INTEGRATED CIRCUITS
DATA SHEET
TDA7056A
3 W BTL mono audio output
amplifier with DC volume control
July 1994
Product specificiation
File under Integrated Circuits, IC01
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Philips Semiconductors
Product specificiation
3 W BTL mono audio output amplifier with
DC volume control
TDA7056A
V
P
2
1
n.c.
TDA7056A
9
n.c.
I + i
6
positive output
3
5
positive input
DC volume control
I
– i
8
negative output
STABILIZER TEMPERATURE
PROTECTION
V
ref
4
7
MGA072 - 1
signal
ground
power
ground
Fig.1 Block diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
n.c.
1
2
3
4
5
6
7
8
9
not connected
handbook, halfpage
VP
positive supply voltage
voltage input
n.c.
1
VI
V
2
3
4
5
6
7
8
9
P
GND1
VC
signal ground
V
I
DC volume control
positive output
power ground
GND1
VC
OUT+
GND2
OUT−
n.c.
TDA7056A
OUT+
GND2
OUT−
n.c.
negative output
not connected
MGA071
Fig.2 Pin configuration.
July 1994
3
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Philips Semiconductors
Product specificiation
3 W BTL mono audio output amplifier with
DC volume control
TDA7056A
Thus, a reduced power supply and smaller capacitors can
be used which results in cost savings.
FUNCTIONAL DESCRIPTION
The TDA7056A is a mono BTL output amplifier with DC
volume control, designed for use in TV and monitor but
also suitable for battery-fed portable recorders and radios.
For portable applications there is a trend to decrease the
supply voltage, resulting in a reduction of output power at
conventional output stages. Using the BTL principle
increases the output power.
In conventional DC volume circuits the control or input
stage is AC coupled to the output stage via external
capacitor to keep the offset voltage low.
The maximum gain of the amplifier is fixed at 35.5 dB. The
DC volume control stage has a logarithmic control
characteristic.
In the TDA7056A the DC volume stage is integrated into
the input stage so that coupling capacitors are not required
and a low offset voltage is maintained.
The total gain can be controlled from 35.5 dB to −44 dB.
If the DC volume control voltage is below 0.3 V, the device
switches to the mute mode.
At the same time the minimum supply voltage remains low.
The BTL principle offers the following advantages:
The amplifier is short-circuit proof to ground, VP and
across the load. A thermal protection circuit is also
implemented. If the crystal temperature rises above
+150 °C the gain will be reduced, thereby reducing the
output power.
• lower peak value of the supply current
• the frequency of the ripple on the supply voltage is twice
the signal frequency
Special attention is given to switch-on and off clicks, low
HF radiation and a good overall stability.
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOL
PARAMETER
supply voltage range
CONDITIONS
MIN.
MAX.
18
UNIT
VP
−
−
−
−
V
IORM
IOSM
Ptot
Tamb
Tstg
Tvj
repetitive peak output current
non repetitive peak output current
total power dissipation
1.25
1.5
9
A
A
Tcase < 60 °C
W
°C
°C
°C
hr
V
operating ambient temperature range
storage temperature range
virtual junction temperature
short-circuit time
−40
−55
−
+85
+150
+150
1
Tsc
−
−
V3
input voltage pin 3
8
V5
input voltage pin 5
−
8
V
THERMAL RESISTANCE
SYMBOL
PARAMETER
THERMAL RESISTANCE
55 K/W
Rth j-a
Rth j-c
from junction to ambient in free air
from junction to case
10 K/W
Note to the thermal resistance
VP = 12 V; RL = 16 Ω; The maximum sine-wave dissipation is = 1.8 W. The Rth vj-a of the package is 55 K/W;
Tamb (max) = 150 − 55 x 1.8 = 51 °C
July 1994
4
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Philips Semiconductors
Product specificiation
3 W BTL mono audio output amplifier with
DC volume control
TDA7056A
CHARACTERISTICS
VP = 12 V; f = 1 kHz; RL = 16 Ω; Tamb = 25 °C; unless otherwise specified (see Fig.6)
SYMBOL
VP
IP
PARAMETER
CONDITIONS
MIN.
4.5
TYP.
MAX. UNIT
positive supply voltage range
total quiescent current
−
8
18
16
V
VP = 12 V; RL = ∞; note 1
−
mA
Maximum gain (V5 = 1.4 V)
PO
output power
THD = 10%; RL = 16 Ω
THD = 10%; RL = 8 Ω
PO = 0.5 W
3
3.5
−
−
W
W
%
−
−
34.5
0.5
−
5.2
THD
Gv
total harmonic distortion
voltage gain
0.3
1
35.5
0.65
210
36.5
−
−
dB
V
VI
input signal handling
noise output voltage (RMS value)
bandwidth
V5 = 0.8 V;THD < 1%
f = 500 kHz; note 2
at −1 dB
Vno(rms)
B
µV
−
20 Hz to
300 kHz
−
SVRR
|Voff|
ZI
supply voltage ripple rejection
DC output offset voltage
input impedance pin 3
note 3
38
−
46
0
−
150
25
dB
mV
kΩ
15
20
Minimum gain (V5 = 0.5 V)
Gv
voltage gain
−
−
−44
20
−
30
dB
Vno(rms)
noise output voltage (RMS value)
note 4
µV
Mute position
VO
output voltage in mute position
V5 ≤ 0.3 V; VI = 600 mV
−
−
30
µV
DC volume control
φ
I5
gain control range
control current
75
60
80
70
−
80
dB
V5 = 0 V
µA
Notes to the characteristics
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by RL.
2. The noise output voltage (RMS value) at f = 500 kHz is measured with RS = 0 Ω and bandwidth = 5 kHz.
3. The ripple rejection is measured with RS = 0 Ω and f = 100 Hz to 10 kHz. The ripple voltage of 200 mV (RMS value)
is applied to the positive supply rail.
4. The noise output voltage (RMS value) is measured with RS = 5 kΩ unweighted.
July 1994
5
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Philips Semiconductors
Product specificiation
3 W BTL mono audio output amplifier with
DC volume control
TDA7056A
MGA075
MGA076 - 1
1000
40
handbook, halfpage
gain
handbook, halfpage
V
noise
(dB)
20
(µV)
800
0
– 20
– 40
– 60
600
400
200
0
0
– 80
0
0.4
0.8
1.2
1.6
2.0
0.4
0.8
1.2
1.6
2.0
(V)
V
V
(V)
5
5
Fig.4 Noise output voltage as a function of DC
volume control.
Fig.3 Gain as a function of DC volume control.
MGA077 - 1
100
handbook, halfpage
I
5
(µA)
60
20
– 20
– 60
– 100
0
0.4
0.8
1.2
1.6
2.0
(V)
V
5
Fig.5 Control current as a function of DC volume
control.
July 1994
6
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Philips Semiconductors
Product specificiation
3 W BTL mono audio output amplifier with
DC volume control
TDA7056A
APPLICATION INFORMATION
(1)
V
P
100
nF
220 µF
2
1
n.c.
9
TDA7056A
n.c.
I + i
6
0.47 µF
positive
input
3
5
R
= 16 Ω
L
I – i
8
5
kΩ
R
S
STABILIZER
TEMPERATURE
PROTECTION
V
ref
DC
volume
control
4
7
MGA073 - 1
ground
(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 2.
Fig.6 Test and application diagram.
handbook, halfpage
5
100 kΩ
MGA074
volume
control
Fig.7 Application using a potentiometer for
volume control; Gv = 30 dB.
July 1994
7
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Philips Semiconductors
Product specificiation
3 W BTL mono audio output amplifier with
DC volume control
TDA7056A
PACKAGE OUTLINE
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
D
D
1
q
A
2
P
P
1
A
3
q
2
q
1
A
A
4
E
pin 1 index
c
L
1
9
b
Q
e
Z
b
w
M
2
b
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
max.
2
Z
(1)
(1)
E
UNIT
A
A
b
b
b
c
D
D
e
L
P
P
Q
q
q
q
2
w
A
3
4
1
2
1
1
1
max.
18.5
17.8
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20
3.9 2.75 3.4 1.75 15.1
3.4 2.50 3.2 1.55 14.9
4.4
4.2
5.9
5.7
2.54
mm
3.7
0.25 1.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-25
SOT110-1
July 1994
8
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Philips Semiconductors
Product specificiation
3 W BTL mono audio output amplifier with
DC volume control
TDA7056A
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
July 1994
9
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