Philips Stereo Amplifier TDA6111Q User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA6111Q  
Video output amplifier  
1995 Feb 07  
Preliminary specification  
Supersedes data of February 1992  
File under Integrated Circuits, IC02  
Philips Semiconductors  
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Philips Semiconductors  
Preliminary specification  
Video output amplifier  
TDA6111Q  
BLOCK DIAGRAM  
supply voltage  
input HIGH  
feedback  
output  
6
9
7 V  
MIRROR  
MIRROR  
FOLLOWERS  
cathode  
transient  
7
V
bias  
output  
C
par  
8
5
cathode  
DC output  
inverting  
3
input  
DIFFERENTIAL  
1
STAGE  
TDA6111Q  
non-inverting  
input  
black current  
measurement  
output  
CURRENT  
SOURCE  
MIRROR  
MIRROR  
4
2
MGA058  
ground  
(substrate)  
supply voltage  
input LOW  
Fig.1 Block diagram.  
1995 Feb 07  
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Philips Semiconductors  
Preliminary specification  
Video output amplifier  
TDA6111Q  
PINNING  
SYMBOL  
Vip  
PIN  
DESCRIPTION  
1
2
3
4
5
non-inverting voltage input  
supply voltage LOW  
inverting voltage input  
ground, substrate  
VDDL  
Vin  
andbook, halfpage  
V
1
2
3
4
5
6
7
8
9
ip  
V
DDL  
GND  
Iom  
V
black current measurement  
output  
in  
GND  
VDDH  
Vcn  
6
7
8
9
supply voltage HIGH  
I
TDA6111Q  
om  
cathode transient voltage output  
cathode DC voltage output  
feedback voltage output  
V
DDH  
Voc  
V
cn  
Vfb  
V
oc  
V
fb  
MGA057  
Fig.2 Pin configuration.  
1995 Feb 07  
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Philips Semiconductors  
Preliminary specification  
Video output amplifier  
TDA6111Q  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134). Voltages measured with respect to GND (pin 4);  
currents as specified in Fig.1; unless otherwise specified.  
SYMBOL  
VDDH  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
250  
UNIT  
high level supply voltage  
low level supply voltage  
input voltage  
0
0
0
V
V
V
V
VDDL  
VI  
14  
VDDL  
+6  
VIdm  
Vom  
Voc  
differential mode input voltage  
measurement output voltage  
cathode output voltage  
feedback output voltage  
input current  
6  
0
VDDL  
VDDH  
VDDH  
1
VDDL  
VDDL  
0
V
V
Vfb  
Iin,Iip  
IocsmL  
mA  
A
low non-repetitive peak cathode  
output current  
flashover discharge = 100 µC  
0
5
IocsmH  
high non-repetitive peak cathode  
output current  
flashover discharge = 100 nC  
0
10  
A
Ptot  
Tstg  
Tj  
total power dissipation  
storage temperature  
junction temperature  
electrostatic handling  
human body model (HBM)  
machine model (MM)  
0
4
W
55  
20  
+150  
+150  
°C  
°C  
Ves  
> 1500  
> 400  
V
V
HANDLING  
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is  
desirable to take normal precautions appropriate to handling MOS devices (see “Handling MOS Devices).  
QUALITY SPECIFICATION  
Quality specification “SNW-FQ-611 part E” is applicable, except for ESD Human body model see Chapter “Limiting  
values”, and can be found in the “Quality reference handbook” (ordering number 9398 510 63011).  
THERMAL CHARACTERISTICS  
SYMBOL  
Rth j-c  
Note  
1. External heatsink is required.  
PARAMETER  
VALUE  
UNIT  
thermal resistance from junction to case (note 1)  
12  
K/W  
1995 Feb 07  
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Philips Semiconductors  
Preliminary specification  
Video output amplifier  
TDA6111Q  
CHARACTERISTICS  
Operating range: Tamb = 20 to 65 °C; VDDH = 180 to 210 V; VDDL = 10.8 to 13.2 V; Vip = 2.6 to 5 V;  
Vom = 1.4 V to VDDL  
.
Test conditions (unless otherwise specified): Tamb = 25 °C; VDDH = 200 V; VDDL = 12 V; Vip = 5 V; Vom = 6 V; CL = 10 pF  
(CL consists of parasitic and cathode capacitance); Rth-heatsink = 10 K/W; measured in test circuit Fig.3.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
7.0  
TYP. MAX. UNIT  
IDDH  
IDDL  
Ibias  
quiescent HIGH voltage supply current Voc = 0.5VDDH  
quiescent LOW voltage supply current Voc = 0.5VDDH  
9.0  
6.8  
11.0  
8.0  
40  
mA  
mA  
µA  
µA  
µA  
5.0  
0
input bias current  
input offset current  
Voc = 0.5VDDH  
Voc = 0.5VDDH  
Ioffset  
6  
10  
+6  
Iom(offset) offset current of measurement output  
Ioc = 0 µA;  
0
+10  
1.0 V < V13 < 1.0 V;  
1.4 V < Vom < VDDL  
linearity of current transfer  
10 µA < Ioc < 3 mA;  
1.0 V < V13 < 1.0 V;  
1.4 V < Vom < VDDL  
0.9  
1.0  
1.1  
Iom  
Ioc  
------------  
Voffset  
Voc(min)  
Voc(max)  
GB  
input offset voltage  
Voc = 0.5VDDH  
50  
VDDH 12  
1.6  
+50  
20  
mV  
V
minimum output voltage  
maximum output voltage  
V13 = 1 V  
V13 = 1 V  
V
gain-bandwidth product of open-loop  
gain: Vfb / Vi, dm  
f = 500 kHz; VocDC = 100 V  
GHz  
BS  
BL  
tpd  
small signal bandwidth  
VocAC = 60 V (p-p);  
VocDC = 100 V  
13  
10  
17  
16  
13  
23  
MHz  
MHz  
ns  
large signal bandwidth  
VocAC = 100 V (p-p);  
VocDC = 100 V  
cathode output propagation delay time VocAC = 100 V (p-p);  
50% input to 50% output ocDC = 100 V square  
29  
V
wave; f < 1 MHz;  
tr = tf = 22 ns;  
see Figs 4 and 5  
tr  
tf  
cathode output rise time 10% output to Voc = 50 to 150 V square  
23  
23  
30  
30  
36  
ns  
ns  
ns  
90% output  
wave; f < 1 MHz; tf = 22 ns;  
see Fig.4  
cathode output fall time 90% output to Voc = 150 to 50 V square  
36  
10% output  
wave; f < 1 MHz; tr = 22 ns;  
see Fig.5  
ts  
settling time 50% input to  
(99% < output < 101%)  
VocAC = 100 V (p-p);  
VocDC = 100 V square  
wave; f < 1 MHz;  
tr = tf = 22 ns;  
350  
see Figs 4 and 5  
SR  
slew rate between 50 V to 150 V  
V
13 = 2 V (p-p) square  
3000  
V/µs  
wave; f < 1 MHz;  
tr = tf = 22 ns  
1995 Feb 07  
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Philips Semiconductors  
Preliminary specification  
Video output amplifier  
TDA6111Q  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP. MAX. UNIT  
Ov  
cathode output voltage overshoot  
VocAC = 100 V (p-p);  
VocDC = 100 V square  
wave; f < 1 MHz;  
9
%
tr = tf = 22 ns;  
see Figs 4 and 5; note 1  
SVRRH  
SVRRL  
high supply voltage rejection ratio  
low supply voltage rejection ratio  
f < 50 kHz; note 2  
f < 50 kHz; note 2  
85  
70  
dB  
dB  
Notes  
1. If the difference between VDDL and Vip is less than 7 V, overshoot cannot be specified.  
2. SVRR: The ratio of the change in supply voltage to the change in input voltage when there is no change in output  
voltage.  
VDDH to GND must be decoupled:  
Cathode output  
1. With a capacitor >20 nF with good HF behaviour  
(e.g. foil). This capacitance must be placed as close  
as possible to pins 6 and 4, but definitely within 5 mm.  
The cathode output is protected against peak currents  
(caused by positive voltage peaks during high-resistance  
flash) of 5 A maximum with a charge content of 100 µC.  
2. With a capacitor >10 µF on the picture tube base print  
The cathode is also protected against peak currents  
(caused by positive voltage peaks during low-resistance  
flash) of 10 A maximum with a charge content of 100 nC.  
(common for three output stages).  
VDDL to GND must be decoupled:  
1. With a capacitor >20 nF with good HF behaviour  
(e.g. ceramic). This capacitance must be placed as  
close as possible to pins 2 and 4, but definitely within  
10 mm.  
Flashover protection  
The TDA6111Q incorporates protection diodes against  
CRT flashover discharges that clamp the cathode output  
pin to the VDDH pin. The DC supply voltage at the VDDH pin  
has to be within the operating range of 180 to 210 V to  
ensure that the Absolute Maximum Rating for VDDH of  
250 V will not be exceeded during flashover. To limit the  
diode current, an external 680 carbon high-voltage  
resistor in series with the cathode output and a 2 kV spark  
gap are needed (for this resistor-value, the CRT has to be  
connected to the main PCB). This addition produces an  
increase in the rise and fall times of approximately 5 ns  
and a decrease in the overshoot of approximately 4%.  
Switch-off behaviour  
The switch-off behaviour of the TDA6111Q is defined:  
when the bias current becomes zero, at VDDL (pin 2) lower  
than approximately 5 V, all the output pins  
(pins 7, 8 and 9) will be high.  
1995 Feb 07  
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Philips Semiconductors  
Preliminary specification  
Video output amplifier  
TDA6111Q  
12 V  
200 V  
C
C1  
C3  
par  
22 nF  
3.9 pF  
C5  
22 nF  
C6  
100 nF  
C7 10 µF  
7
C4  
10 µF  
V
i
R10  
68.1 kΩ  
R9  
820 Ω  
C2  
22 µF  
3
1
9
2
6
8
R1  
50 Ω  
1.4 mA  
TDA6111Q  
C
n
4
5
560 pF  
A
C8  
R3  
6.8 pF  
20 MΩ  
5 V  
C7  
3.2 pF  
probe  
V
om  
6 V  
C9  
R2  
C10  
136 pF  
1 MΩ  
100 nF  
MGA059 - 1  
Cpar = 150 fF.  
Fig.3 Test circuit with feedback factor 183.  
1995 Feb 07  
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Philips Semiconductors  
Preliminary specification  
Video output amplifier  
TDA6111Q  
x
V
i
0
x
t
t
s
overshoot (in %)  
151  
149  
150  
140  
V
oc  
100  
60  
50  
t
t
r
MGA974  
t
pd  
Fig.4 Output voltage (pin 8) rising edge as a function of the AC input signal.  
1995 Feb 07  
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Preliminary specification  
Video output amplifier  
TDA6111Q  
x
V
i
0
x
t
t
s
150  
140  
oc  
V
100  
overshoot (in %)  
51  
60  
50  
49  
t
t
f
MGA975  
t
pd  
Fig.5 Output voltage (pins 8) falling edge as a function of the AC input signal.  
1995 Feb 07  
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Philips Semiconductors  
Preliminary specification  
Video output amplifier  
TDA6111Q  
The dynamic dissipation equals:  
dyn = VDDH × (CL + Cfb + Cint) × fi × Vo(p-p) ×δ  
TEST AND APPLICATION INFORMATION  
Dissipation  
P
CL = load capacitance.  
Regarding dissipation, distinction must first be made  
between static dissipation (independent of frequency) and  
dynamic dissipation (proportional to frequency).  
Cfb = feedback capacitance (150 fF).  
Cint = internal load capacitance (4 pF).  
fi = input frequency.  
The static dissipation of the TDA6111Q is due to high and  
low voltage supply currents and load currents in the  
feedback network and CRT.  
Vo(p-p) = output voltage (peak-to-peak value).  
δ = non-blanking duty-cycle (0.8).  
The static dissipation equals:  
With CL = 10 pF, Cfb = 0, Cint = 4 pF, fi = 8 MHz  
(simulation of worst-case noise), Vo(p-p) = 100 V and  
δ = 80% then Pdyn = 1.8 W  
Pstat = VDDL ×IDDL + VDDH ×IDDH  
Vfb  
+ Voc ×Ioc Vfb  
×
--------  
The IC must be mounted on the picture tube base print to  
minimize the load capacitance (CL).  
Rfb  
Rfb = value of feedback resistor.  
Ioc = DC value of cathode current.  
The total power dissipation, Ptot = Pstat + Pdyn thus  
amounts to 3.6 W under given conditions.  
From Tj = Tamb + Ptot × Rth j-a < Tj(max) = 150 °C, Rth j-a of  
the package and heatsink together must be < 24 K/W.  
With Vfb = Voc = 100 V, Rfb = 68 k, Ioc = 0.6 mA and  
other typical conditions as mentioned in Chapter  
“Characteristics”, the static dissipation Pstat = 2.0 W.  
1995 Feb 07  
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Philips Semiconductors  
Preliminary specification  
Video output amplifier  
TDA6111Q  
PACKAGE OUTLINE  
DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads  
SOT111-1  
D
D
1
A
2
q
P
P
1
Q
A
3
q
2
q
1
A
A
4
E
pin 1 index  
c
L
1
9
e
2
b
e
Z
b
w
M
2
θ
b
1
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
Z
A
max.  
2
(1)  
(1)  
UNIT  
A
A
A
b
b
b
c
D
D
E
e
e
L
P
P
Q
q
q
q
2
w
θ
3
4
1
2
1
2
1
1
max.  
o
o
18.5  
17.8  
8.7 15.5 1.40 0.67 1.40 0.48 21.8 21.4 6.48  
8.0 15.1 1.14 0.50 1.14 0.38 21.4 20.7 6.20  
3.9 2.75 3.4 1.75 15.1  
3.4 2.50 3.2 1.55 14.9  
65  
55  
4.4 5.9  
4.2 5.7  
2.54 2.54  
mm  
3.7  
0.25 1.0  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-11-17  
95-03-11  
SOT111-1  
1995 Feb 07  
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Philips Semiconductors  
Preliminary specification  
Video output amplifier  
TDA6111Q  
SOLDERING  
REPAIRING SOLDERED JOINTS  
Apply the soldering iron below the seating plane (or not  
more than 2 mm above it). If its temperature is below  
300 °C, it must not be in contact for more than 10 s; if  
between 300 and 400 °C, for not more than 5 s.  
Plastic single in-line packages  
BY DIP OR WAVE  
The maximum permissible temperature of the solder is  
260 °C; this temperature must not be in contact with the  
joint for more than 5 s. The total contact time of successive  
solder waves must not exceed 5 s.  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
specified storage maximum. If the printed-circuit board has  
been pre-heated, forced cooling may be necessary  
immediately after soldering to keep the temperature within  
the permissible limit.  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1995 Feb 07  
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Philips Semiconductors  
Preliminary specification  
Video output amplifier  
TDA6111Q  
NOTES  
1995 Feb 07  
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Philips Semiconductors  
Preliminary specification  
Video output amplifier  
TDA6111Q  
NOTES  
1995 Feb 07  
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All rights are reserved. Reproduction in whole or in part is prohibited without the  
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Date of release: 1995 Feb 07  
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