Renesas Switch HD74HC1G66 User Guide

HD74HC1G66  
Analog Switch  
REJ03D0188–0800Z  
(Previous ADE-205-314F (Z))  
Rev.8.00  
Jan.27.2004  
Description  
The HD74HC1G66 is high-speed CMOS analog switch using silicon gate CMOS process. With CMOS  
low power dissipation, it provides high speed. The device has low ON resistance for good transfer  
characteristics and can take wide range of input voltage.  
Features  
The basic gate function is lined up as Renesas uni logic series.  
Supplied on emboss taping for high-speed automatic mounting.  
Electrical characteristics equivalent to the HD74HC4066  
Supply voltage range : 2 to 6 V  
Operating temperature range : –40 to +85°C  
Ordering Information  
Part Name  
Package Type  
Package Code  
Package  
Abbreviation  
Taping Abbreviation  
(Quantity)  
HD74HC1G66CME CMPAK-5 pin  
CMPAK-5A  
CM  
E (3,000 pcs/reel)  
Rev.8.00, Jan.27.2004, page 1 of 8  
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HD74HC1G66  
Absolute Maximum Ratings  
Item  
Symbol  
Ratings  
–0.5 to 7.0  
–0.5 to VCC + 0.5  
–0.5 to VCC + 0.5  
±20  
Unit  
V
Test Conditions  
Supply voltage range  
Input voltage range *1  
Output voltage range *1, 2  
Input clamp current  
Output clamp current  
Continuous output current  
VCC  
VI  
V
VO  
IIK  
V
Output : H or L  
VI < 0 or VI > VCC  
VO < 0 or VO >VCC  
VO = 0 to VCC  
mA  
mA  
mA  
mA  
IOK  
IO  
CC or IGND  
±20  
±25  
Continuous current through  
VCC or GND  
I
±25  
Maximum power dissipation  
at Ta = 25°C (in still air) *3  
PT  
200  
mW  
Storage temperature  
Tstg  
–65 to 150  
°C  
Notes:  
The absolute maximum ratings are values, which must not individually be exceeded, and  
furthermore, no two of which may be realized at the same time.  
1. The input and output voltage ratings may be exceeded if the input and output clamp-current  
ratings are observed.  
2. This value is limited to 5.5 V maximum.  
3. The maximum package power dissipation was calculated using a junction temperature of 150°C.  
Recommended Operating Conditions  
Item  
Symbol  
VCC  
Min  
2
Max  
6
Unit  
V
Test Conditions  
Supply voltage range  
Input voltage range  
Output voltage range  
VI/O  
0
VCC  
VCC  
1000  
500  
400  
85  
V
VO  
0
V
Input rise / fall time  
(Control input 10% to 90%)  
tr, tf  
0
ns  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
0
0
Operating temperature  
Ta  
–40  
°C  
Note: Unused or floating control inputs must be held high or low.  
Rev.8.00, Jan.27.2004, page 3 of 8  
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HD74HC1G66  
Electrical Characteristics  
VCC  
Ta = 25°C  
Ta = –40 to 85°C  
Item  
Symbo (V)  
Unit Test Conditions  
Min  
1.5  
3.15  
4.2  
Typ  
Max  
Min  
1.5  
3.15  
4.2  
Max  
Input voltage  
VIH  
2.0  
4.5  
6.0  
2.0  
4.5  
6.0  
2.0  
4.5  
6.0  
2.0  
4.5  
6.0  
6.0  
V
Control input only  
VIL  
0.5  
0.5  
1.35  
1.8  
1.35  
1.8  
On resistance  
RON  
200  
90  
450  
160  
130  
1500  
200  
170  
±0.1  
550  
180  
140  
2000  
250  
210  
±1.0  
VC = VIH  
VIN = VCC or GND  
IT = 1 mA  
80  
Peak on  
resistance  
RON (p)  
IS (off)  
600  
125  
100  
VC = VIH  
VIN = 0 to VCC  
IIN/OUT = 1 mA  
Leak current  
µA  
VC = VIL  
VIN = VCC, VOUT = GND  
or VIN = GND,  
VOUT = VCC  
IS (on)  
6.0  
±0.1  
±1.0  
µA  
VC = VIH  
VIN = VCC or GND  
Input current  
IIN  
6.0  
6.0  
±0.1  
1.0  
±1.0  
10.0  
µA  
VIN = VCC or GND  
VIN = VCC or GND  
Operating  
current  
ICC  
µA  
Rev.8.00, Jan.27.2004, page 4 of 8  
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HD74HC1G66  
Switching Characteristics  
VCC  
Symbol (V)  
Ta = 25°C  
Ta = –40 to 85°C  
Item  
Unit  
Test Conditions  
Min  
Typ Max Min Max  
Propagation delay time tPLH  
,
2.0  
4.5  
6.0  
2.0  
4.5  
6.0  
2.0  
4.5  
6.0  
2.0  
4.5  
6.0  
4
50  
10  
9
65  
13  
11  
145  
29  
25  
145  
29  
25  
ns  
RL = 10 kΩ  
tPHL  
10  
14  
20  
30  
30  
2.5  
Output enable time  
Output disable time  
tZH, tZL  
115  
23  
20  
115  
23  
20  
5
ns  
RL = 1 kΩ  
tHZ, tLZ  
ns  
RL = 1 kΩ  
Maximum control  
frequency  
MHz  
pF  
Control input  
capacitance  
CIN  
5
Switch I/O capacitance CIN/OUT  
2.5  
0.5  
pF  
pF  
Feed through  
capacitance  
CIN–OUT  
Power dissipation  
capacitance  
CPD  
5
pF  
(CL = 50 pF, tr = tf = 6 ns)  
Rev.8.00, Jan.27.2004, page 5 of 8  
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HD74HC1G66  
Test Circuit  
R  
ON  
VCC  
VC = VIH  
VCC  
(ON)  
GND  
VIN-OUT  
10–3  
VIN = VCC  
VOUT  
RON  
=
(Ω)  
1.0 mA  
+
V
V
IN-OUT  
I (off), I (on)  
S
S
VCC  
VCC  
VC = VIL  
VC = VIL  
VCC  
(OFF)  
GND  
VCC  
(ON)  
GND  
A
A
VOUT = GND  
or VCC  
VOUT  
OPEN  
VIN = VCC  
or GND  
VIN = VCC  
or GND  
t
, t  
PLH PHL  
VCC  
tr = 6 ns  
tf = 6 ns  
VC = VIH  
VCC  
90% 90%  
50% 50%  
tPLH  
VIN  
10%  
VCC  
(ON)  
GND  
10%  
tPHL  
GND  
VOH  
VIN  
VOUT  
RL =  
10 k  
CL =  
VOUT  
50 pF  
50%  
50%  
VOL  
Rev.8.00, Jan.27.2004, page 6 of 8  
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HD74HC1G66  
t
, t / t , t  
ZH ZL HZ LZ  
VCC  
tr = 6 ns  
tf = 6 ns  
VC  
RL =  
VCC  
GND  
VOH  
1 k  
90% 90%  
50% 50%  
VC  
VCC  
VIN  
VOUT  
CL =  
10%  
10%  
tHZ  
S1  
S2  
tZH  
GND  
RL =  
1 kΩ  
50 pF  
90%  
50%  
50%  
Waveform - A  
VOUT  
GND  
VCC  
Item  
tZH  
tZL  
S1  
S2  
tZL  
tLZ  
VCC  
GND  
VCC  
Waveform - B  
GND  
VCC  
10%  
VOL  
tHZ  
tLZ  
GND  
VCC  
GND  
Notes: 1. Waveform - A is for an output with internal conditions such that the output is high  
except when disabled by the output control.  
2. Waveform - B is for an output with internal conditions such that the output is low  
except when disabled by the output control.  
Maximum control frequency  
VCC  
VC  
VCC  
GND  
VC  
VCC  
VOUT  
VIN = VCC  
RL =  
CL =  
GND  
1 k  
15 pF  
VOUT  
VCC/2  
C  
, C  
IN/OUT IN-OUT  
CIN-OUT  
VCC  
VC = GND  
VCC  
(OFF)  
GND  
CIN/OUT  
CIN/OUT  
Rev.8.00, Jan.27.2004, page 7 of 8  
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HD74HC1G66  
Package Dimensions  
Unit: mm  
1.3 ± 0.2  
+ 0.1  
– 0.05  
(0.65)  
(0.65)  
0.15  
0 – 0.1  
5 – 0.2 ± 0.05  
2.0 ± 0.2  
Package Code  
JEDEC  
CMPAK–5V  
JEITA  
Mass (reference value)  
Conforms  
0.006 g  
Rev.8.00, Jan.27.2004, page 8 of 8  
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Keep safety first in your circuit designs!  
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble  
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.  
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary  
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.  
Notes regarding these materials  
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's  
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.  
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diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.  
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therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product  
information before purchasing a product listed herein.  
The information described here may contain technical inaccuracies or typographical errors.  
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.  
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor  
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© 2004. Renesas Technology Corp., All rights reserved. Printed in Japan.  
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