Navman GPS Receiver LA000267 User Manual

Jupiter 32

Miniature 20-channel

GPS receiver module

Integrator’s Manual

Related documents

• Jupiter 32 Product Brief LA000268

• Jupiter 32 Data Sheet LA000267

• Jupiter Development Kit Guide LA000645

• Low Power Operating Modes Application

Note LA000513

• Jupiter 32/30 Saving and retrieving

conﬁguration data to Flash and Selectable

user proﬁles Application Note LA000266

• Navman NMEA Reference Manual

MN000315

• SiRF Binary Protocol Reference Manual,

MN000314

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Figures

Figure 2-1: Jupiter 32 mechanical layout............................................................................ 3

Figure 2-2: Basic Jupiter 32 application circuit................................................................... 4

Figure 2-3: Example PCB layout for external active antenna............................................. 4

Figure 2-4: Decoupling Capacitor Placement .................................................................... 5

Figure 2-5: Arrangement of active antenna and application board .................................... 6

Figure 2-6: Cross section of application board with passive patch antenna...................... 7

Figure 2-7: PCB microstrip dimensions.............................................................................. 7

Figure 2-8: Simple current limiter circuit............................................................................11

Figure 2-9: External Active Antenna Control and Current Limit circuit..............................11

Figure 2-10: Jupiter 32 adapter board ...............................................................................12

Figure 3-1: Moisture Barrier Bag Label .............................................................................13

Figure 3-2: Reel dimensions .............................................................................................13

Figure 3-3: Jupiter 32 Packaging ......................................................................................14

Figure 4-1: Sample Lead and Lead free reﬂow proﬁle ......................................................16

Tables

Table 2-1: Jupiter 32 Module pad functions........................................................................ 2

Table 2-2: Decoupling recommendations........................................................................... 6

Table 2-3: PCB substrate thicknesses v track width .......................................................... 7

Table 2-4: Passive and active Patch antenna features ...................................................... 9

Table 2-5: Recommended antenna characteristics...........................................................10

Table 2-6: Connector conﬁguration...................................................................................12

Table 5-1: Low power modes message values .................................................................19

Table 5-2: Low power acquisition input values..................................................................19

Table 5-3: Actions based on signal state ......................................................................... 20

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1.0 Introduction

The Navman Jupiter 32 module is a complete GPS receiver designed for surface mount

assembly integration. The Jupiter 32 provides a simple, cost effective GPS solution for

application designers. Application integration will vary primarily with respect to antenna system

design and EMI protective circuitry.

The Jupiter 32 is the successor to the established Jupiter 30, being electrically compatible and

having a very small form factor. The provides an easy migration path for existing users requiring

very small packaging, low cost, high volume, greater sensitivity, lower power consumption and a

faster ﬁx.

Basic operation requires a power supply, GPS antenna system interface, relevant EMI

protection, and the design and layout of a custom PCB. This document outlines the following

design considerations and provides recommended solutions:

Hardware application information

This section introduces the system interface and provides the following physical speciﬁcations:

a. electrical connections (SMT pad interface)

b. mounting (PCB pad layout dimensions)

c. manufacturing recommendations

d. application circuit interface

It also discusses fundamental considerations when designing for RF, and presents the antenna

system design overview. This covers the following topics:

a. PCB layout

b. antenna system design choices

A sample solution is presented and discussed. Due to the nature and complexity of GPS signals,

it is recommended that application integrators adhere to the design considerations and criteria

described in this document.

Software application information

This section provides answers to some common questions that might not have been covered in

the above topics.

2.0 Hardware application information

The Jupiter 32 module provide 34 Land Grid Array (LGA) pads for electrical connections. The

sections that follow introduce the physical and relative functional speciﬁcations for application

integration.

Note: The electrical connections can carry very low level GPS signals at 1.57542 GHz. The

layout must be designed appropriately with consideration of the frequencies involved.

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2.1 Electrical connections (SMT pad interface)

The round hole on the front label side of the chip locates pad A1. The pads are designated

A-F and 1-7. Details of the pad layout and numbering are shown in Figure 2-1.

Pad No

Pad Names

RF_IN

Type

Description

RF Input 50 ohm

GND

RF signal ground return

ground

GND

VANT

active antenna power input

reserved

GPIO15

GPIO14

RF_ON

I/O

reserved

output to indicate whether the RF section is

enabled (active high)

GND

RF signal ground return

VDD_BB

baseband power supply input for external

regulator build option - DO NOT CONNECT

reserved

GPIO4

GPIO13

I/O

reserved

VDD_RTC

RTC power supply input for external regulator

build option - DO NOT CONNECT

reserved

GPIO1

GND

I/O

ground

TCXO_IN

TCXO input for external TCXO build option

- DO NOT CONNECT

BOOT

LNA _EN

active high to download ﬂash ﬁrmware

external antenna enable, active high

FACTORY USE ONLY

N_GPS_FIX

reserved

active low when 2D or 3D ﬁx data

available

RXA

TXA

I/O

CMOS level asynchronous input for UARTA

CMOS level asynchronous output for UARTA

GND

ground

GND

ground

GPIO2

N_RESET

RXB

reserved

master reset, active low

CMOS level asynchronous input for UARTB

1 pulse per second output 1µs wide

1PPS

PWRIN

VBATT

3.0 - 3.6V main power supply input

1.9 - 3.6V backup battery input

VCC_RF

RF power supply output for external regulator

option. Connect as per application circuit.

- Figure 2-2

WAKEUP

Push-to-Fix wake-up, active high

N_WAKEUP

low output indicates baseband is powered up

- DO NOT CONNECT

TXB

CMOS level asynchronous output for UARTB

ECLK

external clock input, not used

Table 2-1: Jupiter 32 Module pad functions

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All dimensions in mm

Figure 2-1: Jupiter 32 mechanical layout

2.2 Typical application circuit

The schematic in Figure 2-2 (next page) represents a very basic application circuit, with simple

interfaces to the module. It is subject to variations depending on application requirements.

2.2.1 Power for receiver and active antenna

The receiver power connection requires a clean 3.3 VDC. Noise on this line may affect the

performance of the GPS receiver.

When an active antenna is used, the DC power is fed to it through the antenna coax. This

requires the user to apply the antenna DC voltage to pad A4 of the module.

A 2.85V 30mA supply is made available on pad F3 if the chosen antenna can accept that

voltage. This supply is under the command of the TricklePower energy control.

The source impedance of the power supply must be kept sufﬁciently low. The capacitance of

the power supply and PCB track width determine the overall source impedance. If a passive

antenna is used, the supply must be able to provide a minimum of 100mA continuously with

minimal ripple as measured at the power input pin. This ripple requirement must be adhered

to for a larger current ﬂow when an active antenna is used. In-rush current for some active

antennas have been measured as high as 70mA and may cause a dip in voltage or ripple.

Therefore, a low source impedance is important since the power to the Jupiter 32 must be

able to accommodate instantaneous currents in excess of 200mA.

2.2.2 Grounding

Separate analogue and digital grounds are not used. However, the antenna signal ground

uses a particular layout for optimum results. See Figure 2-3 (next page) and Section 2.3.5

for ground plane recommendations and for design considerations involving the antenna input

and the 50ohm microstrip connection.

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Jupiter 32 Reference Design

3.0-3.6V

10nF Battery

1nF

1uF

1nF

10nF

Coaxial Connector

50 ohm Microstrip

N_GPS_FIX D4

TXA D7

See Section 2.5

10K

A2 GND

27 pF

A1 RF_IN

B1 GND

RXA D5

Jupiter 32

27 pF

1 PPS

1PPS E7

C4 BOOT

27 pF

E5 N_RESET

F4 WAKEUP

TXB F6

RXB E6

Figure 2-2: Basic Jupiter 32 application circuit

(Top)

(Bottom)

Figure 2-3: Example PCB layout for external active antenna

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2.2.3 Decoupling

The schematic in Figure 2-2 illustrates a suggested method of decoupling that may be

followed. Table 2-2 suggests decoupling values for all signals relative to the function required.

This level of decoupling may not be required in a particular application, in which case

these capacitors could be omitted. As shown in Figure 2-2, only the signal lines used in the

application require decoupling.

All capacitors are highly recommended if the module will experience substantial

electromagnetic interference (EMI). All low value capacitors should be as close as possible to

the module pad with a short connection to the ground plane (see Figure 2-4). Any data lines

that have not been properly shielded are susceptible to data corruption.

Figure 2-4: Decoupling Capacitor Placement

2.2.4 Serial RS232 data level shifter

To connect the module to a PC COM port, the serial data signals must be level shifted to

RS232 levels. This has not been shown in the reference design, but many single chip RS232

level shifters are available, such as MAX3232.

Note: It is highly recommended to provide test points on the serial data lines and ‘BOOT’

signal (pad C4), even if the application circuit does not use these signals. This will allow the

user to connect to these signals if a ﬁrmware upload or new conﬁguration is required. These

test points can take the form of an unﬁtted ‘through-hole’ connector. Refer to Figure 2-2.

2.3 PCB design recommendations

The modules are surface mounted devices, hence the layout of the application PCB plays an

integral part in the overall performance of the ﬁnished system.

It is not difﬁcult to design such a PCB, despite the presence of high frequency, low level radio

signals. The following recommendations have been offered to allow the designer to create a

design that will meet the requirements of this product.

Figure 2-1 shows the copper pad dimensions and layout.

2.3.1 Choice of PCB stack up

In general, a two layer PCB substrate can be used, with all the RF signals on one side. Multi-

layer boards can also be used. The design recommendations here only address the microstrip

style of RF connection. Stripline designs can also be accommodated, however, long lengths

of stripline can cause excessive signal loss and vias in the signal track should be avoided.

2.3.2 Ground plane design

A complete ground plane should be used under the PCB with signal tracks on the same

layer as the module. The ground return for any signal should ideally have a clear path back

to its source and should not mix with other signal’s ground return paths. For this reason, RF

signal ground, underneath the microstrip antenna connection, should not be shared with any

digital signal or power supply return paths. Pads A2 and B1 are the RF signal ground return

connections.

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2.3.3 Decoupling components

The recommended values for power and signal decoupling are shown in Table 2-2. The

placement of these components must ensure that the low value capacitors have very short

connections to the module pad and to the ground plane.

Function

PWRIN

BOOT

Pad

Decoupling

1µF||10nF

27pF

RXA

27pF

TXA

27pF

TXB

27pF

RXB

27pF

RF_ON

VANT

27pF

1nF

VCC_RF

VBATT

N_RESET

N_GPS_FIX

GPIO (ALL)

WAKEUP

LNA_EN

1PPS

1µF||1nF

10nF

27pF

Note: ‘||’ represents a parallel connection

Table 2-2: Decoupling recommendations

2.3.4 Antenna connection

The PCB layout design of the antenna input connection requires the appropriate selection of

PCB track width, substrate material and careful attention to the layout geometry. If this overall

system is not implemented correctly, the module will receive poor GPS signals and therefore

provide inferior navigation data.

Figure 2-5 shows an example of a PCB design integrating an external active antenna

connected via an MCX or SMA coaxial connector.

Active GPS

antenna

connecting coax carrying

GPS signals and DC

power for ampliﬁcation

Application PCB

Jupiter

module

coaxial connector

ﬁtted to application

PCB

Figure 2-5: Arrangement of active antenna and application board

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The modules can be used with a passive patch antenna if the connection to the antenna

input is very short. It is possible to mount the patch antenna on the same PCB as the module,

but to reduce the possibility of digital noise, it is recommended that the antenna be mounted

on the opposite side of the board to the module. (Figure 2-6 shows an example of a PCB

design integrating a passive patch antenna.)

Figure 2-6: Cross section of application board with passive patch antenna

2.3.5 Design of 50 ohm microstrip antenna connection

When designing the signal track from the antenna connection to the antenna input on the

module, a controlled impedance microstrip with a characteristic impedance of 50 ohms at

1.5GHz must be used.

The PCB parameters that affect impedance are as follows:

1. Track width (W)

2. PCB substrate thickness (H)

3. PCB substrate permittivity (ε_r)

4. To a lesser extent, PCB copper thickness (T) and proximity of same layer ground plane.

Figure 2-7 shows a representation of the PCB microstrip and its parameters.

Figure 2-7: PCB microstrip dimensions

Table 2-3 shows typical track widths for an FR4 material PCB substrate (permittivity ε_rof 4.3

at 1.5GHz) and different PCB thickness. The effect of track thickness (T) can be ignored for

the short track lengths associated with this design.

Substrate

thickness

H (mm)

Permittivity

Substrate

material

Track width

W (mm)

ε_r

1.6

1.2

1.0

0.8

0.6

0.4

0.2

2.0

1.8

1.6

1.4

1.2

0.7

0.4

FR4

4.3

Table 2-3: PCB substrate thicknesses v track width

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Notes:

1. If a multi-layer PCB is used, the thickness is the distance from signal track to nearest

ground plane.

2. If the antenna connection is routed under the module, the track width should be

approximately halved for that section only.

It is recommended that the antenna connection PCB track should be routed around the

outside of the module outline, kept on a single layer and have no bends greater than

45 degrees. It is not recommended (for production reasons) to route track under the module,

but if track has to route under the module, it should have a modiﬁed track width and solder

mask to avoid short circuits to the underside of the module.

To minimise signal loss and reduce the requirement for vias, it is recommended the signal

track not be placed on an inner layer of a multi-layer PCB.

The PCB track connection to the RF antenna input must:

• have a characteristic impedance of 50ohm

• be as short as possible

• be interfaced to a coaxial connector if an external antenna is used

• have max clearance to ground on the same layer, or at least be half the substrate thickness

• be routed away from noise sources such as: switching power supplies, digital signals,

oscillators and transmitters

The PCB track connection to the RF antenna input must not have:

• vias

• sharp bends

• components overlaying the track

2.4 Antenna system design choices

2.4.1 Antenna types

The role of the antenna is to ﬁlter, amplify and down-convert the incoming GPS signals into

an electric signal that can be processed by the receiver electronics within the RF section.

There are several designs of GPS antennas:

Monopole, or dipole, conﬁgurations.

Quadriﬁlar helices.

Spiral helices.

Microstrips - active and passive.

Planar rings (“choke ring”), and other multipath-resistant designs.

There are special considerations for GPS antennas. They must be able to pick up and

discriminate very weak signals. GPS signals are circularly polarised, so the GPS antenna

must also be circularly polarised. The antenna gain pattern design is intended to enhance the

ability of the RF section to ﬁlter multipath and low elevation signals. An essential requirement

of any consumer GPS product is that the antenna is a stable electrical centre which is

coincident with the geometric centre and insensitive to the rotation and inclination of the

antenna.

The main parts of the construction of the antenna consists of: (a) the omnidirectional antenna

element, (b) the antenna preampliﬁer electronics, and (c) a ground plane (though not always

present). The industry has widely adopted the patch antenna as the most common and

practical design.

There are two major types of GPS antenna patch antennas: passive and active. The active

antenna has a built in LNA (Low Noise Ampliﬁer) to increase the strength of the signal, and to

compensate for the signal loss in a long cable connection.

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The features of each type of antenna are shown in Table 2-4, comparing an externally

mounted active antenna with a passive patch antenna mounted on the same PCB as the

module.

Feature

antenna requires close proximity to receiver

consumes power

Passive antenna Active antenna

yes

can be mounted remote from receiver

gives good performance in poor signal situations

has built in additional ﬁltering

low cost

yes

requires a coaxial connector

yes

Table 2-4: Passive and active Patch antenna features

2.4.2 Active antenna

An active antenna comprises a passive antenna with a built in LNA that requires a power

supply. Active antennas are used when the antenna input is connected to the receiver

through a coaxial cable (usually longer than 3m) or any high loss transmission path.

The GPS signals experience loss in the transmission path from the antenna. The loss is

overcome by the antenna’s LNA, which ampliﬁes the signal before it enters the transmission

path.

The ampliﬁcation is also used to enhance the signal in areas of low signal. If the coaxial

cable is shorter than 3m it may experience too much gain at the receiver and degrade the

performance. There are some variations as to how the antenna will receive its power, but it is

usually supplied through the coaxial cable via the antenna input as shown in Figure 2-5.

Refer to Table 2-5 for the recommended active antenna characteristics.

2.4.3 Passive antenna

A passive antenna does not require any power because it has no ampliﬁer. This is not the

best choice if signal strength is a concern, however, it may be sufﬁcient if the signal path is

kept to a minimum (usually below 300mm). An advantage to using a passive antenna is the

ability to mount directly onto the application. For best performance, a passive patch antenna

should have a metal ground plane (about 80mm in diameter) placed directly under the

antenna, and it is advisable to shield the module and application circuits from the antenna.

For this reason the antenna and Jupiter 32 module should not be mounted on the same side

of the PCB (see Figure 2-6).

Any cover close to the antenna (called the superstrate) will cause the resonant frequency and

efﬁciency of the antenna to drop. It is therefore recommended to keep any distance to the

superstrate to a minimum of 3mm from the top surface of the patch.

See Table 2-5 for recommended characteristics of both passive patch and active antennas

for use with the Jupiter receiver.

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Characteristic

polarisation

Active antenna

Passive antenna

right-hand circular polarised

1.57542 GHz

+/- 1.023 MHz

1.57542 GHz

> +/- 1.023 MHz

receive frequency L1

power supply

DC current

3V (typ), 5V max.

< 10mA at 3VDC

–

+2 to 5dBi with 1dB loss (max)

antenna gain

–

in connections

total gain (includes

antenna gain, LNA

gain and cable loss)

≤ 26dBi (Jupiter 20)

≤18dBi (Jupiter 32)

–

axial ratio

<3dB

output VSWR

<2.5

–

Table 2-5: Recommended antenna characteristics

Note: GPS active and passive antenna selection must include practical TTFF tests

in weak and strong outdoor environments – noting peak and average signal strength

measurements. This must be done in comparison with the antenna supplied in the

Development kit. Performance results and signal strength measurements must be

comparable to the reference antenna supplied. Passive antenna signal strength

measurements will be on average lower than an active antenna. This depends on size of

patch antenna/ground plane, distance from RF input, gain of the element and noise in the

application circuit. However, the TTFF should be comparable in open sky conditions. An

active antenna is recommended if peak performance is required in very weak or obscured

conditions.

2.4.4 Jupiter module used as a GPS sensor

The adapter board reference design shows how a Jupiter 32 GPS receiver module can

be used with an external active antenna via a coax connector (See Figure 2-5). The same

design can be used with a passive patch antenna on the same PCB. The module is placed

so the connection between the antenna and the antenna input pad is as short as possible.

Also note, the PCB should have a complete ground plane on the patch side of the board

which serves as the ground plane required by the antenna (See Figure 2-6).

The serial data from the module must be connected to a local host processor, and care

should be taken so noise from these devices cannot enter the signal path or GPS antenna. It

is recommended that all digital devices are placed on the opposite side of the board from the

antenna.

2.4.5 DC supply protection for an active antenna

Antenna DC supply current limit

When the Jupiter 32 receiver is used with an external active antenna, the DC supply in the

coax cable is vulnerable to over-current if a fault occurs in the antenna. For example, this can

happen if its cable gets crushed in a car door.

Warning: The Jupiter 32 module antenna power feed does not have internal current limiting.

Damage can occur if unlimited current is permitted to ﬂow through the module antenna power

feed components.

The circuit shown in Figure 2-8 (next page) will provide over-current protection.

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70 mA Antenna supply current limit

BC857B

120R @ 100 MHz

ANTENNA_SUPPLY

(V_ANT)

SUPPLY_INPUT

3-5VDC

100nF

200 mW

100nF

18pF

GND

R10

BC857B

GND

Figure 2-8: Simple current limiter circuit

NOTE: Ensure that the In-rush current of your active antenna does not cause it to approach the

current limit.

Transistor Q1 serves as a series pass transistor. Q2 is used to sense the current in the

antenna circuit, turning off Q1 if the voltage across the current sense resistor R1 exceeds

0.6V. This circuit does not turn off the supply to the antenna, but merely limits it to a safe

value. With the components shown the supply will be limited to approximately 70mA.

Other options are available to provide this function. MAXIM can supply a current trip IC

that will turn off the load if a preset supply current is exceeded. The part number for this is

MAX4785. The circuit is shown in Figure 2-9.

Antenna current limit using an IC

antenna short circuit sense signal

100 nF

MAX4785EXK–T

GND

FLAG

120R@100MHz

OUT

100 nF

18 pF

GND

Jupiter 32

GND

antenna power enable

PWR_IN

GND

Jupiter GPS Module

Figure 2-9: External Active Antenna Control and Current Limit circuit

Electro-resistive fuses can be used to protect the supply over-current. These are available

from Bourns, Vitromon and other manufacturers.

2.5 Jupiter adapter printed circuit board

The Jupiter 32 module supplied in the Development Kit is mounted on a carrier PCB in a method

typical of a customer application. This carrier PCB illustrates and implements many of the design

considerations discussed in this integrator’s manual.

The module is interfaced through a downward-facing 20-pin data connector.

The RTC (Real-Time Clock) backup supply voltage can be provided by an on-board lithium cell,

or from the Development unit backup supply. The adapter board carries a switch debounce IC to

provide reliable reset action from the Development unit.

Figure 2-10 (next page) shows the adapter board with the positions of the connectors and

indicators.

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(on bottom side)

(not loaded)

Figure 2-10: Jupiter 32 adapter board

Refer to Table 2-6 for a description of the connector interfaces.

Jupiter function

J2 (2.54 mm pitch header) pin no.

VANT

no connection

VBATT

VDD

N_RESET

reserved

BOOT

reserved

RF_ON

TXA

RXA

reserved

TXB

RXB

WAKEUP

GND

reserved

1PPS

N_GPS_FIX

Table 2-6: Connector conﬁguration

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3.0 Packaging and delivery

Jupiter 32 modules are shipped in Tape and Reel form. The reeled modules are shipped with

250 units per reel. Each reel is ‘dry’ packaged and vacuum sealed in an Moisture Barrier Bag

(MBB) with two silica gel packs and placed in a carton.

All packaging is ESD protective lined. The Jupiter 32 GPS receiver is a Moisture Sensitive

Device (MSD) level 3. Please follow the MSD and ESD handling instructions on the labels of the

MBB and exterior carton. See Figures 3-1, 3-2 and 3-3.

CAUTION

This bag contains

MOISTURE SENSITIVE DEVICES

1. Calculated shelf life in sealed bag: 12 months at < 40^oC and 90%

relative humidity (RH).

^oC,

240

2. Peak package body temperature:

If blank see adjacent bar code label

3. After bag is opened, devices that will be subject to reﬂow solder or

other high temperature process must be:

a) mounted within

hours, at factory conditions

If blank see adjacent bar code label

≤ 30^oC/60% RH, or

b) stored at ≤ 10% RH.

4. Devices require baking before mounting if:

a) humidity indicator card is > 10% when read at 23±5^oC,

b) condition 3a or 3b not met.

5. If baking is required, devices may be baked for 48 hours at 125±5^oC.

Note: If device containers cannot be subjected to high temperature or

shorter bake times are desired,

reference: IPC/JEDEC J-STD-033 for bake procedure.

Bag seal date

^oC,

If blank see adjacent bar code label

Note: Level and body temperature deﬁned by IPC/JEDEC J-STD-020

Figure 3-1: Moisture Barrier Bag Label

330.0

All dimensions in mm

100 -0+2

Figure 3-2: Reel dimensions

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250 per reel

44mm

20.00

4.00

2.00

1.75

Direction of Feed

3.2±0.10

0.35±0.05

17.3±0.10

13.30±0.10

All Dim in mm

Figure 3-3: Jupiter 32 Packaging

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4.0 Manufacturing process recommendations

The Jupiter 32 uses the latest Land Grid Array (LGA) technology. Solder interconnect is

formed solely by solder paste applied to the board assembly. This results in a low stand-off

height, depending on solder paste volume and Printed Circuit Board (PCB) geometry. This

makes LGA ideal for small form-factor applications. Solder joint reliability studies indicate that

LGA greatly exceed typical industry reliability.

4.1 Solder methods

The Jupiter 32 has 34 surface mount connection pads that have a base metal of copper

with an Electroless Nickel Immersion Gold (ENIG) ﬁnish. This is suitable for a lead free

manufacturing process. Critical factors to ensure successful circuit board assembly with LGA

devices include, the design of the solder paste stencil, the solder paste and reﬂow proﬁle

used. Stencil attributes that have been shown to succeed in tests are solder stencil thickness,

aperture diameter, paste release characteristics, and practices to ensure consistent solder

paste volumes that exceed recommended minimums.

4.1.1 Solder paste type

The module will accept all commonly used solder pastes. The solder paste can be lead

based or lead-free. In all processes, factors such as circuit board thickness, fabrication

complexity, assembly process compatibility, and surface ﬁnish should be taken into

consideration. Also, due to the low standoff height of LGA devices and difﬁculty cleaning, a

no-clean paste is recommended.

4.1.2 Solder paste mask size

Solder paste mask size should be adjusted by experimentation according to the production

process requirements. As a starting point, a 0.75:1 (paste mask:pad size) ratio is

recommended.

4.1.3 Solder paste stencils

A 0.125 mm (5 mil) thick stencil is recommended with LGA.

4.1.4 Reﬂow proﬁle recommendations

An optimal reﬂow proﬁle depends on solder paste properties and should be optimised and

proven out as part of an overall process development. The following guidelines represent

good soldering practices to help yield high quality assemblies with minimum rework.

It is important to provide a solder reﬂow proﬁle that matches the solder paste supplier’s

recommendations. Some ﬂuxes need a long dwell time below the temperature of 180°C,

while others will be burned up in a long dwell. Temperatures out of bounds of the solder paste

ﬂux recommendation could result in poor solderability of components on the board. Solder

paste suppliers can recommend an suitable reﬂow proﬁle to give the best solderability. The

maximum reﬂow temperature is 260°C for 10 seconds.

The typical reﬂow proﬁle consists of four sections. In the preheat section, the PCB assembly

should be preheated at the maximum rate of 1° to 2°C/sec to start the solvent evaporation

and to avoid thermal shock. The assembly can then be heated for 60 to 120 seconds to

remove solder volatiles and activate the ﬂux so the temperature of the package rises above

100°C. The reﬂow section of the proﬁle, the time above liquidus (approx. 185° C), can be

between 45 to 60 seconds with a peak temperature in the range of 230° to 260°C. This

allows all solder joints on the assembly to fully reﬂow and a maximum peak temperature that

is below the maximum that the devices or solder material can tolerate. Finally, the assembly

can undergo cool-down in the fourth section of the liquidus point (approx. 185°C). The actual

proﬁle parameters depends upon the recommendations of the solder paste supplier and

other reﬂow requirements of the customer’s PCB.

Refer to Figure 4-1 for sample lead and lead-free reﬂow proﬁles.

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Pre-heat

Heat

Reﬂow

Cool-down

260

Peak Temp.

Liquidus Temp.

Pb-free Solder

Pb Solder

Time Sec

300

Figure 4-1: Sample Lead and Lead free reﬂow proﬁle

4.1.5 Coating

The ﬁnal PCB may be selectively coated with an acrylic resin, air/oven cured conformal

coating, clear lacquer or corresponding method, which gives electrical insulation and

sufﬁcient resistance to corrosion.

4.1.6 Post reﬂow washing

It is recommended that a low residue solder paste is used to prevent the need for post reﬂow

washing. If a washing process is used, an aqueous wash is not recommended due to the

long drying time required and danger of contaminating the ﬁne pitch internal components.

4.1.7 Pre-baking

The modules will be delivered on a tape and reel package, and sealed in an airtight bag. The

MSR (Moisture Sensitivity Rating) is 3, therefore they should be loaded and reﬂowed within

168 hours (7 days). If the modules are in ambient humidity for longer than this, a pre-baking/

drying process will be required.

4.1.8 Rework

It is recommended that no more than 2 reﬂow cycles are performed and that the maximum

reﬂow temperature recommended by the solder paste manufacturer is not exceeded. The

maximum ramp-up rate of 3^oC/sec for leaded solder or 4^oC/sec for lead free solder should

not be exceeded.

Navman recommends that rework and repair is carried out in accordance with the following

guidelines:

• IPC-7711 Rework of Electronic Assemblies

• IPC-7721 Repair and Modiﬁcation of Printed Boards and Electronic Assemblies

For proper removal of the part, special nozzles should be used for local heating of the part

to avoid reﬂow of adjacent parts. The PCB assembly should be preheated to about 75° C

from the bottom using convective pre-heaters and the preheated nozzle should be lowered

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on the part. The proper nozzle should also heat the component leads by either hot gas or hot

bar. The ideal reﬂow proﬁle should be the same as the one used for mounting the part and

depends upon the paste used. The reﬂow zone can be shortened as long as the reﬂow is

complete. The part should then be lifted off automatically during the transition from reﬂow to

cool down cycles using a vacuum.

4.1.9 Site Redress and Cleaning

Once the part is removed, the site needs to be cleaned for attachment of a new package.

This may be done by vacuum de-soldering or wick. Low-temperature, blade style conductive

tools in conjunction with de-soldering braids can also be used. Once all residual solder is

removed, the site should be cleaned with appropriate solvent such as alcohol and a lint-free

swab.

4.1.10 Application of Solder Paste

For a precise and uniform solder paste deposition on the redressed site, it is recommended

that a miniaturized stencil for the individual component be used. The stencil should be

aligned under 50x to 100x magniﬁcation, depending on the part. After precise alignment, the

stencil should be lowered onto the PCB and the paste should be applied in one pass.

4.1.11 Placement and Attachment of the New Component

The new part should be placed on the site using a split-beam alignment where a dual

image of the part leads and the land pattern on the PCB can be viewed on a high-resolution

monitor. Once aligned, the part should be placed on the site and attached to the board using

the reﬂow proﬁle used for the part removal.

5.0 Software application information

5.1 Normal mode operation

In normal mode of operation, the baseband processor software runs continuously, providing

a navigation solution at the maximum rate of once per second. No power saving functions are

applied.

If the power to the module is disrupted, the restart time can be shortened to a warm or hot start

by keeping the RTC and SRAM contents valid with a backup battery on the VBATT input.

If the module has been turned off for longer than 2 hours, the unit will revert to a warm or cold

start. This is caused by the stored ephemeris data becoming invalid after 4 hours.

5.2 Power management

The TricklePower mode of operation can be enabled to reduce the average power consumption.

The main power is supplied to the module continuously. An internal timer wakes the processor

from sleep mode. The module computes a navigation position ﬁx, after which the processor

reverts to sleep mode. The duty cycle is controlled by a user-conﬁgurable parameter.

If ephemeris data becomes outdated, the TricklePower mode will attempt to refresh the data set

within every 30 minute period, or for every new satellite that comes into view.

With TricklePower set to a 20% duty cycle, a power saving of 50% can easily be achieved with

minimal degradation in navigation performance.

5.2.1 Adaptive TricklePower mode

In Adaptive TricklePower mode, the processor automatically returns to full power when signal

levels are below the level at which they can be tracked in TricklePower mode. This is the

default behaviour when TricklePower is active. Adaptive TricklePower is always enabled on

the Jupiter 32.

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5.2.2 Push-to-Fix mode

Unlike TricklePower, the operation in this mode is not cyclic. This mode always forces the

GPS software to revert to a continuous sleep mode after a navigation position ﬁx. It will stay

in sleep mode until woken by wakeup input, and compute a fresh position.

If the ephemeris data become invalid or new satellites come into view, the RTC has the ability

to self activate and refresh the data, thus keeping the restart TTFF very short.

This mode yields the lowest power consumption of the module, and is ideal where a battery

powered application requires very few position ﬁxes.

For further information on the TricklePower and Push-To-Fix modes refer to the Low Power

Operating Modes application note (LA000513).

5.3 Serial I/O

The module can output serial data in the NMEA format or SiRF Binary format. The serial I/O

protocols are deﬁned in the Navman NMEA reference manual (MN000315) and the SiRF Binary

Protocol reference manual. These describe the format of the serial data from the module, as well

as the structure of the commands. Navman has provided additional functionality to the NMEA

protocol as detailed in the following sections.

5.3.1 Default settings

The default protocol is NMEA, at a baud rate of 9600bps. The frame format is 8 data bits, no

parity bit and 1 stop bit.

The following messages are output by default, at a rate of once per second each:

$GPGGA, $GPGLL, $GPGSA, $GPGSV, $GPRMC, $GPVTG, $GPZDA

All output messages have checksums by default.

5.3.2 NMEA input commands

All NMEA input commands are in the form:

$PSRFxxx,…[*CS]<cr><lf>

where xxx is a decimal number between 100 and 255 (inclusive).

Note: In each case, CS represents an NMEA checksum. This checksum is detailed in the

Navman NMEA reference manual MN000315.

Acknowledgements

All input commands other than the standard SiRF commands will be acknowledged with a

sentence of the form:

$PTTK,…*CS

Where the arguments provided to a command are invalid, the response will be the message:

$PTTK,NACK*CS

Checksums

All input commands are accepted whether or not they include a checksum, however if a

checksum is included it must be correct in order for the message to be accepted.

Incorrect checksums will result in the response:

$PTTK,CHECKSUM*CS

Unused messages

Input messages where the message ID is not between 100 and 255, or where the message

ID does not correspond to a speciﬁed function, result in the response:

$PTTK,INVALID*CS

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Errors

Errors in message receipt (other than checksum errors) result in the response:

$PTTK,ERROR,xx*CS

where xx is a hexadecimal error code.

Magnetic Variation (Declination)

The Jupiter 32 module does not calculate the magnetic variation.

5.4 Navman proprietary NMEA low power mode messages

Navman has added a number of proprietary NMEA input messages to conﬁgure the

TricklePower and Push-To-Fix modes.

5.4.1 Low power conﬁguration

The following message sets the receiver to low power mode:

$PSRF151,a,bbbb,cccc[*CS]<cr><lf>

where:

Field

Description

Push-To-Fix (1=on, 0=off)

TricklePower duty cycle (parts per

thousand)

TricklePower on time (milliseconds)

*Note that Push-To-Fix does not require ﬁelds b and c so

they may be left blank

Table 5-1: Low power modes message values

This message is the NMEA equivalent of the SiRF Binary input message ID 151.

System response:

$PTTK,LPSET,a,bbbb,cccc*CS

The updated values returned by the system are as described in Table 3-1.

5.4.2 Low power acquisition conﬁguration

The following message sets the acquisition parameters of the low power mode:

$PSRF167,aaaaaa,bbbbbb,cccc,d[*CS]<cr><lf>

where:

Field

Description

maximum off time (milliseconds)

maximum search time (milliseconds)

Push-To-Fix period (seconds)

adaptive TricklePower (1=on, 0=off)

Table 5-2: Low power acquisition input values

This message is the NMEA equivalent of the SiRF Binary input message ID 167.

System response:

$PTTK,LPACQ,aaaaaa,bbbbbb,cccc,d*CS

The updated values returned by the system are as described in Table 3-2.

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5.5 Save and Retrieve Conﬁguration Data to Flash

The current settings of the Jupiter 32 will be stored in Flash memory upon a command from the

user. Refer to Application Note LA000266. All parameters are written as a set.

The following parameters can be stored and retrieved:

· Port A and B protocols

· Port A and B baud rates and frame formats

· NMEA per-message output rates and checksums

· SiRF Binary debug and raw tracker data output

· Datum

· Altitude hold mode, source and default

· Degraded mode and timeout

· DR timeout

· DOP mode and GDOP/PDOP/HDOP thresholds

· Elevation navigation mask

· Power navigation mask

· Static navigation mode

· Track smoothing mode

· TricklePower^TMmode, on time and interval

· Push-to-Fix mode, period, maximum off and acquisition times

· DGPS source

· SBAS default PRN

5.5.1 Writing to Flash

The module accepts NMEA messaging or SiRF Binary messaging. The protocols are

deﬁned in the Navman NMEA Reference Manual (MN000315) and the SiRF Binary Protocol

Reference Manual. These documents describe the structure of the general commands.

NMEA Store to Flash Memory command

To store all relevant parameters to Flash, send the following NMEA sentence:

$PSRF198[*CS] <cr><lf>

SiRF Binary Store to Flash Memory command

To store all relevant parameters to Flash send a SiRF Binary message with Message ID 198.

A payload of this message should have a length of 1 byte.

5.5.2 Retrieving from Flash

At power-up, the unit will retrieve any conﬁguration parameters stored in Flash and restore

them as a set. Individual parameters can not be restored. Settings stored in battery backed

memory are not over written.

To prevent parameters from being restored, drive the defaults pin GPIO Pad A5 to a logic

low.

Logic State

Power-up Action

high or ﬂoating

retrieves stored parameters in Flash on power-up if no data in

battery backup RAM

low (grounded)

ignores parameters stored in ﬂash

Table 5-3: Actions based on signal state

5.5.3 Reverting to default settings

To restore the default settings, including deleting all parameters stored in Flash, send a

factory reset command in either the NMEA or SiRF Binary protocols.

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5.6 Selectable User Proﬁles

The purpose of this feature is to provide some typical application proﬁles which users can

select through a simple NMEA message. These proﬁles are macro-like commands that modify

parameters used for common applications. These proﬁles produce optimal navigation default

settings which conform speciﬁcally to an application’s requirements. They can be then be saved

using the Write-to-Flash feature. The new proﬁle will not be written to Flash automatically.

Available Proﬁles include:

Default - A general proﬁle that balances the needs of most applications.

Automotive - Takes into consideration higher velocities with occasional stopping.

Pedestrian - Takes into consideration slower velocities.

TricklePower - Power saving mode for battery applications. See Low Power Operating

Modes Application Note LA000513

Push to Fix - Only performs a ﬁx when requested. For use in special applications. See Low

Power Operating Modes Application Note LA000513

Command

The proﬁles will be selected by an NMEA command

$PSRF197,n<cr><lf>

where n is the proﬁle number:

1. Automotive

2. Pedestrian

3. TricklePower

4. Push to Fix

Refer to Application Note LA000266.

5.7 GPS ﬁx output

The GPS ﬁx output is an active low output on pin 23 of the module. Whenever the unit has either

a 2D or a 3D ﬁx, this output will be low. When the unit has no ﬁx, the output will be high.

5.8 Custom application software

The module provides custom modiﬁcation of the ﬁrmware to use available CPU processing

capacities and I/O capabilities. The custom application software can be invoked internally or

externally, providing the ability to dedicate the module as the host application or an external

processor as the host. The module also provides the ability to communicate externally with

standard or customer speciﬁc communication protocols.

The custom application software has access to the ﬂash memory, navigation data from the GPS

Navigation software, and access to various I/O lines used on the module.

This can be developed using the SiRF SDK. The SDK provides all the tools and resources

necessary for custom software development. Refer to http://www.sirf.com for more information

about the SDK.

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6.0 Glossary and acronyms

Axial ratio: For an electromagnetic wave having elliptical polarisation, the ratio of the

magnitudes of the major axis and the minor axis of the ellipse described by the electric ﬁeld

vector.

EMI: Electromagnetic Interference

ENIG: Electroless Nickel Immersion Gold

FR4 substrate: Flame Retardant type 4

The usual base material from which plated-through-hole and multi-layer printed circuit boards

are constructed. The type ‘4’ indicates woven glass reinforced epoxy resin.

GPS: Global Positioning System

A space-based radio positioning system that provides accurate position, velocity, and time data.

LGA: Land Grid Array

A physical interface for microprocessors. There are no pins on the chip; in place of the pins are

pads of bare gold-plated copper that touch pins on the motherboard.

LNA: Low Noise Ampliﬁer

A special type of ampliﬁer used to amplify weak signals captured by an antenna.

MCX: A type of miniature coaxial RF connector

NMEA: National Marine Electronics Association

PCB: Printed Circuit Board

RF: Radio Frequency

SDK: Software Development Kit

SMA: SubMiniature version A connectors are coaxial RF connectors developed in the 1960’s

as a minimal connector interface for coaxial cable with a screw type coupling mechanism. The

connector has a 50Ω impedance.

SRAM: Static Random Access Memory

SMT: Surface mount technology (SMT) is a method for constructing electronic circuits in which

the components are mounted directly onto the surface of printed circuit boards

TTFF: Time-To-First-Fix

The actual time required by a GPS receiver to achieve a position solution. This speciﬁcation

will vary with the operating state of the receiver, the length of time since the last position ﬁx, the

location of the last position ﬁx, and the speciﬁc receiver design.

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Push-To-Fix and TricklePower are registered trademarks of SiRF Technologies.

Information in this document is provided in connection with Navman New Zealand (‘Navman’) products. These materials

are provided by Navman as a service to its customers and may be used for informational purposes only. Navman

assumes no responsibility for errors or omissions in these materials. Navman may make changes to speciﬁcations and

product descriptions at any time, without notice. Navman makes no commitment to update the information and shall

have no responsibility whatsoever for conﬂicts or incompatibilities arising from future changes to its speciﬁcations and

product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is

granted by this document. Except as provided in Navman’s Terms and Conditions of Sale for such products, Navman

assumes no liability whatsoever.

THESE MATERIALS ARE PROVIDED ‘AS IS’ WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESSED OR

IMPLIED, RELATING TO SALE AND/OR USE OF NAVMAN PRODUCTS INCLUDING LIABILITY OR WARRANTIES

RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR INCIDENTAL DAMAGES,

MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY

RIGHT. NAVMAN FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION,

TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. NAVMAN SHALL NOT BE

LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT

LIMITATION, LOST REVENUES OR LOST PROFITS, WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.

Navman products are not intended for use in medical, lifesaving or life sustaining applications. Navman customers using

or selling Navman products for use in such applications do so at their own risk and agree to fully indemnify Navman

for any damages resulting from such improper use or sale. Product names or services listed in this publication are for

identiﬁcation purposes only, and may be trademarks of third parties. Third-party brands and names are the property of

their respective owners. Additional information, posted at www.navman.com, is incorporated by reference.

Reader response:

Navman strives to produce quality documentation and welcomes your feedback. Please send comments and

suggestions to [email protected]. For technical questions, contact your local Navman sales ofﬁce or ﬁeld

applications engineer.

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