Panasonic Network Card MAU2111 User Manual

This product complies with RoHS Directive (EU 2002/95/EC).  
Switching Diodes  
MAU2111  
Silicon epitaxial planar type  
For high speed switching circuits  
Unit: mm  
+0.05  
0.60 0.05  
1
0.13  
0.02  
Features  
Optimum for high-density mounting  
Short reverse recovery time trr  
Small terminal capacitance Ct  
Absolute Maximum Ratings Ta = 25°C  
2
+0.05  
0.2  
Parameter  
Reverse voltage  
Symbol  
Rating  
80  
Unit  
V
0.02  
5°  
VR  
VRM  
IF  
Maximum peak reverse voltage  
Forward current  
80  
V
100  
mA  
mA  
mA  
°C  
Forward current (Average)  
Non-repetitivepeakforward surge current *  
Junction temperature  
IFM  
IFSM  
Tj  
225  
500  
1: Anode  
2: Cathode  
150  
USSMini2-F1 Package  
Storage temperature  
T
stg  
–55 to +150  
°C  
Marking Symbol: 11  
Note) : t = 1 s  
*
Electrical Characteristics Ta = 25°C±3°C  
Parameter  
Forward current  
Symbol  
VF  
Conditions  
Min  
Typ  
Max  
Unit  
V
IF = 100 mA  
IR = 100 mA  
VR = 75 V  
0.95  
1.2  
Reverse voltage  
VR  
80  
V
Reverse current  
IR  
100  
2
nA  
pF  
Terminal capacitance  
Ct  
VR = 0, f = 1 MHz  
0.6  
IF = 10 mA, VR = 6 V, Irr = 0.1 IR ,  
Reverse recovery time *  
trr  
3.0  
ns  
RL = 100 W  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.  
2. Absolute frequency of input and output is 100 MHz.  
3. *: trr measurement circuit  
Bias Application Unit (N-50BU)  
Input Pulse  
tp  
Output Pulse  
trr  
tr  
t
10%  
IF  
t
A
90%  
VR  
I
rr = 0.1 IR  
F = 10 mA  
R = 6 V  
L = 100 Ω  
tp = 2 µs  
tr = 0.35 ns  
δ = 0.05  
I
V
Pulse Generator  
Wave Form Analyzer  
R
(PG-10N)  
(SAS-8130)  
Rs = 50 Ω  
Ri = 50 Ω  
Publication date: September 2006  
SKF00070AED  
1
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Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other  
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other  
company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita  
Electric Industrial Co., Ltd.  
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