Intel Network Router 41210 User Manual

Intel® 41210 Serial to Parallel PCI  
Bridge  
Design Guide  
May 2005  
Order Number: 278801-004  
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Contents  
Contents  
About This Document ...................................................................................................................7  
Introduction....................................................................................................................................9  
Intel®41210 Serial to Parallel PCI Bridge Applications......................................................13  
Package Information ...................................................................................................................15  
Power Plane Layout ....................................................................................................................19  
41210 Bridge Reset and Power Timing Considerations ..........................................................23  
General Routing Guidelines .......................................................................................................25  
Board Layout Guidelines............................................................................................................29  
PCI-X Layout Guidelines.............................................................................................................31  
Intel® 41210 Serial to Parallel PCI Bridge Design Guide Layout Analysis .........................38  
Intel® 41210 Serial to Parallel PCI Bridge Design Guide  
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Contents  
PCI Express Layout.....................................................................................................................45  
Circuit Implementations..............................................................................................................49  
41210 Bridge Customer Reference Boards...............................................................................55  
Design Guide Checklist ..............................................................................................................59  
Figures  
Intel® 41210 Bridge Adapter Card Block Diagram......................................................................13  
iv  
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Contents  
Tables  
Revision History  
Date  
Revision  
Description  
Removed Section 5.3, VCCPE and REFCLKn/REFCLKp  
Information  
May 2005  
004  
Added signals to Section 8.3.1  
Updated Table 19, Table 20, and Table 21  
Updated PCI Express operation information in Section 2.1 and  
Table 19.  
October 2004  
003  
Added signal NC17 information in Table 21.  
Updated Chapters 4, 5, and 12  
July 2004  
October 2003  
July 2003  
002  
001  
000  
Updated content; second draft of this document; initial public  
release of this document.  
First internal draft of this document.  
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About This Document  
1
This document provides layout information and guidelines for designing platform or add-in board  
applications with the Intel® 41210 Serial to Parallel PCI Bridge (also called the 41210 Bridge). It is  
recommended that this document be used as a guideline. Intel recommends employing best-known  
design practices with board level simulation, signal integrity testing and validation for a robust  
design.  
Designers should note that this guide focuses upon specific design considerations for the 41210  
Bridge and is not intended to be an all-inclusive list of all good design practices. Use this guide as  
a starting point and use empirical data to optimize your particular design.  
1.1  
Terminology and Definitions  
Table 1 provides a list of terms and definitions that may be useful when working with the 41210  
Bridge product.  
Table 1. Terminology and Definitions (Sheet 1 of 2)  
Term  
Definition  
Stripline in a PCB is composed of the  
conductor inserted in a dielectric with GND  
planes to the top and bottom.  
Stripline  
NOTE: An easy way to distinguish stripline  
from microstrip is that you need to  
strip away layers of the board to view  
the trace on stripline.  
Microstrip in a PCB is composed of the  
conductor on the top layer above the dielectric  
with a ground plane below  
Microstrip  
Material used for the lamination process of manufacturing PCBs. It consists of a layer of  
epoxy material that is placed between two cores. This layer melts into epoxy when heated and  
forms around adjacent traces.  
Prepreg  
Core  
Material used for the lamination process of manufacturing PCBs. This material is two sided  
laminate with copper on each side. The core is an internal layer that is etched.  
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About This Document  
Table 1. Terminology and Definitions (Sheet 2 of 2)  
Term  
Definition  
Printed circuit board.  
Layer 1: copper  
Prepreg  
Example manufacturing process consists of  
the following steps:  
Layer 2: GND  
Consists of alternating layers of core and  
prepreg stacked  
Core  
The finished PCB is heated and cured.  
The via holes are drilled  
PCB  
Layer 3: VCC15  
Prepreg  
Layer 4: copper  
Plating covers holes and outer surfaces  
Etching removes unwanted copper  
Board is tinned, coated with solder mask  
and silk screened  
Example of a Four-Layer Stack  
SSTL_2  
JEDEC  
Series Stub Terminated Logic for 2.5 V  
Provides standards for the semiconductor industry.  
A network that transmits a coupled signal to another network is aggressor network.  
Zo  
Zo  
Aggressor  
Zo  
Zo  
Victim Network  
Aggressor Network  
Victim  
Network  
Stub  
A network that receives a coupled cross-talk signal from another network is a victim network.  
The trace of a PCB that completes an electrical connection between two or more components.  
Branch from a trunk terminating at the pad of an agent.  
CRB  
Customer Reference Board  
Downstream refers either to the relative position of an interconnect/system element (Link/  
Downstream device) as something that is farther from the Root Complex, or to a direction of information  
flow, i.e., when information is flowing away from the Root Complex.  
Upstream  
®
Memory subsystem on the Intel XScale core DDR SDRAM or Peripheral Bus Interface  
Local memory  
busses.  
DWORD  
32-bit data word.  
FC-BGA (flip chip-ball grid array) chip packages are designed with processor core flipped up  
on the back of the chip, facing away from the PCB. This allows more efficient cooling of the  
package.  
Flip Chip  
Mode  
Conversion  
Mode Conversions are due to imperfections on the interconnect which transform differential  
mode voltage to common mode voltage and common mode voltage to differential voltage.  
PCI-E  
PCI-Express  
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Introduction  
2
The Intel®41210 Serial to Parallel PCI Bridge integrates two PCI Express-to-PCI bridges. Each  
bridge follows the PCI-to-PCI Bridge programming model. The PCI Express port is compliant to  
the PCI Express Specification, Revision 1.0. The two PCI bus interfaces are fully compliant to the  
PCI Local Bus Specification, Revision 2.3.  
2.1  
PCI Express Interface Features  
PCI Express Specification, Revision 1.0b compliant.  
Support for single x8, single x4 or single x1 PCI Express operation.  
64-bit addressing support.  
32-bit CRC (cyclic redundancy checking) covering all transmitted data packets.  
16-bit CRC on all link message information.  
Raw bit-rate on the data pins of 2.5 Gbit/s, resulting in a raw bandwidth per pin of 250 MB/s.  
Maximum realized bandwidth on PCI Express interface is 2 GB/s (in x8 mode) in each  
direction simultaneously, for an aggregate of 4 GB/s.  
2.2  
PCI-X Interface Features  
PCI Local Bus Specification, Revision 2.3 compliant.  
PCI-to-PCI Bridge Specification, Revision 1.1 compliant.  
PCI-X Addendum to the PCI Local Bus Specification, Revision 1.0a compliant.  
64-bit 66 MHz, 3.3 V, NOT 5 V tolerant.  
On Die Termination (ODT) with 8.2Kpull-up to 3.3V for PCI signals.  
Six external REQ/GNT Pairs for internal arbiter on segment A and B respectively.  
Programmable bus parking on either the last agent or always on Lanai.  
2-level programmable round-robin internal arbiter with Multi-Transaction Timer (MTT)  
External PCI clock-feed support for asynchronous primary and secondary domain operation.  
64-bit addressing for upstream and downstream transactions  
Downstream LOCK# support.  
No upstream LOCK# support.  
PCI fast Back-to-Back capable as target.  
Up to four active and four pending upstream memory read transactions  
Up to two downstream delayed (memory read, I/O read/write and configuration read/write)  
transaction.  
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Introduction  
Tunable inbound read prefetch algorithm for PCI MRM/MRL commands  
Local initialization via SMBus  
Secondary side initialization via Type 0 configuration cycles.  
2.3  
Power Management  
Support for PCI Express Active State Power Management (ASPM) L0s link state  
Support for PCI PM 1.1 compatible D0, D3hot and D3cold device power states  
Support for PME# event propagation on behalf of PCI devices  
2.4  
SMBus Interface  
Compatible with System Management Bus Specification, Revision 2.0  
Slave mode operation only.  
Full read/write access to all configuration registers  
2.4.1  
SMBus for configuration register initialization  
Support for local initialization of the configuration registers can be implemented using a  
microcontroller via SMB. Figure 1shows this SMBus and the data transfer that occurs between  
the 41210 Bridge and the microcontroller.  
Configuration Register information is stored internally in a microcontroller and the  
information is transferred to the product via System Managed Bus (SMBus) protocols when  
the device receives power or reset.  
The requirements of the microcontroller are as follows:  
— Supports I2C and SMBus Protocols  
— Has at least 256 Byte of internal EEprom space  
— To facilitate this programming on the Customer Reference Board a Microchip part  
PIC16F876A was used.  
— Code space: estimated code size is ~2K words of program space and 32 words of RAM  
10  
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Introduction  
Figure 1. 41210 Bridge Microcontroller Block Diagram  
SMBus 2.0  
Microcontroller  
Intel41210 Bridge  
Configuration  
Register  
Data  
Configuration  
Register  
Address Space  
B2707-01  
2.4.2  
Microcontroller Connections to the 41210 Bridge  
The following diagram shows the SMB interface from the 41210 Bridge to the microcontroller.  
Figure 2. 41210 Bridge Microcontroller Connections  
3.3 V  
PIC16F876A  
Intel41210  
SMDAT  
Bridge  
SMBDAT  
SDI / SDA  
SCK / SCL  
SMCLK  
SMBCLK  
OSC2 / CLKOUT  
CFG_RETRY  
CFGRETRY  
RC1  
20 MHz  
CFG_RESET  
CFG_RST_N  
RBO / INT  
OSC1 / CLKIN  
22 pF  
22 pF  
B2708-01  
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Introduction  
2.5  
JTAG  
Compliant with IEEE Standard Test Access Port and Boundary Scan Architecture 1149.1a  
2.6  
Related Documents  
Intel® 41210 Serial to Parallel PCI Bridge Design Specification (EDS), Revision 1.0.  
PCI Express Specification, Revision 1.0, from www.pci-sig.com.  
PCI Express Design Guide, Revision 0.5  
PCI Local Bus Specification, Revision 2.3, from www.pci-sig.com.  
PCI-X Addendum to the PCI Local Bus Specification, Revision 1.0a, from www.pci-sig.com.  
IEEE Standard Test Access Port and Boundary Scan Architecture 1149.1a  
System Management Bus Specification, Revision 2.0  
Figure 3. 41210 Bridge Block Diagram  
JTAG  
SMB Bus  
A Bus PCI-X 133MHz  
Intel  
PCI-Express x8  
6 REQ/GNT Pairs  
6 A_PCLKO  
A
41210 Bridge  
Bus Arbiter  
A
Clock Buffer  
B Bus PCI-X 133MHz  
6 REQ/GNT Pairs  
6 B_PCLKO  
B
Bus Arbiter  
B
Clock Buffer  
A_PCLKI  
B_PCLKI  
B2709-01  
12  
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Introduction  
2.7  
Intel®41210 Serial to Parallel PCI Bridge  
Applications  
This section provides a block diagram for a typical the 41210 Bridge application. This application  
shows a PCI-E adapter card with two Dual 2Gb Fibre Channel controllers. Each of the PCI-X bus  
segments is connected to the Dual 2Gb Fibre Channel chip running at 133MHz. The two Dual FC  
chips provides the four 2Gb/s outputs.  
Figure 4. Intel® 41210 Bridge Adapter Card Block Diagram  
SFP Optical  
Module  
2 Gb/s  
2 Gb/s  
Dual 2Gb  
FC  
SFP Optical  
Module  
I2C Micro  
Controller  
133 MHz  
PCI-X  
Intel® 41210  
Bridge  
SFP Optical  
Module  
2 Gb/s  
2 Gb/s  
Dual 2Gb  
PCI-X to  
PCI Express  
FC  
SFP Optical  
Module  
This is locally configurable from SMBus or  
PCI-X interfaces (no BIOS support or Drivers  
required)  
PCI Express  
(to Server)  
B1491-02  
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Introduction  
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Package Information  
3
3.1  
Package Specification  
The 41210 Bridge is in a 567-ball FCBGA package, 31mm X 31mm in size, with a 1.27mm ball  
pitch.  
Figure 5. Top View - 41210 Bridge 567-Ball FCBGA Package Dimensions  
Handling  
Exclusion  
Area  
0.550 in.  
Die Area  
21.00 mm  
17.00 mm  
0.550 in.  
31.00 mm  
17.00 mm  
21.00 mm  
31.00 mm  
Pkg_567-Ball_Top  
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Package Information  
Figure 6. Bottom View - 41210 Bridge 567-Ball FCBGA Package Dimensions  
AD  
AC  
AB  
AA  
Y
W
V
U
T
31.00 – 0.100  
- A -  
R
4X 0.635  
P
N
M
L
K
J
H
G
F
4X 15.500  
E
D
C
23X 1.270  
B
A
+
1
+
2
4
6
8
10  
12  
14  
16  
18  
20  
22  
24  
3
5
7
9
11  
13  
15  
17  
19  
21  
23  
23X 1.270  
8X 14.605  
(0.895)  
29.2100  
31.00 – 0.100  
A
0.200  
- B -  
B2711-01  
16  
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Package Information  
Figure 7. Side View - 41210 Bridge 567-Ball FCBGA Package Dimensions  
Detail J  
Scale 5:1  
H
0.74 – 0.025  
0.100 – 0.025  
FC BGA Substrate  
Die Solder  
Bumps  
Underfill  
Epoxy  
Detail H  
Scale 5:1  
Die  
1.170 – 0.085  
0.600 – 0.100  
J
1.940 – 0.150  
BGA Solder Balls  
B2712-01  
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Package Information  
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Power Plane Layout  
4
This chapter provides details on the decoupling and voltage planes needed to bias the 41210 Bridge  
package.  
4.1  
41210 Bridge Decoupling Guidelines  
Table 2 lists the decoupling guidelines for the 41210 Bridge. Figure 8 and Figure 9 provide the  
decoupling capacitors around the 41210 Bridge ball grid pins.  
Figure 8. Decoupling Placement for Core and PCI Express Voltage Planes  
B2713-01  
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Power Plane Layout  
Figure 9. Decoupling Placement for PCI/PCI-X 1.5V and 3.3V Voltage Planes  
Capacitor Legend  
0603-0.1  
0603-1  
F
F
1206-10  
F
B2714-01  
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Power Plane Layout  
Table 2. 41210 Bridge Decoupling Guidelines  
41210  
Pins  
C
(uF)  
ESR  
(m) (nH)  
ESL  
# of  
Caps  
Voltage Plane  
Voltage  
3.3V  
Package  
Location  
PCI/PCI-X  
Voltage  
50-  
300  
1.0-  
3.0  
Beneath 41210  
Bridge BGA  
VCC33  
VCC33  
0.1  
1.0  
0603  
5
As close as design  
rules will allow to  
41210 Bridge BGA  
PCI/PCI-X  
Voltage  
50-  
300  
1.0-  
3.0  
3.3V  
0603  
2
As close as design  
rules will allow to  
41210 Bridge BGA  
PCI/PCI-X  
Voltage  
50-  
300  
1.0-  
3.0  
3.3V  
1.5V  
1.5V  
VCC33  
VCC15  
VCC15  
10  
0.1  
1.0  
1206  
0603  
0805  
3
5
5
Beneath 41210  
Bridge BGA  
Core Voltage  
Core Voltage  
200  
200  
2.0  
2.3  
As close as design  
rules will allow to  
41210 Bridge BGA  
As close as design  
rules will allow to  
41210 Bridge BGA  
Core Voltage  
1.5V  
1.5V  
1.5V  
VCC15  
VCCPE  
VCCPE  
10  
0.1  
1
1206  
0603  
0805  
200  
200  
200  
1.9  
2.0  
2.3  
2
3
4
PCI Express  
Voltage  
Beneath 41210  
Bridge BGA  
As close as design  
rules will allow to  
41210 Bridge BGA  
PCI Express  
Voltage  
As close as design  
rules will allow to  
41210 Bridge BGA  
PCI Express  
Voltage  
1.5V  
VCCPE  
10  
1206  
200  
1.9  
2
4.2  
Split Voltage Planes  
There are two 1.5V voltage planes that supply power to the 41210 Bridge:  
VCC15:1.5V ±5% (1.5V core voltage)  
VCCPE:1.5V ±3% (1.5V PCI Express voltage)  
The 41210 Bridge core (VCC15), PCI-Express (VCCPE) voltages should be supplied by two  
separate voltage regulators or a single regulator. If VCC15 and VCCPE is supplied by a single  
voltage regulator the power planes should be split as shown in Figure 10.  
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Power Plane Layout  
Note: Linear voltage regulators are recommended when using 1.5 Volt power supplies.  
Figure 10. 41210 Bridge Single-Layer Split Voltage Plane  
Core  
PCI  
Express  
B2715-01  
22  
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41210 Bridge Reset and Power Timing  
Considerations  
5
This chapter describes the 41210 Bridge reset timing considerations.  
5.1  
5.2  
A_RST#,B_RST# and PERST# Timing Requirements  
The PCI-X Specification requires that there is a 100ms delay from valid power (PERST#) to reset  
deassertion (A_RST#/B_RST#). 41210 Bridge will keep A_RST#/B_RST# asserted for a  
minimum of 320ms after PERST# is deasserted.  
VCC15 and VCC33 Voltage Requirements  
The following steps are the power sequencing requirements that must be followed with the  
41210 Bridge:  
1. The 41210 Bridge requires that the VCC33 voltage rail be no less than 0.5V below VCC15  
(absolute voltage value) at all times during 41210 operation, including during system power  
up and power down. In other words, the following must always be true:  
VCC33 >= (VCC15 – 0.5V)  
This can be accomplished by placing a diode (with a voltage drop <0.5V) between VCC15 and  
VCC33. A node will be connected to VCC15 and cathode will be connected to VCC33.  
If VCC15 (1.5V PCI-X I/O voltage) and VCC15 (1.5V core voltage) are tied together on the  
platform, then both voltages must meet the above rule.  
Note: Linear voltage regulators are recommended when using 1.5 Volt power supplies.  
2. If a voltage regulator solution is used which shunts VCC15 to ground while VCC33 is  
powered, the maximum allowable time that VCC15 can be shunted to ground while VCC33 is  
fully powered is 20ms.  
3. The maximum allowed time between VCC33 and VCC15 ramping is 525ms.  
Note: There is no minimum sequencing time requirement other than requirements in Steps 2 and 3.  
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General Routing Guidelines  
6
This chapter provides some basic routing guidelines for layout and design of a printed circuit board  
using the 41210 Bridge. The high-speed clocking required when designing with the 41210 Bridge  
requires special attention to signal integrity. In fact, it is highly recommended that the board design  
be simulated to determine optimum layout for signal integrity. The information in this chapter  
provides guidelines to aid the designer with board layout. Several factors influence the signal  
integrity of a 41210 Bridge design. These factors include:  
power distribution  
minimizing crosstalk  
decoupling  
layout considerations when routing the PCI Express bus and PCI-X bus interfaces  
6.1  
6.2  
General Routing Guidelines  
This section details general routing guidelines for designing with the 41210 Bridge. The order in  
which signals are routed varies from designer to designer. Some designers prefer to route all clock  
signals first, while others prefer to route all high-speed bus signals first. Either order can be used,  
provided the guidelines listed here are followed.  
Crosstalk  
Crosstalk is caused by capacitive and inductive coupling between signals. Crosstalk is composed of  
both backward and forward crosstalk components. Backward crosstalk creates an induced signal on  
victim network that propagates in the opposite direction of the aggressor signal. Forward crosstalk  
creates a signal that propagates in the same direction as the aggressor signal.  
Circuit board analysis software is used to analyze your board layout for crosstalk problems.  
Examples of 2D analysis tools include Parasitic Parameters from ANSOFT* and XFS from Quad  
Design*. Crosstalk problems occur when circuit etch lines run in parallel. When board analysis  
software is not available, the layout should be designed to maintain at least the minimum  
recommended spacing for bus interfaces.  
A general guideline to use is, that space distance between adjacent signals be a least 3.3 times  
the distance from signal trace to the nearest return plane. The coupled noise between adjacent  
traces decreases by the square of the distance between the adjacent traces.  
It is also recommended to specify the height of the above reference plane when laying out  
traces and provide this parameter to the PCB manufacturer. By moving traces closer to the  
nearest reference plane, the coupled noise decreases by the square of the distance to the  
reference plane.  
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General Routing Guidelines  
Figure 11. Crosstalk Effects on Trace Distance and Height  
Reduce Crosstalk:  
- Maximize P  
P
H
aggressor  
victim  
Reference Plane  
- Minimize H  
A9259-01  
Avoid slots in the ground plane. Slots increases mutual inductance thus increasing crosstalk.  
Make sure that ground plane surrounding connector pin fields are not completely cleared out.  
When this area is completely cleared out, around the connector pins, all the return current must  
flow together around the pin field increasing crosstalk. The preferred method of laying out a  
connector in the GND layer is shown in Figure 12.  
Figure 12. PCB Ground Layout Around Connectors  
Connector  
Connector Pins  
GND PCB Layer  
A. Incorrect method  
B. Correct method  
A9260-01  
6.3  
EMI Considerations  
It is highly recommended that good EMI design practices be followed when designing with the  
41210 Bridge.  
To minimize EMI on your PCB a useful technique is to not extend the power planes to the  
edge of the board.  
Another technique is to surround the perimeter of your PCB layers with a GND trace. This  
helps to shield the PCB with grounds minimizing radiation.  
The below link can provide some useful general EMI guidelines considerations:  
26  
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General Routing Guidelines  
6.4  
Power Distribution and Decoupling  
Have ample decoupling to ground, for the power planes, to minimize the effects of the switching  
currents. Three types of decoupling are: the bulk, the high-frequency ceramic, and the inter-plane  
capacitors.  
Bulk capacitance consist of electrolytic or tantalum capacitors. These capacitors supply large  
reservoirs of charge, but they are useful only at lower frequencies due to lead inductance  
effects. The bulk capacitors can be located anywhere on the board.  
For fast switching currents, high-frequency low-inductance capacitors are most effective.  
Place these capacitors as close to the device being decoupled as possible. This minimizes the  
parasitic resistance and inductance associated with board traces and vias.  
Use an inter-plane capacitor between power and ground planes to reduce the effective plane  
impedance at high frequencies. The general guideline for placing capacitors is to place high-  
frequency ceramic capacitors as close as possible to the module.  
6.4.1  
Decoupling  
Inadequate high-frequency decoupling results in intermittent and unreliable behavior.  
A general guideline recommends that you use the largest easily available capacitor in the lowest  
inductance package. For specific decoupling requirements for a 41210 Bridge application please  
refer to Chapter 4.  
6.5  
Trace Impedance  
All signal layers require controlled impedance 60 +/- 15%, microstrip or stripline for add-in card  
applications. Selecting the appropriate board stack-up to minimize impedance variations is very  
important. When calculating flight times, it is important to consider the minimum and maximum  
trace impedance based on the switching neighboring traces. Use wider spaces between traces, since  
this can minimize trace-to-trace coupling, and reduce cross talk.  
When a different stack up is used the trace widths must be adjusted appropriately. When wider  
traces are used, the trace spacing must be adjusted accordingly (linearly).  
It is highly recommended that a 2D Field Solver be used to design the high-speed traces. The  
following Impedance Calculator URL provide approximations for the trace impedance of various  
topologies. They may be used to generate the starting point for a full 2D Field solver.  
The following website link provides a useful basic guideline for calculating trace parameters:  
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General Routing Guidelines  
Note: Using stripline transmission lines may give better results than microstrip. This is due to the  
difficulty of precisely controlling the dielectric constant of the solder mask, and the difficulty in  
limiting the plated thickness of microstrip conductors, which can substantially increase cross-talk.  
6.5.1  
Differential Impedance  
The PCI Express standard defines a 100 differential impedance. This section provides some basic  
background information on the differential impedance calculations. In the cross section of  
Figure 13 shows the cross section of two traces of a differential pair.  
Figure 13. Cross Section of Differential Trace  
Ground reference plane  
B2716 -01  
To calculate the coupled impedance requires a 2x2 matrix. The diagonal values in the matrix  
represent the impedance of the traces to ground and the off-diagonal values provide a measure of  
how tightly the traces are coupled. The “differential impedance is the value of the line-to-line  
resistor terminator that optimally terminates pure differential signals.” The two by two matrix is  
shown below as:  
Figure 14. Two-by-two Differential Impedance Matrix  
Z11 Z12  
Zo =  
Z21 Z22  
B2717 -01  
For a symmetric trace Z11 = Z22, the differential impedance can be calculated from this equation:  
Z
differential = 2(Z11-Z12)  
For two traces to be symmetric, they must have the same width, thickness and height above the  
ground plane.1 With the traces terminated with the appropriate differential, impedance ringing is  
minimized.  
1. “Terminating Differential Signals on PCBs”, Steve Kaufer and Kelee Crisafulli, Printed Circuit Design, March 1999  
28  
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Board Layout Guidelines  
7
This chapter provides details on adapter card stackup suggestions. It is highly recommended that  
signal integrity simulations be run to verify each 41210 Bridge PCB layout especially if it deviates  
from the recommendations listed in these design guidelines.  
7.1  
Adapter Card Topology  
The 41210 Bridge will be implemented on PCI-E adapter cards with an eight layer stackup PCB.  
The specified impedance range for all adapter card implementations will be 60+/-15%.  
Adjustments will be made for interfaces specified at other impedances. Table 3 defines the typical  
layer geometries for eight layer boards.  
Table 3.  
Adapter Card Stack Up, Microstrip and Stripline  
Nominal Minimum Maximum  
Variable  
Type  
Notes  
(mils)  
(mils)  
(mils)  
Solder Mask Thickness (mil)  
N/A  
N/A  
N/A  
N/A  
0.8  
0.6  
1.0  
Solder Mask E  
3.65  
2.8  
3.65  
3.0  
3.65  
3.2  
r
Core Thickness (mil)  
Core E  
4.3  
3.75  
4.85  
2113 material  
r
Power  
2.7  
1.35  
3.5  
2.5  
1.15  
3.3  
2.9  
1.55  
3.7  
Plane Thickness (mil)  
Ground  
1
The trace height will be determined to  
achieve a nominal 60 .  
Trace Height (mil)  
2
3.5  
3.3  
3.7  
3
10.5  
4.30  
4.30  
9.9  
11.1  
4.85  
4.85  
Microstrip  
Stripline1  
3.75  
3.75  
2113 material  
2113 material  
Preg E  
r
7628 material. Trace height 3 is composed  
of one piece of 2113 and one piece of  
7628.  
Stripline2  
4.3  
3.75  
4.85  
Microstrip  
Stripline  
1.75  
1.4  
1.2  
1.2  
2.3  
1.6  
Trace Thickness (mil)  
Trace Width (mil)  
Microstrip  
Stripline  
FR4  
4.0  
4.0  
2.5  
2.5  
5.5  
5.5  
Total Thickness (mil)  
62.0  
56.0  
68.0  
Trace Spacing (using  
microstrip E2E/C2C)  
[12]/[16]  
[12]/[16]  
Trace Spacing (using  
stripline E2E/C2C)  
Microstrip  
Stripline  
60  
60  
51  
51  
69  
69  
Trace Impedance  
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Board Layout Guidelines  
NOTE: Each interface will set the trace spacing based on its signal integrity of differential impedance  
requirements. For the purposes of the building the transmission line models, it is assumed the artwork is  
very accurate and therefore a constant. Thus, all the variability in the trace spacing is the result of the  
tolerances of the trace width.  
Figure 15. Adapter Card Stackup  
Microstrip  
Trace  
Width  
Microstrip  
Trace  
Spacing  
Microstrip Trace Thickness  
Solder Mask Thickness  
L1  
L1  
Trace Height 1  
L2 (GND)  
Trace Height 2  
Stripline Trace Thickness  
L3  
L3  
Trace Height 3  
L4 (VCC)  
L5 (VCC)  
Core Thickness  
Plane Thickness  
L4  
L4  
L7 (GND)  
L8  
Stripline  
Trace  
Stripline  
Trace  
Width  
Spacing  
B1436-01  
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PCI-X Layout Guidelines  
8
This chapter describes several factors to be considered with a 41210 Bridge PCI/PCI-X design.  
These include the PCI IDSEL, PCI RCOMP, PCI Interrupts and PCI arbitration.  
8.1  
Interrupts  
PCI Express provides interrupt messages that emulate the legacy wired mechanism. This allows IO  
devices to signal PCI-style interrupts using a pair of ASSERT and DEASSERT messages This  
message pairing preserves the level-sensitive semantics of the PCI interrupts on PCI Express.  
The 41210 Bridge uses four interrupts - A_INTA:A_INTD on bus A segment and four interrupts  
B_INTA:B_INTD that corresponding to the four interrupts defined in the PCI specification. The  
41210 Bridge routes its PCI interrupt pins and the internal interrupts, to PCI Express INTx  
interrupts according to Table 4.  
Table 4. INTx Routing Table  
A_INT# Interrupt Pins  
B_INT# Interrupt Pins  
B_INTA  
PCI Express INTx Message  
INTA  
A_INTA  
A_INTB  
A_INTC  
A_INTD  
B_INTB  
B_INTC  
B_INTD  
INTB  
INTC  
INTD  
The 41210 Bridge will use its primary bus number and device number in the Requester ID field for  
the PCI Express INTx messages. As stated in the PCI Express specification, the function number is  
reserved for interrupt messages and will always be 0.  
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PCI-X Layout Guidelines  
Note: PCI Express Assert_INTx/Deassert_INTx messages are not inhibited by the BME bit.  
8.1.1  
Interrupt Routing for Devices Behind a Bridge  
Given the legacy interrupt sharing scheme shown in Table 4, to get the best legacy interrupt  
performance (by reducing interrupt sharing), adapter boards have to select the appropriate  
A_INTX#, B_INTX# (where X is A, B, C or D) input pin to use on each PCI bus segment. The  
chosen interrupt input also imposes a PCI device number requirement for the interrupt source as  
specified in the PCI-to-PCI Bridge specification and reproduced in Table 5.  
Table 5. Interrupt Binding for Devices Behind a Bridge  
Device Number on  
Interrupt Pin on Device  
Secondary Bus  
Interrupt on 41210 Bridge  
INTA#  
INTA#  
INTB#  
INTB#  
INTC#  
INTD#  
INTB#  
INTC#  
INTD#  
INTA#  
INTC#  
INTD#  
INTA#  
INTB#  
INTD#  
INTA#  
INTB#  
INTC#  
a
b
- . 4, 8 , 12, 16, 20, 24, 28  
INTC#  
INTD#  
INTA#  
INTB#  
INTC#  
INTD#  
INTA#  
INTB#  
INTC#  
INTD#  
INTA#  
INTB#  
INTC#  
INTD#  
b
1, 5, 9 , 13, 17, 21, 25, 29  
b
2, 6, 10 , 14, 18, 22, 26, 30  
b
3, 7, 11 , 15, 19, 23, 27, 31  
a.  
b.  
Device number 0 is reserved for the Bridge and should not be assigned to secondary devices.  
AD[27:24] which correspond to devices 11:8 should not be used for IDSEL# connections as these signals are used  
when accessing the extended configuration space in the bridge from the secondary bus.  
8.2  
PCI Arbitration  
The 41210 Bridge supports a high-performance internal PCI arbiter that supports up to seven  
masters on each PCI segment A and B PCI Buses. The request inputs into the internal arbiter  
include: six external request inputs and 1 internal request input. All request inputs to the internal  
arbiter are split into two groups, a high priority group and a low priority group. Any master,  
including the internal master, can be programmed to be in either of the two groups. This could also  
mean that all the request inputs into the arbiter could be in one single group. Within a group,  
priority is round-robin. The entire low-priority group represents one slot in the high priority group.  
The 41210 Bridge provides a 16-bit arbiter control register to control two aspects of the internal  
arbiter behavior:  
32  
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PCI-X Layout Guidelines  
Priority group for a master (i.e., whether a master is in low priority group or high priority  
group).  
Bus parking on last PCI agent or the bridge.  
By default the arbiter parks the bus on the bridge and drives the A/D, C/BE# and PAR lines to a  
known value while the bus is idle.  
8.2.1  
PCI Resistor Compensation  
Figure 16 provides the recommended resistor compensation pin termination for the PCI A and PCI  
B buses.  
Figure 16. PCI RCOMP  
RCOMP  
100  
– 1%  
B2718 -01  
8.3  
PCI General Layout Guidelines  
For acceptable signal integrity with bus speeds up to 133 MHz it is important to PCB design layout  
to have controlled impedance.  
Signal traces should have an unloaded impedance of 60 +/- 10% .  
Signal trace velocity should be roughly 150 – 190 ps/inch  
There are a couple of general guidelines which should be used when routing your PCI bus signals:  
Avoid routing signals > 8”.  
The following signals have no length restrictions: A_INTA#, A_INTB#, A_INTC#,  
A_INTD#, B_INTA#, B_INTB#, B_INTC#, B_INTD# and TCK, TDI, TDO, TMS and  
TRST#. Most PCI-X signals are timing critical. These signals have length restrictions for  
propagation, setup, and hold requirements. Table 6 shows the PCI-X signals.  
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PCI-X Layout Guidelines  
Table 6. PCI-X Signals  
A PCI Bus Segment:  
A_ACK64#, A_AD[63:0], A_CBE_[7:0]#, A_DEVSEL#, A_FRAME#,  
A_GNT_[5:0]#, A_IRDY#, A_LOCK#, A_PAR64, A_REQ64#, A_REQ_[5:0]#,  
A_STOP#, A_TRDY#, A_CLKO[6:0], A_CLKI  
Timing Critical Signals  
B PCI Bus Segment:  
B_ACK64#, B_AD[63:0], B_CBE_[7:0]#, B_DEVSEL#, B_FRAME#,  
B_GNT_[5:0]#, B_IRDY#, B_LOCK#, B_PAR64, B_REQ64#, B_REQ_[5:0]#,  
B_STOP#,B_TRDY#, B_CLKO[6:0], B_CLKI  
A PCI Bus Segment:  
A_RST#, A_PME#  
B PCI Bus Segment:  
B_RST#, B_PME#  
Reset Signals  
A PCI Bus Segment:  
A_133EN, A_IRQ[15:0]#, A_M66EN, A_PCIXCAP, A_PERR#, A_SERR#  
B PCI Bus Segment:  
Non Timing Critical  
Signals  
B_133EN, B_IRQ[15:0]#, B_M66EN, B_PCIXCAP, B_PERR#, B_SERR#  
Table 7. PCI/PCI-X Frequency/Mode Straps  
A_M66EN,  
B_M66EN  
A_133EN,  
B_133EN  
(on board)  
Bus  
Mode/  
Freq  
A_PCIXCAP, B_PCIXCAP  
0
0
0
1
X
X
PCI 33  
PCI 66  
PCI-X 66MHz cards connect this  
signal to ground through a 10KΩ  
±5% resistor in parallel with a  
0.01uF ±10% capacitor.  
X
X
PCI-X 66  
PCI-X 133 MHz cards connect  
PCIXCAP to ground through a  
0.01uF ±10% capacitor.  
X
X
0
1
PCI-X 100  
PCI-X 133  
PCI-X 133 MHz cards connect  
PCIXCAP to ground through a  
0.01uF ±10% capacitor.  
Note: All signals sampled on the rising edge of PERST#.  
8.3.1  
PCI Pullup Resistors Not Required  
PCI control signals on the 41210 Bridge do NOT require pullup resistors on the adapter card to  
ensure that they contain stable values when no agent is actively driving the bus. These include:  
A_ACK64#, A_AD[63:32], A_CBE#[7:4], A_DEVSEL#, A_FRAME#, A_INTA#, A_INTB#,  
A_INTC#, A_INTD#, A_IRDY#, A_PERR#, A_PAR, A_GNT#[5:0], A_REQ#[5:0], A_LOCK#,  
A_PAR64, A_REQ64#, A_SERR#, A_STOP#, A_TRDY#, B_ACK64#, B_AD[63:32],  
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B_CBE#[7:4], B_DEVSEL#, B_FRAME#, B_INTA#, B_INTB#, B_INTC#, B_INTD#,  
B_IRDY#, B_PERR#, B_PAR, B_GNT#[5:0], B_REQ#[5:0], B_LOCK#, B_PAR64, B_REQ64#,  
B_SERR#, B_STOP#, and B_TRDY#.  
8.4  
PCI Clock Layout Guidelines  
The PCI-X Addendum to the PCI Local Bus Specification, Revision 1.0b compliant, allows a  
maximum of 0.5 ns clock skew timing for each of the PCI-X frequencies: 66 MHz, 100 MHz and  
133 MHz. A typical PCI-X application may require separate clock point-to-point connections  
distributed to each PCI device. The 41210 Bridge provides seven buffered clocks on the PCI bus to  
connect to multiple PCI-X devices. The Figure 17 shows the use of four PCI “A” clock outputs and  
length matching requirements. These same guidelines apply to the 41210 Bridge PCI “B” clock  
outputs. The recommended clock buffer layout are specified as follows:  
Match each of the used the 41210 Bridge output clock lengths A_CLK[6:0] and B_CLK[6:0]  
to within 0.1” to help keep the timing within the 0.5 ns maximum budget.  
Keep the distance between the clock lines and other signals “d” at least 25 mils from each other.  
Keep the distance between the clock line and itself “a” at a minimum of 25 mils apart (for  
serpentine clock layout).  
A_CLKIN gets connected to A_CLKO6 through a 22+/- 1% resistor and likewise for  
B_CLKIN is connected to B_CLKO6 through a 22resistor.  
The 22 +/- 1% resistor is within 500 mils of A_CLKO.  
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PCI-X Layout Guidelines  
Figure 17.  
PCI Clock Distribution and Matching Requirements  
22  
X0  
X1  
PCI  
Device 1  
A_CLKIN  
a
Intel®  
41210  
Bridge  
A_CLKO0  
A_CLKO1  
A_CLKO2  
A_CLKO3  
22  
PCI  
Device 2  
d
22  
A_CLKO4  
PCI  
Device 3  
X2  
X3  
X4  
A_CLKO6  
22  
PCI  
Device 4  
22  
22  
PCI  
Device 5  
Notes:  
– PCI Clock Lengths X0, X1, X2, X3 and X4 should be matched within 0.1 inch of each other.  
– Minimum separation between two different CLKs, "d".  
– Minimum separation between two segments of the same CLK line, "a".  
B1499-04  
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PCI-X Layout Guidelines  
Table 8.  
PCI-X Clock Layout Requirements Summary  
Parameter  
Routing Guidelines  
Signal Group  
PCI Clocks B_CLKO[6:0], A_CLK[6:0]  
Route over unbroken ground or power plane  
4 mils  
Reference Plane  
Stripline Trace Width  
Stripline Trace Spacing: Separation between two  
different clock lines, “d” clock lines  
25 mils center to center from any other signal  
25 mils center to center from any other signal  
50 mils center to center from any other signal  
Stripline Trace Spacing: Separation between two  
segments of the same clock line (on serpentine  
layout), “a” dimension  
Stripline Trace Spacing: Separation between clocks  
and other lines  
All 41210 Bridge Output Clocks B_CLK0[6:0] and  
A_CLK[6:0] connected to devices must be length  
matched to 0.1 inch of each other.  
Length Matching Requirements  
The clock feedback line lengths from A_CLKOUT to  
A_CLKIN and B_CLKOUT to B_CLKIN should be  
length matched to all other clock lines within 0.1”.  
Total Length of the 41210 Bridge PCI CLKs on the  
adapter card  
10” -14”  
Connect A_CLKIN to one end of a 22+/- 1% resistor  
and the other end connected to A_CLKOUT and  
connect B_CLKIN to one end of a 22resistor and  
the other end connected to B_CLKOUT  
A_CLKIN, B_CLKIN Series Termination  
Each of the clock outputs A_CLKO[6:0] and  
A_CLK[6:0], B_CLK[6:0] Series Termination  
B_CLK[6:0] should have series 22resistor located  
within 500 mils of the 41210 Bridge clock output.  
Point to point signal routing should be used to keep  
the reflections low.  
Routing Guideline 1  
Routing Guideline 2  
Minimize number of vias  
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PCI-X Layout Guidelines  
8.5  
PCI-X Topology Layout Guidelines  
The PCI-X Addendum to the PCI Local Bus Specification, Revision 1.0b compliant, recommends  
the following guidelines for the number of loads for your PCI-X designs. Any deviation from these  
maximum values requires close attention to layout with regard to loading and trace lengths.  
Table 9.  
PCI-X Slot Guidelines  
Frequency  
Maximum Loads  
Maximum Number of Slots  
66 MHz  
100 MHz  
133 MHz  
8
4
2
4
2
1
8.6  
Intel® 41210 Serial to Parallel PCI Bridge Design  
Guide Layout Analysis  
The following sections describes layout recommendations based on the presilicon signal integrity  
analysis. This analysis was conducted using the following parameters:  
Card stack up: 60 +/- 15% single-ended impedance  
Driver Model 41210 Bridge IBIS  
Receiver Model: generic models for PCI-X and PCI  
Driver Package Model: Preliminary 41210 Bridge Model  
Cross talk and ISI impact on timing were not modeled  
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PCI-X Layout Guidelines  
8.6.1  
Embedded PCI-X 133 MHz  
This section lists the routing recommendations for PCI-X 133 MHz without a slot. Figure 18 shows  
the block diagram of this topology and Table 10 describes the routing recommendations.  
Figure 18. Embedded PCI-X 133 MHz Topology  
EM1  
TL1  
EM2  
B2719 -01  
Table 10.  
Embedded PCI-X 133 MHz Routing Recommendations  
Parameter  
Reference Plane  
Routing Guideline for Lower AD Bus  
Route over an unbroken ground plane  
60 +/- 15%  
Board Impedance  
Stripline Trace Spacing  
Microstrip Trace Spacing  
Break Out  
12 mils from edge to edge  
18 mils, from edge to edge  
5 mils on 5 mils spacing. Maximum length of breakout region can be 500 mils  
Spacing from other groups: 25 mils min, edge to edge  
Group Spacing  
Trace Length 1 (TL1): From  
41210 Bridge signal Ball to  
first junction  
1.75” min - 4.0” max  
Trace Length 3 junction of  
TL_EM1 and TL_EM2 to the 1.25” min - 3.25” max  
embedded device  
Length Matching  
Requirements:  
Clocks coming form the clock driver must be on the same layer and length  
matched to within 25 mils.  
Number of vias  
3 vias max per path  
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PCI-X Layout Guidelines  
8.6.2  
Embedded PCI-X 100 MHz  
This section lists the embedded routing recommendations for PCI-X 100 MHz. Figure 19 shows  
the block diagram of this topology and Table 11 describes the routing recommendations.  
Figure 19. Embedded PCI-X 100 MHz Topology  
TL_EM1  
EM1  
TL_EM3  
TL_EM2  
EM3  
EM2  
TL1  
B2720 -01  
Table 11.  
Embedded PCI-X 100 MHz Routing Recommendations  
Parameter  
Reference Plane  
Routing Guideline for Lower AD Bus  
Route over an unbroken ground plane  
Board Impedance  
Stripline Trace Spacing  
Microstrip Trace Spacing  
Break Out  
60 +/- 15%  
12 mils from edge to edge  
18 mils, from edge to edge  
5 mils on 5 mils spacing. Maximum length of breakout region can be 500 mils  
Spacing from other groups: 25 mils min, edge to edge  
Group Spacing  
Trace Length 1 (TL1): From  
41210 Bridge signal Ball to  
first junction  
0.5” min - 3.0” max  
2.5” min - 3.5” max  
Trace Length: TL_EM1: from  
41210 Bridge signal ball to  
the first embedded device  
Trace Length TL_EM2 -  
TL_EM3: from junction to the 1.5” min - 3.5” max  
embedded device  
Length Matching  
Requirements:  
Clocks coming form the clock driver must be on the same layer and length  
matched to within 25 mils.  
Number of vias  
4 vias max per path  
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8.6.3  
PCI-X 66 MHz Embedded Topology  
Figure 20 and Table 12 provide routing details for a topology with an embedded PCI-X 66 MHz  
application.  
Figure 20.  
PCI-X 66 MHz Embedded Routing Topology  
EM1  
EM3  
EM5  
EM7  
TL1  
TL2  
TL3  
TL4  
EM2  
EM4  
EM6  
EM8  
B2721 -01  
Table 12.  
PCI-X 66 MHz Embedded Routing Recommendations  
Parameter  
Reference Plane  
Routing Guideline for Lower AD Bus  
Route over an unbroken ground plane  
Board Impedance  
Stripline Trace Spacing  
Microstrip Trace Spacing  
Break Out  
60 +/- 15%  
12 mils edge to edge  
18 mils, edge to edge  
5 mils on 5 mils. Maximum length of breakout region can be 500 mils  
Spacing from other groups: 25 mils min, edge to edge  
Group Spacing  
Trace Length 1 (TL1): From  
41210 Bridge signal Ball to  
first junction  
1.0” - 5.0” max  
Trace Length TL2 to TL4 -  
between junctions  
1.0” min - 2.5” max  
Trace Length TL_EM1 to  
TL_EM8 from junction  
connector to the embedded  
device  
2.0” min - 3.0” max  
Length Matching  
Requirements:  
Clocks coming form the clock driver must be length matched to within 25 mils  
and routed identical in layers.  
Number of vias  
4 vias max.  
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8.6.4  
PCI 66 MHz Embedded Topology  
Figure 21 and Table 13 provide routing details for a topology with an embedded PCI 66 MHz  
design.  
Figure 21. PCI 66 MHz Embedded Topology  
EM1  
EM3  
TL1  
TL2  
EM2  
EM4  
B2722 -01  
Table 13.  
PCI 66 MHz Embedded Table  
Parameter  
Routing Guideline for Lower AD Bus  
Reference Plane  
Route over an unbroken ground plane  
60 +/- 15%  
Board Impedance  
Microstrip Trace Spacing  
Stripline Trace Spacing  
Group Spacing  
18 mils center to center  
12 mils center to center  
Spacing from other groups: 25 mils min, edge to edge  
5 mils on 5 mils spacing. Maximum length of breakout  
region can be 500 mils.  
Breakout  
Trace Length 1 TL1: From 41210 Bridge signal Ball  
to first junction  
5.0” max  
Trace Length TL2 between junctions  
0.5” min - 3.5” max  
2.0” min - 3.0” max  
Trace Length TL_EM1 to TL_EM4 from junction to  
embedded devices  
Clocks coming from the clock driver must be length  
matched to within 25 mils.  
Length Matching Requirements  
Number of vias  
4 vias max.  
P
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PCI-X Layout Guidelines  
8.6.5  
PCI 33 MHz Embedded Mode Topology  
Figure 22 and Table 14 provide routing details for a topology with an embedded PCI 33 MHz  
design.  
Figure 22. PCI 33 MHz Embedded Mode Routing Topology  
EM1  
EM3  
EM5  
EM7  
EM9  
TL1  
TL2  
TL3  
TL4  
TL5  
EM2  
EM4  
EM6  
EM8  
EM10  
B2723 -01  
Table 14.  
PCI 33 MHz Embedded Routing Recommendations  
Parameter  
Reference Plane  
Routing Guideline for Lower AD Bus  
Route over an unbroken ground plane  
Board Impedance  
Stripline Trace Spacing  
Microstrip Trace Spacing  
Group Spacing  
60 +/- 15%  
12 mils, edge to edge  
18 mils edge to edge  
Spacing from other groups: 25 mils min, edge to edge  
Breakout  
5 mils on 5 mils spacing. Maximum length of breakout region can be 500 mils.  
Trace Length 1 TL1: From  
41210 Bridge signal Ball to  
first junction  
5.0” max  
Trace Length TL2 to TL5 -  
between junctions  
0.5” min - 3.5” max  
Trace Length TL_EM1 to  
TL_EM10 from junction to  
embedded devices  
2.0” min - 3.0” max  
Length Matching  
Requirements  
Clocks coming from the clock driver must be length matched to within 25 mils.  
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PCI Express Layout  
9
This section provides an overview of the PCI-Express stackup recommended based on Intel  
presimulation results. For additional information, refer to the Intel® 41210 Serial to Parallel PCI  
Bridge Developers Manual or the PCI Express Specification, Revision 1.0a from the  
www.pcisig.com website.  
9.1  
General recommendations  
PCI Express is a serial differential low-voltage point-to-point interconnect. The PCI Express was  
designed to support 20 inches between components with standard FR4. The 41210 Bridge supports  
x8 lanes. PCI-Express requires special considerations be made for interconnect losses, jitter, crosstalk  
and mode conversions. The below list provides some general guidelines for the layout of a PCI-  
Express trace:  
1. Jitter: Trace lengths of a PCB trace can introduce around 1 to 5 ps of jitter and 0.35 to 0.5 dB  
of loss per inch of differential pair. An add-in card the trace length from edge-finger pad to  
device is limited to 3 inches.  
2. Matching within pair: Trace lengths of matching differential pairs are required to be matched  
within +/-5 mil delta. Each net within a differential pair should be length matched on a  
segment-by-segment basis at point of discontinuity such as an breakout area, routes between  
vias, routes between AC coupling capacitors and connector pins.  
3. Trace Symmetry: Trace Symmetry is required between two traces of the same differential pair.  
4. Vias: Vias contribute 0.5 to 1.0 dB/via toward the loss budget. Vias on an add-in card should  
be limited to one near the breakout section of the pads and one near the edge finger.  
5. Bends: Trace bends should be kept to a minimum. If bends are used they should be at a 45-  
degree angle or smaller. The number of left and right bends should be matched as closely as  
possible to even out the overall lengths of each segment of the differential pair.  
6. AC Coupling capacitors: AC coupling capacitor with a value of 75nF to 200nF should line  
up at the same location from one trace to the other within the pair. The 0402 size capacitor  
with a small pad size is highly recommended. The breakout from the capacitor should be  
symmetrical for both signal traces in the differential pair.  
7. Connector pins: Length compensation for the connector pins of the differential pair being  
offset from each other the PCB trace should be considered.  
8. Ground Plane Referencing: Ground plane referencing is required along the entire route of the  
differential pair. Traces routed near the edge should maintain a 40 mil air gap to the edge.  
Layer switching should also maintain the ground plane. Grounds between planes should be  
connected with stitching vias (with one to three recommended per differential pair).  
9. Breakout Areas: Breakout areas near a device package should be limited to 500 mils in lengths.  
The necking down to a smaller trace width should be symmetrical on the differential pair.  
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PCI Express Layout  
9.2  
PCI-Express Layout Guidelines  
The layout guidelines for PCI-Express were developed for an adapter card topologies. The models and  
assumptions used in development of these guidelines were as follows:  
Add-In Card Stackup: 60 single-ended impedance  
Target Differential Impedance: 100 +/- 20%.  
Driver Model: 41210 Bridge PCI-E IBIS  
Receiver Model: 41210 Bridge PCI-E IBIS. Specification model did not meet specifications  
Driver Package Model: Preliminary 41210 Bridge model.  
No receiver package model used since specification eye is at package pin.  
Assumed that traces in a lane could be routed totally on microstrip, totally on stripline, or a  
mixture of microstrip and stripline.  
AC coupling capacitors were modeled as a parasitic resistor and inductor in series.  
Add-in card was modeled as micro-strip routes only.  
No vias were modeled at this time.  
Only the receiver eye was evaluated. The next revision will evaluate the eye at the transmitter  
and connector as well as the receiver.  
9.3  
Adapter Card Layout Guidelines  
Table 15.  
Adapter Card Routing Recommendations (Sheet 1 of 2)  
Parameter  
Reference Plane  
Routing Guidelines  
Route over an unbroken ground plane  
Target Single Ended  
Impedance  
60 nominal  
Target Differential  
Impedance  
100 +/- 20% Differential Impedance  
Microstrip and Stripline Trace  
Width  
4 mils  
Intrapair: 10 mils center-to-center  
Interpair: 30 mils center-to-center  
22 mils. center to center (pair to pair).  
Microstrip Trace Spacing  
Group Spacing  
Transmit and Receive pairs should be interleaved. If no interleaving, then inter  
pair spacing should be increased to 50 mils (c2c). Center to center of inter pair is  
defined as center of Positive of one pair to Center of Negative of the next or vice  
versa  
Spacing from other groups: 25 mils minimum, center to center  
Transmit Trace Length  
(41210 Bridge signal pin to  
AC coupling capacitor.)  
0.25”- 5.0” max  
Transmit Trace Length (AC  
coupling capacitor to card  
edge finger.)  
1.00”- 4.5” max  
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PCI Express Layout  
Table 15.  
Adapter Card Routing Recommendations (Sheet 2 of 2)  
Receive Trace Length (Card  
edge finger to 41210 Bridge 1.0” min - 6.0” max  
receiver pin  
Total allowable intra-pair length mis-match must not exceed 25 mils. Each  
routing segment should be matched as close as possible. Total skew across all  
lanes must be less than 20 ns. See the PCI-Express Desktop Design Guidelines  
for additional routing requirements  
Length Matching  
Requirements:  
Number of vias  
4 max  
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Circuit Implementations  
10  
This chapter describes 41210 Bridge circuit implementations.  
10.1  
41210 Bridge Analog Voltage Filters  
The Intel® 41210 Serial to Parallel PCI Bridge requires several external analog voltage filter  
circuits to be placed on the system board, three for the PCI interface, one for the PCI Express  
interface, and one for the bandgap voltage. The 41210 Bridge lists the recommended filter values  
for these filter circuits -- any one of the filter circuits can use any one of the four R, L and C  
combinations shown in Table 16, except that configuration number 4 cannot be used for the PCI  
Express analog voltage filter.  
Table 16.  
Recommended R, L and C Values for 41210 Bridge Analog Filter Circuits  
Config  
1
R
L
C
4.7uH ±25%  
PCI, PCI-E: 45mA  
Bandgap: 30mA  
0.5±1%  
1/16W  
33uF ±20%  
6.3V  
4.7uH ±20  
0.5±1%  
1/16W  
22uF ±20%  
6.3V  
2
3
PCI, PCI-E: 45mA  
Bandgap: 30mA%  
4.7uH ±20%  
PCI, PCI-E: 45mA  
Bandgap: 30mA  
0.5±1%  
1/16W  
2x10uF ±20%  
6.3V  
4.7uH ±20%  
PCI: 45mA  
1.0±1%  
1/16W  
10uF ±20%  
6.3V  
a
4
Bandgap: 30mA  
a.  
Configuration number 4 cannot be used for the PCI Express analog voltage filter.  
Additional notes:  
L (Inductor)  
— L must be magnetically shielded  
— ESR: max < 0.4Ω  
— rated at 45mA (or 30mA for bandgap circuit only)  
C (Capacitor)  
— ESR: max < 0.5Ω  
— ESL < 3.0nH  
R (Resistor)  
— 1/16W  
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Circuit Implementations  
10.1.1  
PCI Analog Voltage Filters  
The following filter circuit is recommended for the PCI interface. Three separate, identical  
versions of this circuit should be placed on the system board, one for each VCCAPCI[2:0] pin on  
the Intel® 41210 Serial to Parallel PCI Bridge.  
Figure 23. PCI Analog Voltage Filter Circuit  
Board Trace:  
Breakout Trace:  
Trace Width > 25 mils  
Trace Spacing < 10 mils  
Trace Length < 600 mils  
Trace Width > 6 mils  
Trace Spacing < 6 mils  
Trace Length < 600 mils  
Board Route Breakout  
Traces Traces  
VCC  
L
VCCAPCI[2:0]  
R
Intel41210  
Bridge  
C
VSS  
B2724 -01  
Note: Three of these PCI filter circuits must be placed on the system board, one for each of the  
VCCAPCI[2:0] pins on the Intel® 41210 Serial to Parallel PCI Bridge.  
Place C as close as possible to package pin.  
R must be placed between VCC15 and L.  
Route VCCPCI[x] and VSS as differential traces.  
VCCPCI[x] and VSS traces must be ground referenced (No VCC15 references).  
Max total board trace length = 1.2”.  
Min trace space to other nets = 30 mils.  
10.1.2  
PCI Express Analog Voltage Filter  
Figure 24 shows the PCI Express Analog Voltage Circuit.  
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Figure 24.  
PCI Express Analog Voltage Filter Circuit  
Board Trace:  
Breakout Trace:  
Trace Width > 25 mils  
Trace Spacing < 10 mils  
Trace Length < 600 mils  
Trace Width > 6 mils  
Trace Spacing < 6 mils  
Trace Length < 600 mils  
Board Route Breakout  
Traces Traces  
VCC  
L
VCCAPE  
R
Intel41210  
Bridge  
C
VSSAPE  
B2725 -01  
Note:  
.
Place C as close as possible to package pin.  
R must be placed between VCC15 and L.  
Route VCCAPE and VSSAPE as differential traces.  
VCCAPE and VSSAPE traces must be ground referenced (No VCC15 references).  
Max total board trace length = 1.2”.  
Min trace space to other nets = 30 mils.  
10.1.3  
Bandgap Analog Voltage Filter  
Figure 25 Shows the Bandgap Analog Voltage Filter.  
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Circuit Implementations  
Figure 25.  
Bandgap Analog Voltage Filter Circuit  
Board Trace:  
Breakout Trace:  
Trace Width > 25 mils  
Trace Spacing < 10 mils  
Trace Length < 600 mils  
Trace Width > 6 mils  
Trace Spacing < 6 mils  
Trace Length < 600 mils  
Board Route Breakout  
Traces Traces  
2.5 V  
L
VCCBGPE  
R
Intel41210  
Bridge  
C
VSS  
VSSBGPE  
Note: Ground VSSBGPE at capacitor  
B2726 -01  
Note:  
.
Place C as close as possible to package pin.  
R must be placed between the 2.5V supply and L.  
Route VCCBGPE and VSSBGPE as differential traces.  
VCCBGPE and VSSBGPE traces must be ground referenced (No 2.5V references).  
VSSBGPE should be grounded at the capacitor.  
Max total board trace length = 1.2”.  
Min trace space to other nets = 30 mils.  
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Circuit Implementations  
10.2  
Intel® 41210 Serial to Parallel PCI Bridge Reference  
and Compensation Pins  
There are three compensation pins on Intel® 41210 Serial to Parallel PCI Bridge.  
PE_RCOMP[1:0] are two separate pins that provide voltage compensation for the PCI Express  
interface on the Intel® 41210 Serial to Parallel PCI Bridge. The nominal compensation voltage is  
0.5V. An external 24.9±1% pullup resistor should be used to connect to VCC15. A single pullup  
resistor can be used to for both of these signals.  
RCOMP is an analog PCI interface compensation pin, providing 0.75V to the Intel® 41210 Serial  
to Parallel PCI Bridge. A 100±1% pulldown resistor should be used to connect the RCOMP pin  
to ground.  
These implementations are shown in Figure 26.  
Figure 26. Reference and Compensation Circuit Implementations  
VCC  
Intel41210  
Bridge  
R1 = 24.9 – 1%  
0.5 V  
0.5 V  
PE_RCOMP[0]  
PE_RCOMP[1]  
0.75 V  
RCOMP  
R3 = 100 – 1%  
B2727 -01  
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Circuit Implementations  
10.2.1  
SM Bus  
The SMBus interface does not have configuration registers. The SMBus address is set by the states  
of pins SMBUS[5] and SMBUS [3:1] when PERST# is asserted as described in Table 17.  
Table 17.  
SMBUs Address Configuration  
Bit  
Value  
7
6
5
4
3
2
1
1
1
SMBUS[5]  
0
SMBUS[3]  
SMBUS[2]  
SMBUS[1]  
Refer to Section 2.4 for details on how to use the SMBus to initialize 41210 Bridge registers with a  
microcontroller.  
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41210 Bridge Customer Reference  
Boards  
11  
This chapter describes the 41210 Bridge Customer Reference Board (CRB).  
11.1  
Board Stack-up  
The proposed layout of the PCB is eight layers with the following stackup:  
Signal #1 (Top/Component Side)  
Ground Plane: GND  
Signal #2  
Power Plane  
Power Plane  
Signal #3  
Ground Plane  
Signal #4 (Bottom)  
The permittivity constant Er = 4.5  
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41210 Bridge Customer Reference Boards  
Table 18. CRB Board Stackup  
Thickness  
(mils)  
Layer  
Type  
Copper Weight  
1
Signal  
Prepreg  
Plane: GND  
Core  
2.00  
4.50  
1.20  
4.80  
1.20  
14.00  
1.20  
3.8  
1/2 + plating  
2
3
4
5
6
7
8
1
Signal  
1
Prepreg  
Plane: PWR  
Core  
1
Plane: PWR  
Prepreg  
Signal  
1.20  
14.00  
1.20  
4.80  
1.20  
4.50  
2.00  
1
1
Core  
Plane: Power  
Prepreg  
Signal  
1
1/2 + plating  
Est. Total  
Thickness  
62 +/- 7  
11.2  
11.3  
Material  
The following materials are used with the 41210 Bridge CRB:  
FR-4, 0.062 in. +/- .007, 1.0 oz Copper Power/GND.  
Full length PCI Raw Card (3.3V Universal) 6.2” high x 7.00” long max with ½ inch cut away.  
Impedance  
Most signal layers require controlled Impedance of 60 +/- 5% microstrip or stripline where  
appropriate.  
Differential signals for the PCI-E interface require matched 100 differential termination realized  
as matched 50resistances referenced to ground.  
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41210 Bridge Customer Reference Boards  
11.4  
Board Outline  
Figure 27 provides the mechanical outline of the 41210 Bridge CRB.  
Figure 27. Mechanical Outline of the 41210 Bridge  
U1  
Intel41210  
Bridge  
B2728 -01  
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Design Guide Checklist  
12  
This checklist highlights design considerations that should be reviewed prior to manufacturing an  
adapter card that implements the 41210 Bridge product. The items contained within this checklist  
attempt to address important connections to these devices and any critical supporting circuitry. This  
is not a complete list and does not guarantee that a design will function properly.  
Table 19. PCI Express Interface Signals  
Signals  
Recommendations  
Reason/Impact  
Must be connected to clock from a PCI Express  
connector for add-in card designs or to a 100MHz  
oscillator for an embedded design.  
REFCLKn,  
REFCLKp  
24.9±1% pullup resistor to 1.5V. A single resistor can  
PE_RCOMP[1:0] be used for both signals. Place resistor as close as  
possible to REFCLKn, REFCLKp pins.  
PCI Express compensation pin.  
0.5V nominal.  
For X1 mode, only signals PERp[0] and PERn[0] or  
PERp[7] and PERn[7] are used.  
PCI Express data serial inputs  
(differential data receive  
signals).  
PERP[7:0]  
PERN[7:0]  
For X4 mode, only signals PERp[3:0] and PERn[3:0]  
are used.  
For X8 mode, all of these signals, PERp[7:0] and  
PERn[7:0], are used.  
For X1 mode, only signals PETp[0] and PETn[0] or  
PETp[7] and PETn[7] are used.  
PCI Express data serial inputs  
(differential data transmit  
signals).  
PETP[7:0]  
PETN[7:0]  
For X4 mode, only signals PETP[3:0] and PETN[3:0]  
are used.  
For X8 mode, all of these signals, PETP[7:0] and  
PETN[7:0], are used.  
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Design Guide Checklist  
Table 20. PCI/PCI-X Interface Signals  
Signals  
Recommendations  
Reason/Impact  
X_AD[63:32]  
X_CBE[7:4]#  
X_DEVSEL#  
X_FRAME#  
X_IRDY#  
X_TRDY#  
X_STOP#  
X_PERR#  
X_SERR#  
X_REQ[5:0]#  
X_GNT[5:0]#  
X_LOCK#  
X_PAR  
41210 Bridge has internal pullup  
resistors on these signals.  
No external pullup resistors required on system board.  
X_AD[31:0] and X_CBE#[3:0]  
signals do not require pullups  
according to the PCI Specification.  
X_PAR64  
X_ACK64#  
X_REQ64#  
Only relevant when running in PCI-X Mode  
(X_PCIXCAP = 1).  
Determines the max PCI-X Mode 1 frequency for a  
particular segment (100 MHz or 133 MHz):  
A_133EN  
B_133EN  
Sampled on the rising edge of  
PERST#.  
0 = 100 MHz PCI-X max frequency  
1 = 133 MHz PCI-X max frequency  
Use an 8.2Kpullup resistor to VCC33. This resistor is  
located on the system board.  
A_INTA#,  
A_INTB#,  
A_INTC#,  
A_INTD#,  
B_INTA#,  
B_INTB#,  
B_INTC#,  
B_INTD#  
The 41210 Bridge has internal  
pullup resistors on these signals.  
No pullup resistors required on these signals.  
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Table 20. PCI/PCI-X Interface Signals  
Signals  
Recommendations  
Reason/Impact  
Controls frequency of the PCI segment when running  
in conventional PCI mode (33 MHz or 66 MHz):  
0 = 33 MHz PCI  
1 = 66 MHz PCI  
Pull-up using a 8.2Kresistor when the PCI bus is  
to operate at 66 MHz and not already pulled up by  
system board. This signal is grounded for 33 MHz  
operation.  
A_M66EN  
B_M66EN  
Sampled on the rising edge of  
PERST#.  
Connect M66EN to a 0.01 µF capacitor located  
with-in 0.25 inches of the M66EN pin on the PCI  
connector (for designs with secondary PCIX bus  
slots only).  
Design without secondary PCI/PCI-  
X Slot  
If there is at least one legacy  
PCI device on the PCI/PCI-X  
bus, tie this pin directly to  
GND.  
If all devices are PCI-X  
capable and there is at least  
one PCI-X device that only  
supports maximum PCI-X  
66MHz on the secondary PCI  
bus, pull down to GND  
through 10Kseries resistor  
parallel with a 0.01uF  
capacitor.  
If all secondary PCI-X  
devices (and the bus loading)  
support PCI-X 133MHz,  
connect PCIXCAP to 3.3V  
through an 8.2K resistor  
A_PCIXCAP  
B_PCIXCAP  
Connects directly to the PCIXCAP pin on the PCI slot.  
Connect to VCC33 through an 8.2Kpullup resistor.  
Design with secondary PCI/PCI-X  
Slot  
If there is at least one on  
board legacy PCI device on  
the secondary PCI bus, tie  
this pin directly to GND.  
Else  
Pull up to 3.3V through a  
8.2Kresistor  
Connect this pin to  
PCIXCAP (Pin B38) of the  
PCI connector. (Assuming  
bus loading supports up to  
PCI-X 133MHz)  
IDSEL  
The series resistor on IDSEL should be 200±5%.  
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Table 21. Miscellaneous Signals  
Signals  
Recommendations  
Reason/Impact  
Used for debug purposes. Connect to VCC33 through  
an 8.2Kpullup resistor for normal operation.  
RSTIN#  
A_STRAP0,  
A_STRAP1,  
A_STRAP2,  
A_STRAP6,  
These signals REQUIRE external pull-downs to GND  
on the board 8.2Kunless otherwise stated.  
B_STRAP0,  
B_STRAP1,  
B_STRAP2,  
B_STRAP6  
RESERVED [8:1]  
Input pin to configure 41210 to retry configuration  
accesses on it's PCI Express interface.  
CFGRETRY  
To retry configuration accesses to the 41210, pull high to  
3.3V through a 2K resistor.  
To allow configuration accesses to the 41210, ground this  
pin through a 2K resistor.  
A_TEST1,  
A_TEST2,  
B_TEST1,  
B_TEST2  
A_PME#,  
B_PME#,  
These signals REQUIRE an external pull-up, 8.2Kto  
3.3V.  
A_STRAP[3],  
A_STRAP[4],  
A_STRAP[5],  
B_STRAP[3],  
B_STRAP[4],  
B_STRAP[5]  
In normal operating mode, this  
pin must be tied high.  
NC17  
This signal requires an external pull-up, 8.2Kto 3.3V.  
Table 22. SMBus Interface Signals  
Signal  
Recommendations  
Reason/Impact  
SMBCLK  
SMBDAT  
Connect to VCC33 through an 8.2Kpullup resistor.  
Connect to VCC33 through an 8.2Kpullup resistor.  
SMBus addressing:  
Bit 7----------------’1’  
Bit 6----------------’1’  
Bit 5---------------SMBUS[5]  
Bit 4----------------’0’  
SMBUS[5],  
SMBUS[3:1]  
Sampled on the rising edge of  
PERST#.  
Bit 3---------------SMBUS[3]  
Bit 2---------------SMBUS[2]  
Bit 1---------------SMBUS[1]  
Use 8.2Kresistors as pullups to VCC33 for a ‘1’ and  
as pulldowns to ground for a ‘0’ to set the SMBus  
address.  
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Table 23. Power and Ground Signals  
Signal  
Recommendations  
Reason/Impact  
100±1% (1/4 W) pulldown resistor to ground.  
Analog compensation pin for  
PCI. 0.75V nominal.  
RCOMP  
The trace impedance of this signal should be < 0.1Ω.  
Connect to 1.5V power supply.  
Note: Linear voltage regulators are recommended  
when using 1.5 Volt power supplies.  
Decoupling:  
VCC15  
1.5V ±5% core voltage.  
5 0.1uF caps beneath package (backside of board)  
2 1.0 uF caps as close as design rules permit to  
package  
3 10 uF caps as close as design rules permit to  
package  
Connect to 3.3V power supply.  
Decoupling: TBD  
The platform must insure that the VCC33 voltage rail  
be greater than to (or no less than 0.5V below) VCC15  
(absolute voltage value at all times during 41210  
Bridge operation, including during system power up,  
power down or any other time during system operation.  
This can be accomplished by placing a diode (with a  
voltage drop < 0.5V) between VCC15 and VCC33.  
Anode will be connected to VCC15 and cathode will be  
connected to VCC33.  
VCC33  
3.3V ±5% PCI I/O voltage.  
Connect to 1.5V power supply.  
1.5V ±3% Analog PCI Express  
voltage.  
VCCAPE  
VCCAPCI[2:0]  
See Figure 23 for circuit.  
Analog PCI voltage pins.  
Voltage output of the bandgap filter circuit into 41210  
Bridge, separated from the rest of the VCC15s. See  
Figure 25 for circuit.  
VCCBGPE  
VCCPE  
2.5V ±3% PCI Express voltage.  
Connect to 1.5V power supply.  
Decoupling:  
3 0.1uF caps beneath package (backside of board)  
1.5V ±3% PCI Express voltage.  
4 1.0 uF caps as close as design rules permit to  
package  
2 10 uF caps as close as design rules permit to  
package  
Ground reference for all  
supplies.  
VSS  
Connect to ground.  
VSSAPE  
VSSBGPE  
See Figure 24 for circuit.  
Analog ground for PCI Express.  
Ground for the bandgap filter circuit, separated from  
the rest of the VSSs. See Figure 25 for circuit.  
Ground for analog bandgap  
voltage.  
Intel® 41210 Serial to Parallel PCI Bridge Design Guide  
63  
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Design Guide Checklist  
Table 24. JTAG Signals  
Signal  
Recommendations  
Reason/Impact  
Internal pull-up  
TCK  
TDI  
If not used for JTAG, leave as No Connect  
If not used for JTAG, leave as No Connect  
If not used for JTAG, leave as No Connect  
If not used for JTAG, leave as No Connect  
Internal pull-up  
Internal pull-up  
Internal pull-up  
TDO  
TMS  
If TAP interface is not used this  
should be tied to ground.  
TRST#  
Connect to ground via a 1Kpulldown resistor.  
64  
Intel® 41210 Serial to Parallel PCI Bridge Design Guide  
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