Philips Stereo Amplifier TDA7053A User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA7053A  
Stereo BTL audio output amplifier  
with DC volume control  
1997 Jul 15  
Product specification  
Supersedes data of 1995 Nov 09  
File under Integrated Circuits, IC01  
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Philips Semiconductors  
Product specification  
Stereo BTL audio output amplifier with DC  
volume control  
TDA7053A  
BLOCK DIAGRAM  
V
P
5
TDA7053A  
TDA7053AT  
I
i
i
positive  
output 1  
16  
13  
4
input 1  
2
DC volume  
control 1  
Ι
I
negative  
output 1  
TEMPERATURE  
PROTECTION  
STABILIZER  
V
ref  
I
I
i
12  
9
negative  
output 2  
6
8
input 2  
DC volume  
control 2  
ΙΙ  
i
positive  
output 2  
1,3,11,15  
7
14  
10  
MSA717 - 2  
not  
connected  
signal  
ground  
power  
ground 1  
power  
ground 2  
Fig.1 Block diagram.  
1997 Jul 15  
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Philips Semiconductors  
Product specification  
Stereo BTL audio output amplifier with DC  
volume control  
TDA7053A  
PINNING  
SYMBOL  
PIN  
DESCRIPTION  
not connected  
n.c.  
1
2
VC1  
DC volume control 1  
not connected  
n.c.  
3
n.c.  
VC1  
n.c.  
1
2
3
4
5
6
7
8
16  
OUT1  
15 n.c.  
14 PGND1  
VI (1)  
4
voltage input 1  
VP  
5
positive supply voltage  
voltage input 2  
VI (2)  
6
V
13  
12  
I (1)  
OUT1  
OUT2  
TDA7053A  
TDA7053AT  
SGND  
VC2  
7
signal ground  
V
P
8
DC volume control 2  
positive output 2  
power ground 2  
not connected  
V
OUT2+  
PGND2  
n.c.  
9
I (2)  
11 n.c.  
10  
11  
12  
13  
14  
15  
16  
PGND2  
SGND  
VC2  
10  
9
OUT2  
OUT2−  
OUT1−  
PGND1  
n.c.  
negative output 2  
negative output 1  
power ground 1  
not connected  
MSA719 - 2  
Fig.2 Pin configuration.  
OUT1+  
positive output 1  
For portable applications there is a trend to decrease the  
supply voltage, resulting in a reduction of output power at  
conventional output stages. Using the BTL principle  
increases the output power.  
FUNCTIONAL DESCRIPTION  
The TDA7053A and TDA7053AT are stereo output  
amplifiers with two DC volume control stages, designed for  
TV and monitors, but also suitable for battery-fed portable  
recorders and radios.  
The maximum gain of the amplifier is fixed at 40.5 dB.  
The DC volume control stages have a logarithmic control  
characteristic. Therefore, the total gain can be controlled  
from +40.5 to 33 dB.  
In conventional DC volume control circuits the control or  
input stage is AC coupled to the output stage via external  
capacitors to keep the offset voltage low.  
If the DC volume control voltage falls below 0.4 V, the  
device will switch to the mute mode.  
The two DC volume control stages are integrated into the  
input stages so that no coupling capacitors are required  
and a low offset voltage is still maintained. The minimum  
supply voltage also remains low.  
The amplifier is short-circuit protected to ground, VP and  
across the load. A thermal protection circuit is also  
implemented. If the crystal temperature rises above  
150 °C the gain will be reduced, thereby reducing the  
output power.  
The BTL principle offers the following advantages:  
Lower peak value of the supply current  
The frequency of the ripple on the supply voltage is twice  
the signal frequency.  
Special attention is given to switch-on and switch-off  
clicks, low HF radiation and a good overall stability.  
Consequently, a reduced power supply with smaller  
capacitors can be used which results in cost reductions.  
1997 Jul 15  
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Philips Semiconductors  
Product specification  
Stereo BTL audio output amplifier with DC  
volume control  
TDA7053A  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
VP  
PARAMETER  
supply voltage  
CONDITIONS  
MIN.  
MAX.  
18  
UNIT  
V
A
A
IORM  
IOSM  
Ptot  
repetitive peak output current  
non-repetitive peak output current  
total power dissipation  
TDA7053A  
1.25  
1.5  
Tamb 25 °C  
2.5  
1.32  
1
W
W
hr  
V
TDA7053AT  
tsc  
short-circuit time  
Vn  
input voltage pins 2, 4, 6 and 8  
operating ambient temperature  
storage temperature  
5
Tamb  
Tstg  
Tvj  
40  
55  
+85  
+150  
+150  
°C  
°C  
°C  
virtual junction temperature  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
VALUE  
UNIT  
Rth j-a  
thermal resistance from junction to ambient in free air  
TDA7053A  
50  
95  
K/W  
K/W  
TDA7053AT  
Power dissipation  
TDA7053A:  
Assume VP = 6 V and RL = 8 .  
The maximum sine wave dissipation is 2 × 0.9 W = 1.8 W.  
The Rth j-a of the package is 50 K/W therefore Tamb(max) = 150 (50 × 1.8) = 60 °C.  
TDA7053AT:  
Assume VP = 6 V and RL = 16 .  
The maximum sine wave dissipation is 2 × 0.46 W = 0.92 W.  
The Rth j-a of the package is 95 K/W therefore Tamb(max) = 150 (95 × 0.92) = 62.6 °C.  
1997 Jul 15  
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Philips Semiconductors  
Product specification  
Stereo BTL audio output amplifier with DC  
volume control  
TDA7053A  
CHARACTERISTICS  
VP = 6 V; Tamb = 25 °C; fi = 1 kHz; TDA7053A: RL = 8 ; TDA7053AT: RL = 16 ; unless otherwise specified  
(see Fig.13).  
SYMBOL  
VP  
Iq(tot)  
Maximum gain; V2,8 1.4 V  
PARAMETER  
supply voltage  
total quiescent current  
CONDITIONS  
MIN.  
4.5  
TYP.  
MAX.  
18  
UNIT  
V
VP = 6 V; RL = ; note 1  
22  
25  
mA  
Pout  
output power  
TDA7053A  
THD = 10%  
1.0  
0.5  
1.1  
W
W
TDA7053AT  
0.55  
THD  
total harmonic distortion  
TDA7053A  
P
out = 0.5 W  
39.5  
1
0.3  
0.3  
40.5  
1
%
TDA7053AT  
Pout = 0.25 W  
1
%
Gv  
voltage gain  
41.5  
dB  
V
VI(rms)  
Vno  
B
input signal handling (RMS value) Gv = 0 dB; THD < 1%  
noise output voltage  
bandwidth  
fi = 500 kHz; note 2  
at 1 dB  
210  
note 3  
38  
200  
25  
µV  
Hz  
dB  
mV  
kΩ  
dB  
dB  
dB  
SVRR  
VO(os)  
Zi  
supply voltage ripple rejection  
DC output offset voltage  
input impedance (pins 4 and 6)  
channel separation  
note 4  
34  
15  
40  
V16 V13 and V12 V9  
0
20  
αcs  
Gv  
RS = 5 kΩ  
note 5  
channel unbalance  
1
G1 = 0 dB; note 6  
1
Mute position; V2,8 = 0.4 V ±30 mV  
VO  
output voltage in mute position  
Vi = 1.0 V; note 7  
V2 = V8 = 0 V  
30  
40  
µV  
DC volume control  
GC  
IDC  
gain control  
volume control current  
68.5  
73.5  
30  
dB  
20  
25  
µA  
Notes  
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being  
equal to the DC output offset voltage divided by RL.  
2. The noise output voltage (RMS value) at fi = 500 kHz is measured with RS = 0 and bandwidth = 5 kHz.  
3. 20 Hz to 300 kHz (typical).  
4. The ripple rejection is measured with RS = 0 and fi = 100 Hz to 10 kHz. The ripple voltage of 200 mV (RMS value)  
is applied to the positive supply rail.  
5. The channel unbalance is measured with VDC1 = VDC2  
6. The channel unbalance at G1 = 0 dB is measured with VDC1 = VDC2  
7. The noise output voltage (RMS value) is measured with RS = 5 kunweighted.  
.
.
1997 Jul 15  
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Philips Semiconductors  
Product specification  
Stereo BTL audio output amplifier with DC  
volume control  
TDA7053A  
MBG671  
MBG672  
12  
40  
handbook, halfpage  
handbook, halfpage  
I
q
THD  
(%)  
(mA)  
30  
8
4
0
(1)  
(2)  
(3)  
20  
10  
0
0
2  
1  
10  
10  
1
10  
4
8
12  
16  
20  
P
(W)  
out  
V
(V)  
P
(1) VP = 4.5 V.  
(2)  
VP = 6 V; RL = 8 .  
(3) VP = 12 V; RL = 25 .  
Fig.3 Quiescent current as a function of supply  
voltage.  
Fig.4 THD as a function of output power.  
MBG669  
MBG670  
2.5  
10  
handbook, halfpage  
handbook, halfpage  
P
out  
(W)  
THD  
(%)  
2.0  
8
6
4
(1)  
(2) (3)  
1.5  
1.0  
0.5  
(2)  
2
(1)  
0
0
0
10  
2  
1  
2
4
8
12  
16  
10  
1
10  
10  
V
(V)  
f (kHz)  
P
(1) RL = 8 .  
(2) RL = 16 .  
(3) RL = 25 .  
(1) Gv = 30 dB; Po = 0.1 W.  
(2) Gv = 40 dB; Po = 0.1 W.  
Fig.6 Output power as a function of supply  
voltage.  
Fig.5 THD as a function of frequency.  
1997 Jul 15  
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Philips Semiconductors  
Product specification  
Stereo BTL audio output amplifier with DC  
volume control  
TDA7053A  
MBG668  
MBG667  
4
80  
handbook, halfpage  
handbook, halfpage  
G
v
P
diss  
(dB)  
40  
(W)  
3
(1)  
(2)  
(3)  
0
40  
80  
2
1
0
0
120  
4
8
12  
16  
0
0.4  
0.8  
1.2  
1.6  
V
2.0  
(V)  
V
(V)  
P
VC  
(1) RL = 8 .  
(2)  
RL = 16 .  
(3) RL = 25 .  
Fig.8 Voltage gain as a function of volume control  
voltage.  
Fig.7 Total worst case power dissipation as a  
function of supply voltage.  
MBG664  
MBG663  
1
0
handbook, halfpage  
handbook, halfpage  
SVRR  
(dB)  
V
no  
(mV)  
20  
(1)  
1  
10  
40  
60  
(2)  
2  
80  
10  
10  
2  
1  
2
0
0.4  
0.8  
1.2  
1.6  
V
2.0  
(V)  
10  
1
10  
10  
f (kHz)  
VC  
(1) VDC = 1.4 V;Vripple = 0.2 V.  
(2) VDC = 0.4 V; Vripple = 0.2 V.  
f = 22 Hz to 22 kHz.  
Fig.9 Noise voltage as a function of volume  
control voltage.  
Fig.10 SVRR as a function of frequency.  
1997 Jul 15  
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Philips Semiconductors  
Product specification  
Stereo BTL audio output amplifier with DC  
volume control  
TDA7053A  
MBG666  
MBG665  
30  
2.0  
handbook, halfpage  
handbook, halfpage  
I
VC  
V
in  
(µA)  
(V)  
20  
1.6  
10  
0
1.2  
0.8  
10  
20  
0.4  
30  
0
0
0
0.4  
0.8  
1.2  
1.6  
V
2.0  
(V)  
4
8
12  
16  
20  
V
(V)  
P
VC  
THD = 1 %.  
Fig.12 Volume control current as a function of  
volume control voltage.  
Fig.11 Input signal handling.  
The maximum input signal voltage is measured at  
THD = 1% at the output with a voltage gain of 0 dB.  
APPLICATION INFORMATION  
The application diagram is illustrated in Fig.13.  
To avoid instabilities and too high distortion, the input  
ground and power ground must be separated as far as  
possible and connected as close as possible to the IC.  
Test conditions  
T
V
amb = 25 °C unless otherwise specified; VP = 6 V;  
The DC volume control can be applied in several ways.  
Two possible circuits are shown below the main  
application diagram. The circuits at the control pin will  
influence the switch-on and switch-off behaviour and the  
maximum voltage gain.  
DC = 1.4 V; fi = 1 kHz; RL = 8 .  
The quiescent current has been measured without load  
impedance.  
The output power as a function of the supply voltage has  
been measured at THD = 10%. The maximum output  
power is limited by the maximum power dissipation and the  
maximum available output current.  
For single-end applications the output peak current must  
not exceed 100 mA. At higher output currents the  
short-circuit protection (MCL) will be active.  
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Philips Semiconductors  
Product specification  
Stereo BTL audio output amplifier with DC  
volume control  
TDA7053A  
V
= 6 V  
P
(1)  
220 µF  
100 nF  
5
TDA7053A  
16  
+
470 nF  
I + i  
4
2
input 1  
R = 5 kΩ  
(2)  
s
I i  
13  
TEMPERATURE  
MCL  
PROTECTION  
STABILIZER  
12  
9
470 nF  
I i  
6
8
input 2  
(2)  
I + i  
DC-  
volume  
+
R
= 5 kΩ  
s
7
10  
14  
signal  
ground  
power  
ground  
V
P
= 6 V  
56 kΩ  
2, 8  
volume  
control  
volume  
control  
2, 8  
maximum voltage  
gain 34 dB  
maximum voltage  
gain 40 dB  
1 µF  
1 MΩ  
1 µF  
22 kΩ  
MBG673  
(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 5.  
(2) RL = 8 .  
Fig.13 Test and application diagram.  
10  
1997 Jul 15  
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Philips Semiconductors  
Product specification  
Stereo BTL audio output amplifier with DC  
volume control  
TDA7053A  
PACKAGE OUTLINES  
DIP16: plastic dual in-line package; 16 leads (300 mil); long body  
SOT38-1  
D
M
E
A
2
A
A
1
L
c
e
w M  
Z
b
1
(e )  
1
b
16  
9
M
H
pin 1 index  
E
1
8
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
Z
A
A
A
(1)  
(1)  
1
2
w
UNIT  
mm  
b
b
c
D
E
e
e
L
M
M
H
1
1
E
max.  
max.  
min.  
max.  
1.40  
1.14  
0.53  
0.38  
0.32  
0.23  
21.8  
21.4  
6.48  
6.20  
3.9  
3.4  
8.25  
7.80  
9.5  
8.3  
4.7  
0.51  
3.7  
2.54  
0.10  
7.62  
0.30  
0.254  
0.01  
2.2  
0.021  
0.015  
0.013  
0.009  
0.86  
0.84  
0.32  
0.31  
0.055  
0.045  
0.26  
0.24  
0.15  
0.13  
0.37  
0.33  
inches  
0.19  
0.020  
0.15  
0.087  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-10-02  
95-01-19  
SOT38-1  
050G09  
MO-001AE  
1997 Jul 15  
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Philips Semiconductors  
Product specification  
Stereo BTL audio output amplifier with DC  
volume control  
TDA7053A  
SO16: plastic small outline package; 16 leads; body width 7.5 mm  
SOT162-1  
D
E
A
X
c
H
v
M
A
E
y
Z
16  
9
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
8
detail X  
e
w
M
b
p
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
max.  
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30  
0.10  
2.45  
2.25  
0.49  
0.36  
0.32  
0.23  
10.5  
10.1  
7.6  
7.4  
10.65  
10.00  
1.1  
0.4  
1.1  
1.0  
0.9  
0.4  
mm  
2.65  
0.25  
0.01  
0.25  
0.1  
0.25  
0.01  
1.27  
0.050  
1.4  
8o  
0o  
0.012 0.096  
0.004 0.089  
0.019 0.013 0.41  
0.014 0.009 0.40  
0.30  
0.29  
0.419  
0.394  
0.043 0.043  
0.016 0.039  
0.035  
0.016  
inches 0.10  
0.055  
0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
95-01-24  
97-05-22  
SOT162-1  
075E03  
MS-013AA  
1997 Jul 15  
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Philips Semiconductors  
Product specification  
Stereo BTL audio output amplifier with DC  
volume control  
TDA7053A  
Several techniques exist for reflowing; for example,  
thermal conduction by heated belt. Dwell times vary  
between 50 and 300 seconds depending on heating  
method. Typical reflow temperatures range from  
215 to 250 °C.  
SOLDERING  
Introduction  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 minutes at  
45 °C.  
WAVE SOLDERING  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
Wave soldering techniques can be used for all SO  
packages if the following conditions are observed:  
A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave) soldering  
technique should be used.  
DIP  
SOLDERING BY DIPPING OR BY WAVE  
The longitudinal axis of the package footprint must be  
parallel to the solder flow.  
The maximum permissible temperature of the solder is  
260 °C; solder at this temperature must not be in contact  
with the joint for more than 5 seconds. The total contact  
time of successive solder waves must not exceed  
5 seconds.  
The package footprint must incorporate solder thieves at  
the downstream end.  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
specified maximum storage temperature (Tstg max). If the  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder is  
10 seconds, if cooled to less than 150 °C within  
6 seconds. Typical dwell time is 4 seconds at 250 °C.  
REPAIRING SOLDERED JOINTS  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Apply a low voltage soldering iron (less than 24 V) to the  
lead(s) of the package, below the seating plane or not  
more than 2 mm above it. If the temperature of the  
soldering iron bit is less than 300 °C it may remain in  
contact for up to 10 seconds. If the bit temperature is  
between 300 and 400 °C, contact may be up to 5 seconds.  
REPAIRING SOLDERED JOINTS  
Fix the component by first soldering two diagonally-  
opposite end leads. Use only a low voltage soldering iron  
(less than 24 V) applied to the flat part of the lead. Contact  
time must be limited to 10 seconds at up to 300 °C. When  
using a dedicated tool, all other leads can be soldered in  
one operation within 2 to 5 seconds between  
270 and 320 °C.  
SO  
REFLOW SOLDERING  
Reflow soldering techniques are suitable for all SO  
packages.  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
1997 Jul 15  
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Philips Semiconductors  
Product specification  
Stereo BTL audio output amplifier with DC  
volume control  
TDA7053A  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1997 Jul 15  
14  
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Philips Semiconductors  
Product specification  
Stereo BTL audio output amplifier with DC  
volume control  
TDA7053A  
NOTES  
1997 Jul 15  
15  
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Philips Semiconductors – a worldwide company  
Argentina: see South America  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. +31 40 27 82785, Fax. +31 40 27 88399  
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,  
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466  
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,  
Tel. +64 9 849 4160, Fax. +64 9 849 7811  
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,  
Fax. +43 160 101 1210  
Norway: Box 1, Manglerud 0612, OSLO,  
Tel. +47 22 74 8000, Fax. +47 22 74 8341  
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,  
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773  
Philippines: Philips Semiconductors Philippines Inc.,  
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,  
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
Belgium: see The Netherlands  
Brazil: see South America  
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,  
Tel. +48 22 612 2831, Fax. +48 22 612 2327  
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,  
51 James Bourchier Blvd., 1407 SOFIA,  
Tel. +359 2 689 211, Fax. +359 2 689 102  
Portugal: see Spain  
Romania: see Italy  
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,  
Tel. +1 800 234 7381  
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,  
Tel. +7 095 755 6918, Fax. +7 095 755 6919  
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,  
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,  
Tel. +852 2319 7888, Fax. +852 2319 7700  
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,  
Tel. +65 350 2538, Fax. +65 251 6500  
Colombia: see South America  
Slovakia: see Austria  
Czech Republic: see Austria  
Slovenia: see Italy  
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,  
Tel. +45 32 88 2636, Fax. +45 31 57 0044  
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,  
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,  
Tel. +27 11 470 5911, Fax. +27 11 470 5494  
Finland: Sinikalliontie 3, FIN-02630 ESPOO,  
Tel. +358 9 615800, Fax. +358 9 61580920  
South America: Rua do Rocio 220, 5th floor, Suite 51,  
04552-903 São Paulo, SÃO PAULO - SP, Brazil,  
Tel. +55 11 821 2333, Fax. +55 11 829 1849  
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,  
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427  
Spain: Balmes 22, 08007 BARCELONA,  
Tel. +34 3 301 6312, Fax. +34 3 301 4107  
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,  
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300  
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,  
Tel. +46 8 632 2000, Fax. +46 8 632 2745  
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,  
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240  
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,  
Tel. +41 1 488 2686, Fax. +41 1 481 7730  
Hungary: see Austria  
India: Philips INDIA Ltd, Band Box Building, 2nd floor,  
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,  
Tel. +91 22 493 8541, Fax. +91 22 493 0966  
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,  
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874  
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,  
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,  
Tel. +66 2 745 4090, Fax. +66 2 398 0793  
Indonesia: see Singapore  
Ireland: Newstead, Clonskeagh, DUBLIN 14,  
Tel. +353 1 7640 000, Fax. +353 1 7640 200  
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,  
Tel. +90 212 279 2770, Fax. +90 212 282 6707  
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,  
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007  
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,  
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461  
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,  
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557  
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,  
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421  
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,  
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077  
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,  
Tel. +1 800 234 7381  
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,  
Tel. +82 2 709 1412, Fax. +82 2 709 1415  
Uruguay: see South America  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,  
Tel. +60 3 750 5214, Fax. +60 3 757 4880  
Vietnam: see Singapore  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Tel. +381 11 625 344, Fax.+381 11 635 777  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381  
Middle East: see Italy  
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,  
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1997  
SCA55  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
547027/1200/04/pp16  
Date of release: 1997 Jul 15  
Document order number: 9397 750 02591  
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