Product Manual
Lyrion Series CE-ATA
ST760211CA
ST730212CA
100441950
Rev. A
May 2008
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Contents
Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Drive care . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Drive specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Formatted capacity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Default logical geometry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recording and interface technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Physical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Time to ready. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Power specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Conducted noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Voltage tolerance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Power-management modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Environmental specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Ambient temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Temperature gradient. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Altitude . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Shock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Vibration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Corrosive environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Acoustics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Electromagnetic immunity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Agency certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Safety certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Electromagnetic compatibility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
FCC verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Configuring and mounting the drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Handling and static discharge precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Drive installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Mounting considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Interface description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Interface signals and connector pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Supported command set and features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
MMC command set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Reduced ATA command set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Status and Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5.0
Seagate Technology support services. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
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List of Figures
Figure 9.
Lyrion Series (CE-ATA interface) disc drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Typical 3.3V startup and operation current profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Location where tri-axial accelerometer will be placed on Lyrion Series drives. . . . . . . . . . . . 12
Drive axis definition for Lyrion Series drives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Lyrion Series breather hole location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Lyrion Series proper handling example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Lyrion Series mechanical dimensions—top, side and end view . . . . . . . . . . . . . . . . . . . . . . . 23
Lyrion Series FPC dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Lyrion Series Area for Protective Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
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1.0
Introduction
This manual describes the functional, mechanical and interface specifications for the following Seagate®
Lyrion®Series CE-ATA drives:
• ST760211CA-60GB, ST730212CA-30GB disc drives with a CE-ATA interface.
These drives provide the following key features.
• 3,600-RPM spindle speed and a 2-Mbyte buffer combined for superior read/write performance.
• Quiet operation. Fluid Dynamic Bearing (FDB) motor.
• Perpendicular recording heads and EPRML technology, which provide the drives with increased areal density.
• State-of-the-art cache and on-the-fly error-correction algorithms.
• 1500 G nonoperating shock, and 500 G operating shock.
• SeaTools™ diagnostic software performs a drive self-test that eliminates unnecessary drive returns.
Figure 1.
Lyrion Series (CE-ATA interface) disc drive
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1.1
Disclaimer
Seagate Technology LLC makes no warranties whatsoever, including any warranty of merchantability, non-
infringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal,
specification or sample. Seagate may not be held liable for any direct, indirect, incidental, special, exemplary,
or consequential damages (including, but not limited to, loss of use, data, or profits; procurement of substitute
goods or services; or business interruptions) however caused and on any theory of liability, whether in contract,
strict liability, or tort (including negligence or otherwise) arising in any way from the use of this kit, even if
advised of the possibility of such damage.
1.2
Drive care
Do not use the Lyrion Series disc drives outside of the ranges of environmental conditions found in Section 2.8,
"Environmental specifications." Doing so may void the warranty of the Lyrion Series disc drive.
2
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2.0
Drive specifications
Unless otherwise noted, all specifications are measured under ambient conditions, at 25°C, and nominal
power. For convenience, the phrases the drive and this drive are used throughout this manual to indicate
ST760211CA and ST730212CA model drives.
2.1
Overview
The specifications listed in this table are for quick reference. For details on specification measurement or
definition, see the appropriate section of this manual.
Table 1:
Specifications
Drive specification
ST760211CA
60
ST730212CA
30
Formatted Gbytes
Guaranteed sectors
117,210,240
512
58,605,120
Bytes per sector (logical)
Cache (Mbytes)
2
Recording density, BPI (bits/inch average)
Track density. TPI (tracks/inch average)
1,025,000
165,000
169
2
Areal density (Gbits/inch average)
Spindle speed (RPM)
3,600
Internal data transfer rate OD (Mbits/sec max)
350
Sustained data transfer rate OD @ 8bit/52MHz (Mbytes/
sec)
24.5
Sustained data transfer rate OD @ 8bit/26MHz (Mbytes/
sec)
18.0
Height
5.0 + 0.15 mm(0.1968 + 0.006 inches)
Width
54.0 +/-0.3 mm (2.1260 +/-0.0118 inches)
Length
71.0 +/-0.3 mm (2.7953 +/-0.0118 inches)
Weight
48.0 gm - 0.1058 lb. (typ)
Average latency (msec)
Power-on to ready (sec typical)
Standby to ready (sec typical)
8.3
1.8
1.8
Startup power (peak at 3.3v) (maximum RMS in 10ms win- 1.15 W
dow)
Read/Write power (typical 3.3V)
1.19/1.09 W
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Table 1:
Specifications
Drive specification
ST760211CA
0.68 W
ST730212CA
Performance idle power (typical 3.3V)
Low power idle power (typical 3.3V)
Standby/Sleep power (typical 3.3V)
Voltage tolerance (including noise)
Ambient temperature
0.48 W
0.20 W
3.3V ± 5%
0° to 60°C (operating)
–40° to 70°C (nonoperating)
Temperature gradient (°C per hour max)
Relative humidity (noncondensing)
20°C (operating)
30°C (nonoperating)
5% to 90% (operating)
5% to 95% (nonoperating)
Relative humidity gradient
30% per hour max
Wet bulb temperature (°C max)
33°C (operating)
40°C (nonoperating)
Altitude, operating
–60.98 m to 3,048 m (–200 ft to 10,000+ ft)
Altitude, nonoperating (below mean sea level, max)
Shock, operating (Gs max at 2 msec)
Shock, nonoperating (Gs max at 1 msec)
–60.98 m to 12,192 m (–200 ft to 40,000+ ft)
500
1500
Vibration, operating
1.0 Gs (0 to peak, 10–500 Hz) @ 2 oct/min sweep rate
(max displacement may apply below 10 hz)
Vibration, nonoperating
5.0 Gs (0 to peak, 10–500 Hz) @ 0.5 oct/min sweep rate
(max displacement may apply below 22 hz)
Idle sound power (bels) (typical)
Operational sound power (bels) (typical)
Nonrecoverable read errors
1.6
2.2
14
1 per 10 bits read
Load/Unload (LUL) cycles
300,000 software-controlled
20,000 power loss
Warranty
Per agreement
4
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2.2
Formatted capacity
Model
Formatted
capacity
Guaranteed
sectors
Bytes per
sector (logical)
ST760211CA
ST730212CA
60 Gbytes
30 Gbytes
117,210,240
58,605,120
512
512
LBA mode addressing
When addressing these drives in LBA mode, all blocks (sectors) are consecutively numbered from 0 to n–1,
where n is the number of guaranteed sectors as defined above.
2.3
Default logical geometry
Model
Cylinders
Heads
16
Sectors
63
ST760211CA
ST730212CA
116,280
58,149
16
63
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2.4
Recording and interface technology
Technology
Interface
Specification
CE-ATA
Recording method
Perpendicular Magnetic Recording
Recording density BPI (bits/inch average)
Track density TPI (tracks/inch average)
1,025,000
165,000
169
2
Areal density (Gbits/inch average)
Spindle speed (RPM) (± 0.2%)
3,600
350
Internal data-transfer rate OD (Mbits/sec max)
Sustained data transfer rate OD @ 8bit/52MHz (Mbytes/sec)
Sustained data transfer rate OD @ 8bit/26MHz (Mbytes/sec)
Cache buffer (Mbytes)
24.5
18.0
2
2.5
Physical characteristics
Height
Width
(mm)
(inches)
5.0 + 0.15
0.1968 + 0.006
(mm)
(inches)
54.0 +/-0.3
2.1260 +/-0.0118
Length
(mm)
(inches)
71.0 +/-0.3
2.7953 +/-0.0118
Typical weight
(grams)
(pounds)
48.0 (typ)
0.1058 lb. (typ))
Interface Connector
18-way ZIF
2.6
Time to ready
Time to ready
Typical
1.8
Power-On to Ready (sec)
Standby to Ready (sec)
1.8
6
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2.7
Power specifications
The drive receives DC power (+3.3V) through the ZIF connector (CE-ATA interface).
2.7.1 Power consumption
Power requirements for the drives are listed in the table on page 8. Typical power measurements are based on
an average of drives tested, under nominal conditions, using +3.3V input voltage at 25°C ambient temperature.
• Startup mode
Startup power is measured from the time of power-on to the time that the drive spindle reaches operating speed.
• Seek mode
During seek mode, the read/write actuator arm moves toward a specific position on the disc surface and does
not execute a read or write operation. Servo electronics are active. Seek power is measured based on three
random seek operations every 100 msecs.
• Read/write mode
Read/write power is measured with the heads on track, while the head is reading/writing from/to disc. It is
performed with 100 percent duty cycle of read/write operation.
• Performance Idle mode
During Performance Idle mode, the heads are on track but no reading or writing is done. The spindle motor is
spinning at full speed.
• Low power idle mode
During Low power Idle mode, the heads are unloaded but the spindle motor is spinning at full speed. Servo
and read/write electronics are in powered down mode.
• Standby / Sleep mode
During Standby/Sleep mode, the spindle motor is not spinning, and the servo and read/write electronics are
in powered down mode.
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Table 2:
DC power
Power Consumption at 3.3V
Startup (max*)
Average (W)
1.15
Read
1.19
Write
1.09
Performance idle (typical)
Low power idle (typical)
Standby/Sleep (typical)
0.68
0.48
0.20
*Maximum is the average of the peak value in 10 msec window
2.7.1.1
Typical current profile
100mA/div
Sequential
Read
Motor
Spinup to
Ready
Unload
Average
Performance
Idle
Standby
Standby
Load
Average
+3.3V Input Supply Current
1s/div
Figure 2.
Typical 3.3V startup and operation current profile
8
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2.7.2
Conducted noise
Input noise ripple is measured at the host system power supply across an equivalent 15-ohm resistive load on
the +3.3 volt line.
Using 3.3-volt power, the drive is expected to operate with a maximum of 70 mV peak-to-peak square-wave
injected noise at up to 20 MHz.
Note. Equivalent resistance is calculated by dividing the nominal voltage by the typical RMS read/write
current.
2.7.3
Voltage tolerance
Voltage tolerance (including noise):
3.3V ± 5%
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2.7.4
Power-management modes
The drive provides programmable power management to provide greater energy efficiency. The drive features
the following power-management modes:
Table 3:
Power-management modes
Power modes
Heads
Spindle
Rotating
Rotating
Rotating
Stopped
Buffer
Active (read/write/seek) Tracking
Enabled
Enabled
Disabled
Disabled
Idle, performance
Idle, low power
Standby/Sleep
Tracking
Parked
Parked
• Active mode
The drive is in Active mode during the read/write and seek operations.
• Performance idle mode
The drive enters this mode once the read/write/seek activity is completed. The buffer remains enabled, and
the drive accepts all commands and returns to Active mode any time disc access is necessary.
• Low power idle mode
Drive enters Low Power Idle mode from Performance Idle mode when the Advanced Power Management
Level is set between 80h and FDh, and the Idle timer reaches 2 seconds (default setting). Disc is spinning
and heads are parked and drive accepts all commands and returns to Active mode any time disc access is
necessary.
• Standby/Sleep mode
The drive enters Standby mode when the host sends a Standby Immediate command. When the Advanced
Power Management Level is set lower than 80h (default setting), the drive enters the Standby state after 2
seconds of interface inactivity. If the host has set the standby timer, the drive may also enter the Standby
mode after the expiry of the standby timer. The standby timer can be set using the Standby or Idle command.
In Standby mode, the drive buffer is disabled, the heads are parked and the spindle is at rest. The drive accepts
all commands and returns to Active mode any time disc access is necessary.
10
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2.8
Environmental specifications
Ambient temperature
2.8.1
Ambient temperature is defined as the temperature of the environment immediately surrounding the drive.
Actual drive case temperature should not exceed 70°C (158°F) within the operating ambient conditions. Case
temperature of the drive operating at 60°C ambient may hit a maximum of 70°C at certain parts of the casing.
Above 1,000 feet (305 meters), the maximum operating temperature is derated linearly by 1°C every 1000 feet.
Operating
0° to 60°C (32° to 140°F)
(70°C max case temperature)
Nonoperating
–40° to 70°C (–40° to 158°F)
2.8.2
Temperature gradient
Operating
20°C per hour (36°F per hour max), without condensation
30°C per hour (54°F per hour max), without condensation
Nonoperating
2.8.3
Humidity
2.8.3.1
Relative humidity
Operating 5% to 90% noncondensing (30% per hour max)
Nonoperating 5% to 95% noncondensing (30% per hour max)
2.8.3.2
Wet bulb temperature
[1] Operating: Wet bulb temperature is calculated by the operating Temperature and the Relative Humidity levels.
[2] Nonoperating: Wet bulb temperature is calculated by the nonoperating Temperature and the Relative Humidity levels.
2.8.4
Altitude
Operating
–60.98 m to 3,048 m (–200 ft to 10,000+ ft)
–60.98 m to 12,192 m (–200 ft to 40,000+ ft)
Nonoperating
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2.8.5
Shock
All shock measurements in this section are carried out at drive level. For all linear shock test, operating or
nonoperating, the input shock level is measured at the frame of the drive at the specific location as indicated in
Figure 3 below.
Figure 3.
Location where tri-axial accelerometer will be placed on Lyrion Series drives
All shock test cover all the 6 directions, +/- x, y and z axes. The drive axis definition in shown in Figure 4 below.
Figure 4.
2.8.5.1
Drive axis definition for Lyrion Series drives
Operating shock
The drive is subjected to 10 shocks for each direction. During the shocks, there must be a minimum delay of 3
seconds between shock pulses. Soft errors and automatic retries are allowed during the test. No data loss or
permanent damage occurs during a half sine shock pulse of:
500 G, 2 msec
2.8.5.2
Nonoperating shock
The nonoperating shock level that the drive can experience without incurring any physical damage when sub-
sequently put into operation is 1500 Gs. The same applies for shock levels of 1500 G, 1 msec pulse duration
on fresh drives for each level.
2.8.6
Vibration
All vibration specifications assume that the drive is mounted securely in a fixture that does not have fixture
resonances in the frequency test range.
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2.8.6.1
Operating sweep sine vibration
The following lists the maximum operating sweep sine vibration levels that the drive may experience while
meeting the performance standards specified. It consists of a forward and backward sweep from 10 Hz to
500 Hz to 10 Hz. The drive operates without a hard error while being subjected to the following vibration levels.
10 Hz to 500 Hz @ 2 oct/min
1.0 Gs (0 to pk). Maximum displacement may apply below 10 Hz.
2.8.6.2
Operating random vibration
The test consists of 30 minutes of random vibration using the power spectral density (PSD) levels specified in
the table below. The vibration test level is 0.67 Gs RMS. The drive operates without a hard error while being
subjected to the following vibration levels.
Table 4:
Operating random vibration profile
Frequency (Hz)
G2/Hz
17
45
1.1 x E-03
1.1 x E-03
8.0 x E-03
8.0 x E-03
1.0 x E-03
1.0 x E-03
5.0 x E-04
5.0 x E-04
48
62
65
150
200
500
2.8.6.3
Nonoperating sweep sine vibration
The following table lists the maximum nonoperating sweep sine vibration levels that the drive may experience
while meeting the performance standards specified. It consists of a forward and backward sweep from 5 Hz to
500 Hz to 5 Hz. The drive does not incur any physical damage when subsequently put into operation.
10 Hz to 500 Hz @ 0.5 oct/min
5 Hz to 10 Hz
5.0 Gs (0 to pk). Maximum displacement may apply below 22 Hz.
25.4 mm peak to peak displacement.
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2.8.6.4
Nonoperating random vibration
The test consists of 15 minutes of random vibration using the power spectral density (PSD) levels specified in
the table below. The vibration test level is 3.01 Gs RMS. The drive does not incur any physical damage when
subsequently put into operation.
Table 5:
Nonoperating random vibration profile.
Frequency (Hz)
G2/Hz
2.5
5
1.0 x E-03
3.0 x E-02
1.8 x E-02
1.8 x E-02
40
500
2.8.7
Corrosive environment
Seagate electronic drive components pass accelerated corrosion testing equivalent to ten years of exposure to
light industrial environments containing sulfurous gases, chlorine and nitric oxide, classes G and H per ASTM
B845. However, this accelerated testing cannot duplicate every potential application environment.
Users should use caution exposing any electronic components to uncontrolled chemical pollutants and corro-
sive chemicals as electronic drive component reliability can be affected by the installation environment. The sil-
ver, copper, nickel and gold films used in Seagate products are especially sensitive to the presence of sulfide,
chloride, and nitrate contaminants. Sulfur is found to be the most damaging. In addition, electronic components
should never be exposed to condensing water on the surface of the printed circuit board assembly (PCBA) or
exposed to an ambient relative humidity greater than 95 percent. Materials used in cabinet fabrication, such as
vulcanized rubber, that can outgas corrosive compounds should be minimized or eliminated. The useful life of
any electronic equipment may be extended by replacing materials near circuitry with sulfide-free alternatives.
14
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2.9
Acoustics
Drive acoustics are measured as overall A-weighted acoustic sound power levels (no pure tones). Discrete
tone penalties are added to the A-weighted sound power (LW) with the following formula only when determin-
ing compliance:
LWt(spec) == LW + 0.1Pt + 0.3 < 4.0 (Bels)
where
LW = A-weighted sound power level
pt == Value of discrete tone penalty [==dLt-6.0 (dBA)]
dLt = Tone-to-noise ratio taken in accordance with ISO 7779 at each octave band.
All measurements are consistent with ISO document 7779. Sound power measurements are taken under
essentially free-field conditions over a reflecting plane. For all tests, the drive is oriented with the cover facing
upward.)
Table 6:
Drive level acoustics
Acoustic mode
Idle
Operational
1.6 bels (typ)
2.2 bels (typ)
2.10
Electromagnetic immunity
When properly installed in a representative host system, the drive operates without errors or degradation in
performance when subjected to the radio frequency (RF) environments defined in the following table:
Table 7:
Electromagnetic immunity
Performance
level
Reference
standard
Test
Description
Radiated RF immunity
80 to 1,000 MHz, 3 V/m,
80% AM with 1 kHz sine
900 MHz, 3 V/m, 50% pulse modulation @ 200
Hz
A
EN 61000-4-3: 96
ENV 50204: 95
Electrical fast transient
Surge immunity
± 1 kV on AC mains, ± 0.5 kV on external I/O
± 1 kV differential, ± 2 kV common, AC mains
B
B
A
EN 61000-4-4: 95
EN 61000-4-5: 95
EN 61000-4-6: 97
Conducted RF immunity
150 kHz to 80 MHz, 3 Vrms, 80% AM with 1
kHz sine
Voltage dips, interrupts
0% open, 5 seconds
0% short, 5 seconds
40%, 0.10 seconds
70%, 0.01 seconds
C
C
C
B
EN 61000-4-11: 94
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2.11
Reliability
Measurement type
Specification
14
Nonrecoverable read errors
Load/Unload (LUL) cycles
1 per 10 bits read, max.
300,000 software-controlled
20,000 power loss
Power On Hours (POH) per year
Warranty
500 hours
Per agreement
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2.12
Agency certification
Safety certification
2.12.1
The drives are recognized in accordance with UL60950-1, CAN/CSA-C22.2 No.60950-1, EN60950 and IEC
60950.
2.12.2
Electromagnetic compatibility
Hard drives that display the CE mark comply with the European Union (EU) requirements specified in the Elec-
tromagnetic Compatibility Directive (89/336/EEC). Testing is performed to the levels specified by the product
standards for Information Technology Equipment (ITE). Emission levels are defined by EN 55022, Class B and
the immunity levels are defined by EN 55024.
Seagate uses an independent laboratory to confirm compliance with the EC directives specified in the previous
paragraph. Drives are tested in representative end-user systems. Although CE-marked Seagate drives comply
with the directives when used in the test systems, we cannot guarantee that all systems will comply with the
directives. The drive is designed for operation inside a properly designed enclosure, with properly shielded I/O
cable (if necessary) and terminators on all unused I/O ports. Computer manufacturers and system integrators
should confirm EMC compliance and provide CE marking for their products.
Korean RRL
If these drives have the Korea Ministry of Information and Communication (MIC) logo, they comply with para-
graph 1 of Article 11 of the Electromagnetic Compatibility control Regulation and meet the Electromagnetic
Compatibility (EMC) Framework requirements of the Radio Research Laboratory (RRL) Ministry of Information
and Communication Republic of Korea.
These drives have been tested and comply with the Electromagnetic Interference/Electromagnetic Susceptibil-
ity (EMI/EMS) for Class B products. Drives are tested in a representative, end-user system by a Korean-recog-
nized lab.
• Family name:
Lyrion Series
STX-S181 (B)
• Certificate numbers:
Australian C-Tick (N176)
If these models have the C-Tick marking, they comply with the Australia/New Zealand Standard AS/NZS3548
1995 and meet the Electromagnetic Compatibility (EMC) Framework requirements of the Australian Communi-
cation Authority (ACA).
2.12.3
European Union Restriction of Hazardous Substances (RoHS) Directive
Seagate designs its products to meet environmental protection requirements worldwide, including regulations
restricting certain chemical substances. A new law, the European Union Restriction of Hazardous Substances
(RoHS) Directive, restricts the presence of chemical substances, including Lead, Cadmium, Mercury,
Hexavalent Chromium, PBB and PBDE, in electronic products, effective July 2006. This drive is manufactured
with components and materials that comply with the RoHS Directive.
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2.12.4
2.12.4
China Restriction of Hazardous Substances (RoHS) Directive
中国限制危险物品的指令
This product has an Environmental Protection Use Period (EPUP) of 20 years. The following
table contains information mandated by China's "Marking Requirements for Control of Pollution
Caused by Electronic Information Products" Standard.
"O" indicates the hazardous and toxic substance content of the part (at the homogenous material level) is lower
than the threshold defined by the China RoHS MCV Standard.
“O"表示该部件（于同类物品程度上）所含的危险和有毒物质低于中国RoHS MCV标准所定义的门槛值。
"X" indicates the hazardous and toxic substance content of the part (at the homogenous material level) is over
the threshold defined by the China RoHS MCV Standard.
“X "表示该部件（于同类物品程度上）所含的危险和有毒物质超出中国RoHS MCV标准所定义的门槛值。
2.12.5
FCC verification
These drives are intended to be contained solely within a personal computer or similar enclosure (not attached
as an external device). As such, each drive is considered to be a subassembly even when it is individually mar-
keted to the customer. As a subassembly, no Federal Communications Commission verification or certification
of the device is required.
Seagate Technology LLC has tested this device in enclosures as described above to ensure that the total
assembly (enclosure, disc drive, motherboard, power supply, etc.) does comply with the limits for a Class B
computing device, pursuant to Subpart J, Part 15 of the FCC rules. Operation with noncertified assemblies is
likely to result in interference to radio and television reception.
Radio and television interference. This equipment generates and uses radio frequency energy and if not
installed and used in strict accordance with the manufacturer’s instructions, may cause interference to radio
and television reception.
This equipment is designed to provide reasonable protection against such interference in a residential installa-
tion. However, there is no guarantee that interference will not occur in a particular installation. If this equipment
does cause interference to radio or television, which can be determined by turning the equipment on and off,
you are encouraged to try one or more of the following corrective measures:
• Reorient the receiving antenna.
• Move the device to one side or the other of the radio or TV.
• Move the device farther away from the radio or TV.
• Plug the computer into a different outlet so that the receiver and computer are on different branch outlets.
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If necessary, you should consult your dealer or an experienced radio/television technician for additional sug-
gestions. You may find helpful the following booklet prepared by the Federal Communications Commission:
How to Identify and Resolve Radio-Television Interference Problems. This booklet is available from the Super-
intendent of Documents, U.S. Government Printing Office, Washington, DC 20402. Refer to publication num-
ber 004-000-00345-4.
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3.0
Configuring and mounting the drive
This section contains the specifications and instructions for configuring and mounting the drive.
3.1
Handling and static discharge precautions
After unpacking, and before installation, the drive may be exposed to potential handling and electrostatic
discharge (ESD) hazards. Observe the following standard handling and static-discharge precautions:
Caution:
• Do not cover or seal the breather hole! Covering or sealing the breather hole may result in loss of data.
Figure 5.
Lyrion Series breather hole location
• Keep the drive in the electrostatic discharge (ESD) bag until you are ready for installation to limit the drive’s
exposure to ESD.
• Before handling the drives, put on a grounded wrist strap, or ground yourself frequently by touching the metal
chassis of a computer that is plugged into a grounded outlet. Wear a grounded wrist strap throughout the entire
installation procedure.
• Handle the drive only by its edges or frame.
Figure 6.
Lyrion Series proper handling example
• The drive is fragile—handle it with care. Do not press down on the drive top cover or attempt to use a pen to
write on the drive’s label.
• Do not apply more than 6.8N of force to the top cover.
• Always rest the drives on a padded, antistatic surface until you mount it in the system.
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• Do not remove the factory-installed labels from the drive or cover them with additional labels. Removal voids
the warranty. Some factory-installed labels contain information needed to service the drive. Other labels are
used to seal out dirt and contamination.
• If provided, store drive in the protective casing when not in use.
• Turn the power off before installing or removing the drive.
• Do not apply any force to the drive during handling or installation.
• Do not touch the connector pins or the printed circuit board.
• Do not drop the drive.
• Do not expose the drive to wet conditions.
• Do not place the drive near a strong magnetic field.
• Do not expose the drive to extreme temperatures.
• The drive may become hot during operation. Be careful when removing the drive from the host device
immediately after operation.
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3.2
Drive installation
Follow these installation precautions when inserting the drive:
• Follow instructions for the installation of data storage devices, provided with your device’s user manual.
• Handle the drive only by its edges or frame or designated finger grip region during mounting (see Figure 6).
Figure 7.
Lyrion Series mechanical dimensions—top, side and end view
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Figure 8.
Lyrion Series FPC dimensions
3.3
Mounting considerations
• Use an elastic mounting material to protect drives so as to ensure that more shock can be absorbed.
• There are guides along the side for mounting. Refer to figure on areas (refer to Figure 9, shaded area)
where the mounting material can rest for mounting.
• As the drive is a sensitive device, it is not recommended to have any mounting force on the top and bottom
surface of the drive other than the recommended mounting surfaces. Mounting force on non recommended
surfaces shall not exceed 6.8N.”
• The drive can be operated in any orientation but horizontal or vertical orientation is preferred.
• Allow a minimum clearance of 0.012 inches (0.30 mm) around the entire perimeter of the drive for cooling,
with the exception of the mounting edges for better airflow.
• In case the system design warrants bending of the FPC to the hard disc drive, care should be taken to
maximize the radius.
• Mounting materials are available from many third-party vendors.
• The 18-way connector is design to meet minimum 6N Horizontal FPC retention after mating.
• The connector has a specification of 20 insertion cycles.
Figure 9.
Lyrion Series Area for Protective Mounting
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4.0
Interface description
The drives use the CE-ATA interface.
4.1
Interface signals and connector pins
The following table summarizes the signals on the 18-way ZIF CE-ATA interface connector.
Table 8:
18-way ZIF (CE-ATA interface) connector signals
Pin number
Signal Name
VSS
Definition
1
Ground
2
DAT2
Data line 02
3
DAT3
Data line 03
4
VSS
Ground
5
DAT4
Data line 04
6
DAT5
Data line 05
7
Supply Voltage
CMD
Supply voltage (Standard): 3.3V +/- 5%
8
Command line
9
Interface Voltage
CLK
Interface voltage reference (Dual range): 1.65V to 1.95V and 2.7V to 3.6V
10
11
12
13
14
15
16
17
18
Clock line, up to 52 MHz
Ground
VSS
DAT6
Data line 06
Data line 07
Ground
DAT7
VSS
DAT0
Data line 00
Data line 01
Ground
DAT1
VSS
Reserved
Reserved for future use
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4.2
Supported command set and features
This section describes the MMC level commands supported by the drive followed the supported reduced ATA
command set and a description of the supported Status and Control Registers (SCR).
4.2.1
MMC command set
The following table lists the supported and essential MMC command set for initializing, status checking, error
handling, and transferring data. For a detailed description of these commands, refer to the MMC System Spec-
ification v 4.0 available to MMCA members under NDA.
Table 9:
MMC command set
Command
Index
Command Name
GO_IDLE_STATE
SEND_OP_COND
ALL_SEND_CID
SET_RELATIVE_ADDR
SWITCH
Command Description
CMD0
CMD1
CMD2
CMD3
CMD6
Hard resets the drive to MMC idle state
Requests OCR contents in response from the drive
Requests CID in response from the drive
Assign relative address to the drive
Switch mode of operation, modify the EXT_CSD register
Toggles the MMC standby and MMC transfer states or the MMC
programming and MMC disconnected states
CMD7
SELECT/DESELECT CARD
CMD8
SEND_EXT_CSD
SEND_CSD
Request the drive to send its EXT_CSD register as a block of data
Requests CSD in response from the drive
CMD9
CMD10
CMD12
CMD13
CMD16
CMD39
CMD60
CMD61
SEND_CID
Requests CID in response from the drive
STOP_TRANSMISSION
SEND_STATUS
SET_BLOCKLEN
FAST_IO
Forces the drive to stop MMC transmission
Requests the drive to send its MMC status in the response
Sets the MMC transfer block length for data transfers.
Write or Read 8 bit register data.
RW_MULTIPLE_REGISTER Read or Write ATA register data and SCR register data.
RW_MULTIPLE_BLOCK
Transfer data for the ATA command requested by CMD60
4.2.2
Reduced ATA command set
The following table lists CE-ATA defined reduced ATA command set. For a detailed description of these com-
Table 10: Supported commands
Command opcode
Command name
Read DMA EXT
Write DMA EXT
Standby Immediate
Flush Cache EXT
Identify Device
Command description
25h
35h
E0h
EAh
ECh
Reads data from the drive in logical blocks
Writes data to the drive in logical blocks
Spins down the drive to enter its standby state
Flushes buffered data from the drive's cache to the media
Transfers information about the drive to the host
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Identify Device command
The Identify Device command returns a single block of data (512 bytes or 256 words) to the host, the relevant
contents per the CE-ATA specification of which are as shown in the following table
Table 11:
Identify Device commands
Word
10-19
23-26
Description
Value
Serial number: (20 ASCII characters)
Firmware revision (8 ASCII characters)
Drive serial number
Current firmware revision
(ASCII) ST730212CA (for 30GB)
(ASCII) ST760211CA (for 60GB)
27-46
Drive model number (40 ASCII characters)
Major version number
Bit 15
: Set to 1
80
Bits 14-2 : Reserved (0)
8002h
Bit 1
Bit 0
: 1 = supports CE-ATA version 1.0
: Set to 0
37E3E3Fh (for 30GB)
6FC7C7Fh (for 60GB)
100-103
106
Maximum user LBA
CE-ATA sector size
000Ch
0000h
CE-ATA Features
206
Bits15-0 : Reserved (0)
Integrity word
255
Bits 15-8 : Checksum (as defined in ATA)
Bits 7-0 : Signature (as defined in ATA)
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4.2.3
Status and Control Registers
The Status and Control Registers (SCR) start at MMC register address 80h and can be accessed only by using
CMD60 (RW_MULTIPLE_REGISTER) to read or write to them. The following SCR have been defined (RO =
The register may be read only, RW = The register may be read or written to).
Table 12: Status and Control Registers
Index
Byte Address
Name
R/W
RO
RO
RO
RO
RW
Description
0
80h
84h
88h
98h
C0h
scrTempC
Current temperature reading
Peak maximum temperature reading
Peak minimum temperature reading
Capabilities and features of the drive
Control capabilities of the drive
1
scrTempMaxP
scrTempMinP
scrCapabilites
scrControl
2
6
16
The detailed description of each registers is as follows:
Byte
Address
Name
Detailed description
80h
scrTempC
Bit 31 : Set to 1 (This register is supported)
Bit 30 : If set to 1, indicates the values in bits 29-0 are valid
If cleared to 0, indicates the values in bits 29-0 are invalid
Bits 29-16 : Reserved (0)
Bits 15-0 : Two's complement value of the number of degrees Celsius
84h
88h
98h
scrTempMaxP
scrTempMinP
scrCapabilites
Bit 31 : Set to 1 (This register is supported)
Bit 30 : If set to 1, indicates the values in bits 29-0 are valid
If cleared to 0, indicates the values in bits 29-0 are invalid
Bits 29-16 : Reserved (0)
Bits 15-0 : Two's complement value of the number of degrees Celsius
Bit 31 : Set to 1 (This register is supported)
Bit 30 : If set to 1, indicates the values in bits 29-0 are valid
If cleared to 0, indicates the values in bits 29-0 are invalid
Bits 29-16 : Reserved (0)
Bits 15-0 : Two's complement value of the number of degrees Celsius
Bit 31 : Set to 1 (This register is supported)
Bit 30 : If set to 1, indicates the values in bits 29-0 are valid
If cleared to 0, indicates the values in bits 29-0 are invalid
Bits 29-3 : Reserved (0)
Bit 2 : Cleared to 0 (MMC data block size of 4KB is not supported)
Bit 1 : Cleared to 0 (MMC data block size of 1KB is not supported)
Bit 0 : Set to 1 (MMC data block size of 512 bytes is supported)
C0h
scrControl
Bit 31 : Set to 1 (This register is supported)
Bit 30 : If set to 1, indicates the values in bits 29-0 are valid
If cleared to 0, indicates the values in bits 29-0 are invalid
Bits 29-2 : Reserved (0)
Bits 1-0 : 00b (Default value, MMC data block size is 512 bytes)
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5.0
Seagate Technology support services
Internet
For information regarding Seagate products and services, visit www.seagate.com. Worldwide support is
available 24 hours daily by email for your questions.
Presales Support:
Technical Support:
Warranty Support:
mySeagate
my.seagate.com is the industry's first Web portal designed specifically for OEMs and distributors. It provides
self-service access to critical applications, personalized content and the tools that allow our partners to
manage their Seagate account functions. Submit pricing requests, orders and returns through a single,
password-protected Web interface-anytime, anywhere in the world.
spp.seagate.com
spp.seagate.com supports Seagate resellers with product information, program benefits and sales tools. You
may register for customized communications that are not available on the web. These communications contain
product launch, EOL, pricing, promotions and other channel-related information. To learn more about the
benefits or to register, go to spp.seagate.com, any time, from anywhere in the world.
Seagate Service Centers
Presales Support
Our Presales Support staff can help you determine which Seagate products are best suited for your specific
application or computer system, as well as product availability and compatibility.
Technical Support
Seagate technical support is available to assist you online at support.seagate.com or through one of our call
centers. Have your system configuration information and your “ST” model number available.
SeaTDD™ (+1-405-324-3655) is a telecommunications device for the deaf (TDD). You can send questions or
comments 24 hours daily and exchange messages with a technical support specialist during normal business
hours for the call center in your region.
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Customer Service Operations
Warranty Service
Seagate offers worldwide customer support for Seagate products. Seagate distributors, OEMs and other direct
customers should contact their Seagate Customer Service Operations (CSO) representative for warranty-
related issues. Resellers or end users of drive products should contact their place of purchase or Seagate
warranty service for assistance. Have your serial number and model or part number available.
Data Recovery Services
Seagate offers data recovery services for all formats and all brands of storage media. Our data recovery
services labs are currently located throughout the world. . Additional information, including an online request
form and data loss prevention resources, is available at http://services.seagate.com/index.aspx
Authorized Service Centers
Seagate Service Centers are available on a global basis for the return of defective products. Contact your
customer support representative for the location nearest you.
USA/Canada/Latin America support services
For an extensive list of telephone numbers to technical support, presales and warranty service in USA/
Global Customer Support
Data Recovery Services
Call Center
USA, Canada,
and Mexico
Toll-free
1-800-475-01435
Direct dial
+1-905-474-2162
FAX
1-800-475-0158
+1-905-474-2459
Europe, the Middle East and Africa Support Services
For an extensive list of telephone numbers to technical support, presales and warranty service in Europe, the
Asia/Pacific Support Services
For an extensive list of telephone numbers to technical support, presales and warranty service in Asia/Pacific,
Publication feedback survey
We are interested in your comments and suggestions regarding this publication. Please take a few minutes to
participate in our survey at the following URL:
Thank you for your time and comments.
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Index
A
F
acoustics 15
features 26
frequency 15
altitude 11
G
H
B
BPI 6
handling 21
heads 1
height 6
humidity 11
C
I
interface 6
interference 18
Introduction 1
certification 17
compliance 17
consumption 8
C-Tick 17
K
D
density 6
L
length 6
disclaimer 2
E
M
enclosures 18
EPRML 1
errors 16
N
noise 9
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specifications 3
Spinup 8
Standby/Sleep 8
subassembly 18
O
P
pins 25
T
temperature 11
tort 2
precautions 23
V
Vibration 12
voltage 9
R
W
Warranty 16
warranty 2
reliability 16
weight 6
width 6
resistance 9
RF 15
S
SeaTools 1
sectors 5
shock 12
signals 25
sound 15
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Seagate Technology LLC
920 Disc Drive, Scotts Valley, California 95066-4544, USA
Publication Number: 100441950, Rev. A, Printed in U.S.A.
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