Infortrend Network Card A12U A08U G2421 User Manual

EonStor® A12U/A08U-G2421  
SCSI-to-SATA RAID Subsystem  
Installation and Hardware  
Reference Manual  
Version 1.1 (12, 2005)  
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EonStor A12U/A08U-G2421 Installation and Hardware Reference Manual  
Copyright 2005  
This Edition First Published 2005  
All rights reserved. This publication may not be reproduced, transmitted, transcribed,  
stored in a retrieval system, or translated into any language or computer language, in  
any form or by any means, electronic, mechanical, magnetic, optical, chemical,  
manual or otherwise, without the prior written consent of Infortrend Technology, Inc.  
Disclaimer  
Infortrend Technology makes no representations or warranties with respect to the  
contents hereof and specifically disclaims any implied warranties of merchantability  
or fitness for any particular purpose. Furthermore, Infortrend Technology reserves  
the right to revise this publication and to make changes from time to time in the  
content hereof without obligation to notify any person of such revisions or changes.  
Product specifications are also subject to change without prior notice.  
Trademarks  
Infortrend, the Infortrend logo, RAIDWatch, and EonStor are registered trademarks  
of Infortrend Technology, Inc. Other names prefixed with “IFT” are trademarks of  
Infortrend Technology, Inc.  
PowerPC® is a trademark of International Business Machines Corporation and  
Motorola Inc.  
Solaris and Java are trademarks of Sun Microsystems, Inc.  
All other names, brands, products or services are trademarks or registered trademarks  
of their respective owners.  
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EonStor A12U/A08U-G2421 Installation and Hardware Reference Manual  
Warnings and Certifications  
FCC  
(applies in the U.S. and Canada)  
FCC Class B Radio Frequency Interference Statement  
This equipment has been tested and found to comply with the limits for a Class B  
digital device, pursuant to Part 15 of the FCC Rules (47 CFR, Part 2, Part 15 and  
CISPR PUB. 22 Class B). These limits are designed to provide reasonable protection  
against harmful interference when the equipment is operated in a residential  
installation. This equipment generates, uses, and can radiate radio frequency energy  
and, if not installed and used in accordance with this user’s guide, may cause harmful  
interference to radio communications. However, there is no guarantee that  
interference will not occur in a particular installation. If this equipment does cause  
harmful interference to radio or television reception, which can be determined by  
turning the equipment off and on, the user is encouraged to try to correct the  
interference by one or more of the following measures:  
Reorient or relocate the receiving antenna.  
Increase the separation between the equipment and receiver.  
Connect the equipment into an outlet on a circuit different from that  
to which the receiver is connected.  
Consult the dealer or an experienced radio/TV technician for help  
This device complies with Part 15 of FCC Rules. Operation is subjected to the  
following two conditions: 1) this device may not cause harmful interference, and 2)  
this device must accept any interference received, including interference that may  
cause undesired operation.  
Warning:  
A shielded power cord is required in order to meet FCC emission limits and also to  
prevent interference to nearby radio and television reception.  
Use only shielded cables to connect I/O devices to this equipment. You are cautioned  
that changes or modifications not expressly approved by the party responsible for  
compliance could void your authority to operate the equipment.  
This device is in conformity with the EMC.  
CB (Certified Worldwide)  
This device meets the requirements of the CB standard for electrical equipment with regard to  
establishing a satisfactory level of safety for persons using the device and for the area  
surrounding the apparatus. This standard covers only safety aspects of the above apparatus; it  
does not cover other matters, such as style or performance.  
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EonStor A12U/A08U-G2421 Installation and Hardware Reference Manual  
Table of Contents  
CHAPTER 1 INTRODUCTION........................................................................... 1-1  
1.1  
PRODUCT OVERVIEW ...........................................................................................................1-1  
1.1.1 Introduction .........................................................................................................................1-1  
1.1.2 Model Variations.................................................................................................................1-2  
1.1.3 Enclosure Chassis................................................................................................................1-2  
1.1.3.1  
1.1.3.2  
1.1.3.3  
1.1.3.4  
1.1.3.5  
1.1.3.6  
Chassis Overview...................................................................................................................1-2  
Physical Dimensions ..............................................................................................................1-4  
Front Panel Overview.............................................................................................................1-4  
Hard Drive Numbering...........................................................................................................1-5  
Rear Panel Overview..............................................................................................................1-5  
Backplane Board....................................................................................................................1-7  
1.2  
SUBSYSTEM COMPONENTS ...................................................................................................1-7  
1.2.1 LCD Panel ...........................................................................................................................1-7  
1.2.2 Drive Trays..........................................................................................................................1-8  
1.2.3 The RAID Controller Module .............................................................................................1-8  
Controller Module Interfaces...................................................................................................................1-9  
 
 
 
Host Ports...............................................................................................................................1-9  
Ethernet Port ..........................................................................................................................1-9  
COM Port.............................................................................................................................1-10  
DIMM Module ......................................................................................................................................1-10  
1.2.4 Battery Backup Unit..........................................................................................................1-10  
1.2.5 Power Supply Units...........................................................................................................1-11  
1.2.6 Cooling Fan Modules ........................................................................................................1-12  
Advanced Fault-Preventative Operation................................................................................................1-12  
1.3  
SUBSYSTEM MONITORING..................................................................................................1-13  
1.3.1 I2C Bus ..............................................................................................................................1-13  
1.3.2 LED Indicators ..................................................................................................................1-13  
1.3.3 Firmware and RAIDWatch GUI........................................................................................1-13  
1.3.4 Audible Alarms..................................................................................................................1-14  
1.4  
HOT-SWAPPABLE COMPONENTS ........................................................................................1-14  
1.4.1 Hot-Swap Capabilities.......................................................................................................1-14  
1.4.2 Components.......................................................................................................................1-14  
1.4.3 Normalized Airflow...........................................................................................................1-15  
CHAPTER 2 HARDWARE INSTALLATION................................................... 2-1  
2.1  
2.2  
2.3  
INTRODUCTION.....................................................................................................................2-1  
INSTALLATION PREREQUISITES ............................................................................................2-1  
SAFETY PRECAUTIONS .........................................................................................................2-2  
2.3.1 Precautions and Instructions................................................................................................2-2  
2.3.2 Static-Free Installation.........................................................................................................2-3  
2.3.3 BBU Warnings and Precautions ..........................................................................................2-3  
2.4  
GENERAL INSTALLATION PROCEDURE .................................................................................2-4  
2.4.1 Installation Procedure Flowchart.........................................................................................2-5  
2.5  
2.6  
UNPACKING THE SUBSYSTEM...............................................................................................2-6  
INSTALLATION OVERVIEW ...................................................................................................2-7  
2.6.1 Pre-installed Components....................................................................................................2-7  
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EonStor A12U/A08U-G2421 Installation and Hardware Reference Manual  
2.6.2 Uninstalled Components......................................................................................................2-7  
2.7  
RACKMOUNTING ..................................................................................................................2-7  
2.7.1 Considerations for Installation Site and Chassis..................................................................2-7  
2.7.2 Mounting Holes Positions....................................................................................................2-8  
2.8  
BBU INSTALLATION ............................................................................................................2-9  
2.8.1 BBU Module Installation Overview....................................................................................2-9  
2.8.2 Installation Procedure..........................................................................................................2-9  
2.9  
HARD DRIVE INSTALLATION ..............................................................................................2-11  
2.9.1 Hard Drive Installation Pre-requisites ...............................................................................2-11  
2.9.2 Drive Installation...............................................................................................................2-11  
2.10 DRIVE TRAY INSTALLATION...............................................................................................2-12  
CHAPTER 3 SYSTEM MONITORING.............................................................. 3-1  
3.1  
3.2  
SUBSYSTEM MONITORING OVERVIEW..................................................................................3-1  
STATUS-INDICATING LEDS ..................................................................................................3-3  
3.2.1 Brief Overview of the LEDs................................................................................................3-3  
3.2.2 Controller Module LEDs.....................................................................................................3-3  
3.2.3 Ethernet Port LEDs..............................................................................................................3-4  
3.2.4 LCD Keypad Panel..............................................................................................................3-5  
3.2.5 Drive Tray LEDs .................................................................................................................3-6  
3.2.6 BBU Module LED...............................................................................................................3-7  
3.2.7 PSU LED.............................................................................................................................3-7  
3.2.8 Cooling Fan Module LED ...................................................................................................3-7  
3.3  
AUDIBLE ALARM..................................................................................................................3-8  
3.3.1 Default Threshold Values....................................................................................................3-9  
3.3.2 Failed Devices .....................................................................................................................3-9  
3.4  
I2C MONITORING ...............................................................................................................3-10  
CHAPTER 4 SYSTEM CONNECTION AND OPERATION........................... 4-1  
4.1  
SCSI CONNECTION OVERVIEW ............................................................................................4-1  
4.1.1 SCSI Cables.........................................................................................................................4-1  
4.1.2 SCSI Port on the Controller Rear Panel...............................................................................4-1  
4.1.3 SCSI Termination................................................................................................................4-2  
Using the LCD Keypad Panel..................................................................................................................4-4  
Configuration over Hyper Terminal ........................................................................................................4-4  
Via RAIDWatch GUI ..............................................................................................................................4-5  
4.2  
HOST CONNECTION TOPOLOGY............................................................................................4-6  
4.2.1 Single Host ..........................................................................................................................4-6  
4.2.2 Dual Hosts ...........................................................................................................................4-7  
4.3  
POWER  
O
N
...........................................................................................................................4-7  
4.3.1 Power On Checklist.............................................................................................................4-7  
4.3.2 Power On Sequence.............................................................................................................4-8  
4.3.3 Power On Procedure............................................................................................................4-8  
4.3.4 Power On Status Check .......................................................................................................4-9  
4.3.5 LCD Screen .......................................................................................................................4-10  
4.4  
POWER OFF PROCEDURE ....................................................................................................4-11  
CHAPTER 5 SYSTEM MAINTENANCE  
5.1  
OVERVIEW ...........................................................................................................................5-1  
5.1.1 About Subsystem Maintenance ...........................................................................................5-1  
5.1.2 General Notes on Component Replacement........................................................................5-1  
5.2  
REPLACING CONTROLLER MODULE COMPONENTS ..............................................................5-2  
5.2.1 Overview .............................................................................................................................5-2  
5.2.2 Notes on Controller Module Maintenance...........................................................................5-3  
5.2.3 Removing the Controller Module........................................................................................5-3  
5.2.4 Replacing the Controller Module ........................................................................................5-4  
5.3  
REPLACING OR UPGRADING MEMORY MODULES.................................................................5-5  
5.3.1 Memory Module Installation Overview ..............................................................................5-5  
5.3.2 Selecting a Memory Module ...............................................................................................5-5  
5.3.3 DIMM Module Installation..................................................................................................5-6  
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EonStor A12U/A08U-G2421 Installation and Hardware Reference Manual  
5.4  
5.5  
REPLACING A FAULTY BBU.................................................................................................5-8  
REPLACING A FAILED PSU MODULE....................................................................................5-9  
5.5.1 Notes on PSU Module Maintenance....................................................................................5-9  
5.5.2 Replacing the PSU Module .................................................................................................5-9  
5.6  
REPLACING A FAILED COOLING FAN MODULE...................................................................5-12  
5.6.1 Notes on Cooling Fan Module Maintenance .....................................................................5-12  
5.6.2 Replacing a Cooling Fan Module......................................................................................5-12  
5.7  
DRIVE TRAY MAINTENANCE ..............................................................................................5-13  
5.7.1 Notes on Hard Drive Maintenance ....................................................................................5-13  
5.7.2 Replacing a Failed Hard Drive ..........................................................................................5-15  
APPENDIX A SUBSYSTEM SPECIFICATIONS  
A.1  
Vibration......................................................................................................................................... A-2  
A.2 CONTROLLER SPECIFICATIONS............................................................................................ A-3  
TECHNICAL SPECIFICATIONS ............................................................................................... A-1  
A.2.1 Configuration........................................................................................................................ A-3  
A.2.2 Architecture .......................................................................................................................... A-3  
A.3  
A.4  
A.5  
A.6  
A.7  
DRIVE TRAY SPECIFICATIONS ............................................................................................. A-4  
POWER SUPPLY SPECIFICATIONS......................................................................................... A-4  
COOLING MODULE SPECIFICATIONS.................................................................................... A-4  
RAID MANAGEMENT.......................................................................................................... A-5  
FAULT TOLERANCE MANAGEMENT..................................................................................... A-5  
APPENDIX B SPARE PARTS AND ACCESSORIES  
B.1  
SPARE PARTS....................................................................................................................... B-1  
B.1.1 Spare Parts Overview ......................................................................................................... B-1  
B.1.2 Spare Parts List................................................................................................................... B-1  
B.1.3 Controller Modules............................................................................................................. B-2  
B.2  
ACCESSORIES AND OPTIONAL ITEMS................................................................................... B-3  
B.2.1 Accessories Overview ........................................................................................................ B-3  
B.2.2 Accessory Parts List ........................................................................................................... B-3  
APPENDIX C PINOUTS  
C.1. SCSI PORT: VHDCI CONNECTOR PINOUTS........................................................................ C-1  
C.2. COM1 CABLE: DB9 AND AUDIO JACK PINOUTS ................................................................ C-2  
C.3. IFT-9011 NULL MODEM ..................................................................................................... C-3  
C.4. ETHERNET PORT PINOUTS ................................................................................................... C-3  
C.5. MAIN POWER ...................................................................................................................... C-3  
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EonStor A12U/A08U-G2421 Installation and Hardware Reference Manual  
Safety Precautions  
Precautions and Instructions  
Prior to powering on the subsystem, ensure that the correct power range is being  
used.  
The EonStor A12U and A08U subsystems come with eight (8) or twelve (12)  
drive bays. Leaving any of these drive bays empty will seriously affect the  
efficiency of the airflow within the enclosure, and will consequently lead to the  
system overheating, which can cause irreparable damage.  
If a module fails, leave it in place until you have a replacement unit and you are  
ready to replace it.  
Airflow Consideration: The subsystem requires an airflow clearance, especially  
at the front and the rear side.  
Handle subsystem modules using the retention screws, extraction levers, and the  
metal frames/faceplates. Avoid touching PCB boards and connector pins.  
To comply with safety, emission, or thermal requirements, none of the covers or  
replaceable modules should be removed. Make sure that during operation, all  
enclosure modules and covers are securely in place.  
Be sure that the rack cabinet that the subsystem chassis is to be installed provides  
sufficient ventilation channels and airflow circulation around the subsystem.  
Provide a soft, clean surface to place your subsystem on before working on it.  
Servicing on a rough surface may damage the exterior of the chassis.  
If it is necessary to transport the subsystem, repackage all disk drives separately.  
If using the original package material, other replaceable modules can stay within  
the enclosure.  
ESD Precautions  
Observe all conventional anti-ESD methods while handling system modules. The use  
of a grounded wrist strap and an anti-static work pad are recommended. Avoid dust  
or debris in your work area.  
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EonStor A12U/A08U-G2421 Installation and Hardware Reference Manual  
About This Manual  
This manual:  
Introduces the EonStor A12U/A08U-G2421 RAID Subsystems.  
Describes all the active components in the subsystem.  
Provides recommendations and details about the hardware installation process.  
Briefly describes how to monitor the subsystem.  
Describes how to maintain the subsystem.  
This manual does not:  
Describe components that are not user-serviceable.  
Describe the configuration options of firmware, using terminal emulation  
program, or the RAIDWatch GUI that came with your subsystem.  
Give a detailed description of the RAID processing units, or the RAID  
controllers embedded within the subsystem.  
Who Should Read This Manual?  
This manual assumes that its readers are experienced with computer hardware  
installation and are familiar with storage enclosures.  
Related Documentation  
Generic Operation Manual  
RAIDWatch User’s Manual  
These two documents can be found in the product utility CD included with your  
subsystem package.  
Conventions  
Naming  
From this point on and throughout the rest of this manual, the EonStor series is  
referred to as simply the “subsystem” or the “system.”  
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EonStor A12U/A08U-G2421 Installation and Hardware Reference Manual  
Important Messages  
Important messages appear where mishandling of components is possible or when  
work orders can be misunderstood. These messages also provide vital information  
associated with other aspects of system operation. The word “important” is written  
as “IMPORTANT,” both capitalized and bold and is followed by text in italics. The  
italicized text is the important message.  
Warnings  
Warnings appear where overlooked details may cause damage to the equipment or  
result in personal injury. Warnings should be taken seriously. Warnings are easy to  
recognize. The word “warning” is written as “WARNING,” both capitalized and  
bold and is followed by text in italics. The italicized text is the warning message.  
Cautions  
Cautionary messages should also be heeded to help you reduce the chance of losing  
data or damaging the system. Cautions are easy to recognize. The word “caution” is  
written as “CAUTION,” both capitalized and bold and is followed by text in italics.  
The italicized text is the cautionary message.  
Notes  
Notes inform the reader of essential but non-critical information. These messages  
should be read carefully as any directions or instructions contained therein can help  
you avoid making mistakes. Notes are easy to recognize. The word “note” is written  
as “NOTE,” both capitalized and bold and is followed by text in italics. The  
italicized text is the note message.  
Steps  
Steps describe the sequential tasks in a specific work procedure. Following the steps  
in their proper order helps guarantee effectiveness and lowers the chance of making  
mistakes.  
Lists  
Bulleted Lists: Bulleted lists are statements of non-sequential facts. They can be read  
in any order. Each statement is preceded by a round black dot “.”  
Numbered Lists: Numbered lists describe sequential steps you should follow in  
order.  
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EonStor A12U/A08U-G2421 Installation and Hardware Reference Manual  
Software and Firmware Updates  
Please contact your system vendor or visit Infortrend’s FTP site  
(ftp.infortrend.com.tw) for the latest software or firmware updates. Note that the  
firmware version installed on your system should provide the complete functionality  
listed in the specification sheet/user’s manual. We provide special revisions for  
various application purposes. Therefore, DO NOT upgrade your firmware unless you  
fully understand what a firmware revision will do.  
Problems that occur during the updating process may cause unrecoverable errors and  
system down time. Always let technical personnel handle the upgrade or consult  
technical personnel before proceeding with any firmware upgrade.  
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Chapter 1  
Introduction  
1.1 Product Overview  
1.1.1 Introduction  
This hardware manual briefly introduces the EonStor A12U and A08U serial ATA  
(SATA) RAID subsystem series. The SATA-based RAID subsystems come with two  
320MB/second SCSI (SCSI-320) host channels and provide RAID protection to the  
data stored in the eight (8) or twelve (12) hot-swappable, SATA-II hard drives. The  
2U-profile subsystems are equipped with redundant and hot-swappable cooling fan  
and power supply modules to reduce the chance of downtime by component failure.  
The modular nature of the subsystem and the easy accessibility to all major  
components ensure the ease of subsystem maintenance. The differences between the  
two models will be described in the following sections  
The 12-bay and 8-bay subsystems are shown below:  
Figure 1-1: EonStor 12-bay SATA RAID Subsystem  
Figure 1-2: EonStor 8-bay SATA RAID Subsystem  
1-1  
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EonStor A08U/A12U-G2421 Installation and Hardware Reference Manual  
1.1.2 Model Variations  
There are two available models in the 2U version of the EonStor SATA-II RAID  
subsystem series. Below is a comparison chart listing major components of the two  
models.  
A12U-G2421  
A08U-G2421  
12  
8
Number of Drive Bays  
RAID Controller  
Host Channels  
PSUs  
IFT-82AU24GD12  
IFT-82AU24GD08  
SCSI-320 x 2  
SCSI-320 x 2  
2
2
3
1
2
1
Cooling Modules  
LCD Panel  
Optional  
Optional  
Battery Support  
Table 1- 1: Available SATA RAID Subsystem Models  
NOTE:  
On receiving and unpacking your subsystem, please check the package contents  
against the included unpacking checklist. If any modules appear to be missing,  
please contact your subsystem vendor immediately.  
1.1.3 Enclosure Chassis  
1.1.3.1 Chassis Overview  
The EonStor subsystem comes in a 2U metal chassis. A backplane board divides the  
enclosure internally into front and rear sections. The front section accommodates  
twelve (12) or eight (8) drive trays (with their associated hard drives) and the rear  
section accommodates two (2) PSU modules, two (2) or three (3) single-fan cooling  
modules, and a single RAID controller module. The two (2) forearm handles on the  
front of the subsystem enable you to easily insert/extract the chassis into/from a rack  
or cabinet. Pre-drilled mounting holes on the sides of the chassis allow you to attach  
separately purchased slide rails.  
Product Overview  
1-2  
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Chapter 1: Introduction  
Figure 1-3: Locations of Key Components in a 12-bay Model  
Figure 1-4: Locations of Key Components in an 8-bay Model  
CAUTION!  
When working with the subsystem, it is important to use tools with extreme care.  
Do not place tools or other items on top of the enclosure to help avoid damaging  
the outward appearance of chassis.  
1
-3  
Product Overview  
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EonStor A08U/A12U-G2421 Installation and Hardware Reference Manual  
1.1.3.2 Physical Dimensions  
The subsystems come in a standard 2U, 19” chassis with the following dimensions:  
Measured with forearm handles: 482mm x 88mm x 505mm (width x height x  
depth)  
Measured without forearm handles: 446mm x 88mm x 490mm (width x height x  
depth)  
NOTE:  
Components accessed through the front panel are referred to as “Front Panel  
Components” and Components accessed through the rear panel are referred to as  
Rear Panel Components.”  
1.1.3.3 Front Panel Overview  
The front section of the subsystem features a 4 x 2 or 4 x 3 layout for eight (8) or  
twelve (12) 3.5-inch disk drives and a foldable LCD keypad panel. The front panels  
of the RAID subsystems described in this manual are shown in Figure 1-5 and  
Figure 1-6. A description of each front panel component is given below:  
Figure 1-5: Front View – A12U 12-bay Model  
Figure 1-6: Front View – A08U 8-bay Model  
The front panels shown in Figure 1-5 and Figure 1-6 are designed to accommodate  
the following components:  
Forearm handles with an LCD keypad panel: The LCD Panel mounted on the  
left handle shows system information and provides local access to the firmware-  
embedded configuration and monitoring utility.  
Product Overview  
1-4  
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Chapter 1: Introduction  
Drive bays with drive tray canisters: The drive bays are used to house the  
subsystem hard drives. The A12U contains 12 drive bays while the A08U contains  
8 drive bays with a blank plate covering the lower part of the front panel.  
1.1.3.4 Hard Drive Numbering  
The subsystems are housed in an enclosure that is 4 bays wide and 3 or 2 bays high.  
When viewed from the front, drive bays (slots) are numbered 1 to 12 (See Figure 1-  
7) or 1 to 8 (See Figure 1-8), from the left to the right, and then from the top to the  
bottom.  
Figure 1-7: A12U Drive Bays Numbering Sequence  
Figure 1-8: A08U Drive Bays Numbering Sequence  
1.1.3.5 Rear Panel Overview  
The rear section of the subsystems are accessed through the rear panel and is reserved  
for a single RAID controller module, one (1) battery backup unit (BBU), two (2)  
power supply units (PSUs), and three (3-A12U) or two (2-A08U) cooling fan  
modules.  
The subsystem rear views are shown in Figure 1-9 and Figure 1-10. A description  
of each rear panel component is given in the proceeding discussions:  
1
-5  
Product Overview  
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EonStor A08U/A12U-G2421 Installation and Hardware Reference Manual  
Figure 1-9: Rear View – A12U-G2421 Subsystem  
Figure 1-10: Rear View – A08U-G2421 Subsystem  
The rear panels shown above are designed to accommodate the following  
components:  
RAID controller module: The controller module contains a controller main  
board and a pre-installed DDR DIMM module.  
Power Supply Unit (PSU): The PSU is used to provide power to the  
subsystem.  
BBU module: A BBU comes as an optional module which provides the  
protective implementation to cached data; and, unless deselected when  
purchasing the subsystems, is installed into the module slot located at the  
upper left corner of the controller module.  
Cooling fan module: The redundant cooling fan module is used to ventilate  
the subsystem and to reduce the temperature within the subsystem. The 12-bay  
model has an additional cooling module installed in the bottom module bay.  
NOTE:  
Each of the power supplies on the sides of the enclosure houses one cooling fan  
module in a retrievable canister. When a power supply is removed, the cooling  
module is also removed. Therefore, replace the power supply unit as fast as possible  
whenever it becomes necessary. Cooling fan modules can be independently removed  
from the chassis without affecting PSU operation.  
Product Overview  
1-6  
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Chapter 1: Introduction  
1.1.3.6 Backplane Board  
An integrated backplane board separates the front and rear sections of the  
subsystems. The PCB board provides traces for logic level signal traces and low  
voltage power paths. It contains no user-serviceable components.  
1.2 Subsystem Components  
All the active components on the subsystems can be accessed through either the front  
or rear panel. The modular design of the active components facilitates their easy  
installation and removal. Hot-swap mechanisms are incorporated to eliminate power  
surges and signal glitches that might occur while removing or installing these  
modules.  
1.2.1 LCD Panel  
Figure 1-11: Opening the Front Handle  
The LCD panel shown in Figure 1-11 consists of a 16 characters x 2 rows LCD  
screen with push buttons, a mute button, and LED status indicators. The LCD front  
panel provides full access to all array configurations and monitoring. After powering  
up the subsystem, the initial screen will show the subsystem model name. A different  
name can be manually assigned to the subsystem or different drive arrays. This will  
enable easier identification in a topology consisting of numerous arrays.  
Figure 1-12: Front Panel Retention Latch  
To access drive bays in the left- or right-hand side column, first flip the retention  
latches (see Figure 1-12) on the enclosure front handles, and then swing the handles  
to the left- and right-hand sides. To close the handles (see Figure 1-13), swing the  
handles toward the system; gently press the handles until a click is heard. The latches  
will keep the handles in place.  
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Figure 1-13: Closing the Front Handles  
1.2.2 Drive Trays  
The subsystems come with 12 or 8 drive trays (see Figure 1-14) designed to  
accommodate separately purchased standard 1-inch pitch, 3.5-inch disk drives. The  
drive bays are accessed from the enclosure front. Two LED’s on the front of the tray  
are used to indicate the drive status. A key-lock on each drive tray secures the hard  
drive in place, while an easily accessible release button ensures fast and efficient  
drive hot-swapping.  
Figure 1-14: Drive Tray Front View  
PN: IFT-9273CDTray – Drive Tray Module  
WARNING!  
Be careful not to warp, twist, or contort the drive tray in any way (e.g., by dropping it  
or resting heavy objects on it). The drive tray has been customized to fit into the drive  
bays in the subsystem. If the drive bay superstructure is deformed or altered, the drive  
trays may not fit into the drive bay.  
1.2.3 The RAID Controller Module  
12-bay A12U-G2421 Æ PN: IFT-82AU24GD12-M2 (w/ 256MB DDR DIMM)  
12-bay A12U-G2421 Æ PN: IFT-82AU24GD12 (w/o DDR DIMM)  
8-bay A08U-G2421 -Æ PN: IFT-82AU24GD08-M2 (w/ 256MB DDR DIMM)  
8-bay A08U-G2421 -Æ PN: IFT-82AU24GD08 (w/o DDR DIMM)  
The RAID controller module contains a main circuit board, a preinstalled 256MB  
capacity or above DDR RAM DIMM module, and the necessary support interfaces.  
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The controller module contains no user-serviceable components. Except when  
replacing a faulty unit or installing/upgrading the cache memory inside, the controller  
module should never be removed or opened.  
WARNING!  
Although the RAID controller can be removed, the only time you should touch the  
controller itself is to replace the memory module or to install the memory module.  
The RAID controller is built of sensitive components and unnecessary tampering can  
damage the controller.  
Controller Module Interfaces  
The subsystems provide external interfaces to host computers and management  
station(s) through the RAID controller’s rear-side faceplate as shown in Figure 1-15.  
Note that the rear-facing faceplates of the A12U and A08U models look identical.  
Figure 1-15: Controller Module Faceplate  
Host Ports  
SCSI-320 Host Ports: Two SCSI-320 host channels connect the subsystem to the  
host computers equipped with SCSI-320 compatible adapters through the dual-stack  
VHDCI connectors. The dual-stack connectors facilitate cascade connections for  
configurations such as host clustering or cascading with another RAID subsystem.  
NOTE:  
This subsystems come with preset configurations for channel mode and channel ID  
settings, and should be sufficient for most applications.  
Ethernet Port  
All controller modules on the subsystems come with a single 10/100BasedT RJ-45  
Ethernet port. The Ethernet port is used for local or remote management through the  
network using the RAIDWatch GUI manager or Telnet protocol.  
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COM Port  
All controller modules come with one RS-232C (audio jack) serial port. The serial  
port is used for local access to the system-embedded configuration utility over the  
included serial port cable.  
DIMM Module  
The controller module comes with a preinstalled 256MB capacity or above DDR  
RAM DIMM module and can support a larger capacity up to 2GB. The DIMM  
module is mounted in an easily accessible location on the controller board. However,  
when the DIMM module is being changed, the controller module must be removed  
from the subsystem chassis.  
1.2.4 Battery Backup Unit  
PN: IFT-9273CBT-C  
An optional, separately purchased Li-ION battery backup unit (BBU) module can  
sustain cache memory for days after a power failure. If you purchased a BBU, it will  
be installed on the upper left corner of the controller module in the rear of subsystem  
chassis. Please refer to Chapter 2 for installation details.  
Figure 1-16: BBU Module  
In accordance with international transportation regulations, the BBU module is only  
charged to between 35% and 45% of its total capacity when shipped. Therefore,  
when powering on the subsystem for the first time (see Section 4.4) the BBU will  
begin to charge its batteries to their full capacity. It normally requires approximately  
twelve (12) hours for the battery to be fully charged. If the battery is not fully  
charged after twelve (12) hours (its LED is still flashing), there is a problem with the  
BBU module and you should contact your subsystem vendor immediately. While the  
battery is being charged, the LED on the BBU rear panel and the fifth LED on the  
controller module will flash. (See Chapter 3.2.6 for details on the LED indicators.)  
You can check the status of the battery’s charge via RAIDWatch manager or the  
firmware utility screen.  
Subsystem Components  
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1.2.5 Power Supply Units  
PN: IFT-9272CPSU-0011  
The SATA-based EonStor subsystems are equipped with two (2) redundant, hot-  
swappable, 2U, 350W power supply unit (PSUs) modules. The PSU is permanently  
mounted into a 2U high (dual-level) bracket especially designed to house both the  
PSU and a cooling module mounted underneath. PSUs can be found on either side of  
the controller module.  
Each PSU comes with a single power socket for power cord plug-in and a single  
power switch for you to turn the PSU on and off. Each PSU also comes with two  
embedded cooling fans to provide sufficient airflow to keep the PSU cool. A single  
LED is used to indicate the PSU status. A handle at the back of the PSU has been  
especially designed to enable you to remove the PSU from the subsystem while the  
system is still online. This should only be done if the PSU has failed and needs to be  
replaced.  
NOTE:  
Hot-swapping the PSU also removes the cooling module at the lower slot.  
A retention screw at the upper right corner of the PSU module is used to secure the  
PSU to the enclosure. If the PSU needs to be removed, the retention screw must be  
removed first. When installing a new PSU module, make sure that the retention screw  
has been firmly secured.  
Figure 1-17: PSU Module  
For the PSU specifications, please refer to Appendix B.  
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1.2.6 Cooling Fan Modules  
PN: 9272CfanModE-0010  
The SATA-based EonStor subsystems are equipped with two (for A08U, the 8-bay  
model) or three (for A12U, the 12-bay model), 1U single-fan, redundant, hot-  
swappable cooling modules shown in Figure 1-18. One 9.7cm fan is housed in each  
cooling module. These modules have been designed to generate a cooling flow from  
the front to the rear of the subsystem to extract the heat generated by the SATA hard  
drives. Two of the cooling fan modules are installed directly beneath the PSUs. For  
the 12-bay subsystem, a third module is located directly beneath the controller  
module.  
Figure 1-18: Top View of a Cooling Fan Module  
Advanced Fault-Preventative Operation  
The cooling fan modules support dual-speed operation modes that help to protect the  
subsystem in the event of component failure or extreme working condition.  
Intelligent Dual Speed Operation  
The cooling fans operate with two rotation speeds. Under normal operating  
conditions, the cooling fans run at the low speed, which is sufficient for maintaining  
efficient airflow across components. Under the following conditions, cooling fans  
raise their rotation speed to increase the airflow:  
1. Component Failure: if another cooling fan module, a PSU, or a temperature  
sensor fails, the remaining cooling fan(s) automatically raises its rotation  
speed.  
2. Elevated Temperature: if the temperature breaches the upper threshold set for  
any of the interior temperature sensors, the cooling fans automatically raises  
its rotation speed.  
3. During the subsystem initialization stage, the cooling fans operate at the high  
speed and return to lower speed once the initialization process is completed  
and no erroneous condition is detected.  
Subsystem Components  
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NOTE:  
There are two values set for the upper temperature thresholds. One is set for event  
notification and the other triggering higher fan rotation speed. The preset value  
for event notification can be changed using the firmware-embedded configuration  
utility, while the fan speed trigger is not a user’s option. Please refer to the  
Generic Operation Manual for the options with event notification values.  
1.3 Subsystem Monitoring  
The SATA-based RAID subsystems come with a number of different monitoring  
methods that provide you with continual updates on the status of the system and  
individual components. The following monitoring features are included in the  
subsystem.  
1.3.1 I2C Bus  
The following subsystem elements are interfaced to the RAID controller over a non-  
user-serviceable I2C bus:  
Cooling fan modules  
PSUs  
Temperature sensors  
1.3.2 LED Indicators  
The following active components come with LEDs to indicate the status of the  
individual components:  
RAID controller  
LCD panel  
Cooling fan module  
PSU module  
BBU module  
Drive trays  
1.3.3 Firmware and RAIDWatch GUI  
Firmware: The firmware is pre-installed software that is used to configure the  
subsystem. The firmware can be accessed either through the LCD keypad panel or a  
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terminal emulation program running on a management computer that is connected to  
the subsystem’s serial port.  
RAIDWatch: RAIDWatch is a premier web-based graphical user interface (GUI) that  
can be installed on a remote computer and is used to access the array through LAN or  
the Internet. The manager communicates with the array via the connection of the  
existing host interface or Ethernet link to the RJ-45 LAN port.  
1.3.4 Audible Alarms  
The subsystems come with audible alarms that are triggered when certain active  
components fail or when certain (controller or subsystem) thresholds are exceeded. If  
you hear hastily repeated beep tones from the subsystems it is imperative that you  
immediately determine and rectify the problem.  
Event notification messages indicate the completion of or the condition when  
proceeding with array configuration tasks and are always accompanied by two or  
three successive and prolonged beeps.  
WARNING!  
Failing to respond when a critical alarm is heard can lead to permanent damage of  
the subsystem. When an audible alarm is heard, rectify the problem as soon as  
possible.  
1.4 Hot-Swappable Components  
1.4.1 Hot-Swap Capabilities  
The EonStor A12U-G2421 and A08U-G2421 subsystems come with a number of  
hot-swappable components. A hot-swap component is one that can be exchanged  
while the subsystem is still online without affecting the operational integrity of the  
subsystem. These components should only be removed from the subsystem when  
they are being replaced. At no other time should these components be removed from  
the subsystem.  
1.4.2 Components  
The following components are all hot-swappable:  
Power supply units (PSUs)  
Cooling fan modules  
Hard drives  
BBU module  
Hot-Swappable Components  
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Chapter 1: Introduction  
1.4.3 Normalized Airflow  
Proper subsystem cooling is referred to as “normalized” airflow. Normalized airflow  
ensures the sufficient cooling of the subsystem and is only attained when all  
components are properly installed. Therefore, a failed component should only be hot-  
swapped when a replacement is available. If a failed component is removed but not  
replaced, permanent damage to the subsystem can result.  
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Chapter 2  
Hardware Installation  
2.1 Introduction  
This chapter gives detailed instructions on how to install the subsystem. When  
installing the subsystem, it is necessary to mount the chassis into a rack or cabinet  
and to install hard drives and drive trays. Installation into a rack or cabinet should  
occur before the hard drives or drive trays are installed into the subsystem. Please  
confirm that you received all of the components listed on the Unpacking List that  
came with the subsystem before proceeding with the installation process.  
CAUTION!  
Please note that the installation instructions described in this chapter should be  
carefully followed to prevent any difficulties and damages to your system.  
2.2 Installation Prerequisites  
1. Static free installation environment: The subsystems must be installed in a  
static-free environment to minimize the possibility of electrostatic discharge  
(ESD) damage. (See Section 2.3).  
2. Component check: Before installing the subsystems, you should first check to  
see that you have received all the required components. (See Section 2.4) If any  
items appear damaged, contact your vendor for a replacement.  
3. Hard drives: Hard drives must be purchased separately prior to the subsystem  
installation. (See Section 2.9 for installation instructions)  
4. Cabling:  
(1). The subsystems come with an external VHDCI-to-VHDCI SCSI round cable  
to connect the subsystem to a host computer. All other SCSI cables that are  
used to connect to a second host computer or external devices must be  
purchased separately. Please see Chapter 4 for sample topologies and  
configuration options.  
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(2). One (1) audio-jack-to-DB9 cable is provided to facilitate the connection of  
the COM1 port for local terminal emulation access to the array.  
(3). Two (2) power cords are provided for the power connections to the power  
sources.  
(4). The RJ-45 Ethernet cable for network management connection is a user-  
supplied item.  
5. Memory module: If you wish to change the pre-installed memory module, a  
separately purchased module must be installed. Please contact your vendor for a  
different memory module or consult the list of compatible modules.  
6. BBU module: If you wish to use a BBU module, the module can be purchased  
separately.  
7. Rack installation: The enclosure chassis can be installed into a rack cabinet  
using self-purchased mounting rails, or Infortrend’s IFT-9272CEslide28 or IFT-  
9272CEslide36 rails. (See Section 2.7) A printed copy of installation guide is  
provided with the slide rails package.  
2.3 Safety Precautions  
2.3.1 Precautions and Instructions  
1. Be sure the correct power range (100-120 or 220-240VAC) is supplied by your  
rack cabinet, UPS device, or power outlet.  
2. Thermal notice: All drive trays (even if they do not contain a hard drive) must be  
installed into the enclosure. Leaving a drive bay or module slot open will  
severely affect the airflow efficiency within the enclosure, and will consequently  
lead to system overheating. Keep a faulty module in place until you have a  
replacement unit and you are ready to replace it.  
3. An enclosure without disk drives can weigh over 25 kilograms. Two (2) people  
are required to install or relocate the subsystem. To avoid damage to disk drives,  
drives should be removed from the enclosure before moving the subsystem.  
4. Handle the system modules by the retention screws, extraction levers, or the  
modules metal frames/faceplates only. Avoid touching the PCB boards,  
connector pins, and soldered surfaces.  
5. Airflow considerations: The subsystem requires an airflow clearance especially  
on the front and rear. For proper ventilation, a minimum of 2.5cm is required  
between the front of the enclosure and rack cover; a minimum of 5cm is required  
between the enclosure and end of the rack.  
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6. None of the covers or replaceable modules should be removed in order to  
maintain compliance with safety, emission, or thermal requirements.  
7. Always secure every enclosure module by its retaining screws or make sure it is  
held in place by its latches.  
8. Always make sure the subsystem has a safe electrical earth connection via power  
cords or chassis ground by the rack cabinet.  
9. Be sure that the rack cabinet in which the subsystem chassis is to be installed  
provides sufficient ventilation channels and airflow circulation around the  
subsystem.  
10. Provide a soft, clean surface to place your enclosure on before working on it.  
Servicing the enclosure on a rough surface may damage the finish of the chassis.  
11. If it is necessary to transport the subsystem, repackage all disk drives separately.  
If using the original package material, all other modules can stay within the  
enclosure.  
2.3.2 Static-Free Installation  
The subsystem contains static-sensitive electronic components that can be damaged  
by improper handling and electrostatic discharge (ESD). To prevent ESD damage to  
any of the components, follow these precautions before touching or handling them:  
Discharge the static electricity from your body by wearing an anti-static  
wristband or by touching a grounded metal surface.  
Avoid carpets, plastic, vinyl, and styrofoam in your work area.  
Handle all components by holding their edges or metal frame. Avoid touching  
PCB boards and connector pins.  
2.3.3 BBU Warnings and Precautions  
The BBU module is an optional item that can sustain cache memory in the event  
of a power failure or in the unlikely event if both PSUs have failed. Having the  
protection to cached data by a BBU is highly recommended. The BBU provides  
additional data security and helps minimize the chance of data loss during power  
outage.  
Replace the BBU once it shows symptoms failing to hold the charge.  
Although the life expectancy of a BBU is determined by the times it has  
been charged or discharged, a BBU can approximately last for one year. If  
the battery recharge time is obviously longer than the suggested 12 hours, or  
if the fault LED is lit, replace the battery.  
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Install or replace the BBU module only with a BBU module supplied by  
your subsystem vendor. Use of battery cells provided by another source will  
void our warranty.  
Always dispose of discharged or used batteries in an ecologically  
responsible manner. Dispose used BBUs at authorized battery disposal sites  
only.  
Do not use nor leave the BBU near a heat source or direct sunlight. Heat can  
melt the insulation and damage other safety features of battery cells,  
possibly leading it to acid leak and result in flames or explosion.  
Do not immerse the BBU in water nor allow it to get wet. Its protective  
features can be damaged. Abnormal chemical reactions may occur, possibly  
causing functional defects, acid leak, and other hazardous results.  
Do not disassemble or modify the BBU. If disassembled, the BBU could  
leak acid, overheat, emit smoke, burst and/or ignite.  
Do not pierce the BBU with a sharp object, strike it with a hammer, step on  
it, or throw it. These actions could damage or deform it, internal short-  
circuiting can occur, possibly causing functional defects, acid leaks, and  
other hazardous results.  
If the BBU leaks, gives off a bad odor, generates heat, becomes discolored  
or deformed, or in any way appears abnormal during use, recharging or  
storage, immediately remove it from the subsystem and stop using it. If this  
is discovered when you first use the BBU, return it to Infortrend or your  
system vendor.  
2.4 General Installation Procedure  
Following all the instructions provided below can save installation time. Detailed,  
illustrated instructions for each component are given in the following sections.  
CAUTION!  
To ensure that your system is correctly installed, please follow the steps outlined  
below. If you follow these steps, installation will be fast and efficient. If you do  
not follow these steps, you may have incorrectly installed the hardware.  
Step 1.  
Unpack: Unpack the subsystem and confirm that all the  
components on the Unpacking Checklist have been included.  
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Step 2.  
Step 3.  
Install an optional BBU: a battery backup unit is highly  
recommended for its protection to data integrity. It should be  
installed prior to operating the subsystem. (See Section 2.8)  
Rack/Cabinet installation: If the subsystem is going to be installed  
in a rack or cabinet, it should be installed prior to installing the hard  
drives. Installing the subsystem into a rack or cabinet requires at  
least two (2) people.  
Step 4.  
Step 5.  
Install hard drives: Separately purchased SATA-II hard drives  
must be individually installed into the drive trays. (See Section 2.9)  
Install drive trays: After the hard drives have been installed into the  
drive trays, the drive trays must be installed into the enclosure itself.  
(See Section 2.10)  
Step 6.  
Step 7.  
Cable connection: Use the power cords that came with the  
subsystem to connect the subsystem to the main power source. Use  
self-purchased SCSI cables (see Chapter 4 for more details) to  
connect host ports to servers.  
Power up: Once the components have been properly installed and  
all cables are properly connected, you can power up the subsystem  
and configure the RAID array. (See Section 4.4)  
2.4.1  
Installation Procedure Flowchart  
Figure 2-1 shows a flowchart of the installation procedure. As you complete each  
step, check off the “Done” box on the right. Please use this flowchart in conjunction  
with the instructions that follow.  
2-5  
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Figure 2-1: Installation Procedure Flowchart  
2.5 Unpacking the Subsystem  
Use the unpacking checklist in your package to check packing contents. Carefully  
check the items contained in each box before proceeding with installation.  
Each packed box is separated into the upper and lower levels.  
Upper level: The boxes on the upper level contain:  
Eight (8) or twelve (12) drive canisters  
Accessory items  
Lower level: The lower box should contain the enclosure chassis with all the pre-  
installed components. The pre-installed components should include:  
RAID controller module  
PSU modules  
LCD panel  
Cooling fan modules  
A backplane  
Accessory items are placed in a box on the upper level. They include two power  
cords, a null modem, screws, an audio jack cable, a VHDCI-to-VHDCI external  
SCSI round cable, a printed copy of Quick Installation Guide and an Unpacking  
Checklist and a product utility CD containing the Installation and Hardware  
Reference Manual (this document), Generic Operation (Firmware) Manual,  
RAIDWatch GUI software and RAIDWatch User’s Manual.  
2-6  
Unpacking the Subsystem  
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Chapter 2: Installation  
2.6 Installation Overview  
2.6.1 Pre-installed Components  
The following components have been pre-installed in the EonStor subsystems and  
therefore do not need to be installed.  
2 - PSU modules  
Cooling fan modules: 3 for A12U-G2421 (12 drive bays), or 2 for A08U-  
G2421 (8 drive bays)  
1 - RAID controller module  
1 - Memory DIMM module (mounted on the controller)  
1 - LCD keypad panel  
2 - foldable forearm handles  
1 - backplane  
2.6.2 Uninstalled Components  
You must install the following components:  
Hard drives (separately purchased disk drives)  
SCSI cables  
A separately purchased BBU (a BBU is shipped in a different package)  
2.7 Rackmounting  
The subsystem is easily installed into a standard 19-inch rack cabinet using the  
mounting holes on the sides of chassis.  
The enclosure chassis can be installed using self-purchased mounting rails, or  
Infortrend’s IFT-9272CEslide28 and IFT-9272CEslide36 rails.  
2.7.1 Considerations for Installation Site and Chassis  
Make sure you have an appropriate site location and cables prepared with  
adequate lengths to connect to main power and other devices.  
At least two people will be required to install the chassis. Disk drives should  
only be installed after the chassis is properly mounted. The chassis can weigh  
about 24Kgs without disk drives.  
The following tools are necessary for mounting the chassis:  
#4 Phillips-head screwdriver  
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Wrenches may be necessary, depending on the rack type  
Use the included M5 or M6 screws for securing the chassis through its front  
mounting ears.  
More details about the use of optional slide rails are given in the Installation  
Guide that came with the slide rail package.  
2.7.2 Mounting Holes Positions  
Integrators may design their own brackets or slide rails using the twenty-two  
(22) mounting holes on the sides of chassis.  
There are six (6) mounting holes with six (6) M4 nuts near the end of the chassis  
on each side. Shown below are the locations of these mounting holes. (See the  
arrow marks in Figure 2-1). See the next diagram for another group of mounting  
holes on a horizontal line.  
Figure 2-1: Enclosure Side Mounting Holes (1)  
Figure 2-2 shows holes that are designed for slide rail options. There are five (5)  
mounting holes for #6-32 screws on the sides of the enclosure for use with slide  
rails purchased separately from Infortrend or other vendors.  
You may purchase Infortrend’s slide rail options (P/N: IFT-9272CEslide28 &  
IFT-9272CEslide36). For information on installing the chassis using the slide  
rails, please refer to the Installation Guide that came with the kit.  
Figure 2-2: Enclosure Side Mounting Holes (2)  
Use M5 or M6 pan-head screws to secure the chassis to the front cabinet posts.  
The front ear holes are shown in Figure 2-3.  
Figure 2-3: Front Ear Holes  
2-8  
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Chapter 2: Installation  
2.8 BBU Installation  
2.8.1 BBU Module Installation Overview  
The BBU module is an optional item that can sustain cached data in the event of a  
power outage or in the unlikely event that both PSUs have failed. Purchasing and  
installing a BBU is highly recommended. The optional BBU provides additional data  
security and helps minimize the chance of data loss during power shutdowns.  
The BBU module is inserted into the subsystem in the module slot at the upper left  
corner of the controller module. The BBU module is secured to the subsystem with  
two (2) retention screws. When shipped, the BBU module slot in the subsystem rear  
panel is covered with a metal dummy plate that must first be removed.  
2.8.2 Installation Procedure  
To install a BBU into the subsystem, please follow these steps:  
Step 1.  
Using a screwdriver, loosen the two (2) retention screws located on  
both sides of the dummy plate. (See Figure 2-2)  
Figure 2-2: Loosening the Metal Sheet Retention Screws  
Step 2.  
Once the retention screws are loosened, wedge a screwdriver  
between the back of the dummy plate and the interior wall of the  
subsystem enclosure. Gently lever the dummy plate out of the  
enclosure. (See Figure 2-3)  
Figure 2-3: Removing the BBU Slot Dummy Plate  
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Step 3.  
Step 4.  
Install the BBU module. Align the BBU module with the BBU  
module slot and gently insert the BBU module until the back of the  
BBU module reaches the end of the slot.  
Secure the BBU module to the chassis. Fasten the two (2) retention  
screws on the BBU module rear panel to secure the BBU module to  
the chassis. (See Figure 2-4)  
Figure 2-4: Installing the BBU Module  
IMPORTANT!  
If a BBU is added when the subsystem has already been put to use, reset the subsystem  
for the configuration change to take effect. Although a BBU can be added online, the  
BBU module will only be functional after a subsystem reset.  
2-10  
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Chapter 2: Installation  
2.9 Hard Drive Installation  
WARNING!  
1. Handle hard drives with extreme care. Hard drives are very delicate.  
Dropping a drive onto a hard surface (even from a short distance) and hitting  
or touching the circuits on the drives with your tools may all cause damage  
to drives.  
2. Observe all ESD prevention methods when handling hard drives.  
3. Only use screws supplied with the drive canisters. Longer screws may  
damage the drive.  
2.9.1 Hard Drive Installation Pre-requisites  
CAUTION!  
The hard drives and drive trays should only be installed into the subsystem once  
the subsystem has been mounted into a rack cabinet. If the hard drives are  
installed first, the subsystem will be too heavy to place into position and the  
possible impact during installation may damage your drives.  
Hard drives for the subsystem must be purchased separately. When purchasing the  
hard drives, the following factors should be considered:  
Capacity (MB/GB): Use drives with the same capacity. RAID arrays use a  
“least-common-denominator” approach. The maximum capacity of each drive  
used in the array is the maximum capacity of the smallest drive. Use drives of  
the same capacity.  
Profile: The drive trays and bays of the system are designed for 3.5-inch wide  
x 1-inch high hard drives. It is highly recommended that you do not try to use  
drives of any other size.  
Drive type: The subsystem described in this manual can use either SATA-II or  
SATA-I hard drives.  
2.9.2 Drive Installation  
Step 1.  
Place the SATA hard drive into the drive tray (as shown in Figure  
2-4) making sure that the hard drive is oriented in such a way that  
the drive’s SATA connector is facing the back of the drive tray.  
2-11  
Hard Drive Installation  
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EonStor A12U/A08U-G2421 Installation and Hardware Reference Manual  
Figure 2-4: Installing a SATA Hard Drive  
Step 2.  
Adjust the drive’s location until the mounting holes in the drive  
canister are aligned with those on the hard drive. Secure the drive  
with four supplied 6/32 flathead screws. (See Figure 2-4)  
WARNING!  
Only use screws supplied with the drive canisters. Longer screws may damage the  
drive.  
2.10 Drive Tray Installation  
Once the hard drives have been installed in the drive trays, the drive trays can be  
installed into the subsystem.  
WARNING!  
All drive trays must be installed into the enclosure even if they do not contain a  
hard drive. If the trays are not installed into the enclosure, the ventilation required  
for cooling will be disturbed and the subsystem will overheat.  
Step 1. Make sure that the hard drive is secured to the drive tray. Make sure  
the key-lock is in the unlocked position. The key-lock is unlocked if  
the groove on its face is in a horizontal orientation. If the groove is in  
a vertical position, as shown in Figure 2-5, then the key-lock is  
locked and the front flap on the drive tray cannot be opened.  
2-12  
Drive Tray Installation  
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Chapter 2: Installation  
Figure 2-5: Front View of an Individual Drive Tray  
Step 2. Open the front flap on the drive tray. (See Figure 2-6). To open the  
flap, push the release button (shown in Figure 2-7) on the front bezel.  
The front flap will open in an upward direction.  
Figure 2-6: Opening Drive Tray Front Flap  
Step 3. Align the drive tray with the slot in which you wish to insert it. Make  
sure that it is resting on the rails inside the module slot. Once the  
drive tray is lined up with the slot, gently slide it in. This should be  
done smoothly and gently.  
Figure 2-7: Installing a Drive Tray  
Step 4. Close the front flap on the drive tray. Make sure the front flap is  
closed properly. Closing the front flap ensures that the drive tray is  
firmly connected to the corresponding connector on the backplane  
board. If the front flap is not closed properly, the connection  
between the HDD and the subsystem will not be secure. DO NOT  
slam the drive tray into place! The connector pins might be  
damaged. If the front flap is not closed properly, the connection  
between the hard drive and the subsystem will not be secure.  
2-13  
Drive Tray Installation  
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Step 5. Lock the flap into place by turning the key-lock until the groove on  
its face is pointing down (vertical orientation). (See Figure 2-8)  
Figure 2-8: Drive Tray Key-lock Rotation  
Step 6. Once all drive trays are installed, the RAID subsystem will poll the  
drive channels and recognize the drives and scan them in  
automatically.  
When powered up, you should check the LEDs on drive bezels to  
ensure all drives are receiving power and are functional. All drive  
LEDs should be solid green after the initialization stage.  
2-14  
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Chapter 3  
System Monitoring  
This chapter provides information on how to monitor the A12U and A08U RAID  
subsystems.  
3.1 Subsystem Monitoring Overview  
Both the EonStor A08U-G2421 and A12U-G2421 subsystems are equipped with a  
variety of self-monitoring features that help to keep subsystem managers informed of  
the subsystem operational status. These monitoring features provide vital feedback to  
help you maintain the operational integrity of the subsystem. Prompt response to  
warnings and subsystem component failure notifications will ensure safe operation of  
the subsystem and help ensure the longevity of the subsystems.  
Self-monitoring features include:  
Firmware (FW): The RAID controllers in the subsystems come with pre-  
installed FW. The FW can be accessed using either the LCD keypad panel  
or a PC running terminal software through the RS-232C (audio jack) serial  
port. Device status information can be obtained from the FW. The FW  
capabilities have been fully described in the “Generic Operation Manual”  
that came with your subsystems. Please refer to this manual for further  
information.  
RAIDWatch: RAIDWatch is a fully integrated Java based Graphical User  
Interface (GUI) that came with the subsystem and can be used to monitor  
and maintain the subsystem using web browsers. Connection to a  
RAIDWatch station is made using the existing Ethernet ports.  
The RAIDWatch Panel View can be customized to show a direct, graphical  
representation of the subsystem in the content panel of the RAIDWatch  
screen. Panel View allows you to quickly determine the operational status  
of critical components. Detailed information for the RAIDWatch manager  
is given in the RAIDWatch User’s Manual included in the Product Utility  
CD that came with your subsystem.  
Configuration Client: The powerful Configuration Client sub-module can  
be used to keep you informed of system events via a variety of  
communication methods like email, LAN broadcast, fax, pager, MSN  
messenger, ICQ, and SMS. The sub-module runs as an independent  
program from RAIDWatch main program. The Configuration Client helps  
prevent blind time and keeps you constantly informed as to the status of the  
storage management subsystem. Instructions on how to activate the  
3-1  
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Configuration Client functionality are given in the RAIDWatch User’s  
Manual.  
LEDs: Device-status-indicating LEDs are placed on all of the subsystems’  
active components. These LEDs inform you of the integrity of a given  
component or a given link. You should become familiar with the different  
LEDs on the subsystem and be aware of their functions. (See Section 3.2)  
Audible Alarm: An audible alarm is present on the subsystem controller  
board and will be triggered if any of a number of threatening events  
occurred. These events usually jeopardize the functional and operational  
integrity of the controller board and must be heeded at all times. Events  
such as a breaching of the temperature threshold will trigger the alarm and  
if an onsite subsystem manager is present, the manager should, using either  
the LCD panel or the PC hyper-terminal, determine the cause of the alarm  
and take the appropriate corrective measures. (See Section 3.3)  
Inter-Integrated Circuit (I2C): The I2C bus monitors the operational  
integrity of the cooling modules, sensors for RAID controller  
board/backplane temperature and voltage readings.  
Subsystem monitoring is a necessary part of subsystem management. If failure  
events or other disruptive events are detected and reported, the subsystem managers  
must take the appropriate action to rectify the problem. Failure to act in a properly  
specified manner to a system event (like overheating) can cause severe and  
permanent damage to the subsystem.  
3-2  
Subsystem Monitoring Overview  
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Chapter 3: Monitoring  
3.2 Status-indicating LEDs  
3.2.1 Brief Overview of the LEDs  
The following devices come with LEDs that inform subsystem managers about the  
operational status of the component on which they are mounted. The EonStor  
subsystems feature status-indicating LEDs distributed over the active components in  
the following ways:  
Component  
LED(s) per Unit  
Total LEDs  
Definition  
Drive Trays  
2
24 – A12U  
16 – A08U  
See Section 3.2.5  
Controller Module  
Ethernet Ports  
5
2
1
5
2
1
See Section 3.2.2  
See Section 3.2.3  
See Section 3.2.6  
BBU Module (if BBU  
is installed)  
PSU Module  
1
3
1
2
3
See Section 3.2.7  
See Section 3.2.4  
See Section 3.2.8  
LCD Keypad Panel  
Cooling Module  
3 – A12U  
2 – A08U  
Table 3-1: LED Distribution  
LED definitions are given in the following sections.  
3.2.2 Controller Module LEDs  
The rear-facing faceplate of the RAID controller module is shown in Figure 3-1 for  
model A12U-G2421. The rear-facing faceplates on the two models look identical.  
The LEDs are numbered from 1 to 5. There are two more LEDs on the Ethernet port.  
The definitions are shown in Table 3-2 below.  
Figure 3-1: A12U-G2421 Controller Faceplate  
3-3  
Status-indicating LEDs  
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LED  
Name  
Color  
Status  
ON: Indicates controller is active and  
1
Controller  
Ready  
Green  
operating normally.  
FLASHING: Indicates controller  
initialization is taking place.  
OFF: Controller is not ready for operation.  
2
Hst_Bsy  
Green  
FLASHING: Activities on the host ports.  
OFF: No activities on the host ports.  
(Host Ports  
Busy)  
3
4
Drv_Bsy  
Green  
FLASHING: Activities on the drive side.  
OFF: No activities on the drive side.  
(Drive Busy)  
ON: Indicates that data is currently being  
cached in memory or is being held up by  
the BBU during a system power loss.  
C_Dirty  
Amber  
(Cache Dirty)  
ON: Indicates the BBU has failed and  
5
BBU_Fail  
Amber  
cannot sustain cached data.  
OFF: Indicates the BBU can sustain cached  
data in memory.  
FLASHING: The BBU is charging.  
(NOTE: The BBU is considered as an  
optional module. If a BBU has not been  
installed, then this LED is always off).  
Table 3-2: Controller Module LED Definitions  
3.2.3 Ethernet Port LEDs  
Both A12U and A08U subsystems come with a RS-232C audio jack serial port that  
can be used to assign a permanent IP to the subsystems. After a permanent IP address  
has been assigned, an Ethernet cable can be used to connect the RJ-45 Ethernet port  
to a network hub or router. This enables you to manage your subsystem locally or  
remotely over TCP/IP. See Figure 3- 2 for the locations of the two LED indicators  
on Ethernet port. Refer to Table 3-3 for the LED definitions.  
Link Status  
Activity  
Figure 3- 2: Ethernet Port Indicators  
3-4  
Status-indicating LEDs  
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Chapter 3: Monitoring  
Name  
Color  
Status  
Link Status  
Green  
ON: Indicates a valid connection to network  
BLINKING: Indicates active transmissions  
LAN Activity  
Green  
Table 3-3: Ethernet Port LED Definitions  
3.2.4 LCD Keypad Panel  
The LCD panel located on the front aluminum foldable handle comes with three  
status LEDs. The LEDs are marked from top to bottom “PWR,” “BUSY” and  
ATTEN” and are clearly seen in Figure 3-3 below. The definitions of these LEDs  
are shown in Table 3- 4. The mute button can be used to stop the alarm until the next  
controller event occurs.  
Figure 3-3: LCD Keypad Panel  
Name  
Color  
Status  
ON indicates that power is being supplied to the  
subsystem.  
POWER  
Blue  
OFF indicates that no power is being supplied to the  
subsystem.  
Flashing indicates that there is activity on the  
host/drive channels.  
BUSY  
White  
OFF indicates that there is no activity on the  
host/drive channels.  
ON indicates that one or more component  
failure/critical events have occurred.  
ATTENTION Red  
OFF indicates that the subsystem and all its  
components are operating normally.  
Table 3- 4: LCD Panel LED Definitions  
NOTE:  
The LCD panel ATTEN LED will, during the power up process, be turned on. If the  
subsystem boots up correctly, then the ATTEN LED will be turned off after the boot up  
procedure is complete.  
3-5  
Status-indicating LEDs  
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3.2.5 Drive Tray LEDs  
Two LED indicators are located on the right side of each drive tray. (See Figure 3- 4)  
Refer to Table 3- 5 for LED definitions. When notified by a drive failure message,  
you should check the drive tray indicators to find the correct location of the failed  
drive. Replacing the wrong drive can cause fatal failure of a logical array.  
Figure 3- 4: Drive Tray LEDs  
LED Name Color  
Status  
ON indicates read/write activity on the drive.  
Drive Busy  
Blue  
OFF indicates there is no read/write activity on the drive.  
GREEN indicates that power is being supplied to the  
Power  
Status  
Red/  
drive.  
Green  
OFF indicates no power is being supplied to the drive or  
the drive tray is not properly installed. .  
RED indicates drive failure or faults have occurred.  
Table 3- 5: Drive Tray LED Definitions  
3-6  
Status-indicating LEDs  
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Chapter 3: Monitoring  
3.2.6 BBU Module LED  
The BBU module has an LED on its faceplate. (See Figure 3-5) The function is the  
same as the fifth LED on the controller module. The LED is off when the BBU is  
functioning normally and is able to sustain the cache memory. The LED flashes to  
indicate the BBU is currently charging its battery cells. If the LED is illuminating  
amber, the unit may have failed. Please contact your system vendor to verify the  
problem.  
Figure 3-5: BBU Module LED  
3.2.7 PSU LED  
Figure 3- 6: PSU LED  
Each PSU comes with a single LED located just above the power switch and just  
below the retention screw (see Figure 3- 6). The LED is used to indicate the  
operational status of the PSU module. Please refer to the PSU LED definitions shown  
in Table 3- 6.  
Color  
Status  
Flashing  
Green  
The power supply has not been turned on. The PSU module LED  
will blink when the subsystem is connected to a power source but  
has not been turned on.  
Static Green  
Static Red  
The PSU is operating normally and experiencing no problems  
The PSU has failed and is unable to continue providing power to  
the subsystem.  
OFF  
The power cord is unplugged or the power cord is plugged but no  
power is being supplied from the power source.  
Table 3- 6: PSU Module LED Definitions  
3.2.8 Cooling Fan Module LED  
The cooling fan module comes with a single status-indicating red LED shown in  
Figure 3-7. LED definitions are given in Table 3-7.  
3-7  
Status-indicating LEDs  
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Figure 3-7: Cooling Fan Module LED  
RED  
OFF  
ON  
Status  
The cooling fan module is operating normally.  
The cooling fan module has failed and must be replaced.  
Table 3-7: Cooling Fan Module LED Definitions  
The subsystem has a novel approach to stabilizing the temperature within the  
subsystem: When the sensors within the enclosure detect critical working conditions,  
such as high ambient temperature or the failure of any cooling or PSU module, the  
system will turn the cooling fans to high speed to extract more heat. Once the  
ambient temperature cools down to normal or the faulty module has been replaced,  
the cooling fans return to normal speed.  
3.3 Audible Alarm  
Different subsystem environmental and operational parameters (i.e., temperature,  
etc.) have been assigned a range of values between which they can fluctuate. If either  
the upper or lower thresholds are exceeded, an audible alarm will automatically be  
triggered. The alarm will also be triggered when an active component of the  
subsystem fails. If the subsystem manager is onsite and hears the alarm, the manager  
will have to read the error message on the LCD screen or the PC terminal in order to  
determine what has triggered the alarm. After determining what has occurred, the  
subsystem manager must take appropriate actions to rectify the problem.  
WARNING!  
When an alarm is triggered, it is necessary for you to determine the problem. If the  
audible alarm is ignored and the problem is not rectified, unexpected damages may  
occur.  
3-8  
Audible Alarm  
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Chapter 3: Monitoring  
3.3.1 Default Threshold Values  
NOTE:  
The threshold values listed below are used to trigger a warning event and sound  
the alarm. A different value set is reserved for triggering the cooling fans to  
operate at a high rotation speed. The fan speed value set is not user-configurable.  
Table 3-8 shows the default threshold values for the subsystem. If any of these values  
are surpassed the alarm will sound:  
Upper Threshold  
+3.6V  
Lower Threshold  
+3.3V  
+2.9V  
+4.5V  
+10.8V  
5ºC  
+5V  
+5.5V  
+12V  
+13.2V  
90ºC  
CPU Temperature  
Board Temperature  
80ºC  
5ºC  
Enclosure  
Ambient 40ºC  
0ºC  
Temperature  
Table 3-8: Default Threshold Values  
The controller self-monitoring thresholds in Table 3-8 are the default threshold  
values. To change these pre-set values, please refer to the Generic Operation  
Manual that came with your system. The values set for the subsystem’s ambient  
temperature are pre-configured before shipping and cannot be changed.  
3.3.2 Failed Devices  
The audible alarm will be triggered if any of the following devices fail:  
Cooling fan modules  
PSU modules  
BBU modules  
Hard drives  
Components on the RAID controller  
NOTE:  
If the temperature exceeds a preset threshold, the BBU charger circuits will stop  
charging. You will then receive a message that says “Thermal Shutdown/Enter  
Sleep Mode.” When the temperature falls back within normal range, the battery  
will resume charging.  
3-9  
Audible Alarm  
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2
3.4 I C Monitoring  
Module presence detection and the general working status of cooling fan and other  
modules are monitored through an I2C serial bus. If any of these modules fails, the  
failure will be detected and you will be notified via the various methods described  
above.  
3-10  
I2C Monitoring  
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Chapter 4: Connection and Operation  
Chapter 4  
System Connection and Operation  
This chapter introduces sample topologies, configuration options and server  
connections for the EonStor subsystems and discusses both the power on and power  
off procedures.  
4.1 SCSI Connection Overview  
The EonStor A12U and A08U subsystems support 2 SCSI host channels and 2 dual-  
stack connectors featuring support for SCSI-320 protocol (also known as Ultra-320),  
the latest iteration of the SCSI drive interface standard. The SCSI-320 enables  
maximum data transfer rates up to 320MB/second per channel from host computers  
to the subsystems or expansion systems. This is twice the bandwidth as the Ultra160  
standard, allowing you optimal performance and flexibility with configuring storage  
applications.  
4.1.1 SCSI Cables  
One SCSI cable (IFT-9270UJBODCab) is provided with each subsystem for host  
connection. If you wish to connect the second host channel, a second cable must be  
separately purchased. Purchase only high quality SCSI-320 cables from a reputable  
manufacturer. To ensure optimum performance, it is necessary to use proper, high  
quality SCSI-320 compatible cables. Failure to do so will result in downgraded  
performance.  
4.1.2 SCSI Port on the Controller Rear Panel  
The SATA-based subsystems are equipped with two dual-stack VHDCI connectors  
on the back of the enclosure. (See Figure 4- 1) Each 68-pin VHDCI connector is  
specified as “Channel # In” or “Channel # Out” port.  
4-1  
SCSI Connection Overview  
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Figure 4- 1: SCSI Connectors on the Controller Rear Panel  
4.1.3 SCSI Termination  
Correct SCSI termination procedures require that the last device on the SCSI bus be  
terminated. If the last device is not terminated or if devices other than the last are  
terminated, erratic SCSI bus behavior may occur.  
An auto-detection, on-board terminator is built into the A08/12U-G2421. You do not  
need to install an external terminator when a subsystem acts as the last device in the  
daisy chain configuration. The on-board terminator default is enabled. If the  
subsystem is not the last device in the daisy chain configuration, the terminator will  
be automatically disabled. Although it is not recommended, if you prefer to disable  
the firmware setting for the on-board terminator using the LCD keypad panel on the  
subsystem, RS232C terminal session, or RAIDWatch management software, the  
auto-detection function is also disable.  
Typically, the host computer or host adapter (SCSI card inside the PC) is the first  
device and some are already terminated. When installing the A08/12U-G2421 on a  
SCSI bus with other devices, be sure to observe the above rules regarding all devices  
on the SCSI bus. Consult your host computer and/or host adapter manual for  
additional information on correct termination procedures.  
NOTE:  
Leave the firmware default setting for the SCSI terminator so the auto-detection  
function can be operated is recommended.  
SCSI Connection Overview  
4-2  
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Chapter 4: Connection and Operation  
4.2 Host Connection Topology  
4.2.1 Single Host  
Figure 4-2: Single SCSI Controller Connected to a Single Host Computer  
In the example shown in Figure 4-2, the SCSI ports are connected to two adapters on  
a host computer to provide path redundancy. If one of the host channels becomes  
disconnected, or if the cable connecting one of the host ports to the host computer is  
damaged, data flow will be routed through the second path from the subsystem to the  
host computer.  
NOTE:  
To create dual redundant data paths on the host side, you will need to install a  
third-party fail-over software on the host computer.  
4-3  
Host Connection Topology  
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4.2.2 Dual Hosts  
Figure 4- 3: Cascaded Subsystems Connected to Two Host Computers  
In the example shown in Figure 4- 3, the SCSI ports are connected to different host  
computers. This provides both path and host computer redundancy. If one of the host  
channels becomes disconnected, or if the cable connecting one of the host ports to the  
host computer is damaged, the second path can transmit data from the subsystem to  
one of the host computers. Similarly, in the clustered hosts configuration, the same  
array can be accessed through different data paths and downtime will be minimized.  
To obtain more disk capacity, the “Out” ports are used to cascade another subsystem.  
4.3 Power On  
After installing all the components in the subsystem, connecting the host channels to  
the host, and connecting the expansion cables to the expansion enclosures, the  
subsystem is ready to be powered on.  
4.3.1 Power On Checklist  
BEFORE powering on the subsystem, please check the following:  
Memory module: Memory module has been correctly installed on the  
controller board.  
BBU modules: (Option) If used, ensure that the BBU modules have been  
installed correctly.  
Power On  
4-4  
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Chapter 4: Connection and Operation  
Hard drives: Hard drives have been correctly installed on the drive trays.  
Drive trays: ALL the drive trays, whether or not they have a hard drive,  
have been installed into the subsystem.  
Cable connections: The host ports on the subsystem have been correctly  
connected to host computer(s).  
Power cables: The power cords have been connected to the PSU modules on  
the subsystem and plugged into main power.  
Ambient temperature: All the subsystem components have been acclimated  
to the surrounding temperature.  
4.3.2 Power On Sequence  
When powering on the ES subsystem, please follow the steps below:  
1. Power on any expansion enclosures if applied  
If you connect any expansion enclosures to the subsystem, power on those  
expansion enclosures before powering on the subsystem.  
2. Power on the subsystem  
The subsystem should be powered on before the host computers. The power on  
procedure for the subsystem is described in Section 4.3.3.  
3. Host computers  
Host computers should be the last devices that are turned on. Please refer to the  
documentation that came with your host computers to see its own power on  
procedure.  
4.3.3 Power On Procedure  
1. Plug in all power cords to the power connectors located at the rear of the  
subsystem. Use the power cables that came with the subsystem to connect the  
subsystem to the power outlet, separate power sources, or UPS devices.  
2. Turn on the power supply switches for both power supply units.  
3. The subsystem is now turned on and the self-test will start automatically.  
4. The “Power” LED on the front LCD panel will turn blue. (See Figure 4- 4)  
4-5  
Power On  
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Figure 4- 4: Subsystem Power Switches  
CAUTION!  
Although the PSUs are redundant and a single PSU can provide sufficient power  
to the system, it is advisable to turn both the power switches on. If only one PSU is  
operating and fails, the whole system will crash.  
4.3.4 Power On Status Check  
Once the ES subsystem has been powered on, the status of the entire subsystem  
should be checked to ensure that everything is running smoothly and that there are no  
complications or malfunctions.  
1. Controller module LEDs: The controller module LEDs should all flash green.  
2. Drive tray LEDs: The LEDs of all the drive trays (that contain hard drives)  
should be constantly lit green to indicate that the drives have successfully spun  
up and are ready for I/Os.  
3. LCD panel LEDs: The blue LED on the LCD panel should come on indicating  
that power is being supplied to the system.  
4. Firmware and RAIDWatch: The overall status of the system may be checked  
using the terminal interface or the RAIDWatch GUI.  
5. Audible alarm: If any errors occur during the initialization process, the onboard  
alarm will sound in a hastily repeated manner.  
Drive tray LEDs should normally start flashing during the initialization stage,  
indicating the RAID controller unit is attempting to access the hard drives.  
NOTE:  
The subsystem has been designed to run continuously. If a hot-replaceable  
component fails, the fault can be corrected online.  
Power On  
4-6  
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Chapter 4: Connection and Operation  
4.3.5 LCD Screen  
When powering on the subsystem, the following messages should appear on the front  
panel LCD screen. Wait for the front panel LCD to show “READY” or “No Host  
LUN” before the host boots up. Refer to Figure 4- 5 on how to read the screens.  
Model Name  
A12U-G2421  
Ready  
Status/Data Transfer Indicator  
Figure 4- 5: The LCD Initial Screen  
The LCD screen startup sequence is shown and described in the sequence below:  
Initializing….  
Please Wait...  
This screen appears when the PSUs are turned on.  
Proceeding with controller self-test.  
Power on Self  
Test, Please Wait...  
Power on Self  
Test Completed  
Self-test completed.  
A12U–G2421  
128MB RAM, Wait…  
Verifying installed cache memory.  
A12U–G2421  
No Host LUN  
System is ready. You can now start to configure  
the subsystem.  
4-7  
Power On  
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EonStor A12U/A08U-G2421 Installation and Hardware Reference Manual  
4.4 Power Off Procedure  
If you wish to power down the subsystem, please follow these steps:  
NOTE:  
If you wish to power down the subsystem, please ensure that no time-consuming  
processes, like “Regenerate Logical Drive Parity” or a “Media Scan,” are taking  
place.  
1. Stop I/O access to the system  
Stop all I/O accesses from the host computers to the subsystem. Please refer to  
the related documentation of your host applications and operating system.  
2. Disconnect the host  
The host must be disconnected from the subsystem. To do this, disconnect the  
cables from both the host and the subsystem.  
3. Flush the cache  
Use the “Shutdown Controller” function to flush all cached data. This prepares  
the RAID subsystem to be powered down.  
4. Turn off the power  
Turn off the power switches at the power supply modules. Once the RAID  
subsystem has been powered down, other devices that are connected to the  
subsystem can be powered down.  
Power Off Procedure  
4-8  
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Chapter 4: Connection and Operation  
CHAPTER 4 SYSTEM CONNECTION AND OPERATION ......................................................1  
4.1  
SCSI CONNECTION OVERVIEW .................................................................................................1  
4.1.1 SCSI Cables.............................................................................................................................1  
4.1.2 SCSI Port on the controller rear panel....................................................................................1  
4.1.3 Points of Failure...................................................................... Error! Bookmark not defined.  
4.1.4 SCSI Termination ....................................................................................................................2  
4.2  
HOST CONNECTION TOPOLOGY.................................................................................................3  
4.2.1 Single Host...............................................................................................................................3  
4.2.2 Dual Hosts...............................................................................................................................4  
4.3  
POWER  
O
N
................................................................................................................................4  
4.3.1 Power On Checklist.................................................................................................................4  
4.3.2 Power On Sequence.................................................................................................................5  
4.3.3 Power On Procedure...............................................................................................................5  
4.3.4 Power On Status Check ...........................................................................................................6  
4.3.5 LCD Screen .............................................................................................................................7  
4.4  
POWER OFF PROCEDURE ...........................................................................................................8  
Figure 4- 1: SCSI Connectors on the Controller rear panel......................................................................2  
Figure 4- 2: Single SCSI Controller connected to a single Host Computer..............................................3  
Figure 4- 3: Single SCSI controller connected to two Host Computers ...................................................4  
Figure 4- 4: ES Subsystem Power Switches.............................................................................................6  
Figure 4- 5: The LCD Start-Up Screen.....................................................................................................7  
4-9  
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EonStor A12U/A08U-G2421 Installation and Hardware Reference Manual  
4.3.5 LCD Screen  
When powering on the subsystem, the following messages should appear on the front  
panel LCD screen. Wait for the front panel LCD to show “READY” or “No Host  
LUN” before the host boots up. Refer to Figure 4- 11 on how to read the screens.  
Model Name  
A12U-G2421  
Ready  
Status/Data Transfer Indicator  
Figure 4- 11: The LCD Initial Screen  
The LCD screen startup sequence is shown and described in the sequence below:  
Initializing….  
Please Wait...  
This screen appears when the PSUs are turned on.  
Proceeding with controller self-test.  
Power on Self  
Test, Please Wait...  
Power on Self  
Test Completed  
Self-test completed.  
A12U–G2421  
128MB RAM, Wait…  
Verifying installed cache memory.  
A12U–G2421  
No Host LUN  
System is ready. You can now start to configure  
the subsystem.  
Power On  
4-10  
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Chapter 4: Connection and Operation  
4.4 Power Off Procedure  
If you wish to power down the subsystem, please follow these steps:  
NOTE:  
If you wish to power down the subsystem, please ensure that no time-consuming  
processes, like “Regenerate Logical Drive Parity” or a “Media Scan,” are taking  
place.  
1. Stop I/O access to the system  
Stop all I/O accesses from the host computers to the subsystem. Please refer to  
the related documentation of your host applications and operating system.  
2. Disconnect the host  
The host must be disconnected from the subsystem. To do this, disconnect the  
cables from both the host and the subsystem.  
3. Flush the cache  
Use the “Shutdown Controller” function to flush all cached data. This prepares  
the RAID subsystem to be powered down.  
4. Turn off the power  
Turn off the power switches at the power supply modules. Once the RAID  
subsystem has been powered down, other devices that are connected to the  
subsystem can be powered down.  
4-11  
Power Off Procedure  
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Chapter 5  
System Maintenance  
5.1 Overview  
5.1.1 About Subsystem Maintenance  
Constant monitoring and maintenance of your SATA-based subsystems will  
minimize the chance of system downtime and preserve the working integrity of the  
system for a longer period of time. If any of the subsystem plug-in modules fails,  
they must be replaced as soon as possible.  
WARNING!  
Do not remove a failed component from the subsystem until you have a  
replacement on hand. If you remove a failed component without replacing it, the  
internal airflow will be disrupted and the system will overheat causing damage to  
the subsystem.  
All of the following components can be replaced in case of failure:  
1. Controller module – Section 5.2  
2. Memory module – Section 5.3  
3. BBU module – Section 5.4  
4. PSU modules – Section 5.5  
5. Cooling fan modules – Section 5.6  
6. Hard drives – Section 5.7.2  
5.1.2 General Notes on Component Replacement  
With the exception of the RAID controller module, all the components on the  
subsystems, including the PSU modules, cooling fan modules, BBU, and drive  
trays are hot-swappable and can be changed while the subsystem is still in  
operation.  
5-1  
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Qualified engineers who are familiar with the subsystem should be the only ones  
who make component replacements. If you are not familiar with the subsystems  
and not familiar with RAID subsystem maintenance in general, it is strongly  
advised that you refer subsystem maintenance to a suitably qualified  
maintenance engineer.  
Normalized airflow is directly dependent upon the presence of all subsystem  
components. Even if a subsystem component fails, it should not be removed  
from the subsystem until a replacement is readily at hand and can be quickly  
installed. Removing a subsystem component without a replacement can lead to  
permanent subsystem damage.  
When replacing any hot-swappable component, caution should be taken to  
ensure that the components are handled in an appropriate manner. Rough or  
improper handling of components can lead to irreparable damage.  
When removing a controller module from the subsystem, ensure that the power  
has been turned off and that all precautionary measures, without exception, are  
adhered to. The controller board contains very sensitive components and can be  
easily damaged.  
WARNING!  
When inserting a removable module, take heed that DO NOT USE  
EXCESSIVE FORCE! Forcing or slamming a module can damage the pins  
on the module connectors either on the module itself or on the backplane. Gently  
push the module until it reaches the end of module slot. Feel the contact  
resistance and use slightly more force to ensure the module connectors are  
correctly mated. If the module comes with extraction levers or retention screws,  
use them to secure the module.  
5.2 Replacing Controller Module Components  
5.2.1 Overview  
The controller module should never be removed unless the following replaceable  
components need to be accessed:  
Cache memory DIMM module: If a larger capacity DIMM module is required.  
Controller module itself:  
If the controller module in a single-controller  
model fails, it is necessary to power down the  
subsystem and replace the controller.  
If a DIMM module or RAID controller fails, contact your vendor immediately for a  
replacement. To replace any of these components, the controller module must first be  
removed from the subsystem.  
5-2  
Replacing Controller Module Components  
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Chapter 5: System Maintenance  
5.2.2 Notes on Controller Module Maintenance  
The controller module contains a DIMM module. It is not recommended to re-  
use the DIMM module extracted from a failed controller unless you have a  
similar RAID subsystem that can be used to test the module. You can contact  
your vendor for sending the failed controller in for repair.  
When replacing the controller module, it must be remembered that the controller  
board is one of the most sensitive components in the subsystem. All previously  
stipulated safety precautions (see Chapter 2) must be strictly adhered to. Failure  
to adhere to these precautions can result in permanent damage to the controller  
board, resulting in lengthy delays.  
Prior to replacing the controller module, it is imperative for your own safety to  
be sure no power is being supplied to the system.  
5.2.3 Removing the Controller Module  
To remove the controller module:  
Step 1. Stop host I/Os or host applications to avoid losing data or causing  
data inconsistency.  
Step 2. Turn the subsystem power off: If possible power off the subsystem in  
the way described in Chapter 4. If it is not possible to do this turn off  
both PSU modules and disconnect the power cords.  
Step 3. Disconnect all cables: There may be a number of different cables  
attached to the controller module. These cables could include SCSI  
cables for host connections, an RS-232C (audio jack) cable for serial  
port connection, and an Ethernet cable for network connection. Prior  
to removing the controller module, all these cables should be  
removed.  
Step 4. Loosen the retention hand screws: Hard screws are located on both  
sides of the RAID controller’s faceplate. Press these screws and use a  
Phillips screwdriver to loosen them so that the controller can be  
removed from chassis. (See Figure 5- 1)  
Replacing Controller Module Components  
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Figure 5- 1: Loosen Controller Module Retention Screws  
Step 5. Pull the controller module out: Once the retention screws have been  
removed; gently pull the controller module out of the subsystem  
chassis.  
5.2.4 Replacing the Controller Module  
Step 1. Remove the failed controller module. (See Section 5.2.3 above)  
Step 2. Install a DIMM module on the new controller module. (See Section  
5.5)  
Step 3. Insert the replacement controller. Align the controller module with  
the module bay at the rear of the subsystem. Gently slide the  
controller module in.  
Step 5. Fasten the hand screws. Once the controller module has been  
completely inserted into the subsystem chassis, secure the controller  
module to the chassis by tightening the hand screws at the sides of the  
controller rear panel.  
Step 6. Connect the controller module cables: Reconnect all of the cables  
that were previously disconnected from the controller module. These  
may include SCSI cables for host and expansion connections, an RS-  
232C (audio jack) cable for serial port connection, and an Ethernet  
cable for network connection.  
Step 7. Power on: Once the new controller module has been properly  
installed and the cables have been correctly connected, turn the  
subsystem power on.  
5-4  
Replacing Controller Module Components  
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Chapter 5: System Maintenance  
5.3 Replacing or Upgrading Memory Modules  
5.3.1 Memory Module Installation Overview  
The subsystems come with a pre-installed 256MB (or above) DDR RAM  
DIMM module on the controller. The controller supports one memory module  
for the capacity up to 1GB. If a DDR RAM DIMM modules with a different  
size is preferred or the original memory module has failed in some way, the pre-  
installed module must be removed and replaced by a new one. Replacement and  
installation instructions are described fully below.  
The DIMM module is located on the controller board. The controller board is a  
sensitive component and must be treated with care to avoid being damaged.  
WARNING!  
The controller board in the module contains sensitive components. Please ensure  
that all anti-static precautions stipulated above are strictly adhered to. Only  
qualified engineers can replace a DIMM module.  
5.3.2 Selecting a Memory Module  
If the memory module mounted on the controller is going to be replaced, the  
following factors should be considered when purchasing replacement modules.  
Pre-installed DIMM module: The subsystem comes with a 256MB DDR RAM  
module pre-installed on the controller board. If you wish to change the size of  
the DIMM, then a new, separately purchased DIMM can be installed.  
DDR RAM DIMM modules supported. The subsystems support DDR RAM  
DIMM modules with the capacities ranging from 256MB to 1GB.  
Installation consideration: When installing the DIMM module, it is necessary  
to handle the controller module. The controller board is more susceptible to  
damage than the other components and must therefore be handled with extreme  
care. All anti-static precautions specified in Section 2.3 must be strictly adhered  
to.  
Secure installation: When replacing the DIMM module, make sure that the new  
DIMM module is firmly in place prior to installing the controller module. If the  
DIMM module is not firmly in place, the subsystem will not run and the  
controller will need to be removed and the DIMM module correctly installed.  
Purchasing consideration: When purchasing a DDR RAM DIMM to install on  
the controller board, contact your vendor for an updated list of certified  
modules.  
Replacing or Upgrading Memory Modules  
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5.3.3 DIMM Module Installation  
WARNING!  
The pre-installed modules must be removed prior to installing new memory  
modules. Do this with care. Sensitive components can be damaged during the  
process.  
If a DIMM module fails or a DIMM module with a higher memory capacity is  
required, the DIMM module must be replaced.  
Step 1. Remove the controller module. See Section 5.2.3.  
Step 2. Remove the previously installed DIMM module from the DIMM  
socket. To do this, push the white module clips on the sides of the  
DIMM module down together. By doing this, the previously  
installed modules will be ejected from the DIMM socket. (See  
Figure 5-2)  
Figure  
5
-2: Push Back the Module Clips on the Sides of the DIMM  
Socket  
Step 3. Gently retrieve the DIMM module out of the DIMM socket. (See  
Figure 5-2)  
Step 4. Insert the DIMM module into the DIMM socket. Align the DIMM  
module with the DIMM socket. Once aligned, gently push the  
DIMM module into the socket. The white clips on the sides of the  
socket will close automatically and secure the DIMM module into  
the socket.  
5-6  
Replacing or Upgrading Memory Modules  
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Chapter 5: System Maintenance  
Figure -3: Insert the DIMM Module  
5
Step 5. Reinstall the controller module. After the DIMM module has been  
properly installed, the controller module must be reinstalled. To do  
this, align the controller module with the controller module bay. Then  
gently push the controller module in the controller bay. Carefully  
push the controller until you feel the contact when the board edge  
connectors are mated to the backplane. Do not use force. If unusual  
contact resistance is felt, try it again. Next secure the controller  
module into the subsystem by fastening the hand screws on the sides.  
NOTE:  
When replacing a DIMM, the whole subsystem needs to be powered down.  
Therefore, when replacing a DIMM, you should carefully select the time when the  
replacement will be made in order to minimize the overall disruption to service.  
Replacing or Upgrading Memory Modules  
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5.4 Replacing a Faulty BBU  
IMPORTANT!  
The BBU is hot-swappable, can be replaced while the subsystem is running.  
However, a new module will only be recognized after a subsystem reset.  
Carefully select the time when the reset will be made in order to minimize the  
overall disruption to service.  
To replace a faulty BBU, please follow these steps:  
Step 1. Remove the faulty BBU module from the chassis. The BBU  
module is secured to the chassis with two (2) spring screws. These  
screws must be loosened. To loosen, turn the screws  
counterclockwise. (See Figure 5-4)  
Figure -4: Remove the BBU Retention Screws  
5
Step 2. Install the new BBU module. After the faulty BBU module has  
been removed, the new BBU module can be installed. To do this,  
align the BBU module with the empty slot, and then gently push the  
BBU module into the slot. (See Figure 5-5)  
Figure -5: Install the BBU Module  
5
Step 3. Secure the BBU module to the enclosure. Tighten the two (2)  
spring screws as shown above on the back of the BBU module.  
5-8  
Replacing a Faulty BBU  
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Chapter 5: System Maintenance  
Step 4. Once the new BBU module is correctly installed into the subsystem,  
the LED should start flashing, indicates the BBU is being charged.  
When the BBU is fully charged, the LED will go off.  
5.5 Replacing a Failed PSU Module  
5.5.1 Notes on PSU Module Maintenance  
Two redundant PSU modules: The subsystem comes with two 350W, fully  
redundant, hot-swappable PSU modules. These modules are accessed from the  
rear of the subsystem.  
Immediate replacement: When a PSU fails, it should ideally be replaced  
immediately. Do not remove the PSU module unless a replacement is readily  
available. Removing a PSU without a replacement will cause severe disruptions  
to the internal airflow and the subsystem will overheat, possibly causing  
irreparable damage to some of the subsystem components.  
PSU bracket: Each PSU module is permanently mounted in a two-level steel  
bracket, creating a single unit. The PSU is located in the upper level and a  
removable cooling fan module is mounted in the lower level.  
WARNING!  
Although the subsystems can operate using single PSU module, it is not advisable  
to run the EonStor subsystems with a single PSU module for an extended period  
of time.  
5.5.2 Replacing the PSU Module  
To replace a PSU, please follow these steps:  
Step 1.  
Step 2.  
Turn off the PSU and remove the power cord: Turn of the power  
switches located on the right side of each power supply module. See  
the diagram below.  
Once the power switches have been turned off, remove the power  
cables that connect the subsystem to the main power. The power  
connector is found on the left side of each power supply module.  
Replacing a Failed PSU Module  
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EonStor A08U/A12U-G2421 Installation and Hardware Reference Manual  
Step 3.  
Remove the retention screw: After the power cable has been  
removed from the power connector, remove the retention screw at  
the upper right side of the PSU rear-end panel. (See Figure 5- 7)  
The screw is located below the extraction lever, beside the LED  
indicator, and can be hidden from sight.  
Figure -6: PSU Parts Identification  
5
Figure 5- 7: Removing the PSU Retention Screw  
Step 4.  
Pull the extraction handle downward: Push the extraction lever at  
the back of the PSU module downwards. This will dislodge the PSU  
module from the subsystem. Once dislodged, gently pull the PSU  
module out of the subsystem. (See Figure 5- 8).  
WARNING!  
When a PSU is pulled out of the chassis, the fan module beneath the PSU is  
removed from the chassis at the same time.  
Do not remove the PSU module unless a replacement is readily available.  
Removing a PSU without a replacement will cause severe disruptions to the  
internal airflow and the subsystem will overheat, possibly causing irreparable  
damage to some of the subsystem components.  
It is recommended that the replacement procedure is completed in less than  
five (5) minutes to prevent the subsystem from overheating.  
5-10  
Replacing a Failed PSU Module  
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Chapter 5: System Maintenance  
Figure 5- 8: Dislodging the PSU  
Step 5.  
Remove the cooling module: To do this, push the clips on either  
side of the module rear panel together. Then gently pull the cooling  
module out of the lower level of the PSU bracket. (See Figure 5-  
11)  
Figure 5-9: Remove the Cooling Module  
Step 6.  
Step 7.  
Reinstall the cooling module into the new PSU module: To do  
this, align the cooling module with the lower level of the PSU  
bracket and gently slide the cooling module in.  
Insert the new PSU module into the subsystem: Once the  
previously removed cooling module has been installed, insert the  
new PSU module into the subsystem. Make sure the extraction lever  
is in its downright position so that the saddle notches on the lower  
edges of the handle can lock on to the edge metal brackets along the  
chassis inner walls. Push the PSU into the slot and pull the handle  
upwards to secure the module.  
Step 8.  
Reinsert the retention screw: If the PSU module is properly  
installed, the back end of the module should be aligned with the  
Replacing a Failed PSU Module  
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EonStor A08U/A12U-G2421 Installation and Hardware Reference Manual  
enclosure’s rear panel. To firmly secure the PSUs into place,  
reinsert the retention screw.  
Step 9.  
Reconnect the power cord and turn the power on: Plug the power  
cord into the socket on the PSU module and turn the PSU module  
power switch on.  
5.6 Replacing a Failed Cooling Fan Module  
5.6.1 Notes on Cooling Fan Module Maintenance  
Redundant cooling fan modules: The subsystems are equipped with two (2,  
EonStor A08U-G2421) or three (3, EonStor A12U-G2421) redundant, hot-  
swappable, single-blower cooling fan modules located in the lower PSU module  
slot. These cooling fan modules control the internal operational temperature of  
the subsystem and therefore their working integrity should be maintained at all  
times.  
Detecting a failed cooling fan module: If a cooling fan module fails, you can be  
notified of the failure by the LED located at the back of the module, an audible  
alarm, the terminal event prompts, the RAIDWatch Panel View, or through the  
various methods by the Configuration Client utility.  
Replacing a cooling fan module: Once you are notified that a cooling fan  
module has failed, it should be replaced as soon as possible. A failed cooling fan  
module should only be removed from the subsystem when you have an  
immediately available replacement module that can be installed as soon as the  
failed cooling fan module has been removed.  
WARNING!  
The latches at the back of the cooling fan module secure the cooling fan  
module into the enclosure. If these latches are broken, the warranty on the  
cooling fan module will be void.  
Although the cooling fan modules are fully redundant, it is not advisable to  
run the EonStor subsystems with any of the cooling fan modules missing.  
Whenever a cooling fan module fails, the system is at risk of sustaining  
irreparable damage.  
Keep a failed module in its enclosure bay until a replacement unit is in hand.  
5.6.2 Replacing a Cooling Fan Module  
The cooling fan modules are secured to the chassis with two black latches located on  
the rear of the module. To replace the cooling fan module, please follow these steps:  
5-12  
Replacing a Failed Cooling Fan Module  
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Chapter 5: System Maintenance  
Step 1.  
To remove the cooling fan module: Squeeze both side latches  
towards the center of the cooling fan module and gently withdraw  
the cooling fan module from the subsystem by gently pulling on the  
silver handle at the bottom. (See Figure 5- 10).  
Release the module  
using the latches  
Figure 5- 10: Removing the Cooling Fan Module  
WARNING!  
Forcing or slamming a module into place can damage the connector pins on the  
module itself or that on the subsystem backplane.  
Step 2.  
Install the new cooling fan module: Line the new module up with  
the slot into which it will be inserted and then gently push it into the  
chassis. The latches will hold the module in place.  
5.7 Drive Tray Maintenance  
5.7.1 Notes on Hard Drive Maintenance  
Hot-swappable drive trays: The drive trays are all hot-swappable. If a hard drive fails, it  
can be replaced while the subsystem is still running.  
Forearm handles: If the hard drive is behind either the left or right forearm handle, make  
sure that the locking mechanism on the side of the handle is first released prior to  
opening the handle itself. (See Figure 5- 11) The locking mechanism must also be  
released in order to close the handle. Therefore, after the new drive has been installed, it  
will be necessary to release the locking mechanism on the handle prior to closing it. For  
more information, please refer to Section 1.5 in Chapter 1.  
Drive Tray Maintenance  
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Figure 5- 11: Forearm Handle Locking Mechanism  
Front flap mechanism: Do not leave a drive tray’s front flap open. The front flap and its  
key-lock secure a drive tray to chassis slot. A disk drive operating with the half-open  
front bezel may result in signal glitches and Data Compare Errors might ensue.  
Remove drives slowly: Although the drive trays are designed to be hot-swappable, when  
removing a drive tray from the subsystem, withdraw it from the chassis slowly.  
Removing the drive tray too quickly may cause a drive I/O timeout.  
Replacement on hand: If a hard drive has failed, make sure you have a replacement hard  
drive readily available before removing the failed drive from the subsystem. Do not leave  
the drive tray slot open for an extended period of time. If the drive tray slot is left  
unoccupied for an extended period of time, the airflow will be disrupted and subsystem  
components will overheat and may be permanently damaged.  
5-14  
Drive Tray Maintenance  
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Chapter 5: System Maintenance  
5.7.2 Replacing a Failed Hard Drive  
To replace a hard drive, please follow these steps:  
WARNING!  
Hard drives are fragile. Please always handle hard drives with extreme care. Do  
not drop the hard drives; always be slow, gentle and careful when handling a hard  
drive. Only handle the hard drives by the edges, avoid touching any components  
or connector pins.  
Step 1.  
Identify the drive tray that contains the hard drive that needs to be  
replaced.  
WARNING!  
Replacing the wrong drive in an array can fatally fail a RAID configuration. You  
should identify a failed drive from the RAIDWatch GUI screen, by checking the  
drive slot ID in the terminal screen, by checking the LEDs on the drive tray panel,  
and/or use the identify/flash drive function in firmware. Please refer to Section 1.5  
in your Generic Operation Manual for details on this function.  
Step 2.  
Open the front flap: Once the drive tray has been identified, push  
the release button at the drive bezel. (See Figure 5-12) The front  
bezel will automatically be lifted and the drive tray should be easily  
dislodged from the chassis.  
Figure 5-12: Front View of an Individual Drive Tray  
Step 3.  
Remove the drive tray. To remove the drive tray from the  
enclosure, the key-lock must be unlocked. (See Figure 5-13) To do  
this, turn the key-lock on the front of the drive tray until the groove  
on its face is in a horizontal orientation.  
Drive Tray Maintenance  
5-15  
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EonStor A08U/A12U-G2421 Installation and Hardware Reference Manual  
Figure 5-13: Drive Tray Key-Lock Rotation  
Step 4.  
Remove the drive tray along with the hard drive in it. Once the  
drive tray is dislodged from the chassis, gently and carefully  
withdraw the drive tray from the chassis.  
Step 5.  
Step 6.  
Remove the hard drive from the drive tray: Loosen the four  
retention screws (two on each side) to remove the hard drive from  
the drive tray.  
Install the new hard drive: Please refer to the complete hard drive  
installation procedures in Section 2.9.  
Figure 5- 14: Drive Tray Retention Screws  
Step 7.  
If the failed drive is a member of a RAID 1, 3, or 5 array, once it is  
replaced the subsystem should immediately start to rebuild the  
array. The drive activity LEDs should start to flash.  
5-16  
Drive Tray Maintenance  
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Appendix A  
Subsystem Specifications  
A.1 Technical Specifications  
Environmental Specifications  
Humidity  
5 to 95% (non condensing – operating and non-operating)  
Operating: 0º to 40ºC  
Temperature  
Non-operating: -40º to 60ºC  
Sea level to 12,000ft – operating  
Sea level to 20,000ft – non-operating  
Altitude  
Power Requirements  
115VAC @ 6A  
Input Voltage  
240VAC @ 3A with PFC  
(auto-switching)  
Frequency  
47-63Hz  
350W  
Power  
Consumption  
Dimensions  
Height  
w/o front handles  
w/ front handles  
88mm  
88mm  
Width  
446mm  
490mm  
482mm  
505mm  
Length  
Package dimensions: 344H x 600W x 670D mm  
A-1  
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System Weight  
Net weight: 23.5kg  
Gross weight: 25.0kg (without disk drives)  
EMI/EMC  
FCC Class-B  
CE  
Safety Requirements  
UL  
CB  
Shock  
Half-sine  
Operating: 5G peak, 11ms duration  
Non-operating: 15G, 11ms, half-sine  
Vibration  
0.5oct/min  
0.5oct/min  
Operating  
Non-operating  
Warning Alarms  
LCD screen messages  
Audible alarms  
System LEDs  
Event notification via the RAIDWatch Manager (LAN broadcast, email, fax,  
MSN, ICQ, SMS, and SNMP traps) and RS-232C terminal display  
A-2  
Technical Specifications  
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Appendix A: Subsystem Features  
A.2 Controller Specifications  
A.2.1 Configuration  
Specification  
0, 1(0 + 1), 3, 5, 10, 30, 50, JBOD, and non-RAID disk  
spanning  
RAID Levels  
Host OS  
Compatibility  
Host OS independent; supports all major platforms  
2 SCSI-320 channels via 2 dual-stacked VHDCI  
connectors  
2 pre-configured SCSI-320 host channels  
Host Interface  
Host Channels  
Supports 8 (A08U) or 12 (A12U) channel connection to  
3Gbps SATA-II disk drives, SATA-I backward  
compatible  
Drive Interface  
All drive channels are pre-configured, routed through a  
back-end PCB and cannot be changed  
Write-through or Write-back  
Pre-installed 256MB (or above) DDR RAM DIMM  
with/without ECC, in one DIMM socket  
Up to 32 per host ID  
Drive Channels  
Caching Mode  
Cache Memory  
Number of LUN’s  
Multiple Target  
IDs/Host Channel  
Firmware on Flash  
Memory  
Yes  
Yes  
A.2.2 Architecture  
Specification  
CPU  
IBM PowerPC 750CXr  
One 10/100BasedT for local or remote management  
access  
Gigabit Ethernet  
DIMM Slot  
ASIC  
One 184-pin DDR DIMM module  
Infortrend 64-bit chipset (ASIC266)  
32Mbit (4MB)  
Flash ROM  
NVRAM  
32KB with RTC  
Hardware XOR  
Yes  
For event messages with time record tracking and  
scheduled maintenance tasks, e.g., Media Scan.  
Real-time Clock  
A-3  
Controller Specifications  
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A.3 Drive Tray Specifications  
Specification  
Height  
Width  
28mm  
110mm  
218.92mm  
Yes  
Depth  
Key Lock  
A.4 Power Supply Specifications  
Specification  
Nominal Power  
DC Output  
350W  
12.0V: 25A  
5.0V: 25A  
3.3V: 20A  
Input Frequency  
47 to 63Hz  
AC Input  
115VAC @ 6A or 240VAC @ 3A with PFC  
Power Factor  
Correction  
Yes  
Hold-up Time  
At least 16ms at 115/230VAC full load after a loss of AC  
input  
Auto shutdown when cooling is lost or elevated  
temperature is detected; over-voltage protection is also  
available.  
Over-temperature  
Protection  
Cooling Fans  
Two fans for each unit (inside PSU)  
A.5 Cooling Module Specifications  
Specification  
High or low rotation speed controlled by firmware  
Speed  
Max. Air Flow  
(each module)  
High speed: 31.8 CFM  
Low speed: 20.1 CFM  
9/3.12W max.  
Input Power  
DC 12V  
Rated Voltage  
Operating: -10 to +60ºC  
Storage: -20 to +70ºC  
Temperature  
A-4  
Drive Tray Specifications  
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Appendix A: Subsystem Features  
A.6 RAID Management  
Specification  
LCD keypad panel  
Text-based firmware-embedded utility over RS-  
232C connection through the included audio jack-  
to-DB-9 serial cable  
Configuration  
The RAIDWatch Manager program using  
Ethernet connection  
Performance  
Monitoring  
Yes  
Remote Control and  
Monitoring  
Yes  
Yes (via RAIDWatch’s sub-modules, Configuration  
Client or NPC)  
Event Notification  
Management  
Connection  
In-band over Ethernet, or RS-232C  
Configuration data stored on disk drives for logical drive  
assemblies to exist after controller replacement; basic  
settings, e.g., channel mode settings, are stored on  
NVRAM  
Configuration on  
Disk  
Via audible alarm, LCD keypad panel, RAIDWatch  
Manager session, event notifications, or event prompts on  
terminal emulation  
Failure Indicator  
A.7 Fault Tolerance Management  
Specification  
SATA drive SMART  
support  
Yes  
Battery Back-up Option  
Yes  
Yes  
ISEMS (Infortrend Simple  
Enclosure Management  
Service) via I2C Interface  
Automatic Drive Failure  
Detection  
Yes  
Regenerate Logical Drive  
Parity  
Bad Block Reassignment  
Automatic Rebuild upon  
Failed Drive Replacement  
Automatic Rebuild on Spare  
Drives  
Manual Clone of Suspected  
Failed Drive  
Yes  
Yes  
Yes  
Yes  
Yes  
A-5  
RAID Management  
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Concurrent rebuild on  
Multiple Drives in a RAID  
(0 + 1) Logical Drive  
Yes  
Salvage the 2nd Temporarily  
Failed Drive in a RAID 1, 3 Yes  
or 5 Logical Drive  
Salvage the 1st Temporarily  
Failed Drive in a RAID 0  
Logical Drive  
Yes  
A-6  
Fault Tolerance Management  
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Appendix B  
Spare Parts and Accessories  
B.1 Spare Parts  
B.1.1 Spare Parts Overview  
Except the RAID controller module, all the active components in the subsystems can  
be replaced while the system is running. If any of these components fails then it can,  
if configured in a fully redundant mode, be hot-swapped. Spare parts for the  
subsystems can be ordered separately. This section lists the model names for the  
different spare parts.  
B.1.2 Spare Parts List  
Except the controller module, the spare parts shown below are common to both the  
A08U-G2421 8-bay and the A12U-G2421 12-bay models.  
Model Name  
IFT-9273CDTray  
IFT-9272CPSU  
Description  
Drive tray, type-III bezel and type-II LED lightpipe.  
Power supply module, EonStor 2U DDR-interface  
subsystems, 350W capacity.  
IFT-9272CFanModE  
Dual-speed version of cooling fan module: EonStor 2U  
subsystems  
IFT-9273CBT-C  
Battery cell pack, Li-ION battery cells  
IFT-9272CHandR  
IFT-9272CHandLLCD  
Right-side forearm handle for 2U subsystems  
Left-side forearm handle for 2U subsystems, an LCD  
keypad panel mounted on it  
Table B-1: Spare Parts List  
B-1  
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B.1.3 Controller Modules  
Model Name  
Description  
IFT-82AU24GD08  
SCSI-to-SATA RAID controller module, 2 x  
SCSI-320 host channels, 8 x SATA II drive  
channels.  
IFT-82AU24GD08-M2  
IFT-82AU24GD12  
SCSI-to-SATA RAID controller module, 2 x  
SCSI-320 host channels, 8 x SATA II drive  
channels, 256MB DDR RAM.  
SCSI-to-SATA RAID controller module, 2 x  
SCSI-320 host channels, 12 x SATA II drive  
channels.  
IFT-82AU24GD12-M2  
SCSI-to-SATA RAID controller module, 2 x  
SCSI-320 host channels, 12 x SATA II drive  
channels, 256MB DDR RAM.  
Table B-2: Controller Module List  
B-2  
Spare Parts and Accessories  
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Appendix B: Spare Parts and Accessories  
B.2 Accessories and Optional Items  
B.2.1 Accessories Overview  
A number of accessory items are available for the EonStor A08U/A12U-G2421  
subsystem. Some of these accessory items come with the subsystem; but if damaged  
or if more accessory items are needed, they can be ordered separately. Available  
accessory items are listed below:  
B.2.2 Accessory Parts List  
Model Name  
Description  
IFT-9270UHstCab  
IFT-9270UJBODCab  
SCSI external round cable, DB68-to-VHDCI  
External SCSI round cable, VHDCI-to-VHDCI  
* One included in the shipping package  
RS-232C serial cable, audio-jack to DB9  
* One included in the shipping package  
IFT-9270ASCab  
IFT-9011  
Null modem, DB9 female to DB9 male, wires  
swapped  
* One included in the shipping package  
Slide rails for 21"~28.5" deep racks  
Slide rails for 23"~36" deep racks  
Table B-3: Accessories List  
IFT-9272CEslide28  
IFT-9272CEslide36  
Spare Parts and Accessories  
B-3  
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Appendix C  
Pinouts  
C.1. SCSI Port: VHDCI Connector Pinouts  
The SCSI port connector pinouts comply with specifications in T10 Working Draft, Project  
1365D, SCSI Parallel Interface-4.  
* NC = No Connection, * GND = Ground,  
* TPWR = Terminator Power  
Pin  
Name  
Pin  
Name  
1
SD12+  
SD13+  
SD14+  
SD15+  
SDP1+  
SD0+  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
SD12-  
SD13-  
SD14-  
SD15-  
SDP1-  
SD0-  
2
3
4
5
6
7
SD1+  
SD1-  
8
SD2+  
SD2-  
9
SD3+  
SD3-  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
SD4+  
SD4-  
SD5+  
SD5-  
SD6+  
SD6-  
SD7+  
SD7-  
SDP0+  
GND  
SDP0-  
GND  
DIFSENS  
TPWR  
TPWR  
NC  
GND  
TPWR  
TPWR  
NC  
GND  
GND  
SATN+  
GND  
SATN-  
GND  
SBSY+  
SACK+  
SRST+  
SMSG+  
SBSY-  
SACK-  
SRST-  
SMSG-  
C-1  
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27  
28  
29  
30  
31  
32  
33  
34  
SSEL+  
SC_D+  
SREQ+  
SI_O+  
SD8+  
61  
62  
63  
64  
65  
66  
67  
68  
SSEL-  
SC_D-  
SREQ-  
SI_O-  
SD8-  
SD9+  
SD9-  
SD10+  
SD11+  
SD10-  
SD11-  
C.2. COM1 Cable: DB9 and Audio Jack Pinouts  
Figure CT-1: Serial Port Cable CN1 and CN2 Connectors  
COM 1 Cable: Connects a PC running a terminal emulation program  
CN1 Pin Number  
Pin Name  
1
2
3
Ground  
TXD  
RXD  
CN2 Pin Number  
Pin Name  
1
2
3
4
5
6
7
8
9
NC  
RXD  
TXD  
DTR  
GND  
DSR  
RTS  
CTS  
NC  
Pin 4 and Pin 6 are shorted  
Pin 7 and Pin 8 are shorted  
Table C-1: COM 1 Cable, RS-232C (Audio Jack)  
Pin Out Definitions  
C-2  
COM1 Cable: DB9 and Audio Jack Pinouts  
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Appendix C  
Pinouts  
NOTE:  
A null modem is used for wire-swap and is necessary for connecting in between  
COM1CN2 and a PC serial port.  
C.3. IFT-9011 Null Modem  
Swap Pin 2 and Pin 3  
Swap Pin 4 and Pin 6  
Swap Pin 7 and Pin 8  
Table -2: Null Modem Pinouts  
C.4. Ethernet Port Pinouts  
Figure -2: LAN Port Pinouts  
Pin  
1
Pin Name  
LAN_TXP  
LAN_TXN  
LAN_RXP  
N2  
Pin  
5
Pin Name  
N2  
2
6
LAN_RXN  
N1  
3
7
4
8
N1  
Table -3: Ethernet Port Pinouts  
C.5. Main Power  
IEC-type receptacle.  
C-3  
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Index  
Drive Trays, 3-3  
dummy plate, 2-9  
- A -  
accessory items, 2-6  
Air Flow, A-4  
- E -  
Airflow, 2-2  
ejection handle, 5-10  
electrostatic discharge, 2-1  
Ethernet link, 1-14  
ethernet port, 1-9  
Ethernet Port, C-3  
Ethernet Ports, 3-3  
airflow clearance, 2-2  
Ambient Temperature, 4-8  
array identification, 1-7  
audible alarm, 1-14, 3-8, 3-9  
Audible Alarm, 3-2  
Audio Jack, C-2  
authorized battery disposal sites, 2-4  
- F -  
failover software, 4-6  
firmware, 1-13  
front cabinet posts, 2-8  
front flap, 2-13  
front panel, 1-4, 1-7  
fully charged, 5-9  
- B -  
Backplane, 1-7  
BBU, 1-6, 1-8, 2-9, 4-7, 5-3  
BBU module, 1-10, 3-7  
BBU Module LED, 3-7  
BBU Warnings, 2-3  
blower, 1-12  
- G -  
Generic Operation Manual, 3-1, 3-9  
GUI, 1-14  
- C -  
Cabinet installation, 2-5  
Cabling, 2-1  
- H -  
handles, 5-13  
hard drive, 2-11  
hard drives, 4-8, 5-1  
host connection, 4-1  
Host Connection, 4-6  
host redundancy, 4-7  
hot-swap mechanism, 1-7  
hot-swappable, 5-1  
hot-swappable components, 1-14  
cached data, 3-4  
capacity, 2-11  
charge, 1-10  
COM 1 Cable, C-2  
component check, 2-1  
controller module, 1-5, 1-8, 5-1, 5-2, 5-3  
Controller Module, 3-3  
Controller Specifications, A-3  
cooling fan module, 1-6, 1-12  
cooling FAN module, 3-7  
cooling fan modules, 1-5  
cooling FAN modules, 5-1  
Cooling Module, 3-3  
Cooling Module Specifications, A-4  
Cooling Modules, 1-2  
CPU, A-3  
- I -  
I2C, 3-2, 3-10  
2
I C bus, 1-13  
Input Voltage, A-1  
international transportation regulation, 1-10  
- D -  
- K -  
Key Components, 1-3  
Key-Lock, 5-16  
data flow, 4-6  
DB9, C-2  
DIMM, 5-3  
DIMM module, 5-2, 5-6  
DIMM socket, 5-6  
drive bay, 1-5  
- L -  
LAN Port LED, 3-4  
LCD, 4-10  
drive bays, 2-11  
LCD panel, 1-7  
LCD Panel, 1-2, 1-4  
LCD Screen, 4-10  
LED, 1-13  
drive IO timeout, 5-14  
drive numbering sequence, 1-5, 1-8, 1-9  
drive tray, 2-12, 4-8  
drive trays, 2-5, 2-11  
Index  
I--1  
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lower level, 2-6  
Retention Latch, 1-7  
retention screws, 5-8  
RJ-45 cable, 2-5  
RJ-45 port, 1-9  
- M -  
media scan, 4-11  
memory module, 4-7  
mini-SCSI connector, 1-9  
Model Variations, 1-2  
RS-232C (Audio Jack) serial port, 1-10  
- S -  
SATA drives, 2-11  
SCSI cable, 4-1  
sensors, 3-8  
Shutdown Controller, 4-11  
single host, 4-6  
- N -  
normalized airflow, 1-15, 5-2  
Null modem, C-3  
startup sequence, 4-10  
static free, 2-1  
Status Check, 4-9  
System Dimensions, A-1  
System Weight, A-2  
- P -  
Package dimensions, A-1  
PATA drives, 2-11  
path redundancy, 4-6, 4-7  
Phillips-head screwdriver, 2-9  
power cable, 4-8  
power cord, 1-11, 2-6  
power down, 4-11  
- T -  
terminal emulation program, 1-14  
terminal management, 1-10  
threshold values, 3-9  
power on, 4-7  
Power On, 4-7  
power socket, 1-11  
Power Supply Specifications, A-4  
power switch, 1-11  
pre-installed components, 2-6  
PSU, 1-2, 1-5, 1-6, 1-11, 5-1, 5-9  
PSU Bracket, 5-9  
- U -  
under charge, 3-4  
upper level, 2-6  
- V -  
PSU Module, 3-3  
ventilation clearance, 2-2  
- R -  
Rack Installation, 2-2  
Rackmounting, 2-7  
- W -  
Warning Alarms, A-2  
RAID Controller Unit, 1-2  
RAIDWatch, 1-14  
Rear Brackets, 2-8  
- X -  
XOR, A-3  
rear panel, 1-5, 1-6, 1-7  
Regenerating logical drive parity, 4-11  
I--2  
Index  
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