INTEGRATED CIRCUITS
DATA SHEET
TDA4860
Vertical deflection power amplifier
for monitors
1997 Oct 27
Product specification
Supersedes data of 1996 Nov 26
File under Integrated Circuits, IC02
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Philips Semiconductors
Product specification
Vertical deflection power amplifier for
monitors
TDA4860
BLOCK DIAGRAM
TDA4860
THERMAL AND
SOAR
VOLTAGE
STABILIZER
VERTICAL
DRIVER
FLYBACK
DRIVER
PROTECTION
DIFFERENTIAL
INPUT
AMPLIFIER
VERTICAL
OUTPUT
FLYBACK
GENERATOR
PULSE
CIRCUIT
1
2
3
4
5
6
7
8
9
V
V
V-OUT
SUB
FLB
V
P1
P2
P3
BAX13
+
8.8 V
PCO
5.6 Ω
470
µF
150 kΩ
270 Ω
470 µF
0.1 µF
R
10 kΩ
1.8 kΩ
1.8 kΩ
PCO
yoke
4.3 Ω
470 µF
R1
1 Ω
from TDA4850
V
N
1 MΩ
V-shift
MHA591
−
+
52 V
8.1 V
Assumed values:
Iyoke = 1.42 A.
Ryoke = 4.17 Ω + 7% + ∆R(T) = 6.12 Ω.
Lyoke = 5.25 mH.
R1 = 1.0 Ω ±1%.
Tamb = 65 °C.
Tj(max) = 105 °C.
Tyoke = 75 °C.
Pyoke = 1.2 W.
PIC = 1.8 W.
Ptot = 3.0 W.
tp FLB = typically 250 µs.
Attention: the heatsink of the IC must be isolated against ground; the cooling fin is connected to pin 6.
Fig.1 Block diagram and application circuit with flyback supply voltage VP3 from an external source.
Deflection frequency range from 50 Hz to 100 Hz.
1997 Oct 27
3
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Philips Semiconductors
Product specification
Vertical deflection power amplifier for
monitors
TDA4860
PINNING
SYMBOL PIN
DESCRIPTION
supply voltage 1
handbook, halfpage
V
VP1
1
2
3
1
2
3
4
5
6
7
8
9
P1
INP1
INP2
VP2
input 1 of differential input amplifier
input 2 of differential input amplifier
INP1
INP2
supply voltage 2 for vertical output
stage
4
V
P2
V-OUT
SUB
TDA4860
V-OUT
SUB
FLB
5
6
7
8
9
vertical output
substrate
flyback generator output
flyback supply voltage 3
pulse circuit output
FLB
VP3
V
P3
PCO
PCO
MHA593
Fig.2 Pin configuration.
FUNCTIONAL DESCRIPTION
Differential input amplifier
Vertical output
The vertical output stage is a quasi-complementary
class-B amplifier with a high linearity. The output contains
SOAR (short-circuit protection) and thermal protection.
The output current on pin 5 is reduced for a short time
(to let the temperature decrease to Tj < 150 °C), when the
junction temperature (Tj) exceeds 160 °C.
The differential sawtooth input signal (coming from a ramp
output of the TDA4850 for example) is fed to the input
pins 2 and 3. The non-inverted signal is attached to pin 3.
The vertical feedback signal is superimposed on the
inverted input signal on pin 2.
Vertical shift is applied at the inputs in a power-less way
(see Fig.1).
Deflection GUARD
Pin 9 will go HIGH if the junction temperature goes to high
(see Fig.3). A pulse signal with 50% duty cycle is output on
pin 9, if the deflection coil is open-circuit. A flyback pulse
signal is output at normal conditions.
Flyback generator
Signals for the flyback generator and the pulse circuit are
generated in the flyback driver stage. The flyback output
consists of a Darlington transistor and a flyback diode.
The flyback generator can operate in two modes:
Further watching can be achieved by means of an external
GUARD circuit as shown in Fig.4. The 22 µF capacitor is
charged during flyback time (V5 > V8) at normal conditions.
In case of failures, the capacitor is discharged and the
GUARD output goes HIGH.
1. An external supply voltage is applied for the short
flyback time, thus the power dissipation is minimum
(see Fig.1).
GUARD output level (see Fig.4):
2. The flyback voltage is generated by doubling the
supply voltage (see Fig.5). The 100 µF capacitor C2
between pins 4 and 7 is charged up to VP1 during
scan, using the external diode and the resistor R2.
The cathode of the capacitor C2 is connected to the
positive rail during flyback. Thus, the flyback voltage is
twice the supply voltage.
• LOW for normal conditions
• HIGH for deflection coil short-circuit respectively
open-circuit
• HIGH when there are neither input or output signals.
1997 Oct 27
4
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Philips Semiconductors
Product specification
Vertical deflection power amplifier for
monitors
TDA4860
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); voltages referenced to substrate (pin 6); unless
otherwise specified.
SYMBOL
VP1
PARAMETER
supply voltage (pin 1)
CONDITIONS
MIN.
MAX.
40
UNIT
−
−
−
−
−
−
−
−
−
V
V
V
V
V
A
A
A
VP2
VP3
V2,3,9
V5,7
I4
supply voltage (pin 4)
60
supply voltage (pin 8)
60
voltage on pins 2, 3 and 9
voltage on pins 5 and 7
current on pin 4
VP1
60
1
I5 (M)
I7 (M)
I9
output current on pin 5 (peak value)
flyback current on pin 7 (peak value)
current on pin 9
note 1
±1.3
±1.3
−8
+150
+75
168
±300
mA
°C
°C
°C
V
Tstg
Tamb
Tj
storage temperature
−25
−20
−
operating ambient temperature
junction temperature
note 1
note 2
Ves
electrostatic handling for all pins
−
Notes
1. Internally limited by thermal protection; switching temperature point at 160 ±8 °C.
2. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-c
PARAMETER
VALUE
UNIT
thermal resistance from junction to case
10
K/W
The heatsink can be estimated according to application circuit (see Fig.1):
T
j(max) – Tamb
105 °C – 65 °C
----------------------------------------
1.8 W
Rth j-a = Rth j-c + Rth c-h + Rth h-a
=
=
= 22.2 K/W .
----------------------------------
PIC(max)
A heatsink is needed at Rth j-c < 10 K/W and Rth c-h = 0.5 K/W (using silicon grease) with
Rth h-a = 22.2 K/W − (10 + 0.5) K/W = 11.7 K/W.
1997 Oct 27
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Philips Semiconductors
Product specification
Vertical deflection power amplifier for
monitors
TDA4860
CHARACTERISTICS
VP1 = VP2 = 25 V; VN = V6 = 0 V; Tamb = 25 °C; voltages referenced to substrate (pin 6); unless otherwise specified.
SYMBOL
PARAMETER
supply voltage 1 (pin 1)
supply voltage 2 (pin 4)
supply voltage 3 (pin 8)
supply current (pin 1)
CONDITIONS
MIN.
TYP.
25
MAX.
30
UNIT
VP1
VP2
VP3
IP1
9
9
9
−
−
V
V
V
25
−
−
60
60
10
−
mA
mA
IP2
quiescent supply current (pin 4)
without input signal
9
Pre-amplifier
V2,3
I2,3
input voltage (pins 2 and 3)
input quiescent current
1.6
−
100
VP1 − 0.5 V
− nA
without input signal
−
Flyback generator
V7
output voltage
upper value; I7 = −1 A
−
−
VP3 − 2.2 −
V
A
I7(M)
flyback output current
(maximum value; pin 7)
−
±1
V1-5
threshold voltage to switch flyback
flyback pulse time
on/off threshold
see Figs 1 and 3
−
−
1.4
−
−
V
tp FLB
250
µs
Vertical output; see Fig.3
V5
output voltage
upper value; I5 = −1 A VP2 − 2.3 VP2 − 2
−
1.7
±1
V
V
A
lower value; I5 = 1 A
−
−
1.5
I5(M)
LIN
vertical output current
(maximum value; pin 5)
−
non-linearity of output signal
−
−
−
1
%
Pulse circuit output; see Fig.3
V9
output voltage
RPCO = 10 kΩ;
see Fig.1
0.4
VP1 − 0.4 V
V9
output voltage for thermal protection
active
VP1 − 0.4 −
−
V
V1-5
tp9
voltage to insert flyback pulse on pin 9 normal condition
pulse width deflection open-circuit −
normal condition tp FLB
−
−
50
−
1.4
−
−
V
%
µs
1997 Oct 27
6
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Philips Semiconductors
Product specification
Vertical deflection power amplifier for
monitors
TDA4860
INP1
input signal
on pin 2
t
INP2
input signal
on pin 3
t
t
= 250 µs
pFLB
V-OUT
output signal
on pin 5
t
t
t
PCO
output signal
on pin 9 for
normal condition
t
p9
PCO
50%
output signal
on pin 9 for deflection
unit open-circuit
PCO
output signal
on pin 9 for thermal
protection active
t
MEH361
Fig.3 Vertical timing.
7
1997 Oct 27
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Philips Semiconductors
Product specification
Vertical deflection power amplifier for
monitors
TDA4860
APPLICATION INFORMATION
V
k
P3
8
5
V
P
BAX13
TDA4860
>1 kΩ
GUARD output
HIGH = error
2.2 Ω
3.3 kΩ
BC548
2N5819
22 µF
220 kΩ
vertical
output
signal
MEH262
Fig.4 GUARD circuit application on vertical output.
TDA4860
THERMAL AND
VOLTAGE
STABILIZER
VERTICAL
DRIVER
FLYBACK
DRIVER
SOAR
PROTECTION
DIFFERENTIAL
INPUT
AMPLIFIER
VERTICAL
OUTPUT
FLYBACK
GENERATOR
PULSE
CIRCUIT
1
2
3
4
5
6
7
8
9
V
V
V-OUT
SUB
FLB
V
P1
P2
P3
BAX13
C2 100 µF
PCO
+
9 V
5.6 Ω
470
µF
R2 240 Ω
150 kΩ
R
270 Ω
10 kΩ
PCO
0.1 µF
1.8 kΩ
1.8 kΩ
5.25 mH
yoke
470 µF
R1
1 Ω
from TDA4850
MHA592
1 MΩ
V-shift
V
N
−
7.8 V
Fig.5 Application for flyback voltage generation by doubling the supply voltage.
8
1997 Oct 27
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Philips Semiconductors
Product specification
Vertical deflection power amplifier for
monitors
TDA4860
V
INP1
2
INP2
3
V
V-OUT SUB
V
P3
PCO
9
P1
P2
1
4
5
6
7
8
cooling fin
TDA4860
MEH266
Fig.6 Internal circuitry.
1997 Oct 27
9
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Philips Semiconductors
Product specification
Vertical deflection power amplifier for
monitors
TDA4860
PACKAGE OUTLINE
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
D
D
1
q
A
2
P
P
1
A
3
q
2
q
1
A
A
4
E
pin 1 index
c
L
1
9
b
Q
e
Z
b
w
M
2
b
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
Z
max.
A
max.
2
(1)
(1)
E
UNIT
A
A
b
b
b
c
D
D
e
L
P
P
Q
q
q
q
2
w
A
3
4
1
2
1
1
1
18.5
17.8
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20
3.9 2.75 3.4 1.75 15.1
3.4 2.50 3.2 1.55 14.9
4.4
4.2
5.9
5.7
2.54
mm
3.7
0.25 1.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-25
SOT110-1
1997 Oct 27
10
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Philips Semiconductors
Product specification
Vertical deflection power amplifier for
monitors
TDA4860
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Oct 27
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© Philips Electronics N.V. 1996
SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
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Printed in The Netherlands
547047/1200/03/pp12
Date of release: 1997 Oct 27
Document order number: 9397 750 02782
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