Renesas Computer Hardware BP 272 User Guide

SH7058 Group BP-272  
User System Interface Board  
HS7058ECB61H User’s Manual  
Renesas Microcomputer Development Environment System  
SuperHTM Family/SH7050 Series  
Rev.3.00  
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2004.3.1  
IMPORTANT INFORMATION  
READ FIRST  
• READ this user's manual before using this user system interface board.  
• KEEP the user's manual handy for future reference.  
Do not attempt to use the user system interface board until you fully understand its  
mechanism.  
User System Interface Board:  
Throughout this document, the term "user system interface board" shall be defined as the  
following product produced only by Renesas Technology Corp. excluding all subsidiary products.  
User system interface board (HS7058ECB61H)  
The user system or a host computer is not included in this definition.  
Purpose of the User System Interface Board:  
This user system interface board is for connecting the evaluation chip board and user system.  
This user system interface board must only be used for the above purpose.  
Improvement Policy:  
Renesas Technology Corp. (including its subsidiaries, hereafter collectively referred to as  
Renesas) pursues a policy of continuing improvement in design, performance, functions, and  
safety of the user system interface board. Renesas reserves the right to change, wholly or  
partially, the specifications, design, user's manual, and other documentation at any time without  
notice.  
Target User of the User System Interface Board:  
This user system interface board should only be used by those who have carefully read and  
thoroughly understood the information and restrictions contained in the user's manual. Do not  
attempt to use the user system interface board until you fully understand its mechanism.  
It is highly recommended that first-time users be instructed by users that are well versed in the  
operation of the user system interface board.  
I
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LIMITED WARRANTY  
Renesas warrants its user system interface boards to be manufactured  
in accordance with published specifications and free from defects in  
material and/or workmanship. Renesas will repair or replace any  
user system interface boards determined to be defective in material  
and/or workmanship. User system interface boards are wearing parts  
which Renesas will not repair or replace if damaged and/or worn  
through use. The foregoing shall constitute the sole remedy for any  
breach of Renesas’ warranty. This warranty extends only to you, the  
original Purchaser. It is not transferable to anyone who subsequently  
purchases the user system interface board from you. Renesas is not  
liable for any claim made by a third party or made by you for a third  
party.  
DISCLAIMER  
RENESAS MAKES NO WARRANTIES, EITHER EXPRESS OR  
IMPLIED, ORAL OR WRITTEN, EXCEPT AS PROVIDED  
HEREIN, INCLUDING WITHOUT LIMITATION THEREOF,  
WARRANTIES AS TO MARKETABILITY, MERCHANTABILITY,  
FITNESS FOR ANY PARTICULAR PURPOSE OR USE, OR  
AGAINST INFRINGEMENT OF ANY PATENT. IN NO EVENT  
SHALL RENESAS BE LIABLE FOR ANY DIRECT, INCIDENTAL  
OR CONSEQUENTIAL DAMAGES OF ANY NATURE, OR  
LOSSES OR EXPENSES RESULTING FROM ANY DEFECTIVE  
USER SYSTEM INTERFACE BOARD, THE USE OF ANY USER  
SYSTEM INTERFACE BOARD, OR ITS DOCUMENTATION,  
EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.  
EXCEPT AS EXPRESSLY STATED OTHERWISE IN THIS  
WARRANTY, THIS USER SYSTEM INTERFACE BOARD IS SOLD  
"AS IS ", AND YOU MUST ASSUME ALL RISK FOR THE USE  
AND RESULTS OBTAINED FROM THE USER SYSTEM  
INTERFACE BOARD.  
II  
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State Law:  
Some states do not allow the exclusion or limitation of implied warranties or liability for  
incidental or consequential damages, so the above limitation or exclusion may not apply to you.  
This warranty gives you specific legal rights, and you may have other rights which may vary from  
state to state.  
The Warranty is Void in the Following Cases:  
Renesas shall have no liability or legal responsibility for any problems caused by misuse,  
abuse, misapplication, neglect, improper handling, installation, repair or modifications of the user  
system interface board without Renesas’ prior written consent or any problems caused by the user  
system.  
All Rights Reserved:  
This user's manual and user system interface board are copyrighted and all rights are reserved  
by Renesas. No part of this user's manual, all or part, may be reproduced or duplicated in any  
form, in hard-copy or machine-readable form, by any means available without Renesas’ prior  
written consent.  
Other Important Things to Keep in Mind:  
1. Circuitry and other examples described herein are meant merely to indicate the characteristics  
and performance of Renesas’ semiconductor products. Renesas assumes no responsibility for  
any intellectual property claims or other problems that may result from applications based on  
the examples described herein.  
2. No license is granted by implication or otherwise under any patents or other rights of any third  
party or Renesas.  
Figures:  
Some figures in this user's manual may show items different from your actual system.  
Limited Anticipation of Danger:  
Renesas cannot anticipate every possible circumstance that might involve a potential hazard.  
The warnings in this user's manual and on the user system interface board are therefore not all  
inclusive. Therefore, you must use the user system interface board safely at your own risk.  
III  
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SAFETY PAGE  
READ FIRST  
• READ this user's manual before using this user system interface board.  
• KEEP the user's manual handy for future reference.  
Do not attempt to use the user system interface board until you fully understand its  
mechanism.  
DEFINITION OF SIGNAL WORDS  
This is the safety alert symbol. It is used to alert you to potential personal  
injury hazards. Obey all safety messages that follow this symbol to avoid  
possible injury or death.  
DANGER  
DANGER indicates an imminently hazardous situation which, if not  
avoided, will result in death or serious injury.  
WARNING  
WARNING indicates a potentially hazardous situation which, if not  
avoided, could result in death or serious injury.  
CAUTION  
CAUTION indicates a potentially hazardous situation which, if not  
avoided, may result in minor or moderate injury.  
CAUTION  
CAUTION used without the safety alert symbol indicates a  
potentially hazardous situation which, if not avoided, may result  
in property damage.  
NOTE emphasizes essential information.  
IV  
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WARNING  
Observe the precautions listed below. Failure to do so  
will result in a FIRE HAZARD and will damage the user  
system and the emulator product or will result in  
PERSONAL INJURY. The USER PROGRAM will be  
LOST.  
1. Do not repair or remodel the emulator product by  
yourself for electric shock prevention and quality  
assurance.  
2. Always switch OFF the E6000H emulator and user system  
before connecting or disconnecting any CABLES or  
PARTS.  
3. Always before connecting any BOARDS, make sure that  
pin 1 on both sides are correctly aligned.  
V
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Preface  
The HS7058ECB61H is a user system interface board that connects a user system for the SH7058  
BP-272 package to the SH7058 E6000H emulator (HS7058EPH60H).  
i
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Contents  
Section 1 Configuration.....................................................................................1  
Section 2 Connection Procedures......................................................................3  
2.1 Connecting User System Interface Board to User System ................................................3  
2.1.1 Installing IC Socket..............................................................................................3  
2.1.2 Fastening IC Socket Connector............................................................................6  
2.2 Exchanging the Spacer of the EV-Chip Board..................................................................7  
2.3 Connecting User System Interface Board to EV-Chip Board ...........................................8  
2.4 Recommended Dimensions for User System Mount Pad (Footprint) ...............................10  
2.5 Dimensions for EV-Chip Board and User System Interface Board...................................11  
2.6 Resulting Dimensions after Connecting User System Interface Board .............................12  
Section 3 Verifying Operation...........................................................................13  
Section 4 Notice.................................................................................................15  
ii  
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Section 1 Configuration  
Figure 1 and table 1 show the configuration and components of the user system interface board for  
the BP-272 package. Please make sure you have all of these components when unpacking.  
EV-chip board  
Spacer  
Screws (M2 x 8 mm)  
Board  
Pin 1  
IC socket  
User system  
Figure 1 User System Interface Board for the SH7058 BP-272 Package  
1
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CAUTION  
Use a TQPACK256RD socket and CSPACK256Z202H01  
(manufactured by Tokyo Eletech Corporation) for the  
BP-272 package IC socket and IC socket connector on the  
user system.  
Table 1  
HS7058ECB61H Components  
No. Component  
Quantity  
Remarks  
1
2
Board  
1
1
IC socket  
For the BP-272 package (installed on the user  
system): CSPACK256Z2021H01  
3
4
5
6
7
8
9
Spacer  
1
1
4
1
4
For installing a BP-272 packaged MCU  
For installing a BP-272 packaged MCU  
For installing a BP-272 packaged MCU  
Dedicated screwdriver to fasten the screws.  
Cover  
Screws (M2 x 8 mm)  
Driver  
Guide pins  
Spacers (2.6MP x 25 mm) 2  
User’s manual  
1
User’s manual for HS7058ECB61H (this manual)  
2
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Section 2 Connection Procedures  
Connecting User System Interface Board to User System  
WARNING  
2.1  
Always switch OFF the user system and the emulator  
product before the USER SYSTEM INTERFACE CABLE  
is connected to or removed from any part. Before  
connecting, make sure that pin 1 on both sides are correctly  
aligned. Failure to do so will result in a FIRE HAZARD and  
will damage the user system and the emulator product or  
will result in PERSONAL INJURY. The USER PROGRAM will  
be LOST.  
To connect the cable head to the user system, follow the instructions below.  
2.1.1 Installing IC Socket  
Install the socket for BP-272 packaged ICs on the user system.  
(1) Gently apply solder to the BGA pads of the user system. Be careful to keep the thickness of  
the solder within 100 to 150 µm. Too much solder will cause short-circuiting of the pins.  
(2) The IC socket is vacuum-packed to avoid oxidization of the surfaces of the solder balls. It  
is thus recommended that the IC socket be installed on the user system immediately after  
the package is opened. After the package’s seal has been broken, store the socket in a  
desiccator. Do not touch the solder balls. If they are touched, solder may not adhere to the  
solder surface.  
The IC socket is covered by a protective cover. Socket and cover are fastened together by  
four screws before the whole is vacuum packed to prevent bending of the IC socket’s pins.  
To avoid the scattering (dispersal) of flux from other components to the IC socket, keep the  
protective cover on the IC socket until solder reflow has been completed.  
(3) Install the provided guide pins into the holes for the guide pins on the user system. Check  
that the pads are correctly aligned with the IC socket.  
3
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(4) Notes on soldering the IC socket  
a) The IC socket is larger than the actual IC package; therefore, refer to figure 4 for the  
installation of other components.  
b) Do not install components that occupy large volume close to the IC socket. Such  
components will prevent the convective flow of heat during reflow.  
c) Since the IC socket has a greater volume than the IC package, it is recommended that  
the temperature profile under the conditions used in installation be measured by  
attaching a temperature sensor to the back side of the IC socket.  
d) Actual heating of the reflow conditions for the IC socket must be more than 210°C for  
30 to 60 seconds.  
Recommended Reflow Conditions  
Surface temperature of IC-socket connector  
Preheating: 150 to 180°C for 180 seconds  
Actual heating: To more than 210°C, for 30 to 60  
seconds  
4
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CAUTION  
1. Never dip the IC socket in flux or use wash to clean the IC  
socket. This is because flux may remain inside the IC  
socket due to the IC socket’s structure. When using the  
IC socket with other DIP products, never clean the other  
DIP products with flux because the flux may enter the  
connector through the guide pins of the IC socket.  
2. When an IC socket with guide pins is soldered to the  
user system, about 1.3 mm of the guide pins will stick out  
(when the user-system board is 1.6 mm thick). When a  
load is applied to the guide pins from the back of the  
user-system board, stress will be applied to the soldered  
part of the IC socket, and this may destroy the  
connectors. Do not apply any load to the guide pins after  
the IC socket has been soldered on the user system.  
3. When an IC socket with no guide pins is soldered to the  
user system, the soldered part will crack if stress is  
applied to the IC socket. Therefore, always apply  
adhesive to the connector and the user system so that  
there is a firm connection between them.  
4. When the IC socket has guide pins, it is recommended  
that epoxy resin adhesive or solder be applied to the  
guide pins at the back of the user system to make sure  
that no stress is applied to the soldered part.  
5
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2.1.2  
Fastening IC Socket Connector  
CAUTION  
1. Check the location of pin 1 before inserting.  
2. Use a provided screwdriver.  
3. Stop tightening when the force required to turn the screw  
becomes significantly greater than that needed when first  
tightening. If a screw is tightened too much, the screw  
head may break or an IC socket contact error may be  
caused by a crack in the IC socket solder.  
4. If the emulator does not operate correctly, cracks might  
have occurred in the solder. Check conduction with  
a tester and re-solder the IC socket if necessary.  
Fasten the user system interface board to the IC socket and the IC socket connector on the user  
system with four screws (M2 x 8 mm) provided.  
Take special care, such as manually securing the IC socket soldered area, to prevent the soldered  
IC socket from being damaged by twisting the components.  
Screws (M2 x 8 mm)  
Board  
Pin 1  
Guide pin  
IC socket  
(Tokyo Eletech Corporation  
Guide hole  
CSPACK256Z2021H01)  
User system  
Figure 2 Connecting User System Interface Board to User System  
6
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2.2  
Exchanging the Spacer of the EV-Chip Board  
While the user system interface board is connected to the user system, force must not applied to  
the user system.  
Exchange the spacer (2.6MP x 10 mm) of the EV-chip board with another spacer (2.6MP x 25  
mm) provided for the user system interface board.  
EV-chip board  
Spacer  
(2.6MP x 25 mm)  
Figure 3 Exchanging the Spacer  
7
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2.3  
Connecting User System Interface Board to EV-Chip Board  
WARNING  
Observe the precautions listed below. Failure to do so  
will result in a FIRE HAZARD and will damage the user  
system and the emulator product or will result in  
PERSONAL INJURY. The USER PROGRAM will be  
LOST.  
1. Always switch OFF the user system and the emulator  
product before the USER SYSTEM INTERFACE BOARD  
is connected to or removed from any part. Before  
connecting, make sure that pin 1 on both sides are  
correctly aligned.  
2. The user system interface board dedicated to the  
emulator must be used.  
1. Make sure the user system and emulator are turned off.  
2. Align the connectors on the board with those on the EV-chip board according to their numbers  
(figure 4).  
3. Adjust the height of the spacer of the EV-chip board with the user system.  
8
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EV-chip board  
Connector No.  
EV-Chip Board  
Connector No.  
Board  
Connector No.  
UCN1  
UCN2  
UCN1  
UCN2  
Board  
Figure 4 Connecting User System Interface Board to EV-Chip Board  
9
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2.4  
Recommended Dimensions for User System Mount Pad (Footprint)  
Figure 5 shows the recommended dimensions for the mount pad (footprint) for the user system  
with an IC socket for an BP-272 package (CSPACK256Z2021H01: manufactured by Tokyo  
Eletech Corporation). Note that the dimensions in figure 6 are somewhat different from those of  
the actual chip's mount pad.  
23.0 ± 0.03  
21.3  
1.0 x 19 = 19.0  
1.0  
4-Ø1.3  
Unit: mm  
Through hole  
Ø0.5  
Figure 5 Recommended Dimensions for Mount Pad  
10  
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2.5  
Dimensions for EV-Chip Board and User System Interface Board  
The dimensions for the EV-chip board and the user system interface board are shown in figure 6.  
120.0  
8.0  
5.0  
Spacer  
EV-chip board  
100.0  
84.0  
16.0  
8.0  
50.0  
65.0  
70.0  
Top view  
Unit: mm  
Tolerance: ±0.5 mm  
Figure 6 Dimensions for EV-Chip Board and User System Interface Board  
11  
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2.6  
Resulting Dimensions after Connecting User System Interface Board  
The resulting dimensions, after connecting the user system interface board to the user system, are  
shown in figure 7.  
EV-chip board  
65.0  
IC socket  
(Tokyo Eletech Corporation  
CSPACK256Z2021H01)  
User system  
Spacer (φ6.0)  
65.0  
Unit: mm  
Tolerance: ±1.0 mm  
Figure 7 Resulting Dimensions after Connecting User System Interface Board  
12  
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Section 3 Verifying Operation  
1. Turn on the emulator according to the procedures described in the SH7058 E6000H Emulator  
User's Manual (HS7058EPH60HE).  
2. Verify the user system interface cable connections by checking the pin states with the extended  
monitor and checking the bus states with the FILL command (emulator command). If an error  
is detected, recheck the soldered IC socket and the location of pin 1.  
3. The emulator connected to this user system interface board supports three kinds of clock  
sources as the MCU clock. For details, refer to the SH7058 E6000H Emulator User's Manual  
(HS7058EPH60HE).  
To use the emulator internal clock  
Select the clock in the emulator by the CLOCK command (emulator command).  
To use the external clock on the user system  
Supply the external clock from the user system to the emulator by inputting the EXTAL pin  
(pin A14) on the user system interface board or connecting the crystal oscillator to the  
XTAL (pin A15) and EXTAL pins. For details, refer to section 5, Clock Pulse Generator  
(CPG), in the SH7058 Hardware Manual.  
Figure 8 shows the clock oscillator on the user system interface board.  
HCU04  
1 M  
HCU04 HCU04  
HCU04  
HCU04  
0 Ω  
To E6000H  
emulator  
HCU04  
270 Ω  
EXTAL XTAL  
System clock  
Figure 8 Clock Oscillator  
13  
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To use the crystal oscillator mounted on the EV-chip board  
Install a crystal oscillator into the crystal oscillator terminals on the EV-chip board.  
Enlarged  
view  
Crystal  
oscillator  
X1  
X2  
Crystal oscillator terminals  
EV-chip board  
Figure 9 Installing the Clock Oscillator  
14  
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Section 4 Notice  
1. The MCU cannot be installed directly into the IC socket provided for connecting this user  
system interface board.  
2. Before connecting any parts or cables, make sure that pin 1 on the both sides are correctly  
aligned.  
3. Do not apply excessive force to the user system interface board while it is connected to the  
user system.  
4. The dimensions of the recommended mount pad for the IC socket for this user system  
interface board are different from those of the MCU.  
5. This user system interface board is specifically designed for the HS7058EPH60H emulator.  
Do not use this board with any other emulator.  
6. When power is not supplied to the Vcc pin on the user system interface board, the emulator  
displays ** VCC DOWN. The emulator will not operate correctly.  
15  
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SH7058 Group BP-272  
User System Interface board  
HS7058ECB61H User's Manual  
Publication Date: Rev.2.00, November 20, 2003  
Rev.3.00, March 1, 2004  
Published by:  
Sales Strategic Planning Div.  
Renesas Technology Corp.  
Edited by:  
Technical Documentation & Information Department  
Renesas Kodaira Semiconductor Co., Ltd.  
2003, 2004 Renesas Technology Corp. All rights reserved. Printed in Japan.  
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SH7058 Group BP-272  
User System Interface Board  
HS7058ECB61H User’s Manual  
REJ10B0088-0300H  
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