
X 100
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9. Click the [ENTER/YES] to display “EFB = MO-P”.
Then, the optical pick-up moves to the pit area automatically
and servo is imposed.
5-7-7. Focus Bias Check
Change the focus bias and check the focus tolerance amount.
Checking Procedure:
10. Observe the waveform of the oscilloscope, and check that the
specified value is satisfied. Do not click the [JOG UP] or
[JOG DOWN].
1. Load the test disk (MDW-74/GA-1).
2. Click the [JOG UP] or [JOG DOWN] to display “CPLAY2
MODE” (C36).
3. Click the [ENTER/YES] to display “CPLAY2MID”.
Traverse Waveform
4. Click the [MENU/NO] when “C =
AD = ” is displayed.
5. Click the [JOG UP] or [JOG DOWN] to display “FBIAS
A
B
CHECK” (C16).
VC
6. Click the [ENTER/YES] to display “
/
c = ”.
The first four digits indicate the C1 error rate, the two digits
after [/] indicate ADER, and the 2 digits after [c =] indicate
the focus bias value.
Specified value : Below 10% offset value
Check that the C1 error is below 20 and ADER is below 2.
I A – B I
2 (A + B)
Offset value (%) =
X 100
7. Click the [ENTER/YES] to display “
Check that the C1 error is about 100 and ADER is below 2.
8. Click the [ENTER/YES] to display “ a = ”.
/
b = ”.
11. Click the [ENTER/YES] to display “EF MO CHECK (C14)”.
The disc stops rotating automatically.
12. Click the [EJECT] button and take out the disc.
13. Load the check disc (MD) TDYS-1.
/
Check that the C1 error is about 100 and ADER is below 2.
9. Click the [MENU/NO], then click the [EJECT] and take out the
test disc.
14. Click the [JOG UP] or [JOG DOWN] and display “EF CD
CHECK” (C15).
5-7-8. C PLAY Check
15. Click the [ENTER/YES] to display “EFB =
CD”. Servo is
imposed automatically.
MO Error Rate Check
16. Observe the waveform of the oscilloscope, and check that the
specified value is satisfied. Do not click the [JOG UP] or
[JOG DOWN].
Checking Procedure:
1. Load the test disk (MDW-74/GA-1).
2. Click the [JOG UP] or [JOG DOWN] to display “CPLAY2
MODE” (C36).
Traverse Waveform
3. Click the [ENTER/YES] to display “CPLAY2MID”.
4. The display changes to “C =
AD = ”.
A
B
5. If the C1 error rate is below 20, check that ADER is 00.
6. Click the [MENU/NO] to stop playback, then Click the
[EJECT] and take out the test disc.
VC
Specified value : Below 10% offset value
CD Error Rate Check
Checking Procedure:
I A – B I
2 (A + B)
Offset value (%) =
X 100
1. Load the check disc (MD) TDYS-1.
2. Click the [JOG UP] or [JOG DOWN] to display “CPLAY2
MODE” (C36).
17. Click the [ENTER/YES] to display “EF CD CHECK” (C15).
18. Click the [EJECT] and take out the check disc (MD) TDYS-1.
3. Click the [ENTER/YES] to display “CPLAY2MID”.
4. The display changes to “C =
AD = ”.
Check Location: BD board (see page 35)
5. Check that the C1 error rate is below 20.
6. Click the [MENU/NO] to stop playback, then click the
[EJECT] and take out the check disc.
5-7-9. Self-Recording/playback Check
Prepare a continuous recording disc using the unit to be repaired
and check the error rate.
Checking Procedure:
1. Load a recordable disc (blank disc).
2. Click the [JOG UP] or [JOG DOWN] to display
“CREC 2MODE” (C37).
3. Click the [ENTER/YES] to display “CREC 2MID”.
4. When recording starts and display “CREC 2 @@@@”(@@@@
is the address).
5. About 1 minute later, click the [MENU/NO] to stop continu-
ous recording.
6. Click the [JOG UP] or [JOG DOWN] to display “CPLAY2
MODE” (C36).
7. Click the [ENTER/YES] to display “CPLAY2MID”.
8. “C =
AD = ” will be displayed.
9. Check that the C1 error becomes below 20 and the AD error
below 2.
10. Click the [MENU/NO] to stop playback, then click the
[EJECT] and take out the disc.
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5-8. INITIAL SETTING OF ADJUSTMENT VALUE
5-10.TEMPERATURE COMPENSATION OFFSET
ADJUSTMENT
Save the temperature data at that time in the non-volatile memory
as 25 ˚C reference data.
Note:
1. Usually, do not perform this adjustment.
2. Perform this adjustment in an ambient temperature of 22 ˚C to 28 ˚C.
Perform it immediately after the power is turned on when the internal
temperature of the unit is the same as the ambient temperature of 22 ˚C
to 28 ˚C.
Note:
Mode which sets the adjustment results recorded in the non-volatile
memory to the initial setting value. However the results of the tempera-
ture compensation offset adjustment will not change to the initial setting
value.
If initial setting is performed, perform all adjustments again excluding the
temperature compensation offset adjustment.
For details of the initial setting, refer to “5-5. Precautions forAdjustments”
and execute the initial setting before the adjustment as required.
3. When D101 has been replaced, perform this adjustment after the tem-
perature of this part has become the ambient temperature.
Setting Procedure:
1. Click the [JOG UP] or [JOG DOWN] to display “ADJ
CLEAR” (C28).
2. Click the [ENTER/YES]. “Complete!” will be displayed mo-
mentarily and initial setting will be executed, after which “ADJ
CLEAR” (C28) will be displayed.
Adjusting Procedure:
1. Click the [JOG UP] or [JOG DOWN] to display “TEMP AD-
JUST” (C03).
2. Click the [ENTER/YES] to select the “TEMPADJUST” mode.
3. “TEMP =
[OK” and the current temperature data will be
displayed.
5-9. RECORDING AND DISPLAYING THE Iop
INFORMATION
The Iop data can be recorded in the non-volatile memory. The Iop
value on the optical pick-up label and the Iop value after the ad-
justment will be recorded. Recording these data eliminates the need
to read the label on the optical pick-up.
4. To save the data, click the [ENTER/YES].
When not saving the data, click the [MENU/NO].
5. When the [ENTER/YES] is clicked, “TEMP = SAVE” will
be displayed and turned back to “TEMP ADJUST” (C03) dis-
play then. When the [MENU/NO] is clicked, “TEMPADJUST”
(C03) will be displayed immediately.
Recording Procedure:
Specified Value:
1. Click the [JOG UP] or [JOG DOWN] to display “Iop Write”
(C05), and click the [ENTER/YES].
The “TEMP =
0F”, “10 - 1F” and “20 - 2F”.
” should be within “E0 - EF”, “F0 - FF”, “00 -
2. The display becomes “Ref=@@@.@” (@ is an arbitrary num-
ber) and the numbers which can be changed will blink.
3. Input the Iop value on the optical pick-up label.
To select the number : Click the [JOG UP] or [JOG DOWN].
To select the digit : Click the [PUSH].
5-11. LASER POWER ADJUSTMENT
Check the Iop value of the optical pick-up before adjustments.
(Refer to 5-9. Recording and Displaying Iop Information)
4. When the [ENTER/YES] is clicked, the display becomes
“Measu=@@@.@” (@ is an arbitrary number).
5. As the adjustment results are recorded for the 4 value. Leave it
as it is and click the [ENTER/YES].
Connection:
laser
power meter
6. “Complete!!” will be displayed momentarily. The value will
be recorded in the non-volatile memory and the display will
become “Iop Write” (C05).
Optical pick-up
objective lens
digital voltmeter
BD board
Display Procedure:
1. Click the [JOG UP] or [JOG DOWN] to display “Iop Read”
(C26), and click the [ENTER/YES].
2. “@@.@/##.#” is displayed and the recorded contents are dis-
played.
CN105 pin 1 (I +3 V)
+
–
CN105 pin 2 (Iop)
@@.@ indicates the Iop value on the optical pick-up label.
##.# indicates the Iop value after adjustment
3. To end, click the [PUSH] or [MENU/NO] to display “Iop Read”
(C26).
Adjusting Procedure:
1. Set the laser power meter on the objective lens of the optical
pick-up. (When it cannot be set properly, click the [FF] or
[FR] to move the optical pick-up)
Connect the digital voltmeter to CN105 pin 1 (I+3V) and
CN105 pin 2 (Iop) on the BD (MD) board.
2. Click the [JOG UP] or [JOG DOWN] to display “LDPWR
ADJUST” (C04).
(Laser power : For adjustment)
3. Click the [ENTER/YES] once to display “L 0.90 mW $ ”.
4. Click the [JOG UP] or [JOG DOWN] so that the reading of
the laser power meter becomes specified value. Click the
[ENTER/YES] after setting the range knob of the laser power
meter, and save the adjustment results. (“LD SAVE $ ” will
be displayed for a moment)
Specified Value:
Laser power meter reading: 0.85 to 0.91 mW (KMS-262A)
0.90 to 0.95 mW (KMS-262E)
5. Then “L 8.40 mW $ ” (KMS-262A) or “L 8.65 mW $
”
(KMS-262E) will be displayed.
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6. Click the [JOG UP] or [JOG DOWN] so that the reading of
the laser power meter becomes specified value, click the
[ENTER/YES] to save it.
5-12. Iop NV SAVE
Write the reference values in the nonvolatile memory to perform
“Iop compare”. As this involves rewriting the reference values, do
not perform this procedure except when adjusting the laser power
during replacement of the optical pick-up and when replacing the
Specified Value:
Laser power meter reading: 8.2 to 8.6 mW (KMS-262A)
8.5 to 8.8 mW (KMS-262E)
IC102. Otherwise the optical pick-up check may deteriorate.
Note: Perform this function with the optical pick-up set at room tempera-
ture.
Note: Do not perform the emission with 8.4 mW more than 15 seconds
continuously.
Procedure:
7. Then, click the [JOG UP] or [JOG DOWN] to display
1. Click the [JOG UP] or [JOG DOWN] to display “Iop NV Save”
(C06).
“LDPWR CHECK” (C13).
8. Click the [ENTER/YES] once to display “L 0.90 mW $ ”.
Check that the reading of the laser power meter become speci-
fied value.
2. Click the [ENTER/YES] and display “Iop [stop]”.
3. After the display changes to “Iop =xxsave?”, click the [ENTER/YES].
4. After “Complete!” is displayed momentarily, the display changes
to “Iop 8.4 mW”.
Specified Value:
Laser power meter reading: 0.84 to 0.92 mW (KMS-262A)
0.90 to 0.96 mW (KMS-262E)
5. After the display changes to “Iop=yysave?”, click the [ENTER/YES].
6. When “Complete!” is displayed, it means that Iop NV saving
has been completed.
9. Click the [ENTER/YES] button once more to display “L 8.40
mW $ ” (KMS-262A) or “L 8.65 mW $ ” (KMS-262E).
Check that the reading the laser power meter and digital volt-
meter satisfy the specified value.
5-13.TRAVERSE ADJUSTMENT
Note 1:Data will be erased during MO reading if a recorded disc is
used in this adjustment.
Note 2:If the traverse waveform is not clear, connect the oscilloscope
as shown in the following figure so that it can be seen more
Note down the digital voltmeter reading value.
clearly.
oscilloscope
Specified Value:
(DC range)
Laser power meter reading: 8.4 ± 0.3 mW (KMS-262A)
8.65 ± 0.25 mW (KMS-262E)
Digital voltmeter reading : Value on the optical pick-up label
±10%
BD board
330 k Ω
CN105 pin 4 (TE)
+
–
CN105 pin 6 (VC)
(Optical pick-up label)
10 pF
KMS262A
20101
B0825
(For details of the method for
checking this value, refer to “8.
Recording and Displaying the Iop
Information”.)
Connection:
oscilloscope
(DC range)
BD board
Iop = 82.5 mA in this case
CN105 pin 4 (TE)
CN105 pin 6 (VC)
Iop (mA) = Digital voltmeter reading (mV)/1 (Ω)
+
–
V: 0.1 V/div
H: 10 ms/div
10. Click the [MENU/NO] to display “LDPWR CHECK” (C13)
and stop the laser emission.
(The [MENU/NO] is effective at all times to stop the laser
emission.)
11. Click the [JOG UP] or [JOG DOWN] to display “Iop Write”
(C05).
12. Click the [ENTER/YES]. When the display becomes
Ref=@@@.@ (@ is an arbitrary number), click the [ENTER/YES]
to display “Measu=@@@.@” (@ is an arbitrary number).
13. The numbers which can be changed will blink. Input the Iop
value noted down at step 9.
To select the number : Click the [JOG UP] or [JOG DOWN].
To select the digit : Click the [PUSH].
14. When the [ENTER/YES] is clicked, “Complete!” will be dis-
played momentarily. The value will be recorded in the non-
volatile memory and the display will become “Iop Write”
(C05).
Adjusting Procedure:
1. Connect an oscilloscope to CN105 pin 4 (TE) and CN105
pin 6 (VC) on the BD board.
2. Load a disc (any available on the market). (Refer to Note 1)
3. Click the [STOP] after the [FF] clicked to move the optical
pick-up outside the pit.
4. Click the [JOG UP] or [JOG DOWN] to display “EF MO
ADJUST” (C07).
5. Click the [ENTER/YES] to display “EFB = MO-R”.
(Laser power READ power/Focus servo ON/tracking servo
OFF/spindle (S) servo ON)
6. Click the [JOG UP] or [JOG DOWN] so that the waveform
of the oscilloscope becomes the specified value.
(When the [JOG UP] or [JOG DOWN] is clicked, the
of
“EFB= ” changes and the waveform changes.) In this ad-
justment, waveform varies at intervals of approx. 2%. Adjust
the waveform so that the specified value is satisfied as much
as possible.
Note: After step 4, each time the [ENTER/YES] is clicked, the display
will be switched “L 0.70 mW $
” and “LD 7.50 mW $
”.
(Read power traverse adjustment)
Nothing needs to be performed here.
Traverse Waveform
Adjustment Location: BD board (see page 35)
A
B
VC
Specification A = B
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7. Click the [ENTER/YES] and save the result of adjustment to
18. Click the [ENTER/YES], display “EFB = SAVE” for a mo-
ment and save the adjustment results in the non-volatile
memory.
the non-volatile memory (“EFB = SAVE” will be displayed
for a moment. Then “EFB =
MO-W” will be displayed).
Next “EF CD ADJUST” (C08) will be displayed.
19. Click the [EJECT] button and take out the disc (MD) TDYS-
1.
8. Click the [JOG UP] or [JOG DOWN] so that the waveform
of the oscilloscope becomes the specified value.
(When the [JOG UP] or [JOG DOWN] is clicked, the
of
“EFB= ” changes and the waveform changes.) In this ad-
justment, waveform varies at intervals of approx. 2%. Adjust
the waveform so that the specified value is satisfied as much
as possible.
Adjustment Location: BD board (see page 35)
5-14. FOCUS BIAS ADJUSTMENT
(Write power traverse adjustment)
Adjusting Procedure:
1. Load the continuously-recorded disc. (Refer to “5. USING
THE CONTINUOUSLY RECORDED DISC”)
2. Click the [JOG UP] or [JOG DOWN] to display “CPLAY2
MODE” (C36).
Traverse Waveform
A
B
3. Click the [ENTER/YES] to display “CPLAY2MID”.
VC
4. Click the [MENU/NO] when “C =
AD = ” is displayed.
5. Click the [JOG UP] or [JOG DOWN] to display “FBIAS
ADJUST” (C09).
6. Click the [ENTER/YES] to display “
Specification A = B
/
a = ”.
The first four digits indicate the C1 error rate, the two digits
after “/ ” indicate ADER, and the 2 digits after “a =” indicate
the focus bias value.
9. Click the [ENTER/YES], and save the adjustment results in
the non-volatile memory. (“EFB = SAVE” will be displayed
for a moment)
7. Click the [JOG UP] and find the focus bias value at which the
C1 error rate becomes about 200 (refer to Note 2).
10. “EFB =
MO-P” will be displayed.
8. Click the [ENTER/YES] to display “
/
b = ”.
The optical pick-up moves to the pit area automatically and
servo is imposed.
9. Click the [JOG DOWN] and find the focus bias value at which
the C1 error rate becomes about 200.
11. Click the [JOG UP] or [JOG DOWN] until the waveform of
the oscilloscope moves closer to the specified value.
In this adjustment, waveform varies at intervals of approx. 2%.
Adjust the waveform so that the specified value is satisfied as
much as possible.
10. Click the [ENTER/YES] to display “
11. Check that the C1 error rate is below 20 and ADER is 00.
/
c = ”.
Then click the [ENTER/YES].
12. If the “( )” in “
-
-
(
)” is above 20, click the
[ENTER/YES] button.
If below 20, click the [MENU/NO] and repeat the adjustment
from step 2.
Traverse Waveform
13. Click the [EJECT] button and take out the disc.
Note 1: The relation between the C1 error and focus bias is as shown in
the following figure. Find points A and B in the following figure
using the above adjustment. The focal point position C is auto-
matically calculated from points A and B.
A
B
VC
Note 2: As the C1 error rate changes, perform the adjustment using the
average vale.
Specification A = B
C1 error
12. Click the [ENTER/YES], and save the adjustment results in
the non-volatile memory. (“EFB = SAVE” will be displayed
for a moment.)
about
200
Next “EF MO ADJUST” (C07) is displayed. The disc stops
rotating automatically.
13. Click the [EJECT] and take out the disc.
14. Load the check disc (MD) TDYS-1.
15. Click the [JOG UP] or [JOG DOWN] to display “EF CD
ADJUST” (C08).
Focus bias value
B
C
A
16. Click the [ENTER/YES] to display “EFB = CD”. Servo is
imposed automatically.
17. Click the [JOG UP] or [JOG DOWN] so that the waveform
of the oscilloscope moves closer to the specified value.
In this adjustment, waveform varies at intervals of approx. 2%.
Adjust the waveform so that the specified value is satisfied as
much as possible.
Traverse Waveform
A
B
VC
Specification A = B
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5-15. ERROR RATE CHECK
5-17. AUTO GAIN CONTROL OUTPUT LEVEL
ADJUSTMENT
Be sure to perform this adjustment when the optical pick-up is
5-15-1. CD Error Rate Check
Checking Procedure:
replaced.
1. Load the check disc (MD) TDYS-1.
2. Click the [JOG UP] or [JOG DOWN] to display “CPLAY2
MODE” (C36).
If the adjustment results becomes “Adjust NG!”, the optical pick-
up may be faulty or the servo system circuits may be abnormal.
3. Click the [ENTER/YES] twice and display “CPLAY2MID”.
5-17-1. CD Auto Gain Control Output Level Adjustment
Adjusting Procedure:
4. The display changes to “C =
AD = ”.
5. Check that the C1 error rate is below 20.
6. Click the [MENU/NO] to stop playback, then click the [EJECT]
and take out the check disc.
1. Load the check disc (MD) TDYS-1.
2. Click the [JOG UP] or [JOG DOWN] to display “AG Set (CD)”
(C11).
3. When the [ENTER/YES] is clicked, the adjustment will be
performed automatically.
5-15-2. MO Error Rate Check
Checking Procedure:
1. Load the continuously-recorded disc. (Refer to “5-6. USING
THE CONTINUOUSLY RECORDED DISC”)
2. Click the [JOG UP] or [JOG DOWN] to display “CPLAY2
MODE” (C36).
“Complete!!” will then be displayed momentarily when the
value is recorded in the non-volatile memory, after which the
display changes to “AG Set (CD)” (C11).
4. Click the [EJECT] and take out the check disc.
3. Click the [ENTER/YES] to display “CPLAY2MID”.
5-17-2. MO Auto Gain Control Output Level Adjustment
Adjusting Procedure:
4. The display changes to “C =
AD = ”.
5. If the C1 error rate is below 20, check that ADER is 00.
6. Click the [MENU/NO] to stop playback, then click the
[EJECT] and take out the test disc.
1. Load the test disc (MDW-74/GA-1).
2. Click the [JOG UP] or [JOG DOWN] to display “AG Set
(MO)” (C10).
3. When the [ENTER/YES] is clicked, the adjustment will be
performed automatically.
5-16. FOCUS BIAS CHECK
Change the focus bias and check the focus tolerance amount.
“Complete!!” will then be displayed momentarily when the
value is recorded in the non-volatile memory, after which the
display changes to “AG Set (MO)” (C10).
Checking Procedure:
1. Load the continuously-recorded disc. (Refer to “5-6. USING
THE CONTINUOUSLY RECORDED DISC”)
2. Click the [JOG UP] or [JOG DOWN] to display “CPLAY2
MODE” (C36).
4. Click the [EJECT] and take out the test disc.
3. Click the [ENTER/YES] twice to display “CPLAY2MID”.
4. Click the [MENU/NO] when “C =
AD = ” is displayed.
5. Click the [JOG UP] or [JOG DOWN] to display “FBIAS
CHECK” (C16).
6. Click the [ENTER/YES] to display “
/
c = ”.
The first four digits indicate the C1 error rate, the two digits
after “/ ” indicate ADER, and the 2 digits after “c =” indicate
the focus bias value.
Check that the C1 error is below 20 and ADER is below 2.
7. Click the [ENTER/YES] and display “
Check that the C1 error is about 100 and ADER is below 2.
8. Click the [ENTER/YES] and display “ a = ”.
/
b = ”.
/
Check that the C1 error is about 100 and ADER is below 2
9. Click the [MENU/NO], then click the [EJECT] and take out
the disc.
Note: If the C1 error and ADER are above other than the specified
value at points a (step 8. in the above) or b (step 7. in the above),
the focus bias adjustment may not have been carried out prop-
erly. Adjust perform the beginning again.
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Adjustment and Checking Loacation:
– BD BOARD (Component Side) –
D101
CN101
– BD BOARD (Conductor Side) –
IC101
CN105
1
1. I+3V
2. Iop
3. GND
4. TE
7
5. FE
6. VC
7. RF
IC201
IC933
Note: It is useful to use the jig for checking the waveform. (Refer to Ser-
vicing Notes on page 8)
35
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SECTION 6
DIAGRAMS
6-1. BLOCK DIAGRAM – SERVO Section –
DIGITAL SIGNAL PROCESSOR,
EFM/ACIRC ENCODER/DECODER,
SHOCK PROOF MEMORY CONTROLLER,
ATRAC ENCODER/DECODER
IC201 (1/2)
17
TX
IC201 (1/2)
EFMO
OVER WRITE
IC181, Q181, 182
ADDT
115
32
DADTI, XBCKI,
LRCKI, DIN1
DATAI
XBCKI
LRCKI
DADTI
XBCKI
LRCKI
SAMPLING
RATE
CONVERTER
27
29
28
HR901
OVER WRITE HEAD
FILI
73
72
75
74
SCTX
PCO
CLTV
FILO
PLL
DIN0
DIN1
24
25
26
DIGITAL
AUDIO
INTERFACE
48
47
RF AMP,
DIN1
ASYO
OPTICAL PICK-UP BLOCK
(KMS-262E)
FOCUS/TRACKING ERROR AMP
67
DOUT
IC101
DADT, BCK,
LRCK, FS256
ASYI
RFI
68
70
DADT
XBCK
LRCK
FS256
DADT
BCK
LRCK
FS256
I
COMPA-
RATOR
1
33
35
34
36
RFO
& EQ
RF AMP
46
J
J
2
EQ
WBL
B.P.F.
3T
X801
90.3168MHz
AUX
33
OSCI
19
20
CLOCK
GENERATOR
PEAK
OSCO
37
36
F
TEMP
WBL
PEAK &
D-RAM
IC152
BOTM
BOTTOM
B
A
INTERNAL BUS
SUBCODE
PROCESSOR
C
D
B
A
ADIP
DEMODULATOR/
DECODER
I
J
ADFG
F0CN
ADFM
ADIN
30
ADFG
AT
AMP
B.P.F.
29
32
91
94
A
B
C
D
4
5
6
7
ABCD
FE
ABCD
AMP
35
34
I-V
E
AMP
CPU
INTERFACE
MONITOR
CONTROL
FOCUS
DETECTOR
C
D
E
SPINDLE
SERVO
TE
SE
E
F
8
9
26
28
I-V
AMP
TRACKING
ERROR AMP
F
COMMAND
110 109
14 13
16 12 11 10
6
7
8
1
2
3
4
AUTOMATIC
POWER CONTROL
Q202, 203
XOE
XWE
XRAS
XCAS
APC
PD
ILCC
LD/PD
AMP
38
47
46
22 OE
11
10
SERIAL/PARALLEL
CONVERTER,
DECODER
4
5
WE
RAS
F0CNT
V-I
CONVERTER
20
PD
LD
23 CAS
LASER DIODE
SWDT
SCLK
LASER ON
SWITCH
Q201
PD
SWDT, SCLK
12
16 17 18
16 18
23
49 30 29 31 51
55 54
COMPARATOR
IOP
LDON
87
43
• SIGNAL PATH
SYSTEM CONTROLLER
IC301 (1/2)
46 WRPWR
: PLAY
: REC
FOCUS/TRACKING COIL DRIVE,
SPINDLE/SLED MOTOR DRIVE
IC401
42
MOD
16
PSB
65 64
SPFD
SPRD
OUT4F
OUT4R
IN4R
IN4F
6
8
3
4
M101
100
M
M
15
80 78 79 86 85 76 77
(SPINDLE)
S101
(LIMIT IN)
LIMIT-IN 45
3
6
+5V
SFDR
SRDR
S105
LOADING
MOTOR DRIVE
IC440
REFERENCE
VOLTAGE SWITCH
Q401, 440
108
107
REC-SW
27 OUT2F
25 OUT2R
IN2F 29
IN2R 30
47
53
50
M102
(SLED)
(REC)
ANALOG MUX
S103
(OUT)
A/D CONVERTER
63 LOAD-LO
OUT-SW
7
2
DIGITAL SERVO
2-AXIS
SIGNAL
DEVICE
FROM CPU
INTERFACE
FCS+
FFDR
FRDR
S104
(PLAY)
PROCESS
IN3F
104
105
PLAY-SW
12 OUT3F
14
M
10
IN3R 15
OUT3R
XLRF
CLRF
DTRF
XLAT
SCLK
SWDT
M103
(LOADING)
97
98
99
–1
–2
S102-1
AUTO
SEQUENCER
REFLECT
PROTECT
SDA
WP
5
7
57 SDA
52 SCL
56 EEP-WP
58
59
(REFELECT RATE DETECT)
FCS–
TRK+
TRK–
S102-2
TFDR
TRDR
(PROTECT DETECT)
OUT1F
23 OUT1R
IN1F
103
102
21
19
DIGITAL SERVO
SIGNAL PROCESSOR
IC201 (2/2)
HF MODULE
SWITCH
Q701 – 704
IN1R 18
S102
MOD
HF MODULE
36
36
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MDS-NT1
6-2. BLOCK DIAGRAM – MAIN Section –
CN4
USB
DADTI, XBCKI,
LRCKI, DIN1
DADTI
XBCKI
LRCKI
DIN1
2
3
NET MD SECURITY,
DIGITAL SIGNAL PROCESSOR,
USB INTERFACE
11 DSPIF3
10 DSPIF2
DP 39
DM 40
USB+
USB–
8
7
DSPIF0
USBSW 42
USBEN 35
D901
1
5
DSPCLK
VBUS
52 53 51 56 57
3
58
47
46
D/A CONVERTER
IC505
DADT, BCK,
LRCK, FS256
X550
12MHz
FS256
1
MCLK
AOUTL+ 12
AOUTL– 11
DADT
BCK
LRCK
CN200
3
2
4
SDTI
BICK
LRCK
ANALOG OUT
AOUTR+ 10
SWDT, SCLK
AOUTR–
9
SWDT
SCLK
8
7
6
CDTI
CCLK
CSN
RV301
PHONE
LEVEL
HEADPHONE AMP
IC503
5
MUTING
Q170, 270
J180
5
3
LIN
RIN
LOUT
ROUT
7
1
PHONES
2
MUTING
CONTROL SWITCH
Q100
HEADPHONE
MUTING
Q451
• SIGNAL PATH
: PLAY
D301
: REC
38
37
4
3
5
74 73 76 75
77
36
17
SYSTEM CONTROLLER
IC301 (2/2)
13 XIN
11 XOUT
X301
10MHz
+5V
84 82 81
93
95
10
+3.3V
IC402
D422
D421
D732
SYS+3.3V
BAK+3.3V
LED DRIVE
Q732
Net MD
+9V
S726
S702
BT420
LITHIUM
BATTERY
RESET
SIGNAL
IC420
B/> x/Z
VOLTAGE
IC401
LED DRIVE
Q751
D751
(PLAY)
+3.3V
IC933
SWITCHING
IC400
SWITCHING
Q400
BD+3.3V
LED DRIVE
Q731
D731
(REC)
+2.6V
IC926
D+2.6V
A+5V
J400
THP400
–5V
IC451
+5V
IC450
A–5V
+
–
DC IN 9V
37
37
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MDS-NT1
• Waveforms
– BD Board –
6-3. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
Note on Printed Wiring Boards:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
f
1 IC101 ek (RF) (PLAY mode)
5 IC201 ef (LRCK) (PLAY mode)
qd IC505 4 (LRCK) (PLAY mode)
and tantalums.
•
•
: internal component.
• All resistors are in Ω and 1/4 W or less unless otherwise
: Pattern from the side which enables seeing.
specified.
(The other layers' patterns are not indicated.)
f
•
: internal component.
Caution:
• C : panel designation.
4.5 Vp-p
4 Vp-p
1.4 Vp-p
Pattern face side: Parts on the pattern face side seen from
(Conductor Side) the pattern face are indicated.
Parts face side:
Note: The components identified by mark 0 or dotted line
with mark 0 are critical for safety.
Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Replace only with part number specified.
• A : B+ Line.
• B : B– Line.
22.7 ns
22.7 ns
• Power voltage is dc 9V and fed with regulated dc power
supply from external power voltage jack.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PLAYBACK
2 IC101 ef (FE) (PLAY mode)
6 IC201 eg (XBCK) (PLAY mode)
qf IC505 2 (BICK) (PLAY mode)
(
) : STOP
: Impossible to measure
∗
• Voltages are taken with aVOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
approx
460 mVp-p
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
4.6 Vp-p
3.6 Vp-p
• Circled numbers refer to waveforms.
• Signal path.
E
: PLAY
l : REC
354 ns
354 ns
– MAIN Board –
qa IC301 qa (XOUT)
3 IC101 wh (TE) (PLAY mode)
qg IC505 1 (MCLK)
approx
620 mVp-p
3 Vp-p
4.2 Vp-p
88 ns
100 ns
4 IC201 w; (OSCO)
qs IC901 5 (DSPCLK)
qh IC400 7 (EXT)
4.2 Vp-p
2.6 Vp-p
9.1 Vp-p
15.8 µs
88 ns
11 ns
38
38
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MDS-NT1
6-4. PRINTED WIRING BOARD – BD Board –
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
HR901
OVER WRITE
HEAD
MAIN BOARD
MAIN BOARD
A
B
C
D
E
(COMPONENT SIDE)
(CONDUCTOR SIDE)
BD BOARD
BD BOARD
(Page 42)
(Page 42)
(SLED)
+
–
M
7
8
1
IC195
IC181
S
14
D
G
S
3
1
3
4
8
1
5
4
D
G
IC933
2
1
30
1
1
31
120
2
26
1
26
(LIMIT IN)
IC201
IC152
3
1
(REC)
IC926
13
60
91
14
61
90
13
2
E
B
E
B
(PLAY)
C
C
E
B
C
1
5
2C
1C
2
3
7
1
I+3V
2B
B
E
E
1B
C
IOP
GND
TE
IC701
F
4
1
32
B
E
FE
C
VC
RF
M101
(SPINDLE)
E
C
M
B
IC401
C
G
H
16
17
48
13
37
(OUT)
1
36
IC101
12
25
(LOADING)
+
24
S102-1
REFLECT
RATE
DETECT
S102-2
PROTECT
DETECT
–
M
-1
-2
S102
12
12
1-683-807-
(12)
1-683-807-
(12)
I
FLEXIBLE BOARD
OPTICAL PICK-UP
BLOCK
(KMS-262E)
• Semiconductor Location
Ref. No. Location
Ref. No. Location
D101
D501
D502
I-6
C-9
C-9
IC933
C-14
Q181
Q182
Q201
Q202
Q203
Q701
Q702
Q703
Q704
C-9
C-9
F-7
G-9
E-10
E-7
F-6
F-7
F-6
IC101
IC152
IC181
IC195
IC201
IC401
IC701
IC926
H-10
D-9
B-10
C-12
D-11
G-13
F-10
E-13
39
39
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MDS-NT1
6-5. SCHEMATIC DIAGRAM – BD Board (1/2) – • See page 38 for Waveforms. • See page 48 for IC Block Diagrams.
A1
A2
A3
A4
(1/2)
R707
4.7k
C704 0.047
R712 100
TP701
Q704
2SA1576A-T
L701
R703 R705
10k
IC701
TLV2361CDBV
1k
A5
A6
R710 R713
47k
10k
COMPARATOR
C702 R706
4.7
-1
-2
2.2k
R709
2.2k
Q702
FMW1-T-148
R704
47k
Q701-704
HF MODULE
SWITCH
CN101
21P
R702
1k
C703 R708
0.1 4.7k
R711
10k
C299
0.1
R701
1k
L202
C701
0.1
TP616
TP615
TP614
TP613
TP612
TP611
VEE
E
A7
E
D
C
F
I
Q701
UN5214-TX
Q703
UN5214-TX
D
C114
2200p
C109 TP207 C111
0.047 0.01
C
F
C105
10
6.3V
C112
0.022
I
TP215
VC
A
TP609
TP608
TP607
TP606
A
L401
L402
B
J
B
A8
A9
C410
100
6.3V
C490
0.1
C411
4.7
J
C101 4.7
VCC
LD-GND
ILCC
MOD
VR
PD
K
L601
C407
0.1
L602
L603
C406
0.01
I
BB3
BB4
BB5
BB6
BB9
1
TP163
TP219
I
BOTM
ABCD
FE
R103
4.7k
J
TP605
J
A10
L201
VC
AA1
AA2
AA3
AA4
A
B
C
TP604
TP603
TP602
TP601
TP218
TP217
FLEXIBLE
BOARD
FCS+
FCS-
TRK+
TRK-
A
AUX
B
ADFG
ADAGC
ADIN
ADFM
SE
C119
C118
C106
10
6.3V
C
RF AMP,
D
E
F
ERROR AMP
D
FOCUS/TRACKING
COIL DRIVE,
0.0047
E
A11
IC101
CXA2523AR
BB7
BB8
TP216
SPINDLE/SLED
MOTOR DRIVE
F
TP204
C120 0.068
PD
CSLED
TE
IC401
BH6519FS
C107 0.022
APC
APCREF
WBLADJ
R110
470k
R120
33k
TP203
R105
3.3M
R119
22k
C405
0.1
R108
2.2k
C409
0.1
R405
0
TP214
C116
4.7
L203
(Page 41)
Q201
UN5113
-TX
TP11
A12
A13
LASER ON
SWITCH
R104
470k
C110
0.001
R114 R116 C115
4.7k 3.3k 0.1
R117
100k
TP212
C103
0.01
C117
0.01
R112
100k
C113
0.0068
R113 R115
10k 10k
C122
0.033
R111 D101
10k 1SS355TE-1
R118
2.2k
C121
0.01
R102
1
R106
100k
R107
680
C104
0.1
C108
0.1
I+3V
IOP
GND
TE
A14
A15
Q203
UN5113
-TX
R101
2.2
TEST PIN
BB8
BB5
TP143
(FOR ADJUSTMENT)
R109
4.7k
FE
Q202
2SB798
-T1D
VC
BB1
RF
Q202,203
AUTOMATIC
CN105
7P
POWER CONTROL
OVER WRITE
HEAD DRIVE
TP404
IC181
MC74ACT08D
TR2
A16
DD1
DD2
M102
(SLED)
Q181
2SJ518ATZR
Q181,182
OVER WRITE
HEAD DRIVE
TP403
TP402
D501
F1J6TP
DD3
DD4
TP504 TP503
TP502 TP501
M101
(SPINDLE)
BG1
R501 C550
22
10V
0
D502
F1J6TP
TP401
C505
100
6.3V
R551
47k
Q182
2SK2788VYTR
CN104
2P
C501
470p
630V
HR901
OVER WRITE
HEAD
R552
47k
L550
C504
10
C502
0.1
A17
L502
L501
A18
A19
40
40
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MDS-NT1
6-6. SCHEMATIC DIAGRAM – BD Board (2/2) – • See page 38 for Waveforms.
(2/2)
S105
(REC)
A1
A2
CC2
CC3
CC4
CC1
TP935
TP931
TP927
A3
S104
(PLAY)
TP1002
A4
C206
100
6.3V
C215 0.033
R207 150
L122
C240 TP1001
0.1
R212
330k
C219
100p
S103
(OUT)
S102
S102-1
REFLECT RATE
DETECT
C220
0.47
CC5
CC6
-1
-2
A5
A6
TP920
TP919
C242
0.1
BB7
S101
C216 R211
2.2
(LIMIT IN)
TP125
TP101
R203
100
S102-2
PROTECT
DETECT
1M
R202
680
C241
0.1
TP145
TP164
A7
TP10
CN102
27P
TP942
TP941
TP940
TP939
TP938
TP937
TP936
MOD
IOP
LDON
CC1
LIMIT-IN
XINT
A8
A9
XINT
WRPWR
DQSY
DQSY
CC2
BB9
A03
A04
REC-SW
SQSY
ADFG
VDIO1
VSIO1
F0CN
VDC3
VSC3
XLRF
CLRF
DTRF
APCR
LDDR
TRDR
TFDR
FFDR
FRDR
FS4
A03
A04
SQSY
TP934
TP933
TP932
C235 0.1
C230 0.1
C253
0.1
DIG-RST
SENS
VSC2
VDC2
A02
SENS
CC3
R122 10k TP162
C251 0.1
A10
A02
A05
A01
A06
A00
A07
A10
A08
A09
XRAS
XCAS
D1
PLAY-SW
SRDT
D-RAM
SRDT
XLAT
SCLK
CC4
TP930
TP929
TP928
IC152
MSM51V17400F-
50TS-K
A05
XLRF
CKRF
DTRF
XLATCH
SCLK
TP144
TP161
TP160
TP165
A01
A06
D3
D2
D1
OUT-SW
SWDT
A00
SWDT
MNT2
MNT1
TP926
TP925
TP924
TP923
TP922
TP921
D0
(Page 44)
A07
A11
XWE
XRAS
XCAS
MNT2(XBUSY)
MNT1(SHCK)
EEP-WP
R121
2.2k
A10
TRDR
XOE
A09
A08
TFDR
FFDR
FRDR
A09
SDA
XRAS
XCAS
D1
DIGITAL SERVO SIGNAL PROCESSOR,
A10
A00
A01
A02
A03
A08
A07
A06
A05
A04
SCL
CC5
CC6
REFRECT SW
PROTECT SW
D-GND
EFM/ACIRC ENCODER/DECODER,
SHOCK PROOF MEMORY CONTROLLER,
ATRAC ENCODER/DECODER
TP158
SRDR
SFDR
SPRD
SPFD
D2
SRDR
SFDR
SPRD
SPFD
FGIN
D2
C909
22
10V
D0
D0
IC201
CXD2664R
D3
LD-OUT
D3
LD-IN
C233
0.1
A11
C194
0.1
C175
0.1
DRVSS0
DRVDD0
XOE
(Page 40)
M103
(LOADING)
TST1
TST2
TST3
EFMO
VDIO2
VSIO2
VDC4
VSC4
MDDT1
XOE
XWE
R227 100
A12
A13
XWE
FS256
XBCK
LRCK
DADT
ADDT
VSC1
TP110
CN103
23P
ADDT
LRCK
DADT
TP917
TP916
TP986
TP911
TP914
TP913
TP912
XBCK
LRCK
DADT
ADDT
ADDT
LRCK
DADT
GND
C231 0.1
R226 100
R225 100
R224 100
R228 100
IC195
BR24C16F-E2
C234
0.1
(NOT SUPPLIED)
R303 R302 R301
10k 10k 10k
C250
0.1
A0
A1
A2
VCC
WP
SCL
XBCK
BCK
R178
0
MCKGND
MCLK
D-GND
XBCKI
GND
TP190
GND SDA
XBCKI
LRCKI
DADTI
A14
A15
TP987
TP899
C301
0.1
C302
0.1
EEPROM
LRCKI
GND
IC926
NJM2391DL1-26
TP999
TP910
DADTI
+5V
C254
0.01
C255
0.1
L10
O
I
DOUT
TP909
DOUT
H+5V
HGND
DIN0
C901
100
6.3V
(Page 44)
TP148
TP149
C905
100
6.3V
C998
0.1
+2.6V REGULATOR
A16
TP908
TP907
MGND
DIN1
L899
0
L8
TP8
IC933
BA033FP-E2
C1102
0.1
MGND
M+5V
M+5V
O
I
C908
10
R808
0
C902
0.1
R299
0
TP169
GND C999
0.1
C903
100
6.3V
X801
90MHz
+3.3V REGULATOR
C809 C807
4.7
1
2
4
0.1
C214
0.01
3
C907
0.01
C209
100p
L801
C211 C212 R205
100p 100p 10k
R206
10k
A17
A18
A19
41
41
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MDS-NT1
6-7. PRINTED WIRING BOARD – MAIN Board (Component Side) –
1
2
3
4
5
6
7
8
9
10
11
12
A
B
C
D
E
MAIN BOARD (COMPONENT SIDE)
IC400
1
3
2
B
E
E
C
C
B
IC402
3
1
2
IC503
1
2
IC420
NC
IC505
IC550
F
13
1
• Semiconductor
14
Location
IC301
Ref. No. Location
D301
D400
D402
D421
D422
D470
D901
D-3
C-2
C-7
D-6
D-6
D-3
F-5
1
4
8
5
2
6
G
H
C
PANEL
BOARD
CN704
IC901
7
IC301
IC400
IC401
IC402
IC420
IC451
IC501
IC503
IC505
IC550
IC901
F-7
(Page 46)
B-5
D-3
C-7
E-6
2
1
8
7
I-9
NC
E-10
D-9
F-10
G-10
G-4
IC451
1
3
6
4
Q100
Q170
Q270
Q400
Q401
Q440
Q451
D-3
C-11
C-10
B-6
H-5
H-5
E-9
I
12
1-682-708-
(12)
BD BOARD
BD BOARD
(Page 39)
(Page 39)
42
42
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MDS-NT1
6-8. PRINTED WIRING BOARD – MAIN Board (Conductor Side) –
1
2
3
4
5
6
7
8
9
10
11
MAIN BOARD (CONDUCTOR SIDE)
CN4
A
B
C
D
E
J400
(FRONT VIEW)
CN200
+
–
SHORT
SOCKET
J180
ANALOG
OUT
DC IN 9V
PHONES
RV301
PHONE
LEVEL
CN4
USB
–1
–2
2
3
4
1
2
1
F
8
G
H
IC440
3
2
1
IC450
1
• Semiconductor
Location
I
12
Ref. No. Location
1-682-708-
(12)
IC440
IC450
G-7
H-4
(CHASSIS)
43
43
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MDS-NT1
6-9. SCHEMATIC DIAGRAM – MAIN Board (1/2) – • See page 38 for Waveforms. • See page 48 for IC Block Diagrams.
(1/2)
IC440
M54641L
LOADING
MOTOR DRIVER
LOAD-OUT
LOAD-IN
TP1
R10
0
FB1
0
CN4
4P
USB
TP2
FB2
0
CN105
8P
LF1
AA2
AA1
R441 R442
22k
Q401,440
15k
GND
LOAD-LOW
TP3
REFERENCE
RESET
CNVSS
RXD1
RESET
CNVSS
RXD1
CLK1
+3.5V
RTS1
TXD1
VOLTAGE SWITCH
FB3
0
Q440
UN5211-TX
C441
0.1
Q401
2SA1576-T106-QR
C442
0.1
R443
47k
C1
0.1
TP4
AA3
NC
CLK1
FB4
0
A1
A2
A3
RTS1
TXD1
C304
100p
A4
A5
CN101
27P
MOD
IOP
MOD
A6
A7
A8
A9
RB300
10k
X4
IOP
LDON
LDON
LIMIT-IN
C306 220p
LIMIT-IN
XINT
XINIT
C920
0
TP350
TP351
R314
10k
R304
0
R303
0
R350
10k
WRPWR
DQSY
REC-P
SQSY
WRPWR
DQSY
(Page 45)
R904
22k
R907 R906
1.5k 27
R905
27
D901
1SS355TE-17
UVBUS3.3
REC-SW
SQSY
RB301
10k
X4
C922
0.1
C307
220p
C918 C917 C916 C915
22p 0.1 0.1 0.1
C913 R913 R903
0.1 10k 47k
R552
220
DIG-RST
L552
DIG-RST
SENS
R351
10k
X550
12MHz
SENS
PLAY-P
SRDT
A10
A11
A12
C900
22p
PLAY-SW
SRDT
PLAY-SW
R306
0
XLATCH
SCLK
XLATCH
SCL
XLATCH
SCLK
XLATCH
SCL
NC
NC
OUT-SW
SWDT
OUT-SW
XBUSY
SHCK
XINIT
OUT-SW
SWDT
OUT-SW
XBUSY
SHOCK
EEP-WP
SDA
XINT
NC
(Page 41)
XBUSY
SHCK
CN102
23P
R308
10k
XBUSY
SHCK
NC
C903
0.1
EEP-WP
SDA
NC
M+5V
M+5V
MGND
DIN1
EEP-WP
SDA
C308
1000p
C904
0.1
EEP-WP
SDA
NC
REFLECT
PROTECT
SQSY
REFLECT
PROTECT
VCC
SQSY
P.DOWN
DQSY
NMI
SCL
UCLK
USI
DIN1
SCL
REFLECT
PROTECT
DQSY
REFRECT SW
PROTECT SW
D-GND
LD-OUT
LD-IN
MGND
DIN0
USO
C318
0.1
EEPNET-WP
VSS
VCC
HGND
H+5V
DOUT
X301
10MHz
C316
0.1
LOAD-LOW
LOAD-OUT
LOAD-IN
R901
0
LOAD-OUT
LOAD-IN
TEST0
SYSTEM CONTROLLER
UCS
VSS
IC301
M30835FJGP-01
UINT
XOUT
S.RESET
NC
DIGITAL SIGNAL PROCESSOR,
USB INTERFACE
REG +5V
DADTI
REG GND
LRCKI
RESET
URESET
DADTI
LRCKI
XBCKI
CN104
7P
TP300
TP301
TP302
TP303
C309 0.1
IC901
CXD1873R
R902
0
TEST1
SYS+3.3V
PANEL.GND
LED1
C321
TEST2
NC
CNVSS
R307
10k
LED1
LED2
LED3
KEY1
KEY0
TEST3
CNVSS
BYTE
NETMD_CLK
NETMD_SI
NETMD_SO
RMC
REG GND
XBCKI
C905
0.1
R332 10k
UCLK
USI
NC
LED2
(Page 41)
NC
D-GND
MCLK
LED3
R915
10k
NC
KEY1
UINT
UCS
USO
NETMD_INT
NETMD_CS
NETMD_RESET
MCKGND
BCK
C906
0.1
KEY0
RMC
BCK
(Page 47)
R301
100k
URESET
NC
REG GND
DADT
CN103
14P
DADT
LRCK
SYS+3.3V
DISP.GND
JOG1
JOG0
DIG-RST
5V
RESET SIGNAL
GENERATOR
UPLLSW
LRCK
JOG1
JOG0
ADDT
RESET
DIG-RST
IC420
M62016FP-E1
TP1642
C907
0.1
RMC
KEY2
FLCS
KEY1
FLDT
KEY0
FLCK
LED4
RMC
RESET
INT
NC
NC
KEY2
FLCS
R951
0
R952
0
VCC
NC
R908
10k
C910
0.1
KEY1
FLDT
NC
C420
0.33
R950
0
C453
0.1
KEY0
FLCK
C301
10
16V
L451
0
L452
0
LED
C421
0.1
44
44
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MDS-NT1
6-10. SCHEMATIC DIAGRAM – MAIN Board (2/2) – • See page 38 for Waveforms. • See page 48 for IC Block Diagrams.
(2/2)
EP550
R162 R164
10k
C166
100p
10k
C856
0.1
(CHASSIS)
R166
10k
C161
220p
IC501(2/2)
NJM2115V(TE2)
C176
22
25V
R140 R142
0
R176
680
R178 C177
L178 330 220p
6
7
5
0
CN200
ANALOG
OUT
R278
330
8
C854
0
C852
0
R161 R163
10k
D/A CONVERTER
10k
C165
100p
R165
10k
L278
C277
220p
R170
10k
A1
A2
A3
IC505
CXD9627
C523
100
10V
C507
0.1
C456
220
10V
C554
0
C451
0.1
C851
0
Q170
2SD1938(F)
-T(TX)
MCLK
DZFL
C524
0.1
MIX AMP
R501 220
R503 220
R500 220
C452
0.1
BCK
DZFR
BICK
A4
A5
L503
DADT
Q170,270
MUTING
C265
100p
R265
10k
VDD
SDTI
(CHASSIS)
IC501(1/2)
NJM2115V(TE2)
LRCK
VSS
3
1
2
LRCK
A6
A7
A8
A9
ADA.RESET
LATCH
SCLK
R261 R263
10k
AOUTL+
PDN
10k
RV301
20k/20k
4
R506 100
R505 100
R504 100
R456 R270
4.7k 10k
Q270
2SD1938(F)
-T(TX)
C519
1000p
AOUTL-
CSN
PHONE
LEVEL
C261
220p
AOUTR+
CCLK
R266
10k
-1
-2
SWDT
(Page 44)
R551
AOUTR-
CDTI
R262 R264
10k 10k
R581
220
C517 C516 C515
100p 100p 100p
C266
100p
R240 R242
0
0
C556
0.1
R455
10k
R276
680
C276
22
25V
C280
1
50V
A10
A11
A12
C281
220 10V L280 2.2
R280
C551
0.1
C555
0.1
L504
0
L551 R550
0.1
R450 C459
100k
1M
1
C550
100
10V
IC550
TC7WHU04FU
BUFFER
C282
220p
R281
1k
J180
PHONES
-5V REGULATOR
HEADPHONE AMP
+5V REGULATOR
IC451
XC6351A120MR
IC503
BH3541F-E2
IC450
BA05T
C101
1
R181
1k
I
O
C182
220p
Q100
UN5111-TX
C181
220
10V
L550
MUTING
CONTROL
SWITCH
R180
L180 2.2
Q451
UN5211-TX
HEADPHONE
MUTING
R420
0
C450
220
10V
C432
0.1
C461
0.1
C462
0.1
C100
1
C460
47
10V
C180
50V
1
C458
220
10V
D301
DAP202UT106
THP400
T400
J400
R471
2.2k
C401
0.1
R403
4.7k
DC IN
9V
VOLTAGE
DETECT
IC401
R470
2.2k
C402
0.1
XC61FN3012MR
D470
MA8033-L-TX
VOUT VIN
(CHASSIS)
VSS
C404
0.1
+3.3V REGULATOR
IC402
BA033FP-E2
IC400
MAX1626ESA
(CHASSIS)
L400
L22µH
C408 C409
0.1
Q400
HAT1020R-E
SWITCHING
0.1
O
I
+V
CS SHDN
EXT 3 5
REF
R401
0.047
CN420
2P
SHORT
SOCKET
C410
15
16V
GND OUT
D422
RB495D-T146
S
R421
220
C407
6800
16V
R404 C406
10k 0.1
BT420
LITHIUM
BATTERY
C416
C415
220
0.1
C413
1000
10V
C412
47
6.3V
SWITCHING
REGULATOR
C414
0.1
D402
SFPB-52V
10V
45
45
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MDS-NT1
6-11. PRINTED WIRING BOARD – PANEL Board –
1
2
3
4
5
6
PANEL BOARD (COMPONENT SIDE)
A
B
C
CN104
D731, 751
(Page 42)
A
K
K
A
K
A
(REC)
(PLAY)
12
1-682-709-
(12)
PANEL BOARD (CONDUCTOR SIDE)
C
D
Net MD
N/>
x/Z
12
(12)
1-682-709-
• Semiconductor
Location
(CHASSIS)
Ref. No. Location
D731
D732
D751
A-6
C-4
A-1
Q731
Q732
Q751
B-5
B-3
B-1
46
46
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MDS-NT1
6-12. SCHEMATIC DIAGRAM – PANEL Board –
R732
150
R751
150
CN704
7P
D732
SEL5820A-TP15
Net MD
D751
SML-010MT-T87
(PLAY)
SYS+3.5V
PANEL.GND
LED1
LED2
R726
4.7k
LED3
KEY1
KEY0
Q732
UN5211-TX
LED DRIVE
Q751
UN5211-TX
LED DRIVE
S726
(Page 44)
C748
0.1
R731
150
TP701
D731
SML-010VT-T87
(REC)
(CHASSIS)
R702
2.2k
S702
Q731
UN5211-TX
LED DRIVE
47
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MDS-NT1
• IC Block Diagrams
– BD Board –
IC101 CXA2523AR
48
47
46
45
44
43 42
41
40
39
38 37
USROP
–
RF AGC
EQ
EQ
+
–
+
USRC
RFA1
DET
BPF3T
3T
RFA2
RFA3
PTGR
AUX
SW
PEAK3T
I
1
2
–
HLPT
–1
1
2
–
–
P-P
–2
–
J
3T
WBL
OFST
TEMP
PEAK
–
–
–
1
2
–2
CVB
36
BOTTOM
WBL
BOTM
+
–
PBH
–1
VC
A
3
4
GRV
GRVA
PBSW
35
34
33
ABCD
FE
–
–
–
–
+
–
AUX
AA
IVR
IVR
IVR
BPFC
ABCDA
32 ADFG
31 ADAGC
30 ADIN
+
–
B
C
5
6
BB
CC
+
+
–
–
FEA
ATA
+
–
DET
BPF22
–
–
+
+
ADIP
AGC
29 ADFM
28 SE
WBL
+
–
D
E
7
8
DD
EE
IVR
IVR
WBL
–1
TG
TG
PTGR
–
+
–
+
–2
+
–
SEA
TEA
+
–
EE'
27 CSLED
26 TE
–1
EFB
TESW
EBAL
–2
ESW
+
–
F
9
+
–
FF
IVR
WBL
FF'
25 WBLADJ
3T
VI CONV
IV
FBAL
EQ
GSW
PD 10
AUXSW
BGR
COMMAND
+
–
+
–
VREF
SCRI - PARA
DECODE
APC 11
APCREF 12
13
14
15
16 17 18
19
20
21
22 23
24
48
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MDS-NT1
IC401 BH6519FS-E2
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
AMP
AMP
AMP
AMP
VDD
INTERFACE
INTERFACE
CHARGE
PUMP.
OSC
PREDRIVE
PREDRIVE
PREDRIVE
PREDRIVE
AMP
AMP
8
AMP
10
AMP
INTERFACE
INTERFACE
PSB
16
1
2
3
4
5
6
7
9
11
12
13
14
15
– MAIN Board –
IC400 MAX1626ESA-TE2
8
7
GND
EXT
1.5V
MINIMUM ON-TIME
ONE-SHOT
ERROR
COMPARATOR
R2
TRIG
Q
–
OUT
1
+
TRIG
Q
MINIMUM OFF-TIME
ONE-SHOT
R1
R3
3/5
2
3
+
SHDN
REF
Q
R
S
REF
4
–
+
6
5
CS
V+
– +
CURRENT-SENSE
COMPARATOR
IC420 M62016FP-E1
3
4
5
6
R1
R2
COM
COM
INTERRUPT
SIGNAL
+
–
8
1
INT
GENERATOR
R3
R4
RESET
SIGNAL
GENERATOR
+
–
RESET
7
2
49
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MDS-NT1
IC440 M54641L
INPUT
AMP
POWER
AMP
CONTROL
INPUT
AMP
POWER
AMP
REG.
1
2
3
4
5
6
7
8
IC451 XC6351A120MR
P1
N2
GND
CCE/
1
2
6
5
C1–
CHIP
ENABLE
VIN
N3
N4
4
VOUT
C1+
3
OSCILLATOR
BUFFER
IC503 BH3541F-E2
8
7
6
5
BIAS
180k
0dB
0dB
+
+
180k
MUTE
2
1
3
4
IC505 CXD9627A-E2
DE-EMPHASIS
CONTROL
CLOCK
DIVIDER
CDTI
CLK
CSN
8
7
6
µP
INTERFACE
PDN
5
9
AOUTR–
8X
∆∑
SCF
SCF
INTERPOLATOR
MODULATOR
10 AOUTR+
LRCK
SDTI
BICK
4
3
2
AUDIO
DATA
INTERFACE
11 AOUTL–
12 AOUTL+
8X
∆∑
INTERPOLATOR
MODULATOR
MCLK
1
13 VSS
14 VDD
15 DZFR
16 DZFL
50
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MDS-NT1
6-13. IC PIN FUNCTION DESCRIPTION
• BD BOARD IC101 CXA2523AR (RF AMP, FOCUS/TRACKING ERROR AMP)
Pin No.
1
Pin Name
I
I/O
I
Description
I-V converted RF signal I input from the optical pick-up block detector
I-V converted RF signal J input from the optical pick-up block detector
Middle point voltage (+1.65V) generation output terminal
Signal input from the optical pick-up detector
2
J
I
3
VC
O
I
4 to 9
10
A to F
PD
I
Light amount monitor input from the optical pick-up block laser diode
Laser amplifier output to the automatic power control circuit
Reference voltage input for setting laser power
11
APC
O
I
12
APCREF
GND
13
—
I
Ground terminal
14
TEMPI
TEMPR
SWDT
SCLK
XLAT
XSTBY
Connected to the temperature sensor
O
I
15
Output terminal for a temperature sensor reference voltage
Writing serial data input from the CXD2664R
16
17
I
Serial data transfer clock signal input from the CXD2664R
Serial data latch pulse signal input from the CXD2664R
Standby signal input terminal “L”: standby (fixed at “H” in this set)
18
I
19
I
Center frequency control voltage input terminal of internal circuit (BPF22, BPF3T, EQ) input
terminal
20
F0CNT
I
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
VREF
EQADJ
3TADJ
VCC
O
I
Reference voltage output terminal Not used
Center frequency setting terminal for the internal circuit (EQ)
Center frequency setting terminal for the internal circuit (BPF3T)
Power supply terminal (+3.3V)
I
—
I
WBLADJ
TE
Center frequency setting terminal for the internal circuit (BPF22)
Tracking error signal output terminal
O
I
CSLED
SE
Connected to the external capacitor for low-pass filter of the sled error signal
Sled error signal output terminal
O
O
I
ADFM
ADIN
ADAGC
ADFG
AUX
FM signal output terminal of the ADIP
Receives a ADIP FM signal in AC coupling
I
Connected to the external capacitor for ADIP AGC
ADIP duplex signal (22.05 kHz ± 1 kHz) output to the CXD2664R
Auxiliary signal (I3 signal/temperature signal) output to the CXD2664R
Focus error signal output terminal
O
O
O
O
O
O
O
I
FE
ABCD
BOTM
PEAK
RF
Light amount signal (ABCD) output terminal
Light amount signal (RF/ABCD) bottom hold output terminal
Light amount signal (RF/ABCD) peak hold output terminal
Playback EFM RF signal output terminal
RFAGC
AGCI
COMPO
COMPP
ADDC
OPO
Connected to the external capacitor for RF auto gain control circuit
Receives a RF signal in AC coupling
I
O
I
User comparator output terminal Not used
User comparator input terminal Not used
I
Connected to the external capacitor for cutting the low band of the ADIP amplifier
User operational amplifier output terminal Not used
User operational amplifier inversion input terminal Not used
RF signal output terminal
O
I
OPN
RFO
O
I
MORFI
MORFO
Receives a MO RF signal in AC coupling
O
MO RF signal output terminal
51
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MDS-NT1
• BD BOARD IC201 CXD2664R
(DIGITAL SIGNAL PROCESSOR, DIGITAL SERVO SIGNAL PROCESSOR, EFM/ACIRC ENCODER/DECODER,
SHOCK PROOF MEMORY CONTROLLER, ATRAC ENCODER/DECODER)
Pin No.
Pin Name
MNT0 (FOK)
MNT1 (SHCK)
MNT2 (XBUSY)
MNT3 (SLOC)
VDC0
I/O
O
O
O
O
—
I
Description
Focus OK signal output terminal “H” is output when focus is on (“L”: NG) Not used
Track jump detection signal output to the system controller
Busy monitor signal output to the system controller
1
2
3
4
Spindle servo lock status monitor signal output terminal Not used
Power supply terminal (+2.5V) (for core)
5
6
SWDT
Writing serial data signal input from the system controller
Serial data transfer clock signal input from the system controller
Serial data latch pulse signal input from the system controller
Ground terminal (for core)
7
SCLK
I
8
XLAT
I
9
VSC0
—
O
O
I
10
11
12
SRDT
Reading serial data signal output to the system controller
Internal status (SENSE) output to the system controller
Reset signal input from the system controller “L”: reset
SENS
XRST
Subcode Q sync (SCOR) output to the system controller
“L” is output every 13.3 msec Almost all, “H” is output
13
14
15
SQSY
DQSY
RPWR
O
O
I
Digital In U-bit CD format subcode Q sync (SCOR) output to the system controller
“L” is output every 13.3 msec Almost all, “H” is output
Laser power selection signal input from the system controller
“L”: playback mode, “H”: recording mode
16
17
18
19
20
XINT
TX
O
O
—
I
Interrupt status output to the system controller
Magnetic head on/off signal output to the over write head drive
Power supply terminal (+3.3V) (for I/O)
VDIO0
OSCI
OSCO
System clock signal input terminal Not used
I
System clock signal (2048Fs=90.3168 MHz) input terminal
Control terminal for inverter and feedback resistor of internal oscillator circuit
“L”: OSCO (pin w;) is output terminal, “H”: OSCO (pin w;) is input terminal
(fixed at “H” in this set)
21
OSCN
I
22
23
VSIO0
XTSL
—
Ground terminal (for I/O)
Input terminal for the system clock frequency setting
“L”: 180.6336 MHz, “H”: 90.3168 MHz (fixed at “H” in this set)
I
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
DIN0
DIN1
I
I
Digital audio signal input terminal when recording mode Not used
Digital audio signal input terminal when recording mode
Digital audio signal output terminal when playback mode Not used
Recording data input from the USB interface
DOUT
DATAI
LRCKI
XBCKI
VDC1
VSC1
O
I
I
L/R sampling clock signal (44.1 kHz) input from the USB interface
Bit clock signal (2.8224 MHz) input from the USB interface
Power supply terminal (+2.5V) (for core)
I
—
—
I
Ground terminal (for core)
ADDT
DADT
LRCK
XBCK
FS256
XWE
Recording data input terminal Not used
O
O
O
O
O
O
—
—
Playback data output to the D/A converter
L/R sampling clock signal (44.1 kHz) output to the D/A converter
Bit clock signal (2.8224 MHz) output to the D/A converter
Clock signal (11.2896 MHz) output to the D/A converter
Write enable signal output to the D-RAM “L” active
Output enable signal output to the D-RAM “L” active
Power supply terminal (+3.3V) (for D-RAM interface)
Ground terminal (for D-RAM interface)
XOE
DRVDD0
DRVSS0
52
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MDS-NT1
Pin No.
41
Pin Name
A11
I/O
O
Description
Address signal output to the external D-RAM Not used
Two-way data bus with the D-RAM
42 to 45
46
D0 to D3
XCAS
I/O
O
Column address strobe signal output to the D-RAM “L” active
Row address strobe signal output to the D-RAM “L” active
47
XRAS
O
A00 to A02,
A05 to A10
48 to 56
O
Address signal output to the D-RAM
57
58
59, 60
61
62
63, 64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
VDC2
VSC2
A03, A04
DRVDD1
DRVSS1
TEST0, TEST1
TEST2
AVD1
ASYO
ASYI
—
—
O
—
—
I
Power supply terminal (+2.5V) (for core)
Ground terminal (for core)
Address signal output to the D-RAM
Power supply terminal (+3.3V) (for D-RAM interface)
Ground terminal (for D-RAM interface)
Not used
O
—
O
I
Not used
Power supply terminal (+3.3V) (analog system)
Playback EFM full-swing output
Playback EFM comparator slice voltage input
Playback EFM comparator bias current input
Playback EFM RF signal input from the RF amplifier
Ground terminal (analog system)
BIAS
I
RFI
I
AVS1
PCO
—
O
I
Phase comparison output for master clock of the recording/playback EFM master PLL
Filter input for master clock of the recording/playback EFM master PLL
Filter output for master clock of the recording/playback EFM master PLL
Internal VCO control voltage input of the recording/playback EFM master PLL
Light amount signal (RF/ABCD) peak hold input from the RF amplifier
Light amount signal (RF/ABCD) bottom hold input from the RF amplifier
Light amount signal (ABCD) input from the RF amplifier
Focus error signal input from the RF amplifier
FILI
FILO
O
I
CLTV
PEAK
BOTM
ABCD
FE
I
I
I
I
AUX1
VC
I
Auxiliary signal (I3 signal/temperature signal) input from the RF amplifier
Middle point voltage (+1.65V) input from the RF amplifier
Output terminal for the test
I
ADIO
ADRT
ADRB
SE
O
I
A/D converter operational range upper limit voltage input terminal (fixed at “H” in this set)
A/D converter operational range lower limit voltage input terminal (fixed at “L” in this set)
Sled error signal input from the RF amplifier
I
I
TE
I
Tracking error signal input from the RF amplifier
AVD2
AVS2
DCHG
APC
—
—
I
Power supply terminal (+3.3V) (analog system)
Ground terminal (analog system)
Connected to the +3.3V power supply
I
Error signal input terminal for laser digital automatic power control Not used
ADIP duplex FM signal (22.05 kHz ± 1 kHz) input from the RF amplifier
Power supply terminal (+3.3V) (for I/O)
I
ADFG
VDIO1
VSIO1
F0CN
VDC3
VSC3
XLRF
CKRF
DTRF
—
—
O
—
—
O
O
O
Ground terminal (for I/O)
Filter f0 control signal output to the RF amplifier
Power supply terminal (+2.5V) (for core)
Ground terminal (for core)
Serial data latch pulse signal output to the RF amplifier
Serial data transfer clock signal output to the RF amplifier
Writing serial data output to the RF amplifier
53
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MDS-NT1
Pin No.
100
Pin Name
I/O
O
O
O
O
O
O
O
O
O
O
O
I
Description
Reference PWM signal output to the RF amplifier for the laser automatic power control
PWM signal output terminal for laser digital automatic power control Not used
Tracking servo drive PWM signal (–) output
Tracking servo drive PWM signal (+) output
Focus servo drive PWM signal (+) output
APC
LDDR
TRDR
TFDR
FFDR
101
102
103
104
105
FRDR
FS4
Focus servo drive PWM signal (–) output
106
Clock signal (176.4 kHz) output terminal (X’tal system) Not used
Sled servo drive PWM signal (–) output
107
SRDR
SFDR
108
Sled servo drive PWM signal (+) output
109
SPRD
Spindle servo drive PWM signal (–) output
110
SPFD
Spindle servo drive PWM signal (+) output
111
FGIN
FG input terminal for spindle servo Not used
Input terminal for the test
112 to 114
115
TST1 to TST3
EFMO
VDIO1
VSIO1
VDC4
VSC4
I
O
—
—
—
—
EFM signal output terminal when recording mode “L” is output when playback mode
Power supply terminal (+3.3V) (for I/O)
116
117
Ground terminal (for I/O)
118
Power supply terminal (+2.5V) (for core)
119
Ground terminal (for core)
MD data mode selection signal input terminal
“L”: normal mode, “H”: MD data mode (fixed at “L” in this set)
120
MDDT1
I
54
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MDS-NT1
• MAIN BOARD IC301 M30835FJGP-01 (SYSTEM CONTROLLER)
Pin No.
Pin Name
NC
I/O
—
I
Description
1
2
Not used
RMC
Remote control signal input terminal Not used
Serial data output to the USB interface IC
3
NETMD_SO
NETMD_SI
NETMD_CLK
BYTE
O
I
4
Serial data input from the USB interface IC
Serial data transfer clock output to the USB interface IC
5
O
I
6
External data bus line byte selection signal input “L”: 16 bit, “H”: 8 bit (fixed at “L”)
7
CNVSS
—
—
Not used
Not used
8, 9
NC
System reset signal input terminal “L”: reset
For several hundreds msec. after the power supply rises, “L” is input, then it change to “H”
10
I
S.RESET
11
12
13
14
15
XOUT
VSS
I
—
O
—
I
System clock input terminal (10 MHz)
Ground terminal
XIN
System clock output terminal (10 MHz)
Power supply terminal (+3.3V)
VCC
NMI
Non-maskable interrupt input terminal Not used
Digital In U-bit CD format subcode Q sync (SCOR) input terminal
“L” is input every 13.3 msec Almost all, “H” is input
16
17
20
DQSY
P.DOWN
SQSY
I
I
I
Power down detection signal input terminal
Subcode Q sync (SCOR) input terminal
“L” is input every 13.3 msec Almost all, “H” is input
19 to 22
23
NC
XINT
—
I
Not used
Interrupt status input from the mechanism deck section
Not used
24 to 26
27
NC
—
I/O
I/O
O
I2C_CLK
I2C_DATA
SWDT
SRDT
Communication data reading clock signal output terminal Not used
Communication data bus input/output terminal Not used
Writing data output to the mechanism deck section and the D/A converter
Reading data input from the mechanism deck section
Serial data transfer clock signal output to the mechanism deck section and the D/A converter
Not used
28
29
30
I
31
O
SCLK
32
RTSI
—
—
O
33 to 35
36
NC
Not used
MUTE
ADA_RESET
ADA_LATCH
EPM
Audio line muting control signal output terminal “L”: line muting on
Reset signal output to the D/A converter “L”: reset
Serial data latch signal output to the D/A converter “L”: reset
Not used
37
O
38
O
39
—
—
40, 41
NC
Not used
Laser modulation select signal output terminal Stop: “L” Playback power: “H”
Recoding power: “H” pulse is inputted in a cycle of 2 seconds
42
MOD
O
Laser diode on/off control signal output to the automatic power control circuit
“H”: laser diode on
43
44
45
LDON
CE
O
I
Command chip enable signal output to the D-RAM
Detection input from the sled limit-in detect switch (S101)
The optical pick-up is inner position when “L”
LIMIT-IN
I
46
47
48
49
WRPWR
REC-SW
O
I
Laser power select signal output terminal “L”: playback mode, “H”: recording mode
Detection input from the recording position detect switch “L”: active
Reset signal output to the mechanism deck section “L”: reset
ADA_RESET
SENSE
O
I
Internal status (SENSE) signal input to the mechanism deck section
55
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MDS-NT1
Pin No.
50
Pin Name
I/O
I
Description
Detection input from the playback position detect switch “L”: active
Serial data latch pulse signal output to the mechanism deck section
Serial clock signal output to the EEPROM
PLAY-SW
XLATCH
SCL
51
O
O
52
Detection signal input from the loading-out detect switch (S103)
“L” at a load-out position, others: “H”
53
OUT-SW
I
54
55
56
57
XBUSY
SHOCK
EEP-WP
SDA
I
I
Busy monitor signal input from the mechanism deck section
Track jump detection signal input from the mechanism deck section
Writing protect signal output to the EEPROM
O
I/O
Two-way data bus with the EEPROM
Detection input from the disc reflection rate detect switch
“L”: high reflection rate disc, “H”: low reflection rate disc
58
59
REFLECT
I
I
REC-proof claw detection signal input from the protect detect switch
“H”: write protect
PROTECT SW
60
61
VCC
EEPNET-WP
VSS
—
—
—
O
O
O
I
Power supply terminal (+3.3V)
Not used
62
Ground terminal
63
LD-LOW
LOAD OUT
LOAD OUT
TEST
Loading motor drive voltage control signal output terminal “H” active
64
Loading motor control signal (load-in direction) output terminal “H” at a load-in
65
Loading motor control signal (eject direction) output terminal “H” at a eject
Test input terminal Not used
Not used
66 to 69
70 to 72
73
NC
—
I
NETMD_INT
NETMD_XCS
NETMD_RESET
NETMD_PLLSW
NETMD_VBUS
NC
Interrupt status input from the USB interface IC
Chip select signal output to the USB interface IC
Reset signal output to the USB interface IC “L”: reset
PLL function on/off control signal output to the USB interface IC “L”: PLL on
USB connect detection signal input terminal “H”: USB on
Not used
74
O
O
O
I
75
76
77
78, 79
80
—
O
O
—
O
I
LED4
LED drive signal output terminal Not used
LED drive signal output terminal
Not used
81, 82
83
LED3, 2
FLCS
84
LED1
LED drive signal output terminal
Jog dial pulse input terminal Not used
Jog dial pulse input terminal Not used
Not used
85
JOG0
86
JOG1
I
87
IOP
—
I
88
SEL1
Destination setting terminal
89
SEL0
I
Model setting terminal
90, 91
92
NC
—
I
Not used
KEY2
key input terminal Not used
B/> key input terminal
93
KEY1
I
94
AVSS
—
I
Ground terminal
95
KEY0
x/Z key input terminal
96
VREF
I
Reference voltage (+3.3V) input terminal
Power supply terminal (+3.3V)
Not used
97
AVCC
—
—
—
—
98
NC
99
FLDT
Not used
100
FLCK
Not used
56
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MDS-NT1
• MAIN BOARD IC301 CXD1873R (NET MD SECURITY, DIGITAL SIGNAL PROCESSOR, USB INTERFACE)
Pin No.
1
Pin Name
VDEA0
VSEA0
PLLSW
TEST0
DSPCLK
VDC0
I/O
—
—
I
Description
Power supply terminal (+3.3V) (for DSP)
Ground terminal (for DSP)
2
3
PLL function on/off control signal input from the system controller “L”: PLL on
Test input terminal Normally fixed at “L”
DSP transfer clock signal input terminal (256Fs: 11.2896MHz)
Power supply terminal (+3.3V)
4
I
5
I
6
—
O
7
DSPIF0
DSPIF1
VDEA1
DSPIF2
DSPIF3
VDC1
Digital audio signal output terminal when recording mode
L/R sampling clock signal (44.1 kHz) output terminal
Power supply terminal (+3.3V) (for DSP)
Bit clock signal (2.8224 MHz) output terminal
Recording data output terminal
8
O
9
—
O
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
O
—
—
Power supply terminal (+3.3V)
VSC0
Ground terminal
EXTIF0
EXTIF1
VDEA2
VSEA1
EXTIF0
EXTIF1
VDC2
I/O Not used
I/O Not used
—
—
Power supply terminal (+3.3V) (for DSP)
Ground terminal (for DSP)
I/O Not used
I/O Not used
—
—
O
O
—
—
O
I
Power supply terminal (+3.3V)
VSC1
Ground terminal
DNKCK
DNKCS
VDEA3
VSEA2
DNKSO
DNKSI
DNKST
VDC3
Serial ROM clock signal output terminal Not used
Serial ROM chip select signal output terminal Not used
Power supply terminal (+3.3V) (for DSP)
Ground terminal (for DSP)
Serial ROM data output terminal Not used
Serial ROM data input terminal Not used
Serial ROM status input terminal Not used
Power supply terminal (+3.3V)
I
—
—
I
VSC2
Ground terminal
DNKRS
TEST1
VDEA4
PLLTHRU
USBEN
VDC4
Serial ROM reset signal input terminal Not used
Test input terminal Normally fixed at “L”
Power supply terminal (+3.3V) (for DSP)
Not used
I
—
I
I
USB enable signal input terminal
Power supply terminal (+3.3V)
—
—
—
VSC3
Ground terminal
USBVSS
DP
Ground terminal (for USB)
I/O USB communication input/output
I/O USB communication input/output
DM
USBVDD
USBSW
PLLVDD
PLLVSS
OSCVDD
—
O
Power supply terminal (+3.3V) (for USB)
USB communication on/off control signal output “H”: USB communication on
Power supply terminal (+3.3V) (for USB)
—
—
—
Ground terminal (for USB)
Power supply terminal (+3.3V) (for OSC)
57
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MDS-NT1
Pin No.
46
Pin Name
EXTAL
XTAL
I/O
I
Description
System clock input terminal (12 MHz)
System clock output terminal (12 MHz)
Ground terminal (for OSC)
47
O
—
—
—
I
48
PLLVSS
VDEC0
VSEC0
CPUCK
CPUSO
CPUSI
49
Power supply terminal (+3.3V) (for CPU)
Ground terminal (for CPU)
50
51
Serial data transfer clock input from the system controller
Serial data output to the system controller
Serial data input from the system controller
Power supply terminal (+3.3V) (for CPU)
Ground terminal (for CPU)
52
O
I
53
54
VDEC1
VSEC1
CPUXCS
CPUINT
RESET
VDEC2
VSEC2
VDC5
—
—
I
55
56
Chip select signal input from the system controller
Interrupt status output to the system controller
Reset signal input from the system controller “L”: reset
Power supply terminal (+3.3V) (for CPU)
Ground terminal (for CPU)
57
O
I
58
59
—
—
—
—
O
I
60
61
Power supply terminal (+3.3V)
62
VSC4
Ground terminal
63
TEST2
TEST3
Test input terminal Not used
64
Test input terminal Normally fixed at “L”
58
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MDS-NT1
SECTION 7
EXPLODED VIEWS
• Abbreviation
SP : Singapore model
NOTE:
•
-XX and -X mean standardized parts, so they
• Items marked “*” are not stocked since they
are seldom required for routine service. Some
delay should be anticipated when ordering
these items.
• The mechanical parts with no reference num-
ber in the exploded views are not supplied.
• Hardware (# mark) list and accessories and
packing materials are given in the last of the
electrical parts list.
may have some difference from the original
one.
•
Color Indication of Appearance Parts
Example:
KNOB, BALANCE (WHITE) . . . (RED)
↑
↑
Parts Color Cabinet's Color
7-1. CASE SECTION
3
4
5
MDM-7S2B
4
5
not supplied
5
7
5
6
8
2
#1
case (B) section
#2
#3
not supplied
#2
front panel section
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
2
3
4
5
6
4-951-620-01 SCREW (2.6X8), +BVTP
4-237-133-02 CASE (UPPER)
4-228-643-21 SCREW (+BVTTWH M3), STEP
4-228-689-01 INSULATOR
7
8
#1
#2
#3
1-792-811-21 WIRE (FLAT TYPE) (23 CORE)
1-792-812-21 WIRE (FLAT TYPE) (27 CORE)
7-685-870-01 SCREW +BVTT 3X5 (S)
7-685-647-79 SCREW +BVTP 3X10 TYPE2 IT-3
7-682-248-04 SCREW +K 3X8
1-823-648-11 WIRE (FLAT TYPE) (7 CORE)
59
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MDS-NT1
7-2. FRONT PANEL SECTION
not supplied
56
54
53
56
52
55
51
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
51
52
53
54
X-4954-600-3 PANEL ASSY, FRONT
4-236-730-01 BUTTON (A)
4-228-630-01 SPRING (LID), TENSION COIL
4-230-848-21 LID (MD)
55
55
56
A-4727-709-A PANEL BOARD, COMPLETE (SP)
A-4727-707-A PANEL BOARD, COMPLETE (AEP, UK)
4-951-620-01 SCREW (2.6X8), +BVTP
60
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MDS-NT1
7-3. CASE (B) SECTION
102
#4
101
#5
#4
#4
#4
103
not supplied
104
105
105
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
101
101
* 102
103
A-4727-708-A MAIN BOARD, COMPLETE (SP)
104
105
#4
4-230-473-11 CASE (B)
4-977-358-01 CUSHION
7-685-646-79 SCREW +BVTP 3X8 TYPE2 IT-3
7-685-872-09 SCREW +BVTT 3X8 (S)
A-4727-706-A MAIN BOARD, COMPLETE (AEP, UK)
1-569-972-21 SOCKET, SHORT 2P
4-236-736-11 PANEL, BACK
#5
61
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MDS-NT1
7-4. MD MECHANISM DECK SECTION-1
(MDM-7S2B)
305
not supplied
311
313
310
314
319
315
316
not supplied
304
317
308
303
318
not supplied
302
306
307
320
302
301
MD mechanism deck section-2
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
* 301
302
303
304
305
4-996-267-01 BASE (BU-D)
4-231-319-01 SCREW (2X6) CZN, +B (P) TRI
4-227-007-01 GEAR (SB)
4-227-025-01 BELT (LOADING)
A-4680-638-B RETAINER COMPLETE ASSY
311
313
314
315
316
4-227-012-01 SPRING (HOLDER), TENSION
4-227-013-01 SPRING (EJ), TENSION
4-226-995-01 SLIDER (EJ)
4-226-996-01 LIMITTER (EJ)
4-226-997-04 SLIDER
306
307
308
310
4-227-002-01 GEAR, PULLEY
4-226-999-01 LEVER (HEAD)
X-4952-665-1 SPRING (SHT) ASSY, LEAF
4-229-533-02 SPRING (STOPPER), TORSION
317
318
319
320
4-226-998-01 LEVER (CHG)
4-227-006-01 GEAR (SA)
A-4735-075-B HOLDER ASSY
4-226-994-01 GUIDE (L)
62
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MDS-NT1
7-5. MD MECHANISM DECK SECTION-2
(MDM-7S2B)
359
HR901
A
358
357
360
367
#11
356
#11
364
362
A
355
368
353
362
354
359
not
supplied
352
S102
352
363
M101
365
366
M102
361
353
not supplied
353
M103
351
353
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
351
352
353
354
355
A-4727-982-A BD BOARD, COMPLETE
4-231-319-01 SCREW (2X6) CZN, +B (P) TRI
3-372-761-01 SCREW (M1.7), TAPPING
4-226-993-01 RACK
364
365
366
367
368
4-230-716-01 SPRING (SPDL), TORSION
4-227-004-01 GEAR (LC)
4-227-005-01 GEAR (LD)
4-227-008-01 GEAR (SC)
4-227-009-01 GEAR (SD)
4-227-014-01 SPRING (RACK), COMPRESSION
356
357
0358
359
360
4-226-992-01 BASE, SL
HR901 1-500-670-22 HEAD, OVER WRITE
1-678-514-11 FLEXIBLE BOARD
A-4672-976-A OPTICAL PICK-UP KMS-262
4-988-560-01 SCREW (+P 1.7X6)
4-996-265-01 SHAFT, MAIN
M101
M102
M103
S102
A-4735-757-A MOTOR ASSY, SPINDLE
A-4672-900-A MOTOR ASSY, SLED
A-4672-975-A MOTOR ASSY, LOADING
1-771-957-11 SWITCH, PUSH (2 KEY)
(REFLECT RATE DETECT, PROTECT DETECT)
361
362
363
4-226-989-01 CHASSIS
4-211-036-01 SCREW (1.7X2.5), +PWH
4-226-990-04 BASE (BU-A)
#11
7-685-204-19 SCREW +KTP 2X6 TYPE2 NON-SLIT
63
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MDS-NT1
BD
SECTION 8
ELECTRICAL PARTS LIST
NOTE:
• Due to standardization, replacements in the
parts list may be different from the parts speci-
fied in the diagrams or the components used
on the set.
• -XX and -X mean standardized parts, so they
may have some difference from the original
one.
•
Items marked “*” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when order-
ing these items.
SEMICONDUCTORS
In each case, u: µ, for example:
The components identified by
mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number
specified.
•
When indicating parts by reference
number, please include the board.
uA. . : µA. .
uPB. . : µPB. .
uPD. . : µPD. .
CAPACITORS
uF: µF
uPA. . : µPA. .
uPC. . : µPC. .
• RESISTORS
All resistors are in ohms.
METAL: Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F: nonflammable
•
•
COILS
• Abbreviation
SP: Singapore
uH: µH
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
A-4727-982-A BD BOARD, COMPLETE
*******************
C241
C242
C250
C251
C252
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
25V
25V
25V
25V
25V
< CAPACITOR >
C101
C103
C104
C105
C106
1-117-720-11 CERAMIC CHIP 4.7uF
1-162-970-11 CERAMIC CHIP 0.01uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-135-259-11 TANTALUM CHIP 10uF
1-135-259-11 TANTALUM CHIP 10uF
10V
10%
25V
25V
6.3V
6.3V
C253
C254
C255
C299
C301
1-164-156-11 CERAMIC CHIP 0.1uF
1-162-970-11 CERAMIC CHIP 0.01uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
25V
25V
25V
25V
25V
20%
20%
10%
10%
C107
C108
C109
C110
C111
1-164-227-11 CERAMIC CHIP 0.022uF 10%
1-164-156-11 CERAMIC CHIP 0.1uF
1-165-176-11 CERAMIC CHIP 0.047uF 10%
1-115-416-11 CERAMIC CHIP 0.001uF 5%
25V
25V
16V
25V
25V
C302
C405
C406
C407
C409
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-162-970-11 CERAMIC CHIP 0.01uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
25V
25V
25V
25V
25V
1-162-970-11 CERAMIC CHIP 0.01uF
10%
C112
C113
C114
C115
C116
1-164-227-11 CERAMIC CHIP 0.022uF 10%
1-162-969-11 CERAMIC CHIP 0.0068uF 10%
1-162-966-11 CERAMIC CHIP 0.0022uF 10%
1-164-156-11 CERAMIC CHIP 0.1uF
25V
25V
50V
25V
10V
C410
C411
C490
C501
C502
1-126-206-11 ELECT CHIP
100uF
20%
10%
6.3V
10V
25V
630V
25V
1-117-720-11 CERAMIC CHIP 4.7uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-117-720-11 CERAMIC CHIP 4.7uF
1-128-795-91 ELECT CHIP
470PF
C117
C118
C119
C120
C121
1-162-970-11 CERAMIC CHIP 0.01uF
1-162-968-11 CERAMIC CHIP 0.0047uF 10%
1-125-837-11 CERAMIC CHIP 1uF 10%
1-110-563-11 CERAMIC CHIP 0.068uF 10%
1-162-970-11 CERAMIC CHIP 0.01uF 10%
10%
25V
50V
6.3V
16V
25V
1-164-156-11 CERAMIC CHIP 0.1uF
C503
C504
C505
C550
C701
1-164-156-11 CERAMIC CHIP 0.1uF
1-117-370-11 CERAMIC CHIP 10uF
25V
10V
6.3V
10V
25V
1-126-206-11 ELECT CHIP
100uF
20%
20%
1-117-970-11 ELECT CHIP
22uF
C122
C175
C194
C205
C206
1-164-677-11 CERAMIC CHIP 0.033uF 10%
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
16V
25V
25V
50V
6.3V
1-164-156-11 CERAMIC CHIP 0.1uF
C702
C703
C704
C807
C809
1-117-720-11 CERAMIC CHIP 4.7uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-165-176-11 CERAMIC CHIP 0.047uF 10%
1-164-156-11 CERAMIC CHIP 0.1uF
1-117-720-11 CERAMIC CHIP 4.7uF
10V
25V
16V
25V
10V
1-162-966-11 CERAMIC CHIP 0.0022uF 10%
1-126-206-11 ELECT CHIP
100uF
20%
C209
C211
C212
C214
C215
1-162-927-11 CERAMIC CHIP 100PF
1-162-927-11 CERAMIC CHIP 100PF
1-162-927-11 CERAMIC CHIP 100PF
1-162-970-11 CERAMIC CHIP 0.01uF
5%
5%
5%
10%
50V
50V
50V
25V
16V
C901
C902
C903
C904
C905
1-126-206-11 ELECT CHIP
1-164-156-11 CERAMIC CHIP 0.1uF
1-126-206-11 ELECT CHIP 100uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-126-206-11 ELECT CHIP 100uF
100uF
20%
20%
20%
10%
20%
6.3V
25V
6.3V
25V
6.3V
1-164-677-11 CERAMIC CHIP 0.033uF 10%
C216
C219
C220
C221
C230
1-125-889-11 CERAMIC CHIP 2.2uF
1-162-927-11 CERAMIC CHIP 100PF
1-125-891-11 CERAMIC CHIP 0.47uF
1-162-970-11 CERAMIC CHIP 0.01uF
1-164-156-11 CERAMIC CHIP 0.1uF
10%
5%
10%
10%
10V
50V
10V
25V
25V
C907
C908
C909
C909
C998
1-162-970-11 CERAMIC CHIP 0.01uF
1-117-370-11 CERAMIC CHIP 10uF
1-104-852-11 TANTALUM CHIP 22uF
1-117-370-11 CERAMIC CHIP 10uF
1-164-156-11 CERAMIC CHIP 0.1uF
25V
10V
10V
10V
25V
C231
C233
C234
C235
C240
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
25V
25V
25V
25V
25V
C999
1-164-156-11 CERAMIC CHIP 0.1uF
25V
25V
C1102 1-164-156-11 CERAMIC CHIP 0.1uF
64
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MDS-NT1
BD
Ref. No.
Part No.
Description
Remark
Ref. No.
R105
Part No.
Description
Remark
< CONNECTOR >
1-216-863-11 RES-CHIP
3.3M
5%
1/10W
CN101 1-766-833-21 CONNECTOR, FFC/FPC (ZIF) 21P
CN102 1-784-835-21 CONNECTOR, FFC (LIF (NON-ZIF)) 27P
CN103 1-784-834-21 CONNECTOR, FFC (LIF (NON-ZIF)) 23P
* CN104 1-580-055-21 PIN, CONNECTOR (SMD) 2P
CN105 1-784-859-21 CONNECTOR, FFC (LIF (NON-ZIF)) 7P
R106
R107
R108
R109
R110
1-216-845-11 METAL CHIP
1-216-819-11 METAL CHIP
1-216-825-11 METAL CHIP
1-216-829-11 METAL CHIP
1-216-853-11 METAL CHIP
100K
680
2.2K
4.7K
470K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
< DIODE >
R111
R112
R113
R114
R115
1-216-833-11 METAL CHIP
1-216-845-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-829-11 METAL CHIP
1-216-833-11 METAL CHIP
10K
100K
10K
4.7K
10K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
D101
D501
D502
8-719-988-61 DIODE 1SS355TE-17
8-719-046-86 DIODE F1J6TP
8-719-046-86 DIODE F1J6TP
< IC >
R116
R117
R118
R119
R120
1-216-827-11 METAL CHIP
1-216-845-11 METAL CHIP
1-216-825-11 METAL CHIP
1-216-837-11 METAL CHIP
1-216-839-11 METAL CHIP
3.3K
100K
2.2K
22K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
33K
R121
R122
R178
R201
R202
1-216-825-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-864-11 METAL CHIP
1-216-815-11 METAL CHIP
1-216-819-11 METAL CHIP
2.2K
10K
0
330
680
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
R203
R205
R206
R207
R208
1-216-809-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-811-11 METAL CHIP
1-216-821-11 METAL CHIP
100
10K
10K
150
1K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
< FERRITE BEAD/RESISTOR >
L8
L10
L122
L201
L202
1-414-760-21 FERRITE
1-469-981-21 FERRITE
1-414-760-21 FERRITE
1-414-760-21 FERRITE
1-469-981-21 FERRITE
0uH
0uH
0uH
0uH
0uH
R209
R210
R211
R212
R214
1-216-815-11 METAL CHIP
1-216-839-11 METAL CHIP
1-216-857-11 METAL CHIP
1-216-851-11 METAL CHIP
1-216-845-11 METAL CHIP
330
33K
1M
330K
100K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
L203
L401
L402
L501
L502
1-414-760-21 FERRITE
1-400-050-11 FERRITE
1-400-050-11 FERRITE
1-400-050-11 FERRITE
1-400-050-11 FERRITE
0uH
0uH
0uH
0uH
0uH
R216
R217
R218
R219
R224
1-216-864-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-864-11 METAL CHIP
1-216-809-11 METAL CHIP
1-216-809-11 METAL CHIP
0
10K
0
100
100
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
L550
L601
L602
L603
L701
1-414-760-21 FERRITE
1-469-981-21 FERRITE
1-469-981-21 FERRITE
1-414-760-21 FERRITE
1-414-760-21 FERRITE
0uH
0uH
0uH
0uH
0uH
R225
R226
R227
R228
R281
1-216-809-11 METAL CHIP
1-216-809-11 METAL CHIP
1-216-809-11 METAL CHIP
1-216-809-11 METAL CHIP
1-216-821-11 METAL CHIP
100
100
100
100
1K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
L801
L899
1-414-760-21 FERRITE
1-216-864-11 METAL CHIP
0uH
0
5%
1/10W
< TRANSISTOR >
R298
R299
R301
R302
R303
1-216-864-11 METAL CHIP
1-216-864-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
0
0
10K
10K
10K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
Q181
Q182
Q201
Q202
Q203
8-729-048-87 FET
8-729-048-88 FET
8-729-403-35 TRANSISTOR
8-729-101-07 TRANSISTOR
8-729-403-35 TRANSISTOR
2SJ518AZTR
2SK2788VYTR
UN5113-TX
2SB798-T1DK
UN5113-TX
R405
R501
R551
R552
R553
1-216-864-11 METAL CHIP
1-216-295-00 SHORT
1-216-841-11 METAL CHIP
1-216-841-11 METAL CHIP
1-216-841-11 METAL CHIP
0
0
47K
47K
47K
5%
1/10W
Q701
Q702
Q703
Q704
8-729-402-93 TRANSISTOR
8-729-903-10 TRANSISTOR
8-729-402-93 TRANSISTOR
8-729-026-53 TRANSISTOR
UN5214-TX
FMW1-T-148
UN5214-TX
5%
5%
5%
1/10W
1/10W
1/10W
2SA1576A-T106-QR
R701
R702
R703
R704
R705
1-216-821-11 METAL CHIP
1-216-821-11 METAL CHIP
1-216-821-11 METAL CHIP
1-216-841-11 METAL CHIP
1-216-833-11 METAL CHIP
1K
1K
1K
47K
10K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
< RESISTOR >
R101
R102
R103
R104
1-216-298-00 METAL CHIP
1-219-724-11 METAL CHIP
1-216-829-11 METAL CHIP
1-216-853-11 METAL CHIP
2.2
1
4.7K
470K
5%
1%
5%
5%
1/10W
1/4W
1/10W
1/10W
R706
1-218-855-11 METAL CHIP
2.2K
0.5% 1/10W
65
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MDS-NT1
BD MAIN
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
R707
R708
R709
R710
1-218-863-11 METAL CHIP
1-218-863-11 METAL CHIP
1-218-855-11 METAL CHIP
1-218-887-11 METAL CHIP
4.7K
4.7K
2.2K
47K
0.5% 1/10W
0.5% 1/10W
0.5% 1/10W
0.5% 1/10W
C321
C401
C402
C404
C406
1-801-862-11 VARISTOR, CHIP
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
25V
25V
25V
25V
R711
R712
R713
R808
1-216-833-11 METAL CHIP
1-216-809-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-864-11 METAL CHIP
10K
100
10K
0
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
C407
C408
C409
C410
C412
1-128-547-11 ELECT
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-119-879-11 ELECT
1-119-765-11 ELECT
6800uF
20%
16V
25V
25V
16V
6.3V
< SWITCH >
15uF
47uF
20%
20%
S101
S103
S104
S105
1-762-596-21 SWITCH, PUSH (1 KEY) (LIMIT IN)
1-771-956-21 SWITCH, PUSH (1 KEY) (OUT)
1-771-955-21 SWITCH, PUSH (1 KEY) (PLAY)
1-771-955-21 SWITCH, PUSH (1 KEY) (REC)
C413
C414
C415
C416
C420
1-126-926-11 ELECT
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-126-934-11 ELECT
1-165-112-11 CERAMIC CHIP 0.33uF
1000uF
10V
25V
25V
10V
16V
220uF
20%
< VIBRATOR >
X801
1-781-569-21 OSCILLATOR, CRYSTAL (90MHz)
C421
C432
C441
C442
C450
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
25V
25V
25V
25V
10V
************************************************************
A-4727-706-A MAIN BOARD, COMPLETE (AEP, UK)
A-4727-708-A MAIN BOARD, COMPLETE (SP)
**********************
1-126-934-11 ELECT
220uF
20%
C451
C452
C453
C456
C458
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
25V
25V
25V
10V
10V
< CAPACITOR/VARISTOR/RESISTOR >
C1
1-164-156-11 CERAMIC CHIP 0.1uF
1-115-156-11 CERAMIC CHIP 1uF
1-115-156-11 CERAMIC CHIP 1uF
1-164-230-11 CERAMIC CHIP 220PF
1-162-927-11 CERAMIC CHIP 100PF
25V
10V
10V
50V
50V
1-126-934-11 ELECT
1-126-934-11 ELECT
220uF
220uF
20%
20%
C100
C101
C161
C165
5%
5%
C459
C460
C461
C462
C507
1-115-156-11 CERAMIC CHIP 1uF
10V
10V
25V
25V
25V
1-126-947-11 ELECT
47uF
20%
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
C166
C176
C177
C180
C181
1-162-927-11 CERAMIC CHIP 100PF
5%
50V
25V
50V
50V
10V
1-128-551-11 ELECT
1-164-230-11 CERAMIC CHIP 220PF
22uF
20%
5%
1-126-960-11 ELECT
1-126-934-11 ELECT
1uF
220uF
20%
20%
C515
C516
C517
C519
C523
1-162-927-11 CERAMIC CHIP 100PF
1-162-927-11 CERAMIC CHIP 100PF
1-162-927-11 CERAMIC CHIP 100PF
5%
5%
5%
50V
50V
50V
50V
10V
C182
C261
C265
C266
C276
1-164-230-11 CERAMIC CHIP 220PF
1-164-230-11 CERAMIC CHIP 220PF
1-162-927-11 CERAMIC CHIP 100PF
1-162-927-11 CERAMIC CHIP 100PF
5%
5%
5%
5%
20%
50V
50V
50V
50V
25V
1-162-964-11 CERAMIC CHIP 0.001uF 10%
1-104-665-11 ELECT
100uF
20%
C524
C550
C551
C554
C555
1-164-156-11 CERAMIC CHIP 0.1uF
1-104-665-11 ELECT 100uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-216-864-11 METAL CHIP
25V
10V
25V
1/10W
25V
1-128-551-11 ELECT
22uF
20%
5%
C277
C280
C281
C282
C301
1-164-230-11 CERAMIC CHIP 220PF
5%
50V
50V
10V
50V
16V
0
1-126-960-11 ELECT
1-126-934-11 ELECT
1-164-230-11 CERAMIC CHIP 220PF
1-126-791-11 ELECT 10uF
1uF
220uF
20%
20%
5%
1-164-156-11 CERAMIC CHIP 0.1uF
C556
C851
C852
C854
C856
1-164-156-11 CERAMIC CHIP 0.1uF
25V
20%
1-216-864-11 METAL CHIP
1-216-864-11 METAL CHIP
1-216-864-11 METAL CHIP
0
0
0
5%
5%
5%
1/10W
1/10W
1/10W
25V
C304
C306
C307
C308
C309
1-162-927-11 CERAMIC CHIP 100PF
1-164-230-11 CERAMIC CHIP 220PF
1-164-230-11 CERAMIC CHIP 220PF
5%
5%
5%
50V
50V
50V
50V
25V
1-164-156-11 CERAMIC CHIP 0.1uF
1-162-964-11 CERAMIC CHIP 0.001uF 10%
1-164-156-11 CERAMIC CHIP 0.1uF
C900
C903
C904
C905
C906
1-162-919-11 CERAMIC CHIP 22PF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
5%
50V
25V
25V
25V
25V
C310
C311
C312
C313
C314
1-162-964-11 CERAMIC CHIP 0.001uF 10%
1-162-964-11 CERAMIC CHIP 0.001uF 10%
1-162-964-11 CERAMIC CHIP 0.001uF 10%
1-162-964-11 CERAMIC CHIP 0.001uF 10%
1-162-964-11 CERAMIC CHIP 0.001uF 10%
50V
50V
50V
50V
50V
C907
C910
C911
C912
C913
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
25V
25V
25V
25V
25V
C315
C316
C318
C319
C320
1-162-964-11 CERAMIC CHIP 0.001uF 10%
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
50V
25V
25V
25V
25V
C915
C916
1-164-156-11 CERAMIC CHIP 0.1uF
1-164-156-11 CERAMIC CHIP 0.1uF
25V
25V
66
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MDS-NT1
MAIN
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
C917
C918
C920
1-164-156-11 CERAMIC CHIP 0.1uF
1-162-919-11 CERAMIC CHIP 22PF
25V
50V
1/10W
L280
L400
1-414-760-21 FERRITE
1-424-674-11 INDUCTOR
0uH
22uH
5%
5%
1-216-864-11 METAL CHIP
0
L451
L452
L503
L504
L550
1-216-864-11 METAL CHIP
1-216-864-11 METAL CHIP
1-414-760-21 FERRITE
1-216-864-11 METAL CHIP
1-414-760-21 FERRITE
0
0
0uH
0
0uH
5%
5%
1/10W
1/10W
C922
1-164-156-11 CERAMIC CHIP 0.1uF
< CONNECTOR/JACK >
25V
5%
1/10W
CN4
1-815-194-11 CONNECTOR, USB (B) (USB)
CN101 1-784-384-11 CONNECTOR, FFC/FPC 27P
CN102 1-793-991-11 CONNECTOR, FFC/FPC 23P
CN103 1-784-373-21 CONNECTOR, FFC/FPC 14P
CN104 1-784-366-21 CONNECTOR, FFC/FPC 7P
L551
L552
1-164-156-11 CERAMIC CHIP 0.1uF
25V
1-414-760-21 FERRITE
0uH
< COIL >
CN105 1-784-367-11 CONNECTOR, FFC/FPC 8P
LF1
1-419-100-21 INDUCTOR
0uH
CN200 1-573-798-11 JACK, MINIATURE (DIA. 3.5) (ANALOG OUT)
* CN420 1-565-513-11 PIN, CONNECTOR 2P
< TRANSISTOR >
< DIODE >
Q100
Q170
Q270
Q400
Q401
8-729-015-74 TRANSISTOR
8-729-046-97 TRANSISTOR
8-729-046-97 TRANSISTOR
8-729-036-99 TRANSISTOR
8-729-026-53 TRANSISTOR
UN5111-TX
2SD1938 (F) -T (TX).SO
2SD1938 (F) -T (TX).SO
HAT1020R-EL
D301
D400
D402
D421
D422
8-719-941-09 DIODE DAP202UT106
8-719-313-73 DIODE SFPB-52V
8-719-313-73 DIODE SFPB-52V
8-719-988-61 DIODE 1SS355TE-17
8-719-074-34 DIODE RB495D-T146
2SA1576A-T106-QR
Q440
Q451
8-729-015-76 TRANSISTOR
8-729-015-76 TRANSISTOR
UN5211-TX
UN5211-TX
D470
D901
8-719-421-18 DIODE MA8033-L-TX
8-719-988-61 DIODE 1SS355TE-17
< RESISTOR/FERRITE BEAD >
< GROUND TERMINAL >
R10
1-216-864-11 METAL CHIP
1-216-864-11 METAL CHIP
1-216-864-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
0
0
0
10K
10K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
R140
R142
R161
R162
EP550 1-537-771-21 TERMINAL BOARD, GROUND
< RESISTOR >
FB1
FB2
FB3
FB4
1-216-864-11 METAL CHIP
1-216-864-11 METAL CHIP
1-216-864-11 METAL CHIP
1-216-864-11 METAL CHIP
0
0
0
0
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
R163
R164
R165
R166
R170
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
1-218-716-11 METAL CHIP
1-218-716-11 METAL CHIP
1-216-833-11 METAL CHIP
10K
10K
10K
10K
10K
5%
5%
1/10W
1/10W
0.5% 1/10W
0.5% 1/10W
5%
1/10W
< IC >
R176
R178
R180
R181
R240
1-216-819-11 METAL CHIP
1-216-815-11 METAL CHIP
1-216-789-11 METAL CHIP
1-216-821-11 METAL CHIP
1-216-864-11 METAL CHIP
680
330
2.2
1K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
0
R242
R261
R262
R263
R264
1-216-864-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
0
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
10K
10K
10K
10K
R265
R266
R270
R276
R278
1-218-716-11 METAL CHIP
1-218-716-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-819-11 METAL CHIP
1-216-815-11 METAL CHIP
10K
10K
10K
680
330
0.5% 1/10W
0.5% 1/10W
5%
5%
5%
1/10W
1/10W
1/10W
< JACK >
R280
R281
R301
R302
R303
1-216-789-11 METAL CHIP
1-216-821-11 METAL CHIP
1-216-845-11 METAL CHIP
1-216-864-11 METAL CHIP
1-216-864-11 METAL CHIP
2.2
1K
100K
0
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
J180
J400
1-507-678-51 JACK (PHONES)
1-691-452-11 JACK, DC (POLARITY UNIFIET TYPE)
(DC IN 9V)
0
< COIL/RESISTOR/CAPACITOR >
R304
R306
R307
R308
1-216-864-11 METAL CHIP
1-216-864-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
0
0
10K
10K
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
L178
L180
L278
1-414-760-21 FERRITE
1-414-760-21 FERRITE
1-414-760-21 FERRITE
0uH
0uH
0uH
67
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MDS-NT1
MAIN PANEL
Ref. No.
R314
Part No.
Description
Remark
1/10W
Ref. No.
T400
Part No.
Description
< FILTER >
Remark
1-216-833-11 METAL CHIP
10K
5%
R320
R321
R323
R324
R325
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
10K
10K
10K
10K
10K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
1-411-312-11 FILTER, COMMON MODE
< THERMISTOR (POSITIVE) >
THP400 1-771-075-21 THERMISTOR, POSITIVE
< VIBRATOR >
R329
R330
R332
R350
R351
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
10K
10K
10K
10K
10K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
X301
X550
1-795-004-21 VIBRATOR, CERAMIC (10MHz)
1-567-865-21 VIBRATOR, CRYSTAL (12MHz)
**************************************************************
R401
R403
R404
R420
R421
1-240-037-11 METAL
0.05
4.7K
10K
0
1%
1/4W
A-4727-707-A PANEL BOARD, COMPLETE (AEP, UK)
A-4727-709-A PANEL BOARD, COMPLETE (SP)
**********************
1-218-708-11 METAL CHIP
1-218-716-11 METAL CHIP
1-216-864-11 METAL CHIP
1-216-813-11 METAL CHIP
0.5% 1/10W
0.5% 1/10W
5%
5%
1/10W
1/10W
220
< CAPACITOR >
R441
R442
R443
R450
R455
1-216-837-11 METAL CHIP
1-216-835-11 METAL CHIP
1-216-841-11 METAL CHIP
1-216-845-11 METAL CHIP
1-216-833-11 METAL CHIP
22K
15K
47K
100K
10K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
C748
1-164-156-11 CERAMIC CHIP 0.1uF
< CONNECTOR >
25V
CN704 1-784-859-21 CONNECTOR, FFC (LIF (NON-ZIF)) 7P
< LED >
R456
R470
R471
R500
R501
1-216-829-11 METAL CHIP
1-216-825-11 METAL CHIP
1-216-825-11 METAL CHIP
1-216-813-11 METAL CHIP
1-216-813-11 METAL CHIP
4.7K
2.2K
2.2K
220
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
D731
D732
D751
8-719-051-89 LED SML-010VT-T87 (REC)
8-719-032-98 LED SEL5820A-TP15 (NetMD)
8-719-984-33 LED SML-010MT-T87 (PLAY)
220
R503
R504
R505
R506
R550
1-216-813-11 METAL CHIP
1-216-809-11 METAL CHIP
1-216-809-11 METAL CHIP
1-216-809-11 METAL CHIP
1-216-857-11 METAL CHIP
220
100
100
100
1M
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
< TRANSISTOR >
Q731
Q732
Q751
8-729-015-76 TRANSISTOR
8-729-015-76 TRANSISTOR
8-729-015-76 TRANSISTOR
UN5211-TX
UN5211-TX
UN5211-TX
R551
R552
R581
R901
R902
1-414-760-21 FERRITE
0uH
220
220
0
< RESISTOR >
1-216-813-11 METAL CHIP
1-216-813-11 METAL CHIP
1-216-864-11 METAL CHIP
1-216-864-11 METAL CHIP
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
R702
R726
R731
R732
R751
1-216-825-11 METAL CHIP
1-216-829-11 METAL CHIP
1-216-811-11 METAL CHIP
1-216-811-11 METAL CHIP
1-216-811-11 METAL CHIP
2.2K
4.7K
150
150
150
5%
1/10W
1/10W
1/10W
1/10W
1/10W
5%
5%
5%
5%
0
R903
R904
R905
R906
R907
1-216-841-11 METAL CHIP
1-216-837-11 METAL CHIP
1-216-802-11 RES-CHIP
1-216-802-11 RES-CHIP
1-216-823-11 METAL CHIP
47K
22K
27
27
1.5K
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
< SWITCH >
S702
S726
1-762-875-21 SWITCH, KEYBOARD (x/Z)
1-762-875-21 SWITCH, KEYBOARD (N/>)
R908
R911
R913
R915
R950
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-833-11 METAL CHIP
1-216-864-11 METAL CHIP
10K
10K
10K
10K
0
5%
5%
5%
5%
5%
1/10W
1/10W
1/10W
1/10W
1/10W
< LEAD >
TP701 1-690-880-11 LEAD (WITH CONNECTOR)
************************************************************
R951
R952
1-216-864-11 METAL CHIP
1-216-864-11 METAL CHIP
0
0
5%
5%
1/10W
1/10W
MISCELLANEOUS
**************
< COMPOSITION CIRCUIT BLOCK >
6
7
8
1-823-648-11 WIRE (FLAT TYPE) (7 CORE)
1-792-811-21 WIRE (FLAT TYPE) (23 CORE)
1-792-812-21 WIRE (FLAT TYPE) (27 CORE)
1-569-972-21 SOCKET, SHORT 2P
RB300 1-236-908-11 NETWORK RESISTOR (CHIP) 10K
RB301 1-236-908-11 NETWORK RESISTOR (CHIP) 10K
* 102
357
1-678-514-11 FLEXIBLE BOARD
< VARIABLE RESISTOR >
0358
A-4672-976-A OPTICAL PICK-UP KMS-262
RV301 1-227-450-11 RES, VAR 10K/10K (PHONE LEVEL)
HR901 1-500-670-22 HEAD, OVER WRITE
M101
M102
A-4735-757-A MOTOR ASSY, SPINDLE
A-4672-900-A MOTOR ASSY, SLED
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.
68
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MDS-NT1
Ref. No.
M103
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
A-4672-975-A MOTOR ASSY, LOADING
S102
1-771-957-11 SWITCH, PUSH (2 KEY)
(REFLECT RATE DETECT, PROTECT DETECT)
************************************************************
ACCESSORIES
************
1-469-089-11 FILTER, CLAMP (FERRITE CORE)
(for USB CABLE)
0
0
1-476-352-12 ADAPTOR, AC (AC-96NP) (AEP, SP)
1-476-353-12 ADAPTOR, AC (AC-96NP) (UK)
1-543-793-11 FILTER, CLAMP (FERRITE CORE)
(for AC ADAPTOR)
1-757-409-11 CORD, CONNECTION
(AUDIO CONNECTING CORD)
1-757-471-11 CABLE, CONNECTION (USB)
4-237-878-11 MANUAL, INSTRUCTION
(ENGLISH, FRENCH) (UK)
4-237-878-21 MANUAL, INSTRUCTION
(ENGLISH, FRENCH, GERMAN, SPANISH,
DUTCH, ITALIAN, SWEDISH, POLISH,
TRADITIONAL CHINESE) (AEP, SP)
4-237-878-31 MANUAL, INSTRUCTION (DANISH, FINNISH)
(AEP)
4-237-880-11 CD-ROM (Open MG Jukebox)
4-237-881-11 MANUAL, INSTRUCTION (ENGLISH) (AEP)
4-237-881-21 MANUAL, INSTRUCTION
(CZECK, HUNGALIAN) (AEP)
4-237-881-31 MANUAL, INSTRUCTION (TRUKISH) (AEP)
4-237-881-41 MANUAL, INSTRUCTION (SLOVAKIAN) (AEP)
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part number specified.
69
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MDS-NT1
REVISION HISTORY
Clicking the version allows you to jump to the revised page.
Also, clicking the version at the upper right on the revised page allows you to jump to the next revised
page.
Ver.
Date
Description of Revision
1.0
2002.02
New
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