INTEGRATED CIRCUITS
DATA SHEET
TDA7050
Low voltage mono/stereo power
amplifier
June 1989
Product specification
File under Integrated Circuits, IC01
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Philips Semiconductors
Product specification
Low voltage mono/stereo power amplifier
TDA7050
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage
V
max.
max.
6 V
P
Peak output current
I
150 mA
OM
Total power dissipation
Storage temperature range
Crystal temperature
see derating curve Fig.1
T
T
−55 to + 150 °C
stg
c
max.
100 °C
A.C. and d.c. short-circuit duration
at V = 3,0 V (during mishandling)
t
max.
5 s
P
sc
Fig.1 Power derating curve.
THERMAL RESISTANCE
From junction to ambient
R
=
110 K/W
thj-a
June 1989
3
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Philips Semiconductors
Product specification
Low voltage mono/stereo power amplifier
TDA7050
CHARACTERISTICS
V = 3 V; f = 1 kHz; R = 32 Ω; T
= 25 °C; unless otherwise specified
P
L
amb
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply
Supply voltage
V
1,6
−
6,0
V
P
Total quiescent current
I
−
3,2
4
mA
tot
Bridge-tied load application (BTL); see Fig.4
Output power; note 1
V = 3,0 V; d = 10%
P
P
−
−
−
140
150
32
−
−
−
mW
mW
dB
P
tot
o
V = 4,5 V; d = 10% (R = 64 Ω)
P
tot
L
o
Voltage gain
G
v
Noise output voltage (r.m.s. value)
R = 5 kΩ; f = 1 kHz
V
−
−
−
1
140
tbf
−
−
40
−
−
70
−
−
µV
µV
mV
MΩ
nA
S
no(rms)
no(rms)
R = 0 Ω; f = 500 kHz; B = 5 kHz
V
S
D.C. output offset voltage (at R = 5 kΩ)
|∆V|
|Z |
S
Input impedance (at R = ∞)
S
i
Input bias current
I
−
i
Stereo application; see Fig.5
Output power; note 1
V = 3,0 V; d = 10%
P
−
−
35
75
26
−
−
mW
mW
dB
P
tot
o
V = 4,5 V; d = 10%
P
P
tot
o
Voltage gain
G
24.5
27.5
v
Noise output voltage (r.m.s. value)
R = 5 kΩ; f = 1 kHz
V
−
−
100
tbf
−
−
µV
µV
S
no(rms)
no(rms)
R = 0 Ω; f = 500 kHz; B = 5 kHz
V
S
Channel separation
R = 0 Ω; f = 1 kHz
Input impedance (at R = ∞)
α
|Z |
30
2
40
−
−
−
−
dB
MΩ
nA
S
S
i
Input bias current
I
−
20
i
Note
1. Output power is measured directly at the output pins of the IC. It is shown as a function of the supply voltage in Fig.2
(BTL application) and Fig.3 (stereo application).
June 1989
4
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Philips Semiconductors
Product specification
Low voltage mono/stereo power amplifier
TDA7050
Fig.2 Output power across the load impedance (R ) as a function of supply voltage (V ) in BTL application.
L
P
Measurements were made at f = 1 kHz; d = 10%; T
= 25 °C.
tot
amb
Fig.3 Output power across the load impedance (R ) as a function of supply voltage (V ) in stereo application.
L
P
Measurements were made at f = 1 kHz; d = 10%; T
= 25 °C.
tot
amb
June 1989
5
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Philips Semiconductors
Product specification
Low voltage mono/stereo power amplifier
TDA7050
APPLICATION INFORMATION
Fig.4 Application diagram (BTL); also used as test circuit.
Fig.5 Application diagram (stereo); also used as test circuit.
6
June 1989
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Philips Semiconductors
Product specification
Low voltage mono/stereo power amplifier
TDA7050
PACKAGE OUTLINE
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
D
M
E
A
2
A
A
1
L
c
w M
Z
b
1
e
(e )
1
M
H
b
b
2
8
5
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
(1)
(1)
1
2
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.10
7.62
0.30
0.254
0.01
1.15
0.068 0.021 0.042 0.014
0.045 0.015 0.035 0.009
0.39
0.36
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.020
0.13
0.045
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-04
SOT97-1
050G01
MO-001AN
June 1989
7
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Philips Semiconductors
Product specification
Low voltage mono/stereo power amplifier
TDA7050
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
SOLDERING
Introduction
specified maximum storage temperature (T
). If the
stg max
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
June 1989
8
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