Panasonic Network Card EZACT User Manual

Chip RC Networks  
Chip RC Networks  
Type:  
EZASTB/SSB  
Type:  
EZACT  
EZADT  
EZAST/SS  
EZANT  
GND  
GND  
GND  
GND  
Features  
Smallest SMD R/C networks  
4 popular noise reduction circuits made  
EZACT  
EZADT  
EZAST/SS  
: 2.0 mm ҂ 1.2 mm ҂ 0.6 mm, 0.5 mm pitch (Flat terminal type)  
: 3.2 mm ҂ 1.6 mm ҂ 0.65 mm, 0.635 mm pitch (Concave terminal type)  
: 4.0 mm ҂ 2.1 mm ҂ 0.65 mm, 0.8 mm pitch (Concave terminal type)  
EZASTB/SSB : 4.0 mm ҂ 2.1 mm ҂ 0.65 mm, 0.65 mm pitch (Convex terminal type)  
EZANT : 6.4 mm ҂ 3.1 mm ҂ 0.80 mm, 1.27 mm pitch (Concave terminal type)  
Takes up less space than discrete chip resistor & chip capacitor  
EZACT:25 % of 0402 inches (1.0 mm ҂ 0.5 mm) chips placing area  
EZADT:50 % of 0402 inches (1.0 mm ҂ 0.5 mm) chips placing area  
EZAST/SS, EZASTB/SSB:70 % of 0402 inches (1.0 mm ҂ 0.5 mm) chips placing area  
EZANT:55 % of 0805 inches (2.0 mm ҂ 1.2 mm) chips placing area  
<Effect of high density placing, PWB space saving>  
RC Low pass filter  
AC Terminator  
I/O  
I/O  
I/O  
I/O  
Chip RC Network  
(EZACT, EZADT, EZAST/SS, EZANT)  
I/O  
I/O  
Chip RC Network  
(EZACT, EZADT, EZAST/SS, EZANT)  
I/O  
I/O  
Discrete Chips  
I/O  
I/O  
I/O  
I/O  
Discrete Chips  
Chip RC Network  
(EZASTB/SSB)  
Chip RC Network  
(EZASTB/SSB)  
Recommended Applications  
Digital equipment such as PCs, printers, HDD, PCMCIA cards, PDAs, and word processors  
Communication equipment, digital cordless phones, automobile phones, GSM, PHS, DECT  
Digital audio and video equipment  
Electronic musical instruments, and other digital devices  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Feb. 2006  
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Chip RC Networks  
Explanation of Part Numbers  
EZASSB (R/C Except the standard Combination)  
1
2
3
4
5
6
7
8
9
10  
11  
12  
E
Z
A
S
S
B
7
0
1
A
J
Design Number  
Resistance Suffix for Special  
Common Code  
Dimension and  
Tolerance  
Requirement  
Circuit Configuration  
Resistance Value : 10 ȑ to 100 kȑ  
Capacitance Value : 10 pF to 180 pF  
In above-mentioned range, it is possible to  
choose optional R/C.  
Thick Film Noise  
Suppression and  
Filtering  
Convex  
terminal type  
Chip RC  
J
5 %  
4.0 mm  
҂2.1 mm  
SSB  
Components  
Networks  
Construction  
EZACT  
EZADT  
EZAST/SS  
Alumina substrate Marking  
Alumina substrate Marking  
Marking  
Protective coating  
Alumina substrate  
GND  
GND  
Electrode  
(Outer)  
Electrode  
(Outer)  
33  
GND  
Electrode  
(Outer)  
GND  
Electrode  
(Outer)  
GND  
Electrode  
(Outer)  
Electrode  
(Outer)  
Protective coating  
Electrode  
(Outer)  
Protective coating Electrode  
(Outer)  
EZANT  
EZASTB/SSB  
Marking  
Alumina substrate  
Alumina substrate  
Marking  
GND  
Electrode  
(Outer)  
GND  
Electrode  
(Outer)  
GND  
Electrode  
(Outer)  
33  
GND  
Electrode  
(Outer)  
Protective coating Electrode  
(Outer)  
Protective coating Electrode  
(Outer)  
Circuit Configuration  
EZACT  
EZADT EZAST/SS EZANT  
EZASTB/SSB  
12  
11 10  
9
8
7
6
10  
R1  
9
8
7
10  
R1  
9
8
7
R1 R2 R3 R4  
R2  
R3  
R4  
R2  
R3  
R4  
GND  
GND  
1
6 GND  
GND  
1
6
C4  
C2  
C1  
C2  
C3  
C4  
C1  
C3  
C1  
C2  
C3  
C4  
2
3
4
5
2
3
4
5
1
2
3
4
5
GND  
R1=R2=R3=R4  
C1=C2=C3=C4  
GND  
R1=R2=R3=R4  
C1=C2=C3=C4  
R1=R2=R3=R4  
C1=C2=C3=C4  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Feb. 2006  
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Chip RC Networks  
Dimensions in mm(not to scale)  
EZACT  
EZADT  
0.33 0.10  
10  
9
8
7
10  
9
8
7
1
6
1
6
2
3
4
5
0.635 0.100  
0.35 0.15  
2
3
4
5
0.65+–  
0.20  
0.5 0.1  
0.25 0.15  
3.20 0.15  
0.10  
2.0 0.1  
0.55 0.10  
0.35 0.10  
0.30 0.15  
0.20 0.15  
Size : 0805 inches  
Mass (Weight) [1000 pcs.] :4 g  
Size : 1206 inches  
Mass (Weight) [1000 pcs.] :11 g  
EZAST/SS  
EZANT  
0.5 0.2  
10  
9
8
7
10  
9
8
7
1
6
1
6
33  
2
3
4
5
1.27 0.10  
0.5 0.2  
0.65 0.20  
2
3
4
5
0.8 0.1  
0.80+–  
0.20  
6.4 0.2  
0.10  
0.65+–  
0.20  
0.10  
4.0 0.2  
0.45 0.20  
0.75 0.20  
0.4 0.2  
Size : 1608 inches  
Mass (Weight) [1000 pcs.] :17 g  
Size : 2512 inches  
Mass (Weight) [1000 pcs.] :55 g  
EZASTB/SSB  
0.58 0.2 0.4 0.2  
0.25 0.15  
10  
9
8
7
11  
12  
33  
1
2
3
4
5
6
0.65 0.10  
0.65+–  
4.0 0.2  
0.20  
0.10  
0.2+–  
0.275+–  
0.2  
0.1  
0.200  
0.100  
Size : 1608 inches  
Mass (Weight) [1000 pcs.] :18 g  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Feb. 2006  
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Chip RC Networks  
Ratings  
Item  
Specification  
10 to 100 k  
ȑ
ȑ
Resistance Values  
Resistance Tolerance  
EZAC Standard : 10 , 22 , 47 , 100 , 220 , 470 , 1 k  
ȑ
ȑ
ȑ
ȑ
ȑ
ȑ
ȑ
ȑ
ȑ
ȑ
ȑ
EZAD/S/N Standard : 22 , 47 , 100 , 220 , 470 , 1 k  
ȑ
ȑ
5 %  
Temperature Coefficient of Resistance (T.C.R.)  
200 10–6/°C(ppm/°C)  
҂
EZAC : 0.031 W( 70 °C(1))  
<
Rated Power  
EZAD/S/N : 0.063 W( 70 °C(1))  
<
Limiting Element Voltage (Maximum Rated Continuous Working Voltage)  
25 V(2)  
EZAC : 10 pF to 33 pF  
Standard : 10 pF, 22 pF  
EZAD : 10 pF to 100 pF  
Capacitance Values  
EZAS : 10 pF to 180 pF  
(25 °C, 1 kHz(3), 1 Vrms)  
Standard : 22 pF, 47 pF, 100 pF  
EZAN : 220 pF to 1000 pF  
Standard : 220 pF, 470 pF, 1000 pF  
Capacitance Tolerance  
+30 %/–20 %  
Capacitance Temperature Characteristics  
Dissipation Factor  
E Characteristic: +20 %/–55 %(–25 to +85 °C)  
Less than 3 %(25, 1 kHz(3), 1 Vrms)  
EZAC, EZAD : 12 V  
EZAS : 25 V  
Rated Voltage  
EZAN : 50 V  
Category Temperature Range (Operating Temperature Range)  
–25 °C to +85 °C  
(1) For resistors operated in ambient temperature above 70 °C, rated power shall be derated. (“Power Derating Curve” is shown below)  
(2) Rated Voltage for resistor shall be determined from ǰRated Power҂Resistance Value, or Limiting Element Voltage (Max. Rated Continuous Working  
Voltage) whichever less.  
(3) In measuring at 1 MHz, Capacitance and Dissipation Factor are different.  
70 °C  
100  
80  
60  
40  
20  
0
Power Derating Curve  
For resistors operated in ambient temperatures above  
70 °C, power rating shall be derated in accordance  
with the figure on the right.  
85 °C  
30 20 10  
0
10 20 30 40 50 60 70 80 90  
Ambient Temperature (°C)  
Attenuation Characteristics  
EZACT  
EZADT  
10  
0
0
10  
–10  
–20  
–30  
–40  
20  
30  
40  
50  
–50  
1M  
10M  
100M  
1G  
3G  
1M  
10M  
100M  
1G  
3G  
Frequency (Hz)  
Frequency (Hz)  
EZST EZASTB  
EZANT  
0
10  
20  
30  
40  
50  
60  
70  
80  
0
10  
20  
30  
40  
50  
1 M  
10 M  
100 M  
Frequency (Hz)  
1 G  
3 G  
1M  
10M  
100M  
Frequency (Hz)  
1G  
EZACT  
EZADT  
EZAST  
EZASTB  
EZANT  
Measurement Circuit  
50 ȑ  
~
50 ȑ  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Feb. 2006  
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Chip RC Networks  
Packaging Methods (Taping)  
Standard Quantity  
Type  
Kind of Taping  
Pitch (P1)  
4 mm  
Quantity  
EZACT  
Punched Carrier Taping  
5000 pcs./reel  
EZADT  
EZAST/SS  
EZASTB/SSB  
EZANT  
Embossed Carrier Taping  
4000 pcs./reel  
Carrier Tape  
(Unit : mm)  
P1  
P2  
P0  
fD0  
T
A
T
fD1 (Only Emboss)  
f
f
D1  
Type  
EZACT  
A
1.65  
2.00  
B
2.40  
3.60  
W
F
E
P1  
P2  
P0  
D0  
T
0.15  
0.20  
0.20  
0.20  
0.20  
0.30  
0.05  
0.20  
0.10  
0.20  
0.05  
8.00  
3.50  
1.75  
0.85  
EZADT  
0.10  
0.05  
0.10  
+0.10  
1.50  
−0  
EZAST/SS  
EZASTB/SSB  
EZANT  
4.00  
2.00  
4.00  
0.20  
0.20  
0.20  
0.20  
0.20  
0.20  
2.50  
3.50  
4.40  
6.80  
1.15  
1.30  
+0.10  
12.00  
5.50  
1.75  
1.50  
−0  
Taping Reel  
(Unit : mm)  
T
f
f
f
C
Type  
A
B
W
EZACT  
EZADT  
EZAST/SS  
EZASTB/SSB  
EZANT  
1.0  
2.0  
T
9.0  
11.4  
+0  
1.0  
180.0  
60 min. 13.0  
–3.0  
1.0  
2.0  
13.0  
15.4  
f C  
f A  
W
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Feb. 2006  
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Chip RC Networks  
Recommended Land Pattern Design  
EZACT  
b g  
P
Land pattern  
a
b
c
d
Dimensions  
0.75  
0.25  
1.70  
0.35  
(mm)  
c
h
e
h
g
P
Dimensions  
(mm)  
1.85  
2.60  
0.25  
0.60  
b
P
EZADT  
Land pattern  
a
b
c
d
Dimensions  
(mm)  
0.9 to 1.1 0.2 to 0.3 2.6 to 2.8 0.3 to 0.4  
f
g
P
Dimensions  
(mm)  
2.0 to 2.6 3.6 to 4.2  
0.635  
c
g
EZAST/SS  
Solder resistant  
f2  
c
Land pattern  
a
b
c
d
Dimensions  
1.2 to 1.4  
0.4  
3.1 to 3.3 0.4 to 0.5  
(mm)  
GND  
e
f1  
f2  
P
Dimensions  
(mm)  
0.8  
2.9 to 3.3 4.8 to 5.2  
0.8  
b
P
EZASTB/SSB  
f2  
Land pattern  
a
b
c
d
Dimensions  
(mm)  
1.4 to 1.6  
0.35  
0.45  
0.3  
GND  
f1  
f2  
P
Dimensions  
(mm)  
2.7 to 3.5  
3.8  
0.65  
c
d
b
P
P
EZANT  
b
Land pattern  
a
b
c
d
Dimensions  
(mm)  
2.3 to 2.5 0.4 to 0.6 5.6 to 5.8 0.4 to 0.8  
f
g
P
Dimensions  
(mm)  
4.3 to 4.7 7.6 to 8.0  
1.27  
c
g
• Design to make GND pattern as large as possible, because high  
frequency noise is removed from GND terminals of chip RC network.  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Feb. 2006  
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Chip RC Networks  
Recommended Soldering Conditions  
Recommendations and precautions are described below.  
Recommended soldering conditions for reflow  
·Reflow soldering shall be performed a maximum of  
two times.  
·Please contact us for additional information when  
used in conditions other than those specified.  
·Please measure the temperature of the terminals and  
study every kind of solder and printed circuit board  
for solderability before actual use.  
For soldering (Example : Sn/Pb)  
Temperature  
140 °C to 160 °C  
Above 200 °C  
235 5 °C  
Time  
Preheating  
Main heating  
Peak  
60 s to120 s  
30 s to 40 s  
max. 10 s  
For lead-free soldering (Example : Sn/Ag/Cu)  
Peak  
Temperature  
150 °C to 180 °C  
Above 230 °C  
max. 260 °C  
Time  
Preheating  
Main heating  
Peak  
60 s to 120 s  
30 s to 40 s  
max. 10 s  
Preheating  
Heating  
This product has circuits on both sides. Therefore, do not use  
adhesives because they may impair the products characteristics.  
Time  
Flow Soldering  
We do not recommend flow soldering to the product, because solder bridging may occur due to the  
narrow pitch of the terminals and the characteristics of the product may be badly affected when using  
adhesive to affix it to a circuit board.  
Safety Precautions  
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,  
Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog.  
1. Take measures against mechanical stress during and after mounting of Chip RC Networks (hereafter called the RC networks)  
so as not to damage their electrodes and protective coatings.  
Be careful not to misplace the RC networks on the land patterns. Otherwise, solder bridging may occur.  
2. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the RC networks' performance  
and/or reliability.  
3. Perform sufficient preheating so that the difference of the solder temperature and the RC networks chip surface  
°
°
temperature becomes 100 C or less. Maintain the temperature difference within 100 C during rapid cooling by  
immersion into solvent after soldering.  
4. When soldering with a soldering iron, never touch the RC networks' bodies with the tip of the soldering iron. When  
using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at  
°
350 C max.).  
5. As the amount of applied solder becomes larger, the mechanical stress applied to the RC networks increases, causing  
problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.  
6. Do not apply shock to the RC networks or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the RC networks'  
protective coatings and bodies may be chipped, affecting their performance.  
7. Avoid excessive bending of printed circuit boards in order to protect the RC networks from abnormal stress.  
8. The static capacitance may decrease by a few percent from the time of shipment due to the characteristics peculiar to  
dielectric materials having a high dielectric constant.  
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.  
Should a safety concern arise regarding this product, please be sure to contact us immediately.  
Feb. 2006  
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Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements])  
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written  
agreement on the specifications with us in advance. The design and specifications in this catalog are subject  
to change without prior notice.  
• Do not use the products beyond the specifications described in this catalog.  
• This catalog explains the quality and performance of the products as individual components. Before use, check  
and evaluate their operations when installed in your products.  
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment  
where a defect in these products may cause the loss of human life or other significant damage, such as damage to  
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating  
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.  
Systems equipped with a protection circuit and a protection device  
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault  
(1) Precautions for use  
• These products are designed and manufactured for general and standard use in general electronic equipment  
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)  
• These products are not intended for use in the following special conditions. Before using the products,  
carefully check the effects on their quality and performance, and determine whether or not they can be used.  
1. In liquid, such as water, oil, chemicals, or organic solvent  
2. In direct sunlight, outdoors, or in dust  
3. In salty air or air with a high concentration of corrosive gas, such as Cl , H S, NH , SO , or NO  
4. Electric Static Discharge (ESD) Environment  
2
2
3
2
2
These components are sensitive to static electricity and can be damaged under static shock (ESD).  
Please take measures to avoid any of these environments.  
Smaller components are more sensitive to ESD environment.  
5. Electromagnetic Environment  
Avoid any environment where strong electromagnetic waves exist.  
6. In an environment where these products cause dew condensation  
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with  
resin or other materials  
• These products generate Joule heat when energized. Carefully position these products so that their heat will  
not affect the other components.  
• Carefully position these products so that their temperatures will not exceed the category temperature range due  
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components  
or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).  
• Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the  
performance or reliability of the products.  
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance  
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water  
residues. Otherwise, the insulation performance may be deteriorated.  
(2) Precautions for storage  
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival  
at your company, provided that they remain packed as they were when delivered and stored at a temperature  
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the  
date of arrival at your company)  
The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on  
the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %  
to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a  
year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of  
-10 °C to +40 °C and a relative humidity of 30 % to 75 %.  
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,  
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping  
materials) may be deformed or deteriorated, resulting in mounting failures.  
2
2
3
2
2
1. In salty air or in air with a high concentration of corrosive gas, such as Cl , H S, NH , SO , or NO  
2. In direct sunlight  
<Package markings>  
Package markings include the product number, quantity, and country of origin.  
In principle, the country of origin should be indicated in English.  
Feb. 2006  
– EX2 –  
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