USB97C242
USB 2.0 Flash Drive
Controller
Datasheet
Product Features
ƒ
ƒ
ƒ
2.5 Volt, Low Power Core Operation
3.3 Volt I/O with 5V input tolerance
ƒ
Double Buffered Bulk Endpoint
−
−
−
Bi-directional 512 Byte Buffer for Bulk Endpoint
64 Byte RX Control Endpoint Buffer
Complete USB Specification 2.0 Compatibility
64 Byte TX Control Endpoint Buffer
−
−
Includes USB 2.0 Transceiver
ƒ
Internal or External Program Memory Interface
A Bi-directional Control and a Bi-directional Bulk
Endpoint are provided.
−
48K Byte Internal Code Space or optional 64K Byte
External Code Space using Flash, SRAM, or
EPROM memory.
ƒ
Complete System Solution for interfacing
SmartMedia (SM), and NAND flash devices to
USB 2.0 bus
ƒ
ƒ
On Board 12Mhz Crystal Driver Circuit
−
Supports USB Bulk Only Mass Storage Compliant
Bootable BIOS
Internal PLL for 480Mhz USB2.0 Sampling,
30Mhz MCU clock
−
Support for the following devices:
- SM: 2M –15MB/sec
ƒ
ƒ
Supports firmware upgrade via USB bus if sector-
erasable Flash program memory is used
- NAND Flash: 2M – 15MB/sec
Built-in hardware 1-bit ECC support.
7 GPIOs for special function use: LED indicators,
button inputs, power control to memory devices,
etc.
−
ƒ
8051 8 bit microprocessor
−
−
Provides low speed control functions
−
Inputs capable of generating interrupts with either
edge sensitivity
30 Mhz execution speed at 4 cycles per instruction
average
ƒ
100 Pin TQFP (12x12x1.4 body) Lead-Free
RoHS Compliant Package also available
−
−
12K Bytes of internal SRAM for general purpose
scratchpad
768 Bytes of internal SRAM for general purpose
scratchpad or program execution with external flash
ORDERING INFORMATION
Order Number(s):
USB97C242-MN-xx for 100 pin TQFP package
USB97C242-MV-04 for 100 pin TQFP Lead-Free RoHS Compliant Package
SMSC USB97C242
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USB97C242 Revision History
PAGE(S)
SECTION/FIGURE/ENTRY
CORRECTION
DATE REVISED
Rev. 1.4
1
Cover
Added lead-free ordering information
02-16-06
5
Chapter 1 – General Description
First bullet modified under the
following section:
Rev. 1.3
07-08-04
Internal program code provides the
following features:
ƒ
Support for 1 to 8, 128Mb through
2Gb, 512byte and 2048 byte page
size, 8bit parallel NAND flash
memories, including multiple
memory aggregates in multi-chip-
modules (MCM) up to 8, 2Gb
devices (ie 16Gb), as long as
individual memory device Chip
Enables are pinned out in the
MCM.
16
5
Table 7.1 - DC Electrical Characteristics
Chapter 1 - General Description
Updated High Input Leakage units.
Rev. 1.2
11-05-03
Rev. 1.1
04-03-03
Revised list of object code software
and licenses; internal program code
features
8
Chapter 3 - Pin TablesTable 3.1 –
USB97C242 100 Pin Package
Updated tables
Rev. 1.1
04-03-03
Rev. 1.1
04-03-03
Rev. 1.1
04-03-03
Rev. 1.1
04-03-03
Rev. 1.1
04-03-03
10
12
22
23
Figure 4.1 – 100 Pin TQFP
Diagram updated, new pin names
Updated misc pin section
Updated table
Table 6.1 – USB97C242 Pin
Descriptions
Table 11.1 - GPIO Usage
Chapter 12 - Typical Application
Typical application diagram deleted
SMSC USB97C242
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TABLE OF CONTENTS
REVISION HISTORY .....................................................................................................................................................2
CHAPTER 1 GENERAL DESCRIPTION ...................................................................................................................5
CHAPTER 2 ACRONYMS & DEFINITION ................................................................................................................7
2.1
CHAPTER 3 PIN TABLES.........................................................................................................................................8
3.1 100 Pin List......................................................................................................................................................8
Acronyms.........................................................................................................................................................7
CHAPTER 4 PIN CONFIGURATION.......................................................................................................................10
CHAPTER 5 BLOCK DIAGRAM .............................................................................................................................11
CHAPTER 6 PIN DESCRIPTIONS ..........................................................................................................................12
6.1
CHAPTER 7 DC PARAMETERS.............................................................................................................................16
7.1 Maximum Guaranteed Ratings ......................................................................................................................16
Buffer Type Descriptions................................................................................................................................15
7.1.1 Capacitance TA = 25°C; FC = 1MHz; VDD, VDDP = 2.5V .....................................................................18
CHAPTER 8 AC SPECIFICATIONS........................................................................................................................19
CHAPTER 9 PACKAGE OUTLINE..........................................................................................................................20
CHAPTER 10
CHAPTER 11
CHAPTER 12
REFERENCE ..................................................................................................................................21
GPIO USAGE TABLE.....................................................................................................................22
TYPICAL APPLICATION ................................................................................................................23
LIST OF FIGURES
Figure 4.1 – 100 Pin TQFP ..........................................................................................................................................10
Figure 9.1 – 100 Pin TQFP Package Outline, 12x12x1.4 Body (Rev A).......................................................................20
LIST OF TABLES
Table 3.1 – USB97C242 100 Pin Package ....................................................................................................................8
Table 3.2 – 100 Pin TQFP .............................................................................................................................................8
Table 6.1 – USB97C242 Pin Descriptions....................................................................................................................12
Table 6.2 - USB97C242 Buffer Type Descriptions .......................................................................................................15
Table 7.1 - DC Electrical Characteristics.......................................................................................................................16
Table 9.1 – 100 Pin TQFP Package Parameters (Rev A)............................................................................................20
Table 11.1 - GPIO Usage.............................................................................................................................................22
SMSC USB97C242
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Chapter 1 General Description
The USB97C242 is a USB2.0 Bulk Only Mass Storage Class Peripheral Controller intended for supporting
SmartMedia (SM), and NAND flash memory devices. It provides a single chip USB reader solution for the
SM and NAND flash devices in the market*.
The device consists of a USB 2.0 PHY and SIE, buffers, Fast 8051 microprocessor with expanded
scratchpad, and program SRAM, 48KB program ROM and SM controller.
Provisions for optional external Flash Memory up to 64K bytes for program storage is provided.
12K bytes of scratchpad SRAM and 768Bytes of scratchpad SRAM are also provided.
Seven GPIO pins are for the 100-pin device. Provisions are made to allow dynamic attach and re-attach to
the USB bus to allow hot swap of flash media to be implemented.
SMSC provides the following object code software and licenses free of charge with purchase of the
USB97C242**:
ƒ
ƒ
Windows 98 Mass Storage Class driver.
Windows application for programming VID/PID/OEM strings, and unique serial number into serial
EEPROM (SM reader) or NAND Flash via USB.
ƒ
ƒ
ƒ
Production test and format utilities
Password protection API and example applet.
Firmware with field upgrade capability via USB (requires external specific model 128KB Flash for
firmware storage).
The Internal program code provides the following features:
ƒ
Support for 1 to 8, 128Mb through 2Gb, 512byte and 2048 byte page size, 8bit parallel NAND flash
memories, including multiple memory aggregates in multi-chip-modules (MCM) up to 8, 2Gb devices
(ie 16Gb), as long as individual memory device Chip Enables are pinned out in the MCM.
ƒ
ƒ
ƒ
ƒ
Autodetection of NAND Flash memory type and capacity
Supports write protect switch
Wear leveling
Internal VID/PID/Serial Number/OEM String storage in NAND flash itself, eliminating need for external
serial EEPROM
ƒ
ƒ
High performance transfers (interleaving, copy block caching, etc.)
Drive password protection
SMSC may make complete internal specifications available for those customers requiring programming
information, subject to SMSC’s applicable Proprietary Information Agreement (nondisclosure agreement).
Contact your SMSC sales representative for more information.**
SMSC USB97C242
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Note:
* In order to develop, make, use, or sell readers and/or other products using or incorporating any of the
SMSC devices made the subject of this document or to use related SMSC software programs, technical
information and licenses under patent and other intellectual property rights from or through various persons
or entities, including without limitation media standard companies, forums, and associations, and other
patent holders may be required. These media standard companies, forums, and associations include
without limitation the following: Sony Corporation (Memory Stick), SD3 LLC (Secure
Digital/MultiMediaCard), the SSFDC Forum (SmartMedia), and the Compact Flash Association (Compact
Flash). SMSC does not make such licenses or technical information available; does not promise or
represent that any such licenses or technical information will actually be obtainable from or through the
various persons or entities (including the media standard companies, forums, and associations), or with
respect to the terms under which they may be made available; and is not responsible for the accuracy or
sufficiency of, or otherwise with respect to, any such technical information.
SMSC's obligations (if any) under the Terms of Sale Agreement, or any other agreement with any
customer, or otherwise, with respect to infringement, including without limitation any obligations to defend
or settle claims, to reimburse for costs, or to pay damages, shall not apply to any of the devices made the
subject of this document or any software programs related to any of such devices, or to any combinations
involving any of them, with respect to infringement or claimed infringement of any existing or future patents
related to solid state disk or other flash memory technology or applications (“Solid State Disk Patents”). By
making any purchase of any of the devices made the subject of this document, the customer represents,
warrants, and agrees that it has obtained all necessary licenses under then-existing Solid State Disk
Patents for the manufacture, use and sale of solid state disk and other flash memory products and that the
customer will timely obtain at no cost or expense to SMSC all necessary licenses under Solid State Disk
Patents; that the manufacture and testing by or for SMSC of the units of any of the devices made the
subject of this document which may be sold to the customer, and any sale by SMSC of such units to the
customer, are valid exercises of the customer’s rights and licenses under such Solid State Disk Patents;
that SMSC shall have no obligation for royalties or otherwise under any Solid State Disk Patents by reason
of any such manufacture, use, or sale of such units; and that SMSC shall have no obligation for any costs
or expenses related to the customer’s obtaining or having obtained rights or licenses under any Solid State
Disk Patents.
SMSC MAKES NO WARRANTIES, EXPRESS, IMPLIED, OR STATUTORY, IN REGARD TO
INFRINGEMENT OR OTHER VIOLATION OF INTELLECTUAL PROPERTY RIGHTS.
SMSC
DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES AGAINST INFRINGEMENT AND THE LIKE.
No license is granted by SMSC expressly, by implication, by estoppel or otherwise, under any patent,
trademark, copyright, mask work right, trade secret, or other intellectual property right.
**To obtain this software program the appropriate SMSC Software License Agreement must be executed
and in effect. Forms of these Software License Agreements may be obtained by contacting SMSC.
SMSC USB97C242
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Chapter 2 Acronyms & Definition
2.1
Acronyms
SM: SmartMedia
SMC: SmartMedia Controller
FM: Flash Media
FMC: Flash Media Controller
ECC: Error Checking and Correcting
CRC: Cyclic Redundancy Checking
SMSC USB97C242
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Chapter 3 Pin Tables
Table 3.1 – USB97C242 100 Pin Package
NAND FLASH/SMARTMEDIA INTERFACE (17 PINS)
D0
D4
D1
D5
D2
D6
D3
D7
ALE
nWP
nWPS
CLE
nB/R
nRE
nCE
nWE
nCD
USB INTERFACE (7 PINS)
USB+
USB-
FS+
LOOPFLTR
FS-
RBIAS
RTERM
MEMORY/IO INTERFACE (29 PINS)
MA0
MA4
MA1
MA5
MA2
MA6
MA3
MA7
MA8
MA9
MA10
MA14
MD2
MA11
MA15
MD3
MD7
MA12
MD0
MA13
MD1
MD4
MD5
MD6
nMRD
nIOW
nMWR
nIOR
nMCE
MISC (21 PINS)
ROMEN
GPIO4
GPIO1
GPIO5
XTAL2
nCS5
GPIO20
GPIO6
nRESET
nCS6
GPIO3
GPIO7
XTAL1/CLKIN
nCS4
nCS7
nCS3
nCS0
nCS1
nCS2
nTEST0
nTEST1
POWER, GROUNDS, AND NC (26 PINS)
TOTAL 100
3.1
100 Pin List
Table 3.2 – 100 Pin TQFP
PIN #
NAME
MA0
MA PIN #
NAME
MD5
MA PIN #
NAME
51 nWE
52 nWP
MA PIN #
NAME
RBIAS
VDDA
FS+
MA
1
2
3
4
5
6
7
8
8
8
8
8
8
8
8
8
26
27
28
29
30
31
32
33
8
8
8
8
8
8
8
8
12
12
8
76
77
78
79
80
81
82
83
MA1
MA2
MA3
MA4
MA5
MA6
MA7
MD6
MD7
53 nCE
nMRD
nMWR
VSSIO
nMCE
nIOW
54 nWPS
55 nB/R
USB+
USB-
56 nCD
FS-
57 nCS0
58 VDDCORE
RTERM
VSSA
SMSC USB97C242
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PIN #
NAME
MA8
MA PIN #
NAME
MA PIN #
NAME
MA PIN #
NAME
MA
9
8
34
nIOR
8
59 nCS1
84
XTAL1/CL
KIN
10
11
12
MA9
8
8
35
36
37
ROMEN
D0
60 VSSCORE
61 nCS2
85
86
87
XTAL2
MA10
12
VSSP
VDDCOR
E
D1
62 VDDIO
LOOPFLT
R
12
12
13
14
MA11
8
38
39
D2
63 nCS3
64 nCS4
88
89
VDDP
VSSCOR
E
VDDCOR
E
GPIO1
8
15
16
VSSIO
40
41
D3
12
12
65 VSSIO
90
91
GPIO2
GPIO3
8
8
MA12
8
VSSCOR
E
66 nCS5
17
18
19
20
21
22
23
24
25
MA13
MA14
MA15
VDDIO
MD0
8
8
8
42
43
44
45
46
47
48
49
50
D4
67 nCS6
68 nCS7
69 NC
70 NC
71 NC
72 NC
73 NC
74 NC
75 NC
92
93
94
95
96
97
98
99
100
GPIO4
GPIO5
GPIO6
GPIO7
nRESET
VSSIO
nTEST0
VDDIO
nTEST1
8
8
8
8
VDDIO
D5
12
12
12
12
D6
8
8
8
8
8
D7
MD1
ALE
VSSIO
nRE
CLE
MD2
MD3
24
12
MD4
SMSC USB97C242
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Chapter 4 Pin Configuration
75
51
CLE
nRE
VSSIO
ALE
D7
D6
D5
VDDIO
D4
VSSCORE
D3
VDDCORE
D2
RBIAS
VDDA
FS+
USB+
USB-
FS-
RTERM
VSSA
XTAL1/CLKIN
XTAL2
VSSP
LOOPFLTR
USB97C242
VDDP
D1
D0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
nRESET
VSSIO
nTEST0
VDDIO
ROMEN
nIOR
nIOW
nMCE
VSSIO
nMWR
nMRD
MD7
MD6
MD5
nTEST1
1
25
Figure 4.1 – 100 Pin TQFP
SMSC USB97C242
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Chapter 5 Block Diagram
Auto address generators
512 Bytes EP2 TX/RX Buffer B
512 Bytes EP2 TX/RX Buffer A
1.25KB
SRAM
Address
Address
64 Bytes EP1RX
64 Bytes EP1TX
64 Bytes EP0RX
64 Bytes EP0TX
EP0TX_BC
Flash Media
Controller (FMC)
Memory
Cards
Address
Address
EP0RX_BC
EP1TX_BC
32 Bit
60MHz
SM/
NAND Flash
CS[7:0]
EP1RX_BC
Address
Address
Latch phase
8051
3
Latch phase
FMC
1
Latch phase 0, 2
SIE
DATA
RAMW R_A/B
NAND Flash
NAND Flash
SM
ECC
Flash
Media
DMA
Unit
Controller
Control/
Status
Control/
Status
RAMRD_A/B
Address
Data
@
15Mhz
32 bit
NAND Flash
NAND Flash
NAND Flash
NAND Flash
Clocked byPhase 0, 2 Clock
NAND Flash
SIE
12K Byte
Scratchpad
SRAM
32 bit 15MHz Data Buss
( Serial Interface Engine
)
SIE Control Regs
USB 2.0 PHY
( Transciever )
GPIO
7
pins
Configuration and Control
Scratchpad
SRAM (768 Byte)
Clock Generation
Osc
48KB ROM
ROMEN
Interrupt Controller
Program Memory/ IO
Bus
MEM/IO Bus
29pins
FAST 8051
CPU CORE
CLOCKOUT
12 MHz
Clocked by Phase
3
Clock
SMSC USB97C242
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Chapter 6 Pin Descriptions
This section provides a detailed description of each signal. The signals are arranged in functional groups
according to their associated interface.
The “n” symbol in the signal name indicates that the active, or asserted state occurs when the signal is at a
low voltage level. When “n” is not present before the signal name, the signal is asserted when at the high
voltage level.
The terms assertion and negation are used exclusively. This is done to avoid confusion when working with
a mixture of “active low” and “active high” signal. The term assert, or assertion indicates that a signal is
active, independent of whether that level is represented by a high or low voltage. The term negate, or
negation indicates that a signal is inactive.
Table 6.1 – USB97C242 Pin Descriptions
BUFFER
TYPE
NAME
SYMBOL
DESCRIPTION
NAND FLASH/SMARTMEDIA INTERFACE
SM
nWP
O12
O12
O12
This pin is an active low write protect signal for the SM or NAND flash
device.
Write
Protect
SM
ALE
CLE
This pin is an active high Address Latch Enable signal for the SM or
NAND flash device.
Address
Strobe
SM
This pin is an active high Command Latch Enable signal for the SM or
NAND flash device.
Command
Strobe
SM
D[7:0]
I/OPU12 These pins are the bi-directional data signal D7-D0.
Data7-0
The bi-directional input signal should have an internal weak pull-up
resister on the input.
SM
nRE
nWE
O24
O12
IPU
This pin is an active low read strobe signal for SM or NAND flash device.
Read
Enable
SM
This pin is an active low write strobe signal for SM or NAND flash device.
Write
Enable
SM
nWPS
A write-protect seal is detected, when this pin is low.
This pin has an internal weak pull-up resistor.
Write
Protect
Switch
SM
nB/R
nCE
IPU
This pin is connected to the BSY/RDY pin of the SM or NAND flash
device.
Busy or
Data Ready
This pin has an internal weak pull-up resistor.
SM
OPU8 This pin is the active low chip enable signal to the SM or NAND flash
device.
Chip
Enable
This pin should be used to support a single SM or NAND flash device
only.
SMSC USB97C242
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BUFFER
TYPE
NAME
SYMBOL
DESCRIPTION
SM
nCD
IPU
This is the card detection signal from SM device to indicate if the device
is inserted.
Card
Detection
This pin has internal weak pull-up resistor.
USB INTERFACE
USB Bus
Data
USB-
USB+
I/O-U
These pins connect to the USB bus data signals.
USB
Transceiver
Filter
LOOPFLTR
This pin provides the ability to supplement the internal filtering of the
transceiver with an external network, if required.
USB
Transceiver
Bias
RBIAS
A precision 9.09K resistor is attached from ground to this pin to set the
transceiver’s internal bias currents.
Termination
Resistor
RTERM
A precision 1.5K resistor is attached to this pin from a 3.3V supply.
Full Speed
USB Data
FS-
I/O-U
These pins connect to the USB- and USB+ pins through 31.6 ohm series
resistors.
FS+
MEMORY/IO INTERFACE
Memory
Data Bus
MD[7:0]
I/OPU8 When ROMEN = 0, these signals are used to transfer data between the
internal CPU and the external program memory.
When ROMEN = 1, internal weak pull up are activated to prevent these
pins from floating.
Memory
Address
Bus
MA[15:0]
nMWR
nMRD
O8
O8
O8
O8
These signals address memory locations within the external memory.
Memory
Read
Strobe
Program Memory Write; active low
Memory
Read
Strobe
Program Memory Read; active low
Memory
Chip
nMCE
Program Memory Chip Enable; active low.
Enable
This signal shall be de-asserted, when all of the following conditions are
met:
IDLE bit (PCON.0) is 1.
INT2 is negated
SLEEP bit of CLOCK_SEL is 1.
This signal shall be asserted whenever any of the three conditions are
no longer met.
I/O Read
Strobe
nIOR
O8
O8
This is a active low I/O Read strobe signal of Xdata bus.
This is a active low I/O Write strobe signal of Xdata bus.
I/O Write
Strobe
nIOW.
SMSC USB97C242
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BUFFER
TYPE
NAME
SYMBOL
DESCRIPTION
MISC
ICLKx 12Mhz Crystal or external clock input.
Crystal
Input/Extern
al Clock
Input
XTAL1/
CLKIN
This pin can be connected to one terminal of the crystal or can be
connected to an external 12Mhz clock when a crystal is not used.
Crystal
Output
XTAL2
OCLKx 12Mhz Crystal
This is the other terminal of the crystal, or left open when an external
clock source is used to drive XTAL1/CLKIN. It may not be used to drive
any external circuitry other than the crystal circuit.
Internal
ROMEN
ROMEN
IPU
When tied low, an external program memory should be connected to the
memory/data bus. The USB97C242 uses this external bus for program
execution.
When this pin is left unconnected or tied high, the USB97C242 uses the
internal ROM for program execution.
The state of this pin is latched internally on the rising edge of nRESET to
determine if internal or external program memory is used.
The state latched is stored in ROMEN bit of GPIO_IN1 register.
General
Purpose I/O
GPIO1
GPIO2
GPIO3
I/O8
This pin may be used either as input, edge sensitive interrupt input, or
output. See Chapter 11 for usage by program in internal ROM.
General
Purpose I/O
I/OPU8 This pin may be used either as input, edge sensitive interrupt input, or
output. See Chapter 11 for usage by program in internal ROM.
General
Purpose I/O
I/O8
I/O8
This pin may be used either as input, edge sensitive interrupt input, or
output. See Chapter 11 for usage by program in internal ROM.
General
Purpose I/O
GPIO[7:4]
nCS[7:0]
These pins may be used either as input, edge sensitive interrupt input, or
output. See Chapter 11 for usage by program in internal ROM.
NAND flash
Chip Select
Signal
OPU8 These pins can be used to chip enable the NAND flash devices, when
multiple NAND flash devices are used.
RESET
input
nRESET
IS
I
This active low signal is used by the system to reset the chip. The active
low pulse should be at least 100ns wide.
TEST Input nTEST[0:1]
These signals are used for testing the chip. User should normally leave
them unconnected.
POWER, GROUNDS, AND NO CONNECTS
+2.5V Core power
VDD
VDDIO
VDDP
VSSP
VDDA
VSSA
GND
+3.3V I/O power
+2.5 Analog power
Analog Ground Reference
+3.3V Analog power
Analog Ground Reference
Ground Reference
SMSC USB97C242
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Note: nMCE is normally asserted except when the 8051 is in standby mode.
6.1
Buffer Type Descriptions
Table 6.2 - USB97C242 Buffer Type Descriptions
BUFFER
DESCRIPTION
I
Input
IPU
IPD
Input with internal weak pull-up resistor.
Input with internal weak pull-down
resistor.
IS
Input with Schmitt trigger
I/O4
Input/Output with 4mA drive
I/OD4
I/O8
Input/Open drain output … 4mA sink
Input/Output with 8mA drive
I/OD8
I/OPD8
Input/Open drain output … 8mA sink
Input/Output with 8mA drive and
controlled weak pull down.
I/OPU8
Input/Output with 8mA drive and
controlled weak pull up.
O4
O8
Output with 4mA drive
Output with 8mA drive
OPD8
Output with 8mA drive and controlled
weak pull down.
OPU8
Output with 8mA drive and controlled
weak pull up.
I/O12
Output with 12mA drive
I/OPU12
Input/Output with 12mA drive and
controlled weak pull up on input.
OPU12
OPD12
Output with 12mA drive and controlled
weak pull up.
Output with 12mA drive and controlled
weak pull down.
O12
OD12
ICLKx
OCLKx
I/O-U
Output with 12mA drive
Open drain….12mA sink
XTAL clock input
XTAL clock output
Defined in USB specification
SMSC USB97C242
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Chapter 7 DC Parameters
7.1
Maximum Guaranteed Ratings
Operating Temperature Range........................................................................................................................... 0oC to +70oC
Storage Temperature Range............................................................................................................................-55o to +150oC
Lead Temperature Range (soldering, 10 seconds)..................................................................................................... +325oC
Positive Voltage on any pin, with respect to Ground ........................................................................................................5.5V
Negative Voltage on any pin, with respect to Ground......................................................................................................-0.3V
Maximum VDD, VDDP ........................................................................................................................................................+3.0V
Maximum VDDIO, VDDA ......................................................................................................................................................+4.0V
*Stresses above the specified parameters could cause permanent damage to the device. This is a stress rating only and
functional operation of the device at any other condition above those indicated in the operation sections of this
specification is not implied.
Note:
When powering this device from laboratory or system power supplies, it is important that the Absolute
Maximum Ratings not be exceeded or device failure can result. Some power supplies exhibit voltage
spikes on their outputs when the AC power is switched on or off. In addition, voltage transients on the AC
power line may appear on the DC output. When this possibility exists, it is suggested that a clamp circuit
be used.
Table 7.1 - DC Electrical Characteristics
(TA = 0°C - 70°C, VDDIO, VDDA= +3.3 V ± 10%, VDD, VDDP = +2.5 V ± 10%,)
PARAMETER
SYMBOL
MIN
2.0
TYP
MAX
UNITS
COMMENTS
I Type Input Buffer
VILI
VIHI
0.8
V
V
TTL Levels
Low Input Level
High Input Level
ICLK Input Buffer
VILCK
VIHCK
0.4
V
V
Low Input Level
2.2
High Input Level
Input Leakage
(All I and IS buffers)
IIL
-10
-10
+10
+10
uA
uA
V
IN = 0
Low Input Leakage
High Input Leakage
IIH
VIN = VDDIO
SMSC USB97C242
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PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
COMMENTS
O8 Type Buffer
VOL
0.4
V
IOL = 8 mA @ VDDIO
Low Output Level
= 3.3V
I
OH = -4mA @ VDDIO
VOH
2.4
-10
V
High Output Level
Output Leakage
= 3.3V
IOL
+10
0.4
uA
V
IN = 0 to VDDIO
(Note 7.1)
I/O8 Type Buffer
Low Output Level
VOL
VOH
IOL
V
V
IOL = 8 mA @ VDDIO
= 3.3V
IOH = -4 mA @ VDDIO
2.4
-10
High Output Level
= 3.3V
+10
0.4
µA
Output Leakage
V
IN = 0 to VDDIO
(Note 7.1)
I/O12 Type Buffer
Low Output Level
VOL
V
V
IOL = 12 mA @
V
DDIOE = 3.3V
IOH = -6mA @ VDDIO
= 3.3V
High Output Level
VOH
2.4
-10
V
IN = 0 to VDDIO
Output Leakage
IOL
+10
0.4
µA
V
(Note 7.1,Note 7.3)
I/O24 Type Buffer
Low Output Level
High Output Level
Output Leakage
VOL
IOL = 24 mA @ VDDIO
= 3.3V
IOH = -12 mA @
VOH
2.4
V
V
DDIO = 3.3V
VIN = 0 to VDDIO
IOL
-10
+10
µA
(Note 7.1,Note 7.3)
SMSC USB97C242
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PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
COMMENTS
IO-U
Note 7.2
Supply Current Unconfigured
ICCINIT
85
60
mA
mA
@ VDD, VDDP = 2.5V
@ VDDIO, VDDA
3.3V
=
Supply Current Active
Supply Current Standby
ICC
85
60
110
70
mA
mA
@ VDD, VDDP = 2.5V
@ VDDIO, VDDA
3.3V
=
ICSBY
150
150
@ VDD, VDDP = 2.5V
µA
@ VDDIO, VDDA
3.3V
=
Note 7.1 Output leakage is measured with the current pins in high impedance.
Note 7.2 See Appendix A for USB DC electrical characteristics.
Note 7.3 Output leakage is valid only on pins without internal weak pull ups or pull downs.
7.1.1 Capacitance TA = 25°C; FC = 1MHz; VDD, VDDP = 2.5V
LIMITS
PARAMETER
Clock Input Capacitance
Input Capacitance
SYMBOL MIN TYP MAX UNIT
TEST CONDITION
CIN
CIN
20
10
20
pF
pF
pF
All pins except USB pins
(and pins under test tied
to AC ground)
Output Capacitance
COUT
SMSC USB97C242
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Chapter 8 AC Specifications
Refer to the appropriate specification document in the chapter of “Reference” for each flash media device or USB
interface.
SMSC USB97C242
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Chapter 9 Package Outline
Figure 9.1 – 100 Pin TQFP Package Outline, 12x12x1.4 Body (Rev A)
Table 9.1 – 100 Pin TQFP Package Parameters (Rev A)
MIN
~
NOMINAL
MAX
1.60
0.15
1.45
14.20
12.20
14.20
12.20
0.20
0.75
~
REMARKS
Overall Package Height
Standoff
~
~
~
~
~
~
~
~
A
A1
A2
D
D1
E
E1
H
L
0.05
1.35
13.80
11.80
13.80
11.80
0.09
0.45
~
Body Thickness
X Span
X body Size
Y Span
Y body Size
Lead Frame Thickness
Lead Foot Length
Lead Length
0.60
1.00
0.40 Basic
L1
e
Lead Pitch
Lead Foot Angle
Lead Width
0o
0.13
0.08
0.08
~
~
0.16
~
~
~
7o
0.23
~
0.20
0.08
θ
W
R1
R2
ccc
Lead Shoulder Radius
Lead Foot Radius
Coplanarity
Notes:
1 Controlling Unit: millimeter.
2 Tolerance on the position of the leads is ± 0.035 mm maximum.
3 Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm.
4 Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5 Details of pin 1 identifier are optional but must be located within the zone indicated.
SMSC USB97C242
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Chapter 10 Reference
1. SmartMediaTM Electrical Specification Version 1.30
2. SmartMediaTM Physical Format Specifications Version 1.30
3. SmartMediaTM Logical Format Specifications Version 1.20
4. SMIL (SmartMedia Interface Library) Software Edition Version 1.00, Toshiba Corporation, 01, July, 2000
5. SMIL (SmartMedia Interface Library) Hardware Edition Version 1.00, Toshiba Corporation, 01, July, 2000
6. K9K2G08U0M, 256Mx8 Bit NAND Flash Memory Data Sheet, Samsung.
7. Universal Serial Bus Specification Rev 2.0
SMSC USB97C242
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Chapter 11 GPIO Usage Table
Table 11.1 - GPIO Usage
ACTIVE
NAME
GPIO1
SYMBOL
DESCRIPTION AND NOTE
LEVEL
H
H
Flash Media Activity LED
Indicates media activity. Media or
USB cable must not be removed
with LED lit. Active High.
GPIO2
Ready/Busy# 1/4
Ready/Busy# line from NAND
Flash chips 0, or 0 & 4
GPIO3
GPIO4
H
H
V_BUS
USB V bus dectect
Ready/Busy# for Chips 1/5
Ready/Busy# line from NAND
Flash chips 1, or 1 & 5
GPIO5
H
HS_IND/Ready/Busy# 2/6
In Rom -03; HS_LED output
indicator; in later ROM patterns,
the Ready/Busy# line from NAND
Flash chips 2, or 2 & 6
GPIO6
GPIO7
H
H
A16
A16 address line when external
Rom is used; unused output
otherwise.
Ready/Busy# 3/7
Ready/Busy# line from NAND
Flash chips 3, or 3 & 7
SMSC USB97C242
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Chapter 12 Typical Application
Contact SMSC Sales for the latest reference designs and information and details about software licenses and the
latest capabilities/features included in current production versions of the internal ROM.
SMSC USB97C242
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