Philips Stereo Amplifier TDA2613 User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA2613  
6 W hi-fi audio power amplifier  
July 1994  
Product specification  
File under Integrated circuits, IC01  
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Philips Semiconductors  
Product specification  
6 W hi-fi audio power amplifier  
TDA2613  
Fig.1 Block diagram.  
PINNING  
1.  
2.  
n.c.  
n.c.  
not connected  
not connected  
ground (asymmetrical) or  
5.  
GND  
OUT  
negative supply (symmetrical)  
output  
1
V (asymmetrical) or  
6.  
7.  
8.  
9.  
2
P
3.  
4.  
V /2  
P
ground (symmetrical)  
not connected  
+V  
positive supply  
P
n.c.  
INV  
inverting input  
INV  
non-inverting input  
July 1994  
3
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Philips Semiconductors  
Product specification  
6 W hi-fi audio power amplifier  
TDA2613  
FUNCTIONAL DESCRIPTION  
This hi-fi power amplifier is designed for mains fed applications. The device is intended for asymmetrical power supplies,  
but a symmetrical supply may also be used. An output power of 6 watts (THD = 0,5%) can be delivered into an 8 load  
with an asymmetrical power supply of 24 V.  
The gain is fixed internally at 30 dB. Internal gain fixing gives low gain spread.  
A special feature of this device is a mute circuit which suppresses unwanted input signals during switching on and off.  
Referring to Fig.4, the 100 µF capacitor creates a time delay when the voltage at pin 3 is lower than an internally fixed  
reference voltage. During the delay the amplifier remains in the DC operating mode but is isolated from the non-inverting  
input on pin 9.  
Two thermal protection circuits are provided, one monitors the average junction temperature and the other the  
instantaneous temperature of the power transistors. Both protection circuits activate at 150 °C allowing safe operation to  
a maximum junction temperature of 150 °C without added distortion.  
RATINGS  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
PARAMETER  
CONDITIONS  
SYMBOL  
MIN.  
MAX.  
42  
UNIT  
Supply voltage  
V
V
A
P
Non-repetitive peak  
output current  
I
4
OSM  
Total power dissipation  
Storage temperature range  
Junction temperature  
Short-circuit time:  
outputs short-circuited  
to ground  
see Fig.2  
P
T
tot  
55  
+ 150  
150  
°C  
°C  
stg  
j
T
see note  
(full signal drive)  
t
1
hour  
sc  
Note to the Ratings  
For asymmetrical power supplies (at short-circuiting of the load) the maximum supply voltage is limited to V = 28 V.  
P
If the total internal resistance of the supply (R ) 4 , the maximum unloaded supply voltage is increased to 32 V.  
S
For symmetrical power supplies the circuit is short-circuit proof to V = ± 21 V.  
P
July 1994  
4
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Philips Semiconductors  
Product specification  
6 W hi-fi audio power amplifier  
TDA2613  
Fig.2 Power derating curve.  
THERMAL RESISTANCE  
From junction to case  
R
= 8 K/W  
th j-c  
HEATSINK DESIGN EXAMPLE  
With derating of 8 K/W, the value of heatsink thermal resistance is calculated as follows:  
given R = 8 and V = 24 V, the measured maximum dissipation is 4,1 W; then, for a maximum ambient temperature  
L
P
of 60 °C, the required thermal resistance of the heatsink is:  
150 60  
Rth h-a  
=
8 14 K/W  
----------------------  
4,1  
Note: The metal tab (heatsink) has the same potential as pin 5 (GND).  
July 1994  
5
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Philips Semiconductors  
Product specification  
6 W hi-fi audio power amplifier  
TDA2613  
CHARACTERISTICS  
PARAMETER  
CONDITIONS SYMBOL  
MIN.  
TYP.  
MAX.  
UNIT  
Supply voltage range  
operating mode  
input mute mode  
Repetitive peak  
output current  
V
V
15  
24  
42  
V
V
P
4
10  
P
I
2.2  
A
ORM  
Operating mode: asymmetrical power supply; test circuit as per Fig.4;  
V = 24 V; R = 8 ; T = 25 °C; f = 1 kHz  
P
L
amb  
Total quiescent current  
Output power  
I
10  
5
20  
6
35  
mA  
W
tot  
THD = 0,5%  
P
P
o
o
THD = 10%  
6,5  
8,0  
W
Total harmonic  
distortion  
P = 4 W  
THD  
B
0,15  
0,2  
%
o
Power bandwidth  
THD = 0,5%;  
note 1  
29  
20 to 16 k  
30  
31  
Hz  
dB  
Voltage gain  
G
v
Noise output voltage  
(r.m.s. value);  
unweighted (20 Hz  
to 20 kHz)  
R = 2 kΩ  
V
14  
70  
20  
140  
26  
µV  
kΩ  
S
no(rms)  
Input impedance  
Supply voltage  
ripple rejection  
Input bias current  
DC output offset  
voltage  
|Z |  
i
note 2  
SVRR  
35  
44  
dB  
I
0,3  
µA  
ib  
with respect  
to V /2  
V
30  
200  
mV  
P
os  
Input mute mode: asymmetrical power supply; test circuit as per Fig.4;  
V = 8 V; R = 8 ; T = 25 °C; f = 1 kHz  
P
L
amb  
Total quiescent current  
Output voltage  
Noise output voltage  
(r.m.s. value);  
I
5
15  
20  
mA  
mV  
tot  
V = 600 mV  
V
2,0  
2,8  
i
out  
unweighted (20 Hz  
to 20 kHz)  
R = 2 kΩ  
V
70  
55  
40  
140  
µV  
dB  
mV  
S
no(rms)  
Supply voltage  
ripple rejection  
DC output offset  
voltage  
note 2  
SVRR  
35  
with respect  
to V /2  
V
200  
P
os  
July 1994  
6
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Philips Semiconductors  
Product specification  
6 W hi-fi audio power amplifier  
TDA2613  
PARAMETER  
CONDITIONS SYMBOL  
MIN.  
TYP.  
MAX.  
UNIT  
Operating mode: symmetrical power supply; test circuit as per Fig.3;  
V = ± 12 V; R = 8 ; T = 25 °C; f = 1 kHz  
P
L
amb  
Total quiescent current  
Output power  
I
10  
20  
6
35  
mA  
tot  
THD = 0,5%  
P
P
5
W
W
%
o
o
THD = 10%  
6,5  
8,5  
Total harmonic distortion  
Power bandwidth  
P = 4 W  
THD  
0,13  
0,2  
o
THD = 0,5%  
note 1  
B
29  
40 to 16 k  
30  
31  
Hz  
dB  
Voltage gain  
G
v
Noise output voltage  
(r.m.s. value);  
unweighted (20 Hz to  
20 kHz)  
R = 2 kΩ  
V
14  
70  
20  
140  
26  
µV  
kΩ  
S
no(rms)  
Input impedance  
Supply voltage  
ripple rejection  
DC output offset  
voltage  
|Z |  
i
SVRR  
40  
60  
30  
dB  
with respect  
to ground  
V
200  
mV  
os  
Notes to the characteristics  
1. Power bandwidth at P  
3 dB.  
o max  
2. Ripple rejection at R = 0 , f = 100 Hz to 20 kHz;  
S
ripple voltage = 200 mV (r.m.s. value) applied to positive or negative supply rail.  
July 1994  
7
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Philips Semiconductors  
Product specification  
6 W hi-fi audio power amplifier  
TDA2613  
APPLICATION INFORMATION  
Fig.3 Test and application circuit; symmetrical power supply.  
Fig.4 Test and application circuit; asymmetrical power supply.  
July 1994  
8
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Philips Semiconductors  
Product specification  
6 W hi-fi audio power amplifier  
TDA2613  
Input mute circuit  
1
The input mute circuit operates only during switching on and off of the supply voltage. The circuit compares the supply  
2
voltage (at pin 3) with an internally fixed reference voltage (V ), derived directly from the supply voltage. When the  
ref  
voltage at pin 3 is lower than V the non-inverting input (pin 9) is disconnected from the amplifier. The voltage at pin 3  
ref  
is determined by an internal voltage divider and the external 100 µF capacitor.  
During switching on, a time delay is created between the reference voltage and the voltage at pin 3, during which the  
input terminal is disconnected, (as illustrated in Fig.5).  
Fig.5 Input mute circuit; time delay.  
July 1994  
9
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Philips Semiconductors  
Product specification  
6 W hi-fi audio power amplifier  
TDA2613  
PACKAGE OUTLINE  
SIL9MPF: plastic single in-line medium power package with fin; 9 leads  
SOT110-1  
D
D
1
q
A
2
P
P
1
A
3
q
2
q
1
A
A
4
E
pin 1 index  
c
L
1
9
b
Q
e
Z
b
w
M
2
b
1
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
Z
max.  
A
max.  
2
(1)  
(1)  
E
UNIT  
A
A
b
b
b
c
D
D
e
L
P
P
Q
q
q
q
2
w
A
3
4
1
2
1
1
1
18.5  
17.8  
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48  
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20  
3.9 2.75 3.4 1.75 15.1  
3.4 2.50 3.2 1.55 14.9  
4.4  
4.2  
5.9  
5.7  
2.54  
mm  
3.7  
0.25 1.0  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-11-17  
95-02-25  
SOT110-1  
July 1994  
10  
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Philips Semiconductors  
Product specification  
6 W hi-fi audio power amplifier  
TDA2613  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
SOLDERING  
Introduction  
specified maximum storage temperature (T  
). If the  
stg max  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
Repairing soldered joints  
Apply a low voltage soldering iron (less than 24 V) to the  
lead(s) of the package, below the seating plane or not  
more than 2 mm above it. If the temperature of the  
soldering iron bit is less than 300 °C it may remain in  
contact for up to 10 seconds. If the bit temperature is  
between 300 and 400 °C, contact may be up to 5 seconds.  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
Soldering by dipping or by wave  
The maximum permissible temperature of the solder is  
260 °C; solder at this temperature must not be in contact  
with the joint for more than 5 seconds. The total contact  
time of successive solder waves must not exceed  
5 seconds.  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
July 1994  
11  
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